JPH08314126A - Method for making photosensitive resin plate - Google Patents
Method for making photosensitive resin plateInfo
- Publication number
- JPH08314126A JPH08314126A JP7119585A JP11958595A JPH08314126A JP H08314126 A JPH08314126 A JP H08314126A JP 7119585 A JP7119585 A JP 7119585A JP 11958595 A JP11958595 A JP 11958595A JP H08314126 A JPH08314126 A JP H08314126A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- transparent substrate
- film
- plate
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はダンボール印刷、フィル
ム印刷、プレプリント印刷のような凸版印刷用の感光性
樹脂版を製造するための改良方法に関する。FIELD OF THE INVENTION The present invention relates to an improved method for producing a photosensitive resin plate for letterpress printing such as cardboard printing, film printing and preprint printing.
【０００２】[0002]
【従来の技術】一般に、液状感光性樹脂を用いて印刷版
を製造するには、先ず図１のように、透明基板１の上に
ネガフィルム３及びカバーフィルム４を重ねて置き、そ
の上に感光性樹脂５を積層し、これにベースフィルム６
とマスキングフィルム７を重ねる。その後、感光性樹脂
版の厚みを決めるためにセットされたスペーサー８、９
の上に透明基板２を乗せ、真空にてベースフィルム６と
マスキングフィルム７を透明基板２に密着させ、透明基
板２を透して活性光線を照射してレリーフ部分の基部を
形成させるためのマスキング露光を行い、次にレリーフ
部分の画像を形成させるためにレリーフ露光を透明基板
１側からネガフィルム３を介して活性光線を照射した
後、図２のようにマスキングフィルム７を取り除いて、
形成されたレリーフ部Ａ，Ｂとベースフィルム６とを固
定させるためのバック露光を透明基板２側から活性光線
を照射して行う。または、全面にレリーフの基部を形成
させるためにマスキングフィルム７を使用しないでバッ
ク露光を透明基板２側から行い、次にレリーフ形成のた
めのレリーフ露光を透明基板１側から行う方法もある。2. Description of the Related Art Generally, in order to manufacture a printing plate using a liquid photosensitive resin, a negative film 3 and a cover film 4 are first placed on a transparent substrate 1 as shown in FIG. Photosensitive resin 5 is laminated, and base film 6 is placed on it.
And masking film 7 on top. After that, spacers 8 and 9 set to determine the thickness of the photosensitive resin plate
Masking for placing the transparent substrate 2 on top of it, bringing the base film 6 and the masking film 7 into close contact with the transparent substrate 2 in a vacuum, and irradiating the transparent substrate 2 with actinic rays to form the base of the relief portion. After performing exposure, and then irradiating active light from the transparent substrate 1 side through the negative film 3 to form an image of the relief portion, the masking film 7 is removed as shown in FIG.
Back exposure for fixing the formed relief portions A and B and the base film 6 is performed by irradiating an active ray from the transparent substrate 2 side. Alternatively, there is also a method in which back exposure is performed from the transparent substrate 2 side without using the masking film 7 to form a relief base portion on the entire surface, and then relief exposure for relief formation is performed from the transparent substrate 1 side.
【０００３】次に、適当な洗剤で露光後の液状感光性樹
脂版の未硬化部分を洗い出して現像し、現像後の感光性
樹脂版に後露光及び乾燥処理を施せば、印刷版が得られ
る。従来の場合、ベースフィルムは印刷版に付いたまま
とされる。Then, the uncured portion of the liquid photosensitive resin plate after exposure is washed out with a suitable detergent and developed, and the photosensitive resin plate after development is subjected to post-exposure and drying treatment to obtain a printing plate. . Conventionally, the base film remains attached to the printing plate.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記の技
術で得られる印刷版には、通常版面画像面積すなわち印
刷時に被印刷物と接触する部分の面積の異なるレリーフ
部が含まれるが、このような印刷版においては、図３に
示す断面図のように版面画像面積の小さいレリーフ部Ｂ
（以下、小面積レリーフ部と略記する）が版面画像面積
の大きいレリーフ部Ａ（以下、大面積レリーフ部と略記
する）よりも版厚が高くなる傾向がみられ、また大面積
レリーフ部においては、その中心部が周囲部よりも低
く、陥没した状態になる傾向がある。そして、各レリー
フ部間の版厚の高低や同一レリーフ部に凹凸を生じる
と、印刷したときに大面積レリーフ部で印刷インキの着
肉が不十分になりその結果、鮮明な印刷画像が得られ難
くなり、また印刷インキの着肉を十分にするために印圧
を増加すると小面積レリーフ部が変形するため、ドット
ゲインが大きくなるのを免れない。However, the printing plate obtained by the above technique usually includes relief portions having different plate surface image areas, that is, the areas of the portions which come into contact with the material to be printed during printing. In FIG. 3, the relief portion B having a small printing plate image area as shown in the sectional view of FIG.
The plate thickness (hereinafter abbreviated as small area relief part) tends to be higher than that of the relief part A having a large plate image area (hereinafter abbreviated as large area relief part), and in the large area relief part, , Its central part is lower than the surrounding part and tends to be in a depressed state. Then, if unevenness is generated in the height of the plate thickness between the relief parts or the same relief part, when the large area relief part is printed, the inking of the printing ink becomes insufficient, and as a result, a clear printed image is obtained. Further, if the printing pressure is increased in order to make the printing ink thick enough, the small area relief portion is deformed, and the dot gain is unavoidably increased.
【０００５】そこで本発明はこのような従来方法におけ
る欠点を克服し、小面積レリーフ部の版厚の高さが大面
積レリーフ部の高さと同じで、かつ大面積レリーフ部に
おける中心部と周囲部との版厚の高低差を無くし、鮮明
でしかもドットゲインの小さい印刷画像を与える印刷用
凸版を製版する方法を提供するものである。Therefore, the present invention overcomes the drawbacks of the conventional method, the height of the plate thickness of the small-area relief portion is the same as the height of the large-area relief portion, and the central portion and the peripheral portion of the large-area relief portion are large. The present invention provides a method for making a printing relief plate which eliminates the difference in plate thickness between the plate and the plate and gives a clear print image with a small dot gain.
