JPH09254006A - Wire for wire saw - Google Patents
Wire for wire sawInfo
- Publication number
- JPH09254006A JPH09254006A JP9485496A JP9485496A JPH09254006A JP H09254006 A JPH09254006 A JP H09254006A JP 9485496 A JP9485496 A JP 9485496A JP 9485496 A JP9485496 A JP 9485496A JP H09254006 A JPH09254006 A JP H09254006A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- saw
- cut
- strands
- polygonal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、精密工業材料の切
断に用いられるワイヤーソーに用いられるワイヤーに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire used in a wire saw used for cutting precision industrial materials.
【０００２】[0002]
【従来の技術】石英、あるいは、半導体シリコンインゴ
ットや、ＧａＰ、ＩｎＰなどの化合物半導体のインゴッ
トなどの被切断物（ワーク）から、一定の厚さの平板状
素材を切り出す装置として、回転するダイヤモンド刃に
よって被切断物を切断するスライシングマシン、また
は、多数枚の薄板状の鋼板をスペーサーを介して平行に
組み上げた切断刃を往復運動させると共に、砥粒を切断
刃と被切断物との接触部分に供給することによって、被
切断物を切断するバンドソーの他に、細い一本のピアノ
線などの鋼線からなるワイヤーを複数個のローラに設け
られた多数の溝に巻き付けて、ワイヤーを一方向に走行
させ、または往復運動させながら走行させて、これに被
切断物を圧接すると共に、ワイヤーと被切断物との接触
部分に、砥粒を供給することによって、被切断物を切断
するワイヤーソーが使用されている。2. Description of the Related Art A rotating diamond blade is used as a device for cutting a flat material having a constant thickness from an object to be cut (work) such as quartz, a semiconductor silicon ingot, or a compound semiconductor ingot such as GaP or InP. A slicing machine that cuts the object to be cut by, or a reciprocating movement of a cutting blade made up of a number of thin steel plates assembled in parallel via a spacer, and at the same time, abrasive grains are applied to the contact portion between the cutting blade and the object. By supplying, in addition to a band saw that cuts the object to be cut, a wire consisting of a thin steel wire such as a piano wire is wound around a large number of grooves provided in a plurality of rollers, and the wire is unidirectionally While running or reciprocatingly running, press the object to be cut into contact with it, and supply the abrasive grains to the contact part between the wire and the object to be cut By Rukoto, wire saw for cutting a object to be cut is used.
【０００３】この最後に挙げたワイヤーソーにおいて
は、スライシングマシンで使用されるダイヤモンド刃
や、バンドソーで使用される鋼板の厚さに比べて小さい
径のワイヤーを使用できるので、高価な材料を小さい切
代で切断できること、および、多数枚の平板状素材を同
時に切り出すことができること、さらに、種々の被切断
物を極めて精度よく切断できることなどの利点を有し、
石英、あるいは、半導体シリコンインゴットや、Ｇａ
Ｐ、ＩｎＰなどの化合物半導体のインゴットなどを、高
い生産効率で切断できる。In the last-mentioned wire saw, a diamond blade used in a slicing machine or a wire having a diameter smaller than the thickness of a steel plate used in a band saw can be used, so that expensive materials can be cut into small pieces. It has the advantages that it can be cut at a cost, and that it can cut out a large number of flat plate-shaped materials at the same time, and that it can cut various objects to be cut with extremely high precision,
Quartz, semiconductor silicon ingot, Ga
Ingots of compound semiconductors such as P and InP can be cut with high production efficiency.
【０００４】[0004]
【発明が解決しようとする課題】近年、半導体デバイス
の高集積化やその生産性向上を図るために、その素材と
なる半導体シリコンインゴットやマスク用基板として使
用される石英インゴットが大型化している。しかし、特
にこのような大型の被切断物をワイヤーソーで切断する
際に、砥粒が、ワイヤーと被切断物との接触部分に供給
されにくく、切断速度を大きくすることができないとい
う問題が生じている。In recent years, semiconductor silicon ingots, which are the raw materials, and quartz ingots used as mask substrates, have become large in size in order to achieve high integration of semiconductor devices and improvement of their productivity. However, particularly when cutting such a large object to be cut with a wire saw, the abrasive grains are difficult to be supplied to the contact portion between the wire and the object to be cut, and there is a problem that the cutting speed cannot be increased. ing.
