JPH09169887A - Phenolic resin composition - Google Patents
Phenolic resin compositionInfo
- Publication number
- JPH09169887A JPH09169887A JP33321195A JP33321195A JPH09169887A JP H09169887 A JPH09169887 A JP H09169887A JP 33321195 A JP33321195 A JP 33321195A JP 33321195 A JP33321195 A JP 33321195A JP H09169887 A JPH09169887 A JP H09169887A
- Authority
- JP
- Japan
- Prior art keywords
- water
- phenolic resin
- resin composition
- flame
- crystallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐水性、耐燃性、
電気特性に優れたフェノール樹脂成形材料を与えるフェ
ノール樹脂組成物に関し、特に電子部品に適したフェノ
ール樹脂組成物に関する。The present invention relates to water resistance, flame resistance,
The present invention relates to a phenol resin composition that provides a phenol resin molding material having excellent electrical characteristics, and particularly to a phenol resin composition suitable for electronic parts.
【０００２】[0002]
【従来の技術】近年、フェノール樹脂成形材料は数多く
の電子部品に使用されている。かかる部品には耐湿寸法
安定性、耐熱性、耐燃性、高強度等の特性が要求され
る。特に電子部品の小型、薄肉化に伴い、より薄い成形
品での耐熱性、耐燃性が要求されつつある。一般的に、
フェノール樹脂は自己消火性があり、難燃性の高い成形
品が得られるが、１．０ｍｍ以下の厚さの成形品となる
と、難燃性が低下し、結晶水を持つ無機充填材、塩素、
臭素といったハロゲン系難燃剤、リン酸エステル等の難
燃剤を大量に添加していた。これら難燃剤の多くは、大
量に添加すると、成形品の比重が高くなる、ブリードを
起こし外観が劣る、耐湿、耐熱性が低下する等の問題が
あり、電子部品用途への使用には限界があった。2. Description of the Related Art In recent years, phenolic resin molding materials have been used for many electronic components. Such components are required to have properties such as dimensional stability against moisture, heat resistance, flame resistance, and high strength. In particular, heat resistance and flame resistance of thinner molded products are being demanded as electronic parts become smaller and thinner. Typically,
Phenolic resin is self-extinguishing and can be molded with high flame retardancy. However, when molded products with a thickness of 1.0 mm or less, flame retardancy decreases and inorganic filler with water of crystallization, chlorine. ,
A large amount of halogen-based flame retardants such as bromine and flame retardants such as phosphoric acid esters were added. When many of these flame retardants are added, there are problems that the specific gravity of the molded product becomes high, bleeding causes poor appearance, moisture resistance, heat resistance deteriorates, etc., and its use in electronic parts is limited. there were.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、耐水性、耐
燃性、電気特性に優れ、電子部品を成形するのに適した
フェノール樹脂成形材料を提供することを目的とするも
のである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a phenol resin molding material which is excellent in water resistance, flame resistance and electric characteristics and which is suitable for molding electronic parts.
【０００４】[0004]
【課題を解決するための手段】本発明は、樹脂組成がレ
ゾール型フェノール樹脂であり、難燃剤成分として、２
００℃以上５００℃以下で結晶水を放出するフィラーを
１０〜５０ｐｈｒ、赤リンを０．２〜３ｐｈｒ含むこと
を特徴とするフェノール樹脂組成物に関するものであ
る。According to the present invention, the resin composition is a resol type phenolic resin, and 2
The present invention relates to a phenol resin composition containing 10 to 50 phr of a filler that releases crystallization water at a temperature of 00 to 500 ° C. and 0.2 to 3 phr of red phosphorus.
【０００５】フェノール樹脂としては、レゾール型樹脂
が用いられるが、硬化性の調整、耐湿性、外観改良等の
ため、ノボラック型フェノール樹脂を併用することもで
きる。難燃剤として使用される２００℃以上５００℃以
下で結晶水を放出する無機フィラーとしては、水酸化ア
ルミニウム、未焼性クレー、ほう酸亜鉛、水酸化マグネ
シウム、タルク等が挙げられる。添加量は１０〜５０ｐ
ｈｒが好ましく、更に好ましくは１５〜４０ｐｈｒが望
ましい。５０ｐｈｒ以上添加しても、耐燃性の向上は認
められず、比重が高くなる、成形性が悪くなる等の問題
が発生する。１０ｐｈｒ未満では耐燃性が充分に発揮さ
れない。 ２００℃未満で結晶水が放出するフィラーを
用いた場合は耐熱性ならびに、耐燃性特に燃焼試験時の
アフターグローが長くなる欠点がある。更に２００℃以
上５００℃以下で結晶水を放出するフィラーとして使用
される難燃剤の内、２００℃以上５００℃以下で２０ｗ
ｔ％以上の結晶水を放出するものとしては、水酸化マグ
ネシウム、水酸化アルミニウム、硼酸カルシウムといっ
たものが挙げられる。As the phenol resin, a resol type resin is used, but a novolac type phenol resin may be used together for the purpose of adjusting curability, moisture resistance, improving appearance and the like. Examples of the inorganic filler used as a flame retardant that releases crystal water at 200 ° C. or higher and 500 ° C. or lower include aluminum hydroxide, unburned clay, zinc borate, magnesium hydroxide, talc and the like. Addition amount is 10-50p
hr is preferable, and more preferably 15 to 40 phr. Even if it is added in an amount of 50 phr or more, no improvement in flame resistance is observed, and problems such as high specific gravity and poor moldability occur. If it is less than 10 phr, the flame resistance is not sufficiently exhibited. The use of a filler that releases water of crystallization at temperatures lower than 200 ° C. has a drawback that heat resistance and flame resistance, especially afterglow at the time of combustion test, become long. Further, among the flame retardants used as fillers that release water of crystallization at 200 ° C or more and 500 ° C or less, 20w at 200 ° C or more and 500 ° C or less
Examples of substances that release t% or more of water of crystallization include magnesium hydroxide, aluminum hydroxide and calcium borate.
