JP2000158319A - Diamond wire saw and cutting method - Google Patents
Diamond wire saw and cutting methodInfo
- Publication number
- JP2000158319A JP2000158319A JP33740298A JP33740298A JP2000158319A JP 2000158319 A JP2000158319 A JP 2000158319A JP 33740298 A JP33740298 A JP 33740298A JP 33740298 A JP33740298 A JP 33740298A JP 2000158319 A JP2000158319 A JP 2000158319A
- Authority
- JP
- Japan
- Prior art keywords
- diamond wire
- wire
- diamond
- work
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ダイヤモンドワイ
ヤーを用いた切断装置に関し、さらに詳細には、細線ワ
イヤーにダイヤモンドの砥粒が固定されたダイヤモンド
ワイヤーを、硬質脆性材料であるワークに接触させて走
行させ、冷却等のための加工液を供給し、前記ワークに
切断等の加工を施すダイヤモンドワイヤーを用いた切断
装置（以下、「ダイヤモンドワイヤーソー」という）に
関する。なお、ワークの代表例としては、シリコンの単
結晶インゴットがある。本発明にかかるダイヤモンドワ
イヤーソーは、そのシリコンの単結晶インゴットをスラ
イスして、シリコンウェーハを得るために好適に利用で
きる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device using a diamond wire, and more particularly, to a diamond wire having diamond abrasive grains fixed to a fine wire, which is brought into contact with a work which is a hard brittle material. The present invention relates to a cutting device (hereinafter, referred to as a “diamond wire saw”) using a diamond wire for running, supplying a working liquid for cooling or the like, and performing processing such as cutting on the work. A typical example of the work is a single crystal ingot of silicon. The diamond wire saw according to the present invention can be suitably used for slicing a silicon single crystal ingot to obtain a silicon wafer.
【０００２】[0002]
【従来の技術】従来から、半導体材料、ガラス材料、セ
ラミック等の硬質で脆い材料に、細線ワイヤー（以下、
単に「ワイヤー」ともいう）を用いて多数列の切断や溝
入れ等の加工を施す機械装置としては、マルチワイヤー
式切断装置（以下、「マルチワイヤーソー」という）が
ある。マルチワイヤーソーの従来例としては、本願出願
人が提案し、特開昭６０−１７２４５９号公報で開示さ
れたものがある。そのマルチワイヤーソーの構成を図２
に基づいて以下に説明する。図２に示すように、切断加
工手段Ａは、多角形（本従来例では矩形）の各頂点位置
に配設された複数（４個）の多溝滑車１５１、１５２、
１５３、１５４に、ワイヤーＷを一連に多数巻回し、そ
のワイヤーＷの多数本並列して延びる下側水平部分を硬
質脆性材料からなる被加工物（以下、単に「ワーク」と
いう）１０７に押圧接触させ、その接触部位に砥粒懸濁
液を供給しながらワイヤーＷをその長手方向へ走行させ
ることによってワーク１０７に切断加工を施す。なお、
ワイヤーＷの下側水平部分に、加工台１０６に載置され
たワーク１０７を接触させて押圧するために、加工台１
０６を吊り上げるべく重錘１１４が用いられている。2. Description of the Related Art Conventionally, hard and brittle materials such as semiconductor materials, glass materials, and ceramics have been used for thin wire (hereinafter, referred to as "wires").
A multi-wire type cutting device (hereinafter, referred to as a “multi-wire saw”) is a mechanical device that performs processing such as cutting or grooving in a large number of rows by using a “wire”. As a conventional example of a multi-wire saw, there is one proposed by the present applicant and disclosed in Japanese Patent Application Laid-Open No. Sho 60-172559. Fig. 2 shows the configuration of the multi-wire saw.
This will be described below based on As shown in FIG. 2, the cutting means A includes a plurality (four) of multi-groove pulleys 151, 152 disposed at each vertex position of a polygon (a rectangle in this conventional example).
A large number of wires W are wound in series at 153 and 154, and a lower horizontal portion of the wires W extending in parallel is pressed into contact with a workpiece (hereinafter simply referred to as a "work") 107 made of a hard and brittle material. The workpiece 107 is cut by moving the wire W in the longitudinal direction while supplying the abrasive suspension to the contact portion. In addition,
In order to bring the workpiece 107 placed on the processing table 106 into contact with and press against the lower horizontal portion of the wire W, the processing table 1
The weight 114 is used to lift the 06.
