JPH08236937A - Multilayered flexible printed wiring board - Google Patents
Multilayered flexible printed wiring boardInfo
- Publication number
- JPH08236937A JPH08236937A JP3870695A JP3870695A JPH08236937A JP H08236937 A JPH08236937 A JP H08236937A JP 3870695 A JP3870695 A JP 3870695A JP 3870695 A JP3870695 A JP 3870695A JP H08236937 A JPH08236937 A JP H08236937A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- sided
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、配線回路パターンから
なる導体層が２層以上に積層された可撓性を有する多層
構成のフレキシブルプリント配線板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board having a multilayer structure having flexibility in which two or more conductor layers each having a wiring circuit pattern are laminated.
【０００２】[0002]
【従来の技術】図７は従来の多層フレキシブルプリント
配線板を示す平面図であり、図８はその製造方法を示す
縦断面図である。なお、図７中における実線は表面側配
線回路パターンであり、破線は裏面側配線回路パターン
である。また、図８は図７のＡ−Ａ′断面に対応してな
る。2. Description of the Related Art FIG. 7 is a plan view showing a conventional multilayer flexible printed wiring board, and FIG. 8 is a vertical sectional view showing a manufacturing method thereof. The solid line in FIG. 7 is the front side wiring circuit pattern, and the broken line is the back side wiring circuit pattern. Further, FIG. 8 corresponds to the AA ′ cross section of FIG. 7.
【０００３】該多層フレキシブルプリント配線板は、図
７に示すように、両面に配線回路パターン１，２を有し
てなり、該表面側配線回路パターン１と裏面側配線回路
パターン２とはスルーホール３を介して接続されてな
る。前記裏面側配線回路パターン２は、表面側配線回路
パターン１と平面的に交わる配線回路パターンの引き回
し用として設けられてなる構成である。図中、１ａは表
面側配線回路パターンにおけるランド（電気接続部）で
ある。As shown in FIG. 7, the multilayer flexible printed wiring board has wiring circuit patterns 1 and 2 on both sides, and the front side wiring circuit pattern 1 and the back side wiring circuit pattern 2 are through holes. It is connected through 3. The back surface side wiring circuit pattern 2 is provided for routing the wiring circuit pattern which intersects the front surface side wiring circuit pattern 1 in plan view. In the figure, 1a is a land (electrical connection portion) in the front side wiring circuit pattern.
【０００４】該多層フレキシブルプリント配線板の内部
構造を具体的に説明すると、図８（ｇ）に示すように、
ポリイミドフイルム，ポリエステルフイルム等からなる
ベースフイルム４の両面に接着剤５を介して銅箔６が設
けられ、該銅箔６の上に銅めっきよりなる配線回路パタ
ーン１，２が形成されてなり、各配線回路パターン１，
２はフイルムカバーレイ７にて被覆されてなる構造であ
る。図中、８は片面回路パターンよりなるフレキシブル
部であり、該フレキシブル部８が繰返し折り曲げに必要
な屈曲部分となっている。The internal structure of the multilayer flexible printed wiring board will be described in detail below. As shown in FIG.
Copper foil 6 is provided on both sides of a base film 4 made of a polyimide film, a polyester film or the like via an adhesive 5, and wiring circuit patterns 1 and 2 made of copper plating are formed on the copper foil 6. Each wiring circuit pattern 1,
Reference numeral 2 is a structure covered with a film cover lay 7. In the figure, 8 is a flexible portion having a single-sided circuit pattern, and the flexible portion 8 is a bent portion required for repeated bending.
【０００５】また、本従来例において接着剤層５の無い
構造のものもある。Further, there is a structure in which the adhesive layer 5 is not provided in this conventional example.
【０００６】以下、上述した多層フレキシブルプリント
配線板の一般的な製造方法を図８にしたがって説明す
る。A general method of manufacturing the above-mentioned multilayer flexible printed wiring board will be described below with reference to FIG.
【０００７】まず、図８（ａ）に示すようなベースフイ
ルム４の両面に接着剤５を介して銅箔６を貼った両面銅
張フイルムに、図８（ｂ）に示すように表裏面導通用の
貫通孔３′を形成する。なお、前記両面銅張フイルムに
代わって２層基材と呼ばれるもので接着剤５の無い両面
銅張フイルムを用いるものもある。First, as shown in FIG. 8 (a), a double-sided copper-clad film in which copper foils 6 are adhered to both sides of a base film 4 with an adhesive 5 as shown in FIG. A general through hole 3'is formed. In addition, instead of the double-sided copper-clad film, there is a double-sided substrate called a two-layer base material, which uses a double-sided copper-clad film without the adhesive 5.
【０００８】次に、図８（ｃ）に示すように、全表面に
銅めっき９を施し両面の銅箔６を電気的に導通させる。Next, as shown in FIG. 8C, copper plating 9 is applied to the entire surface to electrically connect the copper foils 6 on both sides.
【０００９】次に、図８（ｄ）に示すように、配線回路
パターン形成を行うためのドライフイルム１０を貼り合
わせ、該ドライフイルム１０をエッチングレジストとす
るため図８（ｅ）に示すように不要な部分を除去する。
続いて、エッチングを行い図８（ｆ）に示すようにスル
ーホール３と所望の配線回路パターン１，２が形成され
る。Next, as shown in FIG. 8 (d), a dry film 10 for forming a wiring circuit pattern is attached, and the dry film 10 is used as an etching resist, as shown in FIG. 8 (e). Remove unnecessary parts.
Then, etching is performed to form through holes 3 and desired wiring circuit patterns 1 and 2 as shown in FIG.
【００１０】この後、図８（ｇ）に示すように前記スル
ーホール３と配線回路パターン１，２とをフイルムカバ
ーレイ７にて保護するため、カバーレイ接着剤を間に介
してカバーレイフイルムにて圧着してなる。なお、前記
フイルムカバーレイ７は、カバーレイフイルム及びカバ
ーレイ接着剤より構成される。Thereafter, as shown in FIG. 8G, in order to protect the through hole 3 and the wiring circuit patterns 1 and 2 with a film cover lay 7, a cover lay film is interposed with a cover lay adhesive. It is crimped by. The film cover lay 7 is composed of a cover lay film and a cover lay adhesive.
