JPH0322490A - Flexible substrate - Google Patents
Flexible substrateInfo
- Publication number
- JPH0322490A JPH0322490A JP15655589A JP15655589A JPH0322490A JP H0322490 A JPH0322490 A JP H0322490A JP 15655589 A JP15655589 A JP 15655589A JP 15655589 A JP15655589 A JP 15655589A JP H0322490 A JPH0322490 A JP H0322490A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- circuit board
- opening
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 16
- 238000005476 soldering Methods 0.000 claims abstract description 14
- 239000011247 coating layer Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 abstract description 22
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001272720 Medialuna californiensis Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、フレキシブル基板、特にフレキシブル基板を
プリント基板に電気的に接続するためのフレキシブル基
板のスルーホール部分の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flexible substrate, and particularly to the structure of a through-hole portion of a flexible substrate for electrically connecting the flexible substrate to a printed circuit board.
［従来の技術コ
一般にフレキシブル基板とプリント基板は、フレキシブ
ル基板上の配線パターン等の接点部分と、プリント基板
上の対応する接点部分（一般に銅箔ランド等と称される
ので、以下「ランド」と略称する）とを半田付けにより
電気的に接続して用いられる。[Conventional technology] In general, flexible boards and printed circuit boards have contact parts such as wiring patterns on the flexible board, and corresponding contact parts on the printed circuit board (generally called copper foil lands, etc., henceforth referred to as "lands"). (abbreviation)) are electrically connected by soldering.
この電気的接続のための具体的な構造としては、従来例
えば、フレキシブル基板に、内面にスルーホールランド
と通称される環状接点（リング状導体）をもつスルーホ
ールを設けて、このスルーホールをフレキシブル基板側
の接点であるランドの上に重ね、スルーホール内に半田
を流し込むことでスルーホールランドと上記ランドの電
気的接続を与える形式が多く用いられている。Conventionally, as a specific structure for this electrical connection, for example, a through hole with an annular contact (ring-shaped conductor) commonly known as a through-hole land is provided on the inner surface of a flexible board, and this through-hole is connected to a flexible board. A format that is often used is to overlay the land, which is a contact point on the board side, and pour solder into the through hole to provide an electrical connection between the through hole land and the above land.
この従来例の接続構造を更に具体的に示した第３図およ
び第４図を用いて説明すると、図において、１はフレキ
シブル基板で、２枚の被覆層５によりサンドイッチ状に
挾持されている。The connection structure of this conventional example will be explained in more detail with reference to FIGS. 3 and 4. In the figures, reference numeral 1 denotes a flexible substrate, which is sandwiched between two covering layers 5.
この被覆層５は一般的にはカバーレイと称されるもので
、耐熱性、耐薬品性に富み、曲げ等につよい材質、例え
ばポリイ主ドなどのフイルムで形成される。This covering layer 5 is generally referred to as a coverlay, and is made of a material having high heat resistance, chemical resistance, and resistance to bending, for example, a film such as polyamide film.
２はプリント基板であり、その上に形成された導電パタ
ーンの一部にフレキシブル基板の接点（上記スルーホー
ルランド）と電気的に接続される半田付け接点としての
上記ランド６が設けられる。Reference numeral 2 denotes a printed circuit board, and the land 6 as a soldering contact electrically connected to the contact (the through-hole land) of the flexible circuit board is provided on a part of the conductive pattern formed on the printed circuit board.
３はフレキシブル基板１に設けられた円形開口としての
スルーホール３であり、フレキシブル基板１を貫通して
設けられている。４はスルーホールランドであり、スル
ーホール３の内周に露出した円環状の導体であって、フ
レキシブル基板１に形威されている導電パターンに接続
されている。Reference numeral 3 denotes a through hole 3 as a circular opening provided in the flexible substrate 1, and is provided to penetrate the flexible substrate 1. A through-hole land 4 is an annular conductor exposed at the inner periphery of the through-hole 3, and is connected to a conductive pattern formed on the flexible substrate 1.
以上のような構成において、フレキシブル基板とプリン
ト基板の間の所定の電気的接続は、上述のように、フレ
キシブル基板のスルーホールをプリント基板のランドの
上に重ねて、このスルーホールの開口内に半田を流し込
むことで行なうようになっており、このためにフレキシ
ブル基板１のカバーレイ５のスルーホールに臨む開口は
、スルーホール３の開口よりも大きく設けることで半田
付けに便利な構造とされている。なお図において７はス
ルーホール３に注入された半田を示している。In the above configuration, the predetermined electrical connection between the flexible board and the printed circuit board is made by overlapping the through hole of the flexible board over the land of the printed circuit board and inserting the through hole into the opening of this through hole, as described above. This is done by pouring the solder, and for this purpose the opening facing the through-hole of the coverlay 5 of the flexible substrate 1 is made larger than the opening of the through-hole 3 to provide a convenient structure for soldering. There is. Note that in the figure, 7 indicates solder injected into the through hole 3.