【０００３】ワイヤーの給排装置Ｂは、前記接触部位に
ついて、逐次新線ワイヤーＷの供給と使用済みワイヤー
Ｗの送出とを行うためのワイヤー繰り出し手段とワイヤ
ー巻き取り手段とからなる。ワイヤー繰り出し手段は新
線ボビン１０３とその新線ボビン１０３を駆動させるモ
ータＭ１とから構成され、ワイヤー巻き取り手段は巻き
取りボビン１０４とその巻き取りボビン１０４を駆動さ
せるモータＭ２とから構成されている。また、ワイヤー
走行制御手段Ｃは、間隔をおいて上下に配設された第１
の固定滑車群１１９および第２の固定滑車群１２０と、
これら両固定滑車群１１９、１２０間において往復動自
在に配設されたスライダー１２１と、そのスライダー１
２１に装着された第１の動滑車群１２２および第２の動
滑車群１２３と、スライダー１２１および両動滑車群１
２２、１２３の重量と均衡するバランスウエイト１２４
と、スライダー１２１の往復動端に配設され、スライダ
ー１２１と係合によりワイヤー走行駆動モータＭ３の正
逆回転駆動切り換えを行うための一対のリミットスイッ
チ１２５ａ、１２５ｂとからなり、前記接触部位におけ
るワイヤーＷを周期的に往復走行させる。[0003] The wire supply / discharge device B comprises a wire feeding means and a wire winding means for sequentially supplying a new wire W and sending out a used wire W at the contact portion. The wire unwinding means includes a new bobbin 103 and a motor M1 for driving the new bobbin 103, and the wire winding means includes a winding bobbin 104 and a motor M2 for driving the winding bobbin 104. . Further, the wire running control means C is provided with first
A group of fixed pulleys 119 and a second group of fixed pulleys 120;
A slider 121 disposed reciprocally between these two fixed pulley groups 119 and 120;
A first moving pulley group 122 and a second moving pulley group 123 mounted on the slider 21, a slider 121 and a double moving pulley group 1
Balance weight 124 that balances the weight of 22, 123
And a pair of limit switches 125a and 125b disposed at the reciprocating end of the slider 121 to switch the forward / reverse rotation drive of the wire traveling drive motor M3 by engaging with the slider 121. W is reciprocated periodically.
【０００４】以上の構成を備えるマルチワイヤーソーに
よれば、ワイヤー走行制御手段Ｃによって、複数個の多
溝滑車１５１、１５２、１５３、１５４に巻回張架され
るワイヤーＷを、ワーク１０７に対して押圧される接触
部位において、ワイヤー張力を一定に保持して例えば毎
分８０〜３００ｍ程度の速度で走行させてワークを切断
することができる。また、ワイヤーの給排装置Ｂによっ
て、ワイヤー断線を生じることなく所期の加工能率を得
るために、新線ワイヤーを、例えば毎分０〜４ｍ程度逐
次切断加工部へ供給する一方で使用済みワイヤーを同量
切断加工部位から送り出すことができる。According to the multi-wire saw having the above configuration, the wire W wound around the plurality of multi-groove pulleys 151, 152, 153, 154 by the wire running control means C is applied to the work 107. The workpiece can be cut by running at a speed of, for example, about 80 to 300 m per minute while keeping the wire tension constant at the contact portion pressed by the pressure. In addition, in order to obtain a desired processing efficiency without causing wire breakage by the wire supply / discharge device B, a new wire is supplied to the cutting section at a rate of, for example, about 0 to 4 m per minute while a used wire is used. Can be sent out from the same cutting portion.
【０００５】このように、マルチワイヤーソーは、一般
に複数個の多溝滑車にワイヤーを一連に多数回張架巻回
して延びる下側水平部分をワークに押圧接触させ、その
接触部位に砥粒懸濁液（以下、「スラリー」という）を
供給しながら、前記ワイヤーを走行させることにより、
被加工物に多数列の切断や溝入れ等の加工を施すもので
あり、ワイヤーを使用するため、切断しろが少なく、歩
留りが向上し、また他方式の機械的切断加工に比べて変
質層の発生がはるかに少ないという利点をもっている。As described above, the multi-wire saw generally has a lower horizontal portion extending by winding and winding a plurality of multi-groove pulleys in series on a wire a number of times so that the lower horizontal portion is brought into contact with the work, and the contact portion is provided with an abrasive grain suspension. By running the wire while supplying a suspension (hereinafter, referred to as “slurry”),
This process involves cutting and grooving a large number of rows on the workpiece.Because of the use of wires, the cutting margin is small, the yield is improved, and the quality of the deteriorated layer is reduced compared to other types of mechanical cutting. It has the advantage of much lower incidence.
【０００６】ところが、従来のマルチワイヤーソーは、
遊離砥粒を介在させて研削研磨によって切断するもので
あり、その切断速度を従来以上に高速にすることが難し
かった。特に、大径化したシリコンの単結晶インゴット
等、大きなワークを切断する場合には、ワイヤーのワー
クに接触する部分が長くなって走行抵抗が大きくなり、
ワイヤーがワークに接触する単位長さ当たりの圧力（接
触圧）が低下する。このため、ワークの切断速度を高め
ることは、さらに難しくなる。また、上記のように走行
抵抗が大きくなるため、ワイヤーの張力に悪影響を及ぼ
し、ワイヤーがたわみ易くなり、切断精度を低下させて
しまう。すなわち、大径化したシリコンウェーハ等の製
品の切断面である表面の平坦度が低下し、粗い面になっ
てしまう。さらに、砥粒が混合されたスラリーを用いる
ため、飛散したスラリーによって周囲が汚れ易かった。
また、ワイヤーは遊離砥粒によって磨耗し、消耗し易か
った。However, the conventional multi-wire saw is
Cutting is performed by grinding and polishing with loose abrasive particles interposed, and it has been difficult to make the cutting speed higher than before. In particular, when cutting a large workpiece such as a silicon single crystal ingot with a large diameter, the portion of the wire that contacts the workpiece becomes longer, and the running resistance increases.
