JPH08122266A - Surface inspection device - Google Patents
Surface inspection deviceInfo
- Publication number
- JPH08122266A JPH08122266A JP6282909A JP28290994A JPH08122266A JP H08122266 A JPH08122266 A JP H08122266A JP 6282909 A JP6282909 A JP 6282909A JP 28290994 A JP28290994 A JP 28290994A JP H08122266 A JPH08122266 A JP H08122266A
- Authority
- JP
- Japan
- Prior art keywords
- light
- reflected light
- field region
- detecting means
- bright field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Input (AREA)
- Image Processing (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばハードディスク
等の被検査対象物の表面の状態を検査する表面検査装置
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface inspection apparatus for inspecting the surface condition of an object to be inspected such as a hard disk.
【０００２】[0002]
【従来技術】例えば、ハードディスク装置における磁気
記録用ディスク表面の物理的状態を検査する装置とし
て、図４に示すような構成が公知である。投光手段であ
る光源１０から磁気ディスクの如き被検査対象物１２の
表面上に帯状のスリット光を照射し、その反射光をＣＣ
Ｄライン・センサ・カメラのような２台の撮像装置１４
-１及び１４-２で撮像し、それらの結果を夫々３台の画
像処理装置１６-１及び１６-２で画像処理して、その処
理データをコンピュータ１８により解析するシステムで
ある。撮像装置１４-１は、反射光に関する明視野領域
に配置され、撮像装置１４-２は、反射光に関する暗視
野領域に配置されている。2. Description of the Related Art For example, as a device for inspecting the physical state of the surface of a magnetic recording disk in a hard disk device, a structure as shown in FIG. 4 is known. A band-shaped slit light is emitted from the light source 10 which is a light projecting device onto the surface of an object 12 to be inspected such as a magnetic disk, and the reflected light is CC-reflected.
Two imaging devices 14 such as D-line sensor camera
It is a system in which images are taken by -1 and 14-2, the results are image-processed by three image processing devices 16-1 and 16-2, respectively, and the processed data is analyzed by the computer 18. The image pickup device 14-1 is arranged in a bright field region regarding reflected light, and the image pickup device 14-2 is arranged in a dark field region regarding reflected light.
【０００３】図５は、反射光の輝度と反射角度との関係
を表すグラフである。被検査対象物の表面は、略鏡面状
態なので、入射角度θiで照射された光線の大部分は、
反射角度θr＝θiで反射されるが、表面上の僅かな凹凸
に起因する乱反射等により、反射光の輝度は図５に示す
ような曲線の分布となる。本明細書では、最大輝度値Ｉ
maxの反射角度θrから最大輝度値の２分の１のレベル
（Ｉmax／２）までの範囲内を明視野領域と呼び、この
最大輝度値の２分の１のレベルから最大輝度値の１０分
の１（Ｉmax／１０）までの輝度範囲を半明視野領域と
呼び、最大輝度値の１０分の１のレベルより低い輝度の
領域を暗視野領域と呼ぶ。ただし、この視野領域の区分
は便宜的なものであり、別の輝度レベルを基準にして区
分しても良い。FIG. 5 is a graph showing the relationship between the brightness of reflected light and the reflection angle. Since the surface of the object to be inspected is in a substantially mirror surface state, most of the light rays radiated at the incident angle θi are
Although the light is reflected at the reflection angle θr = θi, the luminance of the reflected light has a curve distribution as shown in FIG. 5 due to irregular reflection due to slight irregularities on the surface. In this specification, the maximum brightness value I
The range from the reflection angle θr of max to the level (Imax / 2) of half of the maximum brightness value is called a bright field area, and the level of half the maximum brightness value to 10 minutes of the maximum brightness value. The brightness range up to 1 (Imax / 10) is referred to as a semi-bright field area, and the area having a brightness lower than the level of 1/10 of the maximum brightness value is referred to as a dark field area. However, the division of the visual field area is convenient, and the division may be performed on the basis of another luminance level.
【０００４】ディスク表面上の欠陥の種類としては、接
触キズ、塵の付着、テクスチャ工程での異常、スパッタ
異常、打痕、油類の付着等多くのものがある。これらの
中で、スパッタ異常は、表面の凹凸は殆ど存在せず、反
射光の色合い又は輝度の変化となって現れることから、
明視野領域に配置された撮像装置１４-１で観測され
る。また、接触キズ、ゴミや塵の付着、油類の付着等の
場合には、反射角度が大きく外れることから、暗視野領
域に配置された撮像装置１４-２により観測される。There are many types of defects on the disk surface, such as contact scratches, dust adhesion, abnormalities in the texturing process, spatter abnormalities, dents, and oil adhesion. Among these, the spatter anomaly has almost no unevenness on the surface and appears as a change in the hue or brightness of the reflected light.
