JPH09283684A - Electronic component and manufacture thereof - Google Patents
Electronic component and manufacture thereofInfo
- Publication number
- JPH09283684A JPH09283684A JP8113151A JP11315196A JPH09283684A JP H09283684 A JPH09283684 A JP H09283684A JP 8113151 A JP8113151 A JP 8113151A JP 11315196 A JP11315196 A JP 11315196A JP H09283684 A JPH09283684 A JP H09283684A
- Authority
- JP
- Japan
- Prior art keywords
- external terminal
- notch
- electronic component
- piece
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/30—Active carbon
- C01B32/312—Preparation
- C01B32/342—Preparation characterised by non-gaseous activating agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、部品本体に突設され
た外部端子の被接合部を外部の電子回路に接合する電子
部品およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for joining a joined portion of an external terminal projecting from a component body to an external electronic circuit and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】一般に、この種の電子部品のろう付け材
料として、たとえばＳｎ−Ｐｂ共晶合金が採用され、こ
のＳｎ−Ｐｂ共晶合金に含有されるＰｂ成分の人体に与
える悪影響を考慮して、近年、Ｐｂ成分の含有しない、
たとえばＳｎ−Ａｕ系，Ｓｎ−Ｓｂ系およびＳｎ−Ｂｉ
系の各種材料が検討されている。2. Description of the Related Art Generally, a Sn-Pb eutectic alloy, for example, is used as a brazing material for electronic components of this type, and the adverse effect of the Pb component contained in the Sn-Pb eutectic alloy on the human body is taken into consideration. In recent years, Pb component is not contained,
For example, Sn-Au system, Sn-Sb system and Sn-Bi system
Various materials for the system are being investigated.
【０００３】Ｐｂ成分を含有しない材料は、その融点が
Ｓｎ−Ｐｂ共晶合金に比較して高低さまざまであるが、
一般に融点の高いほど金属組織の熱的安定性が高く、か
つ、接合部の寿命が長いとの観点から高い信頼性が要求
される個所には高融点の材料が採用されている。The melting point of the material containing no Pb component is higher or lower than that of the Sn-Pb eutectic alloy.
Generally, a material having a high melting point is used in a place where high reliability is required from the viewpoint that the higher the melting point, the higher the thermal stability of the metal structure and the longer the life of the joint.
【０００４】[0004]
【発明が解決しようとする課題】ところで、一般に、電
子部品は外部端子をプリント配線基板にろう付けする
際、リフロ−法やフロ−法などの一括ろう付け方法を採
用して高温雰囲気に晒されるために、Ｐｂ成分を含有し
ない高融点材料でもって外部端子をろう付けすると、熱
損傷や外部端子の接合部に断線が生じるなどの新らたな
課題が発生する。By the way, in general, electronic parts are exposed to a high temperature atmosphere by adopting a collective brazing method such as a reflow method or a flow method when brazing external terminals to a printed wiring board. Therefore, when the external terminal is brazed with a high melting point material containing no Pb component, new problems such as heat damage and disconnection at the joint of the external terminal occur.
【０００５】すなわち、外部端子を高融点材料の溶融温
度まで昇温させると、その高温熱が上記外部端子を通っ
て部品本体の内部にまで伝導されて熱損傷を受け、不良
品の発生や短寿命の要因となる。また、上記外部端子
は、放熱効果を有してろう付け部の加熱温度を低下させ
るため、高融点材料の溶融温度まで昇温させるにはその
加熱温度を一層高めなければならず、この高温加熱に基
づく熱変形でもってプリント配線基板とのろう付け部に
剥離や破壊を発生させて断線するなどの課題がある。That is, when the temperature of the external terminal is raised to the melting temperature of the high melting point material, the high temperature heat is conducted to the inside of the component body through the external terminal and is thermally damaged, resulting in defective products or short circuit. It becomes a factor of life. Further, since the external terminal has a heat dissipation effect and lowers the heating temperature of the brazing portion, the heating temperature must be further raised to raise the melting temperature of the high melting point material. However, there is a problem in that the brazed portion with the printed wiring board causes peeling or breakage due to thermal deformation based on the above, resulting in disconnection.
