JPH09105896A - Jig for manufacturing liquid crystal display element and manufacture of liquid crystal display element using the jig - Google Patents

Jig for manufacturing liquid crystal display element and manufacture of liquid crystal display element using the jig

Info

Publication number
JPH09105896A
JPH09105896A JP26537795A JP26537795A JPH09105896A JP H09105896 A JPH09105896 A JP H09105896A JP 26537795 A JP26537795 A JP 26537795A JP 26537795 A JP26537795 A JP 26537795A JP H09105896 A JPH09105896 A JP H09105896A
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
jig
substrate
display element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26537795A
Other languages
Japanese (ja)
Other versions
JP3203166B2 (en
Inventor
Yoshihiro Shirai
芳博 白井
Kenji Nishida
賢治 西田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP26537795A priority Critical patent/JP3203166B2/en
Publication of JPH09105896A publication Critical patent/JPH09105896A/en
Application granted granted Critical
Publication of JP3203166B2 publication Critical patent/JP3203166B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To make it possible to reduce the manufacturing cost of liquid crystal display elements and to stably produce the elements with the good flow property of production stages by providing the surface of a base with a UV curing type tacky adhesive for holding an electrode substrate for the liquid crystal display elements. SOLUTION: The jig 1 for producing the liquid crystal display elements (hereafter abbreviated as the jig) is the jig 1 to fluidize the production stages by supporting the electrode substrate 7 for the liquid crystal display elements on its surface. The tacky adhesive layer 3 for holding the substrate 7 stuck to the surface of the jig is composed of the UV curing type tacky adhesive 3 which is cured and lowered in adhesive power when the adhesive is irradiated UV rays. As a result, the production of the liquid crystal display elements by commonly using the conventional liquid crystal display element production line for glass is made possible even if the substrate materials which alone have no strength and rigidity are used. Further, the sufficient tacky adhesive power to the substrate 7 is assured at the time of fluidizing the production stages in the state of sticking the jig to the substrate 7 and simultaneously the substrate 7 is easily peelable from the jig 1 after the end of the production stages.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、液晶表示素子用電
極基板としてガラス基板やプラスチック基板等を用いた
液晶表示素子の製造に用いられる液晶表示素子製造用治
具及びそれを用いた液晶表示素子の製造方法に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display element manufacturing jig used for manufacturing a liquid crystal display element using a glass substrate, a plastic substrate or the like as an electrode substrate for a liquid crystal display element, and a liquid crystal display element using the jig. The present invention relates to a manufacturing method of.

【0002】[0002]

【従来の技術】従来より、液晶表示素子用電極基板とし
てのガラス基板は、表示の二重像を解消するためや、軽
量化を図るために、薄板化が検討されている。しかしな
がら、ガラス基板においては、脆さや割れ易さ等の問題
により、ガラス基板単体で製造工程を流動させる場合、
量産レベルでは0.7mm程度の薄板化が現在では限界
であり、これより薄い大型ガラス(300mm×300
mm以上)を用いた液晶表示素子の製造は困難なものと
なっている。
2. Description of the Related Art Conventionally, a glass substrate as an electrode substrate for a liquid crystal display element has been considered to be thinned in order to eliminate a double image in display and to reduce weight. However, in the case of a glass substrate, due to problems such as brittleness and fragility, when the glass substrate alone is used to flow the manufacturing process,
At the mass production level, the thinning of about 0.7 mm is currently the limit, and large glass (300 mm × 300
It has been difficult to manufacture a liquid crystal display device using a (mm or more).

【0003】一方、ガラス基板に代わり、プラスチック
基板を用いた液晶表示素子についての開発も進められて
いる。しかしながら、プラスチック基板の場合、剛性が
小さく、いわゆる腰がない、熱変形温度が低い、表面硬
度が低く傷が付き易い、加熱工程において反りや膨張収
縮等のような変形を生じ易い等により、プラスチック基
板単体で製造工程を流動させる場合とロール状で連続的
に製造工程を流動させる場合とのいずれの場合も、液晶
表示素子の製造はガラス基板を用いる場合に比べ、さら
に困難なものとなっている。
On the other hand, a liquid crystal display device using a plastic substrate instead of the glass substrate is being developed. However, in the case of a plastic substrate, the rigidity is low, so-called stiffness, the heat deformation temperature is low, the surface hardness is low, scratches are likely to occur, and deformation such as warpage or expansion / contraction is likely to occur in the heating process. In both cases of flowing the manufacturing process with the substrate alone and continuously flowing the manufacturing process in a roll shape, the manufacturing of the liquid crystal display element becomes more difficult as compared with the case of using the glass substrate. There is.

