JPH09232712A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPH09232712A JPH09232712A JP3688996A JP3688996A JPH09232712A JP H09232712 A JPH09232712 A JP H09232712A JP 3688996 A JP3688996 A JP 3688996A JP 3688996 A JP3688996 A JP 3688996A JP H09232712 A JPH09232712 A JP H09232712A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- patterns
- electrolytic capacitor
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気回路を形成し
たプリント基板に関し、特にプリント基板の構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which an electric circuit is formed, and more particularly to the structure of the printed circuit board.
【０００２】[0002]
【従来の技術】従来、プリント基板は、フェノール樹脂
やガラスエポキシ基材で作られており、この上に電気回
路を形成し、更に抵抗やコンデンサ等の電気部品を実装
して、通信機器やテレビ等の製品の中にユニットやモジ
ュール単位で収納されている。このようなプリント基板
においては実装される電気部品としてアルミ電解コンデ
ンサが用いられることも多い。2. Description of the Related Art Conventionally, a printed circuit board is made of a phenolic resin or a glass epoxy base material, an electric circuit is formed on the printed circuit board, and electric parts such as a resistor and a capacitor are mounted on the printed circuit board so that a communication device or a television can be provided. Etc. are stored in units such as units or modules. In such a printed board, an aluminum electrolytic capacitor is often used as an electric component to be mounted.
【０００３】[0003]
【発明が解決しようとする課題】従来のプリント基板に
おいては、アルミ電解コンデンサの電解液が漏出してプ
リントパターン間をショートさせたり、プリントパター
ンを溶かして、信号断となる障害が発生することがあっ
た。In the conventional printed circuit board, the electrolytic solution of the aluminum electrolytic capacitor may leak to short-circuit between the print patterns, or the print patterns may be melted to cause a trouble such as signal interruption. there were.
【０００４】その理由は、漏出したアルミ電解コンデン
サの電解液が拡散しプリントパターン間に電解液が付着
したり、滞留状態となるためであった。The reason for this is that the leaked electrolytic solution of the aluminum electrolytic capacitor diffuses, and the electrolytic solution adheres between the print patterns or becomes stagnant.
【０００５】したがって、本発明の目的は、漏出した電
解液がプリント基板面上で、拡散したまま滞留状態とな
らないプリント基板を提供することである。Therefore, an object of the present invention is to provide a printed circuit board in which the leaked electrolytic solution does not stay in a dwell state while being diffused on the printed circuit board surface.
【０００６】[0006]
【課題を解決するための手段】本発明によれば、電解コ
ンデンサのリード取付用ランドパターンの周りに溝を形
成したプリント基板が得られる。According to the present invention, there can be obtained a printed circuit board in which a groove is formed around a lead mounting land pattern of an electrolytic capacitor.
【０００７】また、本発明によれば、電解コンデンサ直
下のプリント基板面上に少なくとも１ヶの貫通孔を明け
たプリント基板が得られる。Further, according to the present invention, it is possible to obtain a printed circuit board having at least one through hole formed on the surface of the printed circuit board immediately below the electrolytic capacitor.
【０００８】更に本発明においては電解コンデンサのリ
ード取付用ランドパターンの周りに溝を形成し、更に、
直下の基板面上に貫通孔を設けた構成としてもよい。Further, in the present invention, a groove is formed around the lead mounting land pattern of the electrolytic capacitor.
A configuration may be used in which a through hole is provided on the substrate surface immediately below.
【０００９】電解コンデンサのリード取付用ランドパタ
ーンの周りに溝を形成した本発明では、万一電解液が液
体の状態で漏出しても溝に捕えられ、電解液がプリント
基板上に拡散するのを防止できる。In the present invention in which the groove is formed around the lead mounting land pattern of the electrolytic capacitor, even if the electrolytic solution leaks in a liquid state, it is caught in the groove and the electrolytic solution diffuses on the printed circuit board. Can be prevented.
【００１０】電解コンデンサ直下に１ヶ以上の貫通孔を
明けた本発明では、漏出した気体が電解コンデンサ直下
で液化することなく、貫通孔を通って、プリント基板の
下面より空気中に放散される。According to the present invention in which at least one through hole is formed directly below the electrolytic capacitor, the leaked gas is diffused into the air from the lower surface of the printed circuit board through the through hole without being liquefied immediately below the electrolytic capacitor. .