【０００６】[0006]
【課題を解決するための手段】すなわち本発明の製版方
法は、感光性樹脂の成型・露光時において、透明基板
１、ネガフィルム、カバーフィルム、第一層の液状感光
性樹脂を順次積層し、その上に透明フィルム又は空気層
を介して透明基板２を配置し、透明基板２側から活性光
線を照射した後に、透明基板１側からまたは両方側から
同時に活性光線を照射する第一段階と、その後、透明基
板２を取り除いて第一層の液状感光性樹脂の上に第二層
の液状感光性樹脂、ベースフィルムを順次積層し、その
上に透明基板２を直接配置し、透明基板２側より活性光
線を照射する第二段階からなる感光性樹脂版の製版方法
であり、または、感光性樹脂の成型・露光時において、
透明基板１、ネガフィルム、カバーフィルム、液状感光
性樹脂、ベースフィルムを順次積層し、その上に透明基
板２を配置し、透明基板２側より活性光線を照射した後
に透明基板１側から活性光線を照射するか、または両方
から同時に活性光線を照射し、その後、透明基板２を取
り除いてベースフィルムと液状感光性樹脂を取り出し、
その後、洗剤で露光後の液状感光性樹脂の未硬化部分を
洗い出して現像し、後露光および乾燥処理を行う感光性
樹脂版の製造方法において、早くとも後露光後にベース
フィルムを剥ぎ取る感光性樹脂版の製版方法である。[Means for Solving the Problems] That is, the plate-making method of the present invention comprises a step of sequentially laminating a transparent substrate 1, a negative film, a cover film, and a liquid photosensitive resin as a first layer during molding and exposure of the photosensitive resin, A transparent substrate 2 is arranged on it via a transparent film or an air layer, and after irradiating an active ray from the transparent substrate 2 side, an active ray is simultaneously irradiated from the transparent substrate 1 side or both sides, After that, the transparent substrate 2 is removed, the liquid photosensitive resin of the second layer and the base film are sequentially laminated on the liquid photosensitive resin of the first layer, and the transparent substrate 2 is directly arranged on the transparent substrate 2 side. It is a plate making method of a photosensitive resin plate comprising the second step of irradiating more active rays, or at the time of molding / exposure of the photosensitive resin,
A transparent substrate 1, a negative film, a cover film, a liquid photosensitive resin, and a base film are laminated in this order, a transparent substrate 2 is arranged on the transparent substrate 1, and an active ray is irradiated from the transparent substrate 2 side, and then an active ray is emitted from the transparent substrate 1 side. Or simultaneously irradiating actinic rays from both, and then removing the transparent substrate 2 to take out the base film and the liquid photosensitive resin,
After that, in the method for producing a photosensitive resin plate in which the uncured portion of the liquid photosensitive resin after exposure with a detergent is washed out and developed, and post-exposure and drying treatment is performed, the base resin is peeled off after post-exposure at the earliest. This is a plate making method.
【０００７】以下本発明をさらに詳細に説明する。本発
明方法においては、原料として液状感光性樹脂を用いる
が、例えば特公昭５２−７７６１で示されるような液状
感光性樹脂を使用する。先ず、図４のように透明基板１
の上にネガフィルム３及びカバーフィルム４を重ねて置
き、その上に第一層として液状感光性樹脂を２ｍｍ〜７
ｍｍの厚みで積層して液状感光性樹脂層１２を形成させ
る。その際、更に透明フィルム１４を液状感光性樹脂層
１２の上に積層することも出来る。その後、マスキング
フィルム７を密着配置した透明基板２を液状感光性樹脂
層５と１ｍｍ〜８０ｍｍ、好ましくは５ｍｍ〜３０ｍｍ
の空気層を保つようにセットしたスペーサー８、９の上
に乗せる。また、第一層の液状感光性樹脂層１２の上に
透明フィルム１４を積層した場合、透明基板２は液状感
光性樹脂層と空気層なく配置することが出来る。第一段
階における空気層または透明フィルムは、感光性樹脂層
と透明基板２を直接接しないために配置される。従って
透明フィルムを第一段階で用いた場合であっても、第二
段階で透明フィルムを用いる必要はなく、第二段階では
除去されることが望ましい。The present invention will be described in more detail below. In the method of the present invention, a liquid photosensitive resin is used as a raw material. For example, a liquid photosensitive resin as shown in Japanese Patent Publication No. 52-7761 is used. First, as shown in FIG. 4, the transparent substrate 1
The negative film 3 and the cover film 4 are placed on top of each other, and the liquid photosensitive resin as a first layer is placed on the negative film 3 and the cover film 4 for 2 mm to 7 mm.
The liquid photosensitive resin layer 12 is formed by laminating the liquid photosensitive resin layer 12 with a thickness of mm. At that time, the transparent film 14 may be further laminated on the liquid photosensitive resin layer 12. After that, the transparent substrate 2 on which the masking film 7 is closely arranged and the liquid photosensitive resin layer 5 are 1 mm to 80 mm, preferably 5 mm to 30 mm.
Place it on the spacers 8 and 9 set so as to maintain the air layer of. When the transparent film 14 is laminated on the liquid photosensitive resin layer 12 as the first layer, the transparent substrate 2 can be arranged without the liquid photosensitive resin layer and the air layer. The air layer or the transparent film in the first stage is arranged so as not to directly contact the photosensitive resin layer and the transparent substrate 2. Therefore, even when the transparent film is used in the first step, it is not necessary to use the transparent film in the second step, and it is desirable to remove it in the second step.
【０００８】この透明基板２側からマスキングフィルム
７を介して活性光線例えば紫外線を照射してレリーフ部
分の基部Ａ，Ｂを形成させるためのマスキング露光を行
う。マスキングフィルム７は第一層の液状感光性樹脂を
積層する前に、ネガフィルム３の画像部に合わせて位置
を決め、透明基板２に粘着テープや真空密着などにより
取り付けておくことが望ましい。なお、第一段目では、
必ずしもマスキングフィルムを用いなくともよい。透明
基板として例えばガラス板を使用する。１０，１１は液
状感光性樹脂が外周に流出するのを防ぐためのスポンジ
ダムである。次にレリーフ部分の画像Ｃ，Ｄを形成させ
るためのレリーフ露光を透明基板１側からネガフィルム
３を介して活性光線を照射して行う。Masking exposure for forming the base portions A and B of the relief portion is performed by irradiating an actinic ray such as an ultraviolet ray from the transparent substrate 2 side through the masking film 7. Prior to laminating the liquid photosensitive resin of the first layer, the masking film 7 is preferably positioned according to the image portion of the negative film 3 and attached to the transparent substrate 2 by an adhesive tape or vacuum adhesion. In addition, in the first stage,
It is not always necessary to use a masking film. For example, a glass plate is used as the transparent substrate. 10 and 11 are sponge dams for preventing the liquid photosensitive resin from flowing out to the outer circumference. Next, relief exposure for forming images C and D of the relief portion is performed by irradiating an active ray from the transparent substrate 1 side through the negative film 3.