【００１１】[0011]
【発明が解決しようとする課題】従来の多層フレキシブ
ルプリント配線板は、表裏面の配線回路パターン１，２
を接続するためにスルーホール３を設けており、該スル
ーホール３は孔明け及び銅めっきを施す必要があり、製
造工程が複雑で、接続信頼性に関する制御が難しい。例
えば、孔明け工程ではドリルの回転数，送りスピード，
ヒット数管理等の制御であり、銅めっき工程では孔壁面
のクリーニング処理，液管理，通電量，通電時間等の制
御である。The conventional multilayer flexible printed wiring board has the wiring circuit patterns 1 and 2 on the front and back surfaces.
The through hole 3 is provided for connecting the holes, and the through hole 3 needs to be perforated and copper-plated, the manufacturing process is complicated, and it is difficult to control the connection reliability. For example, the drilling speed, feed speed,
It is control such as hit number management, and in the copper plating process is control of hole wall cleaning processing, liquid management, energization amount, energization time, and the like.
【００１２】また、フレキシブル部８は繰返し折り曲げ
が行われ、該フレキシブル部８は薄い方が屈曲特性に優
れが、従来の多層フレキシブルプリント配線板のフレキ
シブル部８は、銅箔６が除去された部分（配線回路パタ
ーンが形成されていない部分）であっても接着剤５が残
っており、その分厚くなり屈曲特性が低下していた。具
体的に説明すると、銅箔めっきの厚みは接続の信頼性か
ら最低でも１０μｍ以上は必要で平均１７μｍの厚みに
て形成されており、また一般的にベースフイルム４、接
着剤５、銅箔６の厚みは各々２５μｍ、１５μｍ、１８
μｍからなり、従来のフレキシブル部８の総厚は９０μ
ｍとなっている。Further, the flexible portion 8 is repeatedly bent, and the thinner the flexible portion 8 is, the more excellent the bending property is. However, in the flexible portion 8 of the conventional multilayer flexible printed wiring board, the copper foil 6 is removed. Even in (the portion where the wiring circuit pattern is not formed), the adhesive 5 remains, and the adhesive 5 becomes thicker by that amount, and the bending property is deteriorated. More specifically, the thickness of the copper foil plating must be at least 10 μm or more in terms of reliability of connection, and the average thickness is 17 μm. Generally, the base film 4, the adhesive 5, and the copper foil 6 are formed. The thickness of each is 25 μm, 15 μm, 18
The conventional flexible part 8 has a total thickness of 90 μm.
It has become m.
【００１３】ここで、フレキシブル部８の厚みを薄くす
るため、２層基材を用い接着剤５を無くして薄くする構
造も考えられているが、該構造では接着剤５が無いので
引き裂き強度に劣り、少しのきっかけで多層フレキシブ
ルプリント配線板が裂けるため、使用用途が限定され
る。Here, in order to reduce the thickness of the flexible portion 8, a structure in which the adhesive 5 is eliminated by using a two-layer base material is also considered, but since the adhesive 5 is not present in this structure, the tear strength is improved. Inferiorly, since the multilayer flexible printed wiring board is torn by a little trigger, its use is limited.
【００１４】さらに、配線回路パターン１，２を保護す
るフイルムカバーレイ７は、導体（銅箔）間の隙間を埋
め込むため、銅箔の厚みに比例してカバーレイ接着剤の
厚みが厚くなる。例えば、銅厚みが１８μｍ（銅箔のみ
の厚み）であれば、カバーレイ接着剤は２０μｍで十分
であるが、銅厚みが３５μｍ（銅箔＋銅めっきの厚み）
となるとカバーレイ接着剤は３０μｍは絶対必要であ
る。したがって、銅厚みが銅めっきによって厚くなると
カバーレイ接着剤も厚くなるため、総厚が厚くなり屈曲
特性が著しく低下する。Further, since the film coverlay 7 for protecting the wiring circuit patterns 1 and 2 fills the gap between the conductors (copper foil), the thickness of the coverlay adhesive increases in proportion to the thickness of the copper foil. For example, if the copper thickness is 18 μm (thickness of copper foil only), 20 μm is sufficient for the coverlay adhesive, but the copper thickness is 35 μm (copper foil + copper plating thickness).
Then, the coverlay adhesive is absolutely necessary to have a thickness of 30 μm. Therefore, if the copper thickness is increased by copper plating, the cover lay adhesive is also increased, resulting in an increase in the total thickness and a marked decrease in bending characteristics.
【００１５】本発明は、上記課題に鑑み、スルーホール
による導体層間の接続を廃止するとともに、フレキシブ
ル部の薄型化としてなる多層フレキシブルプリント配線
板の提供を目的とする。In view of the above problems, it is an object of the present invention to provide a multilayer flexible printed wiring board which eliminates the connection between conductor layers by through holes and makes the flexible portion thinner.
【００１６】[0016]
【課題を解決するための手段】本発明の請求項１記載の
多層フレキシブルプリント配線板は、複数の導体パター
ンが積層された積層部と該導体パターンの内の一つが引
き出されてなるフレキシブル部とを備えてなる多層フレ
キシブルプリント配線板において、可撓性を有する第１
ベースフイルムの一方の面に接着剤を介して第１導体パ
ターンを積層してなる第１片面フレキシブルプリント配
線板と、可撓性を有する第２ベースフイルムの一方の面
に接着剤を介して第２導体パターンを積層し、該第２導
体パターンの一部を突出させてなる第２片面フレキシブ
ルプリント配線板とを有し、上記積層部は前記第１片面
フレキシブルプリント配線板と第２片面フレキシブルプ
リント配線板とを互いの導体パターン側を対向させ前記
突出部を除く配線板間に接着剤を介して積層されるとと
もに該突出部にて第１導体パターンと第２導体パターン
とが接続されてなり、上記フレキシブル部は前記第１片
面フレキシブルプリント配線板又は第２片面フレキシブ
ルプリント配線板が延在形成されてなることを特徴とす
るものである。A multilayer flexible printed wiring board according to claim 1 of the present invention comprises a laminated portion in which a plurality of conductor patterns are laminated, and a flexible portion in which one of the conductor patterns is pulled out. A multilayer flexible printed wiring board comprising:
A first single-sided flexible printed wiring board in which a first conductor pattern is laminated on one surface of a base film via an adhesive, and a first single-sided flexible printed wiring board having flexibility on one surface of the second base film via an adhesive. A second one-sided flexible printed wiring board formed by stacking two conductor patterns and projecting a part of the second conductor pattern, wherein the laminated portion includes the first one-sided flexible printed wiring board and the second one-sided flexible printed board. The wiring board and the conductor pattern sides are opposed to each other, and the wiring boards except the protruding portions are laminated with an adhesive agent and the first conductor pattern and the second conductor pattern are connected by the protruding portions. The flexible portion is formed by extending and forming the first one-sided flexible printed wiring board or the second one-sided flexible printed wiring board.