【０００６】この発明は上記課題を解消するためになさ
れたもので、熱損傷や外部端子のろう付け部の断線を防
止し、長寿命かつ信頼性の高い電子部品を提供すること
を目的とする。この発明の他の目的は、上記電子部品を
多量生産できるとともに超小型化が可能な電子部品の製
造方法を提供することを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic component having a long life and high reliability, which prevents heat damage and disconnection of a brazed portion of an external terminal. . Another object of the present invention is to provide a method of manufacturing an electronic component which can mass-produce the electronic component and can be miniaturized.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、この発明による請求項１の電子部品は、部品本体に
突設された外部端子の被接合部を外部の電子回路に接合
する電子部品であって、上記外部端子には上記部品本体
の付け根部と被接合部との間に切欠部を形成し、この切
欠部の横断面を上記被接合部の付け根部側近傍における
横断面よりも小面積に形成したことを特徴とする。In order to achieve the above object, the electronic component of claim 1 according to the present invention is an electronic component for joining a joined portion of an external terminal projecting from a component body to an external electronic circuit. In the component, the external terminal has a notch formed between the root of the component body and the joint, and the cross section of the notch is taken from the cross section near the root of the joint. Is also characterized in that it is formed in a small area.
【０００８】この発明による請求項２の電子部品は、上
記切欠部が貫通孔からなることを特徴とする。この発明
による請求項３の電子部品は、上記切欠部が上記外部端
子の幅方向へ延びる凹溝からなることを特徴とする。An electronic component according to a second aspect of the present invention is characterized in that the cutout portion is a through hole. An electronic component according to a third aspect of the present invention is characterized in that the cutout portion is a groove extending in the width direction of the external terminal.
【０００９】この発明による請求項４の電子部品の製造
方法は、リ−ドフレームに形成された複数の外部端子片
の中央部に切欠部を形成する工程と、上記リ−ドフレー
ムの素子設定片に電子素子を接合して上記外部端子片に
電気接続する工程と、上記電子素子を含む上記外部端子
片を封止して部品本体を形成するとともに上記切欠部を
外部に露出させて上記外部端子片を上記部品本体に突設
する工程と、上記外部端子片および素子設定片を上記リ
−ドフレームのフレーム枠から切断して上記切欠部をも
った複数の外部端子を上記部品本体に突設させる工程と
を備えたことを特徴とする。According to a fourth aspect of the present invention, there is provided a method for manufacturing an electronic component, wherein a step of forming a notch in a central portion of a plurality of external terminal pieces formed on the lead frame, and element setting of the lead frame. A step of joining an electronic element to a piece and electrically connecting to the external terminal piece; and a step of sealing the external terminal piece including the electronic element to form a component body and exposing the notch to the outside. A step of projecting the terminal piece on the component body; and a step of cutting the external terminal piece and the element setting piece from the frame of the lead frame to project a plurality of external terminals having the cutout portions on the component body. And a step of setting.
【００１０】この発明による請求項５の電子部品の製造
方法は、上記リ−ドフレームを形成する工程が、帯状の
導電性板材に切欠部を形成する工程と、上記切欠部を有
する外部端子片および素子設定片を打ち抜き形成する工
程とからなることを特徴とする請求項４に記載の電子部
品の製造方法。この発明による請求項６の電子部品の製
造方法は、外部端子片に切欠部を形成する工程が、外部
端子片の中央部に開口をもったフォトレジスト膜の硬化
された保護膜を形成する工程と、上記開口を通して上記
外部端子片の中央部をエッチングする工程と、上記保護
膜を除去する工程とからなることを特徴とする。In the method of manufacturing an electronic component according to a fifth aspect of the present invention, the step of forming the lead frame includes the step of forming a cutout portion in the strip-shaped conductive plate material, and the external terminal piece having the cutout portion. And a step of punching and forming the element setting piece. In the method of manufacturing an electronic component according to claim 6 of the present invention, the step of forming the notch in the external terminal strip forms the cured protective film of the photoresist film having an opening in the center of the external terminal strip. And a step of etching the central portion of the external terminal piece through the opening, and a step of removing the protective film.