【００１１】また、上記２つの特徴を組み合わせた場合
は、前述した２つの作用の併合により、更に電解液の漏
れに対して効果が大きくなる。Further, when the above two features are combined, the effect of the leakage of the electrolytic solution is further increased by the combination of the above-mentioned two actions.
【００１２】[0012]
【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１３】図１は第１の発明の実施の形態を示す図
で、図１の（ａ）は平面図、図１の（ｂ）はＡ−Ａ線で
切断したときの断面図である。プリント基板１上にはプ
リントパターン２があり、電解コンデンサ３が実装され
ている。電解コンデンサ３のリード取付用ランドパター
ン４の周囲を取り囲むように溝１１を形成する構造とな
っている。このため万一電解液が液体の状態で漏出して
も電解液が溝１１に捕えられるため、プリントパターン
面上に拡散するのを防止できる。FIG. 1 is a diagram showing an embodiment of the first invention, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a sectional view taken along the line A--A. A printed pattern 2 is provided on a printed circuit board 1 and an electrolytic capacitor 3 is mounted. The groove 11 is formed so as to surround the lead mounting land pattern 4 of the electrolytic capacitor 3. For this reason, even if the electrolytic solution leaks in a liquid state, the electrolytic solution is caught in the groove 11, so that it can be prevented from diffusing on the print pattern surface.
【００１４】図２は第２の発明の実施の形態を示す図
で、図２の（ａ）は平面図、図２の（ｂ）はＢ−Ｂ線で
切断したときの断面図である。本実施の形態においては
電解コンデンサ３の直下に貫通孔１２を２ヶ設ける。こ
のため漏出した気体が電解コンデンサ直下で液化するこ
となく、貫通孔１２を通してプリント基板下面より周囲
の空間に放出される。また液体で漏出した場合も、この
貫通孔からプリント基板の下に落下し拡散を少なくする
ことが出来る。なお貫通孔は２ヶに限定せず任意の数で
よい。2A and 2B are views showing an embodiment of the second invention. FIG. 2A is a plan view and FIG. 2B is a sectional view taken along line BB. In this embodiment, two through holes 12 are provided immediately below the electrolytic capacitor 3. Therefore, the leaked gas is discharged to the surrounding space from the lower surface of the printed board through the through hole 12 without being liquefied just below the electrolytic capacitor. Further, even if the liquid leaks out, it can fall from the through hole to the bottom of the printed circuit board to reduce the diffusion. Note that the number of through holes is not limited to two, and any number may be used.
【００１５】図３は第３の発明の実施の形態を示す図
で、図３の（ａ）は平面図、図３の（ｂ）はＣ−Ｃ線で
切断したときの断面図である。本例は前述した第１およ
び第２の発明の実施の形態の特徴を併合したものである
ので説明は省略する。3A and 3B are views showing an embodiment of the third invention. FIG. 3A is a plan view and FIG. 3B is a sectional view taken along the line C--C. This example is a combination of the features of the above-described first and second embodiments of the invention, and therefore description thereof will be omitted.
【００１６】図４は前記第４の発明の実施の形態であ
り、図４の（ａ）は平面図、図４の（ｂ）はＤ−Ｄ線で
切断したときの断面図を示す。図で、漏出した電解液は
プリント基板の部品面側に設けた溝１１に捕えられたの
ち、貫通孔１２を通って半田面側に回り込んだ電解液
は、貫通孔１２の周りの半田面側に設けた第２の溝１４
にて阻止されるため、電解コンデンサの半田面端子間に
電解液が付着するのが防止され、貫通孔１２を通してプ
リント基板の下に落下し空間に放出する。FIG. 4 shows an embodiment of the fourth invention, FIG. 4 (a) is a plan view and FIG. 4 (b) is a sectional view taken along the line D--D. In the figure, the leaked electrolytic solution is trapped in the groove 11 provided on the component surface side of the printed circuit board, and then the electrolytic solution that has passed through the through hole 12 to the solder surface side is the solder surface around the through hole 12. Second groove 14 provided on the side
Therefore, the electrolytic solution is prevented from adhering between the solder surface terminals of the electrolytic capacitor, and falls through the through hole 12 below the printed circuit board to be discharged into the space.