【0004】そこで、例えば特開昭60−41018号
公報では、プラスチック基板を額縁状の枠に固定した形
で液晶表示素子の製造工程を流動させる方法が提案され
ている。
Therefore, for example, Japanese Patent Application Laid-Open No. 60-41018 proposes a method in which the manufacturing process of a liquid crystal display device is made to flow with a plastic substrate fixed to a frame-shaped frame.

【0005】また、特開平3−5718号公報には、さ
らに、離型フィルム上にプラスチック基板となる高分子
樹脂を積層した形態で製造する方法も開示されている。
上記の離型フィルムは、支持体であるフィルム上に離型
剤としてシリコン系の樹脂を塗布して形成されている。
Further, Japanese Patent Laid-Open No. 3-5718 discloses a method of manufacturing a release film on which a polymer resin serving as a plastic substrate is laminated.
The release film is formed by applying a silicon-based resin as a release agent on the film that is a support.

【0006】なお、上記のシリコン系樹脂、例えばシリ
コーンは、一般用離型剤として種々の用途に用いられ、
オイル型、ペースト型、溶液型、焼付型、エマルジョン
型、水溶性型、スプレー型等に分類される。そして、例
えばシールの剥離紙には、シール粘着面に対する剥離性
向上を目的として、剥離紙表面に離型層として上記のシ
リコーンが用いられ、また、例えば樹脂成型等において
も、成型体を金型より簡便に離型させるための離型剤と
して使用されている。このように離型剤として使用され
るシリコーンは、それ自身には粘着力は無いか、もしく
はあっても非常に弱くして使用されている。
The above-mentioned silicone resin, for example, silicone is used as a general-purpose releasing agent for various purposes.
It is classified into oil type, paste type, solution type, baking type, emulsion type, water-soluble type, spray type and the like. Then, for example, in the release paper of the seal, the above silicone is used as a release layer on the surface of the release paper for the purpose of improving the releasability to the adhesive surface of the seal. It is used as a release agent for more convenient release. As described above, the silicone used as a release agent has no adhesive force by itself, or has a very weak adhesive force.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、前記し
たプラスチック基板を額縁状の枠に固定した形で製造す
る方法では、プラスチック基板が額縁の内部でたわみ、
表面平坦性の確保が困難となる。この場合、液晶表示素
子製造工程中の各種印刷装置や露光装置等では、額縁内
部の平坦性補助のために、例えば特殊なステージ形状の
設計等が必要となり、このため、装置コストが高くな
り、さらにガラス基板との互換性が得られない。さら
に、プラスチック基板を支持体から剥離することが困難
であり、支持体から剥離した後のプラスチック基板に粘
着剤が残留してしまう等の課題を有している。
However, in the method of manufacturing the above-described plastic substrate fixed to a frame-shaped frame, the plastic substrate bends inside the frame,
It becomes difficult to secure the surface flatness. In this case, in various printing devices and exposure devices during the liquid crystal display element manufacturing process, in order to assist the flatness inside the frame, for example, it is necessary to design a special stage shape, which increases the device cost. Furthermore, compatibility with the glass substrate cannot be obtained. Further, there is a problem that it is difficult to peel the plastic substrate from the support, and the adhesive remains on the plastic substrate after peeling from the support.

【0008】一方、離型フィルム上にプラスチック基板
となる高分子樹脂を積層した形態での液晶表示素子の製
造方法では、以下のような課題を有している。まず、離
型フィルム等の支持体の剛性が低く、製造工程の流動性
が悪いという課題を有している。
On the other hand, the method of manufacturing a liquid crystal display device in which a polymer resin serving as a plastic substrate is laminated on a release film has the following problems. First, there is a problem that the rigidity of the support such as the release film is low and the fluidity in the manufacturing process is poor.

