LU100423B1 - Communication device with good heat dissipation - Google Patents

Abstract

The present invention relates to the field of a communication device, and more particularly to a communication device with good heat dissipation. The device comprises a housing and a circuit board, wherein the battery, the speaker and the camera are installed in the inner wall of the upper part of the housing, the battery and the speaker are located on both sides of the camera, the camera is located in the center of the upper part of the housing, the display screen is provided below the housing, the circuit board is fixed inside the housing, the circuit board comprises an electronic component, a first PCB substrate and a second PCB substrate, the electronic component is connected with the first PCB substrate, an insulating layer is provided above the first PCB substrate, a hydrophobic and olecphobic layer is provided above the insulating layer, the second PCB substrate is located below the first PCB substrate, a heat dissipation layer is provided between the first PCB substrate and the second PCB substrate, the heat dissipation layer is provided with a thermal conductive rubber hole connecting the first PCB substrate and the second PCB substrate, and a thermal conductive membrane is provided below the second PCB substrate. The invention is simple and reasonable in structure, which not only has a good heat dissipation performance, but also effectively avoids the hidden trouble of burn-in caused by the change of the ambient temperature.

Description

COMMUNICATION DEVICE WITH GOOD HEAT DISSIPATION

BACKGROUND

Technical Field

The present invention relates to the field of a communication device, and more particularly, to a communication device with good heat dissipation.

Related Art

With the rapid development of a communication device, the communication device has also brought people a better life experience. The circuit board of the communication device is usually provided with more high-power modules. These high-power modules will produce more heat after working for a long time. The heat will easily lead to a failure, or even burn-in, of the circuit board of the communications device if the heat cannot be dissipated outwards timely. Being concerned about the heat dissipation problem of the communication device and putting forward a series of solutions help enhance the life experience of people in modern life. The circuit board in the current communication device has a poor heat dissipation effect, and the communication device will form drops of water or oil on the circuit board due to the dramatic changes of the ambient temperature in the use, seriously affecting the safety performance of communications device.

Summary

In order to solve the above problems, the present invention provides a communication device with good heat dissipation.

In order to achieve the above object, the present invention adopts the following technical scheme: A communication device with good heat dissipation, comprising a housing, a camera, a speaker, a battery, a display screen and a circuit board, wherein the battery, the speaker and the camera are installed in the inner wall of the upper part of the housing, in which the battery and the speaker are located on both sides of the camera, and the camera is located in the center of the upper part of the housing; the display screen is provided below the housing, the circuit board is fixed inside the housing, the circuit board comprises an electronic component, a first PCB substrate and a second PCB substrate; the electronic component is connected with the first PCB substrate, an insulating layer is provided above the first PCB substrate, a hydrophobic and oleophobic layer is provided above the insulating layer; the second PCB substrate is located below the first PCB substrate, a heat dissipation layer is provided between the first PCB substrate and the second PCB substrate, the heat dissipation layer is provided with a thermal conductive rubber hole connecting the first PCB substrate and the second PCB substrate, and a thermal conductive membrane is further provided below the second PCB substrate.

Herein the preferred scheme is that the heat dissipation layer is made of a copper plate material and a plurality of heat dissipation passages are provided in the heat dissipation layer.

Herein the preferred scheme is that the thermally conductive membrane is formed by processing a metal membrane material.

Compared with the prior art, the invention has the advantageous effect that: when the device is in use, the electronic component provided on the circuit board will generate more heat after working for a period of time, the heat generated by the electronic component is distributed over the entire first PCB substrate, the heat dissipation layer absorbs the heat of the surface of the first PCB substrate at this time, the heat dissipation passage provided inside the heat dissipation layer is more helpful to the dissipation of the heat inside the heat dissipation layer, and the heat conductive rubber hole can transfer the temperature of the surface of the first PCB substrate to the heat dissipation layer, the second PCB substrate and the heat conductive membrane at the same time, the heat conductive membrane is a metal membrane with good heat dissipation and thermal conductivity, and the surface area is in contact with air to accelerate the dissipation of the heat; a hydrophobic and oleophobic layer provided above the first PCB substrate is used to absorb the liquefied drops of water or oil formed due to the communication device in the environment of rapid temperature change, effectively avoiding the problem of the circuit board short circuit and the circuit board aging caused by drops of water or oil. The insulating layer prevents the hydrophobic and oleophobic layer from being in contact with the first PCB substrate at the same time, avoiding short-circuiting between the hydrophobic and oleophobic layer and the first PCB substrate. In summary, the whole communication device is simple and reasonable in structure, in which the circuit board not only has a good heat dissipation performance, but also effectively avoids the hidden trouble of burn-in caused by the change of the ambient temperature. It is high in security and high in practical value.

