JPH09506715A - ビーム整形装置 - Google Patents
ビーム整形装置Info
- Publication number
- JPH09506715A JPH09506715A JP7515476A JP51547695A JPH09506715A JP H09506715 A JPH09506715 A JP H09506715A JP 7515476 A JP7515476 A JP 7515476A JP 51547695 A JP51547695 A JP 51547695A JP H09506715 A JPH09506715 A JP H09506715A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- shaping device
- beam shaping
- diode
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
- G02B19/0057—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode in the form of a laser diode array, e.g. laser diode bar
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0905—Dividing and/or superposing multiple light beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/0977—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1 レーザ装置のためのビーム整形装置であって、前記レーザ装置が、ある 方向におけるビーム特性値がMx2で、それに直交する方向におけるビーム特性 値がMy2であるビームを発するところのビーム整形装置において、 前記ビーム整形装置が、前記ビーム整形装置を通る複数の異なる伝搬経路を形 成する複数の実質的に平行な反射面を具備し、各経路が前記反射面の間でそれぞ れ異なる回数の反射を伴い、 それにより、使用のとき、前記ビーム整形装置に入射する前記レーザ装置から の入力ビームの部分が、それぞれ異なる伝搬経路を進み、前記ビーム特性値Mx2 およびMy2の一方が減少した出力ビームを形成するように再形成されるところ のビーム整形装置。 2 前記伝搬経路が、前記ビーム整形装置のビーム入口においては横方向に 配置されており、前記ビーム整形装置 のビーム出口においては実質的に直交する方向に配置されていることを特徴とす る請求項1記載のビーム整形装置。 3 前記各反射面が、それぞれ別の基板上に形成されていることを特徴とす る請求項1又は請求項2に記載 のビーム整形装置。 4 共通の基板の反対側表面に形成された2枚の反射面を具備する請求項1 又は請求項2に記載のビーム整形装置。 5 前記反射面が実質的に平面であることを特徴とする請求項1乃至4のい ずれかに記載のビーム整形装置。 6 前記反射面がビーム入口およびビーム出口を形成するように相互に配置 されていることを特徴とする請求項1乃至5のいずれかに記載のビーム整形装置 。 7 Mx2がMy2より大きいことを特徴とする請求項1乃至6のいずれかに 記載のビーム整形装置。 8 Mx2とMy2との積が前記出力ビームにおける(Mx2)'と(My2)'との 積に実質的に等しいことを特徴とする請求項7記載のビーム整形装置。 9 前記出力ビームにおける(Mx2)'と(My2)'とが実質的に等しいことを 特徴とする請求項8記載のビーム整形装置。 10 第1の方向における第1のビーム特性値がM x2であり直交する方向における第2のビーム特性値がMy2であるビームを発生 するように動作可能なレーザ装置と、前記レーザ装置からのビームを受容するた めの請求項1乃至9のいずれかに記載のビーム整形装置と、を具備するレーザ光 源。 11 第1の方向における第1のビーム特性値がMx2であり第2の方向に おける第2のビーム特性値がMy2であるビームを発するレーザ装置と、前記第 1および第2のビーム特性値Mx2およびMy2のうち少なくとも一方を再形成す るように前記ビームの少なくとも一部の方向を転換するための少なくとも1枚の 反射面を包含するビーム整形装置と、を具備するレーザ光源。 12 前記レーザ装置が非回折限界ダイオードレーザであることを特徴とす る請求項10又は請求項11に記載のレーザ光源。 13 前記レーザ装置がダイオードバーであることを特徴とする請求項12 記載のレーザ光源。 14 前記レーザ装置がダイオードアレイであることを特徴とする請求項1 2記載のレーザ光源。 15 前記レーザ装置が幅広ストライプダイオード レーザであることを特徴とする請求項12記載のレーザ光源。 16 前記ビーム整形装置により形成された再形成ビームからスポットが実 質的に円形の出力ビームを形成するための光学系を具備する請求項10乃至15 のいずれかに記載のレーザ光源。 17 請求項10乃至16のいずれかに記載のレーザ光源と、前記レーザ光 源の出力を受容して印加ビームを供給するためのビーム供給システムと、を具備 するレーザシステム。 18 前記ビーム供給システムが、材料加工用ビームを供給するための材料 加工ビーム供給システムであることを特徴とする請求項17記載のレーザシステ ム。 19 前記ビーム供給システムが、医療用ビームを供給するための医療用ビ ーム供給システムであることを特徴とする請求項17記載のレーザシステム。 20 前記ビーム供給システムがマルチモード光ファイバであることを特徴 とする請求項17乃至19のいずれかに記載のレーザシステム。 21 請求項10乃至16のいずれかに記載のレーザ光源と、印加ビームを 供給するための固体レーザであって、前記レーザ光源の出力が前記固体レーザを 励起するところの固体レーザと、を具備する、ダイオードにより励起される固体 レーザシステム。 22 前記レーザ光源の出力を前記固体レーザに供給するため前記レーザ光 源に結合されたビーム供給システムであって、前記固体レーザがバルクレーザ、 導波管レーザまたはファイバレーザであるところのビーム供給システムを具備す る、請求項21記載の、ダイオードにより励起される固体レーザシステム。 23 前記ビーム供給システムがマルチモード光ファイバであることを特徴 とする、請求項21または請求項22に記載の、ダイオードにより励起される固 体レーザシステム。 24 レーザ装置のためのビーム整形装置であって、前記レーザ装置が、第 1の方向における第1のビーム特性値Mx2と、直交する方向における第2のビ ーム特性値My2と、を有するビームを発するところのビーム整形装置において 、前記第1および第2のビーム特性値Mx2およびMy2のうち少なくとも一方を 再形成するために前記ビームの少なくとも一部の方向を転換する少なくとも1 枚の反射面を包含するビーム整形装置。 25 第2の反射面を具備しており、前記第1および第2の反射面が互いに 実質的に平行であるところの請求項24記載のビーム整形装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9324589.2 | 1993-11-30 | ||
GB939324589A GB9324589D0 (en) | 1993-11-30 | 1993-11-30 | Beam shaping device |
PCT/GB1994/002614 WO1995015510A2 (en) | 1993-11-30 | 1994-11-30 | Beam shaper |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09506715A true JPH09506715A (ja) | 1997-06-30 |