【０００６】難燃性を付与するために使用する赤リンは
樹脂でマイクロカプセル化をしたものが好ましいが、通
常品であっても用いることが出来る。更に取り扱い時の
安全性を増すために無機フィラーと混合したマスターバ
ッチ品等も用いることが出来、この様なものとして燐化
学工業製のノーバクエルＳＴ−１００、日本化学工業製
のＰＭ−２４等がある。通常の赤リンでも耐燃性は変わ
らないが、材料混練時の発火の危険性等取り扱いの上か
らマスターバッチ品、マイクロカプセル化品等を用いる
ことが、より望ましい。赤リンの難燃性付与機構に関し
ては、数々の説があるが、赤リン自身が燃焼すること
で、ポリ燐酸系化合物をつくると考えられており、この
ポリ燐酸系化合物が成形品表面に無機質の被膜を作り耐
燃性とくに着火時のフレーミング短縮に効果を発揮す
る。添加量は０．２〜３ｐｈｒ、更に好ましくは２ｐｈ
ｒ以下が望ましい。これ以上の添加量では、赤リン自身
の燃焼性により、無添加のものよりも燃え易くなり、耐
燃性の向上は見込めない。０．２ｐｈｒ以下では効果が
小さい。The red phosphorus used for imparting flame retardancy is preferably microencapsulated with a resin, but ordinary products can also be used. Furthermore, in order to increase the safety during handling, a masterbatch product or the like mixed with an inorganic filler can also be used. is there. Although ordinary red phosphorus does not change the flame resistance, it is more preferable to use a masterbatch product, a microencapsulated product or the like in view of handling such as ignition risk when kneading materials. There are various theories regarding the mechanism of imparting flame retardancy to red phosphorus, but it is believed that the combustion of red phosphorus itself produces a polyphosphoric acid-based compound. It is effective for flame resistance, especially for shortening framing during ignition. Addition amount is 0.2 to 3 phr, more preferably 2 ph
r or less is desirable. If the amount added is more than this, the flammability of red phosphorus itself will make it more flammable than that without addition, and improvement in flame resistance cannot be expected. If it is 0.2 phr or less, the effect is small.
【０００７】材料化にあたっては、上記樹脂組成物に対
し、通常の成形材料同様に，パルプ，木粉等の有機フィ
ラー，ガラス繊維，焼性クレー，炭酸カルシウム等の無
機フィラー，消石灰，顔料，離型剤、硬化剤等を添加す
ることが出来，上記原料を均一に混合後、加圧ニーダ
ー、２軸押出し、加熱ロール等で混練し材料化すること
ができる。In forming the material, an organic filler such as pulp and wood powder, a glass fiber, a calcinable clay, an inorganic filler such as calcium carbonate, slaked lime, a pigment and A mold agent, a curing agent, etc. can be added, and the above raw materials can be uniformly mixed and then kneaded into a material by a pressure kneader, biaxial extrusion, a heating roll or the like.
【０００８】本発明のフェノール樹脂組成物から得られ
た成形材料は、耐水性、耐燃性、電気特性に優れ、電子
部品を成形するのに適し、小型、薄肉での耐燃性の要求
される電子部品用に適用できる。The molding material obtained from the phenolic resin composition of the present invention is excellent in water resistance, flame resistance, and electrical characteristics, suitable for molding electronic parts, and is required to have a small size and a thin wall. Applicable for parts.
【０００９】[0009]
【実施例】表１の上欄に示す組成配合にてフェノール樹
脂成形材料を作製した。各成形材料についてを成形品の
特性を測定し、表１の下欄に示した。EXAMPLES A phenolic resin molding material was prepared according to the composition shown in the upper column of Table 1. With respect to each molding material, the characteristics of the molded product were measured and shown in the lower column of Table 1.