The pressure (contact pressure) per unit length at which the wire contacts the workpiece decreases. Therefore, it becomes more difficult to increase the cutting speed of the work. Further, since the running resistance increases as described above, the wire tension is adversely affected, the wire is easily bent, and the cutting accuracy is reduced. That is, the flatness of the surface, which is the cut surface of a product such as a silicon wafer having a large diameter, is reduced, resulting in a rough surface. Furthermore, since a slurry in which abrasive grains are mixed is used, the surroundings are easily stained by the scattered slurry.
Further, the wire was worn by loose abrasive grains and was easily consumed.
【０００７】これに対し、切断速度を高速化できると共
に、精度良く切断でき、且つ作業環境をきれいに維持で
きるワイヤー式の切断装置として、細線ワイヤーにダイ
ヤモンドの砥粒が固定されて成るダイヤモンドワイヤー
を用い、クーラント（加工液）を切口に注いで、ワーク
を切断するダイヤモンドワイヤーソー（マルチソー）が
提案されている。このダイヤモンドワイヤーソーによれ
ば、ダイヤモンドワイヤーによる切れ味が良好なため、
格段に高速にワークを切断できる。そして、ワイヤーが
ワークに接触する単位長さ当たりの接触圧が低くても、
好適に切断できるため、ワークが大型化しても切断精度
を維持できる。また、スラリーを要せず、加工液として
は水か水に近い成分のものを用いることができるため、
周囲をきれいに保つことができる。また、ワイヤーに固
定されたダイヤモンド砥粒の研削作用でワークを切断す
るため、ダイヤモンドが欠けたり、脱落するまでの間、
繰り返し、長期に渡って好適に用いることができる。On the other hand, as a wire-type cutting device capable of increasing the cutting speed, cutting with high precision, and maintaining a clean working environment, a diamond wire in which diamond abrasive grains are fixed to a fine wire is used. A diamond wire saw (multi-saw) for cutting a workpiece by pouring a coolant (working fluid) into a cut has been proposed. According to this diamond wire saw, the sharpness of the diamond wire is good,
Work can be cut at extremely high speed. And even if the contact pressure per unit length at which the wire contacts the workpiece is low,
Since cutting can be suitably performed, cutting accuracy can be maintained even if the work becomes large. In addition, since a slurry is not required and the working fluid can be water or a component close to water,
The surroundings can be kept clean. In addition, since the work is cut by the grinding action of diamond abrasive grains fixed to the wire, until the diamond is chipped or dropped,
It can be used repeatedly over a long period of time.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、ダイヤ
モンドワイヤーソーでは、ダイヤモンドワイヤー自体に
目詰まりが生じ易く、その切れ味が悪くなって切断速度
（加工能率）が低下するという課題がある。However, the diamond wire saw has a problem that the diamond wire itself is liable to be clogged, its sharpness is deteriorated, and the cutting speed (processing efficiency) is reduced.
【０００９】そこで、本発明の目的は、ダイヤモンドワ
イヤーの目詰まりを除去し、ワークの切断等の加工効率
を向上できるダイヤモンドワイヤーソーを提供すること
にある。Accordingly, an object of the present invention is to provide a diamond wire saw capable of removing clogging of a diamond wire and improving processing efficiency such as cutting of a work.
【００１０】[0010]
【課題を解決するための手段】本発明は、上記目的を達
成するために次の構成を備える。すなわち、本発明は、
細線ワイヤーにダイヤモンドの砥粒が固定されたダイヤ
モンドワイヤーを、硬質脆性材料であるワークに押圧接
触させて走行させ、冷却等のために加工液を供給し、前
記ワークに切断等の加工を施すダイヤモンドワイヤーソ
ーにおいて、前記ダイヤモンドワイヤーに押圧接触して
ドレッシングを行うドレッシングツールと、該ドレッシ
ングツールを、前記ダイヤモンドワイヤーの張架される
と共にワークに加工を施していない部分に、押圧接触さ
せる押圧機構とを具備する。The present invention has the following arrangement to achieve the above object. That is, the present invention
A diamond wire, in which diamond abrasive grains are fixed to a fine wire, is brought into contact with a work, which is a hard and brittle material, by pressing and running, a working fluid is supplied for cooling or the like, and the work is subjected to processing such as cutting. In a wire saw, a dressing tool that performs dressing by pressing and contacting the diamond wire, and a pressing mechanism that presses and presses the dressing tool to a portion where the diamond wire is stretched and the workpiece is not processed. Have.