【0009】さらに、使用できる製造工程、装置及び条
件がかなり限定されるという課題を有している。特に、
可撓性を有するプラスチック基板では、その材質や厚み
によって吸着ステージの穴や溝に沿う変形が生じ易い。
このため、印刷不良や配向処理不良が発生する他、オフ
セット印刷機の版に巻き込まれたり、また、印刷直後の
仮乾燥の際、例えばホットプレート上で基板が熱によっ
て湾曲し、いわゆる、踊ってしまうことになって、安定
した乾燥が行えない。
Further, there is a problem that the manufacturing processes, equipment and conditions that can be used are considerably limited. Especially,
A flexible plastic substrate is likely to be deformed along the holes and grooves of the suction stage depending on its material and thickness.
For this reason, in addition to printing defects and orientation processing defects, the substrate may be caught in a plate of an offset printing machine, or during temporary drying immediately after printing, the substrate may be bent by heat on a hot plate, for example, so-called dance As a result, stable drying cannot be performed.

【0010】さらに、離型フィルムと高分子樹脂の密着
性が低いため、密着力の面で安定した流動性が得られ
ず、また、特に加熱処理が行われる場合に、離型フィル
ムと高分子樹脂の界面に気泡、または部分的な剥離が発
生し、以降の工程処理が行えないという課題を有してい
る。
Further, since the adhesiveness between the release film and the polymer resin is low, stable fluidity cannot be obtained in terms of adhesive force, and particularly when heat treatment is performed, the release film and the polymer resin There is a problem that bubbles or partial peeling occurs at the interface of the resin, and the subsequent process treatment cannot be performed.

【0011】本発明は、上記した従来の問題点に鑑みな
されたものであって、液晶表示素子の製造コストを低減
することが可能であり、かつ、製造工程流動性が良好で
安定した製造を行い得ると共に、さらに、液晶表示素子
の性能を向上し得る液晶表示素子製造用治具及びそれを
用いた液晶表示素子の製造方法を提供することを目的と
している。
The present invention has been made in view of the above-mentioned conventional problems, and it is possible to reduce the manufacturing cost of a liquid crystal display element, and to achieve stable manufacturing with good manufacturing process fluidity. An object of the present invention is to provide a jig for manufacturing a liquid crystal display element that can be performed and further improve the performance of the liquid crystal display element, and a method for manufacturing a liquid crystal display element using the jig.

【0012】[0012]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明の請求項1記載の液晶表示素子製造用治具
(以下、治具と略記する)は、表面に液晶表示素子用電
極基板(以下、基板と略記する)を支持して製造工程を
流動される治具であって、表面に貼り付けられる基板を
保持するための粘着層が、紫外線を照射することにより
硬化して粘着力が低下する紫外線硬化型粘着剤により構
成されていることを特徴としている。
In order to achieve the above object, a jig for producing a liquid crystal display element according to claim 1 of the present invention (hereinafter abbreviated as a jig) is used for a liquid crystal display element. A jig for supporting an electrode substrate (hereinafter abbreviated as a substrate) and flowing through the manufacturing process, wherein an adhesive layer for holding the substrate attached to the surface is cured by irradiating with ultraviolet rays. It is characterized in that it is composed of an ultraviolet curable adhesive whose adhesive strength is reduced.

【0013】請求項2記載の液晶表示素子の製造方法
は、請求項1記載の治具に基板を貼り付け、次いで、液
晶表示素子の製造工程を流動させることにより、治具に
貼り付けられた基板に対して液晶表示素子形成処理を順
次行い、所定の工程を終了後、粘着層に紫外線を照射す
ることにより、粘着層を硬化させて粘着力を低下させ、
治具から基板を剥離することを特徴としている。
According to a second aspect of the present invention, there is provided a method of manufacturing a liquid crystal display element, wherein the substrate is attached to the jig according to the first aspect, and then the manufacturing process of the liquid crystal display element is allowed to flow to be attached to the jig. The liquid crystal display element forming process is sequentially performed on the substrate, and after the predetermined steps are finished, the adhesive layer is irradiated with ultraviolet rays to cure the adhesive layer and reduce the adhesive strength,
The feature is that the substrate is peeled from the jig.

【0014】本発明の治具は、液晶表示素子の製造工程
を流動させる際の取り扱いに必要な剛性を有する素材、
例えば所定の厚さを有するガラス板やプラスチック板等
から成る支持体上に、紫外線を照射することにより硬化
して粘着力が低下する紫外線硬化型粘着剤による粘着層
を形成することが望ましい。支持体として用いるガラス
板は、研磨ガラスである必要がなく、安価なものを用い
ることができる。
The jig of the present invention is made of a material having a rigidity necessary for handling when fluidizing a manufacturing process of a liquid crystal display element,
For example, it is desirable to form a pressure-sensitive adhesive layer of a UV-curable pressure-sensitive adhesive that is cured by irradiation with ultraviolet rays to reduce the adhesive strength on a support made of a glass plate, a plastic plate or the like having a predetermined thickness. The glass plate used as the support does not need to be a polished glass, and an inexpensive one can be used.

