JPH09307203A - Printed circuit board and its manufacture - Google Patents
Printed circuit board and its manufactureInfo
- Publication number
- JPH09307203A JPH09307203A JP11807396A JP11807396A JPH09307203A JP H09307203 A JPH09307203 A JP H09307203A JP 11807396 A JP11807396 A JP 11807396A JP 11807396 A JP11807396 A JP 11807396A JP H09307203 A JPH09307203 A JP H09307203A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- printed wiring
- wiring board
- woven fabric
- aromatic polyamide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種電子機器に用
いられるプリント配線基板に関するものであり、絶縁信
頼性に優れた全芳香族ポリアミド繊維不織布基材を用い
たプリント配線基板およびその製造法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in various electronic devices, and more particularly to a printed wiring board using a wholly aromatic polyamide fiber nonwoven fabric substrate having excellent insulation reliability and a method for producing the same. It is a thing.
【０００２】[0002]
【従来の技術】近年、電子機器の小型高密度、多機能化
の要望に対し、プリント配線基板もより小型高密度化、
軽量薄形化、高速化への対応が重要となっている。これ
まで、基板材料には、補強材としてのガラス織布に熱硬
化性樹脂を含浸させたものが一般に使用されてきたが、
最近、このガラス繊維基材では上記の要求を満足させる
ことが困難になりつつある。そこで、ガラス繊維基材に
代わり、高強度、高耐熱性、軽量、低誘電率であるとい
った特徴を有する全芳香族ポリアミド繊維が注目され、
その不織布を用いて、プリント配線基板を作る試みがな
されている（例えば、特開昭６２−２６１１９０号、特
開昭６２−２７３７９２号、特開昭６３−３１１７４７
号、特開平５−１０４６７５号、特開平５−２５１８６
１号、特開平５−３３５４４０号等）。2. Description of the Related Art In recent years, printed wiring boards have been made smaller and higher in density in response to the demand for smaller and higher density electronic devices and higher functionality.
It is important to support lighter and thinner products and higher speeds. Up to now, a glass woven fabric as a reinforcing material impregnated with a thermosetting resin has been generally used as the substrate material,
Recently, it has become difficult to satisfy the above requirements with this glass fiber base material. Therefore, instead of the glass fiber base material, a wholly aromatic polyamide fiber having characteristics such as high strength, high heat resistance, light weight, and low dielectric constant has attracted attention,
Attempts have been made to make a printed wiring board using the nonwoven fabric (for example, JP-A-62-261190, JP-A-62-273792, and JP-A-63-311747).
JP-A-5-104675 and JP-A-5-25186.
1, JP-A-5-335440).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記従
来の全芳香族ポリアミド繊維不織布基材を用いたプリン
ト配線基板は、含有不純物が多く、吸水率が高く、ソ
リ、ネジレが大きいという問題がある、さらには不織布
基材と樹脂間の接着強度が小さいといった課題を有して
いる。これらの改善については、不織布基材を構成する
全芳香族ポリアミド繊維やその繊維間の結合剤として使
用されるバインダーの改良、不織布基材の表面改質、不
織布の地合の改善、さらには含浸樹脂システムの開発等
が検討されているが、充分な効果が得られていないのが
実状である。前記不織布基材を用いたプリント配線基板
は、不織布基材と樹脂間の接着性が小さいことに起因す
る絶縁信頼性不良等の問題が挙げられる。However, the conventional printed circuit board using the above-mentioned wholly aromatic polyamide fiber non-woven fabric substrate has a problem that it contains a large amount of impurities, has a high water absorption rate, and has a large warp and twist. Furthermore, there is a problem that the adhesive strength between the non-woven fabric substrate and the resin is small. Regarding these improvements, the wholly aromatic polyamide fibers that make up the non-woven fabric substrate and the binder used as a binder between the fibers are improved, the surface of the non-woven fabric substrate is modified, the formation of the non-woven fabric is improved, and further impregnation is performed. Although the development of a resin system has been studied, the actual situation is that the sufficient effect has not been obtained. The printed wiring board using the non-woven fabric base material has problems such as poor insulation reliability due to low adhesion between the non-woven fabric base material and the resin.
【０００４】本発明は、かかる従来の問題点を解消する
ものであり、全芳香族ポリアミド繊維不織布基材を用い
たプリント配線基板における不織布基材と樹脂間の接着
強度を向上させ、ひいては絶縁信頼性を向上させること
を目的とするものである。The present invention solves the above-mentioned conventional problems and improves the adhesive strength between a non-woven fabric base material and a resin in a printed wiring board using a wholly aromatic polyamide fiber non-woven fabric base material. The purpose is to improve the sex.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に本発明のプリント配線基板は、全芳香族ポリアミド繊
維を主成分とし、その繊維間のバインダーとしてポリイ
ミド樹脂が５〜２０ｗｔ％含まれる不織布基材に、樹脂
ワニスを含浸し、乾燥して得たプリプレグに銅箔を積層
し、加熱加圧一体化してなるという構成を備えたもので
ある。In order to achieve this object, the printed wiring board of the present invention is a nonwoven fabric containing wholly aromatic polyamide fibers as a main component and containing 5 to 20 wt% of a polyimide resin as a binder between the fibers. The base material is impregnated with a resin varnish, and a prepreg obtained by drying is laminated with a copper foil and integrated with heating and pressure.
【０００６】前記プリント配線基板においては、樹脂ワ
ニスが、エポキシ樹脂とポリイミド樹脂の混合樹脂ワニ
スであることが好ましい。また前記プリント配線基板に
おいては、エポキシ樹脂とポリイミド樹脂の混合樹脂ワ
ニスが、エポキシ樹脂／ポリイミド樹脂＝６０〜９０重
量％／４０〜１０重量％の混合範囲であることが好まし
い。In the printed wiring board, the resin varnish is preferably a mixed resin varnish of epoxy resin and polyimide resin. Further, in the printed wiring board, the mixed resin varnish of the epoxy resin and the polyimide resin is preferably in a mixed range of epoxy resin / polyimide resin = 60 to 90% by weight / 40 to 10% by weight.