【０００５】従って、大型の被切断物を切断する場合で
あっても大きい切断速度で切断できるように、砥粒が、
ワイヤーと被切断物との接触部分に確実に供給されるよ
うにして、ワイヤーソーの切断能力を高めることが所望
されている。Therefore, even if a large object to be cut is cut, the abrasive grains must be cut at a high cutting speed.
It is desirable to increase the cutting ability of the wire saw by ensuring that the wire is supplied to the contact portion between the wire and the object to be cut.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、上記課題
を解決するために種々研究を重ねた結果、ワイヤーソー
において、断面形状が多角形または楕円形の素線からな
るワイヤーを、好ましくは捩じられた状態で用いると、
砥粒を、ワイヤーと被切断物との接触部分に確実に供給
でき、ワイヤーソーの切断能力を高めることができるこ
とを見いだした。さらに、炭素繊維の素線からなるワイ
ヤーも、特に複数本の炭素繊維の素線からなる場合、砥
粒を、ワイヤーと被切断物との接触部分に確実に供給で
き、ワイヤーソーの切断能力を高めることができること
も見いだした。The inventors of the present invention have conducted various studies to solve the above problems, and as a result, in a wire saw, a wire having a polygonal or elliptical cross-section is preferable. Is used in a twisted state,
It has been found that the abrasive grains can be reliably supplied to the contact portion between the wire and the object to be cut, and the cutting ability of the wire saw can be enhanced. Furthermore, when the wire made of carbon fiber strands, especially when made of multiple carbon fiber strands, the abrasive grains can be reliably supplied to the contact portion between the wire and the object to be cut, and the cutting ability of the wire saw can be improved. I also found that it can be increased.
【０００７】従って、本発明は、 １）中心軸に対する断面形状が多角形または楕円形であ
る素線からなることを特徴とする、ワイヤーソー用ワイ
ヤー、 ２）中心軸に対する断面形状が多角形または楕円形であ
る１本の素線からなり、この素線は捩じられた状態にあ
ることを特徴とする、ワイヤーソー用ワイヤー、 ３）２本以上の素線からなり、これらの素線の少なくと
も１本は中心軸に対する断面形状が多角形または楕円形
である素線であることを特徴とする、ワイヤーソー用ワ
イヤー、 ４）２本以上の素線からなり、これらの素線は撚られた
状態にあって、素線の少なくとも１本は中心軸に対する
断面形状が多角形または楕円形である素線であることを
特徴とする、ワイヤーソー用ワイヤー、および ５）炭素繊維の素線からなるワイヤーソー用ワイヤー を要旨とするものである。Therefore, according to the present invention, 1) a wire for a wire saw, which is characterized by comprising a wire whose cross-sectional shape with respect to the central axis is polygonal or elliptical, 2) polygonal or cross-sectional shape with respect to the central axis It consists of one wire that is oval, and this wire is in a twisted state. 3) Wire for wire saw, 3) It consists of two or more wires. At least one wire having a polygonal or elliptical cross-section with respect to the central axis, wire for a wire saw, 4) consisting of two or more wires, which are twisted And a wire for a saw wire, characterized in that at least one of the wires is a polygonal or elliptical cross-section with respect to the central axis, and Become a wire The saw wire is intended to be subject matter.
【０００８】このようなワイヤーを用いると、砥粒がワ
イヤーに保持され易く、かつ、排出され易くなるため、
ワイヤーの走行によって、ワイヤーと被切断物との接触
部分に確実に新たな砥粒を供給することができ、その結
果、ワイヤーソーの切断能力を高めることができる。When such a wire is used, the abrasive grains are easily held on the wire and discharged easily.
