JPH08505001A - 電気的接続構造及びその電気的接続方法 - Google Patents
電気的接続構造及びその電気的接続方法Info
- Publication number
- JPH08505001A JPH08505001A JP7505740A JP50574095A JPH08505001A JP H08505001 A JPH08505001 A JP H08505001A JP 7505740 A JP7505740 A JP 7505740A JP 50574095 A JP50574095 A JP 50574095A JP H08505001 A JPH08505001 A JP H08505001A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- electrical connection
- connection structure
- conductive film
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.少なくとも、複数の導電性端子群を備えた情報処理回路、及び該情報処理 回路に於ける複数本の導電性端子と接続された駆動回路手段とが同一のガラス基 板上に形成された情報伝達装置に於いて、該各回路間に於ける互いに対向する接 続端子部同志、或は該各回路に於ける接続端子部とこれに対向する外部入力回路 手段に於ける接続端子部との間に、接続部が形成されており、該接続部は、互い に対向する2つの電極間に形成される空間部を有しかつ該空間部は、導電性粒子 を含む異方性導電接着剤で充填されており、且つ少なくとも一方の当該電極の表 面が、導電性の膜により被覆されており、更に、当該互いに対向する2つの電極 間は、該導電性粒子による直接的、若しくは該導電性の膜を介した間接的な接合 によって導電通路が形成されており、然かも該導電性の膜の総合的厚さは、該導 電性粒子の最小径よりも薄く構成されている接続構造を特徴とする電気的接続構 造。 2.少なくとも、複数の導電性端子群を備えた情報処理回路及び、該情報処理 回路に於ける複数本の導電性端子と接続された駆動回路手段から構成された情報 伝達装置に於いて、該各回路間に於ける互いに対向する接続端子部同志、或は該 各回路に於ける接続端子部とこれに対向する適宜の外部入力回路手段に於ける接 続端子部との間に、接続部が形成されており、該接続部は、互いに対向する2つ の電極間に形成される空間部を有しかつ該空間部は、導電性粒子を含む異方性導 電接着剤で充填されており、且つ少なくとも一方の当該電極の表面が、導電性の 膜により被覆されており、更に、当該互いに対向する2つの電極間は、該導電性 粒子による直接的、若しくは該導電性の膜を介した間接的な接合によって導電通 路が形成されて おり、然かも該導電性の膜の総合的厚さは、該導電性粒子の最小径よりも薄く構 成されている事を特徴とする電気的接続構造。 3.当該対向する双方の電極の表面に、該導電性の膜が形成されている事を特 徴とする請求項1又は2記載の電気的接続構造。 4.当該対向する双方の電極の表面形成されているそれぞれの該導電性膜の厚 さの総計が該導電性粒子の最小径よりも薄くなる様に構成されている事を特徴と する請求項3記載の電気的接続構造。 5.当該導電性粒子の一部が、該導電性膜の内部に嵌合している事を特徴とす る請求項1又は2に記載の電気的接続構造。 6.当該電極は、酸化インジウムで構成されている事を特徴とする請求項1又 は2記載の電気的接続構造。 7.当該導電性膜は、半田、錫、ニッケル、金、5酸化タンタル等から選択さ れた一つの材料から構成されている事を特徴とする請求項1又は2記載の電気的 接続構造。 8.当該異方性導電接着剤に混入されている該導電性粒子の粒径は、4〜8μ mの範囲である事を特徴とする請求項1又は2記載の電気的接続構造。 9.当該異方性導電接着剤に混入されている該導電性粒子が混入されており、 所定の面積に対する粒子の分散面積で示される分布面積率が5〜20%である事を 特徴とする請求項1又は2記載の電気的接続構造。 10.当該導電性粒子は、硬質の材料で形成されており、押しつぶされる事なく 対向する電極間に存在しており、当該導電性粒子の径が、当該接続部の電極間の 間隔を決定するものである事を特徴とする請求項1又は2記載の電気的接続構造 。 11.該導電性膜が被覆されている当該電極と該導電性粒子とが接続している部 分は、当該導電性粒子が該電極と接続している部分を 中心に、当該中心部の周囲に、当該導電性粒子が該導電性膜の一部を押圧変形さ せた部分が形成される事を特徴とする請求項10記載の電気的接続構造。 12.少なくとも、複数の導電性端子群を備えた情報処理回路及び、該情報処理 回路に於ける複数本の導電性端子を接続された駆動回路手段から構成された情報 伝達装置に於いて、該各回路間に於ける互いに対向する接続端子部同志、或は該 各回路に於ける接続端子部に対向する適宜の外部入力回路手段に於ける接続端子 部との間に形成される接続部を形成するに際し、 該接続部の電極同志を、互いに対向して配置する工程、 少なくとも一方の側の接続部に於ける当該電極の表面を所定の厚さを有する導 電性の膜により被覆する工程、 当該空間部に前記した導電性膜の厚さよりも大なる径を有する導電性粒子を含 む異方性導電接着剤を充填する工程、 当該接続部に加熱状態下に、加圧処理を行い、該対向する両電極同志が、直接 当該導電性粒子と相互に接続されるか、若しくは該導電性膜を介して当該導電性 粒子と間接的に相互に接続される様に、該両接続部間の空間部の間隙を調整する 工程、 とから構成されている事を特徴とする電気的接続構造の形成方法。 13.該導電性粒子の平均直径が略5μmである事を特徴とする請求項12記載の 電気的接続構造の形成方法。 14.当該電極部の表面に形成される該導電性膜の厚さが、1乃至3μmである 事を特徴とする請求項12記載の電気的接続構造の形成方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5/204658 | 1993-07-27 | ||
JP5-204658 | 1993-07-27 | ||
JP20465893 | 1993-07-27 | ||