JP3589299B2 JP3589299B2 (ja) | 2004-11-17 |
Family
ID=10745923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51547695A Expired - Fee Related JP3589299B2 (ja) | 1993-11-30 | 1994-11-30 | ビーム整形装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5825551A (ja) |
EP (1) | EP0731932B1 (ja) |
JP (1) | JP3589299B2 (ja) |
DE (1) | DE69418725T2 (ja) |
ES (1) | ES2131794T3 (ja) |
GB (1) | GB9324589D0 (ja) |
WO (1) | WO1995015510A2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6943957B2 (en) | 2001-08-10 | 2005-09-13 | Hamamatsu Photonics K.K. | Laser light source and an optical system for shaping light from a laser-bar-stack |
JP2013247364A (ja) * | 2012-05-25 | 2013-12-09 | Corning Inc | 単一エミッタのエテンデュのアスペクト比スケーラ |
JP2015508241A (ja) * | 2012-02-21 | 2015-03-16 | コーニング インコーポレイテッド | レーザアレイ光源の合波方法および装置 |
JP2015106105A (ja) * | 2013-12-02 | 2015-06-08 | セイコーエプソン株式会社 | 光学デバイスおよび虚像表示装置 |
JP2018505568A (ja) * | 2015-06-10 | 2018-02-22 | フィルオプティクス・カンパニー・リミテッドPhiloptics Co., Ltd. | ラインビーム形成装置 |
Families Citing this family (102)
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DE4438368C3 (de) * | 1994-10-27 | 2003-12-04 | Fraunhofer Ges Forschung | Anordnung zur Führung und Formung von Strahlen eines geradlinigen Laserdiodenarrays |
DE19514625C2 (de) * | 1995-04-26 | 1997-03-06 | Fraunhofer Ges Forschung | Anordnung zur Formung des geometrischen Querschnitts eines Strahlungsfelds eines oder mehrerer Festkörper- und/oder Halbleiterlaser(s) |
DE19514626C2 (de) * | 1995-04-26 | 1997-03-06 | Fraunhofer Ges Forschung | Anordnung zur Formung des geometrischen Querschnitts eines Strahlungsfeldes eines oder mehrerer Festkörper- und/oder Halbleiterlaser(s) |
FR2741726B1 (fr) * | 1995-11-23 | 1997-12-19 | Thomson Csf | Dispositif de mise en forme du faisceau optique |
US6124973A (en) * | 1996-02-23 | 2000-09-26 | Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Device for providing the cross-section of the radiation emitted by several solid-state and/or semiconductor diode lasers with a specific geometry |
US6028722A (en) * | 1996-03-08 | 2000-02-22 | Sdl, Inc. | Optical beam reconfiguring device and optical handling system for device utilization |
FR2748127B1 (fr) * | 1996-04-30 | 1998-07-17 | Thomson Csf | Dispositif de mise en forme d'un faisceau plat |
KR100251052B1 (ko) * | 1997-07-12 | 2000-05-01 | 윤종용 | 두개의 플랫 플레이트 사이의 에어 갭 및 하이브리드 다이크로익 미러를 이용한 광분리 장치 및 방법 |
US6044096A (en) * | 1997-11-03 | 2000-03-28 | Sdl, Inc. | Packaged laser diode array system and method with reduced asymmetry |
FR2783056B1 (fr) * | 1998-09-04 | 2000-11-24 | Thomson Csf | Systeme de mise en forme d'un faisceau optique |
US6278557B1 (en) * | 1999-02-24 | 2001-08-21 | Semiconductor Laser International Corporation | Method and apparatus for stacking beams |
WO2000057229A1 (en) * | 1999-03-23 | 2000-09-28 | Iridex Corporation | Direct diode laser with fiber delivery |
ITMI991271A1 (it) * | 1999-06-08 | 2000-12-08 | Bright Solutions Soluzioni Las | Metodo e dispositivo per condizionare l'emissione luminosa di una schiera di diodi laser |
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DE19948889C1 (de) * | 1999-10-11 | 2001-06-07 | Unique M O D E Ag | Vorrichtung zur Symmetrierung der Strahlung von linearen optischen Emittern und Verwendung der Vorrichtung |
US6407870B1 (en) | 1999-10-28 | 2002-06-18 | Ihar Hurevich | Optical beam shaper and method for spatial redistribution of inhomogeneous beam |
EP1150097A1 (de) * | 2000-04-26 | 2001-10-31 | Leica Geosystems AG | Optischer Entfernungsmesser |