【０００７】次に本発明のプリント配線基板の製造方法
は、全芳香族ポリアミド繊維からなる不織布基材をポリ
アミック酸樹脂溶液に浸漬処理し、乾燥した後、樹脂ワ
ニスを含浸、乾燥して得たプリプレグに銅箔を積層し、
加熱加圧一体化するという構成を備えたものである。Next, the method for producing a printed wiring board of the present invention was obtained by immersing a non-woven fabric substrate made of wholly aromatic polyamide fiber in a polyamic acid resin solution, drying it, and then impregnating it with a resin varnish and drying it. Laminate copper foil on prepreg,
It is provided with a structure in which heating and pressure are integrated.
【０００８】前記方法においては、全芳香族ポリアミド
繊維からなる不織布基材を、予め非プロトン性極性溶剤
に浸漬処理し、乾燥した後、樹脂ワニスを含浸すること
が好ましい。In the above method, it is preferable that the non-woven fabric substrate made of wholly aromatic polyamide fiber is previously immersed in an aprotic polar solvent, dried, and then impregnated with a resin varnish.
【０００９】また前記方法においては、非プロトン性極
性溶剤が、Ｎ，Ｎ−ジメチルホルムアミド（ＤＭＦ）、
テトラヒドロフラン（ＴＨＦ）、Ｎ−メチル−２−ピロ
リドン（ＮＭＰ）、ジメチルスルホキシド（ＤＭＳＯ）
から選ばれる少なくとも一つの溶剤であることが好まし
い。In the above method, the aprotic polar solvent is N, N-dimethylformamide (DMF),
Tetrahydrofuran (THF), N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO)
It is preferably at least one solvent selected from
【００１０】また前記方法においては、非プロトン性極
性溶剤に浸漬処理して乾燥した後、さらにポリアミック
酸樹脂溶液に浸漬処理し、乾燥した後、樹脂ワニスを含
浸することが好ましい。In the above method, it is preferable that the resin varnish be impregnated with an aprotic polar solvent after being dipped and dried, and then further dipped in a polyamic acid resin solution and dried.
【００１１】前記した本発明のプリント配線基板によれ
ば、全芳香族ポリアミド繊維を主成分とし、その繊維間
のバインダーとしてポリイミド樹脂が５〜２０ｗｔ％含
まれる不織布基材に、樹脂ワニスを含浸し、乾燥して得
たプリプレグに銅箔を積層し、加熱加圧一体化すること
により、不織布基材と樹脂間の接着強度を向上し、ひい
ては絶縁信頼性を向上することができる。According to the above-mentioned printed wiring board of the present invention, a non-woven fabric base material containing wholly aromatic polyamide fibers as a main component and containing 5 to 20 wt% of a polyimide resin as a binder between the fibers is impregnated with a resin varnish. By stacking a copper foil on the prepreg obtained by drying and heating and pressurizing the prepreg, the adhesive strength between the non-woven fabric substrate and the resin can be improved, and the insulation reliability can be improved.
【００１２】次に本発明のプリント配線基板の製造方法
によれば、全芳香族ポリアミド繊維からなる不織布基材
をポリアミック酸樹脂溶液に浸漬処理し、乾燥した後、
樹脂ワニスを含浸し、乾燥して得たプリプレグに銅箔を
積層し、加熱加圧一体化することにより、不織布基材と
樹脂間の接着強度を向上し、絶縁信頼性を向上すること
ができる。Next, according to the method for producing a printed wiring board of the present invention, a non-woven fabric substrate made of wholly aromatic polyamide fibers is dipped in a polyamic acid resin solution and dried,
By laminating a copper foil on a prepreg obtained by impregnating with a resin varnish and drying it, and heating and pressurizing the prepreg, the adhesive strength between the non-woven fabric substrate and the resin can be improved and the insulation reliability can be improved. .
【００１３】[0013]
【発明の実施の形態】本発明は、全芳香族ポリアミド繊
維不織布基材を用いたプリント配線基板において、不織
布基材と樹脂間の接着強度に大きく影響する不織布基材
の構成、含浸樹脂の構成および不織布基材の表面改質を
行ったものである。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a printed wiring board using a wholly aromatic polyamide fiber non-woven fabric base material, which has a great influence on the adhesive strength between the non-woven fabric base material and the resin, and the composition of the impregnated resin. And surface modification of the non-woven fabric substrate.
【００１４】主成分を全芳香族ポリアミド繊維とし、ポ
リアミック酸樹脂をそのバインダーとして不織布基材を
構成することで、繊維がポリアミック酸樹脂にコーティ
ングされるため、不織布基材と含浸樹脂間の親和性が向
上し、接着強度を増大することができる。添加するバイ
ンダー量としては、不織布全体の５〜２０ｗｔ％が好ま
しく、この範囲外では接着強度が増大しないか、あるい
は減少する。By forming the non-woven fabric base material by using the wholly aromatic polyamide fiber as the main component and the polyamic acid resin as its binder, the fibers are coated on the polyamic acid resin, so that the affinity between the non-woven fabric base material and the impregnated resin is improved. Can be improved and the adhesive strength can be increased. The amount of binder to be added is preferably 5 to 20 wt% of the whole nonwoven fabric, and the adhesive strength does not increase or decreases outside this range.
【００１５】含浸樹脂の構成をエポキシ樹脂とポリアミ
ック酸樹脂の混合系にすることで、含浸樹脂の全芳香族
ポリアミド繊維不織布基材に対する親和性が向上し、結
果として不織布基材と樹脂間の接着強度を増大すること
ができる。含浸樹脂の構成としては、エポキシ樹脂を主
成分とし、ポリアミック酸樹脂を含浸樹脂全体の４０ｗ
ｔ％以下にすることが好ましい。これよりポリアミック
酸樹脂の量が多くなると、含浸樹脂中のエポキシ樹脂の
比率が減少するため、不織布基材と銅箔との間の接着性
が低下する傾向がある。By making the composition of the impregnating resin a mixed system of the epoxy resin and the polyamic acid resin, the affinity of the impregnating resin for the wholly aromatic polyamide fiber non-woven fabric base material is improved, resulting in the adhesion between the non-woven fabric base material and the resin. The strength can be increased. As the composition of the impregnated resin, the epoxy resin is the main component, and the polyamic acid resin is 40 w of the entire impregnated resin.