【００１７】本発明の請求項２又は３記載の多層フレキ
シブルプリント配線板は、前記突出部を湾曲形成又は第
２導体パターンに金属体を設けてなることを特徴とする
ものである。The multilayer flexible printed wiring board according to claim 2 or 3 of the present invention is characterized in that the protruding portion is formed in a curved shape or a metal body is provided on the second conductor pattern.
【００１８】本発明の請求項４記載の多層フレキシブル
プリント配線板は、前記突出部の第２導体パターン表面
及び該突出部に対応する部分の第１導体パターン表面が
金属めっきにて被覆されてなることを特徴とするもので
ある。According to a fourth aspect of the present invention, in the multilayer flexible printed wiring board, the surface of the second conductor pattern of the projecting portion and the surface of the first conductor pattern corresponding to the projecting portion are coated with metal plating. It is characterized by that.
【００１９】[0019]
【作用】上記構成によれば、本発明の請求項１乃至３記
載の多層フレキシブルプリント配線板は、第１導体パタ
ーンと第２導体パターンとが湾曲形成又は金属体等によ
る突出部によって接続されてなる構成なので、従来のス
ルーホールによる接続を廃止でき、これにより該スルー
ホールを形成するための孔明け、銅めっき等の複雑でま
た接続信頼性に関わる制御が難しい工程を必要とせず電
気的接続が得られる。According to the above structure, in the multilayer flexible printed wiring board according to the first to third aspects of the present invention, the first conductor pattern and the second conductor pattern are connected to each other by a curved shape or a protrusion formed of a metal body or the like. With this configuration, it is possible to eliminate the conventional connection using through holes, which makes it possible to make electrical connections without the need for complicated steps such as drilling and copper plating to form the through holes and difficult control of connection reliability. Is obtained.
【００２０】さらに、フレキシブル部が片面フレキシブ
ルプリント配線板により構成され、従来のフレキシブル
部と比較して薄型化が図れ、屈曲特性を向上することが
できる。Furthermore, since the flexible portion is formed of a single-sided flexible printed wiring board, the flexible portion can be made thinner than the conventional flexible portion, and the bending characteristics can be improved.
【００２１】本発明の請求項４記載の多層フレキシブル
プリント配線板は、前記突出部の第２導体パターン表面
及び該突出部に対応する部分の第１導体パターン表面が
金属めっきにて被覆されてなる構成なので、積層前及び
積層時において接続部となる部分の第１導体パターン表
面及び第２導体パターン表面が酸化するのを防止するこ
とができ、第１導体パターンと第２導体パターンとの電
気接続において酸化膜による抵抗値の増加を防止するこ
とができる。According to a fourth aspect of the present invention, in the multilayer flexible printed wiring board, the surface of the second conductor pattern of the projecting portion and the surface of the first conductor pattern corresponding to the projecting portion are coated with metal plating. Because of the constitution, it is possible to prevent the surface of the first conductor pattern and the surface of the second conductor pattern in the portion which will be the connection portion before and during the lamination from being oxidized, and the electrical connection between the first conductor pattern and the second conductor pattern can be prevented. In, it is possible to prevent the resistance value from increasing due to the oxide film.
【００２２】[0022]
【実施例】図１は、本発明の一実施例よりなる多層フレ
キシブルプリント配線板の構造を示す縦断面図である。1 is a vertical sectional view showing the structure of a multilayer flexible printed wiring board according to an embodiment of the present invention.
【００２３】該多層フレキシブルプリント配線板（以
下、「多層ＦＰＣ」と称す。）２１は、第１片面フレキ
シブルプリント配線板（以下、「第１片面ＦＰＣ」と称
す。）２２と第２片面フレキシブルプリント配線板（以
下、「第２片面ＦＰＣ」と称す。）２３とからなる構成
であり、該第１片面ＦＰＣ２２と第２片面ＦＰＣとが間
に接着剤２４を介して積層された積層部２１ａと、前記
第１片面ＦＰＣ２２が該積層部２１ａより延在形成され
てなるフレキシブル部２１ｂとを備え、前記第２片面Ｆ
ＰＣ側の多層ＦＰＣ表面側がフイルムカバーレイ２５に
て被覆されてなる。The multilayer flexible printed wiring board (hereinafter referred to as "multilayer FPC") 21 includes a first single-sided flexible printed wiring board (hereinafter referred to as "first single-sided FPC") 22 and a second single-sided flexible print. A wiring board (hereinafter, referred to as "second one-sided FPC") 23 and a laminated portion 21a in which the first one-sided FPC 22 and the second one-sided FPC are laminated with an adhesive 24 therebetween. , A flexible portion 21b formed by extending the first one-sided FPC 22 from the laminated portion 21a, and the second one-sided F
The surface of the multilayer FPC on the PC side is covered with a film cover lay 25.
【００２４】前記第１片面ＦＰＣ２２は、ポリイミドフ
イルム，ポリエステルフイルム等からなるベースフイル
ム２６の一方の面に接着剤２７を介して配線回路パター
ン２８が設けられてなる。The first single-sided FPC 22 is provided with a wiring circuit pattern 28 on one surface of a base film 26 made of a polyimide film, a polyester film or the like via an adhesive 27.
【００２５】前記第２片面ＦＰＣ２３は、前記第１片面
ＦＰＣ２２同様にポリイミドフイルム，ポリエステルフ
イルム等からなるベースフイルム２９の一方の面に接着
剤３０を介して配線回路パターン３１が設けられてな
り、該配線回路パターン３１の一部が突出するよう湾曲
されて突出部２３ａが形成されてなる。Like the first single-sided FPC 22, the second single-sided FPC 23 is provided with a wiring circuit pattern 31 on one side of a base film 29 made of a polyimide film, a polyester film or the like via an adhesive 30. A part of the wiring circuit pattern 31 is curved so as to project to form a projecting portion 23a.