By running the wire, new abrasive grains can be reliably supplied to the contact portion between the wire and the object to be cut, and as a result, the cutting ability of the wire saw can be enhanced.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態を説明
する。上記１）の本発明のワイヤーソー用ワイヤーは、
中心軸に対する断面形状が多角形、例えば、三角形、四
角形、五角形、六角形、または楕円形である素線からな
る。上記２）の本発明のワイヤーソー用ワイヤーは、上
記のような素線を捩って作製されたものである。このよ
うに捩ることによって、ワイヤーに砥粒がより保持され
易くなって、ワイヤーソーの切断能力をより高めること
ができる。図１に、上記２）の本発明のワイヤーソー用
ワイヤーのいくつかの例を、断面形状を表す図と部分斜
視図で示す。Embodiments of the present invention will be described below. The wire for a wire saw of the present invention in 1) above,
The elemental wire has a polygonal cross section with respect to the central axis, for example, a triangle, a quadrangle, a pentagon, a hexagon, or an ellipse. The wire for a wire saw of the present invention in 2) above is produced by twisting the above-mentioned strand. By twisting in this manner, the abrasive grains are more easily held by the wire, and the cutting ability of the wire saw can be further enhanced. FIG. 1 shows some examples of the wire for a wire saw of the present invention of 2) above in a view showing a cross-sectional shape and a partial perspective view.
【００１０】上記３）の本発明のワイヤーソー用ワイヤ
ーは、２本以上の素線からなり、素線の少なくとも１
本、好ましくは素線の半数以上は、中心軸に対する断面
形状が多角形、例えば、三角形、四角形、五角形、六角
形、または楕円形である素線である。このように中心軸
に対する断面形状が、多角形または楕円形である素線を
用いると、円形の素線のみを用いる場合よりも、ワイヤ
ーに砥粒がより保持され易く、かつ、より排出され易く
なって、ワイヤーソーの切断能力をより高めることがで
きる。上記４）の本発明のワイヤーソー用ワイヤーは、
このような２本以上の素線を撚って作製されたものであ
る。このように撚ることによって、ワイヤーに砥粒がよ
り保持され易くなって、ワイヤーソーの切断能力をより
高めることができる。上記４）のワイヤーにおいて、断
面形状が多角形または楕円形である素線が捩じられてい
て、捩られている素線が、他の素線と撚られていてもよ
い。The wire for a wire saw of the present invention of 3) above is composed of two or more wires, and at least one of the wires is
More than half of the strands, preferably strands, are strands having a polygonal cross section with respect to the central axis, for example, a triangle, a quadrangle, a pentagon, a hexagon, or an ellipse. In this way, the cross-sectional shape with respect to the central axis, when using a wire that is polygonal or elliptical, it is easier to hold the abrasive grains on the wire and more easily discharged, as compared to the case where only a circular wire is used. Therefore, the cutting ability of the wire saw can be further enhanced. The wire for a wire saw of the present invention in 4) above,
It is produced by twisting two or more such wires. By twisting in this manner, the abrasive grains are more easily held by the wire, and the cutting ability of the wire saw can be further enhanced. In the wire of 4) above, an element wire having a polygonal or elliptical cross section may be twisted, and the twisted element wire may be twisted with another element wire.
【００１１】さらに、上記３）および４）の本発明のワ
イヤーソー用ワイヤーにおいて、素線の本数が多いほど
ワイヤーに砥粒がより保持され易くなるので、素線の本
数をより多くするのが好ましい。ただし、素線の本数を
多くするほど、切代を小さくするために、素線の線径を
小さくし、切断の際に用いる砥粒の径も変更するのが好
ましい。図２に、上記４）の本発明のワイヤーソー用ワ
イヤーのいくつかの例を、断面形状を表す図と部分斜視
図で示す。Further, in the wire saw wire of the present invention of the above 3) and 4), the larger the number of strands, the easier the abrasive grains are retained in the wire, so that the number of strands should be increased. preferable. However, in order to reduce the cutting margin as the number of strands increases, it is preferable to reduce the diameter of the strands and change the diameter of the abrasive grains used for cutting. FIG. 2 shows some examples of the wire for wire saw of the present invention of 4) above with a view showing a sectional shape and a partial perspective view.