It is observed by the imaging device 14-1 arranged in the bright field area. Further, in the case of contact scratches, dust or dust adhesion, oil adhesion, etc., since the reflection angle is largely deviated, it is observed by the imaging device 14-2 arranged in the dark field region.
【０００５】[0005]
【発明が解決しようとする課題】上述のような検査シス
テムによれば、各撮像装置により得られた測定データに
基づいて、欠陥の種別まである程度判断できるという利
点があるが、複数の撮像装置が必要であり、各測定デー
タを画像処理する複数の画像処理装置も必要となるの
で、コストが嵩むという問題がある。また、欠陥の種別
まで判断するのは、欠陥の内容を検知し、それを分析す
るような場合であるが、生産ライン等で全数検査をする
場合には、良品であるか不良品であるかの判別が重要で
あり、欠陥の種別の判断までする必要のないことが多
い。この目的の為に上述のような高価なシステムを使用
するのは、過剰投資となり望ましくない。According to the inspection system as described above, there is an advantage that the type of defect can be judged to some extent based on the measurement data obtained by each image pickup device. This is necessary, and a plurality of image processing devices that image-process each measurement data are also required, which causes a problem of increased cost. Also, the type of defect is determined only when the content of the defect is detected and analyzed, but when 100% inspection is performed on the production line, it is determined whether it is a good product or a defective product. Is important, and it is often unnecessary to determine the type of defect. The use of expensive systems such as those described above for this purpose is over-invested and undesirable.
【０００６】本発明の目的は、簡単な構成で被検査対象
物の表面状態を検査可能な表面検査装置を提供すること
である。An object of the present invention is to provide a surface inspection device capable of inspecting the surface condition of an object to be inspected with a simple structure.
【０００７】[0007]
【課題を解決する為の手段】本発明は、被検査対象物の
表面に光を照射する投光手段と、上記表面からの反射光
を検出する検出手段とを有し、該検出手段からの出力に
より、上記表面の状態を検査する表面検査装置であっ
て、上記投光手段は、上記表面上の検査位置に対して異
なる入射角で光を照射する２つ以上の光源を含み、上記
検出手段は、上記光源の１つからの光の反射光に関する
明視野領域内、上記光源の他の１つからの光の反射光に
関する半明視野領域内又は暗視野領域内に配置された１
つの撮像装置を含むことを特徴とする。The present invention has a light projecting means for irradiating the surface of an object to be inspected with light, and a detecting means for detecting reflected light from the surface. A surface inspection device for inspecting a state of the surface by output, wherein the light projecting means includes two or more light sources that emit light at different incident angles with respect to an inspection position on the surface, and the detection is performed. The means are arranged in a brightfield region for reflected light of light from one of the light sources, in a semi-brightfield region for reflected light of light from another of the light sources, or in a darkfield region.
It is characterized by including two imaging devices.
【０００８】本発明は、被検査対象物の表面に光を照射
する投光手段と、上記表面からの反射光を検出する検出
手段とを有し、該検出手段からの出力により、上記表面
の状態を検査する表面検査装置であって、上記投光手段
は、上記表面上の検査位置に対して異なる入射角で光を
照射する３つの光源を含み、上記検出手段は、上記光源
の１つからの光の反射光に関する明視野領域内、上記光
源の他の１つからの光の反射光に関する半明視野領域
内、且つ上記光源の残りの１つの光の反射光に関する暗
視野領域内に配置された１つの撮像装置を含むことを特
徴とする。The present invention has a light projecting means for irradiating the surface of the object to be inspected with light, and a detecting means for detecting the reflected light from the surface, and the output of the detecting means detects the surface of the surface. A surface inspection apparatus for inspecting a state, wherein the light projecting means includes three light sources that emit light at different incident angles with respect to an inspection position on the surface, and the detecting means is one of the light sources. Within a bright-field region for reflected light of light from, a semi-bright-field region for reflected light of light from another one of the light sources, and a dark-field region for reflected light of the remaining one of the light sources. It is characterized in that it includes one arranged imaging device.