【０００９】前記のマスキング露光とレリーフ露光は製
版時間短縮のためにその一部または全部を同時に行うこ
とも出来る。また、マスキング露光を必要としない場合
は透明基板２にはマスキングフィルム７を配置せず、透
明基板１側からのレリーフ露光のみを行う。次に第二段
階として、透明基板２とマスキングフィルム７を取り除
き、透明フィルム１４を積層してある場合は透明フィル
ムも取り除く。その後、図５のように第一層の上に第二
層として液状感光性樹脂層１３を０．５ｍｍ〜３ｍｍの
厚みで積層して、さらにその上にベースフィルム６例え
ばポリエステルフィルムを積層し、透明基板２を直接積
層する。その後、真空を利用してベースフィルム６と透
明基板２を密着させることが望ましい。The masking exposure and the relief exposure may be performed partially or entirely at the same time in order to shorten the plate making time. When the masking exposure is not required, the masking film 7 is not arranged on the transparent substrate 2 and only the relief exposure from the transparent substrate 1 side is performed. Next, as a second step, the transparent substrate 2 and the masking film 7 are removed, and when the transparent film 14 is laminated, the transparent film is also removed. Then, as shown in FIG. 5, a liquid photosensitive resin layer 13 is laminated as a second layer on the first layer to a thickness of 0.5 mm to 3 mm, and a base film 6 such as a polyester film is further laminated thereon. The transparent substrate 2 is directly laminated. After that, it is desirable to bring the base film 6 and the transparent substrate 2 into close contact with each other by utilizing vacuum.
【００１０】次に図６のように透明基板２側よりバック
露光を行い、第二層（液状感光性樹脂層１３）の厚み以
上硬化させることにより、マスキング露光（マスキング
フィルム７を使用しない場合はレリーフ露光）により硬
化した部分と第二層が接続して、感光性樹脂版を得るこ
とが出来る。その後、適当な洗剤で未硬化の液状感光性
樹脂部分を洗い出して現像し、後露光及び乾燥処理を施
せば、版厚精度の改善された感光性樹脂版を得ることが
出来る。Next, as shown in FIG. 6, back exposure is performed from the transparent substrate 2 side to cure the second layer (the liquid photosensitive resin layer 13) to a thickness not less than that of the second layer (liquid photosensitive resin layer 13), thereby exposing the masking exposure (when the masking film 7 is not used). The part cured by relief exposure) and the second layer are connected to each other to obtain a photosensitive resin plate. After that, the uncured liquid photosensitive resin portion is washed out with an appropriate detergent, developed, and subjected to post-exposure and drying treatments to obtain a photosensitive resin plate with improved plate thickness accuracy.
【００１１】また、透明基板１の上にネガフィルム３及
びカバーフィルム４を重ねて置き、その上に液状感光性
樹脂を２ｍｍ〜８ｍｍの厚みで積層し、更にその上にベ
ースフィルム６を積層し、マスキングフィルム７と透明
基板２をこの順序で配置する。その後、透明基板２側か
らマスキングフィルム７を介して活性光線例えば紫外線
を照射してレリーフ部分の基部Ａ，Ｂを形成させるため
のマスキング露光を行う。次にレリーフ部分の画像Ｃ，
Ｄを形成させるためのレリーフ露光を透明基板１側から
ネガフィルム３を介して活性光線を照射して行う。前記
のマスキング露光とレリーフ露光は製版時間短縮のため
にその一部または全部を同時に行うことも出来る。次に
透明基板２とマスキングフィルム７を取り除き、再度透
明基板２を配置して、透明基板２側よりバック露光を行
い、感光性樹脂版を得ることが出来る。なお、マスキン
グ露光を必要としない場合にはマスキングフィルム７を
配置せず、透明基板２側からのバック露光と透明基板１
側からのレリーフ露光にて感光性樹脂版を得ることが出
来る。The negative film 3 and the cover film 4 are stacked on the transparent substrate 1, the liquid photosensitive resin is laminated thereon with a thickness of 2 mm to 8 mm, and the base film 6 is further laminated thereon. The masking film 7 and the transparent substrate 2 are arranged in this order. Then, masking exposure is performed to form the bases A and B of the relief portion by irradiating the transparent substrate 2 side with an actinic ray such as an ultraviolet ray through the masking film 7. Next, the image C of the relief part,
Relief exposure for forming D is performed by irradiating an active ray from the transparent substrate 1 side through the negative film 3. The masking exposure and the relief exposure may be performed partially or wholly at the same time in order to shorten the plate making time. Next, the transparent substrate 2 and the masking film 7 are removed, the transparent substrate 2 is arranged again, and back exposure is performed from the transparent substrate 2 side to obtain a photosensitive resin plate. If masking exposure is not necessary, the masking film 7 is not placed, and the back exposure from the transparent substrate 2 side and the transparent substrate 1 are performed.
A photosensitive resin plate can be obtained by relief exposure from the side.
【００１２】このようにして得られた感光性樹脂版から
ベースフィルム６を剥がすことにより、液状感光性樹脂
が活性光線にて硬化、収縮するときに発生した内部応力
が解放され、版厚精度を改善させることが出来る。通
常、液状感光性樹脂製版に使用するベースフィルム６に
は露光により樹脂と接着するように片面に接着剤が塗布
されているが、この接着力が低すぎると現像のときにベ
ースフィルム６と感光性樹脂が剥がれてしまうため、こ
の方法で使用するベースフィルムの接着剤の接着力は１
００〜１０００ｇ／ｃｍ（１８０度法）、好ましくは３
００〜７００ｇ／ｃｍが望ましい。また、樹脂版からベ
ースフィルム６を剥がすと感光性樹脂が収縮するため、
ネガフィルム３は収縮量を考慮して作成しておかなけれ
ばならない。By peeling the base film 6 from the photosensitive resin plate thus obtained, the internal stress generated when the liquid photosensitive resin is cured and contracted by actinic rays is released, and the plate thickness accuracy is improved. Can be improved. Usually, the base film 6 used for the liquid photosensitive resin plate making is coated with an adhesive on one side so as to adhere to the resin by exposure, but if this adhesive force is too low, the base film 6 and the photosensitive film will be exposed during development. The adhesive strength of the base film used in this method is 1
00-1000 g / cm (180 degree method), preferably 3
A range of 00 to 700 g / cm is desirable. Further, when the base film 6 is peeled from the resin plate, the photosensitive resin shrinks,
The negative film 3 must be prepared in consideration of the shrinkage amount.
