JPH0786473A - Heat pipe cooler - Google Patents

Heat pipe cooler

Info

Publication number
JPH0786473A
JPH0786473A JP5228737A JP22873793A JPH0786473A JP H0786473 A JPH0786473 A JP H0786473A JP 5228737 A JP5228737 A JP 5228737A JP 22873793 A JP22873793 A JP 22873793A JP H0786473 A JPH0786473 A JP H0786473A
Authority
JP
Japan
Prior art keywords
heat
block
holes
heat pipe
relay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5228737A
Other languages
Japanese (ja)
Other versions
JP2996843B2 (en
Inventor
Takashi Hashimoto
隆 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5228737A priority Critical patent/JP2996843B2/en
Publication of JPH0786473A publication Critical patent/JPH0786473A/en
Application granted granted Critical
Publication of JP2996843B2 publication Critical patent/JP2996843B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To arrange heat pipes in parallel easily and improve the precision of the positions and the pitches by attaching all the straight heat pipes to a surface of a connecting block vertically. CONSTITUTION:Heat pipes 3 each with an open end are arranged in parallel to each other and connected vertically to the connecting surface of a connecting block 2, the connecting surface being opposed to the joining surface joined to the heat-receiving block 1. The heat pipes 3 communicate with the holes 2a arranged in the connecting block 2. Cooling fins 4 are attached to the other ends by press fit or by pipe expansion. Thus, the positions and the pitches of the heat pipes are determined easily and the precision of dimensions is improved. In the case of inserting the heat pipes 3 through the cooling fins 4, the work becomes easier.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体素子を冷却するヒ
ートパイプ式冷却器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe cooler for cooling semiconductor devices.

【0002】[0002]

【従来の技術】半導体素子は動作時に熱を発するため、
冷却をすることが必要であり、その冷却方式にも沸騰冷
却方式やヒートパイプを用いた冷却方式がある。沸騰冷
却方式に比べて冷媒量が著しく減少できる等の理由か
ら、近年ヒートパイプを用いた冷却方式が多く使用され
てきている。
2. Description of the Related Art Semiconductor devices generate heat during operation,
It is necessary to cool, and there are a boiling cooling system and a cooling system using a heat pipe as the cooling system. In recent years, a cooling system using a heat pipe has been widely used because the amount of the refrigerant can be remarkably reduced as compared with the boiling cooling system.

【0003】ヒートパイプ式冷却器は、半導体素子が押
圧される受熱部ブロックにヒートパイプの一端が接続さ
れ、そしてヒートパイプの他端に放熱フィンが複数枚取
付けられて構成されている。冷媒が封入された端部の閉
じたヒートパイプの一端を、受熱部ブロックに設けられ
たヒートパイプの径より若干大きな穴に挿入し、できた
すきまにハンダ等を充填することで、受熱部ブロックと
ヒートパイプとは接続される。複数枚の放熱フィンには
ヒートパイプが貫通する穴がそれぞれ設けられている。
これら放熱フィンに設けられた穴は、ヒートパイプの径
よりも若干小さい穴であり、この穴に対して圧入方式に
よりヒートパイプを挿入し放熱フィンとヒートパイプを
密着させ、複数枚の放熱フィンはヒートパイプの軸方向
に垂直となる方向に適当なピッチで積層される。また放
熱フィンに設けられる穴をヒートパイプの径と同じ若し
くは若干大きく形成し、その穴にヒートパイプを挿入し
てヒートパイプ内部よりパイプ管径を拡げる拡管方式に
より互いを密着させる方式もある。
A heat pipe type cooler is constructed by connecting one end of a heat pipe to a heat receiving block against which a semiconductor element is pressed, and attaching a plurality of heat radiation fins to the other end of the heat pipe. By inserting one end of the closed heat pipe with the refrigerant sealed into a hole slightly larger than the diameter of the heat pipe provided in the heat receiving block, and filling the resulting clearance with solder, etc., the heat receiving block And the heat pipe are connected. Each of the plurality of heat radiation fins is provided with a hole through which a heat pipe passes.
The holes provided in these radiating fins are slightly smaller than the diameter of the heat pipe, and a heat pipe is inserted into this hole by a press-fitting method to bring the radiating fins into close contact with each other. The heat pipes are laminated at an appropriate pitch in a direction perpendicular to the axial direction. There is also a method in which a hole provided in the heat radiation fin is formed to have the same diameter as or slightly larger than the diameter of the heat pipe, and the heat pipe is inserted into the hole to expand the pipe diameter from the inside of the heat pipe so as to be in close contact with each other.

【0004】何れの方式も、穴の径、穴の位置は寸法精
度が要求されるが、同時にヒートパイプの位置、ピッチ
にも寸法精度は要求されることになる。最も一般的なヒ
ートパイプ式冷却器では、真直なヒートパイプ数本が用
いられるが、放熱フィン側の空気の流れ、受熱部ブロッ
クの素子取付部の周辺の部品実装を効率良くする為、屈
曲したヒートパイプ数本を用いて受熱部ブロックの素子
取付面と放熱フィン積層方向とにある角度をもたせるこ
とがある。
In either method, dimensional accuracy is required for the hole diameter and hole position, but at the same time, dimensional accuracy is required for the position and pitch of the heat pipe. The most common heat pipe type cooler uses several straight heat pipes, but it is bent to improve the air flow on the radiating fin side and the component mounting around the element mounting part of the heat receiving block efficiently. There may be a case where a heat pipe is used to form an angle between the element mounting surface of the heat receiving block and the radiation fin stacking direction.