【０００９】本発明は、被検査対象物の表面に光を照射
する投光手段と、上記表面からの反射光を検出する検出
手段とを有し、該検出手段からの出力により、上記表面
の状態を検査する表面検査装置であって、上記投光手段
は、１つの光源を含み、上記検出手段は、上記光源から
の光の反射光に関する明視野領域内に配置された撮像装
置を含み、上記光源からの光の反射光に関する半明視野
領域内の反射光又は暗視野領域内の反射光の何れか一方
を上記撮像装置に供給する第１偏向手段を具えることを
特徴とする。また、更に、上記光源からの光の反射光に
関する半明視野領域の反射光又は暗視野領域内の反射光
の他方を上記撮像装置に供給する第２偏向手段を具える
ことを特徴とする。The present invention has a light projecting means for irradiating the surface of the object to be inspected with light, and a detecting means for detecting the reflected light from the surface, and the output of the detecting means allows the surface of the surface to be detected. A surface inspection device for inspecting a state, wherein the light projecting means includes one light source, and the detecting means includes an image pickup device arranged in a bright field region regarding reflected light of the light from the light source, It is characterized by comprising first deflecting means for supplying to the image pickup device either the reflected light in the semi-bright field region or the reflected light in the dark field region regarding the reflected light of the light from the light source. Further, it is characterized by further comprising second deflecting means for supplying the other of the reflected light in the semi-bright field region or the reflected light in the dark field region regarding the reflected light of the light from the light source to the image pickup device.
【００１０】また、本発明は、被検査対象物の表面に光
を照射する投光手段と、上記表面からの反射光を検出す
る検出手段と、該検出手段からの出力により、上記表面
の状態を検査する表面検査装置であって、上記投光手段
は、１つの光源を含み、上記検出手段は、上記光源から
の光の反射光に関する明視野領域内に配置された第１撮
像装置と、上記光源からの光の反射光に関する半明視野
領域内又は暗視野領域内の何れか一方に配置された第２
撮像装置とを含み、上記第１及び第２撮像装置の出力を
加算する加算手段を更に具えることを特徴とする。Further, according to the present invention, a light projecting means for irradiating the surface of the object to be inspected with light, a detecting means for detecting reflected light from the surface, and a state of the surface by the output from the detecting means. A surface inspecting apparatus for inspecting the light source, wherein the light projecting means includes one light source, and the detecting means includes a first imaging device arranged in a bright field region related to reflected light of the light from the light source, A second one disposed in either the semi-bright field region or the dark field region for the reflected light of the light from the light source;
And an image pickup device, further comprising addition means for adding the outputs of the first and second image pickup devices.
【００１１】[0011]
【実施例】図１は、本発明の一実施例の構成を示すブロ
ック図である。図１の装置では、投光手段としての３つ
の光源１０-１、１０-２、１０-３を用いているが、こ
れら３つの光源のうち、必要に応じて２つのみ使用して
も良い。これらの光源は、被検査対象物の同一位置に夫
々所定角度で光を照射するように配置されている。一
方、反射光を検出するＣＣＤカメラの撮像装置１４は１
つだけである。この撮像装置１４の位置は、光源１０-
１の反射光についての明視野領域であり、光源１０-２
の反射光についての半明視野領域であり、かつ、光源１
０-３の反射光についての暗視野領域に配置されてい
る。このような配置にすることにより、被検査位置から
の検査情報に関しては、３つの領域の情報が加算されて
撮像装置１４に供給されることになる。すなわち、撮像
装置１４は、光源１０-１からの照射光に基づく明視野
領域の反射光と、光源１０-２からの照射光に基づく半
明視野領域の反射光と、光源１０-３からの照射光に基
づく暗視野領域の反射光を同時に検出することになる。
これらの３つの領域の検査情報は、夫々種々の欠陥の種
別に基づいているので、これらの情報を総合した情報を
検出することにより、被検査対象物が不良か否かを効率
的かつ総合的に判断することができる。勿論、前述のよ
うに、３つの領域のうち、２つの領域のみの情報で十分
であれば、光源を２つに制限して２つの領域のみの反射
光を解析するように構成しても良い。その場合、１つの
光源により、明視野領域の光を撮像装置１４に供給し、
残りの１つの光源により、半明視野領域又は暗明視野領
域の何れか一方の光を撮像装置に供給するようにすれば
良い。撮像装置１４からの信号は、画像処理装置１６に
よって、増幅され、アナログ・デジタル変換され、フィ
ルタ処理等が実行され、その結果得られた検査データ
は、コンピュータ１８に転送され、所定の分析アルゴリ
ズムに基づいて良、不良が判断される。このような、画
像処理装置及びコンピュータにおけるデータ処理及び判
断処理は、当業者には周知の技術に属するので詳細な説
明は省略する。1 is a block diagram showing the configuration of an embodiment of the present invention. In the apparatus of FIG. 1, three light sources 10-1, 10-2, 10-3 are used as the light projecting means, but of these three light sources, only two may be used if necessary. . These light sources are arranged so as to irradiate the same position of the inspection object with light at a predetermined angle. On the other hand, the image pickup device 14 of the CCD camera for detecting the reflected light is 1
