JPH08255729A - Manufacture of chip electronic component - Google Patents
Manufacture of chip electronic componentInfo
- Publication number
- JPH08255729A JPH08255729A JP5726795A JP5726795A JPH08255729A JP H08255729 A JPH08255729 A JP H08255729A JP 5726795 A JP5726795 A JP 5726795A JP 5726795 A JP5726795 A JP 5726795A JP H08255729 A JPH08255729 A JP H08255729A
- Authority
- JP
- Japan
- Prior art keywords
- anode lead
- wire
- lead frame
- chip
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ状電子部品に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component.
【０００２】[0002]
【従来の技術】従来のフレーム構造を有するチップ状電
子部品は、例えばチップ状固体電解コンデンサの場合、
図４に示したものが一般に知られており、内部素子、即
ちコンデンサ素子１に植設した陽極導出線２と平行方向
に接合する第一のリードフレーム、即ち陽極リードフレ
ーム３と前記コンデンサ素子１とを導電性接着剤５で接
続する第二のリードフレーム、即ち陰極リードフレーム
４とで構成し、コンデンサ素子１をプラスチックパッケ
ージ６で被覆していた。2. Description of the Related Art A chip-shaped electronic component having a conventional frame structure is, for example, a chip-shaped solid electrolytic capacitor,
The one shown in FIG. 4 is generally known, and the first lead frame, that is, the anode lead frame 3 and the capacitor element 1 which are joined to the internal element, that is, the anode lead wire 2 implanted in the capacitor element 1 in a parallel direction. And a second lead frame, that is, a cathode lead frame 4 connected by a conductive adhesive 5, and the capacitor element 1 was covered with a plastic package 6.
【０００３】しかしながら、従来のチップ状電子部品
は、例えば前述のチップ状固体電解コンデンサの場合、
陽極導出線２と陽極リードフレーム３とを重ね合わせた
部分で抵抗溶接して接合する為、陽極導出線２がコンデ
ンサ素子１より引き出される方向へ前記の重ね合わせる
部分、すなわち溶接しろをとる必要がある。However, the conventional chip-shaped electronic component is, for example, in the case of the chip-shaped solid electrolytic capacitor described above,
Since the anode lead-out wire 2 and the anode lead frame 3 are joined by resistance welding at the overlapped portion, it is necessary to take the above-mentioned overlapped portion, that is, the welding margin in the direction in which the anode lead-out wire 2 is pulled out from the capacitor element 1. is there.
【０００４】この溶接しろは、抵抗溶接するときの溶接
電極として用いる溶接チップの厚さに制約される為、陽
極導出線２の長さを短くすることが検討されているが、
実用的に困難であった。Since this welding margin is restricted by the thickness of the welding tip used as a welding electrode in resistance welding, it has been considered to shorten the length of the anode lead wire 2.
It was practically difficult.
【０００５】この為、前述の通り抵抗溶接による陽極導
出線２と陽極リードフレーム３との溶接しろにて、チッ
プ状固体電解コンデンサの体積有効活用率（素子体積／
部品全体の体積）にロスが生じ、コンデンサ素子１の大
きさを制約する、即ちチップ状固体電解コンデンサの体
積有効活用率を制約し、収納容量の拡大を阻害するとい
う問題をもっていた。Therefore, as described above, the effective volume utilization ratio of the chip-shaped solid electrolytic capacitor (element volume / element volume /
There is a problem in that a loss occurs in the volume of the entire component, and the size of the capacitor element 1 is restricted, that is, the effective volume utilization rate of the chip solid electrolytic capacitor is restricted, and expansion of the storage capacity is hindered.