【0005】[0005]

【発明が解決しようとする課題】上述した屈曲したヒー
トパイプ数本の一端を受熱部ブロックに挿入し、他端に
複数枚の放熱フィンを取付けてヒートパイプ式冷却器を
構成する場合、放熱フィンに設けられた各穴に数本の屈
曲したヒートパイプが同時に挿入される。ヒートパイプ
の位置、ピッチには寸法精度が要求されるが、ヒートパ
イプが屈曲しているため、寸法精度が上げられず、又ヒ
ートパイプと各放熱フィンとの密着度合にそれぞれバラ
ツキが生じ、放熱性能が満足に得られないという問題が
あった。
When one end of several bent heat pipes described above is inserted into the heat receiving block and a plurality of heat radiation fins are attached to the other end to form a heat pipe type cooler, the heat radiation fins are used. Several bent heat pipes are simultaneously inserted into each hole provided in the. Dimensional accuracy is required for the position and pitch of the heat pipe, but because the heat pipe is bent, the dimensional accuracy cannot be improved, and the degree of close contact between the heat pipe and each radiating fin varies, causing heat dissipation. There was a problem that the performance was not satisfactory.

【0006】更に放熱フィン側を自然対流により冷却す
る場合、放熱フィンを大きくし放熱面積を増やす必要が
ある。しかしヒートパイプが挿入される箇所は受熱部ブ
ロックの大きさにより限定されてしまうため、放熱フィ
ンを大形化しても放熱フィン全体に渡ってヒートパイプ
が挿入されず、放熱フィンの効率が悪く、効果的に冷却
が行えない。そのため冷却フィンの枚数を増やす等の対
策をとる必要があり、装置が大型化してしまうという問
題も生じていた。
Further, when cooling the heat radiation fin side by natural convection, it is necessary to enlarge the heat radiation fin to increase the heat radiation area. However, since the location where the heat pipe is inserted is limited by the size of the heat receiving block, the heat pipe is not inserted over the entire heat dissipation fin even if the heat dissipation fin is enlarged, and the efficiency of the heat dissipation fin is poor. Not able to cool effectively. Therefore, it is necessary to take measures such as increasing the number of cooling fins, which causes a problem that the device becomes large.

【0007】そこで本発明は上記問題点を除去し、ヒー
トパイプの位置、ピッチの寸法精度をあげ、又ヒートパ
イプと放熱フィンとの接合度合をそれぞれ均等にして放
熱性能を向上させるヒートパイプ式冷却器を提供するこ
とを目的とする。又本発明は放熱フィンを大形化しても
受熱部ブロックの大きさに限定されずに放熱フィンの効
率を上げ、放熱性能を向上させるヒートパイプ式冷却器
を提供することを目的とする。
Therefore, the present invention eliminates the above-mentioned problems, improves the dimensional accuracy of the position and pitch of the heat pipe, and makes the degree of joint between the heat pipe and the heat radiation fin uniform to improve heat radiation performance. The purpose is to provide a container. Another object of the present invention is to provide a heat pipe type cooler that increases the efficiency of the heat radiation fins and improves the heat radiation performance without being limited to the size of the heat receiving block even if the heat radiation fins are made large.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に請求項1記載の発明では、冷媒液が注入される複数個
の穴が1つの面に所定の間隔毎に形成され、半導体素子
が押圧される受熱部ブロックと、この受熱部ブロックと
接合され、この接合面とこの接合面に所定の角度傾いて
対向する面との間に、受熱部ブロックに形成される複数
個の穴それぞれと連通する複数個の貫通穴が形成される
中継部ブロックと、この中継部ブロックの受熱部ブロッ
クとの接合面と対向する面に垂直に取付けられ、中継部
ブロックに形成される複数個の貫通穴と連通する複数本
のヒートパイプと、これらヒートパイプにそれぞれ取付
けられた複数枚の放熱フィンとを備えてなる。
In order to achieve the above object, according to the invention of claim 1, a plurality of holes into which a coolant liquid is injected are formed on one surface at predetermined intervals, and a semiconductor element is formed. Each of the plurality of holes formed in the heat receiving portion block is pressed, and the heat receiving portion block is joined to the heat receiving portion block, and between the joint surface and a surface facing the joint surface at a predetermined angle. A relay block having a plurality of through holes communicating with each other, and a plurality of through holes formed in the relay block, which are vertically attached to a surface of the relay block that faces the joining surface of the heat receiving block. A plurality of heat pipes communicating with the heat pipes and a plurality of heat radiation fins attached to the heat pipes are provided.