【００１３】ベースフィルムを剥がすのは、早くとも後
露光後であることが必要である。これ以前では、樹脂版
が十分に硬化していないからである。望ましくは後露光
後乾燥処理したあとに剥がすのが良い。透明基板の材質
としては前記したガラスのほか、アクリル樹脂、ポリカ
ーボネート樹脂、ポリ塩化ビニール樹脂などのプラスチ
ックや透明セラミックスが用いられる。It is necessary that the base film be peeled off at the earliest after the post-exposure. This is because the resin plate was not sufficiently cured before this. Desirably, it is preferable to peel off after post-exposure and drying treatment. As the material of the transparent substrate, in addition to the above-mentioned glass, plastic such as acrylic resin, polycarbonate resin, polyvinyl chloride resin, or transparent ceramics is used.
【００１４】[0014]
【作用】第一層はマスキング露光とレリーフ露光（マス
キングフィルム７を使用しない場合はレリーフ露光の
み）によって硬化収縮し、その度合いは大面積レリーフ
部のほうが小面積レリーフ部より大きくなり、厚みに変
化が発生するが、第二層の積層により硬化収縮した部分
に液状感光性樹脂が補われるため厚みが同じになる。The first layer is cured and shrunk by masking exposure and relief exposure (relief exposure only when masking film 7 is not used), and the degree of change is greater in the large area relief area than in the small area relief area and changes in thickness. However, since the liquid photosensitive resin is supplemented to the portion which is cured and shrunk due to the lamination of the second layer, the thickness becomes the same.
【００１５】図７は本発明方法により得られる感光性樹
脂版の例を示す断面図であるが、これから分かるよう
に、二段階の処理によって大面積レリーフ部の上面は陥
没したような凹部がなく平坦であり、また小面積レリー
フ部の版厚と大面積レリーフ部の版厚が同等になってい
る。もちろん、バック露光による硬化によって樹脂は収
縮するが感光性樹脂版の全面が均一に硬化するため、全
体の厚みの差は変化しない。FIG. 7 is a cross-sectional view showing an example of a photosensitive resin plate obtained by the method of the present invention. As can be seen from this, the upper surface of the large area relief portion does not have a recess like a depression due to the two-step treatment. It is flat, and the plate thickness of the small area relief part and the plate thickness of the large area relief part are equal. Of course, the resin shrinks due to curing by back exposure, but since the entire surface of the photosensitive resin plate is uniformly cured, the difference in overall thickness does not change.
【００１６】また、露光・現像・後露光・乾燥を終えた
従来の版からベースフィルム６を剥がすことによって
も、硬化収縮による内部応力がなくなるため、大面積レ
リーフ部の上面の凹部がなくなり平坦になり、更に大面
積レリーフ部と小面積レリーフ部との厚みの差が緩和さ
れる。Also, by peeling the base film 6 from the conventional plate which has been exposed, developed, post-exposed and dried, internal stress due to curing shrinkage is eliminated, and thus the concave portion on the upper surface of the large area relief portion is eliminated and flattened. Therefore, the difference in thickness between the large area relief portion and the small area relief portion is alleviated.
【００１７】[0017]
【実施例】以下の各実施例におけるレリーフ間の版厚差
ΔＴ及び大面積レリーフ内版厚差Δｔは次のように定め
る。 （１）レリーフ間の版厚差ΔＴ；全体のレリーフ部の版
厚を測定し、その最低値と最大値の差。 （２）大面積レリーフ内版厚差Δｔ；最も大きい版面画
像面積のレリーフ部を選び、その中心部と周辺部の版厚
の差。EXAMPLES The plate thickness difference ΔT between reliefs and the large area relief inner plate thickness difference Δt in the following examples are determined as follows. (1) Difference in plate thickness between reliefs ΔT: The difference between the minimum value and the maximum value of the plate thickness of the entire relief portion was measured. (2) Large-area relief inner plate thickness difference Δt: The difference in plate thickness between the central portion and the peripheral portion of the relief portion having the largest plate surface image area.
【００１８】また、大面積レリーフ部は縦５３０ｍｍ、
横２２０ｍｍの四角形ベタ、小面積レリーフ部は縦１０
ｍｍ、横１０ｍｍの四角形ベタとなっているネガフィル
ムを使用し、版の厚みはミツトヨのＤＥＧＩＭＡＴＩＣ
ＩＮＤＩＣＡＴＯＲ ＴＹＰＥ ＩＤＦ−１０３０を
使用して測定を行った。The large area relief portion is 530 mm in length.
220 mm wide square solid, small area relief is 10 vertical
mm, width 10 mm square solid negative film is used, the plate thickness is Mitutoyo's DEGIMATIC
Measurements were made using an INDICATOR TYPE IDF-1030.
【００１９】[0019]
【実施例１】高精度に研磨されたパイレックス製硬質基
板（コーニング社製）の上にネガフィルム及びカバーフ
ィルムを介して液状感光性樹脂ＡＰＲ Ｆ−４７（旭化
成工業株式会社製、登録商標）を積層して厚さ５ｍｍの
液状感光性樹脂層を形成させ、その樹脂層と１５ｍｍの
間隔を保つようにセットしたスペーサーの上にマスキン
グフィルムを密着配置したパイレックス製硬質基板を乗
せた。次に上方よりマスキングフィルムを介してマスキ
ング露光を行い、その後、下方よりネガフィルムを介し
てレリーフ露光を行った。次に上側のパイレックス製硬
質基板とマスキングフィルムを取り除き、先ほど露光を
行った液状感光性樹脂層の上に２ｍｍの液状感光性樹脂
とベースフィルムを積層し、版の厚みが７ｍｍになるよ
うにセットしたスペーサーの上にパイレックス製硬質基
板を再度乗せ、真空にてベースフィルムと上側のパイレ
ックス製硬質基板を密着させ、硬化厚みが２．５ｍｍに
なるように上方からバック露光を行った。次に露光処理
した感光性樹脂版を定法に従って洗浄液で洗い出し、現
像したのち、後露光し、乾燥することにより版厚７ｍｍ
の印刷版を得た。Example 1 A liquid photosensitive resin APR F-47 (registered trademark, manufactured by Asahi Kasei Kogyo Co., Ltd.) was placed on a hard substrate (manufactured by Corning Incorporated) made of Pyrex that had been highly accurately polished via a negative film and a cover film. A 5 mm-thick liquid photosensitive resin layer was formed by stacking, and a hard substrate made of Pyrex on which a masking film was closely arranged was placed on a spacer set so as to keep a distance of 15 mm from the resin layer. Next, masking exposure was performed from above through a masking film, and then relief exposure was performed from below through a negative film. Next, remove the Pyrex hard substrate and masking film on the upper side, stack 2 mm of the liquid photosensitive resin and the base film on the liquid photosensitive resin layer that was previously exposed, and set it so that the plate thickness is 7 mm. The Pyrex hard substrate was put on the above spacer again, the base film and the upper Pyrex hard substrate were brought into close contact with each other by vacuum, and back exposure was performed from above so that the cured thickness was 2.5 mm. Next, the exposed photosensitive resin plate is washed with a washing solution according to a standard method, developed, and then post-exposed and dried to obtain a plate thickness of 7 mm.