It is preferably t% or less. When the amount of the polyamic acid resin is larger than this, the ratio of the epoxy resin in the impregnated resin decreases, and thus the adhesiveness between the non-woven fabric substrate and the copper foil tends to decrease.
【００１６】全芳香族ポリアミド繊維不織布基材をポリ
アミック酸樹脂溶液に浸漬し、コーティングすること
で、不織布基材の含浸樹脂に対する親和性が向上するた
め、不織布基材と樹脂間の接着強度を増大することがで
きる。ポリアミック酸樹脂の処理量としては、不織布基
材全体の１０ｗｔ％以下であることが好ましく、これよ
り処理量が多いと逆に不織布基材と樹脂間の接着性が減
少する傾向がある。By dipping the wholly aromatic polyamide fiber non-woven fabric base material in a polyamic acid resin solution and coating it, the affinity of the non-woven fabric base material for the impregnated resin is improved, so that the adhesive strength between the non-woven fabric base material and the resin is increased. can do. The treatment amount of the polyamic acid resin is preferably 10 wt% or less of the total amount of the non-woven fabric substrate. If the treatment amount is higher than this, the adhesiveness between the non-woven fabric substrate and the resin tends to decrease.
【００１７】全芳香族ポリアミド繊維不織布基材を非プ
ロトン性極性溶剤に浸漬放置することで、繊維基材表面
の不純物が除去され、さらに繊維基材表面が粗くなるた
め、不織布基材と樹脂間の接着強度を増大することがで
きる。溶剤としては、ＤＭＦ、ＴＨＦ、ＮＭＰおよびＤ
ＭＳＯが好ましく、またそれらの混合物でもよい。By dipping and leaving the wholly aromatic polyamide fiber nonwoven fabric base material in an aprotic polar solvent, impurities on the surface of the fiber base material are removed and the surface of the fiber base material becomes rough. The adhesive strength of can be increased. Solvents include DMF, THF, NMP and D
MSO is preferred, and may be a mixture thereof.
【００１８】全芳香族ポリアミド繊維不織布基材を非プ
ロトン性極性溶剤に浸漬放置した後、乾燥し、さらにポ
リアミック酸樹脂溶液に浸漬することで、繊維基材表面
の不純物が除去され、繊維基材表面が粗くなり、さらに
ポリアミック酸樹脂で基材表面がコーティングされるた
め、不織布基材と樹脂間の接着強度を増大することがで
きる。溶剤としては、ＤＭＦ、ＴＨＦ、ＮＭＰおよびＤ
ＭＳＯが好ましく、あるいはそれらの混合物でもよい。
また、ポリアミック酸樹脂の処理量としては、不織布基
材全体の１０ｗｔ％以下であることが好ましく、これよ
り処理量が多いと逆に基材と樹脂との間の接着性が減少
する傾向がある。The wholly aromatic polyamide fiber non-woven fabric substrate is immersed in an aprotic polar solvent, dried, and then immersed in a polyamic acid resin solution to remove impurities on the surface of the fiber substrate, thereby removing the fiber substrate. Since the surface becomes rough and the surface of the base material is coated with the polyamic acid resin, the adhesive strength between the non-woven fabric base material and the resin can be increased. Solvents include DMF, THF, NMP and D
MSO is preferred or it may be a mixture thereof.
Further, the treatment amount of the polyamic acid resin is preferably 10 wt% or less of the whole non-woven fabric substrate, and a treatment amount larger than this tends to decrease the adhesiveness between the substrate and the resin. .
【００１９】[0019]
【実施例】以下、本発明の実施の形態について説明す
る。なお、実施例に示した部数は、すべて重量部であ
る。Embodiments of the present invention will be described below. All parts shown in the examples are parts by weight.
【００２０】（実施例１）以下のように不織布基材、プ
リプレグおよびプリント配線基板を作成した。 （１）全芳香族ポリアミド繊維不織布基材の作成 パラ系芳香族ポリアミド繊維（例えばデュポン社”ケブ
ラー”）に下記式（化１）よりなるポリアミック酸樹脂
バインダーを不織布全体の５ｗｔ％になるように添加し
た構成で不織布を作成した。不織布は抄紙後、温度：２
５０℃、圧力：２５０ｋｇ／ｃｍの条件でカレンダ処理
を行った。得られた不織布シートは、目付：７０ｇ／ｍ
2 、厚さ：１００μｍであった。Example 1 A non-woven fabric substrate, a prepreg and a printed wiring board were prepared as follows. (1) Preparation of non-woven fabric substrate of wholly aromatic polyamide fiber Para-aromatic polyamide fiber (for example, "Kevlar" manufactured by DuPont) is filled with a polyamic acid resin binder represented by the following formula (1) in an amount of 5 wt% of the whole nonwoven fabric. A non-woven fabric was created with the composition added. Non-woven fabric after papermaking, temperature: 2
Calendar processing was performed under the conditions of 50 ° C. and pressure: 250 kg / cm. The obtained non-woven sheet has a basis weight: 70 g / m
2 , thickness: 100 μm.