【0009】又請求項2記載の発明では、冷媒液が注入
される複数個の穴が1つの面に所定の間隔毎に形成さ
れ、半導体素子が押圧される受熱部ブロックと、この受
熱部ブロックと接合され、この接合面からこの接合面に
所定の角度傾いて対向する面にかけて受熱部ブロックに
形成される複数個の穴の間隔から広がって形成され、複
数個の穴それぞれと連通する複数個の貫通穴を有する中
継部ブロックと、この中継部ブロックの受熱部ブロック
との接合面と対向する面に垂直に取付けられ、中継部ブ
ロックに形成される複数個の貫通穴と連通する複数本の
ヒートパイプと、これらヒートパイプにそれぞれ取付け
られた複数枚の放熱フィンとを備えてなる。
According to the second aspect of the present invention, a plurality of holes for injecting the refrigerant liquid are formed in one surface at predetermined intervals, and the heat receiving portion block against which the semiconductor element is pressed, and the heat receiving portion block. A plurality of holes which are formed so as to extend from the space between the plurality of holes formed in the heat receiving section block from the joint surface to the surface facing the joint surface at a predetermined angle, and which communicate with each of the plurality of holes. A relay block having a through hole, and a plurality of relay blocks that are vertically attached to the surface of the relay block that faces the joint surface between the heat receiving block and the plurality of through holes formed in the relay block. It comprises a heat pipe and a plurality of heat radiation fins attached to these heat pipes.

【0010】[0010]

【作用】上述した構成により請求項1記載の発明では、
受熱部ブロックに設けた穴は、中継部ブロックに設けた
貫通穴を介してヒートパイプと接続されるが、中継部ブ
ロックにより冷媒が通る穴の軸方向は曲げられることに
なる。中継部ブロックに接続されるヒートパイプは真直
なもので、その接続される中継部ブロックの面は複数本
のヒートパイプに対して同一の平面である為、ヒートパ
イプは、その位置、ピッチの寸法精度をあげることがで
き、放熱フィンの取付の際、良好に圧入あるいは拡管が
可能となる。
With the above-mentioned structure, in the invention according to claim 1,
The hole provided in the heat receiving block is connected to the heat pipe through the through hole provided in the relay block, but the axial direction of the hole through which the refrigerant passes is bent by the relay block. The heat pipe connected to the relay block is straight, and the surface of the connected relay block is the same plane for multiple heat pipes. The accuracy can be improved, and when mounting the heat radiation fin, it is possible to press fit or expand the pipe satisfactorily.

【0011】また請求項2記載の発明では、中継部ブロ
ックに設けられる複数個の貫通穴を平行ではなく、ヒー
トパイプの接続される側を広げるような穴に形成するこ
とで、受熱部ブロックに設けた穴ピッチよりも大きなピ
ッチで複数個のヒートパイプが中継部ブロックに接続さ
れることになる。従って放熱フィンのより周辺部分の方
までヒートパイプが放熱フィンに挿入されることにな
り、放熱フィンの放熱効率が向上する。
According to the second aspect of the present invention, the plurality of through holes provided in the relay block are not parallel to each other, but are formed so as to widen the side to which the heat pipe is connected. A plurality of heat pipes are connected to the relay block at a pitch larger than the provided hole pitch. Therefore, the heat pipe is inserted into the heat radiating fin toward the peripheral portion of the heat radiating fin, and the heat radiating efficiency of the heat radiating fin is improved.

【0012】[0012]