PCT/JP1994/001240 WO1995004387A1 (en) | 1993-07-27 | 1994-07-27 | An electrical connecting structure and a method for electrically connecting terminals to each other |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08505001A true JPH08505001A (ja) | 1996-05-28 |
JP3415845B2 JP3415845B2 (ja) | 2003-06-09 |
Family
ID=16494149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50574095A Expired - Lifetime JP3415845B2 (ja) | 1993-07-27 | 1994-07-27 | 電気的接続構造及びその電気的接続方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US5679928A (ja) |
EP (1) | EP0662256B1 (ja) |
JP (1) | JP3415845B2 (ja) |
DE (1) | DE69414686T2 (ja) |
WO (1) | WO1995004387A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3800631B2 (ja) * | 1997-02-27 | 2006-07-26 | セイコーエプソン株式会社 | 異方導電性接着剤の製造方法、接続構造体の製造方法及び液晶装置の製造方法 |
JP2011248696A (ja) * | 2010-05-28 | 2011-12-08 | Kyocera Corp | 入力装置、およびこれを備えた表示装置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996042107A1 (en) * | 1995-06-13 | 1996-12-27 | Hitachi Chemical Company, Ltd. | Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device |
WO1998015005A1 (de) * | 1996-09-30 | 1998-04-09 | Siemens Aktiengesellschaft | Mikroelektronisches bauteil in sandwich-bauweise |
WO1999038623A1 (en) * | 1998-01-30 | 1999-08-05 | Loctite Corporation | A method of forming a coating onto a non-random monolayer of particles, and products formed thereby |
JP2000058593A (ja) * | 1998-08-03 | 2000-02-25 | Nec Corp | 表面弾性波素子の実装構造及びその実装方法 |
JP4239310B2 (ja) * | 1998-09-01 | 2009-03-18 | ソニー株式会社 | 半導体装置の製造方法 |
JP3539315B2 (ja) * | 1999-06-22 | 2004-07-07 | 株式会社村田製作所 | 電子デバイス素子の実装方法、および弾性表面波装置の製造方法 |
JP2001077501A (ja) * | 1999-09-03 | 2001-03-23 | Seiko Epson Corp | フレキシブル配線基板、電気光学装置および電子機器 |
US6608258B1 (en) | 1999-11-18 | 2003-08-19 | Nortel Networks Limited | High data rate coaxial interconnect technology between printed wiring boards |
GB2365816B (en) * | 2000-08-09 | 2002-11-13 | Murata Manufacturing Co | Method of bonding conductive adhesive and electrode,and bonded structure |
TW540281B (en) * | 2001-08-09 | 2003-07-01 | Matsushita Electric Ind Co Ltd | Manufacturing method of conductive paste material and manufacturing method of printing wiring base board |
JP2003309338A (ja) * | 2002-04-15 | 2003-10-31 | Fujitsu Ltd | 基板、接続構造及び電子装置 |
TWI286381B (en) * | 2002-08-27 | 2007-09-01 | Gigno Technology Co Ltd | Multi-chip integrated module |
US7164192B2 (en) * | 2003-02-10 | 2007-01-16 | Skyworks Solutions, Inc. | Semiconductor die package with reduced inductance and reduced die attach flow out |
KR100883455B1 (ko) * | 2004-05-28 | 2009-02-16 | 몰렉스 인코포레이티드 | 가요성의 문지름 링 접촉부 |
WO2005119848A1 (en) * | 2004-05-28 | 2005-12-15 | Molex Incorporated | Flexible ring interconnection system |
TWI285357B (en) * | 2004-07-14 | 2007-08-11 | Chi Mei Optoelectronics Corp | Driving circuit of liquid crystal display device |
US7687906B2 (en) * | 2006-03-31 | 2010-03-30 | Brother Kogyo Kabushiki Kaisha | Connecting structure, method for forming bump, and method for producing device-mounting substrate |