【００２６】前記積層部２１ａは、前記第１片面ＦＰＣ
２２と第２片面ＦＰＣ２３とを、互いの配線回路パター
ン２８，３１を対向させ、前記突出部２３ａを除く第１
片面ＦＰＣ２２と第２片面ＦＰＣ２３との間に前記接着
剤２４を介して積層されてなる。前記配線回路パターン
２８と配線回路パターン３１とは、前記突出部２３ａに
より突出した第２配線回路パターン３１の配線回路パタ
ーン部分で電気的に接続されてなる。The laminated portion 21a is made up of the first single-sided FPC.
22 and the second single-sided FPC 23, the wiring circuit patterns 28 and 31 are opposed to each other, and the first protruding portion 23a is excluded.
The one-sided FPC 22 and the second one-sided FPC 23 are laminated via the adhesive 24. The wiring circuit pattern 28 and the wiring circuit pattern 31 are electrically connected at the wiring circuit pattern portion of the second wiring circuit pattern 31 which is projected by the projecting portion 23a.
【００２７】前記フレキシブル部２１ｂは、前記第１片
面ＦＰＣ２１の全ての構成が前記積層部２１ａから延在
形成されてなる。The flexible portion 21b is formed by extending the entire structure of the first single-sided FPC 21 from the laminated portion 21a.
【００２８】前記フイルムカバーレイ２５は、カバーレ
イフイルム及びカバーレイ接着剤からなる。The film coverlay 25 comprises a coverlay film and a coverlay adhesive.
【００２９】前記突出部２３ａにおける第２配線回路パ
ターン３１表面及び該第２配線回路パターン３１に対応
する部分の第１配線回路パターン２８表面に金属めっき
を施すことにより、積層前及び積層時において接続部と
なる部分の第１配線回路パターン表面及び第２配線回路
パターン表面が酸化し酸化膜が形成されるのを防止する
ことができる。これにより、該酸化膜によって第１配線
回路パターン２８と第２配線回路パターン３１との間の
抵抗値が増加することが防止される。該抵抗値が増加す
ると電流の流れが悪くなる。Metal plating is applied to the surface of the second wiring circuit pattern 31 in the protruding portion 23a and the surface of the first wiring circuit pattern 28 at a portion corresponding to the second wiring circuit pattern 31, so as to connect before and during lamination. It is possible to prevent the surface of the first wiring circuit pattern and the surface of the second wiring circuit pattern of the portion to be oxidized from being oxidized to form an oxide film. This prevents the oxide film from increasing the resistance value between the first wiring circuit pattern 28 and the second wiring circuit pattern 31. When the resistance value increases, the current flow becomes worse.
【００３０】前記酸化膜は、例えば積層前の時間の経
過、積層時の第１片面ＦＰＣ２２と第２片面ＦＰＣ２３
との圧着の際の熱によりその表面に形成される。The oxide film is formed by, for example, the passage of time before stacking, the first one-sided FPC 22 and the second one-sided FPC 23 at the time of stacking.
It is formed on the surface by the heat of the pressure bonding with.
【００３１】前記金属めっきとしては、例えば金めっ
き，半田めっき等にて構成する。The metal plating may be gold plating, solder plating, or the like.
【００３２】以下、上述した多層ＦＰＣの製造方法につ
いて図１乃至図４にしたがって説明する。図２は、第１
片面ＦＰＣの製造工程図であり、図３は第２片面ＦＰＣ
の製造工程図であり、図４は第２片面ＦＰＣの湾曲形成
方法を示す図である。A method of manufacturing the above-mentioned multilayer FPC will be described below with reference to FIGS. FIG. 2 shows the first
FIG. 3 is a manufacturing process diagram of a single-sided FPC, and FIG. 3 shows a second single-sided FPC.
FIG. 4 is a manufacturing process diagram of, and FIG. 4 is a diagram showing a method for forming a curve of the second single-sided FPC.
【００３３】まず、第１片面ＦＰＣ２２の製造方法につ
いて説明すると、図２（ａ）に示すように、ベースフイ
ルム２６の一方の面に接着剤２７を介して銅箔２８′を
貼った片面銅張フイルムを用い、図２（ｂ）に示すよう
に、回路パターン形成を行うためのドライフイルム３２
を貼り合わせ、該ドライフイルム３２をエッチングレジ
ストとするため図２（ｃ）に示すように不要な部分を除
去する。続いて、エッチングを行い図２（ｄ）に示すよ
うに所望の配線回路パターン２８が形成されて第１片面
ＦＰＣ２２が得られる。これを、フレキシブル部２１ｂ
となる屈曲部分を有する下側の片面ＦＰＣとする。前記
金属めっきは、第１配線回路パターン２８形成後に続い
て該第１配線回路パターン２８表面に施す。First, a method of manufacturing the first single-sided FPC 22 will be described. As shown in FIG. 2A, a single-sided copper-clad sheet having a copper foil 28 'attached to one surface of the base film 26 with an adhesive 27 is used. As shown in FIG. 2B, a dry film 32 for forming a circuit pattern is formed using the film.
Are bonded to each other, and unnecessary portions are removed as shown in FIG. 2C in order to use the dry film 32 as an etching resist. Then, etching is performed to form a desired wiring circuit pattern 28 as shown in FIG. 2D, and the first single-sided FPC 22 is obtained. This is the flexible part 21b
The single-sided FPC on the lower side having a bent portion that becomes The metal plating is applied to the surface of the first wiring circuit pattern 28 after the first wiring circuit pattern 28 is formed.