【実施例】本発明の一実施例を図面を参照して詳細に説
明する。図1,図2は請求項1記載の発明の第1の実施
例を示す図で、図1はヒートパイプ式冷却器の斜視図、
図2は図1のA−A断面図である。半導体素子(図示し
ない)が押圧される受熱部ブロック1には複数個の穴1
a(本実施例では3つの場合を示している)が設けられ
ていて、穴1aには冷媒1bが入れられている。受熱部
ブロック1の穴1aが設けられた面には、中継部ブロッ
ク2がロウ付け等により接合される。この中継部ブロッ
ク2は受熱部ブロック1との接合面と対向する面が平行
ではなく本実施例では約80度の角度をもつように形成さ
れ、その接合面と対向する面を貫通する複数の穴2a
(本実施例では3つの場合を示している)が設けられて
いる。この中継部ブロック2の穴2aと受熱部ブロック
1の穴1aが、連通するように受熱部ブロック1と中継
部ブロック2とは接合されている。そして中継部ブロッ
ク2の受熱部ブロック1との接合面と対向する面には一
端が開放した複数本(本実施例では3本)のヒートパイ
プ3が垂直にそして各々平行となるように接合され、こ
れらヒートパイプ3はそれぞれ中継部ブロック2に設け
られた穴2aと連通している。そしてヒートパイプ3の
他端には、複数枚の放熱フィン4が圧入方式、拡管方式
等により取付けられている。このように構成されたヒー
トパイプ式冷却器では、半導体素子から発生する熱は受
熱部ブロック1に伝わり穴1a内の冷媒1bが沸騰して
気化し、中継部ブロック2の穴2aを介してヒートパイ
プ3に伝わる。そして、ヒートパイプ3に取付けられた
放熱フィン4で熱を放出し、気化した冷媒1bが圧縮し
て受熱部ブロック1の穴1aに戻る。
An embodiment of the present invention will be described in detail with reference to the drawings. 1 and 2 are views showing a first embodiment of the invention described in claim 1, FIG. 1 is a perspective view of a heat pipe type cooler,
2 is a sectional view taken along line AA of FIG. A plurality of holes 1 are formed in the heat receiving portion block 1 against which a semiconductor element (not shown) is pressed.
a (three cases are shown in this embodiment) is provided, and the coolant 1b is put in the hole 1a. The relay block 2 is joined to the surface of the heat receiving block 1 where the hole 1a is provided by brazing or the like. The relay block 2 is formed such that the surface facing the joint surface with the heat receiving block 1 is not parallel and has an angle of about 80 degrees in the present embodiment, and a plurality of surfaces penetrating the surface facing the joint surface are formed. Hole 2a
(Three cases are shown in this embodiment). The heat receiving part block 1 and the relay part block 2 are joined so that the hole 2a of the relay part block 2 and the hole 1a of the heat receiving part block 1 communicate with each other. A plurality of (three in this embodiment) heat pipes 3 having one open end are joined vertically and in parallel to the surface of the relay block 2 that faces the joining surface with the heat receiving block 1. The heat pipes 3 communicate with the holes 2 a provided in the relay block 2. A plurality of heat radiation fins 4 are attached to the other end of the heat pipe 3 by a press fitting method, a tube expanding method, or the like. In the heat pipe cooler configured as described above, the heat generated from the semiconductor element is transmitted to the heat receiving section block 1 and the refrigerant 1b in the hole 1a is boiled and vaporized, and the heat is generated through the hole 2a of the relay section block 2. It is transmitted to pipe 3. Then, the heat radiation fins 4 attached to the heat pipe 3 release heat, and the vaporized refrigerant 1b is compressed and returns to the holes 1a of the heat receiving section block 1.

【0013】受熱部ブロック1に対して中継部ブロック
2が接合され、その中継部ブロック2に対して複数本の
ヒートパイプ3が接合されるが、中継部ブロック2の受
熱部ブロック1が接合される面とヒートパイプ3が接合
される面とは平行ではなく約80度という傾きをもってい
る為、ヒートパイプ3は中継部ブロック2に対して垂直
に接合しているが、受熱部ブロック1に対してヒートパ
イプ3は約80度の傾きをもつことになる。従ってヒート
パイプ3は真直なものを使用することで受熱部ブロック
1との傾きを約80度とれることになる。ヒートパイプ3
の中継部ブロック2への接続は、真直な複数本のヒート
パイプ3を中継部ブロック2の1つの平面に直角に取付
けることになるので、各ヒートパイプの位置、ピッチ等
は決めやすくなり寸法精度をあげることができる。又放
熱フィン4へヒートパイプ3を挿入する時も、容易に作
業を行うことができるので、放熱フィン4に設けられた
ヒートパイプ3を挿入する為の各穴の位置は正確にヒー
トパイプ3の位置と合わせることができる。更にヒート
パイプ3を放熱フィン4へ圧入方式又は拡管方式により
接合する時、ヒートパイプ3と放熱フィン4とを良好に
密着させることができるため効率良く冷却を行うことが
できる。
The relay block 2 is joined to the heat receiving block 1, and a plurality of heat pipes 3 are joined to the relay block 2, but the heat receiving block 1 of the relay block 2 is joined. The heat pipe 3 is joined perpendicularly to the relay block 2 because the heat pipe 3 and the face to which the heat pipe 3 is joined are not parallel to each other and have an inclination of about 80 degrees. Therefore, the heat pipe 3 has an inclination of about 80 degrees. Therefore, by using a straight heat pipe 3, the inclination with the heat receiving block 1 can be set to about 80 degrees. Heat pipe 3
For connecting to the relay unit block 2, since a plurality of straight heat pipes 3 are mounted at right angles to one plane of the relay unit block 2, the position, pitch, etc. of each heat pipe can be easily determined, and dimensional accuracy can be improved. Can be raised. Also, when the heat pipe 3 is inserted into the radiating fins 4, the work can be easily performed, so that the positions of the holes for inserting the heat pipes 3 provided in the radiating fins 4 are accurately determined. Can be aligned with the position. Further, when the heat pipe 3 is joined to the radiating fin 4 by a press-fitting method or a pipe expanding method, the heat pipe 3 and the radiating fin 4 can be satisfactorily brought into close contact with each other, so that efficient cooling can be performed.