【０００６】以上のような問題を解決する為に、図５に
示したチップ状固体電解コンデンサのように、コンデン
サ素子１に植設した陽極導出線２とほぼ直角方向にレー
ザ溶接にて接合する陽極リードフレーム３と、コンデン
サ素子に導電性接着剤５で接続する陰極リードフレーム
４とがチップ状固体電解コンデンサの下面にて、それら
が表出するようプラスチックパッケージ６を成型したも
のが示されている。In order to solve the above-mentioned problems, as in the chip-shaped solid electrolytic capacitor shown in FIG. 5, it is joined by laser welding in a direction substantially perpendicular to the anode lead wire 2 implanted in the capacitor element 1. A molded plastic package 6 is shown so that the anode lead frame 3 and the cathode lead frame 4 connected to the capacitor element by a conductive adhesive 5 are exposed on the lower surface of the solid electrolytic capacitor. There is.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、前記の
チップ状電子部品は、金属バー７にコンデンサ素子１が
整列するよう陽極導出線２を固定したのち、レーザによ
り陽極リードフレーム３へ陽極導出線２をレーザ溶接す
る工程と、陽極導出線２を定寸カットして金属バー７を
除去する工程を行うとき、確実にレーザを陽極リードフ
レーム３と陽極導出線２とが接する位置にスポット照射
する必要があるため、金属バー７への陽極導出線２の固
定ピッチ寸法を極めて高精度に管理する必要があり、素
子製造工程における生産性が極めて悪いものであった。
さらに、素子製造工程を経て、陽極リードフレーム３と
の溶接工程に至るまでに金属バー７に固定したコンデン
サ素子１の陽極導出線２が曲がることがあり、図６，図
７に示すように陽極リードフレーム３に対する陽極導出
線２の位置が固定されない為、安定してレーザを陽極導
出線２の位置にスポット照射できず、陽極導出線２のカ
ットミスや溶接不良が生じる場合や、さらには充分な溶
接強度を得られずプラスチックパッケ−ジ６の成型時に
断線不良が生じるという問題をもっていた。この為、陽
極導出線２の位置を画像処理などで認識させ、レーザス
ポット位置を補正するなど極めて厳格な位置合わせを必
要としていた。However, in the above-mentioned chip-shaped electronic component, the anode lead wire 2 is fixed to the metal bar 7 so that the capacitor elements 1 are aligned, and then the anode lead wire 2 is connected to the anode lead frame 3 by a laser. Laser welding and the step of removing the metal bar 7 by cutting the anode lead-out wire 2 to a certain size, it is necessary to surely irradiate the laser with a spot at a position where the anode lead frame 3 and the anode lead-out wire 2 are in contact with each other. Therefore, it is necessary to control the fixed pitch dimension of the anode lead-out wire 2 to the metal bar 7 with extremely high precision, and the productivity in the element manufacturing process is extremely poor.
Further, the anode lead-out wire 2 of the capacitor element 1 fixed to the metal bar 7 may be bent before the welding process with the anode lead frame 3 through the element manufacturing process. As shown in FIGS. Since the position of the anode lead-out wire 2 with respect to the lead frame 3 is not fixed, it is not possible to stably irradiate the spot on the position of the anode lead-out wire 2 with a laser, resulting in a cut error or welding failure of the anode lead-out wire 2, or even more However, there is a problem in that a sufficient welding strength cannot be obtained and a disconnection failure occurs when the plastic package 6 is molded. Therefore, it is necessary to perform extremely strict alignment such as recognizing the position of the anode lead wire 2 by image processing and correcting the laser spot position.
【０００８】その上、前記のチップ状電子部品では、モ
ールドパッケージ成型金型を新規に製作して生産ライン
を別に設ける必要があるなど、極めて膨大な設備投資を
要するという問題をもっていた。In addition, the above-mentioned chip-shaped electronic component has a problem that an extremely enormous capital investment is required, for example, it is necessary to newly manufacture a mold package molding die and separately provide a production line.
【０００９】本発明は、上記従来の問題点を解決するも
ので、図４に示す従来のチップ状電子部品に対し、体積
有効活用率に優れ、低コストで、且つ極めて優れた生産
性を得ることのできる製造方法を提供することを目的と
するものである。The present invention solves the above-mentioned problems of the prior art, and is superior to the conventional chip-shaped electronic component shown in FIG. 4 in volume effective utilization rate, low cost, and extremely excellent productivity. It is an object of the present invention to provide a manufacturing method capable of producing the same.