I got a print version of.
【００２０】表１のように、このもののΔＴは０．０８
ｍｍ、Δｔは０．０３ｍｍであった。As shown in Table 1, this product has a ΔT of 0.08.
mm and Δt were 0.03 mm.
【００２１】[0021]
【比較例１】実施例１に対応した従来の方法で厚み７ｍ
ｍの版を製造したものについてΔＴ及びΔｔを求めたと
ころ、それぞれ０．１７ｍｍ及び０．１１ｍｍであっ
た。Comparative Example 1 A thickness of 7 m was obtained by the conventional method corresponding to Example 1.
The ΔT and Δt of the manufactured m plate were 0.17 mm and 0.11 mm, respectively.
【００２２】[0022]
【実施例２】実施例１と同様の製版方法で、最初の液状
感光性樹脂層の厚みを４ｍｍとし、その上の液状感光性
樹脂層を１ｍｍにして版の厚みが５ｍｍになるように製
造した印刷版を得た。表１のように、このもののΔＴは
０．０６ｍｍ、Δｔは０．０３ｍｍであった。Example 2 The same plate-making method as in Example 1, the thickness of the first liquid photosensitive resin layer was set to 4 mm, and the liquid photosensitive resin layer thereon was set to 1 mm to produce a plate having a thickness of 5 mm. A printing plate was obtained. As shown in Table 1, this product had ΔT of 0.06 mm and Δt of 0.03 mm.
【００２３】[0023]
【比較例２】実施例２に対応した従来の方法で厚み５ｍ
ｍの版を製造したものについてΔＴ及びΔｔを求めたと
ころ、それぞれ０．１４ｍｍ及び０．０９ｍｍであっ
た。[Comparative Example 2] A thickness of 5 m by the conventional method corresponding to Example 2.
The ΔT and Δt of the manufactured m plate were 0.14 mm and 0.09 mm, respectively.
【００２４】[0024]
【実施例３】パイレックス製硬質基板の上にネガフィル
ム及びカバーフィルムを介して液状感光性樹脂Ｆ−４７
と厚さ１００μの透明ポリエステルフィルムを積層し
て、厚さ５ｍｍの液状感光性樹脂を形成させ、マスキン
グフィルムを密着配置したパイレックス製硬質基板を透
明ポリエステルフィルムと密着するようにセットされた
スペーサーの上に乗せた。次に上方よりマスキングフィ
ルムを介してマスキング露光を行い、その後、下方より
ネガフィルムを介してレリーフ露光を行った。次に上側
のパイレックス製硬質基板とマスキングフィルム、透明
ポリエステルフィルムを取り除き、先ほど露光を行った
液状感光性樹脂の上に２ｍｍの液状感光性樹脂とベース
フィルムを積層し、版の厚みが７ｍｍになるようにセッ
トしたスペーサーの上にパイレック製硬質基板を再度乗
せ、真空にてベースフィルムと上側のパイレックス製硬
質基板を密着させ、硬化厚みが２．５ｍｍになるように
上方からバック露光を行い、版厚７ｍｍの印刷版を得
た。[Example 3] Liquid photosensitive resin F-47 on a Pyrex hard substrate through a negative film and a cover film
And a transparent polyester film with a thickness of 100μ are laminated to form a liquid photosensitive resin with a thickness of 5 mm, and a Pyrex hard substrate on which a masking film is closely arranged is placed on a spacer set so as to closely adhere to the transparent polyester film. I put it on. Next, masking exposure was performed from above through a masking film, and then relief exposure was performed from below through a negative film. Next, the upper hard substrate made of Pyrex, the masking film and the transparent polyester film are removed, and 2 mm of the liquid photosensitive resin and the base film are laminated on the previously exposed liquid photosensitive resin, and the thickness of the plate becomes 7 mm. Place the Pyrex hard substrate again on the spacer set in this way, and make the base film and the upper Pyrex hard substrate adhere to each other in vacuum, and perform back exposure from above so that the cured thickness becomes 2.5 mm, and the plate A printing plate having a thickness of 7 mm was obtained.
【００２５】表１のように、このもののΔＴは０．０９
ｍｍ、Δｔは０．０４ｍｍであった。As shown in Table 1, this product has a ΔT of 0.09.
mm and Δt were 0.04 mm.
【００２６】[0026]
【比較例３】実施例３に対応した従来の方法で厚み７ｍ
ｍの版を製造したものについてΔＴ及びΔｔを求めたと
ころ、それぞれ０．１７ｍｍ及び０．１１ｍｍであっ
た。[Comparative Example 3] A thickness of 7 m by the conventional method corresponding to Example 3.
The ΔT and Δt of the manufactured m plate were 0.17 mm and 0.11 mm, respectively.
【００２７】[0027]
【実施例４】実施例３と同様の製造方法で、最初の液状
感光性樹脂層の厚みを４ｍｍとし、その上の液状感光性
樹脂層を１ｍｍにして版の厚みが５ｍｍになるように製
造した印刷版を得た。表１のように、このもののΔＴは
０．０７ｍｍ、Δｔは０．０４ｍｍであった。[Example 4] By the same manufacturing method as in Example 3, the thickness of the first liquid photosensitive resin layer was set to 4 mm, and the liquid photosensitive resin layer thereon was set to 1 mm so that the plate thickness became 5 mm. A printing plate was obtained. As shown in Table 1, this product had ΔT of 0.07 mm and Δt of 0.04 mm.
【００２８】[0028]
【比較例４】実施例４に対応した従来の方法で厚み５ｍ
ｍの版を製造したものについてΔＴ及びΔｔを求めたと
ころ、それぞれ０．１４ｍｍ及び０．０９ｍｍであっ
た。[Comparative Example 4] A thickness of 5 m by the conventional method corresponding to Example 4.