【００１２】上記素線の材料は、通常素線の材料として
使用されているものであればいずれでもよく、例えば、
鋼、タングステンなどの金属、または、高張力の高分子
材料が挙げられるが、耐磨耗性に優れておりかつ安価で
あるという点から、鋼であるのが好ましい。さらに、素
線として、炭素繊維を用いることもできる。炭素繊維は
比較的強度が高く、高分子材料とは違って、導電性であ
るために、電流を流すことによって、万が一、ワイヤー
が断線した場合や、ローラなどのワイヤーソーの本体部
分を切断してしまった場合に、検出することができ、ワ
イヤーソーの非常停止が可能であるからである。特に、
上記３）および４）のワイヤーにおいて、多数本の素線
を用いる場合で切代を小さくしたい場合には、素線とし
て、炭素繊維を用いるのが好ましい。ここで素線の材料
が鋼であると、切代を小さくするために素線の線径を小
さくした時に、素線の強度が低下し、断線の原因となる
が、４００〜５００本束ねた時に通常のピアノ線の太さ
（２００μｍ）と同じ太さになるような線径（１０μ
ｍ）の炭素繊維でも、比較的高い強度を有し、断線が起
こり難く、比較的容易に線径を小さくできるからであ
る。Any material may be used as the material of the above-mentioned wire as long as it is usually used as a material of the wire, for example,
Examples of the material include metals such as steel and tungsten, and high tension polymer materials, but steel is preferable from the viewpoints of excellent abrasion resistance and low cost. Furthermore, carbon fibers can also be used as the strands. Since carbon fiber has a relatively high strength and is electrically conductive, unlike polymer materials, if a wire breaks or the body of a wire saw such as a roller is cut by applying an electric current, This is because if it does happen, it can be detected and the wire saw can be stopped in an emergency. Especially,
In the wires 3) and 4), when a large number of strands are used and it is desired to reduce the cutting margin, it is preferable to use carbon fibers as the strands. Here, when the material of the wire is steel, when the wire diameter of the wire is reduced in order to reduce the cutting margin, the strength of the wire is reduced, which causes breakage, but 400 to 500 are bundled. Sometimes the diameter (10 μm) is the same as that of normal piano wire (200 μm).
This is because even the carbon fiber m) has a relatively high strength, is unlikely to cause wire breakage, and can relatively easily reduce the wire diameter.
【００１３】上記５）の本発明のワイヤーソー用ワイヤ
ーは、炭素繊維の素線からなる。このような炭素繊維の
素線からなるワイヤーにおいては、特に複数本の炭素繊
維の素線からなる場合、砥粒が保持され易く、かつ、排
出され易く、ワイヤーソーの切断能力を高めることがで
きる。この場合、炭素繊維の素線の断面形状は、円形で
あっても、多角形または楕円形であってもよい。２本以
上の炭素繊維の素線からなる場合、素線は撚られた状態
または編まれた状態であってもよい。The wire for wire saw of the present invention of the above 5) is made of carbon fiber. In such a wire made of carbon fiber strands, particularly when it is made of a plurality of carbon fiber strands, the abrasive grains are easily held and easily discharged, and the cutting ability of the wire saw can be enhanced. . In this case, the cross-sectional shape of the carbon fiber strand may be circular, polygonal or elliptical. When the wire is composed of two or more carbon fiber wires, the wires may be twisted or knitted.