【００１１】また、複数個の多溝滑車に、前記ダイヤモ
ンドワイヤーを一連に多数回張架巻回して延びる下側水
平部分を前記ワークに押圧接触させ、同時に複数の切断
等の加工を施すマルチソーであり、前記ドレッシングツ
ールは、複数列に並列されたダイヤモンドワイヤーに同
時に押圧接触することで、生産効率を向上できる。[0011] Further, a multi-saw for performing a plurality of processes such as cutting at the same time by pressing a lower horizontal portion, which is formed by stretching and winding the diamond wire a number of times around a plurality of multi-groove pulleys, into contact with the work. In addition, the dressing tool can improve production efficiency by simultaneously pressing and contacting a plurality of rows of diamond wires arranged in parallel.
【００１２】また、本発明は、細線ワイヤーにダイヤモ
ンドの砥粒が固定されたダイヤモンドワイヤーを、硬質
脆性材料であるワークに押圧接触させて走行させ、冷却
等のために加工液を供給し、前記ワークに切断等の加工
を施すダイヤモンドワイヤーソーを用いた切断加工方法
において、前記ダイヤモンドワイヤーのドレッシングツ
ールを、前記ダイヤモンドワイヤーによるワークの切断
等の加工中に、前記ダイヤモンドワイヤーの張架される
と共にワークに加工を施していない部分に押圧接触させ
てドレッシングを行うことを特徴とする切断加工方法に
もある。Further, the present invention provides a method in which a diamond wire, in which diamond abrasive grains are fixed to a fine wire, is brought into contact with a work, which is a hard brittle material, while being pressed against the work, and a working fluid is supplied for cooling or the like. In a cutting method using a diamond wire saw for performing processing such as cutting on a work, the dressing tool for the diamond wire is used while the diamond wire is stretched during processing such as cutting of the work by the diamond wire. There is also a cutting method characterized in that dressing is performed by pressing and contacting a part which has not been processed.
【００１３】[0013]
【発明の実施の形態】以下、本発明の好適な実施の形態
を添付図面と共に詳細に説明する。図１は本発明にかか
るダイヤモンドワイヤーソーの一実施例について、模式
的に説明する斜視図である。１０はダイヤモンドワイヤ
ーであり、細線ワイヤーにダイヤモンドの砥粒が固定さ
れて設けられている。細線ワイヤーは、ピアノ線と呼ば
れる鋼線等の引張強度の高い線材である。ダイヤモンド
の砥粒は、ピアノ線の外周表面に、好適に固定されるよ
うに、例えば、ニッケルめっき等のめっき（電着）によ
って、包まれるようにして付着されている。又は、樹脂
接着剤（レジンボンド）によって、ダイヤモンドの砥粒
が固定されているものもある。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view schematically illustrating one embodiment of a diamond wire saw according to the present invention. Reference numeral 10 denotes a diamond wire, in which diamond abrasive grains are fixed to a fine wire. The fine wire is a wire having a high tensile strength, such as a steel wire called a piano wire. The diamond abrasive grains are attached to the outer peripheral surface of the piano wire so as to be fixed appropriately, for example, by plating (electrodeposition) such as nickel plating. Alternatively, there is a type in which diamond abrasive grains are fixed by a resin adhesive (resin bond).
【００１４】１２は硬質脆性材料のワークであり、この
ワーク１２に、ダイヤモンドワイヤー１０を押圧接触さ
せて走行させ、冷却及び切屑の排出等のために加工液を
供給し、切断等の加工が施される。加工液は、水又は水
を主成分とするものを利用でき、飛散しても周囲を汚染
することがない。また、加工液は、フィルタによって、
切屑及びダイヤモンドワイヤー１０から発生した粒子を
濾過することで、循環させて好適に利用できる。Reference numeral 12 denotes a work made of a hard and brittle material, and the diamond wire 10 is made to travel while being brought into contact with the work 12, and a working fluid is supplied for cooling and discharge of chips, and processing such as cutting is performed. Is done. As the processing liquid, water or a liquid containing water as a main component can be used, and even if it scatters, it does not contaminate the surroundings. Also, the working fluid is filtered by the filter
The chips and the particles generated from the diamond wire 10 are circulated and suitably used by filtering.
【００１５】なお、ワーク１２のダイヤモンドワイヤー
１０が接触する切口に高圧の前記加工液を吹きつけるべ
く、その切口に向けて設けられ、加工液を噴出する噴射
ノズルと、その噴射ノズルに管路を介して高圧の加工液
を供給する高圧加工液の供給装置とを備える加工液の供
給手段を設けてもよい。この加工液の供給手段によれ
ば、加工液をワークの切断中に形成される溝（切溝）内
へ、強制的に進入させ、切屑の排出を促進させることが
できる。これにより、切溝及びダイヤモンドワイヤー自
体の目詰まりが防止でき、切断や溝入れ等の加工効率を
向上できる。In order to spray the high-pressure working fluid onto the cut of the workpiece 12 where the diamond wire 10 comes into contact, a jet nozzle is provided toward the cut and ejects the working fluid, and a pipe is connected to the jet nozzle. And a high-pressure working fluid supply device for supplying a high-pressure working fluid via the processing fluid supply means. According to the processing liquid supply means, the processing liquid can be forcibly entered into a groove (cutting groove) formed during cutting of the workpiece, thereby facilitating the discharge of chips. Thereby, clogging of the kerf and the diamond wire itself can be prevented, and processing efficiency such as cutting and grooving can be improved.