【００１７】[0017]
【発明の効果】本発明は、漏出した電解液によりプリン
トパターンを破損したり、プリントパターン間でショー
トして機器障害を発生させることを防止する効果があ
る。その理由は、電解コンデンサの電解液は封口ゴムと
リードのすき間から漏れ出すことが多いが、本発明では
漏出した電解液は電解コンデンサのリード端子出口付近
の溝に捕えられ電解コンデンサの外側に漏出することは
無い。また電解コンデンサより気体の状態で漏出した電
解液は、貫通孔を通ってプリント基板の外の空気中に放
散される。INDUSTRIAL APPLICABILITY The present invention has the effect of preventing the printed patterns from being damaged by the leaked electrolytic solution or causing a short circuit between the printed patterns to cause a device failure. The reason is that the electrolytic solution of the electrolytic capacitor often leaks from the gap between the sealing rubber and the lead, but in the present invention, the leaked electrolytic solution is trapped in the groove near the outlet of the lead terminal of the electrolytic capacitor and leaks to the outside of the electrolytic capacitor. There is nothing to do. Further, the electrolytic solution leaking in a gas state from the electrolytic capacitor is diffused into the air outside the printed circuit board through the through hole.
【図１】本発明による第１の実施の形態を示す図で、
（ａ）は平面図、（ｂ）はＡ−Ａ線で切断したときの断
面図。FIG. 1 is a diagram showing a first embodiment according to the present invention,
(A) is a plan view and (b) is a cross-sectional view taken along the line AA.
【図２】本発明による第２の実施の形態を示す図で、
（ａ）は平面図、（ｂ）はＢ−Ｂ線で切断したときの断
面図。FIG. 2 is a diagram showing a second embodiment according to the present invention,
(A) is a plan view and (b) is a sectional view taken along the line BB.
【図３】本発明による第３の実施の形態を示す図で、
（ａ）は平面図、（ｂ）はＣ−Ｃ線で切断したときの断
面図。FIG. 3 is a diagram showing a third embodiment according to the present invention,
(A) is a plan view and (b) is a cross-sectional view taken along the line C-C.
【図４】本発明による第４の実施の形態を示す図で、
（ａ）は平面図、（ｂ）はＤ−Ｄ線で切断したときの断
面図。FIG. 4 is a diagram showing a fourth embodiment according to the present invention,
(A) is a plan view and (b) is a cross-sectional view taken along the line D-D.
１ プリント基板 ２ プリントパターン ３ 電解コンデンサ ４ 電解コンデンサリード取付用ランドパターン １１ 溝 １２ 貫通孔 １３ 電解コンデンサリード端子 １４ 第２の溝 1 Printed Circuit Board 2 Print Pattern 3 Electrolytic Capacitor 4 Electrode Capacitor Lead Mounting Land Pattern 11 Groove 12 Through Hole 13 Electrolytic Capacitor Lead Terminal 14 Second Groove
Claims (4)
ドパターンの周りに溝を設けたことを特徴とするプリン
ト基板。1. A printed circuit board having grooves formed around a land pattern for mounting lead terminals of an electrolytic capacitor.
貫通孔を設けたことを特徴とするプリント基板。2. A printed circuit board having a through hole on a surface of the printed circuit board directly below the electrolytic capacitor.
貫通孔を設けたことを特徴とする請求項１のプリント基
板。3. The printed circuit board according to claim 1, wherein a through hole is provided in the printed circuit board directly below the electrolytic capacitor.
の面で、前記貫通孔の周りに溝を設けたことを特徴とす
る請求項２あるいは３のプリント基板。4. The printed circuit board according to claim 2, wherein a groove is provided around the through hole on the surface opposite to the surface on which the electrolytic capacitor is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3688996A JPH09232712A (en) | 1996-02-23 | 1996-02-23 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3688996A JPH09232712A (en) | 1996-02-23 | 1996-02-23 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09232712A true JPH09232712A (en) | 1997-09-05 |
Family
ID=12482353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3688996A Pending JPH09232712A (en) | 1996-02-23 | 1996-02-23 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09232712A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0124882B2 (en) * | 1983-05-20 | 1989-05-15 | Uni Charm Corp | |
| JPH0548237A (en) * | 1991-08-21 | 1993-02-26 | Wako Electric Co Ltd | Circuit substrate |
-
1996
- 1996-02-23 JP JP3688996A patent/JPH09232712A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0124882B2 (en) * | 1983-05-20 | 1989-05-15 | Uni Charm Corp | |
| JPH0548237A (en) * | 1991-08-21 | 1993-02-26 | Wako Electric Co Ltd | Circuit substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980203 |