【００１１】[0011]
【作用】請求項１の発明によれば、上記外部端子には上
記部品本体の付け根部と被接合部との間に切欠部を形成
し、この切欠部の横断面を上記被接合部の付け根部側近
傍における横断面よりも小面積に形成したから、外部端
子の先端部をろう付け材料の溶融温度まで昇温させて加
熱した場合でも、高温熱が上記切欠部における小横断面
積の部分で伝導し難く、部品本体の内部にまで伝導され
るのを抑制して、熱損傷をなくし、不良品の発生を防止
することができる。また、上記外部端子の熱変形を上記
切欠部で吸収し、プリント配線基板とのろう付け部にお
ける剥離や破壊に基づく断線を防止して、長寿命かつ信
頼性の高い電子部品を提供することができる。その場
合、請求項２および３の発明のように、上記切欠部を貫
通孔や凹溝から容易かつ簡単に形成することができる。According to the invention of claim 1, a cutout is formed in the external terminal between the root of the component body and the joint, and the cross section of the notch is the root of the joint. Since it is formed in a smaller area than the cross section in the vicinity of the part side, even when the tip of the external terminal is heated to the melting temperature of the brazing material and heated, high temperature heat is generated in the small cross-sectional area of the cutout. It is difficult to conduct electricity, and it is possible to suppress conduction to the inside of the component body, eliminate heat damage, and prevent the occurrence of defective products. Further, thermal deformation of the external terminals is absorbed by the cutout portions, wire breakage due to peeling or breakage at the brazed portion with the printed wiring board is prevented, and a long-life and highly reliable electronic component can be provided. it can. In that case, as in the inventions of claims 2 and 3, the notch can be easily and easily formed from the through hole or the groove.
【００１２】請求項４の発明によれば、外部端子に切欠
部を有する電子部品がリ−ドフレームの使用で多量生産
可能である。その場合、請求項５の発明のように、上記
切欠部がリ−ドフレームに形成されているから、電子部
品の製造が容易かつ簡単である。また、請求項６の発明
のように、上記切欠部を精密写真印刷技術でもって外部
端子に形成すれば、超小型化された電子部品を製造する
ことができる。According to the fourth aspect of the present invention, the electronic parts having the notches in the external terminals can be mass-produced by using the lead frame. In this case, since the notch is formed in the lead frame as in the invention of claim 5, the manufacturing of the electronic component is easy and simple. Further, as in the invention of claim 6, if the notch is formed in the external terminal by the precision photo printing technique, an ultra-miniaturized electronic component can be manufactured.
【００１３】[0013]
【実施例】以下、この発明の実施例を図面にもとづいて
説明する。図１はこの発明による電子部品の一例を示す
斜視図である。同図において、Ａは電子部品で、たとえ
ば合成樹脂からなる部品本体１にはＩＣチップなどの電
子素子２をインサート成形するとともに、上記電子素子
２に電気接続された複数の外部端子３が上記部品本体１
に突設されている。上記外部端子３は、その先端部３ａ
がプリント配線基板Ｂ（図２）の導体パターン４にろう
付け材料５で接合されるとともに、その被接合部３ａと
上記部品本体１に対する上記外部端子３の付け根部３ｂ
との間には長手方向（矢印ａ方向）に沿って複数の貫通
孔７を穿設して切欠部６が形成されている。上記貫通孔
７は１つであってもよいことはいうまでもない。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an example of an electronic component according to the present invention. In the figure, A is an electronic component, for example, an electronic element 2 such as an IC chip is insert-molded in a component body 1 made of synthetic resin, and a plurality of external terminals 3 electrically connected to the electronic element 2 are the above-mentioned components. Body 1
It is projected. The external terminal 3 has a tip portion 3a.
Is joined to the conductor pattern 4 of the printed wiring board B (FIG. 2) with the brazing material 5, and the joint portion 3a and the root portion 3b of the external terminal 3 to the component body 1 are joined together.
A plurality of through holes 7 are bored along the longitudinal direction (direction of arrow a) to form a notch portion 6 between and. It goes without saying that the number of the through holes 7 may be one.