【００１０】[0010]
【課題を解決する為の手段】上記目的を達成する為、本
発明は、陽極導出線２を具備したコンデンサ素子１と陽
極リードフレーム３とを有するチップ状電子部品の製造
方法において、金属バー７にコンデンサ素子１が整列す
るよう陽極導出線２を固定したのち、前記陽極リードフ
レーム３と該陽極導出線２との接合及び該陽極導出線２
の定寸カットを行う場合、陽極リードフレーム３の先端
部の端面から内側に向けて徐々に狭くなるよう構成した
該カット溝に陽極導出線２をはめ込み、陽極導出線２、
コンデンサ素子１、陽極リードフレーム３の少なくとも
１つを押し込み、カット溝と陽極導出線（２）とを接合
して、レーザにより該陽極導出線２を定寸カットし、陽
極導出線２を陽極リードフレーム３のカット溝でレーザ
溶接するようにしたものである。In order to achieve the above object, the present invention provides a method for manufacturing a chip-shaped electronic component having a capacitor element 1 having an anode lead wire 2 and an anode lead frame 3, in which a metal bar 7 is used. After fixing the anode lead-out wire 2 so that the capacitor element 1 is aligned, the joining of the anode lead frame 3 and the anode lead-out wire 2 and the anode lead-out wire 2 are performed.
When the constant size cut is performed, the anode lead-out wire 2 is fitted into the cut groove which is configured to be gradually narrowed inward from the end surface of the tip portion of the anode lead frame 3,
At least one of the capacitor element 1 and the anode lead frame 3 is pushed in, the cut groove is joined to the anode lead wire (2), the anode lead wire 2 is cut to a certain size by a laser, and the anode lead wire 2 is connected to the anode lead. Laser cutting is performed in the cut groove of the frame 3.
【００１１】[0011]
【作用】上記製造方法によれば、陽極リードフレーム３
の先端部に陽極リードフレーム３の端面から徐々に狭く
なるように構成したカット溝を設け、該カット溝に該陽
極導出線２をはめ込み、さらに該カット溝，該陽極導出
線２，コンデンサ素子１の少なくとも１つを押し込むこ
とで、横方向での陽極導出線２の位置決め機能をもたせ
たことにより、金属バー７への素子固定ピッチ寸法の高
精度管理が不要となり、且つレーザ照射スポットの厳格
な位置合せも不要となり、容易に且つ確実に陽極導出線
２の定寸カットと溶接を行うことが可能となると共に、
溶接しろを極めて短くでき、優れた体積有効活用率のチ
ップ状電子部品を得ることができる。According to the above manufacturing method, the anode lead frame 3
A cut groove configured to be gradually narrowed from the end surface of the anode lead frame 3 is provided at the tip end of the anode lead frame 3, the anode lead wire 2 is fitted in the cut groove, and further, the cut groove, the anode lead wire 2, and the capacitor element 1 By pressing at least one of the two, the anode lead-out wire 2 has a lateral positioning function, which eliminates the need for high-precision control of the element fixing pitch dimension to the metal bar 7, and makes the laser irradiation spot strict. Positioning is also unnecessary, and it is possible to easily and reliably cut the anode lead wire 2 to a certain size and perform welding.
The welding margin can be extremely shortened, and a chip-shaped electronic component having an excellent volume effective utilization rate can be obtained.