Only one. The position of the imaging device 14 is the light source 10-
The light source 10-2 is a bright field region for the reflected light of No. 1
Is a semi-bright field region for reflected light of
It is located in the dark field region for 0-3 reflected light. With such an arrangement, with respect to the inspection information from the inspected position, the information of the three areas is added and supplied to the imaging device 14. That is, the imaging device 14 includes reflected light in the bright-field region based on the irradiation light from the light source 10-1, reflected light in the semi-bright-field region based on the irradiation light from the light source 10-2, and light from the light source 10-3. The reflected light in the dark field region based on the irradiation light will be detected at the same time.
Since the inspection information of these three areas is based on the types of various defects, it is possible to efficiently and comprehensively determine whether or not the inspection object is defective by detecting the information obtained by integrating these information. Can be judged. Of course, as described above, if the information of only two areas of the three areas is sufficient, the number of light sources may be limited to two and the reflected light of only two areas may be analyzed. . In that case, the light source supplies light in the bright field region to the imaging device 14,
The remaining one light source may supply the light from either the semi-bright field region or the dark field region to the imaging device. The signal from the imaging device 14 is amplified, analog-digital converted, filtered, and the like by the image processing device 16, and the inspection data obtained as a result is transferred to the computer 18 and subjected to a predetermined analysis algorithm. Good or bad is judged based on the result. Such data processing and determination processing in the image processing apparatus and the computer belong to the technology well known to those skilled in the art, and thus detailed description thereof will be omitted.
【００１２】図２は、本発明による別の実施例の構成を
示すブロック図である。投光手段として使用する１つの
光源１０は、検査位置に光を照射し、その反射光に関す
る明視野領域に１つの撮像装置１４を配置している。そ
して、検査位置からの反射光線に関する半明視野領域に
１組の光学系、すなわち、偏向手段として機能する反射
ミラー１５-１及びハーフ・ミラー１５-２が配置されて
いる。この結果、検査位置からの反射光線の半明視野領
域の光が反射ミラー１５-１及びハーフ・ミラー１５-２
で反射されて撮像装置１４に供給される。同様に、反射
光に関する暗視野領域に別の１組の光学系であって、偏
向手段として機能する反射ミラー１５-３及びハーフ・
ミラー１５-４が配置されており、暗視野領域の光がこ
れらに反射されて撮像装置１４に供給される。なお、こ
れら２組の光学系は、常に両方使用する必要はなく、検
査対象の必要性に応じて何れか１組のみを使用するよう
にしても良い。このように、この図２のシステムでは、
１つの光源と１つの撮像装置と、１組又は２組の光学系
を用いて、明視野領域、半明視野領域及び暗視野領域の
光を同時に検出することができる。この検出結果は、図
１と同様に、画像処理装置１６に転送され、コンピュー
タ１８により解析処理される。FIG. 2 is a block diagram showing the configuration of another embodiment according to the present invention. One light source 10 used as a light projecting unit irradiates the inspection position with light, and one image pickup device 14 is arranged in a bright field region related to the reflected light. Then, a set of optical systems, that is, a reflecting mirror 15-1 and a half mirror 15-2 which function as a deflecting means are arranged in a semi-bright field region related to the reflected light beam from the inspection position. As a result, the light in the semi-bright field region of the reflected light from the inspection position is reflected by the reflecting mirror 15-1 and the half mirror 15-2.
And is supplied to the image pickup device 14. Similarly, a reflection mirror 15-3 and a half mirror which are another set of optical systems in the dark field region for reflected light and function as a deflection means.