【００３４】次に、第２片面ＦＰＣ２３の製造方法につ
いて説明すると、図３（ａ）に示すように、上記第１片
面ＦＰＣ２２と同様の製造方法で所望の配線回路パター
ン３１まで形成し、次に図３（ｂ）に示すように、配線
回路パターン３１の一部が突出するよう突出部２３ａを
２箇所形成するとともに、該突出部２３ａにおける配線
回路パターン表面に金属めっき３３を施す。この後、該
突出部２３ａを除く第２片面ＦＰＣ２３表面に接着剤２
４を塗布して第２片面ＦＰＣ２３が得られる。これを、
上側の片面ＦＰＣとする。Next, a method of manufacturing the second one-sided FPC 23 will be described. As shown in FIG. 3A, a desired wiring circuit pattern 31 is formed by the same manufacturing method as that of the first one-sided FPC 22, and then, as shown in FIG. As shown in FIG. 3B, two protrusions 23a are formed so that a part of the wiring circuit pattern 31 protrudes, and a metal plating 33 is applied to the surface of the wiring circuit pattern in the protrusion 23a. After that, the adhesive 2 is applied to the surface of the second single-sided FPC 23 excluding the protrusion 23a.
4 is applied to obtain the second one-sided FPC 23. this,
The upper one-sided FPC.
【００３５】該第２片面ＦＰＣ２３の製造方法におい
て、突出部２３ａの湾曲形成方法として、例えば図４
（ａ）に示すような金型を用い金型加工によって形成す
る。In the method of manufacturing the second one-sided FPC 23, as a method of forming the curved portion of the protrusion 23a, for example, FIG.
The mold is formed by using a mold as shown in FIG.
【００３６】該金型は上型ポンチ４１と下型ダイ４２と
からなり、該下型ダイ４２は貫通孔４３を備え、前記上
型ポンチ４１は該貫通孔４３を挿通する構造からなる。The die comprises an upper die punch 41 and a lower die 42. The lower die 42 has a through hole 43, and the upper die punch 41 has a structure in which the through hole 43 is inserted.
【００３７】一般的に配線回路パターン間を接続するラ
ンド寸法は直径０．８ｍｍであり、本実施例においても
突起部２３ａの直径を０．８ｍｍに仕上げる金型寸法と
する。具体的には、上型ポンチ４１を直径０．４５ｍ
ｍ、下型ダイ４１の貫通孔４３径を０．６５ｍｍとし、
ストロークを０．３ｍｍで設定する。Generally, the size of the land for connecting the wiring circuit patterns is 0.8 mm, and the size of the die for finishing the diameter of the protrusion 23a to 0.8 mm is also used in this embodiment. Specifically, the upper punch 41 has a diameter of 0.45 m.
m, the through hole 43 diameter of the lower die 41 is 0.65 mm,
Set the stroke to 0.3 mm.
【００３８】該金型による湾曲形成は、図４（ｂ）に示
すような配線回路パターン３１まで作成された第２片面
ＦＰＣ２３をベースフイルム２８側から配線回路パター
ン３１側へ突き出すように加工を行う。これにより、図
４（ｃ）に示すように、盛り上がり径０．８ｍｍ、突起
高さ０．２３ｍｍの突出部２３ａを得ることができる。In the curved formation by the mold, the second one-sided FPC 23 having the wiring circuit pattern 31 as shown in FIG. 4B is processed so as to project from the base film 28 side to the wiring circuit pattern 31 side. . As a result, as shown in FIG. 4C, it is possible to obtain the protruding portion 23a having a raised diameter of 0.8 mm and a protrusion height of 0.23 mm.
【００３９】このように作成されてなる第１片面ＦＰＣ
２２と第２片面ＦＰＣ２３とを、図１に示すように互い
の配線回路パターン２８，３１側が対向するよう積層
し、該配線回路パターン２８，３１を前記突出部２３ａ
にて接続するとともに、該突出部２３ａを除く片面ＦＰ
Ｃ２２，２３間を接着剤２４にて接着する。この後、フ
レキシブル部２１ｂにおける第１片面ＦＰＣ２２の配線
回路パターン２８の保護のため、該配線回路パターン２
８側をフイルムカバーレイ２５にて被覆し、多層ＦＰＣ
が得られる。First single-sided FPC formed in this way
22 and the second single-sided FPC 23 are laminated so that the wiring circuit patterns 28 and 31 are opposed to each other as shown in FIG. 1, and the wiring circuit patterns 28 and 31 are formed on the protruding portion 23a.
And the single-sided FP except for the protrusion 23a.
An adhesive 24 is used to bond between C22 and C23. Thereafter, in order to protect the wiring circuit pattern 28 of the first one-sided FPC 22 in the flexible portion 21b, the wiring circuit pattern 2
8 side is covered with a film coverlay 25, and a multi-layer FPC
Is obtained.
【００４０】前記接着剤２４としては、２５〜４０μｍ
の厚みで絶縁層を兼ねた熱硬化タイプのものを使用し、
第１片面ＦＰＣ２２と第２片面ＦＰＣ２３との接着はフ
イルムカバーレイ２５による被覆の後、１６０℃、１０
分、８００Ｎ／ｃｍ2 の条件でプレス圧着する。また、
耐熱が不要な場合は１４０℃、０．４ｍ／分、６０Ｎ／
ｃｍ2 の条件でローラ圧着することも可能である。The adhesive 24 is 25 to 40 μm.
Use a thermosetting type that doubles as an insulating layer with the thickness of
The first one-sided FPC 22 and the second one-sided FPC 23 are adhered to each other after coating with the film cover lay 25 at 160 ° C. for 10
And press-bonding under the condition of 800 N / cm 2 . Also,
If heat resistance is not required, 140 ℃, 0.4m / min, 60N /
It is also possible to perform roller pressure bonding under the condition of cm 2 .
【００４１】次に、本発明の他の実施例よりなる多層Ｆ
ＰＣを説明する。本実施例では上記実施例と相異する点
のみ説明する。図５は、第２片面ＦＰＣの製造工程を示
す縦断面図である。Next, a multi-layer F according to another embodiment of the present invention.
The PC will be described. In this embodiment, only points different from the above embodiment will be described. FIG. 5 is a vertical cross-sectional view showing the manufacturing process of the second single-sided FPC.
【００４２】該多層ＦＰＣは、図５（ｄ）に示すよう
に、上記実施例の第２片面ＦＰＣの突出部の屈曲形成に
代わって、配線回路パターン３１上にニッケル−金めっ
き，半田めっき等の金属体３４を付着して突出部を形成
してなる構成である。As shown in FIG. 5 (d), the multi-layer FPC has nickel-gold plating, solder plating, etc. on the wiring circuit pattern 31 instead of bending the protruding portion of the second single-sided FPC of the above embodiment. The metal body 34 is attached to form a protrusion.