【００１４】上記ろう付け材料５として、Ｐｂ成分を含
有しない、たとえばＳｎ−Ａｕ系，Ｓｎ−Ｓｂ系および
Ｓｎ−Ｂｉ系の各種材料で、かつ、その融点がＳｎ−Ｐ
ｂ共晶合金に比較して高いものが採用され、リフロ−法
やフロ−法などの一括ろう付け方法によって、外部端子
３の先端部３ａが上記導体パターン４にろう付けされ
る。As the brazing material 5, various materials containing no Pb component, for example, Sn—Au type, Sn—Sb type and Sn—Bi type materials, and having a melting point of Sn—P are used.
A higher alloy than the b-eutectic alloy is adopted, and the tip portion 3a of the external terminal 3 is brazed to the conductor pattern 4 by a collective brazing method such as a reflow method or a flow method.
【００１５】この一括ろう付け工程において、高融点の
ろう付け材料５が採用されるために、電子部品Ａは高温
雰囲気に晒される。その際、電子素子２は部品本体１に
インサート成形されて直接に加熱されることなく熱損傷
を防止することができる。また、上記外部端子３の先端
部３ａをろう付け材料５の高温溶融温度まで昇温させて
加熱した場合でも、上記外部端子３には上記部品本体１
の付け根部と被接合部３ａとの間に切欠部６を形成し、
この切欠部６におけるｂ−ｂ線に沿う横断面を上記被接
合部３ａの付け根部側近傍におけるｃ−ｃ線に沿う横断
面よりも小面積に形成したから、高温熱が上記切欠部６
における小横断面積の部分で伝導し難く、部品本体１の
内部にまで伝導されるのを抑制して、上記電子素子２の
熱損傷をなくし、不良品の発生を防止して長寿命とする
ことができる。In this collective brazing process, the high melting point brazing material 5 is used, so that the electronic component A is exposed to a high temperature atmosphere. At this time, the electronic element 2 is insert-molded in the component body 1 and is not directly heated, so that thermal damage can be prevented. Further, even when the tip portion 3a of the external terminal 3 is heated to the high temperature melting temperature of the brazing material 5 and heated, the external terminal 3 has the component body 1
Forming a notch 6 between the root of the and the joined portion 3a,
Since the cross section of the notch 6 along the line bb is formed to have a smaller area than the cross section of the portion 3a near the base of the joined portion 3a along the line cc, high-temperature heat is generated by the notch 6 as described above.
It is difficult to conduct electricity in the small cross-sectional area of the component, suppress conduction to the inside of the component body 1, eliminate heat damage to the electronic element 2, prevent defective products, and prolong life. You can
【００１６】さらに、上記外部端子３を高温加熱する
と、複数の各外部端子３の先端部３ａがプリント配線基
板Ｂにろう付け材料５で接合された状態で長手方向（矢
印Ａ方向）へ熱膨張して伸長するために、上記外部端子
３は上記配線基板Ｂから離間する方向（矢印ｄ方向）へ
変位して浮き上がろうとする。このとき、上記外部端子
３には切欠部６が形成されて機械的強度を弱めてあるか
ら、この切欠部６の変形で上記外部端子３の熱膨張に基
づく熱変形を吸収し、上記外部端子３の浮き上り変位が
ろう付け部５に伝達されることなく、このろう付け部５
における剥離や破壊に基づく断線を有効に防止すること
ができる。Further, when the external terminals 3 are heated to a high temperature, the ends 3a of the plurality of external terminals 3 are thermally expanded in the longitudinal direction (the direction of arrow A) while being joined to the printed wiring board B by the brazing material 5. Then, the external terminal 3 is displaced in the direction away from the wiring board B (the direction of arrow d) to float. At this time, since the notch 6 is formed in the external terminal 3 to weaken the mechanical strength, the deformation of the notch 6 absorbs the thermal deformation due to the thermal expansion of the external terminal 3, and the external terminal 3 The floating displacement of 3 is not transmitted to the brazing part 5,
It is possible to effectively prevent wire breakage due to peeling or breakage.