GB0010950D0 (en) * | 2000-05-05 | 2000-06-28 | Univ Bath | A nonlinear optical device |
DE10106155A1 (de) * | 2001-02-10 | 2002-08-14 | Lissotschenko Vitalij | Strahlformungsvorrichtung für die Formung des Querschnitts eines Lichtstrahls sowie Anordnung zur Einkopplung eines von einer langgestreckten Laserlichtquelle ausgehenden Lichtstrahls mit einem länglichen Querschnitt in eine Lichtleitfaser |
US20030174405A1 (en) * | 2001-08-10 | 2003-09-18 | Hamamatsu Photonics K.K. | Laser light source and an optical system for shaping light from a laser-bar-stack |
US6600605B1 (en) * | 2001-09-28 | 2003-07-29 | Spectra-Physics Semiconductor Lasers, Inc. | Diode beam transformation |
US6765725B1 (en) | 2001-10-11 | 2004-07-20 | Boston Laser, Inc. | Fiber pigtailed high power laser diode module with high brightness |
ATE473421T1 (de) * | 2001-10-17 | 2010-07-15 | Leica Geosystems Ag | Optischer entfernungsmesser |
US6819402B2 (en) * | 2001-10-18 | 2004-11-16 | Asml Holding N.V. | System and method for laser beam expansion |
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FI116010B (fi) | 2002-05-22 | 2005-08-31 | Cavitar Oy | Menetelmä ja laserlaite suuren optisen tehotiheyden tuottamiseksi |
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ATE496411T1 (de) | 2003-02-07 | 2011-02-15 | Spi Lasers Uk Ltd | Vorrichtung zur abgabe optischer strahlung |
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DE10328084A1 (de) * | 2003-06-20 | 2005-01-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Erhöhung des Füllfaktors in y-Richtung der Strahlung mehrerer gekühlter Diodenlaserbarren gleicher Wellenlänge und Polarisation |
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LT5257B (lt) | 2003-12-19 | 2005-08-25 | Uždaroji akcinė bendrovė MGF "Šviesos konversija" | Ryškį išsaugojantis lazerinių pluoštų formuotuvas |
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CN100388053C (zh) * | 2004-06-03 | 2008-05-14 | 上海交通大学 | 激光束整形装置 |
US7387954B2 (en) * | 2004-10-04 | 2008-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
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- 1994-11-30 JP JP51547695A patent/JP3589299B2/ja not_active Expired - Fee Related
- 1994-11-30 DE DE69418725T patent/DE69418725T2/de not_active Expired - Fee Related
- 1994-11-30 EP EP95902192A patent/EP0731932B1/en not_active Expired - Lifetime
- 1994-11-30 WO PCT/GB1994/002614 patent/WO1995015510A2/en active IP Right Grant
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US6943957B2 (en) | 2001-08-10 | 2005-09-13 | Hamamatsu Photonics K.K. | Laser light source and an optical system for shaping light from a laser-bar-stack |
JP2015508241A (ja) * | 2012-02-21 | 2015-03-16 | コーニング インコーポレイテッド | レーザアレイ光源の合波方法および装置 |
JP2013247364A (ja) * | 2012-05-25 | 2013-12-09 | Corning Inc | 単一エミッタのエテンデュのアスペクト比スケーラ |
JP2015106105A (ja) * | 2013-12-02 | 2015-06-08 | セイコーエプソン株式会社 | 光学デバイスおよび虚像表示装置 |
JP2018505568A (ja) * | 2015-06-10 | 2018-02-22 | フィルオプティクス・カンパニー・リミテッドPhiloptics Co., Ltd. | ラインビーム形成装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0731932A1 (en) | 1996-09-18 |
JP3589299B2 (ja) | 2004-11-17 |
EP0731932B1 (en) | 1999-05-26 |
US5825551A (en) | 1998-10-20 |
DE69418725T2 (de) | 1999-09-30 |
GB9324589D0 (en) | 1994-01-19 |
DE69418725D1 (de) | 1999-07-01 |
ES2131794T3 (es) | 1999-08-01 |
WO1995015510A3 (en) | 1995-07-06 |
WO1995015510A2 (en) | 1995-06-08 |
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