【００４３】該第２片面ＦＰＣ２３′の製造方法につい
て以下説明する。図５（ａ）に示すように配線回路パタ
ーン３１まで作成された第２片面ＦＰＣ２３′に、図５
（ｂ）に示すようにめっきレジストに使用する５０μｍ
厚さのドライフイルム３５を貼り合わせ、該ドライフイ
ルム３５の突出部を形成する部分に開口３６を設ける。
該開口径は直径０．４ｍｍが望ましい。次に、図５
（ｃ）に示すように、開口３６内に金属体３４を注入す
る。この後、図５（ｄ）に示すように、ドライフイルム
３５を剥離する。これにより、ドライフイルム３５の厚
さ分５０μｍの高さの突出部が得られる。A method of manufacturing the second one-sided FPC 23 'will be described below. As shown in FIG. 5 (a), the second single-sided FPC 23 'having the wiring circuit pattern 31 formed therein has
50 μm used for plating resist as shown in (b)
The dry film 35 having a thickness is adhered to each other, and the opening 36 is provided in a portion of the dry film 35 where the projecting portion is formed.
The opening diameter is preferably 0.4 mm. Next, FIG.
As shown in (c), the metal body 34 is injected into the opening 36. After that, as shown in FIG. 5D, the dry film 35 is peeled off. Thereby, a protrusion having a height of 50 μm corresponding to the thickness of the dry film 35 is obtained.
【００４４】上記実施例の多層ＦＰＣ２１によれば、第
１配線回路パターン２８と第２配線回路パターン３１と
が湾曲形成又は金属体３４等による突出部２３ａにて接
続されてなる構成なので、従来のスルーホールによる接
続を廃止でき、これにより該スルーホールを形成するた
めの孔明け、銅めっき等の複雑でまた接続信頼性に関わ
る制御が難しい工程を必要とせず電気的接続が得られ、
多層ＦＰＣ２１としての信頼性を向上することができ
る。According to the multi-layer FPC 21 of the above-mentioned embodiment, the first wiring circuit pattern 28 and the second wiring circuit pattern 31 are formed in a curved shape or are connected to each other by the protruding portion 23a such as the metal body 34. The connection by the through hole can be abolished, and thereby the electric connection can be obtained without the need for complicated steps such as drilling for forming the through hole, copper plating, etc. and difficult control of connection reliability.
The reliability of the multilayer FPC 21 can be improved.
【００４５】また、多層ＦＰＣ２１のフレキシブル部２
１ｂが片面ＦＰＣにて構成されており、当然ながら銅め
っきは施されておらず、銅厚みが配線回路パターンの銅
箔厚のみで設定でき薄くなる。これに伴い、カバーレイ
接着剤も薄くなる。また、裏面側に接着剤が残ることも
ない。Further, the flexible portion 2 of the multi-layer FPC 21
1b is composed of a single-sided FPC, of course, copper plating is not applied, and the copper thickness can be set only by the copper foil thickness of the wiring circuit pattern and becomes thin. Along with this, the coverlay adhesive also becomes thinner. Further, no adhesive remains on the back surface side.
【００４６】図６は上記実施例と従来例とのフレキシブ
ル部２１ｂの総厚の対比図であり、Ａ，Ｂ，Ｃはそれぞ
れ上記実施例の一例であり、Ｄは本実施例に対応する従
来例であり、Ｅは２層基材を用いた従来例である。FIG. 6 is a comparison diagram of the total thickness of the flexible portion 21b in the above-described embodiment and the conventional example. A, B and C are examples of the above-mentioned embodiment, and D is a conventional example corresponding to this embodiment. This is an example, and E is a conventional example using a two-layer base material.
【００４７】実施例Ａは従来例Ｄに対して銅めっき及び
裏面側接着剤を無くした構成である。実施例Ｂは銅箔厚
に対応させてカバーレイ接着剤厚を薄くした構成であ
る。実施例Ｃは従来例Ｄと同等の銅厚を有し裏面側接着
剤のみ除去した構成である。従来例Ｄは銅箔とベースフ
イルムとの間に接着剤を有する場合の構成である。従来
例Ｅは銅箔とベースフイルムとの間の接着剤が無い場合
の構成である。The example A has a structure in which the copper plating and the adhesive on the back surface side are eliminated from the conventional example D. Example B has a configuration in which the thickness of the cover lay adhesive is reduced to correspond to the thickness of the copper foil. The example C has the same copper thickness as the conventional example D and has a structure in which only the back surface side adhesive is removed. Conventional example D is a configuration in which an adhesive is provided between the copper foil and the base film. Conventional example E is a configuration in which there is no adhesive between the copper foil and the base film.
【００４８】該対比図にて明らかな通り、実施例Ａにお
いてはフレキシブル部２１ａの総厚を従来例よりも３２
μｍ薄くすることが可能となり、屈曲特性が優れ、また
屈曲回数についても向上される。As is clear from the comparison diagram, in the embodiment A, the total thickness of the flexible portion 21a is 32 as compared with the conventional example.
It becomes possible to reduce the thickness by μm, the bending characteristics are excellent, and the number of times of bending is also improved.
【００４９】さらに、実施例Ｂで示すように銅厚１８μ
ｍに対応させてカバーレイ接着剤厚２０μｍとすること
により、実施例Ａに対してさらに２倍の屈曲回数を得る
ことができる。Further, as shown in Example B, the copper thickness is 18 μm.
By setting the coverlay adhesive thickness to 20 μm corresponding to m, the number of times of bending can be further doubled as compared with Example A.
【００５０】実施例Ｃと従来例Ｄとは銅厚が同じで裏面
側の接着剤が有るか無いかであるが、屈曲回数は本実施
例のものの方が２倍良い。また、従来例Ｅのように２層
基材を用いても実施例Ｃと同レベルにしかならないこと
が確認されている。The example C and the conventional example D have the same copper thickness and the presence or absence of the adhesive on the back surface side, but the number of bendings is twice as good in this example. Further, it has been confirmed that even if a two-layer base material is used as in Conventional Example E, the level is only the same as in Example C.
【００５１】なお、上記実施例において、前記片面銅張
フイルムに代わって２層基材と呼ばれるもので接着剤２
７，３０の無い片面銅張フイルムを用いても良い。In the above embodiment, the one-sided copper-clad film is replaced by a two-layer base material, which is adhesive 2
A single-sided copper clad film without 7, 30 may be used.
【００５２】また、上記実施例においては、第２片面Ｆ
ＰＣ２３，２３′に突出部２３ａを設けたが、該突出部
２３ａを第１ＦＰＣ２２に設けた構成であっても良い。In the above embodiment, the second side F
Although the projections 23a are provided on the PCs 23 and 23 ', the projections 23a may be provided on the first FPC 22.
【００５３】[0053]
【発明の効果】以上説明したように、本発明の請求項１
乃至３記載の多層フレキシブルプリント配線板によれ
ば、第１導体パターンと第２導体パターンとが湾曲形成
又は金属体等による突出部にて接続されてなる構成なの
で、従来のスルーホールによる接続を廃止でき、これに
より該スルーホールを形成するための孔明け、銅めっき
等の複雑でまた接続信頼性に関わる制御が難しい工程を
必要とせず電気的接続が得られ、多層フレキシブルプリ
ント配線板としての信頼性が向上される。As described above, according to the first aspect of the present invention.
According to the multilayer flexible printed wiring board described in any one of 3 to 3, since the first conductor pattern and the second conductor pattern are connected by a curved portion or a projecting portion such as a metal body, the conventional connection by a through hole is abolished. As a result, an electrical connection can be obtained without the need for complicated and complicated control processes such as drilling and copper plating for forming the through hole, and reliability as a multilayer flexible printed wiring board. The property is improved.
【００５４】さらに、フレキシブル部おいて、従来では
該フレキシブル部を両面フレキシブルプリント配線板の
一方の銅箔を除去してなる構成であったために接着剤が
残っており、また銅めっきが必要であったため銅厚が大
きくなっていたが、本発明では前記接着剤及び銅めっき
のない片面フレキシブルプリント配線板により構成され
るので、従来のフレキシブル部と比較して薄型化が図
れ、非常に優れた屈曲特性が得られる。Further, in the flexible part, since the conventional flexible part is constructed by removing one copper foil of the double-sided flexible printed wiring board, the adhesive remains, and copper plating is required. Therefore, the copper thickness was large, but in the present invention, since it is composed of the adhesive and the single-sided flexible printed wiring board without copper plating, it can be made thinner than the conventional flexible portion, and it has excellent bending. The characteristics are obtained.
【００５５】本発明の請求項４記載の多層フレキシブル
プリント配線板によれば、前記突出部の導体パターン表
面及び該突出部に対応する部分の第１導体パターン表面
が金属めっきにて被覆されてなる構成なので、積層前及
び積層時において前記突出部及び該突出部に対応する部
分の第１導体パターン表面が酸化するのを防止すること
ができ、第１導体パターンと第２導体パターンとの電気
接続において酸化膜による抵抗値の増加が防止される。According to the multilayer flexible printed wiring board of the present invention, the surface of the conductor pattern of the protrusion and the surface of the first conductor pattern of the portion corresponding to the protrusion are coated with metal plating. Because of the constitution, it is possible to prevent the surface of the first conductor pattern of the protrusion and the portion corresponding to the protrusion before and during lamination from being oxidized, and the electrical connection between the first conductor pattern and the second conductor pattern can be achieved. In, the increase of the resistance value due to the oxide film is prevented.
【図１】本発明の一実施例よりなる多層フレキシブルプ
リント配線板の構造を示す縦断面図である。FIG. 1 is a vertical cross-sectional view showing the structure of a multilayer flexible printed wiring board according to an embodiment of the present invention.
【図２】図１に示す第１片面フレキシブルプリント配線
板の製造工程図である。FIG. 2 is a manufacturing process diagram of the first single-sided flexible printed wiring board shown in FIG.
【図３】図１に示す第２片面フレキシブルプリント配線
板の製造工程図である。FIG. 3 is a manufacturing process diagram of the second single-sided flexible printed wiring board shown in FIG. 1.
【図４】図３に示す第２片面フレキシブルプリント配線
板の湾曲形成方法を示す図であり、（ａ）は使用する金
型構成図であり、（ｂ）は湾曲形成前の第２片面フレキ
シブルプリント配線板を示す縦断面図であり、（ｃ）は
湾曲形成後を示す縦断面図である。4A and 4B are diagrams showing a method of forming a curve of the second single-sided flexible printed wiring board shown in FIG. 3, wherein FIG. 4A is a configuration diagram of a mold to be used, and FIG. 4B is a second single-sided flexible before curve formation. It is a longitudinal section showing a printed wiring board, and (c) is a longitudinal section showing after curve formation.
【図５】他の実施例における第２片面フレキシブルプリ
ント配線板の製造工程図である。FIG. 5 is a manufacturing process diagram of a second single-sided flexible printed wiring board according to another embodiment.
【図６】フレキシブル部における本実施例と従来例との
対比図である。FIG. 6 is a comparison diagram of the present embodiment and a conventional example in a flexible portion.
【図７】従来の多層フレキシブルプリント配線板を示す
平面図である。FIG. 7 is a plan view showing a conventional multilayer flexible printed wiring board.
【図８】従来の製造工程図である。FIG. 8 is a conventional manufacturing process diagram.