【００１４】本発明のワイヤーソー用ワイヤーはいずれ
も、現在使用されている一般のワイヤーソーのいずれに
もそのまま使用することができる。現在使用されている
一般のワイヤーソーの一例を図３に示す。図３に示すワ
イヤーソーは、例えば単結晶引き上げ法によって製造さ
れたシリコンインゴットからウエーハを切り出すことが
できる装置であって、ワイヤー送り出し部Ａから延出す
る１本のワイヤー１が、３本のローラ２，３，４の周囲
に所定のピッチで螺旋状に巻き付けられた後、ワイヤー
受け取り部Ｂに向けて延出されている。また、下方のロ
ーラ２が駆動ローラであって、ワイヤー１を所要の線速
度で走行させることができる。また、上方の２本のロー
ラ３，４は同一高さで配設され、このローラ３，４間が
加工部５である。加工部５の上方には、ワークＷを保持
するためのワークホルダ６と、加工部５に向けて砥粒ス
ラリー（微細な砥粒を油性または水溶性のクーラント中
に懸濁させたもの）を供給するノズル７，７が配設され
ている。前記ワークホルダ６は、不図示の昇降手段によ
って上下動可能であって、ワークＷをワイヤー１に圧接
させることができる。加工部５の下方には、砥粒スラリ
ーを受けるためのスラリー受け８が配設されている。Any of the wires for the wire saw of the present invention can be used as it is for any ordinary wire saw currently used. An example of a general wire saw currently used is shown in FIG. The wire saw shown in FIG. 3 is a device that can cut a wafer from a silicon ingot manufactured by, for example, a single crystal pulling method, and one wire 1 extending from the wire sending part A has three rollers. After being spirally wound around 2, 3, and 4 at a predetermined pitch, it is extended toward the wire receiving portion B. Further, the lower roller 2 is a driving roller, and the wire 1 can be run at a required linear velocity. Further, the upper two rollers 3 and 4 are arranged at the same height, and the space between the rollers 3 and 4 is a processing section 5. A work holder 6 for holding the work W and an abrasive grain slurry (fine abrasive grains suspended in an oily or water-soluble coolant) are provided above the processing unit 5 toward the processing unit 5. Supplying nozzles 7, 7 are arranged. The work holder 6 can be moved up and down by an elevating means (not shown), and the work W can be pressed against the wire 1. A slurry receiver 8 for receiving an abrasive slurry is disposed below the processing unit 5.
【００１５】本発明のワイヤーソー用ワイヤーにより切
断できる被加工物としては、例えば、石英、半導体材料
や酸化物結晶、セラミックス、磁性材料などの高度な機
能性材料のインゴットやブロックが挙げられる。Examples of workpieces that can be cut with the wire for a wire saw of the present invention include ingots and blocks of highly functional materials such as quartz, semiconductor materials, oxide crystals, ceramics, and magnetic materials.
【００１６】[0016]
【実施例】断面形状が四角形で、その一片が２５０μｍ
の１本の鋼線を捩じって外径が約３００μｍのワイヤー
（本発明ワイヤー１）を作製した。また、断面形状が四
角形で、その一片が１２０μｍの３本の鋼線を撚って外
径が約３００μｍのワイヤー（本発明ワイヤー２）を作
製した。さらに、断面形状が六角形で外径が１０μｍの
１０８０本の炭素繊維を撚って、外径が約３００μｍの
ワイヤー（本発明ワイヤー３）を作製した。また、比較
のために、外径が３００μｍの１本のピアノ線（断面形
状が円形の鋼線）からなるワイヤー（従来のワイヤー）
も準備した。[Example] The cross-sectional shape is square, and one piece is 250 μm
One of the steel wires was twisted to produce a wire (invention wire 1) having an outer diameter of about 300 μm. In addition, three steel wires each having a quadrangular cross section and one piece of which was 120 μm were twisted to produce a wire (invention wire 2) having an outer diameter of about 300 μm. Further, 1080 carbon fibers having a hexagonal cross section and an outer diameter of 10 μm were twisted to produce a wire (invention wire 3) having an outer diameter of about 300 μm. For comparison, a wire (conventional wire) made of one piano wire (steel wire having a circular cross section) with an outer diameter of 300 μm
I also prepared.
【００１７】これらの４本のワイヤーを用いて、ワイヤ
ーソーで、大型の石英（２００ｍｍ×２００ｍｍ角、長
さ３００ｍｍ）を切断した。砥粒としては、ＧＣ＃６０
０（平均粒径２０μｍ）を用いた。切断中、砥粒がワイ
ヤーとワークとの接触部分に確実に供給されているかど
うかを観察すると共に、平均切断速度を求めた。これら
の結果を、切断能力と共に、表１に示す。切断能力は、
比較ワイヤーを用いた場合の平均切断速度を１００％と
して、本発明ワイヤー１〜３を用いた場合の平均切断速
度を比較した値である。A large quartz (200 mm × 200 mm square, length 300 mm) was cut with a wire saw using these four wires. As abrasive grains, GC # 60
0 (average particle size 20 μm) was used. During cutting, it was observed whether the abrasive grains were reliably supplied to the contact portion between the wire and the work, and the average cutting speed was obtained. The results are shown in Table 1 together with the cutting ability. The cutting ability is
It is the value which compared the average cutting speed at the time of using the wire 1-3 of this invention, making the average cutting speed at the time of using a comparative wire 100%.