A mirror 15-4 is arranged, and the light in the dark field region is reflected by these and supplied to the imaging device 14. Note that it is not always necessary to use both of these two sets of optical systems, and only one set may be used depending on the needs of the inspection target. Thus, in the system of FIG. 2,
By using one light source, one imaging device, and one or two sets of optical systems, it is possible to simultaneously detect light in the bright field region, the semi-bright field region, and the dark field region. This detection result is transferred to the image processing device 16 and analyzed by the computer 18, as in FIG.
【００１３】図３は、本発明の更に別の実施例の構成を
示すブロック図である。１つの光源１０から光を検査位
置に照射し、この反射光の明視野領域、半明視野領域及
び暗視野領域に夫々ＣＣＤライン・センサ・カメラのよ
うな撮像装置１４-１、１４-２、１４-３を配置してい
る。これら３つの撮像装置１４-１、１４-２、１４-３
で検出したデータは、加算器１７に供給され、加算さ
れ、この加算結果が画像処理装置１６により画像処理さ
れ、その処理済データがコンピュータ１８により解析さ
れる構成である。ただし、３つの撮像装置１４-１、１
４-２、１４-３の動作が同期している必要があるので、
共通の動作クロック信号がクロック発生器２０から供給
される。このクロック発生器２０は、被検査対象物であ
る磁気ディスク１２の駆動モーター２２に直結されたエ
ンコーダ２４からのスタート・パルスに同期してクロッ
ク信号を発生する。このクロック信号は、画像処理装置
１６にも供給され、画像処理動作も同期する構成になっ
ている。なお、この実施例においても、３つの撮像装置
を必要に応じて何れか２つにしても良いのは勿論であ
る。２つにする場合には、１つは、明視野領域内に配置
され、残りの１つは、半明視野領域又は暗明視野領域の
何れか一方の領域に配置すれば良い。FIG. 3 is a block diagram showing the configuration of still another embodiment of the present invention. Light is emitted from one light source 10 to the inspection position, and image pickup devices 14-1, 14-2 such as CCD line sensor cameras are provided in the bright field region, semi-bright field region and dark field region of the reflected light, respectively. 14-3 is arranged. These three imaging devices 14-1, 14-2, 14-3
The data detected in 3 is supplied to the adder 17, added, the result of the addition is subjected to image processing by the image processing device 16, and the processed data is analyzed by the computer 18. However, the three image pickup devices 14-1 and 1
Since the operations of 4-2 and 14-3 need to be synchronized,
A common operating clock signal is provided by the clock generator 20. The clock generator 20 generates a clock signal in synchronization with a start pulse from an encoder 24 directly connected to a drive motor 22 of the magnetic disk 12 which is an object to be inspected. The clock signal is also supplied to the image processing device 16 so that the image processing operation is also synchronized. In this embodiment as well, it goes without saying that any of the three image pickup devices may be provided as necessary. In the case of two, one may be arranged in the bright field area and the other one may be arranged in either one of the semi-bright field area and the dark bright field area.
【００１４】以上本発明の好適実施例について説明した
が、本発明はここに説明した実施例のみに限定されるも
のではなく、本発明の要旨を逸脱することなく必要に応
じて種々の変形及び変更を実施し得ることは当業者には
明らかである。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the embodiments described herein, and various modifications and modifications can be made as necessary without departing from the gist of the present invention. It will be apparent to those skilled in the art that changes can be made.
【００１５】[0015]
【発明の効果】本発明によれば、簡単な構成で、被検査
対象物表面からの反射光線の明視野領域、半明視野領域
又は暗視野領域の３つの成分又は選択した２つの成分を
合成して検出できるので、被検査対象物の表面の欠陥等
を低コストで容易に判断することができる。According to the present invention, three components of the bright field region, the semi-bright field region or the dark field region of the reflected light from the surface of the object to be inspected or the selected two components are combined with a simple structure. Therefore, it is possible to easily determine a defect or the like on the surface of the inspection object at low cost.
【図１】本発明の一実施例の構成を示すブロック図であ
る。FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.
【図２】本発明の他の実施例の構成を示すブロック図で
ある。FIG. 2 is a block diagram showing the configuration of another embodiment of the present invention.
【図３】本発明の更に別の実施例の構成を示すブロック
図である。FIG. 3 is a block diagram showing the configuration of still another embodiment of the present invention.