【００１２】その上、前述の該カット溝と該陽極導出線
２の溶接点は、該カット溝に該陽極導出線２をはめ込
み、該カット溝，該陽極導出線２，コンデンサ素子１の
少なくとも１つ以上を被接合物の方向へ押し込みなが
ら、レーザにより該カット溝と該陽極導出線２とを溶融
させ接合させるものであるから、縦方向での位置決めも
可能となり、チップ状電子部品の体積有効活用率を向上
させることを目的に、該陽極導出線２を陽極リードフレ
ーム３とほぼ直角方向に溶接する構造でかつ、従来のモ
ールド成型金型を使用して金型のパーティングライン即
ち、リードフレームに対するコンデンサ素子１の位置を
従来のチップ状電子部品と同一にすることができるの
で、プラスチックパッケージよりコンデンサ素子１が露
出する外観不良などが生じることが無い為、優れた歩留
を達成し、さらに新規に生産ラインを設ける必要がな
く、低コストで前述の優れた体積有効活用率のチップ状
電子部品を得ることができる。Moreover, at the welding point between the cut groove and the anode lead wire 2 described above, the anode lead wire 2 is fitted in the cut groove, and at least one of the cut groove, the anode lead wire 2 and the capacitor element 1 is formed. Since the cut groove and the anode lead-out wire 2 are melted and joined by the laser while pushing one or more toward the article to be joined, positioning in the vertical direction is also possible, and the volume of the chip-shaped electronic component is effective. For the purpose of improving the utilization rate, the anode lead wire 2 is welded to the anode lead frame 3 in a direction substantially perpendicular to the anode lead frame 3, and the mold parting line, that is, the lead, is formed by using a conventional mold. Since the position of the capacitor element 1 with respect to the frame can be made the same as that of the conventional chip-shaped electronic component, there is a defect in appearance such that the capacitor element 1 is exposed from the plastic package. Because there is no Rukoto excellent achieved yield, without further need to provide a production line to a new, can be obtained at low cost superior volume effective utilization rate of the chip electronic component described above.
【００１３】[0013]
【実施例１】以下に、本発明の一実施例についてチップ
状固体電解コンデンサを製作したものを添付図面を参照
しつつ説明する。[Embodiment 1] An embodiment of the present invention, in which a chip solid electrolytic capacitor is manufactured, will be described below with reference to the accompanying drawings.
【００１４】図１は、本発明によるチップ状電子部品の
チップ状固体電解コンデンサにおける一実施例を示す断
面図、図２は同コンデンサの製造途中の要部の斜視図、
図３は同コンデンサの製造途中の要部の正面図である。FIG. 1 is a sectional view showing an embodiment of a chip-shaped solid electrolytic capacitor of a chip-shaped electronic component according to the present invention, and FIG. 2 is a perspective view of an essential part of the capacitor during manufacturing.
FIG. 3 is a front view of a main part of the capacitor during manufacturing.
【００１５】この図１および、図２においてコンデンサ
素子１は、陽極導出線２を具備した弁作用金属からなる
陽極体を金属バー７に固定し、誘電体酸化皮膜，電解質
層，カーボン層，陰極層を順次形成したものである。In FIG. 1 and FIG. 2, the capacitor element 1 has an anode body made of a valve metal provided with an anode lead wire 2 fixed to a metal bar 7, and a dielectric oxide film, an electrolyte layer, a carbon layer, and a cathode. The layers are sequentially formed.
【００１６】一方、陽極リードフレーム３の先端部に
は、図３に示すように陽極導出線２をはめ込むＶ字状の
カット溝を設けた。On the other hand, the tip of the anode lead frame 3 was provided with a V-shaped cut groove into which the anode lead wire 2 was fitted, as shown in FIG.
【００１７】引き続き、図２に示すよう前記の陽極リー
ドフレーム３のカット溝を設けた先端部を引き起こすよ
うＬ字状にフォーミングした。Subsequently, as shown in FIG. 2, the anode lead frame 3 was formed into an L shape so as to cause the tip end portion provided with the cut groove.
【００１８】次に陽極導出線２を該カット溝にはめ込
み、陽極導出線２を陽極リードフレーム３の方向へ押し
込み、レーザにより陽極導出線２を定寸カットして金属
バー７を除去するとともに、陽極導出線２と陽極リード
フレーム３とをレーザ溶接した。Then, the anode lead-out wire 2 is fitted into the cut groove, the anode lead-out wire 2 is pushed in the direction of the anode lead frame 3, and the anode lead-out wire 2 is sized and cut by a laser to remove the metal bar 7. The anode lead wire 2 and the anode lead frame 3 were laser-welded.