CN101141027B (zh) * | 2007-09-20 | 2012-02-29 | 友达光电(苏州)有限公司 | 平面显示器基板的电路连接结构与其连接方法 |
KR20130091521A (ko) * | 2012-02-08 | 2013-08-19 | 삼성디스플레이 주식회사 | 이방성 도전층을 포함하는 미세 전자 소자 및 미세 전자 소자 형성 방법 |
KR102489187B1 (ko) * | 2014-10-28 | 2023-01-17 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 그 제조 방법, 및 접속 구조체 |
EP3779583B1 (en) * | 2018-04-05 | 2023-12-06 | Toppan Printing Co., Ltd. | Light control unit |
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GB2152060B (en) * | 1983-12-02 | 1987-05-13 | Osaka Soda Co Ltd | Electrically conductive adhesive composition |
JPS63249393A (ja) * | 1987-04-03 | 1988-10-17 | シャープ株式会社 | 電子部品の接続方法 |
JPH0623350B2 (ja) * | 1988-01-20 | 1994-03-30 | 信越ポリマー株式会社 | 異方導電性接着剤 |
AU612771B2 (en) * | 1988-02-26 | 1991-07-18 | Minnesota Mining And Manufacturing Company | Electrically conductive pressure-sensitive adhesive tape |
US5031308A (en) * | 1988-12-29 | 1991-07-16 | Japan Radio Co., Ltd. | Method of manufacturing multilayered printed-wiring-board |
US5235741A (en) * | 1989-08-18 | 1993-08-17 | Semiconductor Energy Laboratory Co., Ltd. | Electrical connection and method for making the same |
JPH0817109B2 (ja) * | 1989-08-18 | 1996-02-21 | 株式会社半導体エネルギー研究所 | 電気配線およびその接続方法 |
JPH0831350B2 (ja) * | 1989-10-03 | 1996-03-27 | 日本黒鉛工業株式会社 | ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法 |
US5147084A (en) * | 1990-07-18 | 1992-09-15 | International Business Machines Corporation | Interconnection structure and test method |
JPH04301817A (ja) * | 1991-03-29 | 1992-10-26 | Rohm Co Ltd | 液晶表示装置とその製造方法 |
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
JP3035021B2 (ja) * | 1991-08-29 | 2000-04-17 | 株式会社リコー | 液晶表示素子およびその製造方法 |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
-
1994
- 1994-07-27 DE DE69414686T patent/DE69414686T2/de not_active Expired - Fee Related
- 1994-07-27 US US08/403,779 patent/US5679928A/en not_active Expired - Lifetime
- 1994-07-27 JP JP50574095A patent/JP3415845B2/ja not_active Expired - Lifetime
- 1994-07-27 WO PCT/JP1994/001240 patent/WO1995004387A1/en active IP Right Grant
- 1994-07-27 EP EP94921825A patent/EP0662256B1/en not_active Expired - Lifetime
-
1997
- 1997-05-20 US US08/859,258 patent/US6101708A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3800631B2 (ja) * | 1997-02-27 | 2006-07-26 | セイコーエプソン株式会社 | 異方導電性接着剤の製造方法、接続構造体の製造方法及び液晶装置の製造方法 |
JP2011248696A (ja) * | 2010-05-28 | 2011-12-08 | Kyocera Corp | 入力装置、およびこれを備えた表示装置 |
Also Published As
Publication number | Publication date |
---|---|
DE69414686D1 (de) | 1998-12-24 |
EP0662256B1 (en) | 1998-11-18 |
JP3415845B2 (ja) | 2003-06-09 |
US6101708A (en) | 2000-08-15 |
EP0662256A1 (en) | 1995-07-12 |
DE69414686T2 (de) | 1999-05-06 |
US5679928A (en) | 1997-10-21 |
WO1995004387A1 (en) | 1995-02-09 |
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