【図４】従来の表面検査装置の構成例を示すブロック図
である。FIG. 4 is a block diagram showing a configuration example of a conventional surface inspection device.
【図５】本発明に関連して、被検査対象物表面からの反
射光の輝度に関する明視野領域、半明視野領域及び暗視
野領域の特性の一例を示すグラフである。FIG. 5 is a graph showing an example of characteristics of a bright-field region, a semi-bright-field region, and a dark-field region related to the brightness of reflected light from the surface of the inspection object in relation to the present invention.
１０ 投光手段（光源） １２ 被検査対象物 １４ 撮像装置 １５-１、１５-２ 第１偏向手段 １５-３、１５-４ 第２偏向手段 １６ 画像処理装置 １７ 加算器 １８ コンピュータ 10 Projection means (light source) 12 Object to be inspected 14 Imaging device 15-1, 15-2 First deflection means 15-3, 15-4 Second deflection means 16 Image processing device 17 Adder 18 Computer
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０６Ｔ 1/00 Ｇ１１Ｂ 5/84 Ｃ 7303−5Ｄ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location G06T 1/00 G11B 5/84 C 7303-5D
Claims (5)
手段と、上記表面からの反射光を検出する検出手段とを
有し、該検出手段からの出力により、上記表面の状態を
検査する表面検査装置において、 上記投光手段は、上記表面上の検査位置に対して異なる
入射角で光を照射する２つ以上の光源を含み、 上記検出手段は、上記光源の１つからの光の反射光に関
する明視野領域内で、かつ上記光源の他の１つからの光
の反射光に関する半明視野領域内又は暗視野領域内に配
置された１つの撮像装置を含むことを特徴とする表面検
査装置。1. A light emitting means for irradiating a surface of an object to be inspected with light, and a detecting means for detecting a reflected light from the surface, the state of the surface being detected by an output from the detecting means. In the surface inspection apparatus for inspecting, the light projecting means includes two or more light sources that emit light at different incident angles with respect to the inspection position on the surface, and the detecting means includes one of the light sources. An imaging device disposed in a bright field region for reflected light and in a semi-bright field region or a dark field region for reflected light from another one of the light sources. Surface inspection equipment.
手段と、上記表面からの反射光を検出する検出手段とを
有し、該検出手段からの出力により、上記表面の状態を
検査する表面検査装置において、 上記投光手段は、上記表面上の検査位置に対して異なる
入射角で光を照射する３つの光源を含み、 上記検出手段は、上記光源の１つからの光の反射光に関
する明視野領域内、上記光源の他の１つからの光の反射
光に関する半明視野領域内、且つ上記光源の残りの１つ
からの光の反射光に関する暗視野領域内に配置された１
つの撮像装置を含むことを特徴とする表面検査装置。2. A light projecting means for irradiating the surface of an object to be inspected with light, and a detecting means for detecting reflected light from the surface, the output of the detecting means indicating the state of the surface. In the surface inspection apparatus for inspecting, the light projecting unit includes three light sources that emit light at different incident angles with respect to the inspection position on the surface, and the detecting unit detects the light from one of the light sources. Located in a bright field area for reflected light, a semi-bright field area for reflected light of light from another one of the light sources, and a dark field area for reflected light of light from the remaining one of the light sources 1
A surface inspection device including two image pickup devices.
段と、上記表面からの反射光を検出する検出手段とを有
し、該検出手段からの出力により、上記表面の状態を検
査する表面検査装置において、 上記投光手段は、１つの光源を含み、 上記検出手段は、上記光源からの光の反射光に関する明
視野領域内に配置された撮像装置を含み、 上記光源からの光の反射光に関する半明視野領域内又は
暗視野領域内の何れか一方の反射光を上記撮像装置に供
給する第１偏向手段を具えることを特徴とする表面検査
装置。3. A light projecting means for irradiating the surface of an object to be inspected with light, and a detecting means for detecting reflected light from the surface. The output of the detecting means indicates the state of the surface. In the surface inspection apparatus for inspecting, the light projecting means includes one light source, and the detecting means includes an image pickup device arranged in a bright field region for reflected light of the light from the light source. A surface inspection apparatus comprising a first deflecting means for supplying the image pickup device with reflected light in either a semi-bright field region or a dark field region related to reflected light.