【００１７】上記切欠部６は図１で示した貫通孔７に代
えて切欠孔８（図３）や凹溝９（図４）であってもよ
く、これらによって上記切欠部６をきわめて簡単かつ容
易に形成することができる。また、外部端子３は先端部
３ａを上記配線基板Ｂの板面にほぼ平行に配設してろう
付けしたけれども、外部端子３の先端部３ａに段部３ｃ
（図５）を設け、この段部３ｃを上記配線基板Ｂに形成
されたスルーホール１０（図６）の外周縁に係止させ
て、上記先端部３ａをろう付け材料５で上記配線基板Ｂ
の導体パターン４に接合してもよく、この場合でも前述
の場合とほぼ同様の利点を有する。The notch 6 may be a notch hole 8 (FIG. 3) or a groove 9 (FIG. 4) in place of the through hole 7 shown in FIG. 1, whereby the notch 6 is extremely simple and It can be easily formed. Further, the external terminal 3 is brazed with the tip portion 3a disposed substantially parallel to the plate surface of the wiring board B, but the step portion 3c is attached to the tip portion 3a of the external terminal 3.
(FIG. 5) is provided, the step portion 3c is locked to the outer peripheral edge of the through hole 10 (FIG. 6) formed in the wiring board B, and the tip portion 3a is brazed with the wiring board 5 by the brazing material 5.
The conductor pattern 4 may be joined to the conductor pattern 4 of FIG.
【００１８】図７はこの発明による電子部品の製造方法
の一例を示す平面図である。同図(A) で示すように、リ
−ドフレームＣには複数の外部端子片３１および素子設
定片３２が形成され、このリ−ドフレームＣは図８(A)
で示すダイ３３に載置された帯状の導電性板材（図示せ
ず）をパンチ３４で打ち抜いて上記外部端子片３１およ
び素子設定片３２を形成するとともに、上記外部端子片
３１の中央部に貫通孔７からなる切欠部６が同時に形成
される。FIG. 7 is a plan view showing an example of a method of manufacturing an electronic component according to the present invention. As shown in FIG. 8 (A), a plurality of external terminal pieces 31 and element setting pieces 32 are formed on the lead frame C. This lead frame C is shown in FIG. 8 (A).
A band-shaped conductive plate material (not shown) mounted on the die 33 shown in FIG. 2 is punched with a punch 34 to form the external terminal piece 31 and the element setting piece 32, and penetrates the central portion of the external terminal piece 31. The notch 6 consisting of the hole 7 is simultaneously formed.
【００１９】つぎに、図７(B) および図８(B) で示すよ
うに、リ−ドフレームＣの素子設定片３２にＩＣチップ
などの電子素子２をダイボンディングし、金線やアルミ
ニュウム線８を上記電子素子２と外部端子片３１にまた
がってワイヤボンディングしたのち、上記電子素子２お
よびワイヤボンディング部を金型（図示せず）に設定し
て合成樹脂を射出し、図７(C) で示す部品本体１にイン
サート成形し、上記外部端子片３１および素子設定片３
２の連結片３５を図８(C) で示すダイ３８に載置されて
パンチ３７でもって上記リ−ドフレームＣのフレーム枠
３６から切断し、図１で示するような電子部品Ａを多量
生産する。Next, as shown in FIGS. 7B and 8B, an electronic element 2 such as an IC chip is die-bonded to the element setting piece 32 of the lead frame C, and a gold wire or an aluminum wire is attached. After wire bonding 8 over the electronic element 2 and the external terminal piece 31, the electronic element 2 and the wire bonding portion are set in a mold (not shown) and a synthetic resin is injected, as shown in FIG. Is insert-molded into the component body 1 shown in FIG.
The connecting piece 35 of No. 2 is placed on the die 38 shown in FIG. 8 (C) and cut with the punch 37 from the frame 36 of the lead frame C, and a large amount of electronic parts A as shown in FIG. Produce.
【００２０】なお、上記リ−ドフレームＣは、図９(A)
で示すダイ４２に載置された帯状の導電性板材Ｃ１をパ
ンチ４１で打ち抜いて、図９(B) で示す貫通孔７を形成
したのち、図７(A) で示すように形成してもよい。ま
た、上記切欠部６は貫通孔７に代えて、切欠孔８（図
３）や凹溝９（図４）を上記パンチ３４，４１を変更す
ることにより容易に形成することができる。The lead frame C is shown in FIG. 9 (A).
