JP2002151636A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JP2002151636A JP2002151636A JP2000342867A JP2000342867A JP2002151636A JP 2002151636 A JP2002151636 A JP 2002151636A JP 2000342867 A JP2000342867 A JP 2000342867A JP 2000342867 A JP2000342867 A JP 2000342867A JP 2002151636 A JP2002151636 A JP 2002151636A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- plate
- pipe
- heat sink
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体素子等の発
熱体から生じる熱を放熱するヒートシンクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for radiating heat generated from a heating element such as a semiconductor element.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】電子機
器に搭載される半導体素子等の発熱体の冷却には、従来
よりヒートシンクが使用されている。ヒートシンクの中
には、発熱体が取り付けられるベース板と、ベース板に
取り付けられるヒートパイプから主に構成されているも
のがある。ヒートパイプとは、パイプ内の密閉空間を真
空に引いた後に、水やブタン、アルコール等の作動流体
を封入したものである。発熱体が取り付けられたベース
板の部分は受熱部となり、発熱体から熱が伝えられる。
ベース板の受熱部に伝えられた熱は、ベース板からヒー
トパイプに伝えられ、ヒートパイプ内の作動流体を蒸発
させる。この蒸気はヒートパイプ内を移動して、受熱部
から離れた部分で放熱し、この部分が放熱部となる。放
熱に伴い蒸気は液体に戻る。この密閉空間内の作動流体
の相変化や移動により発熱体の熱が拡散する。放熱部に
は、フィン列等が設けられており、熱を有効に拡散させ
ている。2. Description of the Related Art A heat sink has conventionally been used for cooling a heating element such as a semiconductor element mounted on an electronic device. Some heat sinks mainly include a base plate to which a heating element is attached and a heat pipe attached to the base plate. The heat pipe is one in which a working fluid such as water, butane, or alcohol is sealed after a closed space in the pipe is evacuated. The portion of the base plate to which the heating element is attached becomes a heat receiving section, and heat is transmitted from the heating element.
The heat transmitted to the heat receiving portion of the base plate is transmitted from the base plate to the heat pipe, and evaporates the working fluid in the heat pipe. This vapor moves in the heat pipe and radiates heat at a portion away from the heat receiving portion, and this portion becomes a heat radiating portion. The vapor returns to liquid with the heat release. The heat of the heating element is diffused by the phase change and movement of the working fluid in the closed space. The heat dissipating portion is provided with a fin row and the like, and effectively diffuses heat.
【０００３】近年では、電子機器に搭載される部品の集
積度や搭載密度が高くなっているのに伴い、ヒートシン
クの小型化や熱輸送効率の向上が求められている。特
に、高い熱量を発する部品では、従来のヒートシンクを
使用した場合、ヒートシンクの姿勢（設置方向）によっ
ては、ヒートパイプ内の作動流体の相変化の循環が限界
に達し、受熱部の熱量が放熱部に移動せず、熱輸送能力
が著しく低下する場合がある。In recent years, as the degree of integration and the mounting density of components mounted on electronic equipment have increased, there has been a demand for smaller heat sinks and improved heat transport efficiency. In particular, when a conventional heat sink is used for a component that emits a large amount of heat, the circulation of the phase change of the working fluid in the heat pipe reaches a limit depending on the posture (installation direction) of the heat sink, and the amount of heat of the heat receiving unit is reduced to the heat radiating unit. And the heat transport ability may be significantly reduced.
【０００４】本発明は、上記の問題点に鑑みてなされた
ものであって、小型で、姿勢依存性がなく、高い熱輸送
能力をするヒートシンクを提供することを目的とする。[0004] The present invention has been made in view of the above problems, and has as its object to provide a heat sink which is small, has no attitude dependency, and has a high heat transport ability.
【０００５】[0005]
【課題を解決するための手段】上記の課題を解決するた
め、本発明のヒートシンクは、 発熱体が取り付けられ
るベース板と、 該ベース板に一部（受熱部）が接続さ
れており、他の一部（放熱部）が該ベース板から離れた
位置に延びるように構成されているプレート型ヒートパ
イプと、 該ヒートパイプの前記放熱部の表面に接続さ
れた放熱フィン列と、を具備するヒートシンクであっ
て； 前記プレート型ヒートパイプの受熱部が、１枚の
ヒートパイプを折り曲げて重ねた構造を有することを特
徴とする。受熱部を、ヒートパイプを重ねた構造とする
ことにより高い熱輸送能力を得ることができる。この構
造により、ヒートシンクの幅を広げる必要がなくなり小
型化できる。また、ヒートシンクの姿勢依存性も少なく
なる。In order to solve the above problems, a heat sink according to the present invention comprises a base plate to which a heating element is attached, a part (heat receiving portion) connected to the base plate, and another heat sink. A heat sink comprising: a plate-type heat pipe having a portion (a heat radiating portion) extending away from the base plate; and a heat radiating fin array connected to a surface of the heat radiating portion of the heat pipe. Wherein the heat receiving portion of the plate-type heat pipe has a structure in which one heat pipe is bent and stacked. A high heat transport capability can be obtained by forming the heat receiving portion with a structure in which heat pipes are stacked. With this structure, it is not necessary to increase the width of the heat sink, and the heat sink can be downsized. Also, the attitude dependency of the heat sink is reduced.