【0014】なお本実施例では真直な3本のヒートパイ
プ3を用いた場合を示したが、ヒートパイプ3の本数は
これに限られず、ヒートパイプ3の本数と同じ数の穴2
aをもつ中継部ブロック2、同じ数の穴1aをもつ受熱
部ブロック1それぞれを上述した実施例と同様に接合し
てもよい。又本実施例では、中継部ブロック2の受熱部
ブロック1との接合面とヒートパイプ3との接合面と
は、約80度の傾きをもたせているが、この角度は中継部
ブロック1に取付けられたヒートパイプ3が水平より上
方へ向く角度であればよい。約80度の角度をもたせると
いうことは、ヒートパイプ3は水平より上方へ約10度向
いていることになり、気化した冷媒1bが放熱フィン4
へと伝わっていくことになる。
In this embodiment, the case where three straight heat pipes 3 are used is shown, but the number of heat pipes 3 is not limited to this, and the same number of holes 2 as the number of heat pipes 3 is used.
The relay block 2 having a and the heat receiving block 1 having the same number of holes 1a may be joined in the same manner as in the above-described embodiment. Further, in this embodiment, the joint surface of the relay block 2 with the heat receiving block 1 and the joint surface of the heat pipe 3 are inclined by about 80 degrees, but this angle is attached to the relay block 1. It suffices that the heat pipe 3 thus formed has an angle that is directed upward from the horizontal. Having an angle of about 80 degrees means that the heat pipe 3 faces upward from the horizontal by about 10 degrees, and the vaporized refrigerant 1b is radiated by the radiating fins 4
It will be transmitted to.

【0015】次に図3は請求項1記載の発明の第2の実
施例を示すヒートパイプ式冷却器の斜視図である。本実
施例は図1,図2に示した第1の実施例の受熱部ブロッ
ク1、ヒートパイプ3を90度回転した構成である。受熱
部ブロック5には冷媒が入れられる穴5aが設けられて
いて、中継部ブロック6が接合される。中継部ブロック
6に設けられた穴6aと受熱部ブロック5に設けられた
穴5aが連通している。中継部ブロック6に設けられる
穴6aは、受熱部ブロック5との接合面とその面に対向
する面とを貫通するものである。2つの対向する面は平
行ではなく、ある角度傾いているため、穴6aはそれぞ
れ平行ではあるが、長さが異なっている。そして、中継
部ブロック6の受熱部ブロック5との接合面と対向する
面には、穴6aと連通するように複数本の真直なヒート
パイプ7がそれぞれ直角にそして平行に接合される。ヒ
ートパイプ7には複数枚の放熱フィン8が取付けられて
いる。本実施例でも第1の実施例と同様に、中継部ブロ
ック6の受熱部ブロック5との接合面、ヒートパイプ7
との接合面が平面であるため、中継部ブロック6に設け
られる穴6aの間隔は受熱部ブロック5に設けられる穴
5aの間隔と同じ間隔にあければよく、又ヒートパイプ
7も中継部ブロック6に対して垂直に取付けることで、
各ヒートパイプ7は平行にすることができる。従って放
熱フィン8への各ヒートパイプ7の挿入作業も容易に行
うことができ、接合度合も均等に良くなるので冷却性能
を上昇させることができる。
Next, FIG. 3 is a perspective view of a heat pipe type cooler showing a second embodiment of the present invention. In this embodiment, the heat receiving block 1 and the heat pipe 3 of the first embodiment shown in FIGS. 1 and 2 are rotated by 90 degrees. The heat receiving part block 5 is provided with a hole 5a into which a refrigerant is put, and the relay part block 6 is joined thereto. The hole 6a provided in the relay block 6 and the hole 5a provided in the heat receiving block 5 communicate with each other. The hole 6a provided in the relay block 6 penetrates the joint surface with the heat receiving block 5 and the surface facing the surface. Since the two facing surfaces are not parallel and are inclined at an angle, the holes 6a are parallel, but have different lengths. Then, a plurality of straight heat pipes 7 are joined at right angles and in parallel to the surface of the relay block 6 facing the joint surface with the heat receiving block 5 so as to communicate with the holes 6a. A plurality of heat radiation fins 8 are attached to the heat pipe 7. Also in this embodiment, as in the first embodiment, the joint surface between the relay block 6 and the heat receiving block 5, the heat pipe 7
Since the joint surface with the flat surface is flat, the distance between the holes 6a provided in the relay block 6 should be the same as the distance between the holes 5a provided in the heat receiving block 5, and the heat pipe 7 should also be connected to the relay block 6. By installing vertically to
Each heat pipe 7 can be parallel. Therefore, the work of inserting the heat pipes 7 into the radiation fins 8 can be easily performed, and the degree of bonding is evenly improved, so that the cooling performance can be improved.