［発明が解決しようとする課題］
ところで、上述した従来例の構造のフレキシブル基板を
用いて実際に半田付けの作業を行なうと、製作された製
品中に電気的に接続不良のがみられた。このような電気
的な接続不良品の存在は製品管理上無視できないことか
ら、この問題について検討を重ねたところその原因は主
にフレキシブル基板の構造に起因することが分かつｋ．
すなわち第４図に示すように、半田付けの際にフレキシ
ブル基板１のスルーホール３とプリント基板２のランド
６を対向させると、、スルーホール３とランド６とが組
み合わさってあたかもコップの内空間様の上方に開放し
ｋ空所を形成する。この空所が半田付けの際に半田７を
流し込む部分を形成することになる。ところがこの空所
によって、スルーホール３の上方から半田７を注入した
ときに、第２図のようにスルーホールランド４の上端部
分で架橋した半田が蓋となってスルーホール３を密閉し
てしまう原因となる場合もあることが分かつｋ．そして
このような架橋現象が生ずると、空所内部の空気が外部
に逃げることができなくなり、気泡８としてスルーホー
ル３内に閉じ込められる結果になる。[Problems to be Solved by the Invention] By the way, when soldering work was actually performed using the flexible circuit board having the conventional structure described above, electrical connection failures were found in the manufactured products. Since the existence of such defective electrical connections cannot be ignored in terms of product management, we have repeatedly investigated this problem and found that the cause is mainly due to the structure of the flexible circuit board.k. In other words, as shown in FIG. 4, when the through holes 3 of the flexible board 1 and the lands 6 of the printed circuit board 2 are made to face each other during soldering, the through holes 3 and the lands 6 are combined to form the inner space of a cup. It opens upwards to form a k-space. This void will form a portion into which solder 7 will be poured during soldering. However, due to this void, when solder 7 is injected from above the through hole 3, the solder bridged at the upper end of the through hole land 4 acts as a lid and seals the through hole 3, as shown in Figure 2. k. If such a bridging phenomenon occurs, the air inside the cavity will not be able to escape to the outside, resulting in being trapped in the through hole 3 as air bubbles 8.
このためにこの気泡の存在がスルーホールランド４とラ
ンド６が電気的接続の不良を招き、両基板の電気的な接
続不良を起こす原因となっていたのである。For this reason, the presence of the air bubbles caused a defective electrical connection between the through-hole land 4 and land 6, causing a defective electrical connection between the two substrates.
本発明の目的は、上記した問題の解決を図り、フレキシ
ブル基板のスルーホールを用いて、フレキシブル基板と
プリント基板の各接点を電気的に接続する際に、半田注
入によるスルーホール内への気泡の封入を防止し、これ
らの間の電気的接続を確実に行なうことができる構造を
持ったフレキシブル基板を提供することにある。An object of the present invention is to solve the above-mentioned problems, and to prevent bubbles from entering the through-holes due to solder injection when electrically connecting the contacts of the flexible circuit board and the printed circuit board using the through-holes of the flexible circuit board. It is an object of the present invention to provide a flexible substrate having a structure that can prevent encapsulation and ensure electrical connection between them.
［課題を解決するための手段］
上記の目的を達成する本発明よりなるフレキシブル基板
の特徴は、プリント基板の接点と半田付けにより電気的
に接続される開口型接点としてのスルーホールを有し、
かつ表面が被覆層（カバーレイ）で覆装されているフレ
キシブル基板において、上記カバーレイのスルーホール
に臨む開口内縁の一部を、該スルーホールの径内方に張
り出し形成させたという構成をなすところにある。[Means for Solving the Problems] The flexible board according to the present invention that achieves the above object has a through hole as an open contact that is electrically connected to the contact of the printed circuit board by soldering,
In a flexible substrate whose surface is covered with a covering layer (coverlay), a part of the inner edge of the opening facing the through-hole of the coverlay is formed to protrude radially inward of the through-hole. There it is.