【００１８】[0018]
【表１】 表１ 供給状態 平均切断速度 切断能力 本発明ワイヤー１ 確実 約４５０μｍ／分 １８０％ 本発明ワイヤー２ 非常に確実 約５５０μｍ／分 ２２０％ 本発明ワイヤー３ 非常に確実 約４００μｍ／分 １６０％ 従来のワイヤー 不確実 約２５０μｍ／分 １００％Table 1 Table 1 Supply state Average cutting speed Cutting capacity Inventive wire 1 Certainly about 450 μm / min 180% Inventive wire 2 Very certain About 550 μm / min 220% Inventive wire 3 Very certain About 400 μm / min 160% Conventional wire uncertainty approx. 250 μm / min 100%
【００１９】表１から明らかなように、本発明ワイヤー
１〜３を用いると、従来のワイヤーを用いるよりも、砥
粒がワイヤーとワークとの接触部分に確実に供給され、
ワイヤーソーの切断能力が増大している。As is clear from Table 1, when the wires 1 to 3 of the present invention are used, the abrasive grains are more reliably supplied to the contact portion between the wire and the work, as compared with the conventional wire.
The cutting ability of wire saws is increasing.
【００２０】[0020]
【発明の効果】本発明によれば、大型の被切断物を切断
する場合であっても、砥粒が、ワイヤーと被切断物との
接触部分に確実に供給され、その結果、ワイヤーソーの
切断能力を高めることができる。According to the present invention, the abrasive grains are reliably supplied to the contact portion between the wire and the object to be cut, even when cutting a large object to be cut. The cutting ability can be improved.
【図１】 （Ａ）〜（Ｅ）は、本発明のワイヤーソー用
ワイヤーの例を示す断面形状を表す図と部分斜視図であ
る。1A to 1E are a diagram showing a sectional shape and a partial perspective view showing an example of a wire for a wire saw of the present invention.
【図２】 （Ａ）および（Ｂ）は、本発明のワイヤーソ
ー用ワイヤーの他の例を示す断面形状を表す図と部分斜
視図である。2A and 2B are a diagram showing a cross-sectional shape and a partial perspective view showing another example of the wire for a wire saw of the present invention.
【図３】 ワイヤーソーの概略構成図である。FIG. 3 is a schematic configuration diagram of a wire saw.
１…ワイヤー、 ２…駆動ローラ、３…ロ
ーラ、 ４…ローラ、５…加工部、
６…ワークホルダ、７…ノズル、
８…スラリー受け、Ａ…ワイヤー送り出し部、
Ｂ…ワイヤー受け取り部、Ｗ…ワーク。1 ... Wire, 2 ... Drive roller, 3 ... Roller, 4 ... Roller, 5 ... Processing part,
6 ... Work holder, 7 ... Nozzle,
8: Slurry receiver, A: Wire sending part,
B ... Wire receiving part, W ... work.
Claims (7)
楕円形である素線からなることを特徴とする、ワイヤー
ソー用ワイヤー。1. A wire for a wire saw, which comprises a wire having a polygonal or elliptical cross-section with respect to a central axis.
楕円形である１本の素線からなり、この素線は捩じられ
た状態にあることを特徴とする、ワイヤーソー用ワイヤ
ー。2. A wire for a wire saw, which comprises one element wire having a polygonal or elliptical cross-section with respect to the central axis, and the element wire is in a twisted state.
の少なくとも１本は中心軸に対する断面形状が多角形ま
たは楕円形である素線であることを特徴とする、ワイヤ
ーソー用ワイヤー。3. A wire for a wire saw, comprising two or more strands, at least one of which is a strand having a polygonal or elliptical cross-section with respect to the central axis. .
