JPH1184633A - Production of photosensitive resin plate and device - Google Patents
Production of photosensitive resin plate and deviceInfo
- Publication number
- JPH1184633A JPH1184633A JP24664297A JP24664297A JPH1184633A JP H1184633 A JPH1184633 A JP H1184633A JP 24664297 A JP24664297 A JP 24664297A JP 24664297 A JP24664297 A JP 24664297A JP H1184633 A JPH1184633 A JP H1184633A
- Authority
- JP
- Japan
- Prior art keywords
- transparent substrate
- plate
- photosensitive resin
- film
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はダンボール印刷、フ
ィルム印刷、シール・ラベル印刷のような凸版印刷用感
光性樹脂版の製造方法及び製版装置に関わるものであ
り、特に感光性樹脂版の版厚精度を改良するための方法
及び装置に関わるものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for producing a photosensitive resin plate for letterpress printing such as cardboard printing, film printing, and label printing, and more particularly to a plate thickness of the photosensitive resin plate. The present invention relates to a method and an apparatus for improving accuracy.
【０００２】[0002]
【従来の技術】一般に、液状感光性樹脂を用いて印刷版
を製造するには、先ず図１のように、真空にする等の手
段により、下部透明基版１の上にネガフィルム３及びカ
バーフィルム４を密着して置き、その上にボトムオープ
ンバケット等を用いて感光性樹脂層５を積層し、これに
ベースフィルム６とマスキングフィルム７を重ねる。そ
の後、感光性樹脂版の厚みを決めるためにセットされた
スペーサー８の上に置かれた上部透明基板２を通して活
性光を照射して、レリーフ部分の基部を形成させるため
のマスキング露光を行う。次に、レリーフ部分の画像を
形成させるために下部透明基板１側からネガフィルム３
を介して活性光を照射してレリーフ露光を行なった後、
マスキングフィルム７を取り除いて、形成されたレリー
フ部Ａ，Ｂをベースフィルム６に安定的に固定させるた
めのバック露光を上部透明基板２側から行なう。2. Description of the Related Art Generally, in order to produce a printing plate using a liquid photosensitive resin, first, as shown in FIG. 1, a negative film 3 and a cover are placed on a lower transparent substrate 1 by means such as vacuuming. The film 4 is placed in close contact, a photosensitive resin layer 5 is laminated thereon using a bottom open bucket or the like, and a base film 6 and a masking film 7 are laminated thereon. Thereafter, active light is irradiated through the upper transparent substrate 2 placed on the spacer 8 set in order to determine the thickness of the photosensitive resin plate, and masking exposure for forming the base of the relief portion is performed. Next, a negative film 3 is formed from the lower transparent substrate 1 side to form an image of a relief portion.
After performing relief exposure by irradiating active light through
After removing the masking film 7, back exposure is performed from the upper transparent substrate 2 side to stably fix the formed relief portions A and B to the base film 6.
【０００３】その他に、最後のバック露光を行なわない
製版方法も時には用いられる。次に、適当な洗剤で未硬
化部分を洗い出して現像し、後露光及び乾燥処理を施せ
ば、印刷版が得られる。また、マスキングフィルムを使
用しないで、下部透明基板１の上にネガフィルム３及び
カバーフィルム４を密着して置き、その上に感光性樹脂
層４´を積層し、これにベースフィルム７を重ねる。そ
の後、感光性樹脂版の厚みを決めるためにセットされた
スペーサー９の上に置かれた上部透明基板１０を通して
活性光を照射して版の基部を形成させるためのバック露
光を行い、次に下部透明基板１側からネガフィルム２を
介して活性光を照射してレリーフ露光を行ない、現像、
後露光及び乾燥処理して版を得る方法も広く用いられて
いる。[0003] In addition, a plate making method in which the last back exposure is not performed is sometimes used. Next, the uncured portion is washed out with a suitable detergent, developed, and subjected to post-exposure and drying treatments to obtain a printing plate. Also, without using a masking film, the negative film 3 and the cover film 4 are placed on the lower transparent substrate 1 in close contact with each other, a photosensitive resin layer 4 'is laminated thereon, and the base film 7 is laminated thereon. Thereafter, a back exposure for irradiating active light through an upper transparent substrate 10 placed on a spacer 9 set to determine the thickness of the photosensitive resin plate to form a base of the plate, and then performing a lower exposure Activating light is irradiated from the transparent substrate 1 side through the negative film 2 to perform relief exposure,
A method of obtaining a plate by post-exposure and drying is also widely used.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
技術でダンボール印刷等で一般的に用いられている厚手
（通常７ｍｍ）の大型の版（長さ１ｍ以上）を製造する
と、露光に伴う樹脂の発熱による透明基板の熱変形によ
って、版の中央部が低くなって版厚精度が低下し、印刷
不良となる事が多かった。However, when a thick (usually 7 mm) large plate (1 m or more in length) generally used for cardboard printing or the like is manufactured by the above-described technique, the resin required to be exposed to light is reduced. The thermal deformation of the transparent substrate due to heat generated lowers the center of the plate, lowers plate thickness accuracy, and often results in poor printing.