上記構成においてカバーレイをスルーホールの径内方に
『張り出し形成」させたとは、スルーホール内への半田
注入の際に、この半田がスルーホールの空所の底まで円
滑に流れ込みし、途中スルーホールの上端付近で架橋す
るような現象を阻止できるに充分な構威であればよいも
のである。すなわち流動化した半田がその表面張力等で
スルーホールの開口全面にかぶって、内部の空気が上方
へ逃げることができなくなるような不都合を生じないこ
とを条件に、上記張り出しの構成を設ければ良いのであ
り、このために具体的には、カバーレイのスルーホール
に臨む開口を、該スルーホールを形成しているスルーホ
ールランドの内径よりも内側間で張り出した部分を持つ
半月状．扇形状．多角形状としたり、強度的に許容され
る場合には開口中央部等の位置に細い架橋線を架設した
りする場合のものを例示することができる。In the above configuration, the coverlay is formed to ``protrude'' inward from the diameter of the through hole, which means that when injecting solder into the through hole, the solder flows smoothly to the bottom of the cavity of the through hole, and the solder flows through the through hole in the middle. Any structure is sufficient as long as it is sufficient to prevent phenomena such as crosslinking near the upper ends of the holes. In other words, if the above-mentioned overhanging structure is provided on the condition that the fluidized solder does not cover the entire surface of the opening of the through hole due to its surface tension, thereby preventing the internal air from escaping upward. For this purpose, specifically, the opening facing the through-hole of the coverlay is shaped like a half-moon, with a portion that protrudes from the inner diameter of the through-hole land that forms the through-hole. Fan shape. For example, it may have a polygonal shape, or if it is permissible in terms of strength, a thin bridge wire may be installed at a position such as the center of the opening.
［作 用］
上記の如く構成した本発明によれば、スルーホールへの
半田の注入の際に、カバーレイがスルーホールの開口の
一部を覆い隠しているため、半田はスルーホール上端部
分で架橋現象を起こすことなくスルーホール３の片側よ
りスルーホール３内に円滑に流入し、スルーホールラン
ドとランドの確実な半田接続を与える。[Function] According to the present invention configured as described above, when injecting solder into the through-hole, the coverlay partially covers the opening of the through-hole, so that the solder does not reach the upper end of the through-hole. To smoothly flow into a through hole 3 from one side of the through hole 3 without causing a bridging phenomenon, and to provide reliable solder connection between through hole lands and lands.
［実 施 例］
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。[Example] Hereinafter, the present invention will be described in detail based on an example shown in the drawings.
第１図は本実施例の斜視図、第２図は本実施例の断面図
である。なお以下の説明において第３図および第４図と
共通の構成要素には同一の符号を使用して詳細な説明を
省略した。FIG. 1 is a perspective view of this embodiment, and FIG. 2 is a sectional view of this embodiment. In the following description, the same reference numerals are used for the same components as in FIGS. 3 and 4, and detailed description thereof is omitted.
第１図及び第２図において、１はフレキシブル基板であ
り、図示しない所定の導電パターンが表面に形成されて
いると共に、本例では表裏両面がカバーレイ５で覆装さ
れている。２はプリント基板であり、図示しない所定の
導電パターンが表面に形成されていると共に、この導電
パターンの一部には、フレキシブル基板と電気的接続の
ためのランド６が形成されている。In FIGS. 1 and 2, reference numeral 1 denotes a flexible substrate, on which a predetermined conductive pattern (not shown) is formed, and in this example, both the front and back surfaces are covered with a coverlay 5. A printed circuit board 2 has a predetermined conductive pattern (not shown) formed on its surface, and a land 6 for electrical connection with the flexible circuit board is formed in a part of the conductive pattern.
３は上記プリント基板２のランド６と半田付け接続する
ための半田付け作業部位として所定位置に形成されたス
ルーホールであり、その内面にはスルーホールランド４
が設けられていて、プリント基板２のランド６と半田付
け接続できるようになっている。なお７はスルーホール
３に注入された半田である。Reference numeral 3 denotes a through hole formed at a predetermined position as a soldering work site for soldering connection with the land 6 of the printed circuit board 2, and the through hole land 4 is formed on the inner surface thereof.
is provided so that it can be connected to the land 6 of the printed circuit board 2 by soldering. Note that 7 is solder injected into the through hole 3.
本実施例の特徴は、フレキシブル基板１のプリント基板
側とは反対側のカバーレイ５において、そのスルーホー
ル３に臨む開口の内縁部分の一部５′が、スルーホール
３の開口の一部を弓形（あるいは三日月形）に覆い隠す
ようにスルーホール内方に張り出した構造に設けられて
いるところにある。The feature of this embodiment is that in the coverlay 5 on the side opposite to the printed circuit board side of the flexible board 1, a part 5' of the inner edge portion of the opening facing the through hole 3 covers a part of the opening of the through hole 3. It is located in a structure that protrudes inward from the through hole so as to cover it in an arch (or crescent) shape.
