JPH08500211A - 集積回路チップの一体化積重ね体用の非導電性端部層 - Google Patents
集積回路チップの一体化積重ね体用の非導電性端部層Info
- Publication number
- JPH08500211A JPH08500211A JP6502691A JP50269194A JPH08500211A JP H08500211 A JPH08500211 A JP H08500211A JP 6502691 A JP6502691 A JP 6502691A JP 50269194 A JP50269194 A JP 50269194A JP H08500211 A JPH08500211 A JP H08500211A
- Authority
- JP
- Japan
- Prior art keywords
- stack
- layer
- layers
- cap layer
- accessible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06524—Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 下記の構成部材を含むことを特徴とする、接近可能な平面を有しそして埋 設された一体化回路(IC)を含有する、直角平行六面体を形成する層の一体化 積重ね体: ICチップを設備した複数個の層、該各層はその接近可能な平面に多数個の電 気リード材を有する; 該積重ね体の一端部に存在するキャップ層;該キャップ層は誘電性材料から形 成され、そして内部表面と外部表面との間に延長している複数個の孔部を有する ; 該キャップ層の内部表面上の複数個のトレース材、各トレース材は孔部から該 接近可能な平面に達している; 該孔部の一つにそれぞれ配置されている、キャップ層の外部表面上の複数個の 端子; 各孔部を通って延長してトレース材を端子に連結する導電性材料;および 一個または二個以上のIC層の各電気リード材に各トレース材を連結する、該 接近可能な平面上の導電性材料。 2. 該ICチップ層を形成する材料の熱膨張係数と近似した熱膨張係数を、該 キャップ層の材料が有する、請求の範囲第1項の層の一体化積重ね体。 3. 該ICチップ層を形成する材料がシリコンでありそして該キャップ層を形 成する材料がチッ化アルミニウムである、請求の範囲第2項の層の一体化積重ね 体。 4. 第一のキャップ層から離れて該積重ね体の他端部に配置されている第二の キャップ層を更に含有し、その結果該積重ね体の両端部が誘電性材料からなる層 によって被覆されている、請求の範囲第1項の層の一体化積重ね体。 5. 連続的な金属化処理が各トレース材、該孔部を通る導電体お よび端子によって達成され、そして該連続的金属化処理が電気メッキ法によって 該キャップ層上に形成されている、請求の範囲第1項の層の一体化積重ね体。 6. 該電気メッキ工程が、該誘電性材料上に薄い金属の播種用の層を無電気的 に形成する工程、および該金属化部分を所望の厚さにする引続く電解メッキ工程 を含む、請求の範囲第5項のチップを含む層の一体化積重ね体。 7. 下記の構成部材を含むことを特徴とする、接近可能な平面を有しそして埋 設された一体化回路(IC)を含有する、直角平行六面体を形成する層の一体化 積重ね体: ICチップを設備した複数個の層、該各層はその接近可能な平面に多数個の電 気リード材を有する; 誘電性の内部および外部の表面を有するキャップ層; 外部回路との連結に用いられる、該キャップ層の外表面に形成された端子; 該接近可能な平面上に形成されそして該チップ層上の電気リード材に連結され た導電体;および 該接近可能な平面上の導電体を該キャップ層の外部表面上の個々の端子に連結 する導電体。 8. 下記の構成を更に特徴とする、請求の範囲第7項の層の一体化積重ね体: 該キャップ層はその内部表面からその外部表面上の個々の端子に延長している 複数個の孔部を有し; 複数個の導電体が該キャップ層の内部表面上に形成されており、各導電体は該 孔部の一つから該積重ね体の接近可能平而上の導体に達しており;そして 導電体は該キャップ層中の孔部を通って延長しており、該各導電体は該キャッ プ層の内部表面上に形成された導電体の一つを該層の外部表面上に形成された端 子の一つと連結している。 9. 下記の工程を含むことを特徴とする、電子回路パッケージの製造方法: ICチップから形成される複数個の層を積重ねる工程、該各層は埋設されたI C回路を有しそして該層端部に延長しているリード材を有し、そして該層のリー ド材を有する端部は接近可能な積重ね体の平面を構成している; 平らな内部表面および平らな外部表面を有する、誘電性材料の端部層を形成す る工程; 該端部層を通って延長している孔部を形成する工程; 該端部層の内部表面上に導電体を形成する工程、該各導電体は該積重ね体の接 近可能平面に該孔部の一つを連結している; 該端部層の外部表面上に端子を形成する工程、該各端子は該孔部の各一つに配 置されている; 各端子から該積重ね体の接近可能平面に達する連続した電気伝導を得るために 、該端部層中の孔部を通って延長している導電体を形成する工程; 複数個のICチップ層に該端部層を付加する工程;および 該端部層を含有する一体化した層の積重ね体を形成する工程。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88466092A | 1992-05-15 | 1992-05-15 | |
US07/884,660 | 1992-05-15 | ||
PCT/US1993/004462 WO1993023873A1 (en) | 1992-05-15 | 1993-05-05 | Non-conductive end layer for integrated stack of ic chips |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08500211A true JPH08500211A (ja) | 1996-01-09 |
JP3544974B2 JP3544974B2 (ja) | 2004-07-21 |
Family
ID=25385082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50269194A Expired - Lifetime JP3544974B2 (ja) | 1992-05-15 | 1993-05-05 | 一体化積層体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5424920A (ja) |
EP (1) | EP0596075B1 (ja) |
JP (1) | JP3544974B2 (ja) |
DE (1) | DE69330630T2 (ja) |
WO (1) | WO1993023873A1 (ja) |
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JPH0715969B2 (ja) * | 1991-09-30 | 1995-02-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | マルチチツプ集積回路パツケージ及びそのシステム |
US6714625B1 (en) * | 1992-04-08 | 2004-03-30 | Elm Technology Corporation | Lithography device for semiconductor circuit pattern generation |
US5567654A (en) * | 1994-09-28 | 1996-10-22 | International Business Machines Corporation | Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
US5592364A (en) * | 1995-01-24 | 1997-01-07 | Staktek Corporation | High density integrated circuit module with complex electrical interconnect rails |
US5763943A (en) * | 1996-01-29 | 1998-06-09 | International Business Machines Corporation | Electronic modules with integral sensor arrays |
JPH09283652A (ja) * | 1996-04-15 | 1997-10-31 | Nec Corp | 電子デバイス組立体 |