【0015】前記治具に、薄板状のガラス基板やプラス
チック基板等を貼り付けて液晶表示素子の製造工程を流
動させることで、単体では強度や剛性のない基板材料を
用いても、従来のガラス用液晶表示素子製造ラインを共
用して、液晶表示素子を製造することが可能となる。例
えば、厚さ1.1mmのガラスを流動させていた液晶表
示素子製造ラインでは、支持体として厚さ0.7mmの
ものを用いて、基板として0.4mmのものを用いれ
ば、治具と基板の総厚は1.1mmとなり、装置の設定
をほとんど変更する必要がない。
By adhering a thin glass substrate or a plastic substrate to the jig to flow the manufacturing process of the liquid crystal display device, even if a substrate material that is not strong or rigid by itself is used, the conventional glass is used. The liquid crystal display device manufacturing line can be shared to manufacture the liquid crystal display device. For example, in a liquid crystal display element manufacturing line in which glass having a thickness of 1.1 mm is flowing, if a support having a thickness of 0.7 mm is used and a substrate having a thickness of 0.4 mm is used, a jig and a substrate can be used. The total thickness is 1.1 mm, and there is almost no need to change the setting of the device.

【0016】前記のような粘着層としては、基板を貼り
付けた状態で製造工程を流動させる際に、基板に対する
充分な粘着力が確保されると同時に、製造工程終了後
は、基板を簡単に治具から剥離できることが必要であ
る。このような材料としては、半導体集積回路の製造工
程における、ウェハ上の多数のICをチップ単位に切断
分離する際に用いるもので、アクリル系材料からなる紫
外線硬化型粘着テープ等が好適である。例えば、古河電
気工業株式会社製の半導体用UVテープであるSPシリ
ーズやUCシリーズが好適である。特に、SPシリーズ
は耐酸性にも優れているため、ウエットエッチングにも
問題なく使用することができる。
The adhesive layer as described above ensures a sufficient adhesive force to the substrate when the manufacturing process is made to flow while the substrate is attached, and at the same time, after the manufacturing process is completed, the substrate can be easily adhered. It is necessary to be able to peel from the jig. As such a material, a UV curable adhesive tape made of an acrylic material or the like is suitable for use in cutting and separating a large number of ICs on a wafer into chips in a semiconductor integrated circuit manufacturing process. For example, SP series and UC series, which are UV tapes for semiconductors manufactured by Furukawa Electric Co., Ltd., are suitable. In particular, since the SP series has excellent acid resistance, it can be used for wet etching without any problem.

【0017】本発明の液晶表示素子の製造方法は、液晶
表示素子の製造工程における絶縁膜や配向膜等の印刷工
程を基板が治具に貼り付いている状態で行う。これら印
刷工程では、非常に均一な印刷性が必要である。そこ
で、ある程度の剛性を有する治具に基板が貼り付いた状
態で支持されていることによって、特にプラスチック基
板の場合に発生しやすかった印刷ステージの吸着穴や溝
に沿った変形が抑えられ、良好な印刷性が確保される。
また、治具における粘着層の粘着力をある程度以上に設
定することで、印刷の際、プラスチック基板が印刷ロー
ラーに巻き込まれることも防止される。
In the method of manufacturing a liquid crystal display device of the present invention, the printing process of the insulating film, the alignment film and the like in the manufacturing process of the liquid crystal display device is performed with the substrate attached to the jig. These printing processes require very uniform printability. Therefore, by supporting the substrate in a state that it is attached to a jig that has a certain degree of rigidity, deformation along the suction holes and grooves of the printing stage, which was likely to occur especially in the case of plastic substrates, can be suppressed, and it is good. Secure printability.
Further, by setting the adhesive force of the adhesive layer in the jig to a certain level or more, it is possible to prevent the plastic substrate from being caught in the printing roller during printing.