【００２１】[0021]
【化１】 Embedded image
【００２２】 （２）樹脂ワニス含浸操作 臭素化ビスフェノールＡ型エポキシ樹脂（臭素量：２３％、エポキシ当量：２ ７０） ３５．０部 ３官能エポキシ樹脂（臭素量：２３％、エポキシ当量：２７０）３５．０部 ノボラック型フェノール樹脂（水酸基当量：１２０） ３０．０部 カルボニルジイミダゾール ０．１部 メチルエチルケトン ６６．６部 上記材料を溶解混合してワニスを調整した。(2) Resin varnish impregnation operation Brominated bisphenol A type epoxy resin (bromine amount: 23%, epoxy equivalent: 270) 35.0 parts Trifunctional epoxy resin (bromine amount: 23%, epoxy equivalent: 270) 35.0 parts Novolac-type phenol resin (hydroxyl equivalent: 120) 30.0 parts Carbonyldiimidazole 0.1 parts Methyl ethyl ketone 66.6 parts The above materials were dissolved and mixed to prepare a varnish.
【００２３】不織布基材にプリプレグ状態で含浸合計樹
脂量が５０±１ｗｔ％になるようにワニスを含浸させ、
１４０℃で３分間乾燥してプリプレグとした。 （３）積層操作 樹脂ワニス含浸操作終了後、上記プリプレグの両面に厚
さ３５μｍの両面粗化銅箔を積層し、熱プレスして、プ
リント配線基板を作成した。熱プレスは、圧力５５ｋｇ
／ｃｍ2、温度２００℃で６０分間の条件で行った。The non-woven fabric substrate was impregnated with varnish in a prepreg state so that the total resin amount was 50 ± 1 wt%,
It was dried at 140 ° C. for 3 minutes to obtain a prepreg. (3) Laminating Operation After the completion of the resin varnish impregnation operation, a double-sided roughened copper foil having a thickness of 35 μm was laminated on both surfaces of the prepreg and hot pressed to form a printed wiring board. Heat press, pressure 55kg
/ Cm 2 and temperature of 200 ° C. for 60 minutes.
【００２４】（実施例２）パラ系芳香族ポリアミド繊維
に下記式（化２）よりなるポリアミック酸樹脂バインダ
ーを不織布全体の５ｗｔ％になるように添加した構成で
不織布を作成した以外は、実施例１と同様にしてカレン
ダ処理、プリプレグおよびプリント配線基板を作成し
た。(Example 2) A non-woven fabric was prepared except that a para-aromatic polyamide fiber was added with a polyamic acid resin binder represented by the following formula (Formula 2) in an amount of 5 wt% of the whole non-woven fabric. A calendar process, a prepreg and a printed wiring board were prepared in the same manner as in 1.
【００２５】[0025]
【化２】 Embedded image
【００２６】（実施例３）パラ系芳香族ポリアミド繊維
に下記式（化３）よりなるポリアミック酸樹脂バインダ
ーを不織布全体の５ｗｔ％になるように添加した構成で
不織布を作成した以外は、実施例１と同様にしてカレン
ダ処理、プリプレグおよびプリント配線基板を作成し
た。Example 3 A non-woven fabric was prepared except that a para-aromatic polyamide fiber was added with a polyamic acid resin binder represented by the following formula (formula 3) in an amount of 5 wt% of the whole non-woven fabric. A calendar process, a prepreg and a printed wiring board were prepared in the same manner as in 1.
【００２７】[0027]
【化３】 Embedded image
【００２８】（実施例４）パラ系芳香族ポリアミド繊維
に前記式（化１）よりなるポリアミック酸樹脂バインダ
ーを不織布全体の１０ｗｔ％になるように添加した構成
で不織布を作成した以外は、実施例１と同様にしてカレ
ンダ処理、プリプレグおよびプリント配線基板を作成し
た。Example 4 A non-woven fabric was prepared except that a polyamic acid resin binder represented by the above formula (Formula 1) was added to the para-aromatic polyamide fiber so as to be 10 wt% of the whole non-woven fabric. A calendar process, a prepreg and a printed wiring board were prepared in the same manner as in 1.
【００２９】（実施例５）パラ系芳香族ポリアミド繊維
に前記式（化１）よりなるポリアミック酸樹脂バインダ
ーを不織布全体の１５ｗｔ％になるように添加した構成
で不織布を作成した以外は、実施例１と同様にしてカレ
ンダ処理、プリプレグおよびプリント配線基板を作成し
た。Example 5 A non-woven fabric was prepared except that the polyamic acid resin binder represented by the above formula (Formula 1) was added to the para-aromatic polyamide fiber in an amount of 15 wt% of the whole non-woven fabric. A calendar process, a prepreg and a printed wiring board were prepared in the same manner as in 1.
【００３０】（実施例６）パラ系芳香族ポリアミド繊維
に前記式化１よりなるポリアミック酸樹脂バインダーを
不織布全体の２０ｗｔ％になるように添加した構成で不
織布を作成した以外は、実施例１と同様にしてカレンダ
処理、プリプレグおよびプリント配線基板を作成した。(Example 6) Example 1 was repeated except that a non-woven fabric was prepared by adding para-aromatic polyamide fiber to the polyamic acid resin binder represented by the above formula 1 in an amount of 20 wt% of the whole non-woven fabric. Similarly, a calendar process, a prepreg and a printed wiring board were prepared.
【００３１】（比較例１）パラ系芳香族ポリアミド繊維
のみの構成で不織布を作成した以外は、実施例１と同様
にしてカレンダ処理、プリプレグおよびプリント配線基
板を作成した。(Comparative Example 1) A calendering treatment, a prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that a non-woven fabric was prepared by using only para aromatic polyamide fibers.
【００３２】（比較例２）パラ系芳香族ポリアミド繊維
に前記式（化１）よりなるポリアミック酸樹脂バインダ
ーを不織布全体の２５ｗｔ％になるように添加した構成
で不織布を作成した以外は、実施例１と同様にしてカレ
ンダ処理、プリプレグおよびプリント配線基板を作成し
た。Comparative Example 2 A non-woven fabric was prepared except that a para-aromatic polyamide fiber was added with the polyamic acid resin binder represented by the above formula (Formula 1) in an amount of 25 wt% of the whole non-woven fabric. A calendar process, a prepreg and a printed wiring board were prepared in the same manner as in 1.