The ΔT and Δt of the manufactured m plate were 0.14 mm and 0.09 mm, respectively.
【００２９】[0029]
【実施例５】パイレックス製硬質基板の上にネガフィル
ム及びカバーフィルムを介して液状感光性樹脂Ｆ−４７
を積層して、厚さ４ｍｍの液状感光性樹脂を形成させ、
その樹脂層と１５ｍｍの間隔を保つようにセットしたス
ペーサーの上にパイレックス製硬質基板を乗せ、下方よ
りネガフィルムを介してレリーフ露光を行った。その
後、上側のパイレックス製硬質基板を取り除き、先ほど
露光を行った液状感光性樹脂の上に２．３５ｍｍの液状
感光性樹脂とベースフィルムを積層し、版の厚みが６．
３５ｍｍになるようにセットしたスペーサーの上にパイ
レックス製硬質基板を再度乗せ、真空にてベースフィル
ムと上側のパイレックス製硬質基板を密着させて硬化厚
みが３，３５ｍｍになるようにバック露光を行い、版厚
６．３５ｍｍの印刷版を得た。Example 5 Liquid photosensitive resin F-47 was formed on a Pyrex hard substrate with a negative film and a cover film interposed therebetween.
Are laminated to form a liquid photosensitive resin having a thickness of 4 mm,
A Pyrex hard substrate was placed on a spacer set so as to keep a distance of 15 mm from the resin layer, and relief exposure was performed from below through a negative film. After that, the upper Pyrex hard substrate was removed, and a 2.35 mm liquid photosensitive resin and a base film were laminated on the liquid photosensitive resin that was previously exposed, and the plate thickness was 6.
The Pyrex hard substrate is placed again on the spacer set to 35 mm, and the base film and the upper Pyrex hard substrate are brought into close contact with each other by vacuum to perform back exposure so that the cured thickness becomes 3,35 mm, A printing plate having a plate thickness of 6.35 mm was obtained.
【００３０】表１のように、このもののΔＴは０．０８
ｍｍ、Δｔは０．０３ｍｍであった。As shown in Table 1, this product has a ΔT of 0.08.
mm and Δt were 0.03 mm.
【００３１】[0031]
【比較例５】実施例５に対応した従来の方法で厚み６．
３５ｍｍの版を製造したものについてΔＴ及びΔｔを求
めたところ、それぞれ０．１６ｍｍ及び０．１１ｍｍで
あった。[Comparative Example 5] A thickness of 6. was obtained by the conventional method corresponding to Example 5.
The ΔT and Δt of the 35 mm plate manufactured were 0.16 mm and 0.11 mm, respectively.
【００３２】[0032]
【実施例６】パイレックス製硬質基板の上にネガフィル
ム及びカバーフィルムを介して液状感光性樹脂Ｆ−４７
と厚さ１００μの透明ポリエステルフィルムを積層し
て、厚さ４ｍｍの液状感光性樹脂を形成させ、パイレッ
クス製硬質基板を透明ポリエステルフィルムと密着する
ようにセットされたスペーサーの上に乗せ、下方よりネ
ガフィルムを介してレリーフ露光を行い、次に上側のパ
イレックス製硬質基板と透明ポリエステルフィルムを取
り除き、先ほど露光を行った液状感光性樹脂の上に２．
３５ｍｍの液状感光性樹脂とベースフィルムを積層し、
版の厚みが６．３５ｍｍになるようにセットしたスペー
サーの上にパイレックス製硬質基板を再度乗せ、真空に
てベースフィルムと上側のパイレックス製硬質基板を密
着させて硬化厚みが３，３５ｍｍになるようにバック露
光を行い、版厚６．３５ｍｍの印刷版を得た。[Example 6] Liquid photosensitive resin F-47 on a Pyrex hard substrate through a negative film and a cover film
And a transparent polyester film with a thickness of 100μ are laminated to form a liquid photosensitive resin with a thickness of 4 mm, and a Pyrex hard substrate is placed on a spacer set so as to be in close contact with the transparent polyester film, and the negative is applied from below. 1. Relief exposure is performed through the film, then the upper rigid substrate made of Pyrex and the transparent polyester film are removed, and the liquid photosensitive resin that has been previously exposed is subjected to 2.
Laminate 35mm liquid photosensitive resin and base film,
Place the Pyrex hard substrate again on the spacer set so that the plate thickness is 6.35 mm, and bring the base film and the upper Pyrex hard substrate into close contact with each other by vacuum so that the cured thickness becomes 3,35 mm. Back exposure was performed to obtain a printing plate having a plate thickness of 6.35 mm.
【００３３】表１のように、このもののΔＴは０．０９
ｍｍ、Δｔは０．０４ｍｍであった。As shown in Table 1, the ΔT of this product is 0.09.
mm and Δt were 0.04 mm.
【００３４】[0034]
【比較例６】実施例６に対応した従来の方法で厚み６．
３５ｍｍの版を製造したものについてΔＴ及びΔｔを求
めたところ、それぞれ０．１６ｍｍ及び０．１１ｍｍで
あった。[Comparative Example 6] A thickness of 6.
The ΔT and Δt of the 35 mm plate manufactured were 0.16 mm and 0.11 mm, respectively.
【００３５】[0035]
【実施例７】パイレックス製硬質基板の上にネガフィル
ム及びカバーフィルムを介して液状感光性樹脂Ｆ−４７
とベースフィルムを積層して、厚み７ｍｍの液状感光性
樹脂を形成させ、その上にマスキングフィルムを置き、
版の厚みが７ｍｍになるようにセットしたスペーサーの
上にパイレックス製硬質基板を乗せ、真空にてベースフ
ィルムと上側のパイレックス製硬質基板を密着させた。
次に上方よりマスキングフィルムを介してマスキング露
光を行い、その後、下方よりネガフィルムを介してレリ
ーフ露光を行った。次に上側のパイレックス製硬質基板
とマスキングフィルムを取り除き、再度パイレックス製
硬質基板を乗せ、上方よりバック露光を行い、その後、
現像・後露光・乾燥処理を行った感光性樹脂版からベー
スフィルムを剥がして印刷版を得た。Example 7 Liquid photosensitive resin F-47 was formed on a Pyrex hard substrate through a negative film and a cover film.
And a base film are laminated to form a liquid photosensitive resin having a thickness of 7 mm, and a masking film is placed on it.