【0018】さらに、絶縁膜や配向膜形成時の乾燥工程
を基板が前記治具に貼り付いている状態で行う。絶縁膜
や配向膜形成工程では、前記した印刷の直後に仮乾燥を
行い、次いで本乾燥を行うが、ある程度の剛性を有する
治具に基板が貼り付いた状態であることにより、例えば
ホットプレート上の熱によるプラスチック基板の踊りが
防止される。
Further, the drying process for forming the insulating film and the alignment film is performed with the substrate attached to the jig. In the step of forming the insulating film and the alignment film, temporary drying is performed immediately after the printing described above, and then main drying is performed. However, since the substrate is attached to a jig having a certain degree of rigidity, for example, on a hot plate. The plastic substrate is prevented from dancing due to the heat.

【0019】[0019]

【発明の実施の形態】本発明の実施の形態を図1乃至図
3を用いて以下の通り説明する。図1に示すように、本
発明に係わる液晶表示素子製造用治具(以下、治具と略
記する)1は、平板状の支持体2の表面に粘着層3を設
けて構成されている。支持体2は、300mm×300
mmで厚さ0.7mmの透明なガラス板から成り、粘着
層3は、アクリル系材料からなる紫外線硬化型粘着剤か
ら成っている。
DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. As shown in FIG. 1, a liquid crystal display device manufacturing jig (hereinafter abbreviated as a jig) 1 according to the present invention is configured by providing an adhesive layer 3 on a surface of a flat plate-like support 2. Support 2 is 300 mm x 300
It is made of a transparent glass plate having a thickness of 0.7 mm and a thickness of 0.7 mm, and the adhesive layer 3 is made of an ultraviolet curable adhesive made of an acrylic material.

【0020】本発明の治具1は、図2に示すように、ポ
リオレフィン等からなるプラスチックフィルム4上に、
粘着層3としてのアクリル系材料からなる紫外線硬化型
粘着剤を形成した紫外線硬化型粘着テープ5を、支持体
2としてのガラス板の表面に接着剤6を介して貼り付け
た構成にしてもかまわない。また、支持体2としてのガ
ラス板は、基板7と同じ外形サイズ(厚さは除く)でも
かまわないし、支持体2に基板7を貼りつける際の位置
合わせ精度を考慮して、支持体2を基板7に対して縦横
とも2mm程度大きいサイズにしてもかまわない。
As shown in FIG. 2, the jig 1 of the present invention comprises a plastic film 4 made of polyolefin, etc.
The ultraviolet curable adhesive tape 5 having the ultraviolet curable adhesive made of an acrylic material as the adhesive layer 3 may be attached to the surface of the glass plate as the support 2 with the adhesive 6 interposed therebetween. Absent. Further, the glass plate as the support 2 may have the same outer shape size (excluding the thickness) as the substrate 7, and the support 2 may be taken into consideration in consideration of alignment accuracy when the substrate 7 is attached to the support 2. The size may be about 2 mm larger in both length and width than the substrate 7.

【0021】次に、液晶表示素子の製造工程における前
記治具1の使用形態について説明する。まず、図3に示
すように、治具1における粘着層3の表面に、300m
m×300mmで厚さ0.4mmのアクリル系樹脂より
成るプラスチック基板7を貼り付けた。この時、プラス
チック基板7には、透明導電膜が形成されていてもかま
わないし、治具1にプラスチック基板7を貼り付けた状
態で、マグネトロンスパッタリング等により透明導電膜
を形成してもかまわない。しかし、治具1にプラスチッ
ク基板7を貼り付けた状態で透明導電膜を形成する場合
には、粘着層3であるアクリル系材料からなる紫外線硬
化型粘着剤の耐熱性が60℃程度であるため、高透明
度、低抵抗値、耐クラック性が良好な透明導電膜が必要
な場合には、プラスチック基板7単体で透明導電膜を形
成したものを治具1に貼り付けて以下の製造工程を流動
させることが望ましい。
Next, the usage of the jig 1 in the manufacturing process of the liquid crystal display element will be described. First, as shown in FIG. 3, on the surface of the adhesive layer 3 in the jig 1, 300 m
A plastic substrate 7 made of acrylic resin having a size of m × 300 mm and a thickness of 0.4 mm was attached. At this time, the transparent conductive film may be formed on the plastic substrate 7, or the transparent conductive film may be formed by magnetron sputtering or the like with the plastic substrate 7 attached to the jig 1. However, when the transparent conductive film is formed with the plastic substrate 7 attached to the jig 1, the heat resistance of the UV-curable pressure-sensitive adhesive made of an acrylic material, which is the pressure-sensitive adhesive layer 3, is about 60 ° C. When a transparent conductive film having high transparency, low resistance value, and good crack resistance is required, the transparent conductive film formed by the plastic substrate 7 alone is attached to the jig 1 and the following manufacturing process is performed. It is desirable to let