Even if the band-shaped conductive plate material C1 placed on the die 42 is punched by the punch 41 to form the through holes 7 shown in FIG. 9B, and then as shown in FIG. 7A. Good. Further, the notch portion 6 can be easily formed by replacing the through hole 7 with the notch hole 8 (FIG. 3) and the concave groove 9 (FIG. 4) by changing the punches 34 and 41.
【００２１】図１０はこの発明による電子部品の製造方
法の他の例を示す平面図である。同図(A) で示すよう
に、リ−ドフレームＣには複数の外部端子片３１および
素子設定片３２が形成され、上記リ−ドフレームＣの全
表面に図１１(A) で示すようにフォトレジスト膜Ｄが塗
布され、上記外部端子片３１の中央部を除いて上記フォ
トレジスト膜Ｄの全面をマスク（図示せず）を介し露光
して硬化させ、これを洗浄液で洗浄し、図１０(B) およ
び図１１(B) で示すように、上記外部端子片３１の中央
部に開口４３をもった保護膜４４が形成される。上記開
口４３を通して上記外部端子片３１の中央部をエッチン
グ液でエッチングすると、図１０(C) および図１１(C)
で示すように、上記外部端子片３１の中央部には、たと
えば凹溝９からなる切欠部６が形成され、上記保護膜４
４を洗浄液で除去すれば、前述の図７(A) で示すような
リ−ドフレームＣを製造することができる。したがっ
て、このような精密写真印刷技術により、リ−ドフレー
ムＣの外部端子片３１に切欠部６を形成すれば、超小型
化された電子部品Ａを製造することができる。FIG. 10 is a plan view showing another example of the method of manufacturing an electronic component according to the present invention. As shown in FIG. 11A, a plurality of external terminal pieces 31 and element setting pieces 32 are formed on the lead frame C, and the entire surface of the lead frame C is shown in FIG. 11A. Is coated with a photoresist film D, and the entire surface of the photoresist film D except for the central portion of the external terminal piece 31 is exposed and cured through a mask (not shown), and washed with a cleaning liquid. As shown in FIG. 10 (B) and FIG. 11 (B), a protective film 44 having an opening 43 is formed in the central portion of the external terminal piece 31. When the central portion of the external terminal piece 31 is etched through the opening 43 with an etchant, the external terminal piece 31 shown in FIGS.
As shown in FIG. 3, a cutout 6 made of, for example, a groove 9 is formed in the center of the external terminal piece 31, and the protective film 4 is formed.
By removing 4 with a cleaning liquid, the lead frame C as shown in FIG. 7 (A) can be manufactured. Therefore, if the notch 6 is formed in the external terminal piece 31 of the lead frame C by such a precision photo printing technique, it is possible to manufacture the miniaturized electronic component A.
【００２２】なお、上記実施例において、電子部品Ａと
して合成樹脂からなる部品本体１にＩＣチップなどの電
子素子２をインサート成形した場合について説明したけ
れども、上記電子部品Ａは、たとえば抵抗器、コイル装
置，コンデンサもしくはマイコンなどであってもよく、
本願発明は特許請求の範囲に記載された技術思想に基づ
いて各種の変形例が案出され、これらの変形例は本願発
明の技術思想を逸脱しない範囲内において包含されるこ
とはいうまでもない。In the above embodiment, the case where the electronic element 2 such as an IC chip is insert-molded into the component body 1 made of synthetic resin as the electronic component A has been described, but the electronic component A is, for example, a resistor or a coil. It may be a device, a capacitor or a microcomputer,
Needless to say, the present invention is devised in various modifications based on the technical idea described in the claims, and these modifications are included within the scope not departing from the technical idea of the present invention. .
【００２３】[0023]
【発明の効果】以上詳述したように、請求項１ないし３
の発明によれば、熱損傷や外部端子の接合部の断線を防
止して、長寿命かつ信頼性の高い電子部品を提供するこ
とができる。また、請求項４ないし６の発明によれば、
上記電子部品を多量生産できるとともに、超小型化が可
能な電子部品の製造方法を提供することができる。As described in detail above, claims 1 to 3
According to the invention, it is possible to provide an electronic component having a long life and high reliability by preventing heat damage and disconnection of the joint portion of the external terminal. According to the invention of claims 4 to 6,
It is possible to provide a method for manufacturing an electronic component that can be mass-produced and can be miniaturized.