Brief Description of Drawings FIG. 1 is a structure schematic diagram according to the present invention; and FIG. 2 is a structure schematic diagram of enlarged part Ain FIG. 1.

Description of Embodiments

The present invention will now be described in detail with reference to the accompanying drawings, but the present invention may be practiced in many different ways defined and covered by the claims.

Referring to FIGs. 1 and 2, a communication device with good heat dissipation comprises a housing 1, a camera 2, a speaker 3, a battery 4, a display screen 6 and a circuit board, wherein the battery 4, the speaker 3 and the camera 2 are installed in the inner wall of the upper part of the housing 1, in which the battery 4 and the speaker 3 are located on both sides of the camera 2, and the camera 2 is located in the center of the upper part of the housing 1; the display screen 6 is further provided below the housing 1, the display screen 6 is a liquid crystal display screen; the circuit board is fixed inside the housing 1, the circuit board comprises an electronic component 5, a first PCB substrate 9 and a second PCB substrate 11; the electronic component 5 is connected with the first PCB substrate 9, an insulating layer 8 is provided above the first PCB substrate 9; a hydrophobic and oleophobic layer 7 is provided above the insulating layer 8, the hydrophobic and oleophobic layer 7 is used to absorb the liquefied drops of water or oil formed due to the communication device in the environment of rapid temperature change; the second PCB substrate 11 is located below the first PCB substrate 9; a heat dissipation layer 14 is provided between the first PCB substrate 9 and the second PCB substrate 11, the heat dissipation layer 14 is made of a copper plate material with a better heat dissipation effect; a plurality of heat dissipation passages 12 are provided in the heat dissipation layer 14 to further assist in heat dissipation with a better heat dissipation effect; the heat dissipation layer 14 is provided with a thermal conductive rubber hole 10 connecting the first PCB substrate 9 and the second PCB substrate 11, the thermal conductive rubber hole 10 is used to transfer heat from the first PCB substrate 9 to the second PCB substrate 11; a thermal conductive membrane 13 is further provided below the second PCB substrate 11, and the thermal conductive membrane 13 is made of a metal membrane having better heat dissipation and thermal conductivity.

When the device is in use, the housing 1 protects the various components in the communication device from being shocked, the battery 4 supplies electric energy to the entire communication device, the camera 2 and the speaker 3 provide more practical functions for the entire communication device; the display screen 6 is used to display the information of the communication device; the electronic component 5 provided on the circuit board will generate more heat after working for a period of time, the heat generated by the electronic component 5 is distributed over the entire first PCB substrate 9, the heat dissipation layer 14 absorbs the heat of the surface of the first PCB substrate 9 at this time, the heat dissipation passage 12 provided inside the heat dissipation layer 14 is more helpful to the dissipation of the heat inside the heat dissipation layer 14, and the heat conductive rubber hole 10 can transfer the temperature of the surface of the first PCB substrate 9 to the heat dissipation layer 14, the second PCB substrate 11 and the heat conductive membrane 13 at the same time, the heat conductive membrane 13 is a metal membrane with good heat dissipation and thermal conductivity, and the surface area is in contact with air to accelerate the dissipation of the heat; a hydrophobic and oleophobic layer 7 provided above the first PCB substrate 9 is used to absorb the liquefied drops of water or oil formed due to the communication device in the environment of rapid temperature change, effectively avoiding the problem of the circuit board short circuit and the circuit board aging caused by drops of water or oil. The insulating layer 8 prevents the hydrophobic and oleophobic layer 7 from being in contact with the first PCB substrate 9 at the same time, avoiding short-circuiting between the hydrophobic and oleophobic layer 7 and the first PCB substrate 9.