射光に関する上記半明視野領域内又は上記暗視野領域内
の他方の反射光を上記撮像装置に供給する第２偏向手段
を具えることを特徴とする請求項３記載の表面検査装
置。4. The second deflection means according to claim 3, further comprising: another reflected light in the semi-bright field region or in the dark field region, which is reflected light of the light from the light source, is supplied to the imaging device. The surface inspection apparatus according to claim 3, wherein
手段と、上記表面からの反射光を検出する検出手段とを
有し、該検出手段からの出力により、上記表面の状態を
検査する表面検査装置において、 上記投光手段は、１つの光源を含み、 上記検出手段は、上記光源からの光の反射光に関する明
視野領域内に配置された第１撮像装置と、 上記光源からの光の反射光に関する半明視野領域内又は
暗視野領域内の何れか一方に配置された第２撮像装置と
を含み、 上記第１及び第２撮像装置の出力を加算する加算手段を
更に具えることを特徴とする表面検査装置。5. A light projecting means for irradiating the surface of an object to be inspected with light, and a detecting means for detecting reflected light from the surface, the output of the detecting means indicating the state of the surface. In the surface inspection apparatus for inspecting, the light projecting means includes one light source, and the detecting means includes a first image pickup device arranged in a bright field region related to reflected light of the light from the light source, and the light source. A second image pickup device arranged in one of a semi-bright field region and a dark field region regarding the reflected light of the light of, and further includes an addition unit for adding outputs of the first and second image pickup devices. A surface inspection device characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6282909A JPH08122266A (en) | 1994-10-21 | 1994-10-21 | Surface inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6282909A JPH08122266A (en) | 1994-10-21 | 1994-10-21 | Surface inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08122266A true JPH08122266A (en) | 1996-05-17 |
Family
ID=17658687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6282909A Pending JPH08122266A (en) | 1994-10-21 | 1994-10-21 | Surface inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08122266A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6011618A (en) * | 1997-12-25 | 2000-01-04 | System Seiko Co., Ltd. | Method and apparatus of surface inspection of a disk |
| WO2007145224A1 (en) * | 2006-06-12 | 2007-12-21 | Sharp Kabushiki Kaisha | End inclination angle measuring method, inspecting method and inspecting apparatus for objects having undulations, method for determining the position of illuminating means, irregularity inspecting apparatus, and illuminating position determining apparatus |
| KR100953204B1 (en) * | 2008-05-19 | 2010-04-15 | (주)쎄미시스코 | Glass waviness inspection device and inspection method thereof |
| US7889358B2 (en) | 2006-04-26 | 2011-02-15 | Sharp Kabushiki Kaisha | Color filter inspection method, color filter manufacturing method, and color filter inspection apparatus |
| WO2016208023A1 (en) * | 2015-06-25 | 2016-12-29 | 株式会社ニレコ | Web detection device and detection method |
-
1994
- 1994-10-21 JP JP6282909A patent/JPH08122266A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6011618A (en) * | 1997-12-25 | 2000-01-04 | System Seiko Co., Ltd. | Method and apparatus of surface inspection of a disk |
| US7889358B2 (en) | 2006-04-26 | 2011-02-15 | Sharp Kabushiki Kaisha | Color filter inspection method, color filter manufacturing method, and color filter inspection apparatus |
| WO2007145224A1 (en) * | 2006-06-12 | 2007-12-21 | Sharp Kabushiki Kaisha | End inclination angle measuring method, inspecting method and inspecting apparatus for objects having undulations, method for determining the position of illuminating means, irregularity inspecting apparatus, and illuminating position determining apparatus |
| JP2008020431A (en) * | 2006-06-12 | 2008-01-31 | Sharp Corp | End tilt angle measuring method, system and method for inspection of undulating object |
| JP4597946B2 (en) * | 2006-06-12 | 2010-12-15 | シャープ株式会社 | End tilt angle measuring method, inspection method and inspection apparatus for inspected object having undulations |
| KR100953204B1 (en) * | 2008-05-19 | 2010-04-15 | (주)쎄미시스코 | Glass waviness inspection device and inspection method thereof |
| WO2016208023A1 (en) * | 2015-06-25 | 2016-12-29 | 株式会社ニレコ | Web detection device and detection method |
| JPWO2016208023A1 (en) * | 2015-06-25 | 2018-04-05 | 株式会社ニレコ | Web detecting apparatus and detecting method |
| TWI682162B (en) * | 2015-06-25 | 2020-01-11 | 日商仁力克股份有限公司 | Belt body detection device and detection method |
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