【0022】次に、フォトレジスト塗布、フォトレジス
ト乾燥、フォトレジスト感光、フォトレジスト現像、エ
ッチング、フォトレジスト剥離という一般的なウエット
エッチング法により、透明電極パターンを形成した。こ
の時、フォトレジスト乾燥は、粘着層3の耐熱性以下の
温度によって行えば問題は発生しない。また、フォトレ
ジスト感光時に紫外線を照射するが、フォトレジスト塗
布面から紫外線を照射するので、フォトレジストが紫外
線を吸収し、紫外線硬化型粘着剤である粘着層3が硬化
してしまうことはない。さらに、エッチングについて
も、耐酸性に優れた紫外線硬化型粘着剤を粘着層3に用
いれば問題は発生しない。
Next, a transparent electrode pattern was formed by a general wet etching method such as photoresist coating, photoresist drying, photoresist exposure, photoresist development, etching, and photoresist stripping. At this time, if the photoresist is dried at a temperature lower than the heat resistance of the adhesive layer 3, no problem will occur. Further, although ultraviolet rays are radiated when the photoresist is exposed to light, since the ultraviolet rays are radiated from the photoresist coating surface, the photoresist does not absorb the ultraviolet rays and the adhesive layer 3, which is an ultraviolet curable adhesive, is not cured. Further, with respect to etching, no problem will occur if an ultraviolet curable adhesive having excellent acid resistance is used for the adhesive layer 3.

【0023】次に、フレキソ印刷法により配向膜を印刷
し、ホットプレートを用いて70℃で3分間の設定によ
り配向膜の仮乾燥を行った。この時、ホットプレートを
用いて70℃で3分間程度の設定であれば、粘着層3と
して用いている紫外線硬化型粘着剤の温度は、耐熱温度
である60℃に達することはない。
Next, the alignment film was printed by a flexographic printing method, and the alignment film was provisionally dried by using a hot plate at 70 ° C. for 3 minutes. At this time, if the temperature is set to 70 ° C. for about 3 minutes using a hot plate, the temperature of the UV-curable adhesive used as the adhesive layer 3 does not reach the heat resistant temperature of 60 ° C.

【0024】次に、図4に示すように、治具1のプラス
チック基板7を貼り付けていない側の面から、1000
mJ/cm2の紫外線8を照射し、治具1からプラスチ
ック基板7を剥離した。この時、治具1のプラスチック
基板7を貼り付けていない側の面は、支持体2として透
明なガラス板を用いているので、紫外線8を透過するこ
とができ、紫外線硬化型粘着剤である粘着層3を硬化さ
せて粘着力を低下させることができる。
Next, as shown in FIG. 4, from the surface of the jig 1 on which the plastic substrate 7 is not attached, 1000
The plastic substrate 7 was peeled from the jig 1 by irradiating with ultraviolet rays 8 of mJ / cm 2 . At this time, since the transparent glass plate is used as the support 2 on the surface of the jig 1 on which the plastic substrate 7 is not attached, it is possible to transmit the ultraviolet rays 8 and it is an ultraviolet curing adhesive. The adhesive layer 3 can be cured to reduce the adhesive strength.

【0025】その後、プラスチック基板7単体で配向膜
の本乾燥、ラビング法による配向処理、スクリーン印刷
法によるシール印刷、散布法によるスペーサー散布、ホ
ットプレス法による貼り合わせ、パネル単品への分断、
液晶注入等の一般的な製造工程を流動させ、液晶表示素
子を得た。
Thereafter, the plastic substrate 7 alone is subjected to the main drying of the alignment film, the alignment treatment by the rubbing method, the seal printing by the screen printing method, the spacer dispersion by the spraying method, the bonding by the hot pressing method, the division into the panel single product,
A general manufacturing process such as liquid crystal injection was performed to obtain a liquid crystal display device.