【００１６】２６はドレッシングツールであり、ダイヤ
モンドワイヤー１０に押圧接触してドレッシングを行
う。このドレッシングツール２６としては、例えば、Ｇ
Ｃ砥石等を用いることができる。このドレッシングツー
ル２６によって、ダイヤモンドワイヤー１０自体に生じ
た切屑の粒子を主成分とする目詰まりを、好適に除去し
て解消することができる。従って、ダイヤモンドワイヤ
ー１０の切れ味が低下することを防止でき、切断等の加
工効率を向上できる。また、ダイヤモンドワイヤー１０
の寿命を長くすることができ、これによっても生産性を
向上できる。Reference numeral 26 denotes a dressing tool which performs dressing by pressing and contacting the diamond wire 10. As the dressing tool 26, for example, G
C grindstone or the like can be used. The dressing tool 26 can suitably remove and eliminate clogging which is mainly caused by chip particles generated in the diamond wire 10 itself. Therefore, the sharpness of the diamond wire 10 can be prevented from being reduced, and the processing efficiency such as cutting can be improved. In addition, diamond wire 10
Can be extended, thereby also improving productivity.
【００１７】２８は押圧機構であり、ドレッシングツー
ル２６を、ダイヤモンドワイヤー１０の張架されると共
にワーク１２に加工を施していない部分である非加工張
架部１０ａに、押圧接触させる。本実施例では、図１に
示すように、側部の上下に複数本が並列された張架部
（非加工張架部１０ａ）に押圧接触させている。従っ
て、切断等の加工中、イン・プロセスで、ダイヤモンド
ワイヤー１０の複数箇所のドレッシングを同時に行うこ
とができる。この押圧機構２８によって、ドレッシング
ツール２６をダイヤモンドワイヤー１０へ押圧する圧力
は、細線ワイヤーの引張強度等の条件に合わせて適宜選
択的に設定すればよい。また、この押圧機構２８として
は、詳細を図示しないが、種々の運動機構を利用するこ
とができる。例えば、シリンダ装置、モータ等の動力装
置、及び直動ガイド往復移動機構、クランク機構、カム
機構等の運動機構を適宜選択に用いればよいのは勿論で
ある。Reference numeral 28 denotes a pressing mechanism which presses the dressing tool 26 into contact with the non-worked stretched portion 10a where the diamond wire 10 is stretched and the work 12 is not worked. In the present embodiment, as shown in FIG. 1, a plurality of stretching portions (unprocessed stretching portions 10 a) arranged in parallel on the upper and lower sides are brought into pressure contact with each other. Therefore, during processing such as cutting, dressing of a plurality of portions of the diamond wire 10 can be performed simultaneously in an in-process. The pressure by which the dressing tool 26 is pressed against the diamond wire 10 by the pressing mechanism 28 may be appropriately set as appropriate in accordance with conditions such as the tensile strength of the fine wire. Although not shown in detail, various motion mechanisms can be used as the pressing mechanism 28. For example, a power device such as a cylinder device and a motor, and a motion mechanism such as a linear motion guide reciprocating mechanism, a crank mechanism, and a cam mechanism may be used as appropriate.
【００１８】なお、ワイヤ工具（ダイヤモンドワイヤー
１０）のドレッシングが施される部分は、本実施例に限
定されるものではなく、一本が張架された部分について
行うようにしてもよい。すなわち、ダイヤモンドワイヤ
ー１０の走行経路の一部であって非加工部に、ドレッシ
ングツールによってドレッシングがなされるようにすれ
ばよい。以上のようにドレッシングがなされることで、
ワーク１２の加工中（イン・プロセス）において、ダイ
ヤモンドワイヤー１０のドレッシングを好適に行うこと
ができ、切断や溝入れ等の加工効率を向上できる。ま
た、イン・プロセスでドレッシングを行うことができる
ため、ダイヤモンドワイヤー１０の機能を好適に維持す
ることができ、加工速度、加工精度を安定的に向上でき
る。The part where the dressing of the wire tool (diamond wire 10) is performed is not limited to the present embodiment, but may be performed on a part where one wire is stretched. That is, the dressing tool may be used to dress a part of the travel path of the diamond wire 10 and the non-processed portion. By dressing as described above,
During the processing of the workpiece 12 (in-process), the dressing of the diamond wire 10 can be suitably performed, and the processing efficiency such as cutting and grooving can be improved. Further, since the dressing can be performed in-process, the function of the diamond wire 10 can be suitably maintained, and the processing speed and the processing accuracy can be stably improved.