【0016】次に図4は請求項2記載の第1の実施例を
示す図で、図4(a)はヒートパイプ式冷却器の斜視
図、図4(b)は中継部ブロックの断面図である。半導
体素子が押圧される受熱部ブロック9に接合される中継
部ブロック10には、受熱部ブロック9に設けられ冷媒が
入れられる穴9aと連通する穴10aが設けられている。
中継部ブロック10の受熱部ブロック9との接合面と対抗
する面は平行ではなく、ある角度(本実施例では約80
度)傾いて形成され、ヒートパイプ11が中継部ブロック
10に設けられた穴10aと連通するように接合される。各
ヒートパイプ11は中継部ブロック10に対して垂直に接合
することで、それぞれが平行に配置される。そしてこれ
らヒートパイプ11を複数枚の放熱フィン12に挿入して圧
入方式や拡管方式によりヒートパイプ11と放熱フィン12
とは密着接合される。中継部ブロック10に設けられた複
数の穴10aは、それぞれが平行ではなく、対向する2面
10b,10c間を受熱部ブロック9に設けられた穴9aの
間隔から、広がるように貫通する穴となっている。つま
り受熱部ブロック9とは中継部ブロック10の接合面10b
が接合され、接合面10cにはヒートパイプ11が接合され
ることになる。従って複数本のヒートパイプ11の間隔は
受熱部ブロック9に設けられた穴9aの間隔よりも広く
なるため、放熱フィン12の中心に近い部分だけでなく全
体に渡ってヒートパイプ11を挿入することができる。又
放熱フィン12を大型化した場合でも中継部ブロック10に
設ける穴10aを接合面10cにおいて間隔をひろげて形成
することで、ヒートパイプ11の取付け間隔をひろげ、放
熱フィン12の効率を向上し、放熱性能の良好なヒートパ
イプ式冷却器を提供できる。更に真直な複数本のヒート
パイプ11を中継部ブロック10の接合面10cに接続するこ
とは図1乃至図3に示した実施例と同様に放熱フィン12
にヒートパイプ11を挿入して密着することは良好に行う
ことができる。
Next, FIG. 4 is a view showing a first embodiment according to claim 2, FIG. 4 (a) is a perspective view of a heat pipe type cooler, and FIG. 4 (b) is a sectional view of a relay block. Is. The relay section block 10 joined to the heat receiving section block 9 against which the semiconductor element is pressed is provided with a hole 10a communicating with the hole 9a provided in the heat receiving section block 9 and containing the refrigerant.
The surface of the relay block 10 that opposes the joint surface with the heat receiving block 9 is not parallel, but at a certain angle (about 80 in this embodiment).
The heat pipe 11 is formed with a tilt, and the heat pipe 11 is a relay block.
It is joined so as to communicate with the hole 10a formed in the hole 10. By joining the heat pipes 11 to the relay block 10 vertically, the heat pipes 11 are arranged in parallel. Then, these heat pipes 11 are inserted into a plurality of heat radiation fins 12 and the heat pipes 11 and the heat radiation fins 12 are formed by a press fitting method or a pipe expanding method.
And are closely joined. The plurality of holes 10a provided in the relay block 10 are not parallel to each other, but two surfaces facing each other.
The holes 10b and 10c are formed so as to extend from the space between the holes 9a provided in the heat receiving block 9 so as to expand. That is, the heat receiving part block 9 and the joint surface 10b of the relay part block 10
Are joined together, and the heat pipe 11 is joined to the joining surface 10c. Therefore, the intervals between the plurality of heat pipes 11 are wider than the intervals between the holes 9a provided in the heat receiving block 9, so that the heat pipes 11 should be inserted not only near the center of the radiating fins 12 but also over the whole. You can Further, even when the heat radiation fin 12 is enlarged, the holes 10a provided in the relay block 10 are formed with wide intervals on the joint surface 10c, thereby widening the attachment intervals of the heat pipes 11 and improving the efficiency of the heat radiation fins 12, It is possible to provide a heat pipe type cooler having excellent heat dissipation performance. Further, connecting a plurality of straight heat pipes 11 to the joint surface 10c of the relay block 10 is similar to that of the embodiment shown in FIGS.
It is possible to satisfactorily insert the heat pipe 11 into and to bring it into close contact.

【0017】次に図5は請求項2記載の第2の実施例を
示すヒートパイプ式冷却器の斜視図である。本実施例で
は受熱部ブロック13に設けられた穴13aが水平方向に向
くように配置され、中継部ブロック14が受熱部ブロック
13に接合される。中継部ブロック14に設けられる穴14a
は、接合面14bと接合面14c間を少し上向きの角度をも
たせて貫通する穴であるが、接合面14bにおいては穴の
位置間隔は受熱部ブロック13に設けられた穴13aの間隔
と同じで、接合面14cにおいてはその間隔が広がるよう
にあけられている。又この中継部ブロック14の接合面14
bと接合面14cとは、平行な面で形成されている。そし
て接合面14cには垂直にヒートパイプ15が接合され各ヒ
ートパイプ15は平行に配置される。これらヒートパイプ
15を複数枚の放熱フィン16に挿入して、圧入方式や拡管
方式によりヒートパイプ15と放熱フィン16とは密着接合
される。本実施例でも第1の実施例と同様に、受熱部ブ
ロック13に設けられた穴13aの間隔に限らず放熱フィン
16の大きさに合わせて中継部ブロック14の穴14aの間隔
を変えることで、ヒートパイプ15を放熱フィン16の全体
に渡って挿入することができ、放熱フィン16の効率を上
げることができる。
Next, FIG. 5 is a perspective view of a heat pipe type cooler showing a second embodiment of the present invention. In this embodiment, the holes 13a provided in the heat receiving block 13 are arranged so as to be oriented in the horizontal direction, and the relay block 14 is used as the heat receiving block.
Joined to 13. Hole 14a provided in the relay block 14
Is a hole that penetrates between the joint surface 14b and the joint surface 14c with a slight upward angle. However, in the joint surface 14b, the positional intervals of the holes are the same as the distance between the holes 13a provided in the heat receiving block 13. The joint surface 14c is opened so that the distance is widened. Also, the joint surface 14 of this relay block 14
b and the joint surface 14c are formed as parallel surfaces. The heat pipes 15 are vertically joined to the joint surface 14c, and the heat pipes 15 are arranged in parallel. These heat pipes
15 is inserted into a plurality of heat radiation fins 16, and the heat pipe 15 and the heat radiation fins 16 are closely joined by a press-fitting method or a pipe expanding method. Also in this embodiment, as in the first embodiment, the heat radiation fins are not limited to the intervals of the holes 13a provided in the heat receiving block 13.
By changing the distance between the holes 14a of the relay block 14 according to the size of the heat radiating fins 16, the heat pipes 15 can be inserted over the radiating fins 16 and the efficiency of the radiating fins 16 can be increased.