The Pyrex hard substrate was placed on the spacer set so that the plate thickness was 7 mm, and the base film and the upper Pyrex hard substrate were brought into close contact with each other by vacuum.
Next, masking exposure was performed from above through a masking film, and then relief exposure was performed from below through a negative film. Then remove the Pyrex hard substrate and masking film on the upper side, put the Pyrex hard substrate again, perform back exposure from above, then,
The base film was peeled off from the photosensitive resin plate that had been subjected to development, post-exposure and drying treatments to obtain a printing plate.
【００３６】表２のように、このもののΔＴは０．０８
ｍｍ、Δｔは０．０４ｍｍであった。As shown in Table 2, this product has a ΔT of 0.08.
mm and Δt were 0.04 mm.
【００３７】[0037]
【比較例７】実施例７に対応した従来の方法で厚み７ｍ
ｍの版を製造したものについてΔＴ及びΔｔを求めたと
ころ、それぞれ０．１７ｍｍ及び０．１１ｍｍであっ
た。[Comparative Example 7] A thickness of 7 m by the conventional method corresponding to Example 7.
The ΔT and Δt of the manufactured m plate were 0.17 mm and 0.11 mm, respectively.
【００３８】[0038]
【実施例８】パイレックス製硬質基板の上にネガフィル
ム及びカバーフィルムを介して液状感光性樹脂Ｆ−４７
とベースフィルムを積層して、厚み６．３５ｍｍの液状
感光性樹脂を形成させ、版の厚みが６．３５ｍｍになる
ようにセットしたスペーサーの上にパイレックス製硬質
基板を乗せ、真空にてベースフィルムと上側のパイレッ
クス製硬質基板を密着させた。次に上方よりバック露光
を行い、次に下方よりネガフィルムを介してレリーフ露
光を行った。その後、現像・後露光・乾燥処理を行った
感光性樹脂版からベースフィルムを剥がして印刷版を得
た。[Embodiment 8] Liquid photosensitive resin F-47 on a Pyrex hard substrate through a negative film and a cover film.
And a base film are laminated to form a liquid photosensitive resin having a thickness of 6.35 mm, and a Pyrex hard substrate is placed on a spacer set so that the plate has a thickness of 6.35 mm, and the base film is vacuumed. The Pyrex hard substrate on the upper side was adhered to. Next, back exposure was performed from above, and then relief exposure was performed from below through a negative film. Then, the base film was peeled off from the photosensitive resin plate which had been subjected to development, post-exposure and drying treatments to obtain a printing plate.
【００３９】表２のように、このもののΔＴは０．０８
ｍｍ、Δｔは０．０４ｍｍであった。As shown in Table 2, this product has a ΔT of 0.08.
mm and Δt were 0.04 mm.
【００４０】[0040]
【比較例８】実施例８に対応した従来の方法で厚み６．
３５ｍｍの版を製造したものについてΔＴ及びΔｔを求
めたところ、それぞれ０．１６ｍｍ及び０．１１ｍｍで
あった。[Comparative Example 8] A thickness of 6.
The ΔT and Δt of the 35 mm plate manufactured were 0.16 mm and 0.11 mm, respectively.
【００４１】[0041]
【表１】 [Table 1]
【００４２】[0042]
【表２】 [Table 2]
【００４３】[0043]
【発明の効果】本発明により、版の大面積レリーフ部は
インキの着肉性が改善され、小面積レリーフ部は太りが
改善され、印刷により鮮明でドットゲインの少ない印刷
物を得ることが出来るため、ダンボール印刷用、フィル
ム印刷用、プレプリント印刷用などの製版方法として好
適である。EFFECTS OF THE INVENTION According to the present invention, ink receptivity is improved in the large area relief portion of the plate, and thickening is improved in the small area relief portion, so that a clear printed matter with a small dot gain can be obtained by printing. It is suitable as a plate making method for cardboard printing, film printing, preprint printing, and the like.
【図１】従来の製版方法にてマスキング露光とレリーフ
露光を終えた状態の断面図。FIG. 1 is a sectional view showing a state in which masking exposure and relief exposure have been completed by a conventional plate making method.
【図２】従来の製版方法にてバック露光を終えた状態の
断面図。FIG. 2 is a sectional view showing a state in which back exposure is completed by a conventional plate making method.
【図３】従来の方法で得られる印刷版の断面図。FIG. 3 is a cross-sectional view of a printing plate obtained by a conventional method.
【図４】マスキングフィルムを使用し、第一層と透明基
板２の間に空気層を設ける方法でマスキング露光とレリ
ーフ露光を終えた状態の断面図。FIG. 4 is a cross-sectional view of a state in which masking exposure and relief exposure are completed by a method of using a masking film and providing an air layer between the first layer and the transparent substrate 2.
【図５】マスキングフィルムを使用し、第一層の上に透
明フィルムを積層する方法でマスキング露光とレリーフ
露光を終えた状態の断面図。FIG. 5 is a cross-sectional view of a state in which masking exposure and relief exposure are completed by a method of using a masking film and laminating a transparent film on the first layer.
【図６】マスキングフィルムを使用せず、第一層と透明
基板２の間に空気層を設ける方法でレリーフ露光を終え
た状態の断面図。FIG. 6 is a cross-sectional view of a state in which relief exposure is completed by a method of providing an air layer between the first layer and the transparent substrate 2 without using a masking film.
【図７】図４の後、マスキングフィルムを取り除き、第
二層を積層した状態の断面図。FIG. 7 is a cross-sectional view of a state in which the masking film is removed and a second layer is laminated after FIG.
【図８】図７の後、バック露光を終えた状態の断面図。FIG. 8 is a cross-sectional view showing a state in which back exposure has been completed after FIG.
【図９】請求項１の方法により得られる感光性樹脂版の
断面図。FIG. 9 is a sectional view of a photosensitive resin plate obtained by the method of claim 1.
【図１０】請求項２の方法により得られる感光性樹脂版
の断面図。FIG. 10 is a sectional view of a photosensitive resin plate obtained by the method of claim 2.