【図１】この発明による電子部品の一例を示す斜視図で
ある。FIG. 1 is a perspective view showing an example of an electronic component according to the present invention.
【図２】同電子部品をろう付けして示す要部の斜視図で
ある。FIG. 2 is a perspective view of a main part showing the electronic component by brazing.
【図３】同電子部品の他の例を示す要部の斜視図であ
る。FIG. 3 is a perspective view of a main part showing another example of the electronic component.
【図４】同電子部品の異なる他の例を示す要部の斜視図
である。FIG. 4 is a perspective view of a main part showing another example of the same electronic component.
【図５】同電子部品のさらに異なる他の例を示す要部の
斜視図である。FIG. 5 is a perspective view of a main part showing still another example of the electronic component.
【図６】同電子部品をろう付けして示す要部の断面図で
ある。FIG. 6 is a cross-sectional view of a main part showing the electronic component by brazing.
【図７】この発明による電子部品の製造方法の一例を示
す要部の平面図である。FIG. 7 is a plan view of essential parts showing an example of a method for manufacturing an electronic component according to the present invention.
【図８】同電子部品の製造方法の他の例を示す要部の断
面図である。FIG. 8 is a cross-sectional view of essential parts showing another example of the method for manufacturing the same electronic component.
【図９】この発明による電子部品の製造方法の他の例を
示す要部の側面図および平面図である。9A and 9B are a side view and a plan view of a main part showing another example of the method for manufacturing an electronic component according to the present invention.
【図１０】この発明による電子部品の製造方法の異なる
他の例を示す要部の平面図である。FIG. 10 is a plan view of an essential part showing another example of a different method of manufacturing an electronic component according to the present invention.
【図１１】この発明による電子部品の製造方法の異なる
他の例を示す要部の断面図である。FIG. 11 is a cross-sectional view of a main part showing another example of a different method of manufacturing an electronic component according to the present invention.
Ａ 電子部品 Ｂ プリント配線基板 Ｃ リ−ドフレーム Ｃ１ 導電性板材 Ｄ フォトレジスト膜 １ 部品本体 ２ 電子素子 ３ 外部端子 ３ａ 先端部（被接合部） ３ｂ 付け根部 ６ 切欠部 ７ 貫通孔 ８ 切欠孔 ９ 凹溝 ３１ 外部端子片 ３２ 素子設定片 ３６ フレーム枠 ４３ 開口 ４４ 保護膜 A electronic component B printed wiring board C lead frame C1 conductive plate material D photoresist film 1 component body 2 electronic element 3 external terminal 3a tip (joined portion) 3b root 6 notch 7 through hole 8 notch 9 Groove 31 External terminal piece 32 Element setting piece 36 Frame frame 43 Opening 44 Protective film
Claims (6)
部を外部の電子回路に接合する電子部品であって、上記
外部端子には上記部品本体の付け根部と被接合部との間
に切欠部を形成し、この切欠部の横断面を上記被接合部
の付け根部側近傍における横断面よりも小面積に形成し
たことを特徴とする電子部品。1. An electronic component for joining a joined portion of an external terminal projecting from a component body to an external electronic circuit, wherein the external terminal is provided between a base portion of the component body and the joined portion. An electronic component, characterized in that a notch is formed in the cross section, and the cross section of the notch has a smaller area than the cross section in the vicinity of the root side of the joined portion.
とする請求項１に記載の電子部品。2. The electronic component according to claim 1, wherein the cutout portion is a through hole.
びる凹溝からなることを特徴とする請求項１に記載の電
子部品。3. The electronic component according to claim 1, wherein the cutout portion is a concave groove extending in a width direction of the external terminal.