【0018】更に図1乃至図5に記載した各実施例にお
いて、中継部ブロックとヒートパイプ間に絶縁管を介し
て接続し、絶縁性の高い冷媒を封入することで絶縁形ヒ
ートパイプ式冷却器としてもよい。
Further, in each of the embodiments shown in FIGS. 1 to 5, an insulation type heat pipe cooler is provided by connecting a relay block and a heat pipe via an insulating pipe and enclosing a highly insulating refrigerant. May be

【0019】[0019]

【発明の効果】以上説明したように請求項1記載の発明
によれば、真直な複数本のヒートパイプを中継部ブロッ
クの1つの平面に全て垂直に取付けることで容易にヒー
トパイプどうしを平行に配置することができるので、取
付位置、ピッチの寸法精度を上げることができる。従っ
て放熱フィンにヒートパイプを挿入することを良好に行
え、密着度合も均等となり冷却性能を上げることができ
る。
As described above, according to the first aspect of the present invention, a plurality of straight heat pipes are mounted vertically on one plane of the relay block so that the heat pipes can be easily parallel to each other. Since they can be arranged, the dimensional accuracy of the mounting position and the pitch can be improved. Therefore, the heat pipe can be properly inserted into the heat radiation fin, and the degree of adhesion can be made uniform to improve the cooling performance.

【0020】更に請求項2記載の発明によれば、中継部
ブロックに設けられた穴によって複数本のヒートパイプ
の取付間隔を、放熱フィンにあわせた最適な間隔にでき
るので放熱フィンの効率を上げて放熱性能を向上するこ
とができる。
Further, according to the second aspect of the present invention, the holes provided in the relay block make it possible to set the mounting intervals of the plurality of heat pipes to the optimum intervals according to the radiation fins, so that the efficiency of the radiation fins is improved. The heat dissipation performance can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】請求項1記載の発明の第1の実施例を示すヒー
トパイプ式冷却器の斜視図である。
FIG. 1 is a perspective view of a heat pipe type cooler showing a first embodiment of the invention according to claim 1. FIG.

【図2】図1のA−A断面図である。FIG. 2 is a sectional view taken along line AA of FIG.

【図3】請求項1記載の発明の第2の実施例を示すヒー
トパイプ式冷却器の斜視図である。
FIG. 3 is a perspective view of a heat pipe cooler showing a second embodiment of the invention according to claim 1.

【図4】請求項2記載の発明の第1の実施例を示す図で
(a)はヒートパイプ式冷却器の斜視図で、(b)は中
継部ブロックの断面図である。
FIG. 4 is a diagram showing a first embodiment of the invention according to claim 2, (a) is a perspective view of a heat pipe type cooler, and (b) is a sectional view of a relay block.

【図5】請求項2記載の発明の第2の実施例を示すヒー
トパイプ式冷却器の斜視図である。
5 is a perspective view of a heat pipe type cooler showing a second embodiment of the invention according to claim 2. FIG.

【符号の説明】[Explanation of symbols]

1,5,9,13 受熱部ブロック 2,6,10,14 中継部ブロック 3,7,11,15 ヒートパイプ 4,8,12,16 放熱フィン 1,5,9,13 Heat receiving block 2,6,10,14 Relay block 3,7,11,15 Heat pipe 4,8,12,16 Radiating fin