【０００５】従来、このような欠点を克服するために、
透明基板の変形を検出して、反版側より透明基板を加熱
して、透明基板の熱変形を抑え込む方法等が用いられて
きたが、装置が大がかりなものとなり費用もかさみ、透
明基板の反版側からの加熱が極めて困難なこと等の理由
から、必ずしも満足しうるものではなかった。そこで、
本発明は、このような従来方法による欠点を克服し、高
い版厚精度の厚手大型版を安定的に製造する方法を提供
する事を目的とするものである。Conventionally, in order to overcome such disadvantages,
A method of detecting the deformation of the transparent substrate and heating the transparent substrate from the reverse side to suppress the thermal deformation of the transparent substrate has been used. It was not always satisfactory because heating from the plate side was extremely difficult. Therefore,
An object of the present invention is to overcome the drawbacks of the conventional method and to provide a method for stably producing a thick large plate having high plate thickness accuracy.
【０００６】[0006]
【課題を解決するための手段】本発明者らは、上記課題
について鋭意検討した結果、樹脂面側が凹形状の硬質透
明基板を用いて版を製造することにより、上記課題が解
決できることを見出した。すなわち、本願は以下の発明
を提供する。 （１）液状感光性樹脂を用い、透明基板を通して露光す
る工程を有する液状感光性樹脂版の製造方法において、
樹脂面側が凹形状の硬質透明基板を用いることを特徴と
する液状感光性樹脂版の製造方法。 （２）液状感光性樹脂版用製版装置において、樹脂面側
が凹形状の硬質透明基板を設けたことを特徴とする液状
感光性樹脂版用製版装置。Means for Solving the Problems The present inventors have conducted intensive studies on the above problems and found that the above problems can be solved by manufacturing a plate using a hard transparent substrate having a concave resin surface. . That is, the present application provides the following inventions. (1) In a method for producing a liquid photosensitive resin plate having a step of exposing through a transparent substrate using a liquid photosensitive resin,
A method for producing a liquid photosensitive resin plate, wherein a hard transparent substrate having a concave resin surface is used. (2) A plate making apparatus for a liquid photosensitive resin plate, wherein a hard transparent substrate having a concave resin surface side is provided.
【０００７】本願発明の具体的実施態様としては、
（ａ）下部透明基板の上にネガフィルム、カバーフィル
ム、液状感光性樹脂、ベースフィルム、マスキングフィ
ルム、上部透明基板を積層するに際して、樹脂面側が凹
形のなめらかな曲面を持つ上下透明基板を使用してこれ
らを積層し、先ず上部透明基板を通してマスキング露光
を行ない、次いで下部透明基板を通してレリーフ露光を
行ない、更にマスキングフィルムを除去した上で、上部
透明基板を通してバック露光を行なった後、未硬化の液
状感光性樹脂を除去して感光性樹脂版を作成する方法、
または、（ｂ）下部透明基板の上にネガフィルム、カバ
ーフィルム、液状感光性樹脂、ベースフィルム、上部透
明基板を積層するに際して、樹脂面側が凹形のなめらか
な曲面を持つ上下透明基板を使用してこれらを積層し、
先ず上部透明基板を通してバック露光を行ない、次いで
下部透明基板を通してレリーフ露光を行なった後、未硬
化の液状感光性樹脂を除去して感光性樹脂版を作成する
方法が挙げられる。As a specific embodiment of the present invention,
(A) When laminating a negative film, a cover film, a liquid photosensitive resin, a base film, a masking film, and an upper transparent substrate on a lower transparent substrate, use upper and lower transparent substrates having a smooth curved surface with a concave resin surface. Then, these are laminated, first, masking exposure is performed through the upper transparent substrate, then relief exposure is performed through the lower transparent substrate, and after removing the masking film, back exposure is performed through the upper transparent substrate. A method of removing the liquid photosensitive resin to form a photosensitive resin plate,
Alternatively, (b) when laminating a negative film, a cover film, a liquid photosensitive resin, a base film, and an upper transparent substrate on the lower transparent substrate, use upper and lower transparent substrates having a concave curved smooth resin surface. And stack these,
First, back exposure is performed through the upper transparent substrate, then relief exposure is performed through the lower transparent substrate, and then the uncured liquid photosensitive resin is removed to form a photosensitive resin plate.