【００３３】（実施例７）パラ系芳香族ポリアミド繊維
のみの構成で不織布を作成し、カレンダ処理後、実施例
１のエポキシ樹脂９０ｗｔ％、前記式（化１）よりなる
ポリアミック酸樹脂１０ｗｔ％の構成からなる樹脂ワニ
スを含浸した以外は、実施例１と同様にしてプリプレグ
およびプリント配線基板を作成した。(Example 7) A non-woven fabric was prepared by using only para-aromatic polyamide fiber, and after calendering, 90 wt% of the epoxy resin of Example 1 and 10 wt% of the polyamic acid resin of the above formula (Formula 1) were used. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the resin varnish having the composition was impregnated.
【００３４】（実施例８）パラ系芳香族ポリアミド繊維
のみの構成で不織布を作成し、カレンダ処理後、実施例
１のエポキシ樹脂９０ｗｔ％、前記式（化２）よりなる
ポリアミック酸樹脂１０ｗｔ％の構成からなる樹脂ワニ
スを含浸した以外は、実施例１と同様にしてプリプレグ
およびプリント配線基板を作成した。(Example 8) A non-woven fabric was prepared with only para-aromatic polyamide fibers, and after calendering, 90 wt% of the epoxy resin of Example 1 and 10 wt% of the polyamic acid resin of the above formula (Formula 2) were used. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the resin varnish having the composition was impregnated.
【００３５】（実施例９）パラ系芳香族ポリアミド繊維
のみの構成で不織布を作成し、カレンダ処理後、実施例
１のエポキシ樹脂９０ｗｔ％、前記式（化３）よりなる
ポリアミック酸樹脂１０ｗｔ％の構成からなる樹脂ワニ
スを含浸した以外は、実施例１と同様にしてプリプレグ
およびプリント配線基板を作成した。(Example 9) A non-woven fabric was prepared by using only para-aromatic polyamide fibers, and after calendering, 90 wt% of the epoxy resin of Example 1 and 10 wt% of the polyamic acid resin represented by the above formula (Formula 3) were used. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the resin varnish having the composition was impregnated.
【００３６】（実施例１０）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、前記
式（化１）よりなるポリアミック酸樹脂を不織布基材全
体の５ｗｔ％になるように表面処理した以外は、実施例
１と同様にして、プリプレグおよびプリント配線基板を
作成した。(Example 10) A non-woven fabric was prepared by using only para-aromatic polyamide fibers, and after calendering, the polyamic acid resin represented by the above formula (Formula 1) was added to 5 wt% of the whole non-woven fabric substrate. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the surface treatment was performed.
【００３７】（実施例１１）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、前記
式（化２）よりなるポリアミック酸樹脂を不織布基材全
体の５ｗｔ％になるように表面処理した以外は、実施例
１と同様にして、プリプレグおよびプリント配線基板を
作成した。(Example 11) A non-woven fabric was prepared using only para-aromatic polyamide fibers, and after calendering, the polyamic acid resin represented by the above formula (Formula 2) was added to 5 wt% of the whole non-woven fabric substrate. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the surface treatment was performed.
【００３８】（実施例１２）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、前記
式（化３）よりなるポリアミック酸樹脂を不織布基材全
体の５ｗｔ％になるように表面処理した以外は、実施例
１と同様にして、プリプレグおよびプリント配線基板を
作成した。(Example 12) A non-woven fabric was prepared with only para-aromatic polyamide fibers, and after calendering, the polyamic acid resin represented by the above formula (Formula 3) was added to 5 wt% of the whole non-woven fabric substrate. A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the surface treatment was performed.
【００３９】（実施例１３）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
Ｆで溶剤処理した以外は、実施例１と同様にして、プリ
プレグおよびプリント配線基板を作成した。(Example 13) A non-woven fabric was made of only para-aromatic polyamide fibers, calendered, and DM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the solvent treatment with F was performed.
【００４０】（実施例１４）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＴＨ
Ｆで溶剤処理した以外は、実施例１と同様にして、プリ
プレグおよびプリント配線基板を作成した。(Example 14) A non-woven fabric was prepared by using only para-aromatic polyamide fibers, calendered and then TH
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the solvent treatment with F was performed.
【００４１】（実施例１５）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＮＭ
Ｐで溶剤処理した以外は、実施例１と同様にして、プリ
プレグおよびプリント配線基板を作成した。(Example 15) A non-woven fabric was prepared with only a para-aromatic polyamide fiber, calendered, and then NM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the solvent treatment with P was performed.
【００４２】（実施例１６）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
ＳＯで溶剤処理した以外は、実施例１と同様にして、プ
リプレグおよびプリント配線基板を作成した。(Example 16) A non-woven fabric was prepared with only a para-aromatic polyamide fiber, calendered, and DM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the solvent treatment with SO was performed.
【００４３】（実施例１７）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
ＦとＤＭＳＯの混合物で溶剤処理した以外は、実施例１
と同様にして、プリプレグおよびプリント配線基板を作
成した。(Example 17) A non-woven fabric was made of only para-aromatic polyamide fibers, calendered, and DM
Example 1 except solvent treated with a mixture of F and DMSO
A prepreg and a printed wiring board were prepared in the same manner as in.
【００４４】（実施例１８）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
ＦとＴＨＦとＤＭＳＯの混合物で溶剤処理した以外は、
実施例１と同様にして、プリプレグおよびプリント配線
基板を作成した。(Example 18) A non-woven fabric was made of only para-aromatic polyamide fibers, calendered, and DM-treated.
Except for solvent treatment with a mixture of F, THF and DMSO,
A prepreg and a printed wiring board were produced in the same manner as in Example 1.
【００４５】（実施例１９）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
Ｆで溶剤処理し、次いで前記式（化１）よりなるポリア
ミック酸樹脂を不織布基材全体の５ｗｔ％になるように
表面処理した以外は、実施例１と同様にして、プリプレ
グおよびプリント配線基板を作成した。(Example 19) A non-woven fabric was made of only para-aromatic polyamide fibers, calendered, and DM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the treatment with F was performed with a solvent and then the polyamic acid resin represented by the formula (Formula 1) was surface-treated so as to be 5 wt% of the entire nonwoven fabric substrate. Created.