【００１９】又、前記の溶接加工は、陽極導出線２を陽
極リードフレーム３の方向に押さえ込みながらレーザを
照射し、陽極導出線２の位置が陽極リードフレーム３の
水平面上に位置するよう、陽極導出線２及び陽極リード
フレーム３を溶融し、接合させた。In the welding process, the laser is irradiated while pressing the anode lead wire 2 toward the anode lead frame 3 so that the anode lead wire 2 is positioned on the horizontal plane of the anode lead frame 3. The lead wire 2 and the anode lead frame 3 were melted and joined.
【００２０】このとき、陽極導出線２をカット溝にはめ
込み、陽極リードフレーム３の方向へ押し込むことで、
陽極導出線２の横方向への位置補正作用を得、確実に陽
極導出線２上にレーザ光線を照射することが可能とな
り、極めて容易に定寸カットと溶接加工を行うことがで
きた。さらに、陽極導出線２の縦方向での位置補正も可
能となり、下記に述べるプラスチックパッケージ６の成
型金型は、図４に示す従来品のものをそのまま流用可能
とした。At this time, by fitting the anode lead wire 2 into the cut groove and pushing it toward the anode lead frame 3,
It was possible to obtain the function of laterally correcting the anode lead-out wire 2 and reliably irradiate the anode lead-out wire 2 with the laser beam, and it was possible to perform the sizing cut and the welding process extremely easily. Further, it is possible to correct the position of the anode lead wire 2 in the vertical direction, and the conventional mold shown in FIG. 4 can be used as it is as the molding die of the plastic package 6 described below.
【００２１】一方、前記陽極リードフレーム３と陽極導
出線２との接合強度については、図８に示す通り、極め
て良好な強度を得ることができた。On the other hand, regarding the bonding strength between the anode lead frame 3 and the anode lead wire 2, as shown in FIG. 8, extremely good strength could be obtained.
【００２２】続いて、陰極リードフレーム４を前記コン
デンサ素子１に導電性接着剤５で接続したのち、プラス
チックパッケージ６を成型してチップ状固体電解コンデ
ンサを製作した。Subsequently, the cathode lead frame 4 was connected to the capacitor element 1 with a conductive adhesive 5, and then a plastic package 6 was molded to manufacture a chip solid electrolytic capacitor.
【００２３】以上のような製造方法により得られたチッ
プ状固体電解コンデンサは、プラスチックパッケージ６
内のフレーム溶接部及びフレームフォーミング部に費や
されるロス体積を極めて小さくすることができ、図４に
示す従来のチップ状固体電解コンデンサと比較し、約
１.５倍の体積のコンデンサ素子１を収納することがで
きた。The chip-shaped solid electrolytic capacitor obtained by the above manufacturing method is a plastic package 6
The loss volume consumed in the frame welding part and the frame forming part inside can be made extremely small, and the capacitor element 1 of about 1.5 times the volume is stored as compared with the conventional chip-shaped solid electrolytic capacitor shown in FIG. We were able to.
【００２４】尚、陽極リードフレーム３先端部のカット
溝は、Ｖ字状の他、Ｕ字状等、リードフレームの先端部
の端面から内側に向けて徐々に狭くなり、陽極導出線２
がカット溝内でガタつくことのない形状であれば良く、
又、陽極導出線２をカット溝にはめ込んだのち、陽極導
出線２を陽極リードフレーム３の方向に押し込むかわり
に、コンデンサ素子１、陽極導出線２、又は陽極リード
フレーム３を適宜組み合わせて、相対する部品に向けて
押し込んでも同様の効果を得ることはいうまでもない。The cut groove at the tip of the anode lead frame 3 is not only V-shaped but also U-shaped, etc., and is gradually narrowed inward from the end face of the tip of the lead frame.