【０００８】本願発明の製版方法においては、例えば特
公昭５２−７７６１号、特開昭６０−１９１２３７号、
特開昭６３−８８５５５号、特開平１−２４５２４５
号、特開平７−２９５２１８号公報等で示される、液状
感光性樹脂を使用する事ができ、また特開昭６３−９６
６６１号公報で示される感光性樹脂版製版装置を使用す
る事ができる。In the plate making method of the present invention, for example, JP-B-52-7761, JP-A-60-191237,
JP-A-63-88555, JP-A-1-245245
And liquid photosensitive resins described in JP-A-7-295218 can be used.
No. 661 can be used.
【０００９】通常、版厚が４ｍｍ以上のいわゆる厚手版
を製造する場合は、透明基板１の上にネガフィルム２及
びカバーフィルム３を重ねて置き、透明基板１に加工そ
れた穴・溝及び真空配管によりネガフィルム２、カバー
フィルム３を透明基板１に真空密着する。その上に感光
性樹脂４、ベースフィルム７、マスキングフィルム８を
積層し、感光性樹脂版の厚みを決定するためにセットさ
れたスペーサー１０の上に上部透明基板１１を乗せるに
際して、樹脂面側が凹形のなめらかな曲面を持つ上下透
明基板を使用してこれらの積層を行ない、この透明基板
１１を通して活性光を照射してレリーフ部分の基部を形
成させるための背面露光（マスキング露光）を行ない、
次いで画像のレリーフ部分を形成させるために透明基板
１側からネガフィルム２を介して活性光を照射するレリ
ーフ露光を行なう。次にマスキングフィルム８を取り除
いて、形成されたレリーフ部とベースフィルム７とを固
定させるためのバック露光を透明基板１１側から行な
う。Normally, when manufacturing a so-called thick plate having a plate thickness of 4 mm or more, a negative film 2 and a cover film 3 are placed on a transparent substrate 1 and the holes / grooves and vacuum formed in the transparent substrate 1 are processed. The negative film 2 and the cover film 3 are vacuum adhered to the transparent substrate 1 by piping. The photosensitive resin 4, the base film 7, and the masking film 8 are laminated thereon, and when the upper transparent substrate 11 is placed on the spacer 10 set for determining the thickness of the photosensitive resin plate, the resin surface side is concave. These layers are stacked using upper and lower transparent substrates having a smooth curved surface, and a backside exposure (masking exposure) for irradiating active light through the transparent substrate 11 to form a base of a relief portion is performed.
Next, in order to form a relief portion of the image, relief exposure for irradiating active light from the transparent substrate 1 side through the negative film 2 is performed. Next, the masking film 8 is removed, and back exposure for fixing the formed relief portion and the base film 7 is performed from the transparent substrate 11 side.