【０００６】本発明においては、 前記プレート型ヒー
トパイプの放熱部も重ね構造でありその両面に前記放熱
フィン列を設けることができる。こうすることにより、
放熱を促進し、熱輸送能力をさらに向上させることがで
きる。In the present invention, the heat radiating portion of the plate-type heat pipe also has a stacked structure, and the heat radiating fin rows can be provided on both surfaces thereof. By doing this,
Heat dissipation can be promoted, and the heat transport ability can be further improved.
【０００７】本発明においては、前記重ね構造を有する
プレート型ヒートパイプを、重ね接合後に受熱部と放熱
部の間で所定の角度に折り曲げることができる。こうす
ることにより、ヒートシンクを設置される空間の形状や
大きさに応じた形状にすることができる。[0007] In the present invention, the plate-type heat pipe having the overlapping structure can be bent at a predetermined angle between the heat receiving portion and the heat radiating portion after the overlap joining. By doing so, it is possible to make the shape according to the shape and size of the space in which the heat sink is installed.
【０００８】本発明においては、前記放熱部を、前記受
熱部から分岐して形成してもよい。または、前記放熱部
が、コルゲート状に折り曲げられたプレート型ヒートパ
イプを含むようにしてもよい。発熱部品の発熱量や、設
置される空間の形状や大きさに応じたヒートシンクを提
供することができる。In the present invention, the heat radiating portion may be formed so as to be branched from the heat receiving portion. Alternatively, the heat radiating section may include a plate-type heat pipe bent in a corrugated shape. It is possible to provide a heat sink according to the amount of heat generated by the heat generating component and the shape and size of the space in which the heat generating component is installed.
【０００９】[0009]
【発明の実施の形態】以下、図面を参照しつつ説明す
る。図１は、本発明の第１実施例に係るヒートシンクの
構造を示す図であり、（Ａ）は正面図、（Ｂ）は平面図
である。このヒートシンク１は、受熱板３と、同受熱板
３に熱的に接続されているプレート型ヒートパイプ５、
及び、同プレート型ヒートパイプ５に熱的に接続されて
いる放熱フィン列７から構成される。Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B are diagrams showing a structure of a heat sink according to a first embodiment of the present invention, wherein FIG. 1A is a front view and FIG. 1B is a plan view. The heat sink 1 includes a heat receiving plate 3, a plate-type heat pipe 5 thermally connected to the heat receiving plate 3,
And a radiating fin array 7 thermally connected to the plate-type heat pipe 5.
【００１０】受熱板３は熱伝導性の高いアルミニウム等
の金属で作製される。受熱板３には発熱部品９が、高熱
伝導性接着剤等を用いる熱伝導性の高い手段により固定
されている。発熱体９が取り付けられた受熱板３の部分
には発熱部品９から熱が伝えられる。The heat receiving plate 3 is made of a metal having high thermal conductivity such as aluminum. A heat generating component 9 is fixed to the heat receiving plate 3 by means of high thermal conductivity using a high thermal conductive adhesive or the like. Heat is transmitted from the heat generating component 9 to the heat receiving plate 3 to which the heat generating element 9 is attached.
【００１１】プレート型ヒートパイプ５は、蛇行細孔が
比較的薄い平板の中に作り込まれた蛇行細孔ヒートパイ
プ等が使用される。蛇行細孔ヒートパイプとは、以下の
特性を有するヒートパイプのことである（特開平４−１
９００９０号参照）。 （１）細孔の両端末が相互に流通自在に連結されて密閉
されている。 （２）細孔の一部は受熱部、他の部分は放熱部となって
いる。 （３）受熱部と放熱部が交互に配置されており、両部の
間を細孔が蛇行している。 （４）細孔内には２相凝縮性流体が封入されている。 （５）細孔の内壁は、上記作動流体が常に孔内を閉塞し
た状態のままで循環または移動することができる最大直
径以下の径をもつ。As the plate type heat pipe 5, a meandering pore heat pipe or the like in which the meandering pores are formed in a relatively thin flat plate is used. The meandering pore heat pipe is a heat pipe having the following characteristics (Japanese Unexamined Patent Publication No.