【0026】[0026]

【発明の効果】以上の説明のように、本発明の請求項1
記載の液晶表示素子製造用治具(以下、治具と略記す
る)は、表面に基板を支持して製造工程を流動される治
具であって、表面に貼り付けられる基板を保持するため
の粘着層が、紫外線を照射することにより硬化して接着
力が低下する紫外線硬化型粘着剤により構成されてい
る。
As described above, according to the first aspect of the present invention,
The described liquid crystal display device manufacturing jig (hereinafter, abbreviated as a jig) is a jig that supports a substrate on the surface and flows through the manufacturing process, and is for holding a substrate to be attached to the surface. The pressure-sensitive adhesive layer is composed of a UV-curable pressure-sensitive adhesive that is cured by irradiation with ultraviolet rays to reduce the adhesive strength.

【0027】これにより、単体では強度や剛性のない基
板材料を用いても、従来のガラス用液晶表示素子製造ラ
インを共用して、液晶表示素子を製造することが可能と
なる。さらに、基板を貼り付けた状態で製造工程を流動
させる際に、基板に対する充分な粘着力が確保されると
同時に、製造工程終了後は、基板を簡単に治具から剥離
できる。さらに、基板を治具から剥離した後、支持体か
ら粘着層を剥離すれば、支持体を再利用することも可能
である。
As a result, it is possible to manufacture a liquid crystal display element by sharing a conventional glass liquid crystal display element manufacturing line, even if a substrate material having no strength or rigidity is used by itself. Further, when the manufacturing process is made to flow while the substrate is attached, sufficient adhesive force to the substrate is secured, and at the same time, the substrate can be easily separated from the jig after the manufacturing process is completed. Furthermore, after peeling the substrate from the jig and then peeling the adhesive layer from the support, the support can be reused.

【0028】請求項2記載の液晶表示素子の製造方法
は、請求項1記載の治具に基板を貼り付け、次いで、液
晶表示素子の製造工程を流動させることにより、治具に
貼り付けられた基板に対して液晶表示素子形成処理を順
次行い、所定の工程を終了後、治具から基板を剥離する
ことを特徴としている。
According to a second aspect of the present invention, there is provided a liquid crystal display element manufacturing method, wherein the substrate is attached to the jig according to the first aspect, and then the liquid crystal display element production process is flowed to attach the substrate to the jig. The liquid crystal display element forming process is sequentially performed on the substrate, and after the predetermined steps are completed, the substrate is peeled from the jig.

【0029】これにより、ある程度の剛性を有する治具
に基板が貼り付いた状態で支持されていることによっ
て、特にプラスチック基板の場合に発生しやすかった印
刷ステージの吸着穴や溝に沿った変形が抑えられ、良好
な印刷性を確保することができる。
As a result, since the substrate is supported in a state in which it is attached to a jig having a certain degree of rigidity, the deformation along the suction holes or grooves of the printing stage, which is likely to occur particularly in the case of a plastic substrate, occurs. It can be suppressed and good printability can be secured.

【0030】さらに、治具における粘着層の粘着力をあ
る程度以上に設定することで、印刷の際、プラスチック
基板が印刷ローラーに巻き込まれることを防止すること
ができる。
Furthermore, by setting the adhesive force of the adhesive layer in the jig to a certain level or more, it is possible to prevent the plastic substrate from being caught in the printing roller during printing.

【0031】さらに、絶縁膜や配向膜形成工程では、前
記した印刷の直後に仮焼成を行い、次いで本焼成を行う
が、ある程度の剛性を有する治具に基板が貼り付いた状
態であることにより、例えばホットプレート上の熱によ
るプラスチック基板の踊りが防止される。
Further, in the step of forming the insulating film and the alignment film, the preliminary baking is performed immediately after the printing described above, and then the main baking is performed. However, since the substrate is attached to the jig having a certain degree of rigidity, , The plastic substrate is prevented from dancing due to heat on the hot plate, for example.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態に係わる液晶表示素子製造
用治具を示す断面模式図である。
FIG. 1 is a schematic cross-sectional view showing a jig for manufacturing a liquid crystal display element according to an embodiment of the present invention.

【図2】本発明の他の実施の形態に係わる液晶表示素子
製造用治具を示す断面模式図である。
FIG. 2 is a schematic cross-sectional view showing a jig for manufacturing a liquid crystal display element according to another embodiment of the present invention.

【図3】液晶表示素子製造用治具に液晶表示素子用電極
基板を貼り付けた状態を示す断面模式図である。
FIG. 3 is a schematic cross-sectional view showing a state in which a liquid crystal display element electrode substrate is attached to a liquid crystal display element manufacturing jig.