【００４６】（実施例２０）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
Ｆで溶剤処理し、次いで前記式（化２）よりなるポリア
ミック酸樹脂を不織布基材全体の５ｗｔ％になるように
表面処理した以外は、実施例１と同様にして、プリプレ
グおよびプリント配線基板を作成した。(Example 20) A non-woven fabric was prepared by using only para-aromatic polyamide fibers, calendered, and then DM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the treatment with F was performed with a solvent, and then the polyamic acid resin represented by the formula (Formula 2) was surface-treated so as to be 5 wt% of the entire nonwoven fabric substrate. Created.
【００４７】（実施例２１）パラ系芳香族ポリアミド繊
維のみの構成で不織布を作成し、カレンダ処理後、ＤＭ
Ｆで溶剤処理し、次いで前記式（化３）よりなるポリア
ミック酸樹脂を不織布基材全体の５ｗｔ％になるように
表面処理した以外は、実施例１と同様にして、プリプレ
グおよびプリント配線基板を作成した。(Example 21) A non-woven fabric was prepared by using only para-aromatic polyamide fibers, calendered, and then DM
A prepreg and a printed wiring board were prepared in the same manner as in Example 1 except that the treatment with F was performed with a solvent and then the polyamic acid resin represented by the formula (Formula 3) was surface-treated so as to be 5 wt% of the entire nonwoven fabric substrate. Created.
【００４８】以上の実施例および比較例で得られた銅張
積層板に対して、絶縁信頼性に直接影響する全芳香族ポ
リアミド繊維不織布基材と樹脂間の接着強度（層間強
度）の測定結果を表１〜３に示す。また、層間強度の測
定方法として、熱プレス後の銅張積層板を１ｃｍ幅に切
断し、引張り試験機で９０°剥離試験を行った。この試
験条件において、全芳香族ポリアミド繊維不織布基材と
樹脂間で剥離していることが走査形電子顕微鏡（ＳＥ
Ｍ）観察で確認されている。したがって、この条件にお
ける測定結果を層間強度とした。With respect to the copper clad laminates obtained in the above Examples and Comparative Examples, the measurement results of the adhesive strength (interlayer strength) between the wholly aromatic polyamide fiber nonwoven fabric base material and the resin, which directly affects the insulation reliability. Are shown in Tables 1-3. Further, as a method for measuring the interlaminar strength, the copper clad laminate after hot pressing was cut into a width of 1 cm, and a 90 ° peel test was performed with a tensile tester. Under these test conditions, the separation between the wholly aromatic polyamide fiber non-woven fabric substrate and the resin was observed by the scanning electron microscope (SE).
M) Confirmed by observation. Therefore, the measurement result under these conditions was defined as the interlayer strength.
【００４９】[0049]
【表１】 [Table 1]
【００５０】[0050]
【表２】 [Table 2]
【００５１】[0051]
【表３】 [Table 3]
【００５２】表１において、全芳香族ポリアミド繊維不
織布のバインダーにポリアミック酸樹脂を用いた場合、
基板の層間強度が向上していることが確認できた。比較
例１のように全芳香族ポリアミド繊維のみからなる不織
布基材は、基材と含浸樹脂との間の親和性が乏しいた
め、基板の層間強度が小さくなっている。しかし、バイ
ンダーにポリアミック酸を用いることで、繊維がポリア
ミック酸樹脂でコーティングされ、基材と含浸樹脂間の
親和性が増す。その結果、基板の層間強度が向上すると
考えられる。比較例２より、バインダー量が２０ｗｔ％
を越えると、基板の層間強度は増大せずに減少する。し
たがって、バインダー量は、５〜２０ｗｔ％が好まし
い。In Table 1, when a polyamic acid resin is used as the binder of the wholly aromatic polyamide fiber nonwoven fabric,
It was confirmed that the interlayer strength of the substrate was improved. The non-woven fabric substrate composed of only wholly aromatic polyamide fibers as in Comparative Example 1 has a low affinity between the substrate and the impregnated resin, so that the interlayer strength of the substrate is small. However, by using polyamic acid as the binder, the fibers are coated with the polyamic acid resin, and the affinity between the base material and the impregnated resin is increased. As a result, it is considered that the interlayer strength of the substrate is improved. From Comparative Example 2, the amount of binder is 20 wt%
When it exceeds, the interlaminar strength of the substrate decreases without increasing. Therefore, the binder amount is preferably 5 to 20 wt%.
【００５３】表２において、含浸樹脂にポリアミック酸
樹脂が含まれる実施例７〜９の層間強度が優れているこ
とが確認できた。含浸樹脂にアミド結合が含まれる樹脂
を混合することで、含浸樹脂の全芳香族ポリアミド繊維
不織布基材に対する親和性が向上し、基板の層間強度が
増大する。In Table 2, it was confirmed that the interlayer strength of Examples 7 to 9 in which the impregnating resin contained a polyamic acid resin was excellent. By mixing the impregnating resin with a resin containing an amide bond, the affinity of the impregnating resin for the wholly aromatic polyamide fiber nonwoven fabric base material is improved, and the interlayer strength of the substrate is increased.