Should have a shape that does not rattle in the cut groove,
Instead of fitting the anode lead-out wire 2 in the cut groove and then pushing the anode lead-out wire 2 in the direction of the anode lead frame 3, the capacitor element 1, the anode lead-out wire 2, or the anode lead frame 3 is appropriately combined to form a relative structure. It goes without saying that the same effect can be obtained by pushing it toward the part to be processed.
【００２５】又、上記実施例では、チップ状固体電解コ
ンデンサについて述べたが、他のチップ状電子部品にお
いても同様の効果を得ることができる。Further, in the above embodiment, the chip-shaped solid electrolytic capacitor is described, but the same effect can be obtained in other chip-shaped electronic parts.
【００２６】[0026]
【発明の効果】上記製造方法によれば、陽極リードフレ
ーム３の先端部に陽極リードフレーム３の端面から徐々
に狭くなるように構成したカット溝を設け、該カット溝
に該陽極導出線２をはめ込み、さらに該カット溝，該陽
極導出線２，コンデンサ素子１の少なくとも１つを押し
込むことで、陽極導出線２の横方向での位置決め機能を
もたせたことにより、レーザによる陽極導出線２の定寸
カットと、陽極リードフレーム３との溶接のレーザ照射
点は、厳格な位置合せをしなくとも、容易に且つ確実に
陽極導出線２の定寸カットと充分な強度を確保した溶接
を行うことが可能となり、且つ陽極リードフレーム３に
対する陽極導出線２の縦方向の位置は、前述の該カット
溝，該陽極導出線２，コンデンサ素子１の少なくとも１
つを押し込みながら、レーザにより該カット溝と該陽極
導出線２を溶融させ接合させるものである為、従来のチ
ップ状電子部品における陽極リードフレーム３と陽極導
出線２の位置を同一にすることが可能となり、モールド
パッケージ成型金型は従来のものをそのまま流用するこ
とができるので、優れた生産性と体積有効活用率を有す
るチップ状電子部品を低コストで生産することができ
る。According to the above manufacturing method, a cut groove is formed at the tip of the anode lead frame 3 so as to be gradually narrowed from the end face of the anode lead frame 3, and the anode lead wire 2 is provided in the cut groove. Since the anode lead-out wire 2 is provided with a lateral positioning function by fitting at least one of the cut groove, the anode lead-out wire 2 and the capacitor element 1, the anode lead-out wire 2 is fixed by the laser. At the laser irradiation point of the dimensional cut and the welding with the anode lead frame 3, the dimensional cut of the anode lead-out wire 2 and the welding with sufficient strength are performed easily and surely without strict alignment. And the position of the anode lead wire 2 with respect to the anode lead frame 3 in the vertical direction is at least 1 of the cut groove, the anode lead wire 2, and the capacitor element 1 described above.
Since the cut groove and the anode lead-out wire 2 are melted and joined by a laser while pushing in one, the positions of the anode lead frame 3 and the anode lead-out wire 2 in the conventional chip-shaped electronic component can be made the same. Since it is possible to use the conventional mold package molding die as it is, a chip-shaped electronic component having excellent productivity and effective volume utilization can be produced at low cost.
【図１】本発明によるチップ状電子部品のチップ状固体
電解コンデンサにおける一実施例を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a chip solid electrolytic capacitor of a chip electronic component according to the present invention.
【図２】図１の製造途中の要部の斜視図である。FIG. 2 is a perspective view of a main part of the manufacturing process shown in FIG.
【図３】図１の製造途中の要部の正面図である。3 is a front view of the main part of the manufacturing process shown in FIG. 1. FIG.
【図４】従来のチップ状電子部品のチップ状固体電解コ
ンデンサにおける断面図である。FIG. 4 is a cross-sectional view of a conventional chip-shaped solid electrolytic capacitor of a chip-shaped electronic component.