このようにカバーレイ５の開口内縁部分の一部５′が、
スルーホール３のの径内方に張り出しした構造に設けら
れていることにより、半田付け作業に際してスルーホー
ル３の開口上方より半田７を注入すると、半田７は従来
例のようにスルーホールランド４間に架橋してスルーホ
ール３内に気泡８を封入するようなことがなく円滑に流
れ込むことになる。このため、スルーホールランド４と
ランド６との間に半田が確実に注入され、これらの間の
電気的な接続が確保され、これは製品間のバラツキを招
くこともなかっｋ０
［発明の効果］
以上説明してきたように、本発明のフレキシブル基板に
よれば、このフレキシブル基板の接点とプリント基板の
接点とを半田付けして電気的に接続する作業を行なう際
に、半田付け作業部位であるスルーホール内の空間に気
泡を閉じ込めることがないので、スルーホールランドと
ランドを確実に電気的に接続することができるという効
果がある。In this way, a part 5' of the inner edge of the opening of the coverlay 5 is
Because the through hole 3 is provided in a structure that extends inward in its diameter, when solder 7 is injected from above the opening of the through hole 3 during soldering work, the solder 7 will flow between the through hole lands 4 as in the conventional example. The air bubbles 8 will not be bridged and enclosed in the through hole 3, and will flow smoothly. Therefore, the solder is reliably injected between the through-hole land 4 and the land 6, and the electrical connection between them is ensured, and this does not cause variations between products k0 [Effects of the invention] As explained above, according to the flexible circuit board of the present invention, when soldering the contacts of the flexible circuit board and the contacts of the printed circuit board to electrically connect them, it is possible to Since air bubbles are not trapped in the space within the hole, there is an effect that the through-hole land and the land can be reliably electrically connected.
第１図は本発明の一実施例の斜視図、第２図は同実施例
の断面図、第３図は従来例の斜視図、第４図は同従来例
の断面図である。
１・・・フレキシブル基板 ２・・・プリント基板３・
・・スルーホール
４・・・スルーホールランド
５・・・被覆層（カバーレイ）
９
−ら１１一
１
０
５′
・・・被覆層の一部
６・・・ランド
７・・・半田
８・・・気泡
１
１
第
１
図
第
２
図FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of the embodiment, FIG. 3 is a perspective view of a conventional example, and FIG. 4 is a sectional view of the conventional example. 1...Flexible board 2...Printed circuit board 3.
...Through hole 4...Through hole land 5...Cover layer (coverlay) 9-ra11-105'...Part of cover layer 6...Land 7...Solder 8... ...Bubble 1 1 Figure 1 Figure 2
Claims (1)
される開口型接点としてのスルー ホールを有し、かつスルーホール部分を除く表面が被覆
層で覆装されているフレキシブル基板において、上記被
覆層のスルーホールに臨む開口内縁の一部を、該スルー
ホールの径内方に張り出し形成させたことを特徴とする
フレキシブル基板。1. In a flexible board that has a through hole as an open contact that is electrically connected to a contact of a printed circuit board by soldering, and whose surface except the through hole portion is covered with a coating layer, the through hole of the coating layer A flexible substrate characterized in that a part of the inner edge of the opening facing the hole is formed to extend radially inward of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15655589A JPH0322490A (en) | 1989-06-19 | 1989-06-19 | Flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15655589A JPH0322490A (en) | 1989-06-19 | 1989-06-19 | Flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0322490A true JPH0322490A (en) | 1991-01-30 |
Family
ID=15630356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15655589A Pending JPH0322490A (en) | 1989-06-19 | 1989-06-19 | Flexible substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0322490A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5418691A (en) * | 1990-02-07 | 1995-05-23 | Canon Kabushiki Kaisha | Two printed circuit boards superiposed on one another both having position registry marks |
| US5982626A (en) * | 1996-06-07 | 1999-11-09 | Asahi Kogaku Kogyo Kabushiki Kaisha | Two dimensional coupling for flexible printed circuit boards |
| JP2015050423A (en) * | 2013-09-04 | 2015-03-16 | 三菱電機株式会社 | Semiconductor device and flexible circuit board |
-
1989
- 1989-06-19 JP JP15655589A patent/JPH0322490A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5418691A (en) * | 1990-02-07 | 1995-05-23 | Canon Kabushiki Kaisha | Two printed circuit boards superiposed on one another both having position registry marks |
| US5982626A (en) * | 1996-06-07 | 1999-11-09 | Asahi Kogaku Kogyo Kabushiki Kaisha | Two dimensional coupling for flexible printed circuit boards |
| JP2015050423A (en) * | 2013-09-04 | 2015-03-16 | 三菱電機株式会社 | Semiconductor device and flexible circuit board |
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