【図4】液晶表示素子製造用治具に液晶表示素子用電極
基板を貼り付けた状態で、液晶表示素子の製造工程を流
動させる時の模式図である。
FIG. 4 is a schematic diagram when a manufacturing process of a liquid crystal display element is performed in a state where an electrode substrate for a liquid crystal display element is attached to a jig for manufacturing a liquid crystal display element.

【符号の説明】[Explanation of symbols]

1 液晶表示素子製造用治具 2 支持体(ガラス) 3 粘着層(紫外線硬化型粘着剤) 4 プラスチックフィルム 5 紫外線硬化型粘着テープ 6 接着剤 7 液晶表示素子用電極基板 8 紫外線 1 jig for manufacturing liquid crystal display element 2 support (glass) 3 adhesive layer (ultraviolet curing adhesive) 4 plastic film 5 ultraviolet curing adhesive tape 6 adhesive 7 liquid crystal display electrode substrate 8 ultraviolet

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 液晶表示素子用電極基板を保持して液晶
表示素子の製造を行うための治具において、液晶表示素
子用電極基板を保持するための手段として紫外線硬化型
粘着剤が支持体上に設けられていることを特徴とする液
晶表示素子製造用治具。
1. A jig for holding a liquid crystal display element electrode substrate to manufacture a liquid crystal display element, wherein an ultraviolet curable adhesive is used as a means for holding the liquid crystal display element electrode substrate on a support. A jig for manufacturing a liquid crystal display element, the jig being provided in.
【請求項2】 請求項1における液晶表示素子製造用治
具を用いて、液晶表示素子用電極基板に所定の加工を施
した後、紫外線硬化型粘着剤に紫外線を照射することに
より、前記紫外線硬化型粘着剤の粘着力を低下させ、前
記液晶表示素子用電極基板を前記液晶表示素子製造用治
具から剥離することを特徴とする液晶表示素子の製造方
法。
2. The ultraviolet ray is produced by irradiating the ultraviolet ray curable pressure sensitive adhesive with ultraviolet rays after subjecting the electrode substrate for the liquid crystal display element to predetermined processing using the jig for producing a liquid crystal display element according to claim 1. A method for producing a liquid crystal display element, which comprises reducing the adhesive force of a curable adhesive to separate the electrode substrate for a liquid crystal display element from the jig for producing a liquid crystal display element.
JP26537795A 1995-10-13 1995-10-13 Jig for manufacturing liquid crystal display element and method for manufacturing liquid crystal display element using the same Expired - Fee Related JP3203166B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26537795A JP3203166B2 (en) 1995-10-13 1995-10-13 Jig for manufacturing liquid crystal display element and method for manufacturing liquid crystal display element using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26537795A JP3203166B2 (en) 1995-10-13 1995-10-13 Jig for manufacturing liquid crystal display element and method for manufacturing liquid crystal display element using the same

Publications (2)

Publication Number Publication Date
JPH09105896A true JPH09105896A (en) 1997-04-22
JP3203166B2 JP3203166B2 (en) 2001-08-27

Family

ID=17416343

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3203166B2 (en)

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US9963382B2 (en) 2013-07-26 2018-05-08 Corning Precision Materials Co., Ltd. Method for handling ultra-thin glass for display panel
CN105431393B (en) * 2013-07-26 2019-08-23 康宁精密素材株式会社 Method of the processing for the ultra-thin glass of display panel
TWI549159B (en) * 2013-12-25 2016-09-11 Asahi Glass Co Ltd A packing method with a substrate having an adsorbent layer and a packer and a packing device having a substrate having an adsorbent layer
JP2014211638A (en) * 2014-05-22 2014-11-13 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP2017108147A (en) * 2017-01-17 2017-06-15 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
KR20200120645A (en) 2018-02-14 2020-10-21 오사카 유키가가쿠고교 가부시키가이샤 Curable resin composition for forming cured resin film with heat resistance and easy peelability, and method for producing same
JP2018142721A (en) * 2018-04-27 2018-09-13 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP2019035986A (en) * 2018-11-22 2019-03-07 株式会社半導体エネルギー研究所 Method of manufacturing electronic apparatus
CN110082378A (en) * 2019-05-14 2019-08-02 海城海鸣矿业有限责任公司 A kind of test of refractories sample introduction mold
CN114141810A (en) * 2021-11-30 2022-03-04 深圳市华星光电半导体显示技术有限公司 Preparation method of display substrate and display panel

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