【図５】従来のチップ状電子部品のチップ状固体電解コ
ンデンサにおける他の例の断面図である。FIG. 5 is a cross-sectional view of another example of a conventional chip-shaped solid electrolytic capacitor for a chip-shaped electronic component.
【図６】図５の製造途中の要部の斜視図である。FIG. 6 is a perspective view of a main part during the manufacturing of FIG.
【図７】図１の製造途中の要部の正面図である。FIG. 7 is a front view of the main part during the manufacturing of FIG. 1.
【図８】本発明における導出線とリードフレームとの接
合強度を示す図である。FIG. 8 is a diagram showing a joint strength between a lead wire and a lead frame in the present invention.
１ コンデンサ素子 ２ 陽極導出線 ３ 陽極リードフレーム ４ 陰極リードフレーム ５ 導電性接着剤 ６ プラスチックパッケージ ７ 金属バー 1 Capacitor Element 2 Anode Lead Wire 3 Anode Lead Frame 4 Cathode Lead Frame 5 Conductive Adhesive 6 Plastic Package 7 Metal Bar
Claims (1)
素子（１）と、陽極リードフレーム（３）とを有するチ
ップ状電子部品の製造方法において、陽極リードフレー
ム（３）の先端部の端面から内側に向けて徐々に狭くな
るよう構成したカット溝に陽極導出線（２）をはめ込
み、陽極導出線（２）、コンデンサ素子（１）、陽極リ
ードフレーム（３）の少なくとも１つを押し込み、カッ
ト溝と陽極導出線（２）とを接合して、レーザにより該
陽極導出線（２）を定寸カットする工程と、陽極導出線
（２）を陽極リードフレーム（３）のカット溝でレーザ
溶接する工程からなることを特徴とするチップ状電子部
品の製造方法。1. A method for manufacturing a chip-shaped electronic component having a capacitor element (1) having an anode lead wire (2) and an anode lead frame (3), wherein an end face of a tip portion of the anode lead frame (3). Fit the anode lead wire (2) into the cut groove that is gradually narrowed from the inside to the inside, and press at least one of the anode lead wire (2), the capacitor element (1), and the anode lead frame (3), A step of joining the cut groove and the anode lead wire (2) and cutting the anode lead wire (2) to a predetermined size with a laser, and the step of cutting the anode lead wire (2) with a laser in the cut groove of the anode lead frame (3). A method of manufacturing a chip-shaped electronic component, which comprises a step of welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05726795A JP3359459B2 (en) | 1995-03-16 | 1995-03-16 | Manufacturing method of chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05726795A JP3359459B2 (en) | 1995-03-16 | 1995-03-16 | Manufacturing method of chip-shaped electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08255729A true JPH08255729A (en) | 1996-10-01 |
| JP3359459B2 JP3359459B2 (en) | 2002-12-24 |
Family
ID=13050763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05726795A Expired - Fee Related JP3359459B2 (en) | 1995-03-16 | 1995-03-16 | Manufacturing method of chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3359459B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1209706A2 (en) * | 2000-11-22 | 2002-05-29 | Nec Corporation | Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method |
| US6665172B1 (en) * | 2002-05-22 | 2003-12-16 | Samsung Electro-Mechanics Co., Ltd. | Solid electrolytic capacitor |
-
1995
- 1995-03-16 JP JP05726795A patent/JP3359459B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1209706A2 (en) * | 2000-11-22 | 2002-05-29 | Nec Corporation | Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method |
| EP1209706A3 (en) * | 2000-11-22 | 2006-04-26 | Nec Tokin Corporation | Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method |
| US6665172B1 (en) * | 2002-05-22 | 2003-12-16 | Samsung Electro-Mechanics Co., Ltd. | Solid electrolytic capacitor |
| KR100466071B1 (en) * | 2002-05-22 | 2005-01-13 | 삼성전기주식회사 | A solid electrolytic condenser |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3359459B2 (en) | 2002-12-24 |
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