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 冷媒液が注入される複数個の穴が1つの
面に所定の間隔毎に形成され、半導体素子が押圧される
受熱部ブロックと、 この受熱部ブロックと接合され、この接合面とこの接合
面に所定の角度傾いて対向する面との間に、前記受熱部
ブロックに形成される複数個の穴それぞれと連通する複
数個の貫通穴が形成される中継部ブロックと、 この中継部ブロックの前記受熱部ブロックとの接合面と
対向する面に垂直に取付けられ、前記中継部ブロックに
形成される複数個の貫通穴と連通する複数本のヒートパ
イプと、 これらヒートパイプにそれぞれ取付けられた複数枚の放
熱フィンとを有するヒートパイプ式冷却器。
1. A heat receiving portion block, in which a plurality of holes for injecting a refrigerant liquid are formed at a predetermined interval on one surface, and a semiconductor element is pressed, and the heat receiving portion block. A relay block having a plurality of through holes communicating with each of the plurality of holes formed in the heat receiving block, between the relay block and a surface facing the joint surface at a predetermined angle. A plurality of heat pipes that are vertically attached to a surface of the partial block that faces the joint surface with the heat receiving block and that communicate with a plurality of through holes formed in the relay block, and are attached to these heat pipes, respectively. Heat pipe type cooler having a plurality of heat radiation fins.
【請求項2】 冷媒液が注入される複数個の穴が1つの
面に所定の間隔毎に形成され、半導体素子が押圧される
受熱部ブロックと、 この受熱部ブロックと接合され、この接合面からこの接
合面と対向する面にかけて前記受熱部ブロックに形成さ
れる複数個の穴の間隔から広がって形成され、前記複数
個の穴それぞれと連通する複数個の貫通穴を有する中継
部ブロックと、 この中継部ブロックの前記受熱部ブロックとの接合面と
対向する面に垂直に取付けられ、前記中継部ブロックに
形成される複数個の貫通穴と連通する複数本のヒートパ
イプと、 これらヒートパイプにそれぞれ取付けられた複数枚の放
熱フィンとを有するヒートパイプ式冷却器。
2. A heat receiving portion block, in which a plurality of holes for injecting a refrigerant liquid are formed at a predetermined interval on one surface, and a semiconductor element is pressed, and the heat receiving portion block is joined to the heat receiving portion block. From the relay portion block having a plurality of through holes that are formed to spread from the interval of the plurality of holes formed in the heat receiving portion block from the surface facing the joining surface to the plurality of holes, respectively, A plurality of heat pipes that are vertically attached to the surface of the relay block that faces the joint surface with the heat receiving block and that communicate with a plurality of through holes formed in the relay block, and these heat pipes. A heat pipe cooler having a plurality of radiation fins attached to each.
JP5228737A 1993-09-14 1993-09-14 Heat pipe cooler Expired - Fee Related JP2996843B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5228737A JP2996843B2 (en) 1993-09-14 1993-09-14 Heat pipe cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5228737A JP2996843B2 (en) 1993-09-14 1993-09-14 Heat pipe cooler

Publications (2)

Publication Number Publication Date
JPH0786473A true JPH0786473A (en) 1995-03-31
JP2996843B2 JP2996843B2 (en) 2000-01-11

Family

ID=16881035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5228737A Expired - Fee Related JP2996843B2 (en) 1993-09-14 1993-09-14 Heat pipe cooler

Country Status (1)

Country Link
JP (1) JP2996843B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952612A1 (en) * 1998-04-23 1999-10-27 Ferraz Date Industries Heat exchanger, in particular for cooling an electronic power component, and its method for fabrication
JP2008130702A (en) * 2006-11-20 2008-06-05 Furukawa Electric Co Ltd:The Heat sink with joint
DE102004042154B4 (en) * 2004-08-31 2011-01-05 Asia Vital Components Co., Ltd. cooler
CN104142077A (en) * 2013-03-26 2014-11-12 通用电气能源能量变换技术有限公司 Heat pipe heat sink with heating unit
EP2784812A3 (en) * 2013-03-26 2015-04-29 GE Energy Power Conversion Technology Ltd Heat pipe sink for high power density
JP2017187214A (en) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 Cooling device, refrigerating cycle device, and method for manufacturing the cooling device
US20200227880A1 (en) * 2019-01-10 2020-07-16 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device

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FR3043764B1 (en) * 2015-11-16 2018-01-05 Airbus Defence And Space Sas THERMAL EXCHANGE DEVICE FOR ARTIFICIAL SATELLITE, WALL AND ASSEMBLY OF WALLS COMPRISING SUCH THERMAL EXCHANGE DEVICE

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0952612A1 (en) * 1998-04-23 1999-10-27 Ferraz Date Industries Heat exchanger, in particular for cooling an electronic power component, and its method for fabrication
FR2777986A1 (en) * 1998-04-23 1999-10-29 Ferraz HEAT EXCHANGER, IN PARTICULAR FOR COOLING AN ELECTRONIC POWER COMPONENT, AND METHOD FOR MANUFACTURING THEREOF
DE102004042154B4 (en) * 2004-08-31 2011-01-05 Asia Vital Components Co., Ltd. cooler
JP2008130702A (en) * 2006-11-20 2008-06-05 Furukawa Electric Co Ltd:The Heat sink with joint
CN104142077A (en) * 2013-03-26 2014-11-12 通用电气能源能量变换技术有限公司 Heat pipe heat sink with heating unit
EP2784812A3 (en) * 2013-03-26 2015-04-29 GE Energy Power Conversion Technology Ltd Heat pipe sink for high power density
JP2017187214A (en) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 Cooling device, refrigerating cycle device, and method for manufacturing the cooling device
WO2017175798A1 (en) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 Cooling device, refrigeration cycle device, and method for producing cooling device
US20200227880A1 (en) * 2019-01-10 2020-07-16 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11570411B2 (en) * 2019-01-10 2023-01-31 Hisense Laser Display Co., Ltd. Laser light source and laser projection device
US11592145B2 (en) 2019-01-10 2023-02-28 Hisense Laser Display Co., Ltd. Laser light source and laser projection device

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