【００５４】表３において、実施例１０〜１２は全芳香
族ポリアミド繊維がポリアミック酸でコーティングされ
ており、そのため不織布基材と含浸樹脂間の親和性が増
し、基板の層間強度が向上することが確認できた。ま
た、実施例１３〜１８のように全芳香族ポリアミド繊維
不織布基材を溶剤で処理することで、繊維表面の不純物
が除去されると共に繊維表面が粗くなるため、不織布基
材と樹脂間の機械的強度が向上し、基板の層間強度が増
大する。また、実施例１９〜２１は、溶剤処理された不
織布基材をさらにポリアミック酸樹脂で表面処理したも
のであり、溶剤処理の効果とポリアミック酸樹脂コーテ
ィングの効果によって、基板の層間強度が増大する。In Table 3, in Examples 10 to 12, wholly aromatic polyamide fibers are coated with polyamic acid, so that the affinity between the non-woven fabric substrate and the impregnated resin is increased, and the interlayer strength of the substrate is improved. It could be confirmed. Further, by treating the wholly aromatic polyamide fiber nonwoven fabric substrate with a solvent as in Examples 13 to 18, impurities on the fiber surface are removed and the fiber surface becomes rough, so that a machine between the nonwoven fabric substrate and the resin is used. The mechanical strength is improved and the interlayer strength of the substrate is increased. Further, in Examples 19 to 21, the solvent-treated non-woven fabric substrate was further surface-treated with a polyamic acid resin, and the interlayer strength of the substrate was increased by the effect of the solvent treatment and the effect of the polyamic acid resin coating.
【００５５】[0055]
【発明の効果】以上説明したように、本発明のプリント
配線基板によれば、全芳香族ポリアミド繊維を主成分と
し、その繊維間のバインダーとしてポリイミド樹脂が５
〜２０ｗｔ％含まれる不織布基材に、樹脂ワニスを含浸
し、乾燥して得たプリプレグに銅箔を積層し、加熱加圧
一体化することにより、不織布基材と樹脂間の接着強度
を向上し、絶縁信頼性を向上することができる。As described above, according to the printed wiring board of the present invention, the wholly aromatic polyamide fiber is the main component, and the polyimide resin is 5 as the binder between the fibers.
Approximately 20 wt% of the non-woven fabric base material is impregnated with resin varnish, dried to obtain a prepreg, and a copper foil is laminated on the non-woven fabric base material. Insulation reliability can be improved.
【００５６】また本発明によれば、全芳香族ポリアミド
繊維不織布のバインダーにポリアミック酸樹脂を用いる
こと、含浸樹脂にポリアミック酸樹脂を添加すること、
あるいは基材表面をポリアミック酸樹脂で処理すること
で全芳香族ポリアミド繊維不織布基材を用いたプリント
配線基板における不織布基材と樹脂間の接着強度を増大
させることができ、結果として絶縁信頼性に優れたプリ
ント配線基板を得ることができる。According to the present invention, a polyamic acid resin is used as the binder of the wholly aromatic polyamide fiber nonwoven fabric, and a polyamic acid resin is added to the impregnating resin.
Alternatively, by treating the base material surface with a polyamic acid resin, it is possible to increase the adhesive strength between the non-woven fabric base material and the resin in the printed wiring board using the wholly aromatic polyamide fiber non-woven fabric base material, and as a result, the insulation reliability is improved. An excellent printed wiring board can be obtained.
【００５７】次に本発明のプリント配線基板の製造方法
によれば、全芳香族ポリアミド繊維からなる不織布基材
をポリアミック酸樹脂溶液に浸漬処理し、乾燥した後、
樹脂ワニスを含浸し、乾燥して得たプリプレグに銅箔を
積層し、加熱加圧一体化することにより、不織布基材と
樹脂間の接着強度を向上し、絶縁信頼性を向上すること
ができる。Next, according to the method for producing a printed wiring board of the present invention, the non-woven fabric substrate made of wholly aromatic polyamide fibers is dipped in a polyamic acid resin solution and dried,
By laminating a copper foil on a prepreg obtained by impregnating with a resin varnish and drying it, and heating and pressurizing the prepreg, the adhesive strength between the non-woven fabric substrate and the resin can be improved and the insulation reliability can be improved. .
【００５８】また、全芳香族ポリアミド繊維不織布基材
を溶剤処理することで、不織布基材と樹脂間の接着強度
を増大させることができ、結果として絶縁信頼性に優れ
たプリント配線基板を得ることができる。By subjecting the wholly aromatic polyamide fiber nonwoven fabric base material to solvent treatment, the adhesive strength between the nonwoven fabric base material and the resin can be increased, and as a result, a printed wiring board having excellent insulation reliability can be obtained. You can
Claims (7)
その繊維間のバインダーとしてポリイミド樹脂が５〜２
０ｗｔ％含まれる不織布基材に、樹脂ワニスを含浸し、
乾燥して得たプリプレグに銅箔を積層し、加熱加圧一体
化してなるプリント配線基板。1. A wholly aromatic polyamide fiber as a main component,
The polyimide resin is 5 to 2 as the binder between the fibers.
Nonwoven fabric base material containing 0 wt% is impregnated with resin varnish,
A printed wiring board obtained by laminating copper foil on a prepreg obtained by drying, and heating and pressurizing the prepreg.
ド樹脂の混合樹脂ワニスである請求項１に記載のプリン
ト配線基板。2. The printed wiring board according to claim 1, wherein the resin varnish is a mixed resin varnish of an epoxy resin and a polyimide resin.
脂ワニスが、エポキシ樹脂／ポリイミド樹脂＝６０〜９
０重量％／４０〜１０重量％の混合範囲である請求項２
に記載のプリント配線基板。3. A mixed resin varnish of epoxy resin and polyimide resin is epoxy resin / polyimide resin = 60 to 9
The mixing range of 0% by weight / 40 to 10% by weight.
The printed wiring board according to.
基材をポリアミック酸樹脂溶液に浸漬処理し、乾燥した
後、樹脂ワニスを含浸、乾燥して得たプリプレグに銅箔
を積層し、加熱加圧一体化するプリント配線基板の製造
方法。4. A non-woven fabric substrate made of wholly aromatic polyamide fibers is dipped in a polyamic acid resin solution, dried, impregnated with a resin varnish and dried, and a copper foil is laminated on the prepreg and heated and pressed. Method for manufacturing integrated printed wiring board.