The foregoing is only a preferred embodiment of the present invention and is not intended to limit the scope of the patent of the present invention. All the equivalent structure or equivalent process transformation made using the present specification and the accompanying drawings of the present invention, either directly or indirectly applied in other related technical fields, are similarly contained within the scope of the patent protection of the present invention.

Claims (3)

1. Dispositif de communication présentant une dissipation de chaleur améliorée, comprenant un boîtier (1), une caméra (2), un haut-parleur (3), une batterie (4), un écran d'affichage (6) et une carte de circuit imprimé, dans lequel la batterie (4), le haut-parleur (3) et la caméra (2) sont installés dans la paroi intérieure de la partie supérieure du boîtier (1), dans lequel la batterie et le haut-parleur sont situés sur les deux côtés de la caméra, et la caméra étant située au centre de la partie supérieure du boîtier ; l'écran d'affichage (6) est prévu au-dessous du boîtier, la carte de circuit étant fixée à l'intérieur du boîtier, la carte de circuit imprimé comprend un composant électronique (5), un premier substrat en PCB (9) et un second substrat en PCB (11) ; le composant électronique (5) est relié au premier substrat en PCB, une couche isolante (8) est prévue au-dessus du premier substrat en PCB, une couche hydrophobe et oléophobe (7) est disposée au-dessus de la couche isolante (8) ; le second substrat en PCB (11) est situé sous le premier substrat en PCB (9), une couche de dissipation de la chaleur (14) est prévue entre le premier substrat en PCB et le second substrat en PCB, la couche de dissipation de la chaleur (14) étant pourvue d'un orifice de caoutchouc conducteur thermique (10) reliant le premier substrat en PCB (9) et le second substrat en PCB (11), et une membrane thermoconductrice (13) est en outre prévue sous le second substrat de PCB (11).A communication device having improved heat dissipation, comprising a housing (1), a camera (2), a speaker (3), a battery (4), a display screen (6) and a card circuit board, wherein the battery (4), the speaker (3) and the camera (2) are installed in the inner wall of the upper housing (1), wherein the battery and the speaker are located on both sides of the camera, and the camera is located at the center of the top of the case; the display screen (6) is provided below the housing, the circuit board being fixed inside the housing, the printed circuit board comprises an electronic component (5), a first PCB substrate (9), ) and a second PCB substrate (11); the electronic component (5) is connected to the first PCB substrate, an insulating layer (8) is provided above the first PCB substrate, a hydrophobic and oleophobic layer (7) is arranged above the insulating layer (8). ); the second PCB substrate (11) is located beneath the first PCB substrate (9), a heat dissipation layer (14) is provided between the first PCB substrate and the second PCB substrate, the DC dissipation layer the heat (14) being provided with a thermal conductive rubber orifice (10) connecting the first PCB substrate (9) and the second PCB substrate (11), and a heat-conductive membrane (13) is further provided under the second PCB substrate (11). 2. Dispositif de communication présentant une dissipation de chaleur améliorée selon la revendication 1, dans lequel la couche de dissipation de la chaleur (14) est constituée d'un matériau en plaque de cuivre et une pluralité de passages de dissipation de la chaleur (12) sont prévus dans la couche de dissipation de la chaleur (14).An improved heat dissipation communication device according to claim 1, wherein the heat dissipation layer (14) is made of a copper plate material and a plurality of heat dissipation passages (12). ) are provided in the heat dissipation layer (14). 3. Dispositif de communication présentant une dissipation de chaleur améliorée selon la revendication 1, dans lequel la membrane thermoconductrice (13) est formée par le traitement d'un matériau membranaire métallique.A communication device having improved heat dissipation according to claim 1, wherein the thermally conductive membrane (13) is formed by treating a metallic membrane material.