【００１９】また、本実施例のダイヤモンドワイヤソー
２０は、図１に明らかなように、同時に複数の切断等の
加工を施すマルチソーになっている。図１に示すよう
に、複数個の多溝滑車２１、２２、２３、２４にダイヤ
モンドワイヤー１０を一連に多数回張架巻回して延びる
下側水平部分を、ワーク１２に押圧接触させるように設
けられている。すなわち、一本のダイヤモンドワイヤー
１０で、多数本が並列された状態に巻き回してあり、こ
れにより、複数の切断が同時にでき、生産効率を向上で
きるようになっている。そして、ドレッシングツール２
６は、矩形に形成されており、複数列に並列されたダイ
ヤモンドワイヤー１０に渡って同時に押圧接触されるた
め、効率よくドレッシングを行うことができる。The diamond wire saw 20 according to the present embodiment is a multi-saw that simultaneously performs a plurality of processes such as cutting, as is apparent from FIG. As shown in FIG. 1, a plurality of multi-groove pulleys 21, 22, 23, and 24 are provided with a lower horizontal portion that is stretched and wound around the diamond wire 10 many times in a series so as to press and contact the work 12. Have been. That is, a single diamond wire 10 is wound in a state in which a large number of wires are wound in parallel, whereby a plurality of cuts can be made at the same time, and the production efficiency can be improved. And dressing tool 2
Numeral 6 is formed in a rectangular shape and is pressed simultaneously over the diamond wires 10 arranged in a plurality of rows, so that dressing can be performed efficiently.
【００２０】本実施例の４つの多溝滑車２１、２２、２
３、２４は、それぞれ、サーボモータ２１ａ、２２ａ、
２３ａ、２４ａによって回転駆動及び制御されるように
連結されている。このように構成されているため、多溝
滑車２１、２２、２３、２４を好適に同期回転させ、ダ
イヤモンドワイヤー１０をバランスよく走行でき、その
張力を均一に維持することができる。なお、多溝滑車及
びサーボモータの数等は、本実施例に限定されるもので
はなく、例えば３個の多溝滑車によっても、上記の下側
水平部分を得ることができる。また、サーボモータによ
って駆動する１個の多溝滑車に対して、他の２個の多溝
滑車についてはサーボモータで直接的に駆動させないで
従動させてもよい。In the present embodiment, the four multi-groove pulleys 21, 22, 2
3, 24 are servo motors 21a, 22a, respectively.
They are connected so as to be rotationally driven and controlled by 23a and 24a. With such a configuration, the multi-groove pulleys 21, 22, 23, and 24 are preferably rotated synchronously, the diamond wire 10 can travel in a well-balanced manner, and the tension thereof can be maintained uniformly. The number of the multi-groove pulleys and the number of servomotors are not limited to those in the present embodiment, and the lower horizontal portion can be obtained by using, for example, three multi-groove pulleys. Also, one multi-groove pulley driven by the servomotor may be driven without directly driving the other two multi-groove pulleys by the servomotor.
【００２１】次に、ダイヤモンドワイヤー１０の繰り出
しと巻き取りを行う機構の一例について、図１に基づい
て以下に説明する。３１は第１ボビンであり、３２は第
２ボビンであり、平行に配設されている。第１ボビン３
１は、第１ボビン用のサーボモータ３１ａによって回転
駆動・制御される。また、第２ボビン３２は、第２ボビ
ン用のサーボモータ３２ａによって回転駆動・制御され
る。また、３４は円筒カムであり、回転駆動（Ｒ）する
ことで、移動プーリユニット３５を二つのボビン３１、
３２の軸芯と平行な方向へ移動（Ｓ）させる。Next, an example of a mechanism for feeding and winding the diamond wire 10 will be described below with reference to FIG. 31 is a first bobbin and 32 is a second bobbin, which are arranged in parallel. First bobbin 3
1 is rotationally driven and controlled by a servo motor 31a for the first bobbin. Further, the second bobbin 32 is rotationally driven and controlled by a servo motor 32a for the second bobbin. Reference numeral 34 denotes a cylindrical cam which is driven to rotate (R) to move the movable pulley unit 35 to the two bobbins 31,
It is moved (S) in a direction parallel to the axis of 32.