【００１０】[0010]
【表１】 ［測定方法］ 吸水率，荷重たわみ温度，絶縁抵抗：ＪＩＳ Ｋ ６９１
１に準じて行う。テストピースは１７５℃で３分間トラ
ンスファ成形したものである。 ハンダ耐熱性：５０φ×３ｍｍ厚さのテストピースを１
７５℃で３分トランスファー成形し，４００℃の半田槽
に３秒間浸漬し、厚さの変化率を測定した。 耐燃性：１２．７ｍｍ×１２７ｍｍ×０．４ｍｍ厚さの
テストピースを１７５℃で３分トランスファー成形し、
ＵＬ９４垂直法に準じて、耐燃性を確認した。[Table 1] [Measurement method] Water absorption rate, deflection temperature under load, insulation resistance: JIS K 691
Perform according to 1. The test piece was formed by transfer molding at 175 ° C. for 3 minutes. Solder heat resistance: 1 test piece of 50φ x 3mm thickness
Transfer molding was performed at 75 ° C. for 3 minutes, and the resultant was immersed in a solder bath at 400 ° C. for 3 seconds, and the rate of change in thickness was measured. Flame resistance: 12.7 mm × 127 mm × 0.4 mm thick test piece is transfer molded at 175 ° C. for 3 minutes,
The flame resistance was confirmed according to the UL94 vertical method.
【００１１】[0011]
【発明の効果】以上の実施例及び比較例から明らかなよ
うに、本発明のフェノール樹脂組成物から得られた成形
材料は、耐水性、耐燃性、電気特性に優れている。特に
耐燃性、電気特性に優れており、これらの特性が要求さ
れる成形品、特に電子部品に好適である。As is apparent from the above examples and comparative examples, the molding material obtained from the phenol resin composition of the present invention is excellent in water resistance, flame resistance and electric characteristics. In particular, it has excellent flame resistance and electrical characteristics, and is suitable for molded products, particularly electronic parts, which require these characteristics.
Claims (2)
剤成分として、２００℃以上５００℃で結晶水を放出す
るフィラーを１０〜５０ｐｈｒ、赤リンを０．２〜３ｐ
ｈｒ含むことを特徴とするフェノール樹脂組成物。1. A resole-type phenol resin, as a flame retardant component, a filler that releases crystallization water at 200 ° C. to 500 ° C. is 10 to 50 phr, and red phosphorus is 0.2 to 3 p.
A phenolic resin composition containing hr.
ち、２００℃以上５００℃以下で２０重量％以上の結晶
水を放出するフィラーが、使用される全難燃剤の内少な
くとも１種類以上含む、請求項１記載のフェノール樹脂
組成物。2. Among the fillers used as the flame retardant, a filler that releases 20% by weight or more of water of crystallization at 200 ° C. or higher and 500 ° C. or lower contains at least one of all flame retardants used. The phenolic resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33321195A JPH09169887A (en) | 1995-12-21 | 1995-12-21 | Phenolic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33321195A JPH09169887A (en) | 1995-12-21 | 1995-12-21 | Phenolic resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09169887A true JPH09169887A (en) | 1997-06-30 |
Family
ID=18263566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33321195A Pending JPH09169887A (en) | 1995-12-21 | 1995-12-21 | Phenolic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09169887A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014112394A1 (en) * | 2013-01-20 | 2014-07-24 | 積水化学工業株式会社 | Flame-retardant urethane resin composition |
| JP2015078357A (en) * | 2013-09-13 | 2015-04-23 | 積水化学工業株式会社 | Flame resistant heat insulation composition |
| WO2020080148A1 (en) * | 2018-10-16 | 2020-04-23 | 旭有機材株式会社 | Semi-noncombustible phenolic-resin composition and semi-noncombustible material obtained therefrom |
| EP3835344A4 (en) * | 2018-08-10 | 2022-04-20 | Asahi Yukizai Corporation | Resin composition for phenolic foam production |
-
1995
- 1995-12-21 JP JP33321195A patent/JPH09169887A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014112394A1 (en) * | 2013-01-20 | 2014-07-24 | 積水化学工業株式会社 | Flame-retardant urethane resin composition |
| US10676559B2 (en) | 2013-01-20 | 2020-06-09 | Sekisui Chemical Co., Ltd. | Flame-retardant urethane resin composition |
| US11958931B2 (en) | 2013-01-20 | 2024-04-16 | Sekisui Chemical Co., Ltd. | Flame-retardant urethane resin composition |
| JP2015078357A (en) * | 2013-09-13 | 2015-04-23 | 積水化学工業株式会社 | Flame resistant heat insulation composition |
| EP3835344A4 (en) * | 2018-08-10 | 2022-04-20 | Asahi Yukizai Corporation | Resin composition for phenolic foam production |
| WO2020080148A1 (en) * | 2018-10-16 | 2020-04-23 | 旭有機材株式会社 | Semi-noncombustible phenolic-resin composition and semi-noncombustible material obtained therefrom |
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