１ 透明基板 ２ 透明基板 ３ ネガフィルム ４ カバーフィルム ５ 感光性樹脂 ６ ベースフィルム ７ マスキングフィルム ８ スペーサー ９ スペーサー １０ スポンジテープ １１ スポンジテープ １２ 液状感光性樹脂第一層 １３ 液状感光性樹脂第二層 １４ 透明フィルム Ａ． レリーフ部分の基部 Ｂ． レリーフ部分の基部 Ｃ． レリーフ部分の画像部 Ｄ． レリーフ部分の画像部 1 transparent substrate 2 transparent substrate 3 negative film 4 cover film 5 photosensitive resin 6 base film 7 masking film 8 spacer 9 spacer 10 sponge tape 11 sponge tape 12 liquid photosensitive resin first layer 13 liquid photosensitive resin second layer 14 transparent Film A. Base of relief part B. Base of relief portion C. Image portion of relief portion D. Image part of relief part
Claims (2)
１、ネガフィルム、カバーフィルム、第一層の液状感光
性樹脂を順次積層し、さらに透明フィルム又は空気層を
介して透明基板２を積層し、透明基板２側から活性光線
を照射した後に、透明基板１側からまたは両方側から同
時に活性光線を照射する第一段階と、その後、透明基板
２を取り除いて第一層の液状感光性樹脂の上に第二層の
液状感光性樹脂、ベースフィルムを順次積層し、さらに
透明基板２を直接積層し、透明基板２側より活性光線を
照射する第二段階からなる感光性樹脂版の製版方法。1. In the molding of a photosensitive resin plate, a transparent substrate 1, a negative film, a cover film, and a liquid photosensitive resin as a first layer are sequentially laminated, and further a transparent substrate 2 is laminated with a transparent film or an air layer interposed therebetween. Then, after the actinic ray is irradiated from the transparent substrate 2 side, the actinic ray is simultaneously irradiated from the transparent substrate 1 side or both sides, and thereafter, the transparent substrate 2 is removed and the liquid photosensitive resin of the first layer is removed. A method for making a photosensitive resin plate comprising a second step in which a liquid photosensitive resin of a second layer and a base film are sequentially laminated on the transparent substrate 2, and the transparent substrate 2 is directly laminated on the transparent substrate 2 and actinic rays are irradiated from the transparent substrate 2 side. .
１、ネガフィルム、カバーフィルム、液状感光性樹脂、
ベースフィルムを順次積層し、さらに透明基板２を積層
し、透明基板２側より活性光線を照射した後に透明基板
１側から活性光線を照射するか、または両方から同時に
活性光線を照射し、その後、透明基板２を取り除いてベ
ースフィルムと液状感光性樹脂を取り出し、その後、洗
剤で露光後の液状感光性樹脂の未硬化部分を洗い出して
現像し、後露光および乾燥処理を行う感光性樹脂版の製
造方法において、早くとも後露光後にベースフィルムを
剥ぎ取る感光性樹脂版の製版方法。2. In molding a photosensitive resin plate, a transparent substrate 1, a negative film, a cover film, a liquid photosensitive resin,
Base films are sequentially laminated, and further a transparent substrate 2 is laminated, and an active ray is irradiated from the transparent substrate 2 side and then an active ray is irradiated from the transparent substrate 1 side, or both are simultaneously irradiated with an active ray, and then, Production of a photosensitive resin plate in which the transparent substrate 2 is removed, the base film and the liquid photosensitive resin are taken out, and then the uncured portion of the liquid photosensitive resin after exposure with a detergent is washed out and developed, and post-exposure and drying are performed. In the method, a method for making a photosensitive resin plate, in which the base film is stripped off after post-exposure at the earliest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11958595A JP3611368B2 (en) | 1995-05-18 | 1995-05-18 | Photosensitive resin plate making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11958595A JP3611368B2 (en) | 1995-05-18 | 1995-05-18 | Photosensitive resin plate making method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08314126A true JPH08314126A (en) | 1996-11-29 |
| JP3611368B2 JP3611368B2 (en) | 2005-01-19 |
Family
ID=14765015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11958595A Expired - Fee Related JP3611368B2 (en) | 1995-05-18 | 1995-05-18 | Photosensitive resin plate making method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3611368B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| JP2020517982A (en) * | 2017-04-11 | 2020-06-18 | マクダーミッド グラフィックス ソリューションズ エルエルシー | Method for producing relief image from liquid photopolymerizable resin |
-
1995
- 1995-05-18 JP JP11958595A patent/JP3611368B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| JP2020517982A (en) * | 2017-04-11 | 2020-06-18 | マクダーミッド グラフィックス ソリューションズ エルエルシー | Method for producing relief image from liquid photopolymerizable resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3611368B2 (en) | 2005-01-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1955111B1 (en) | Photopolymer printing form with reduced processing time | |
| US5213949A (en) | Method for selectively curing a liquid photosensitive resin by masking exposure | |
| JP2515521B2 (en) | Improved masking exposure method and plate making method using the same | |
| US4283484A (en) | Method of making relief printing plates with concave printing areas | |
| JP3562865B2 (en) | Manufacturing method of photosensitive resin plate | |
| US4115123A (en) | Shallow relief photopolymer printing plate and methods | |
| JP3611368B2 (en) | Photosensitive resin plate making method | |
| JPH04202677A (en) | Formation of resist pattern | |
| JP3705340B2 (en) | Thick film pattern forming letterpress, thick film pattern forming method using the same, and thick film pattern forming letterpress manufacturing method | |
| US3313018A (en) | Method of making diaphragm means for acoustic translating devices | |
| JP2988504B2 (en) | Plate making method for photocurable resin | |
| JPH08244370A (en) | Plate, plate material and manufacture of the plate | |
| JPH11222782A (en) | Plate making of thick-film printing plate for screen printing | |
| JPH1184633A (en) | Production of photosensitive resin plate and device | |
| JP2004325552A (en) | Method of manufacturing screen printing plate | |
| US20140234587A1 (en) | Methods of Producing Flat Top Dots on Flexographic Printing Plates, and Laminates Therefor | |
| JPS62229250A (en) | Sticking method for printing mask film for printing of pattern of circuit board | |
| JPH0333519B2 (en) | ||
| JPH03226757A (en) | Production of photosensitive resin plate | |
| JPS6286365A (en) | Image forming method | |
| JPH11151729A (en) | Method and apparatus for producing highly accurate photosensitive resin panel | |
| KR100328123B1 (en) | Method for preparing screen stencil | |
| JPH0273256A (en) | Structural body for pellicle frame | |
| JPS63279257A (en) | Production of intaglio printing plate for pad printing | |
| JPS6350844A (en) | Method for producing improved laminated photosensitive resin plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040601 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040727 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20040727 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20040727 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20040727 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20041019 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20041019 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081029 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081029 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091029 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091029 Year of fee payment: 5 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091029 Year of fee payment: 5 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091029 Year of fee payment: 5 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091029 Year of fee payment: 5 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101029 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101029 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111029 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |