JP3305426B2 - Manufacturing method of multilayer printed wiring board - Google Patents
Manufacturing method of multilayer printed wiring boardInfo
- Publication number
- JP3305426B2 JP3305426B2 JP15513393A JP15513393A JP3305426B2 JP 3305426 B2 JP3305426 B2 JP 3305426B2 JP 15513393 A JP15513393 A JP 15513393A JP 15513393 A JP15513393 A JP 15513393A JP 3305426 B2 JP3305426 B2 JP 3305426B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- copper foil
- adhesive layer
- wiring
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層プリント配線板の
製造方法に関する。The present invention relates to a method for manufacturing a multilayer printed wiring board.
【０００２】[0002]
【従来の技術】多層プリント配線板は、配線の高密度化
に伴って、１つの配線層と他の配線層の電気的接続に使
用される導通穴の数が増加する。従来、この導通穴は、
配線層を多数重ねて積層した後に、全体を貫通する穴を
あけ、その穴内壁をめっきすることによって行われてい
る。この場合、必要な接続を行う層間以外の層にまで穴
があけられ、接続と無関係な層においては、その貫通穴
の箇所を避けて配線を行わなければならず、この方法で
は、設計の自由度や配線の高密度化の障害になってい
る。2. Description of the Related Art In a multilayer printed wiring board, the number of conductive holes used for electrical connection between one wiring layer and another wiring layer increases as the wiring density increases. Conventionally, this conduction hole
After a large number of wiring layers are stacked and stacked, a hole penetrating the whole is formed, and the inner wall of the hole is plated. In this case, a hole is formed in a layer other than the layer for performing the necessary connection, and in a layer unrelated to the connection, wiring must be performed avoiding the location of the through hole. This is an obstacle to higher density and wiring density.
【０００３】そこで、配線板全体を貫通する穴だけを使
用するのではなく、隣接する配線層のみの接続を行う、
いわゆるバイアホールを形成する方法が開発されてい
る。この方法は、現在、基本的に以下の２通りの方法が
知られている。Therefore, instead of using only holes penetrating the entire wiring board, connection is made only to adjacent wiring layers.
Methods for forming so-called via holes have been developed. At present, the following two methods are basically known.
【０００４】第一の方法は、隣接する配線層を先に形成
し、接続穴を形成しておいて、多層化する方法である。
具体的には、両面銅張り積層板に穴をあけ、穴内壁に無
電解めっきあるいは必要な場合に電解めっきを行って接
続用導体を形成し、片面の銅箔の不要な箇所のみをエッ
チング除去し、もう一方の面は全面に銅箔を残してお
き、他の基板と積層一体化した後、全体を貫通する穴を
あけて、穴内壁を金属化する方法や、絶縁基板の表面に
配線層を形成し、その配線層の表面に感光性絶縁材料に
よって層を形成し、導通穴となる箇所のみを除去するよ
うに光を照射し現像して、この絶縁材料の表面を粗化
し、必要な回路導体と穴内壁とに無電解めっきを行って
導体を形成するという、配線層の層間に感光性材料を用
いる方法等がある。これらの技術は、いずれも、さらに
必要な配線層を、同じ技術で形成して多層化するもので
ある。The first method is a method of forming adjacent wiring layers first, forming connection holes, and forming a multilayer structure.
Specifically, holes are drilled in the double-sided copper-clad laminate, electroless plating or electrolytic plating is performed on the inner walls of the holes to form connection conductors, and only unnecessary portions of the copper foil on one side are etched away. Then, leave the copper foil on the whole surface on the other side, laminate and integrate it with the other substrate, then make a hole that penetrates the whole and metalize the inner wall of the hole, or wire on the surface of the insulating substrate Forming a layer with a photosensitive insulating material on the surface of the wiring layer, irradiating and developing light so as to remove only a portion that becomes a conduction hole, and roughening the surface of the insulating material; There is a method of forming a conductor by performing electroless plating on a simple circuit conductor and an inner wall of a hole, using a photosensitive material between wiring layers, and the like. In each of these techniques, necessary wiring layers are further formed by the same technique to form multiple layers.
【０００５】第二の方法は、先に積層しておいて、表面
層と、その表面層と接続を行う層の接続を行う方法であ
って、導通穴を、接続を行う層までにしかあけないこと
が特徴となっている。具体的には、複数の配線層とそれ
を支える絶縁層を交互に積層しておき、表面には銅箔を
残しておき、表面の回路と接続する箇所に、接続する層
に達する深さまで、ドリルで穴をあけ、穴内壁に無電解
めっきを行い、必要な場合には続いて電解めっきを行
い、表面の回路を不要な部分をエッチング除去して形成
する方法や、穴をあけるのに、レーザ光を用い、レーザ
光が接続を必要としない層までに照射されないように、
接続する層の箇所に銅箔を残しておく方法等がある。The second method is a method of connecting a surface layer and a layer for making a connection with the surface layer after laminating them in advance. In the second method, a conductive hole is formed only up to the layer for making a connection. It is characterized by the absence. Specifically, a plurality of wiring layers and insulating layers that support it are alternately laminated, copper foil is left on the surface, at the point where the surface connects to the circuit, until the depth reaches the connecting layer Drill a hole, perform electroless plating on the inner wall of the hole, and then, if necessary, perform electrolytic plating, and then etch and remove unnecessary parts of the surface circuit. Using laser light, so that the laser light is not irradiated to the layer that does not require connection,
There is a method of leaving a copper foil at a location of a layer to be connected.
【０００６】ところで、これらの従来の方法において
は、以下のような問題があった。すなわち、第一の方法
において両面銅張り積層板を使用する場合、片面に回路
を形成するので基板の寸法変化が起り易く、複数の基板
を重ねて積層するときに、各配線層間の位置精度に十分
の注意を払わなければならず、また、導通穴内壁の接続
のために行うめっきによって他方の導体の厚さが厚くな
り、多層化したときに全体の厚さを小さくすることが困
難となる。また、感光性材料を各配線層間の絶縁層とし
て用いる場合、めっきの密着力を高める粗化処理と、貫
通穴を設けるための感光性を同時に満足できる材料が少
なく、現存する材料ではめっき皮膜の密着力は十分では
ない。第二の方法においてドリルを用いる場合、基板の
厚さにばらつきがあり、接続する箇所でドリルの進行を
止める位置精度を高くできない。また、レーザを用いる
場合、装置が高価である。さらに、この第二の方法にお
いては、穴をあける箇所において、表面層と接続層の間
には、他の層には配線ができない。However, these conventional methods have the following problems. That is, when a double-sided copper-clad laminate is used in the first method, a circuit is formed on one side, so that a dimensional change of the substrate is likely to occur. Care must be taken, and the thickness of the other conductor is increased by plating performed for connection of the inner wall of the conduction hole, making it difficult to reduce the overall thickness when multi-layered. . In addition, when a photosensitive material is used as an insulating layer between wiring layers, there are few materials capable of simultaneously satisfying the roughening treatment for increasing the adhesion of plating and the photosensitivity for providing a through-hole, and existing materials have a plating film. Adhesion is not enough. When a drill is used in the second method, the thickness of the substrate varies, and the positional accuracy at which the progress of the drill is stopped at the connection point cannot be increased. When a laser is used, the device is expensive. Furthermore, in the second method, no wiring can be formed between the surface layer and the connection layer in another layer at the location where the hole is formed.
【０００７】そこで、本発明者らは、鋭意検討の結果、
片面銅張り積層板の絶縁材料側の表面に接着剤層を設
け、この接着剤層をＢステージにし、その基板に穴をあ
け、その穴をあけた基板の接着剤層側に、内層回路板が
接触するように重ね合わせ、加圧加熱して積層一体化し
た後、その積層一体化した基板の必要な箇所に、導体回
路を形成する方法を開発した。Accordingly, the present inventors have conducted intensive studies and as a result,
An adhesive layer is provided on the surface of the single-sided copper-clad laminate on the insulating material side, the adhesive layer is used as a B stage, a hole is formed in the substrate, and an inner circuit board is formed on the adhesive layer side of the holed substrate. We have developed a method to form a conductor circuit at the required location on the laminated and integrated substrate after superimposing them so that they come into contact with each other and by applying pressure and heating.
【０００８】[0008]
【発明が解決しようとする課題】ところで、この方法
は、積層後にレーザ加工やドリル加工によって非貫通孔
を形成せずに内層配線と外層配線の接続が行えるという
利点があるものの、内層回路板と外層回路板をＢステー
ジの接着剤層を介して積層接着するときに、Ｂステージ
の接着剤の流動性の制御が極めて重要である。というの
も、このＢステージの接着剤は、内層と外層の接続のた
めの穴があけられており、流動性が高すぎると、穴が小
さくなり、電気的接続に必要な面積を確保できず、逆に
流動性が低すぎると、内層回路板に形成された内層回路
導体の間に接着剤が流れず、接着の不完全さや絶縁特性
が低下する。By the way, this method has an advantage that the connection between the inner layer wiring and the outer layer wiring can be performed without forming a non-through hole by laser processing or drilling after lamination, but this method has an advantage that the inner layer circuit board and the inner layer circuit board can be connected. When laminating and bonding the outer circuit board via the B-stage adhesive layer, it is extremely important to control the fluidity of the B-stage adhesive. This is because the B-stage adhesive has a hole for connecting the inner layer and the outer layer. If the fluidity is too high, the hole becomes smaller and the area required for electrical connection cannot be secured. Conversely, if the fluidity is too low, the adhesive does not flow between the inner layer circuit conductors formed on the inner layer circuit board, resulting in imperfect bonding and poor insulation properties.
【０００９】本発明の目的は、積層後にレーザ加工やド
リル加工によって非貫通孔を形成せずに内層配線と外層
配線の接続が行え、かつ、接着剤の流動性の制御を内層
回路が充分に接着剤で充填されればそれ以上に制御を要
しない多層プリント配線板の製造方法を提供することで
ある。[0009] It is an object of the present invention to connect the inner layer wiring and the outer layer wiring without forming a non-through hole by laser processing or drilling after lamination, and to control the fluidity of the adhesive by the inner layer circuit. An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board which requires no further control if filled with an adhesive.
【００１０】[0010]
【課題を解決するための手段】本発明の多層プリント配
線板の製造方法は、以下の工程を含むことを特徴とす
る。 (a) 絶縁材料側の表面にＢステージの接着剤層を設けた
片面銅箔張り積層板を用意する工程 (b) 前記片面銅箔張り積層板に穴をあける工程 (c) 内層回路板の表面に配線を形成する工程 (d) 前記内層回路板の配線のうち、前記穴をあけた片面
銅箔張り積層板の穴の位置に該当する箇所に、前記穴に
収納できる大きさの導電性の突起を設ける工程 (e) 前記穴をあけた片面銅箔張り積層板と、前記内層回
路板とを、前記接着剤層を介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた片面銅箔張り積層板上の導体
回路と前記内層回路の配線とを、前記穴の箇所で接続す
る工程A method of manufacturing a multilayer printed wiring board according to the present invention includes the following steps. (a) providing the adhesive layer of B-stage on the surface of the insulating material side
A step of preparing a single-sided copper foil-clad laminate (b) a step of drilling a hole in the single-sided copper foil-clad laminate (c) a step of forming wiring on the surface of the inner-layer circuit board (d) of the wiring of the inner-layer circuit board , One side with the hole
Providing a conductive projection of a size large enough to be accommodated in the hole at a position corresponding to the position of the hole in the copper foil-clad laminate; (e) a single-sided copper foil-clad laminate having the hole, and the inner layer circuit board; (F) laminating and bonding via the adhesive layer (f) forming a conductor at a necessary portion of the laminated and bonded plate,
A step of connecting a conductor circuit on at least the holed single-sided copper foil laminated board and a wiring of the inner layer circuit at the location of the hole
【００１１】また、片面銅箔張り積層板に代えて、プリ
ント配線板用銅箔の粗化処理面に接着剤層を設けたもの
を用いることもでき、その場合、以下の工程となる。 (a) プリント配線板用銅箔の粗化処理面に接着剤層を設
け、この接着剤層をＢステージにする工程 (b) 前記接着剤層付銅箔に穴をあける工程 (c) 前記穴をあけた接着剤層付銅箔と、前記接着剤層を
介して積層接着される内層回路板の配線を形成する工程 (d) 前記内層回路板の配線のうち、前記穴をあけた接着
剤層付銅箔の穴の位置に該当する箇所に、前記穴に収納
できる大きさの導電性の突起を設ける工程 (e) 前記穴をあけた接着剤層付銅箔と、前記内層回路板
とを、前記接着剤層を介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた接着剤層付銅箔上の導体回路
と前記内層回路の配線とを、前記穴の箇所で接続する工
程Further, instead of the single-sided copper foil-clad laminate, a copper foil for a printed wiring board having a roughened surface provided with an adhesive layer can be used. In that case, the following steps are performed. (a) providing an adhesive layer on the roughened surface of the copper foil for a printed wiring board, and bringing the adhesive layer into the B-stage (b) making a hole in the copper foil with the adhesive layer (c) Forming a wiring of an inner layer circuit board to be laminated and bonded via the adhesive layer with the copper foil with an adhesive layer having a hole formed therein; (E) providing a conductive projection having a size large enough to be accommodated in the hole at a position corresponding to the position of the hole of the copper foil with the agent layer, and (e) the copper foil with the adhesive layer having the hole, and the inner layer circuit board. (F) laminating and bonding via the adhesive layer (f) forming a conductor at a necessary portion of the laminated and bonded plate,
A step of connecting a conductor circuit on at least the holed copper foil with an adhesive layer and a wiring of the inner layer circuit at a location of the hole;
【００１２】また、接着剤層と銅箔をそれぞれ穴あけ加
工した後に積層することもでき、この場合、以下の工程
となる。 (a) Ｂステージの接着フィルムに穴をあける工程 (b) プリント配線板用銅箔の、前記接着フィルムにあけ
た穴に該当する箇所に穴をあける工程 (c) 前記銅箔と、前記穴をあけた接着フィルムを介して
積層接着される内層回路板の配線を形成する工程 (d) 前記内層回路板の配線のうち、前記接着フィルムの
穴の位置に該当する箇所に、前記穴に収納できる大きさ
の導電性の突起を設ける工程 (e) 前記穴をあけた銅箔と、前記内層回路板とを、前記
接着フィルムを介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた銅箔上の導体回路と前記内層
回路の配線とを、前記穴の箇所で接続する工程[0012] Alternatively, the adhesive layer and the copper foil may be laminated after drilling, respectively. In this case, the following steps are performed. (a) a step of drilling a hole in the adhesive film of the B-stage (b) a step of drilling a hole in the copper foil for a printed wiring board corresponding to the hole drilled in the adhesive film; (c) the copper foil and the hole Forming the wiring of the inner circuit board to be laminated and bonded through the opened adhesive film (d) Of the wiring of the inner circuit board, the wiring is housed in the hole at a position corresponding to the position of the hole of the adhesive film A step of providing conductive protrusions of a size as large as possible (e) a step of laminating and bonding the perforated copper foil and the inner layer circuit board via the adhesive film; Form conductors in
Connecting at least the conductor circuit on the copper foil with the hole and the wiring of the inner layer circuit at the location of the hole;
【００１３】本発明に用いる片面銅箔張り積層板は、そ
の片面に銅箔を貼り合わせた絶縁材料であるガラス布−
エポキシ樹脂を用いた片面銅箔張り積層板や、フレキシ
ブルなポリイミドフィルムを用いた片面銅箔張りフレキ
シブルシート等がある。この絶縁材料には、紙、不織布
あるいはガラス布等の強化繊維に樹脂を含浸した有機材
料や、強化しない樹脂製品、フレキシブルなフィルム、
あるいは、このような材料とセラミックスとの複合化さ
れた材料が使用できる。樹脂としては、フェノール樹
脂、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹
脂、あるいはフッ素含有樹脂等が使用できる。さらには
また、これらの絶縁材料中に、無電解めっき用触媒を分
散させたものも使用できる。The single-sided copper foil-clad laminate used in the present invention is made of a glass cloth which is an insulating material having a copper foil bonded to one side thereof.
There are a single-sided copper foil-clad laminate using an epoxy resin and a single-sided copper foil-clad flexible sheet using a flexible polyimide film. This insulating material includes paper, non-woven fabrics, glass fabrics and other reinforcing fibers impregnated with resin, organic materials that are not reinforced, flexible films, flexible films,
Alternatively, a composite material of such a material and ceramics can be used. As the resin, a phenol resin, an epoxy resin, a polyimide resin, a polyester resin, a fluorine-containing resin, or the like can be used. Furthermore, those in which a catalyst for electroless plating is dispersed in these insulating materials can also be used.
【００１４】接着剤としては、エポキシ樹脂系接着剤、
アクリル変性樹脂系接着剤、あるいはポリイミド樹脂系
接着剤等が使用でき、これらをロールコーティング、デ
ィップコーティングあるいはカーテンコーティング等に
よって塗布することができる。また、さらに、これらの
接着剤をフィルム化したものも使用できる。これらの接
着剤層や接着フィルムは、Ｂステージになっている必要
がある。本発明でいうＢステージとは、４０℃以下では
粘着性を持たず、その後の多層化接着によって接着強さ
が０．８kgf/cm以上となることができる半硬化状態をい
う。Ｂステージ状態にする方法としては、通常の樹脂と
同じように、温度時間を制御して加熱する。このような
条件は、実験的に求めることができる。As the adhesive, an epoxy resin adhesive,
An acrylic-modified resin-based adhesive or a polyimide resin-based adhesive can be used, and these can be applied by roll coating, dip coating, curtain coating, or the like. Further, a film of these adhesives can also be used. These adhesive layers and adhesive films need to be in the B stage. The B stage in the present invention refers to a semi-cured state in which the layer has no tackiness at 40 ° C. or lower and can have an adhesive strength of 0.8 kgf / cm or more by subsequent multilayer bonding. As a method of setting the stage to the B stage, similarly to a normal resin, heating is performed while controlling the temperature and time. Such conditions can be determined experimentally.
【００１５】内層回路板の配線のうち、接着剤層の穴の
位置に該当する箇所に、穴に収納できる大きさの突起を
設ける導電性の材料としては、金属やカーボン等の導電
性充填剤を含む導電性ペースト、はんだ、金属線が使用
できる。これらの導電性材料による突起は、その底面の
大きさが前記接着剤層にあけられた穴より小さくなけれ
ばならない。また、高さは、接着剤の穴の深さより小さ
いことが好ましく、少なくとも１０μｍ以上あることが
好ましい。このような導電性材料を、内層回路板の配線
のうち、接着剤層の穴の位置に該当する箇所に設ける方
法としては、導電性ペーストやはんだの場合、シルクス
クリーン法による印刷や、ディスペンサーによる塗布が
あり、金属線はワイヤボンディングを行う方法で融着
し、必要な長さに切断することができる。[0015] Among the wiring of the inner layer circuit board, a conductive filler such as metal or carbon is used as a conductive material for providing a projection having a size that can be accommodated in the hole at a position corresponding to the position of the hole in the adhesive layer. Conductive pastes, solders, and metal wires can be used. The size of the projection made of these conductive materials must be smaller than the size of the hole formed in the adhesive layer. Further, the height is preferably smaller than the depth of the hole of the adhesive, and is preferably at least 10 μm or more. As a method of providing such a conductive material at a position corresponding to the position of the hole of the adhesive layer in the wiring of the inner layer circuit board, in the case of a conductive paste or solder, printing by a silk screen method or by a dispenser There is a coating, and the metal wire is fused by a method of performing wire bonding and can be cut to a required length.
【００１６】[0016]
【作用】本発明の方法によって、穴の底面に導電性の突
起を設けることができ、この突起によって、Ｂステージ
の接着剤に流動性の高いものを使用しても、接続の面積
を確保できる。According to the method of the present invention, a conductive projection can be provided on the bottom surface of the hole. With this projection, a connection area can be secured even if a highly fluid adhesive is used for the B stage. .
【００１７】[0017]
【実施例】実施例１ 図１(a)に示すように、厚さ１８μｍのプリント配線板
用銅箔の粗化処理面に厚さ５０μｍ、ガラス転移温度１
１０℃のＢステージの接着フィルム（エポキシ接着フィ
ルム；日立化成工業株式会社製）を貼り合わせる。図１
(b)に示すように、前記接着剤層付銅箔に、ドリルで直
径約２５０μｍの穴をあける。図１(c)に示すように、
穴をあけた接着剤層付銅箔と、接着剤層を介して積層接
着される内層回路板の配線を形成する。図１(d)に示す
ように、内層回路板の配線のうち、前記穴をあけた接着
剤層付銅箔の穴の位置に該当する箇所に、直径約１００
μｍ、高さ約３０μｍの銅ペーストを印刷し、導電性の
突起を設ける。図１(e)に示すように、穴をあけた接着
剤層付銅箔と、内層回路板とを、接着剤層を介して、加
熱加圧して積層接着する。図１(f)に示すように、穴内
部を含んで、全体に無電解銅めっきを約２０μｍの厚さ
に行い、エッチングレジストを形成して、積層接着され
た板の必要な箇所に、導体を形成し、少なくとも前記穴
をあけた接着剤層付銅箔上の導体回路と内層回路の配線
とを、穴の箇所で接続する（図１(g)に示す。）。EXAMPLE 1 As shown in FIG. 1 (a), a copper foil for a printed wiring board having a thickness of 18 μm was 50 μm thick and had a glass transition temperature of 1 μm on the roughened surface.
A B-stage adhesive film (epoxy adhesive film; manufactured by Hitachi Chemical Co., Ltd.) at 10 ° C. is attached. FIG.
As shown in (b), a hole having a diameter of about 250 μm is formed in the copper foil with the adhesive layer by a drill. As shown in FIG.
The copper foil with the adhesive layer with holes is formed, and the wiring of the inner circuit board to be laminated and bonded via the adhesive layer is formed. As shown in FIG. 1 (d), the wiring of the inner layer circuit board has a diameter of about 100 mm at a position corresponding to the position of the hole of the copper foil provided with the adhesive layer.
A copper paste having a thickness of about 30 μm and a height of about 30 μm is printed, and conductive protrusions are provided. As shown in FIG. 1 (e), the copper foil with the adhesive layer with the holes and the inner layer circuit board are laminated and bonded by applying heat and pressure via the adhesive layer. As shown in FIG. 1 (f), the entire surface including the inside of the hole is subjected to electroless copper plating to a thickness of about 20 μm, and an etching resist is formed. Is formed, and at least the conductor circuit on the copper foil provided with the adhesive layer and the wiring of the inner layer circuit are connected at the location of the hole (shown in FIG. 1 (g)).
【００１８】実施例２ 図２(a)に示すように、厚さ１８μｍの電解銅箔の粗化
処理面に、厚さ５０μｍ、ガラス転移温度１１０℃のＢ
ステージの接着フィルム（エポキシ接着フィルム；日立
化成工業株式会社製）を設ける。図２(b)に示すよう
に、その接着剤層付銅箔に直径約２５０μｍの穴を、ド
リルであける。図２(c)に示すように、その穴をあけた
接着剤層付銅箔と、接着剤層を介して積層接着される内
層回路板の配線を、サブトラクト法によって形成する。
図２(d)に示すように、その内層回路板の配線のうち、
穴をあけた接着剤層付銅箔の穴の位置に該当する箇所
に、金線をワイヤボンディングして融着し、長さを４０
μｍのところで切断して、導電性の突起を設ける。図２
(e)に示すように、その穴をあけた接着剤層付銅箔と、
内層回路板とを、接着剤層を介して、加熱加圧して積層
接着する。図２(f)に示すように、穴内部を含んで、全
体に無電解銅めっきを約２０μｍの厚さに行い、エッチ
ングレジストを形成して、積層接着された板の必要な箇
所に、導体を形成し、少なくとも前記穴をあけた接着剤
層付銅箔上の導体回路と内層回路の配線とを、穴の箇所
で接続する（図２(g)に示す。）。Example 2 As shown in FIG. 2A, a roughened surface of an electrolytic copper foil having a thickness of 18 μm was coated on a roughened surface of a 50 μm thick, glass transition temperature 110 ° C.
A stage adhesive film (epoxy adhesive film; manufactured by Hitachi Chemical Co., Ltd.) is provided. As shown in FIG. 2B, a hole having a diameter of about 250 μm is drilled in the copper foil with the adhesive layer. As shown in FIG. 2 (c), the copper foil with the adhesive layer having the holes formed therein and the wiring of the inner layer circuit board laminated and bonded via the adhesive layer are formed by a subtractive method.
As shown in FIG. 2D, of the wiring of the inner layer circuit board,
A gold wire is wire-bonded and fused to a position corresponding to the position of the hole in the copper foil with an adhesive layer having a hole, and has a length of 40 mm.
Cut at μm to provide conductive projections. FIG.
As shown in (e), a copper foil with an adhesive layer with the hole,
The inner layer circuit board is laminated and adhered by applying heat and pressure through an adhesive layer. As shown in FIG. 2 (f), the entire surface including the inside of the hole is subjected to electroless copper plating to a thickness of about 20 μm, and an etching resist is formed. Is formed, and at least the conductor circuit on the copper foil with the adhesive layer having the hole and the wiring of the inner layer circuit are connected at the location of the hole (shown in FIG. 2 (g)).
【００１９】[0019]
【発明の効果】以上に説明したように、本発明によっ
て、積層後にレーザ加工やドリル加工によって非貫通孔
を形成せずに内層配線と外層配線の接続が行え、かつ、
接着剤の流動性の制御を内層回路が充分に接着剤で充填
されればそれ以上に制御を要しない多層プリント配線板
の製造方法を提供することができる。As described above, according to the present invention, the inner wiring and the outer wiring can be connected without forming a non-through hole by laser processing or drilling after lamination, and
It is possible to provide a method of manufacturing a multilayer printed wiring board which does not require any further control of the fluidity of the adhesive if the inner layer circuit is sufficiently filled with the adhesive.
【図１】(a)〜(g)は、それぞれ本発明の一実施例を示す
各工程ごとの断面図である。1 (a) to 1 (g) are cross-sectional views for respective steps showing one embodiment of the present invention.
【図２】(a)〜(g)は、それぞれ本発明の他の実施例を示
す各工程ごとの断面図である。2 (a) to 2 (g) are cross-sectional views of respective steps showing another embodiment of the present invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浦崎 直之 茨城県下館市大字小川1500番地 日立化 成工業株式会社 下館研究所内 (72)発明者 大塚 和久 茨城県下館市大字小川1500番地 日立化 成工業株式会社 下館研究所内 (72)発明者 稲田 禎一 茨城県下館市大字小川1500番地 日立化 成工業株式会社 下館研究所内 (56)参考文献 特開 平５−121878（ＪＰ，Ａ) 特開 昭62−260395（ＪＰ，Ａ) 実開 平５−41186（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/46 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Naoyuki Urasaki 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd. Inside Shimodate Research Laboratory Co., Ltd. (72) Inventor Seiichi Inada 1500 Ogawa, Shimodate-shi, Ibaraki Pref. Hitachi Chemical Industry Co., Ltd. Shimodate Research Laboratory (56) References JP-A-5-121878 (JP, A) 260395 (JP, A) Hikaru Hei 5-41186 (JP, U) (58) Field surveyed (Int. Cl. 7 , DB name) H05K 3/46
Claims (4)
リント配線板の製造方法。 (a) 絶縁材料側の表面にＢステージの接着剤層を設けた
片面銅箔張り積層板を用意する工程 (b) 前記片面銅箔張り積層板に穴をあける工程 (c) 内層回路板の表面に配線を形成する工程 (d) 前記内層回路板の配線のうち、前記穴をあけた片面
銅箔張り積層板の穴の位置に該当する箇所に、前記穴に
収納できる大きさの導電性の突起を設ける工程(e) 前記
穴をあけた片面銅箔張り積層板と、前記内層回路板と
を、前記接着剤層を介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた片面銅箔張り積層板上の導体
回路と前記内層回路の配線とを、前記穴の箇所で接続す
る工程1. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (a) providing the adhesive layer of B-stage on the surface of the insulating material side
A step of preparing a single-sided copper foil-clad laminate (b) a step of drilling a hole in the single-sided copper foil-clad laminate (c) a step of forming wiring on the surface of the inner-layer circuit board (d) , One side with the hole
(E) providing a conductive protrusion having a size large enough to be accommodated in the hole at a position corresponding to the position of the hole in the copper foil-clad laminate; (e) a single-sided copper foil-clad laminate having the hole, and the inner layer circuit board (F) laminating and bonding via the adhesive layer (f) forming a conductor at a necessary portion of the laminated and bonded plate,
A step of connecting a conductor circuit on at least the holed single-sided copper foil laminated board and a wiring of the inner layer circuit at the location of the hole
リント配線板の製造方法。 (a) プリント配線板用銅箔の粗化処理面に接着剤層を設
け、この接着剤層をＢステージにする工程 (b) 前記接着剤層付銅箔に穴をあける工程 (c) 前記穴をあけた接着剤層付銅箔と、前記接着剤層を
介して積層接着される内層回路板の配線を形成する工程 (d) 前記内層回路板の配線のうち、前記穴をあけた接着
剤層付銅箔の穴の位置に該当する箇所に、前記穴に収納
できる大きさの導電性の突起を設ける工程 (e) 前記穴をあけた接着剤層付銅箔と、前記内層回路板
とを、前記接着剤層を介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた接着剤層付銅箔上の導体回路
と前記内層回路の配線とを、前記穴の箇所で接続する工
程2. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (a) providing an adhesive layer on the roughened surface of the copper foil for a printed wiring board, and bringing the adhesive layer into the B-stage (b) making a hole in the copper foil with the adhesive layer (c) Forming a wiring of an inner layer circuit board to be laminated and bonded via the adhesive layer with the copper foil with an adhesive layer having a hole formed therein; (E) providing a conductive projection having a size large enough to be accommodated in the hole at a position corresponding to the position of the hole of the copper foil with the agent layer, and (e) the copper foil with the adhesive layer having the hole, and the inner layer circuit board. (F) laminating and bonding via the adhesive layer (f) forming a conductor at a necessary portion of the laminated and bonded plate,
A step of connecting a conductor circuit on at least the holed copper foil with an adhesive layer and a wiring of the inner layer circuit at a location of the hole;
リント配線板の製造方法。 (a) プリント配線板用銅箔の粗化処理面に、Ｂステージ
接着剤層を設ける工程 (b) 前記接着剤層付銅箔に穴をあける工程 (c) 前記穴をあけた接着剤層付銅箔と、前記接着剤層を
介して積層接着される内層回路板の配線を形成する工程 (d) 前記内層回路板の配線のうち、前記穴をあけた接着
剤層付銅箔の穴の位置に該当する箇所に、前記穴に収納
できる大きさの導電性の突起を設ける工程 (e) 前記穴をあけた接着剤層付銅箔と、前記内層回路板
とを、前記接着剤層を介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた接着剤層付銅箔上の導体回路
と前記内層回路の配線とを、前記穴の箇所で接続する工
程3. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (a) a step of providing a B-stage adhesive layer on the roughened surface of the copper foil for a printed wiring board; (b) a step of making a hole in the copper foil with the adhesive layer; and (c) an adhesive layer having the hole made. A step of forming wiring of an inner layer circuit board to be laminated and bonded via the adhesive layer with the attached copper foil, and (d) a hole of the adhesive layer-coated copper foil having the hole, among the wiring of the inner layer circuit board. (E) providing a conductive projection having a size large enough to be accommodated in the hole at a position corresponding to the position of (e) the adhesive-coated copper foil with the hole, and the inner circuit board; (F) forming a conductor at a necessary portion of the laminated and bonded plate,
A step of connecting a conductor circuit on at least the holed copper foil with an adhesive layer and a wiring of the inner layer circuit at a location of the hole;
リント配線板の製造方法。 (a) Ｂステージの接着フィルムに穴をあける工程 (b) プリント配線板用銅箔の、前記接着フィルムにあけ
た穴に該当する箇所に穴をあける工程 (c) 前記銅箔と、前記穴をあけた接着フィルムを介して
積層接着される内層回路板の配線を形成する工程 (d) 前記内層回路板の配線のうち、前記接着フィルムの
穴の位置に該当する箇所に、前記穴に収納できる大きさ
の導電性の突起を設ける工程 (e) 前記穴をあけた銅箔と、前記内層回路板とを、前記
接着フィルムを介して積層接着する工程 (f) 積層接着された板の必要な箇所に、導体を形成し、
少なくとも前記穴をあけた銅箔上の導体回路と前記内層
回路の配線とを、前記穴の箇所で接続する工程4. A method for manufacturing a multilayer printed wiring board, comprising the following steps. (a) a step of drilling a hole in the adhesive film of the B-stage (b) a step of drilling a hole in the copper foil for a printed wiring board corresponding to the hole drilled in the adhesive film; (c) the copper foil and the hole Forming the wiring of the inner circuit board to be laminated and bonded through the opened adhesive film (d) Of the wiring of the inner circuit board, the wiring is housed in the hole at a position corresponding to the position of the hole of the adhesive film A step of providing conductive protrusions of a size as large as possible (e) a step of laminating and bonding the perforated copper foil and the inner layer circuit board via the adhesive film; Form conductors in
Connecting at least the conductor circuit on the copper foil with the hole and the wiring of the inner layer circuit at the location of the hole;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15513393A JP3305426B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15513393A JP3305426B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0715140A JPH0715140A (en) | 1995-01-17 |
| JP3305426B2 true JP3305426B2 (en) | 2002-07-22 |
Family
ID=15599279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15513393A Expired - Fee Related JP3305426B2 (en) | 1993-06-25 | 1993-06-25 | Manufacturing method of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3305426B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101232A (en) * | 2001-09-25 | 2003-04-04 | Daiwa Kogyo:Kk | Conductive connection structure and method of forming the same |
| WO2006041161A1 (en) * | 2004-10-15 | 2006-04-20 | Sony Chemical & Information Device Corporation | Wiring board and method for manufacturing same |
| JP5454605B2 (en) * | 2012-04-02 | 2014-03-26 | 富士通セミコンダクター株式会社 | Wiring substrate and semiconductor device |
| JP6976201B2 (en) * | 2018-03-13 | 2021-12-08 | 京セラ株式会社 | Manufacturing Methods for Fixed Structures, Electronic Devices, Imaging Devices, Mobiles, and Fixed Structures |
-
1993
- 1993-06-25 JP JP15513393A patent/JP3305426B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0715140A (en) | 1995-01-17 |
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