【００１０】また、バック露光を行なわないで感光性樹
脂版を製造する事も可能である。次に、適当な洗剤で未
硬化の感光性樹脂を洗浄除去し、後露光及び乾燥処理を
施す事により、印刷版が得られる。また、通常、版厚が
４ｍｍ未満の比較的薄い版を製造する場合には、上記し
たマスキングフィルム８を使用しないで、先ず透明基板
１１を通して版全面にレリーフ部分の基部を形成させる
ための背面露光（バック露光）を行ない、次いで画像の
レリーフ部分を形成させるために透明基板１側からレリ
ーフ露光を行なう方法が行なわれる。It is also possible to produce a photosensitive resin plate without performing back exposure. Next, the printing plate is obtained by washing and removing the uncured photosensitive resin with a suitable detergent and performing post-exposure and drying treatments. Usually, when manufacturing a relatively thin plate having a plate thickness of less than 4 mm, a backside exposure for forming a base of a relief portion on the entire surface of the plate through the transparent substrate 11 without using the masking film 8 described above. (Back exposure), and then a relief exposure is performed from the transparent substrate 1 side to form a relief portion of an image.
【００１１】このようにして得られた厚手大型の印刷版
は、従来の方法によって製造された版に比べて、特に中
央部と周辺部の版厚差が極めて少ない版であって、印刷
時の印圧変動が少ない事から、鮮明でゲインの少ない、
原稿に対して高度の再現性を有する印刷画像を与えるこ
とができる。本発明に用いられる上下透明基板の凹形の
程度としては、ガラスの材質・寸法（幅・長さ・厚）等
によって異なるが、通常０．０２ｍｍ〜０．５ｍｍ、好
ましくは０．０２ｍｍ〜０．３ｍｍの範囲で凹形となっ
ているものが用いられる。耐熱ガラス（パイレックス又
はテンパックス等）を使用して製版する場合、製版寸法
が５００ｍｍ×８００ｍｍ以上、ガラスサイズで幅７０
０ｍｍ以上、長さ１，０００ｍｍ以上、厚さが１２ｍｍ
以上の時には、０．０２ｍｍから０．１５ｍｍの範囲の
凹形を用いると、均一な版厚が得られるので、このよう
な範囲が有効性、実用性の点で好ましい。The thick and large printing plate thus obtained is a plate having a very small difference in plate thickness, especially at the central portion and the peripheral portion, as compared with a plate manufactured by a conventional method. Because the printing pressure fluctuation is small, it is clear and has little gain,
A printed image having a high degree of reproducibility can be given to a document. The degree of the concave shape of the upper and lower transparent substrates used in the present invention varies depending on the material and dimensions (width, length, thickness) of the glass and the like, but is usually 0.02 mm to 0.5 mm, preferably 0.02 mm to 0 A concave shape within a range of 0.3 mm is used. When making a plate using heat-resistant glass (such as Pyrex or Tempax), the plate making dimension is 500 mm x 800 mm or more, and the glass size is 70 mm wide.
0 mm or more, length 1,000 mm or more, thickness 12 mm
In the above case, if a concave shape in the range of 0.02 mm to 0.15 mm is used, a uniform plate thickness can be obtained, and such a range is preferable in terms of effectiveness and practicality.
【００１２】本発明に使用される透明基板の材質として
は、ガラス及びクリスタル、アクリル樹脂、ポリカーボ
ネート樹脂、ポリ塩化ビニル樹脂などのプラスチックや
透明セラミック等が用いられる。As the material of the transparent substrate used in the present invention, glass and plastics such as crystal, acrylic resin, polycarbonate resin and polyvinyl chloride resin, transparent ceramics and the like are used.
【００１３】[0013]
【発明の実施の形態】以下、本発明の例を実施例に基づ
き具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, examples of the present invention will be specifically described based on examples.
【００１４】[0014]
【実施例１】上面を０．０２ｍｍ凹形になめらかに研磨
されたパイレックスガラス製下部透明基板の上にネガフ
ィルム及びカバーフィルムを真空密着した上に、液状感
光性樹脂ＡＰＲ（登録商標）Ｆ−４７（旭化成工業株式
会社製）を成型・積層して厚さ７ｍｍの感光性樹脂層を
形成させ、その上にポリエステル製ベースフィルム及び
マスキングフィルムを介して下面を０．０６ｍｍ凹形に
なめらかに研磨されたパイレックスガラス製上部透明基
板を載置し、２枚の透明基板の間隔はスペーサにより保
持した。EXAMPLE 1 A negative film and a cover film were vacuum-adhered on a Pyrex glass lower transparent substrate whose upper surface was smoothly polished to a concave shape of 0.02 mm, and a liquid photosensitive resin APR (registered trademark) F- 47 (manufactured by Asahi Kasei Kogyo Co., Ltd.) is formed and laminated to form a photosensitive resin layer having a thickness of 7 mm, and the lower surface is polished smoothly on the lower surface through a polyester base film and a masking film into a 0.06 mm concave shape. The upper transparent substrate made of Pyrex glass was placed, and the distance between the two transparent substrates was held by a spacer.