基材を、予め非プロトン性極性溶剤に浸漬処理し、乾燥
した後、樹脂ワニスを含浸する請求項４に記載のプリン
ト配線基板の製造方法。5. The method for producing a printed wiring board according to claim 4, wherein the non-woven fabric substrate made of wholly aromatic polyamide fibers is previously immersed in an aprotic polar solvent, dried and then impregnated with a resin varnish.
チルホルムアミド（ＤＭＦ）、テトラヒドロフラン（Ｔ
ＨＦ）、Ｎ−メチル−２−ピロリドン（ＮＭＰ）、ジメ
チルスルホキシド（ＤＭＳＯ）から選ばれる少なくとも
一つの溶剤である請求項５に記載のプリント配線基板の
製造方法。6. The aprotic polar solvent is N, N-dimethylformamide (DMF), tetrahydrofuran (T
The method for manufacturing a printed wiring board according to claim 5, wherein the solvent is at least one solvent selected from HF), N-methyl-2-pyrrolidone (NMP), and dimethyl sulfoxide (DMSO).
燥した後、さらにポリアミック酸樹脂溶液に浸漬処理
し、乾燥した後、樹脂ワニスを含浸する請求項５に記載
のプリント配線基板の製造方法。7. The method for producing a printed wiring board according to claim 5, wherein after dipping treatment in an aprotic polar solvent and drying, further dipping treatment in a polyamic acid resin solution, drying and impregnation with a resin varnish. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11807396A JPH09307203A (en) | 1996-05-13 | 1996-05-13 | Printed circuit board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11807396A JPH09307203A (en) | 1996-05-13 | 1996-05-13 | Printed circuit board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09307203A true JPH09307203A (en) | 1997-11-28 |
Family
ID=14727341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11807396A Pending JPH09307203A (en) | 1996-05-13 | 1996-05-13 | Printed circuit board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09307203A (en) |
Cited By (6)
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|---|---|---|---|---|
| WO2009039353A2 (en) * | 2007-09-19 | 2009-03-26 | Sabic Innovative Plastics Ip B.V. | Fiber coated with polyamic acid or polyetherimide and method for making the coated fiber |
| US20110229828A1 (en) * | 2008-12-02 | 2011-09-22 | Kyong-Ho Yoon | Aromatic ring containing polymer, underlayer composition including the same, and associated methods |
| WO2014150348A3 (en) * | 2013-03-15 | 2015-02-26 | National Nonwovens Inc. | Composites and articles made from nonwoven structures |
| WO2016017368A1 (en) * | 2014-07-29 | 2016-02-04 | 太陽ホールディングス株式会社 | Resinous sheet, and structure and wiring board each including same |
| US9314995B2 (en) | 2013-03-15 | 2016-04-19 | National Nonwovens Inc. | Composites comprising nonwoven structures and foam |
| WO2016072334A1 (en) * | 2014-11-04 | 2016-05-12 | 太陽ホールディングス株式会社 | Resin-containing sheet, and structure and wiring board using same |
-
1996
- 1996-05-13 JP JP11807396A patent/JPH09307203A/en active Pending
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009039353A2 (en) * | 2007-09-19 | 2009-03-26 | Sabic Innovative Plastics Ip B.V. | Fiber coated with polyamic acid or polyetherimide and method for making the coated fiber |
| WO2009039353A3 (en) * | 2007-09-19 | 2009-05-28 | Sabic Innovative Plastics Ip | Fiber coated with polyamic acid or polyetherimide and method for making the coated fiber |
| JP2010539350A (en) * | 2007-09-19 | 2010-12-16 | サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ | Coated fiber and method for producing the same |
| US20110229828A1 (en) * | 2008-12-02 | 2011-09-22 | Kyong-Ho Yoon | Aromatic ring containing polymer, underlayer composition including the same, and associated methods |
| US8697341B2 (en) * | 2008-12-02 | 2014-04-15 | Cheil Industries, Inc. | Aromatic ring containing polymer, underlayer composition including the same, and associated methods |
| US9314995B2 (en) | 2013-03-15 | 2016-04-19 | National Nonwovens Inc. | Composites comprising nonwoven structures and foam |
| US9314993B2 (en) | 2013-03-15 | 2016-04-19 | National Nonwovens Inc. | Composites and articles made from nonwoven structures |
| WO2014150348A3 (en) * | 2013-03-15 | 2015-02-26 | National Nonwovens Inc. | Composites and articles made from nonwoven structures |
| US10549498B2 (en) | 2013-03-15 | 2020-02-04 | National Nonwovens Inc. | Composites and articles made from nonwoven structures |
| US10549501B2 (en) | 2013-03-15 | 2020-02-04 | National Nonwovens Inc. | Composites comprising nonwoven structures and foam |
| WO2016017368A1 (en) * | 2014-07-29 | 2016-02-04 | 太陽ホールディングス株式会社 | Resinous sheet, and structure and wiring board each including same |
| CN106459453A (en) * | 2014-07-29 | 2017-02-22 | 太阳控股株式会社 | Resinous sheet, and structure and wiring board each including same |
| KR20170039118A (en) * | 2014-07-29 | 2017-04-10 | 다이요 홀딩스 가부시키가이샤 | Resinous sheet, and structure and wiring board each including same |
| TWI659986B (en) * | 2014-07-29 | 2019-05-21 | 日商太陽控股股份有限公司 | Resin-containing sheet, structure and wiring board using the same |
| WO2016072334A1 (en) * | 2014-11-04 | 2016-05-12 | 太陽ホールディングス株式会社 | Resin-containing sheet, and structure and wiring board using same |
| JP2016089022A (en) * | 2014-11-04 | 2016-05-23 | 太陽ホールディングス株式会社 | Resin-containing sheet, and structure and wiring board using the same |
| EP3216823A4 (en) * | 2014-11-04 | 2017-11-29 | Asahi Kasei Kabushiki Kaisha | Resin-containing sheet, and structure and wiring board using same |
| US10047202B2 (en) | 2014-11-04 | 2018-08-14 | Asahi Kasei Kabushiki Kaisha | Resin-containing sheet, and structure and wiring board using same |
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