US5772835A (en) * | 1996-05-29 | 1998-06-30 | Ibm Corporation | Vacuum oven chamber for making laminated integrated circuit devices |
US5892203A (en) * | 1996-05-29 | 1999-04-06 | International Business Machines Corporation | Apparatus for making laminated integrated circuit devices |
US5772815A (en) * | 1996-05-29 | 1998-06-30 | International Business Machines Corporation | Method for making laminated integrated circuit devices |
US5735196A (en) * | 1996-05-29 | 1998-04-07 | Ibm Corporation | Apparatus for applying a force to laminated integrated circuit devices |
US5793116A (en) * | 1996-05-29 | 1998-08-11 | Mcnc | Microelectronic packaging using arched solder columns |
US5813113A (en) * | 1996-12-09 | 1998-09-29 | International Business Machines Corporation | Fixture for making laminated integrated circuit devices |
US5818107A (en) * | 1997-01-17 | 1998-10-06 | International Business Machines Corporation | Chip stacking by edge metallization |
US5903437A (en) * | 1997-01-17 | 1999-05-11 | International Business Machines Corporation | High density edge mounting of chips |
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US6215184B1 (en) * | 1998-02-19 | 2001-04-10 | Texas Instruments Incorporated | Optimized circuit design layout for high performance ball grid array packages |
US5990472A (en) * | 1997-09-29 | 1999-11-23 | Mcnc | Microelectronic radiation detectors for detecting and emitting radiation signals |
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US7440449B2 (en) * | 2000-10-06 | 2008-10-21 | Irvine Sensors Corp. | High speed switching module comprised of stacked layers incorporating t-connect structures |
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US6748994B2 (en) * | 2001-04-11 | 2004-06-15 | Avery Dennison Corporation | Label applicator, method and label therefor |
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US6734370B2 (en) * | 2001-09-07 | 2004-05-11 | Irvine Sensors Corporation | Multilayer modules with flexible substrates |
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EP1472730A4 (en) * | 2002-01-16 | 2010-04-14 | Mann Alfred E Found Scient Res | HOUSING FOR ELECTRONIC CIRCUITS WITH REDUCED SIZE |
US7777321B2 (en) * | 2002-04-22 | 2010-08-17 | Gann Keith D | Stacked microelectronic layer and module with three-axis channel T-connects |
US6806559B2 (en) * | 2002-04-22 | 2004-10-19 | Irvine Sensors Corporation | Method and apparatus for connecting vertically stacked integrated circuit chips |
US7511369B2 (en) * | 2002-04-22 | 2009-03-31 | Irvine Sensors Corp. | BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same |
AU2003256360A1 (en) * | 2002-06-25 | 2004-01-06 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
US7547623B2 (en) * | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
US7531898B2 (en) * | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
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TWI225899B (en) * | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
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JPH0217644A (ja) * | 1988-07-06 | 1990-01-22 | Hitachi Ltd | 集積回路 |
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-
1993
- 1993-05-05 EP EP93911250A patent/EP0596075B1/en not_active Expired - Lifetime
- 1993-05-05 WO PCT/US1993/004462 patent/WO1993023873A1/en active IP Right Grant
- 1993-05-05 DE DE69330630T patent/DE69330630T2/de not_active Expired - Lifetime
- 1993-05-05 JP JP50269194A patent/JP3544974B2/ja not_active Expired - Lifetime
-
1994
- 1994-04-25 US US08/232,739 patent/US5424920A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3544974B2 (ja) | 2004-07-21 |
EP0596075A1 (en) | 1994-05-11 |
DE69330630T2 (de) | 2002-06-13 |
EP0596075A4 (en) | 1994-06-15 |
US5424920A (en) | 1995-06-13 |
WO1993023873A1 (en) | 1993-11-25 |
EP0596075B1 (en) | 2001-08-22 |
DE69330630D1 (de) | 2001-09-27 |
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