【００１５】次いで上部硬質基板より真空吸引して、マ
スキングフィルム及びベースフィルムの密着性を保ちな
がら３分間保持した後、上部透明基板及びマスキングフ
ィルムを透して活性光を照射してマスキング露光を１５
０秒間行なった。その後、下部透明基板及びネガフィル
ムを通して活性光を照射するレリーフ露光を１３０秒間
行ない、次いでマスキングフィルムを除去した。次に、
上部透明基板を通して活性光を照射するバック露光を２
０秒間行ない画像形成露光を完了した。Then, vacuum suction is performed from the upper hard substrate, and the film is held for 3 minutes while maintaining the adhesion between the masking film and the base film. Then, active light is irradiated through the upper transparent substrate and the masking film to perform masking exposure for 15 minutes.
Performed for 0 seconds. Thereafter, relief exposure for irradiating active light through the lower transparent substrate and the negative film was performed for 130 seconds, and then the masking film was removed. next,
Back exposure to irradiate active light through upper transparent substrate
The image forming exposure was completed for 0 second.
【００１６】次に、このようにして露光処理した感光層
を常法に従って洗浄液で洗い出し、現像したのち、後露
光し、乾燥することにより、版厚７ｍｍ、幅７００ｍ
ｍ、長さ１２００ｍｍの印刷版を得た。この印刷版を用
いてダンボールへの印刷を行なったところ、印刷ゲイン
の少ない、原稿に対する忠実度の極めて高い印刷物が得
られた。Next, the photosensitive layer exposed in this manner is washed out with a cleaning liquid according to a conventional method, developed, post-exposed, and dried to obtain a plate thickness of 7 mm and a width of 700 m.
m, a printing plate having a length of 1200 mm was obtained. When printing was performed on a cardboard using this printing plate, a printed matter having a small printing gain and extremely high fidelity to an original was obtained.
【００１７】[0017]
【実施例２】実施例１において、上面が０．０２ｍｍ凹
形のテンパックスガラス製下部透明基板、下面が０．０
８ｍｍ凹形の同じくテンパックスガラス製上部透明基板
を使用する以外は、実施例１と全く同様にして版厚７ｍ
ｍ、幅９００ｍｍ、長さ１，３００ｍｍの印刷版を得
た。その結果を表１に示す。Example 2 In Example 1, a lower transparent substrate made of Tempax glass having an upper surface of 0.02 mm concave shape and a lower surface of 0.02 mm was used.
A plate thickness of 7 m was obtained in exactly the same manner as in Example 1 except that an 8 mm concave upper transparent substrate also made of Tempax glass was used.
m, a width of 900 mm, and a length of 1,300 mm were obtained. Table 1 shows the results.
【００１８】[0018]
【比較例１】実施例２において、共に高度に平面研磨さ
れたテンパックスガラス製上下透明基板を使用する以外
は、実施例２と全く同様にして版厚７ｍｍ、幅９００ｍ
ｍ、長さ１，３００ｍｍの印刷版を得た。その結果を表
１に示す。Comparative Example 1 A plate thickness of 7 mm and a width of 900 m were carried out in the same manner as in Example 2 except that the upper and lower transparent substrates made of Tempax glass, both of which were highly polished, were used.
m, a printing plate having a length of 1,300 mm was obtained. Table 1 shows the results.