２１ 多層フレキシブルプリント配線板 ２１ａ 積層部 ２１ｂ フレキシブル部 ２２ 第１片面フレキシブルプリント配線板 ２３，２３′ 第２片面フレキシブルプリント配線板 ２３ａ 突出部 ２４，２７，３０ 接着剤 ２５ フイルムカバーレイ ２６ 第１ベースフイルム ２８ 第１導体パターン（第１配線回路パターン） ２９ 第２ベースフイルム ３１ 第２導体パターン（第２配線回路パターン） ３３ 金属めっき ３４ 金属体 21 Multilayer Flexible Printed Wiring Board 21a Laminated Part 21b Flexible Part 22 First One-sided Flexible Printed Wiring Board 23, 23 'Second One-sided Flexible Printed Wiring Board 23a Projection 24, 27, 30 Adhesive 25 Film Coverlay 26 First Base Film 28 1st conductor pattern (1st wiring circuit pattern) 29 2nd base film 31 2nd conductor pattern (2nd wiring circuit pattern) 33 Metal plating 34 Metal body
Claims (4)
と該導体パターンの内の一つが引き出されてなるフレキ
シブル部とを備えてなる多層フレキシブルプリント配線
板において、 可撓性を有する第１ベースフイルムの一方の面に接着剤
を介して第１導体パターンを積層してなる第１片面フレ
キシブルプリント配線板と、 可撓性を有する第２ベースフイルムの一方の面に接着剤
を介して第２導体パターンを積層し、該第２導体パター
ンの一部を突出させてなる第２片面フレキシブルプリン
ト配線板とを有し、 上記積層部は前記第１片面フレキシブルプリント配線板
と第２片面フレキシブルプリント配線板とを互いの導体
パターン側を対向させ前記突出部を除く配線板間に接着
剤を介して積層されるとともに該突出部にて第１導体パ
ターンと第２導体パターンとが接続されてなり、上記フ
レキシブル部は前記第１片面フレキシブルプリント配線
板又は第２片面フレキシブルプリント配線板が延在形成
されてなることを特徴とする多層フレキシブルプリント
配線板。1. A multi-layer flexible printed wiring board comprising a laminated portion in which a plurality of conductor patterns are laminated and a flexible portion formed by pulling out one of the conductor patterns, wherein a flexible first base is provided. A first single-sided flexible printed wiring board formed by laminating a first conductor pattern on one surface of a film via an adhesive; and a second flexible film on one surface of a flexible second base film via an adhesive A second single-sided flexible printed wiring board formed by stacking conductor patterns and projecting a part of the second conductor pattern, wherein the laminated portion is the first single-sided flexible printed wiring board and the second single-sided flexible printed wiring. The board and the conductor pattern sides are opposed to each other, and the board is laminated with an adhesive between the wiring boards excluding the projecting portion, and at the projecting portion, the first conductor pattern and the first conductor pattern are formed. A multilayer flexible printed wiring board, characterized in that it is connected to two conductor patterns, and the flexible portion is formed by extending the first one-sided flexible printed wiring board or the second one-sided flexible printed wiring board.
を特徴とする請求項１記載の多層フレキシブルプリント
配線板。2. The multilayer flexible printed wiring board according to claim 1, wherein the protrusion is formed in a curved shape.
体を設けてなることを特徴とする請求項１記載の多層フ
レキシブルプリント配線板。3. The multilayer flexible printed wiring board according to claim 1, wherein the protrusion has a metal body provided on the second conductor pattern.
該突出部に対応する部分の第１導体パターン表面が金属
めっきにて被覆されてなることを特徴とする請求項１記
載の多層フレキシブルプリント配線板。4. The multilayer flexible print according to claim 1, wherein a surface of the second conductor pattern of the protrusion and a surface of the first conductor pattern of a portion corresponding to the protrusion are coated with metal plating. Wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3870695A JP3445678B2 (en) | 1995-02-27 | 1995-02-27 | Multilayer flexible printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3870695A JP3445678B2 (en) | 1995-02-27 | 1995-02-27 | Multilayer flexible printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08236937A true JPH08236937A (en) | 1996-09-13 |
| JP3445678B2 JP3445678B2 (en) | 2003-09-08 |
Family
ID=12532769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3870695A Expired - Lifetime JP3445678B2 (en) | 1995-02-27 | 1995-02-27 | Multilayer flexible printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3445678B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007049076A (en) * | 2005-08-12 | 2007-02-22 | Nippon Mektron Ltd | Method for manufacturing hybrid multilayered circuit substrate |
| WO2008095338A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A mutual connection structure between multi-layer boards and manufacturing method thereof |
| WO2008095337A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
| JP2008288612A (en) * | 2008-07-29 | 2008-11-27 | Fujikura Ltd | Multilayer wiring board, and method of manufacturing the same |
| WO2009075079A1 (en) * | 2007-12-11 | 2009-06-18 | Sumitomo Bakelite Co., Ltd. | Circuit board, circuit board manufacturing method, and cover ray film |
| US7687312B2 (en) | 2006-12-06 | 2010-03-30 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates |
| US7703889B2 (en) | 2004-04-26 | 2010-04-27 | Brother Kogyo Kabushiki Kaisha | Printed wiring board and electric device using the same |
| US7886438B2 (en) | 2003-01-20 | 2011-02-15 | Fujikura Ltd. | Process for producing multilayer printed wiring board |
| US8014164B2 (en) | 2006-12-06 | 2011-09-06 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
-
1995
- 1995-02-27 JP JP3870695A patent/JP3445678B2/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7886438B2 (en) | 2003-01-20 | 2011-02-15 | Fujikura Ltd. | Process for producing multilayer printed wiring board |
| US7703889B2 (en) | 2004-04-26 | 2010-04-27 | Brother Kogyo Kabushiki Kaisha | Printed wiring board and electric device using the same |
| JP2007049076A (en) * | 2005-08-12 | 2007-02-22 | Nippon Mektron Ltd | Method for manufacturing hybrid multilayered circuit substrate |
| US7948079B2 (en) | 2006-12-06 | 2011-05-24 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof |
| US7687312B2 (en) | 2006-12-06 | 2010-03-30 | Princo Corp. | Method of manufacturing hybrid structure of multi-layer substrates |
| US8014164B2 (en) | 2006-12-06 | 2011-09-06 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
| US8023282B2 (en) | 2006-12-06 | 2011-09-20 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
| US8111519B2 (en) | 2006-12-06 | 2012-02-07 | Princo Corp. | Hybrid structure of multi-layer substrates and manufacture method thereof |
| WO2008095337A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A method of manufacturing a mutual connection structure between multi-layer baseboards and structure thereof |
| WO2008095338A1 (en) * | 2007-02-05 | 2008-08-14 | Princo Corp. | A mutual connection structure between multi-layer boards and manufacturing method thereof |
| WO2009075079A1 (en) * | 2007-12-11 | 2009-06-18 | Sumitomo Bakelite Co., Ltd. | Circuit board, circuit board manufacturing method, and cover ray film |
| JP2008288612A (en) * | 2008-07-29 | 2008-11-27 | Fujikura Ltd | Multilayer wiring board, and method of manufacturing the same |
| JP4538513B2 (en) * | 2008-07-29 | 2010-09-08 | 株式会社フジクラ | Manufacturing method of multilayer wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3445678B2 (en) | 2003-09-08 |
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