は撚られた状態にあって、素線の少なくとも１本は中心
軸に対する断面形状が多角形または楕円形である素線で
あることを特徴とする、ワイヤーソー用ワイヤー。4. A strand comprising two or more strands, wherein these strands are twisted, and at least one of the strands is a polygonal or elliptical cross-section with respect to the central axis. A wire for a wire saw, which is characterized by being present.
態にある、請求項４記載のワイヤ。5. The wire of claim 4, wherein at least one of the strands is in a twisted state.
のいずれか１項に記載のワイヤー。6. The wire according to claim 1, wherein the wire is made of carbon fiber.
The wire according to any one of 1.
ワイヤー。7. A wire for a wire saw, which is made of carbon fiber strands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9485496A JPH09254006A (en) | 1996-03-25 | 1996-03-25 | Wire for wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9485496A JPH09254006A (en) | 1996-03-25 | 1996-03-25 | Wire for wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09254006A true JPH09254006A (en) | 1997-09-30 |
Family
ID=14121629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9485496A Pending JPH09254006A (en) | 1996-03-25 | 1996-03-25 | Wire for wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09254006A (en) |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
| US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
| JP2007021677A (en) * | 2005-07-19 | 2007-02-01 | Asahi Diamond Industrial Co Ltd | Electrodeposition wire tool |
| JP2007281176A (en) * | 2006-04-06 | 2007-10-25 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Slicing method of semiconductor ingot |
| CN102174749A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Free edge material cutting line with aramid core wire and preparation method thereof |
| CN102172999A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Aramid fiber core wire saw and preparation method thereof |
| CN102380915A (en) * | 2011-11-21 | 2012-03-21 | 镇江耐丝新型材料有限公司 | Metal wire for cutting and capable for twisting shapes, and manufacturing device and manufacturing method thereof |
| CN102962901A (en) * | 2012-11-13 | 2013-03-13 | 镇江耐丝新型材料有限公司 | Intermittent deformation cutting metal wire |
| WO2013076400A1 (en) * | 2011-11-24 | 2013-05-30 | Sodetal | Metal wire for saw |
| WO2013179509A1 (en) | 2012-05-29 | 2013-12-05 | 株式会社東京ワイヤー製作所 | Wire saw |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
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-
1996
- 1996-03-25 JP JP9485496A patent/JPH09254006A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
| US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
| WO1999046077A3 (en) * | 1998-03-11 | 2003-07-24 | Norton Co | Superabrasive wire saw and method for making the saw |
| EP1371438A1 (en) * | 1998-03-11 | 2003-12-17 | Saint-Gobain Abrasives, Inc. | Superabrasive wire saw and method for making it |
| JP2007021677A (en) * | 2005-07-19 | 2007-02-01 | Asahi Diamond Industrial Co Ltd | Electrodeposition wire tool |
| JP2007281176A (en) * | 2006-04-06 | 2007-10-25 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Slicing method of semiconductor ingot |
| US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
| US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
| US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9248583B2 (en) | 2010-12-30 | 2016-02-02 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| CN102172999A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Aramid fiber core wire saw and preparation method thereof |
| CN102174749A (en) * | 2011-03-04 | 2011-09-07 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Free edge material cutting line with aramid core wire and preparation method thereof |
| US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
| CN102380915A (en) * | 2011-11-21 | 2012-03-21 | 镇江耐丝新型材料有限公司 | Metal wire for cutting and capable for twisting shapes, and manufacturing device and manufacturing method thereof |
| WO2013076400A1 (en) * | 2011-11-24 | 2013-05-30 | Sodetal | Metal wire for saw |
| FR2983099A1 (en) * | 2011-11-24 | 2013-05-31 | Sodetal | METAL WIRE FOR SAW |
| WO2013179509A1 (en) | 2012-05-29 | 2013-12-05 | 株式会社東京ワイヤー製作所 | Wire saw |
| US9586254B2 (en) | 2012-05-29 | 2017-03-07 | Tokyo Wire Works, Ltd. | Wire saw |
| US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
| US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| CN102962901A (en) * | 2012-11-13 | 2013-03-13 | 镇江耐丝新型材料有限公司 | Intermittent deformation cutting metal wire |
| US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
| US11878359B2 (en) * | 2017-02-14 | 2024-01-23 | Siltronic Ag | Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot |
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