【００２２】ダイヤモンドワイヤー１０は、第１ボビン
３１から繰り出され、移動プーリユニット３５の移動プ
ーリ３６ａ、３６ｂで向きを変えられ、さらに、複数の
多溝滑車上に固定されたプーリ３６ｃ、３６ｄで向きを
変えられて、多溝滑車２１へ掛け回される。そして、４
つの多溝滑車２１、２２、２３、２４に複数回掛け回さ
れた後、複数の多溝滑車上に固定されたプーリ３８ａ、
３８ｂで向きを変えられて、さらに、移動プーリユニッ
ト３５の移動プーリ３８ｃ、３８ｄで向きを変えられ、
第２ボビン３２へ巻き取られる。このようにダイヤモン
ドワイヤー１０を走行するには、二つのボビン３１、３
２をサーボモータ３１ａ、３２ａで時計と反対方向に回
転させればよい。そして、ダイヤモンドワイヤー１０を
反対方向に走行させるには、二つのボビン３１、３２を
時計方向に回転させればよい。この場合は、第２ボビン
３２から繰り出され、第１ボビン３１に巻き取られるこ
とになる。The diamond wire 10 is unreeled from the first bobbin 31, turned by the moving pulleys 36a and 36b of the moving pulley unit 35, and further turned by pulleys 36c and 36d fixed on a plurality of multi-groove pulleys. Is changed, and is wrapped around the multi-groove pulley 21. And 4
A plurality of pulleys 38a fixed on the plurality of multi-groove pulleys after being looped around the multi-groove pulleys 21, 22, 23, 24,
38b, the direction can be changed by the moving pulleys 38c, 38d of the moving pulley unit 35,
It is wound up on the second bobbin 32. To travel the diamond wire 10 in this manner, two bobbins 31, 3
2 may be rotated in the direction opposite to the clock by the servo motors 31a and 32a. Then, in order to make the diamond wire 10 run in the opposite direction, the two bobbins 31 and 32 may be rotated clockwise. In this case, it is fed out from the second bobbin 32 and wound up on the first bobbin 31.
【００２３】また、このようにダイヤモンドワイヤー１
０を走行させる際に、ダイヤモンドワイヤー１０のボビ
ンへの巻き取り位置と対応させて、移動プーリユニット
３５を円筒カム３４によって往復運動させる。これによ
り、ダイヤモンドワイヤー１０が重なって乱雑に巻き取
られることを防止できる。以上のように、ダイヤモンド
ワイヤー１０の走行方向を反転でき、好適に繰り出し巻
き取ることの可能な構成とすることで、ダイヤモンドワ
イヤー１０を効率よく且つ好適に利用でき、生産性を向
上できる。なお、ダイヤモンドワイヤー１０を走行させ
る速度、及びその走行方向の反転にかかるタイムスケジ
ュール等は、具体的な切断仕様に基づいて適宜設定すれ
ばよい。また、３９はワーク１２を支持してダイヤモン
ドワイヤー１０へ適度な押圧力で接触させる押圧手段で
あり、従来技術のように、加工台及び重錘等によって構
成すればよい。In addition, the diamond wire 1
When the vehicle travels 0, the movable pulley unit 35 is reciprocated by the cylindrical cam 34 in correspondence with the winding position of the diamond wire 10 on the bobbin. Accordingly, it is possible to prevent the diamond wires 10 from being overlapped and randomly wound. As described above, the configuration in which the running direction of the diamond wire 10 can be reversed and the wire can be appropriately fed and wound can be used efficiently and suitably, and the productivity can be improved. The speed at which the diamond wire 10 travels, the time schedule for reversing the traveling direction, and the like may be appropriately set based on specific cutting specifications. Reference numeral 39 denotes a pressing means for supporting the work 12 and bringing the diamond wire 10 into contact with the diamond wire 10 with an appropriate pressing force.
【００２４】ところで、ワーク１２としては、水晶のよ
うな直方体のものを図示して説明したが、本発明によれ
ば、前述したように単結晶シリコンの円柱状インゴット
を好適に加工できるのは勿論である。すなわち、単結晶
シリコンのインゴットを、好適にウェーハ状に切り出し
て、半導体チップの原料となるシリコンウェーハを好適
に製造することができる。By the way, the work 12 is illustrated and described as having a rectangular parallelepiped such as quartz. However, according to the present invention, it is needless to say that the columnar ingot of single crystal silicon can be suitably processed as described above. It is. That is, a single crystal silicon ingot can be suitably cut into a wafer shape, and a silicon wafer serving as a raw material for a semiconductor chip can be suitably manufactured.
【００２５】また、以上の実施例では、ワーク１２の切
口が加工液面の上にある場合を想定しているが、本発明
はこれに限定されるものではなく、貯留槽に溜められた
加工液中にワーク１２を没し、加工液面下でワーク１２
の加工を行うようにしてもよい。以上、本発明につき好
適な実施例を挙げて種々説明してきたが、本発明はこの
実施例に限定されるものではなく、発明の精神を逸脱し
ない範囲内で多くの改変を施し得るのは勿論のことであ
る。Further, in the above embodiment, it is assumed that the cut end of the work 12 is above the working liquid level. However, the present invention is not limited to this, and the work stored in the storage tank is not limited to this. The work 12 is immersed in the liquid, and the work 12
May be performed. As described above, the present invention has been described variously with reference to preferred embodiments. However, the present invention is not limited to the embodiments, and it is needless to say that many modifications can be made without departing from the spirit of the invention. That is.