端子片の中央部に切欠部を形成する工程と、上記リ−ド
フレームの素子設定片に電子素子を接合して上記外部端
子片に電気接続する工程と、上記電子素子を含む上記外
部端子を封止して部品本体を形成するとともに上記切欠
部を外部に露出させて上記外部端子片を上記部品本体に
突設する工程と、上記外部端子片および素子設定片を上
記リ−ドフレームのフレーム枠から切断して上記切欠部
をもった複数の外部端子を上記部品本体に突設させる工
程とを備えたことを特徴とする電子部品の製造方法。4. A step of forming a notch in a central portion of a plurality of external terminal pieces formed on a lead frame, and an external element piece by joining an electronic element to an element setting piece of the lead frame. A step of electrically connecting to, a step of sealing the external terminal including the electronic element to form a component body and exposing the cutout portion to the outside to project the external terminal piece on the component body, And a step of cutting the external terminal piece and the element setting piece from the frame of the lead frame to project a plurality of external terminals having the cutout portions on the component body. Manufacturing method of parts.
帯状の導電性板材に切欠部を形成する工程と、上記切欠
部を有する外部端子片および素子設定片を打ち抜き形成
する工程とからなることを特徴とする請求項４に記載の
電子部品の製造方法。5. The step of forming the lead frame comprises:
The method for manufacturing an electronic component according to claim 4, comprising a step of forming a notch in the strip-shaped conductive plate material and a step of punching and forming an external terminal piece and an element setting piece having the notch. .
外部端子片の中央部に開口をもったフォトレジスト膜の
硬化された保護膜を形成する工程と、上記開口を通して
上記外部端子片の中央部をエッチングする工程と、上記
保護膜を除去する工程とからなることを特徴とする請求
項４に記載の電子部品の製造方法。6. The step of forming a notch in the external terminal piece comprises:
A step of forming a cured protective film of a photoresist film having an opening in the central portion of the external terminal piece, a step of etching the central portion of the external terminal piece through the opening, and a step of removing the protective film The method for manufacturing an electronic component according to claim 4, wherein the method comprises:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11315196A JP3451516B2 (en) | 1996-04-09 | 1996-04-09 | Electronic component, its manufacturing method and brazing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11315196A JP3451516B2 (en) | 1996-04-09 | 1996-04-09 | Electronic component, its manufacturing method and brazing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09283684A true JPH09283684A (en) | 1997-10-31 |
| JP3451516B2 JP3451516B2 (en) | 2003-09-29 |
Family
ID=14604869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11315196A Expired - Fee Related JP3451516B2 (en) | 1996-04-09 | 1996-04-09 | Electronic component, its manufacturing method and brazing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3451516B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2019167284A1 (en) * | 2018-03-02 | 2020-04-09 | 新電元工業株式会社 | Resin-sealed semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101780385B1 (en) | 2015-08-31 | 2017-09-21 | 호서대학교 산학협력단 | Oled encapsulation structure and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (en) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPS62199961U (en) * | 1986-06-11 | 1987-12-19 | ||
| JPS6417458A (en) * | 1987-07-13 | 1989-01-20 | Matsushita Electronics Corp | Semiconductor package |
| JPH0722570A (en) * | 1993-06-28 | 1995-01-24 | Internatl Business Mach Corp <Ibm> | Elastic lead for electrical and mechanical connection of integrated circuit chip package to substrate surface and preparation thereof |
| JPH0878452A (en) * | 1994-09-06 | 1996-03-22 | Hitachi Ltd | Resin molding equipment |
| JPH0878482A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | Film carrier, semiconductor package and production thereof |
-
1996
- 1996-04-09 JP JP11315196A patent/JP3451516B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58215061A (en) * | 1982-06-09 | 1983-12-14 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| JPS62199961U (en) * | 1986-06-11 | 1987-12-19 | ||
| JPS6417458A (en) * | 1987-07-13 | 1989-01-20 | Matsushita Electronics Corp | Semiconductor package |
| JPH0722570A (en) * | 1993-06-28 | 1995-01-24 | Internatl Business Mach Corp <Ibm> | Elastic lead for electrical and mechanical connection of integrated circuit chip package to substrate surface and preparation thereof |
| JPH0878482A (en) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | Film carrier, semiconductor package and production thereof |
| JPH0878452A (en) * | 1994-09-06 | 1996-03-22 | Hitachi Ltd | Resin molding equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2019167284A1 (en) * | 2018-03-02 | 2020-04-09 | 新電元工業株式会社 | Resin-sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3451516B2 (en) | 2003-09-29 |
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