【００１９】[0019]
【表１】 [Table 1]
【００２０】[0020]
【発明の効果】本発明によれば、版面画像面積の大小に
関係なく良好なインキの着肉性及び転移性を示し、全体
にわたって鮮明でしかも印圧過多によるゲインの少な
い、原稿に対する忠実度の高い印刷画像を与える厚手大
型感光性樹脂版が、作業者の負担や製版時間を増す事な
く得られるので、本発明はダンボール印刷用、フィルム
印刷用、ラベル印刷用などの印刷版の製造方法、製版装
置として好適である。According to the present invention, good ink inking property and transferability are exhibited regardless of the size of the plate image area, and the fidelity with respect to the original is clear over the whole, and the gain due to excessive printing pressure is small. Thick large photosensitive resin plate giving a high print image can be obtained without increasing the burden on the operator and plate making time, so the present invention is a method for manufacturing a printing plate for cardboard printing, film printing, label printing, etc. It is suitable as a plate making device.
【図１】液状感光性樹脂を用いた製版方法における露光
工程を示す断面図。FIG. 1 is a sectional view showing an exposure step in a plate making method using a liquid photosensitive resin.
【図２】従来法の透明基板と版形状の説明用断面図。FIG. 2 is a sectional view for explaining a transparent substrate and a plate shape according to a conventional method.
【図３】本発明の透明基板と版形状の説明用断面図。FIG. 3 is a sectional view for explaining a transparent substrate and a plate shape of the present invention.
１．下部透明基板 ２．ネガフィルム ３．カバーフィルム ４．液状感光性樹脂層 ７．ベースフィルム ８．マスキングフィルム ９．スポンジテープ １０．スペーサー １１．上部透明基板 1. 1. Lower transparent substrate Negative film 3. Cover film 4. Liquid photosensitive resin layer 7. Base film 8. Masking film 9. Sponge tape 10. Spacer 11. Upper transparent substrate
Claims (2)
て露光する工程を有する液状感光性樹脂版の製造方法に
おいて、樹脂面側が凹形状の硬質透明基板を用いること
を特徴とする液状感光性樹脂版の製造方法。1. A method for producing a liquid photosensitive resin plate, comprising the step of using a liquid photosensitive resin and exposing through a transparent substrate, wherein a hard transparent substrate having a concave resin surface is used. Plate production method.
樹脂面側が凹形状の硬質透明基板を設けたことを特徴と
する液状感光性樹脂版用製版装置。2. A plate making apparatus for a liquid photosensitive resin plate,
A plate making apparatus for a liquid photosensitive resin plate, wherein a hard transparent substrate having a concave resin surface is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24664297A JPH1184633A (en) | 1997-09-11 | 1997-09-11 | Production of photosensitive resin plate and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24664297A JPH1184633A (en) | 1997-09-11 | 1997-09-11 | Production of photosensitive resin plate and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1184633A true JPH1184633A (en) | 1999-03-26 |
Family
ID=17151456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24664297A Pending JPH1184633A (en) | 1997-09-11 | 1997-09-11 | Production of photosensitive resin plate and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1184633A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7064494B2 (en) * | 2001-04-12 | 2006-06-20 | Matsushita Electric Industrial Co., Ltd. | Discharge lamp operating apparatus and self-ballasted electrodeless discharge lamp |
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| WO2023092692A1 (en) * | 2021-11-29 | 2023-06-01 | Tcl华星光电技术有限公司 | Manufacturing method for backlight lamp panel, backlight lamp panel, and backlight module |
| US11892674B2 (en) | 2021-11-29 | 2024-02-06 | Tcl China Star Optoelectronics Technology Co., Ltd | Production method of backlight plate, backlight plate, and backlight module |
-
1997
- 1997-09-11 JP JP24664297A patent/JPH1184633A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7064494B2 (en) * | 2001-04-12 | 2006-06-20 | Matsushita Electric Industrial Co., Ltd. | Discharge lamp operating apparatus and self-ballasted electrodeless discharge lamp |
| JP2010091867A (en) * | 2008-10-09 | 2010-04-22 | Asahi Kasei E-Materials Corp | Method for manufacturing photosensitive resin letterpress plate, and apparatus for manufacturing photosensitive resin letterpress plate |
| WO2023092692A1 (en) * | 2021-11-29 | 2023-06-01 | Tcl华星光电技术有限公司 | Manufacturing method for backlight lamp panel, backlight lamp panel, and backlight module |
| US11892674B2 (en) | 2021-11-29 | 2024-02-06 | Tcl China Star Optoelectronics Technology Co., Ltd | Production method of backlight plate, backlight plate, and backlight module |
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