【００２６】[0026]
【発明の効果】本発明によれば、ダイヤモンドワイヤー
に押圧接触してドレッシングを行うドレッシングツール
と、そのドレッシングツールを、ダイヤモンドワイヤー
の張架されると共にワークに加工を施していない部分
に、押圧接触させる押圧機構とを具備する。このため、
ダイヤモンドワイヤーの目詰まりを好適に除去してワー
クの切断等の加工効率を向上できると共に、イン・プロ
セスでドレッシングを行うことができるため、加工速
度、加工精度を安定化できるという著効を奏する。According to the present invention, a dressing tool for performing dressing by pressing and contacting a diamond wire, and pressing the dressing tool to a portion where the diamond wire is stretched and the workpiece is not processed is pressed. And a pressing mechanism for causing the pressing mechanism. For this reason,
Since the clogging of the diamond wire can be suitably removed and the processing efficiency such as cutting of the work can be improved, and the dressing can be performed in-process, the processing speed and the processing accuracy can be stabilized.
【図１】本発明にかかるダイヤモンドワイヤーソーの一
実施例を説明する斜視図である。FIG. 1 is a perspective view illustrating an embodiment of a diamond wire saw according to the present invention.
【図２】従来のマルチワイヤーソーの構造を説明する斜
視説明図である。FIG. 2 is a perspective view illustrating the structure of a conventional multi-wire saw.
１０ ダイヤモンドワイヤー １２ ワーク ２６ ドレッシングツール ２８ 押圧機構 10 diamond wire 12 work 26 dressing tool 28 pressing mechanism
Claims (3)
定されたダイヤモンドワイヤーを、硬質脆性材料である
ワークに押圧接触させて走行させ、冷却等のために加工
液を供給し、前記ワークに切断等の加工を施すダイヤモ
ンドワイヤーソーにおいて、 前記ダイヤモンドワイヤーに押圧接触してドレッシング
を行うドレッシングツールと、 該ドレッシングツールを、前記ダイヤモンドワイヤーの
張架されると共にワークに加工を施していない部分に、
押圧接触させる押圧機構とを具備することを特徴とする
ダイヤモンドワイヤーソー。1. A diamond wire in which diamond abrasive grains are fixed to a fine wire is pressed against a work made of a hard and brittle material to travel, a working fluid is supplied for cooling or the like, and the work is cut or the like. In a diamond wire saw that performs processing, a dressing tool that performs dressing by pressing and contacting the diamond wire, and applying the dressing tool to a portion where the diamond wire is stretched and the workpiece is not processed.
A diamond wire saw, comprising: a pressing mechanism for pressing and contacting.
ワイヤーを一連に多数回張架巻回して延びる下側水平部
分を前記ワークに押圧接触させ、同時に複数の切断等の
加工を施すマルチソーであり、 前記ドレッシングツールは、複数列に並列されたダイヤ
モンドワイヤーに同時に押圧接触することを特徴とする
請求項１記載のダイヤモンドワイヤーソー。2. A multi-saw in which a plurality of multi-groove pulleys are successively stretched and wound around the diamond wire a number of times and a lower horizontal portion extending therefrom is brought into pressure contact with the work, and simultaneously performs a plurality of processes such as cutting. 2. The diamond wire saw according to claim 1, wherein the dressing tool simultaneously presses and contacts the diamond wires arranged in a plurality of rows.
定されたダイヤモンドワイヤーを、硬質脆性材料である
ワークに押圧接触させて走行させ、冷却等のために加工
液を供給し、前記ワークに切断等の加工を施すダイヤモ
ンドワイヤーソーを用いた切断加工方法において、 前記ダイヤモンドワイヤーのドレッシングツールを、前
記ダイヤモンドワイヤーによるワークの切断等の加工中
に、前記ダイヤモンドワイヤーの張架されると共にワー
クに加工を施していない部分に押圧接触させてドレッシ
ングを行うことを特徴とする切断加工方法。3. A diamond wire in which diamond abrasive grains are fixed to a fine wire is pressed against a work, which is a hard brittle material, to run, a working liquid is supplied for cooling or the like, and the work is cut or the like. In a cutting method using a diamond wire saw that performs processing of the above, the diamond wire dressing tool is processed while the diamond wire is stretched and the work is processed during processing such as cutting of the work by the diamond wire. A dressing method characterized in that dressing is performed by pressing and contacting a portion that has not been cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33740298A JP2000158319A (en) | 1998-11-27 | 1998-11-27 | Diamond wire saw and cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33740298A JP2000158319A (en) | 1998-11-27 | 1998-11-27 | Diamond wire saw and cutting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000158319A true JP2000158319A (en) | 2000-06-13 |
Family
ID=18308304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33740298A Pending JP2000158319A (en) | 1998-11-27 | 1998-11-27 | Diamond wire saw and cutting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000158319A (en) |
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| JP2011020197A (en) * | 2009-07-14 | 2011-02-03 | Shin Etsu Handotai Co Ltd | Workpiece cutting method |
| JP2011031386A (en) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | Electro-deposition fixed abrasive grain wire and crystal slicing method using the same |
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1998
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