No. 90090). (1) Both ends of the pore are connected to each other so as to be freely circulated and are sealed. (2) Part of the pores serves as a heat receiving part, and the other part serves as a heat radiating part. (3) The heat receiving portions and the heat radiating portions are alternately arranged, and the pores meander between both portions. (4) A two-phase condensable fluid is sealed in the pores. (5) The inner wall of the pore has a diameter equal to or less than the maximum diameter at which the working fluid can circulate or move while always closing the hole.
【００１２】プレート型ヒートパイプ５は、１枚のプレ
ート型ヒートパイプを、細孔の長さ方向のほぼ中央で折
り返した２層重ね構造を有する。折り返し作業は、治具
を折り返される部分に当てて、プレス機によってプレー
ト型ヒートパイプを整形することによって行う。重なっ
た部分のプレート型ヒートパイプはろう付けで密着して
接合されている。折り返し部分は所定の径（この例では
８ｍｍ）を有するターン部５ａとなっている。なお、タ
ーン部５ａの端から接合部の端までの間隔は約２０ｍｍ
である。The plate-type heat pipe 5 has a two-layer structure in which one plate-type heat pipe is folded substantially at the center in the longitudinal direction of the pores. The folding operation is performed by applying a jig to the folded portion and shaping the plate-type heat pipe with a press machine. The overlapped plate-type heat pipes are closely joined by brazing. The folded portion is a turn portion 5a having a predetermined diameter (8 mm in this example). The distance from the end of the turn part 5a to the end of the joint part is about 20 mm
It is.
【００１３】プレート型ヒートパイプ５のターン部５ａ
付近の一面５ｂには、受熱板３がろう付けや高熱伝導性
接着剤等の方法で取り付けられており、この部分が受熱
部となる。また、反受熱板３側の面５ｃの受熱板３から
離れた部分には、放熱フィン列７がろう付けや高熱伝導
性接着剤等の方法で取り付けられており、この部分が放
熱部となる。放熱フィン列７は、熱伝導性の高いアルミ
ニウム等の金属をプレスにより折り曲げ加工したコルゲ
ート型フィンである。なお、放熱フィン列７は、プレー
ト型ヒートパイプ５の受熱板３が取り付けられている面
５ｂと同じ側の面に取り付けられてもよい。The turn portion 5a of the plate type heat pipe 5
The heat receiving plate 3 is attached to the nearby one surface 5b by a method such as brazing or a high heat conductive adhesive, and this portion serves as a heat receiving portion. A radiating fin array 7 is attached to a portion of the surface 5c on the side opposite to the heat receiving plate 3 away from the heat receiving plate 3 by a method such as brazing or a high thermal conductive adhesive, and this portion serves as a heat radiating portion. . The radiation fin row 7 is a corrugated fin formed by bending a metal such as aluminum having high thermal conductivity by pressing. The radiating fin row 7 may be attached to the same surface as the surface 5b of the plate-type heat pipe 5 to which the heat receiving plate 3 is attached.
【００１４】放熱フィン列７の右側のプレート型ヒート
パイプの端部は、この例においては、上層の端部が、下
層の端部より長い。この長い方の端部には、細孔内に作
動流体を封入するためのノズル１１が形成されている。
なお、この部分は、作動流体封入後のノズル１１を密閉
する作業に支障がなければ同じ長さでもよい。In this example, the end of the plate-type heat pipe on the right side of the radiating fin row 7 has the upper end longer than the lower end. At the longer end, a nozzle 11 for sealing the working fluid in the pore is formed.
This portion may have the same length as long as the operation for sealing the nozzle 11 after sealing the working fluid is not hindered.
【００１５】発熱部品９から受熱板３に伝わった熱は、
２層に重ねられたプレート型ヒートパイプ５の受熱部に
伝わる。また、受熱板３の貼られた図の下側のプレート
型ヒートパイプで蒸発した熱媒体が上側のプレート型ヒ
ートパイプに流れることにより、上側のプレート型ヒー
トパイプにも大量の熱が伝わる。プレート型ヒートパイ
プ５の受熱部に伝わった熱は、２層のプレート型ヒート
パイプ５を通って放熱フィン列７が設けられた部分へ輸
送されるため、プレート型ヒートパイプが１層の場合よ
りも熱輸送能力が向上する。熱は、放熱フィン列７が設
けられた部分で放熱する。The heat transmitted from the heat generating component 9 to the heat receiving plate 3 is
The heat is transmitted to the heat receiving portion of the plate-type heat pipe 5 stacked in two layers. In addition, a large amount of heat is transmitted to the upper plate-type heat pipe by flowing the heat medium evaporated in the lower plate-type heat pipe to which the heat receiving plate 3 is stuck to the upper plate-type heat pipe. Since the heat transmitted to the heat receiving portion of the plate-type heat pipe 5 is transported through the two-layer plate-type heat pipe 5 to the portion where the radiating fin row 7 is provided, the heat is more than when the plate-type heat pipe has one layer. Even heat transport capacity is improved. The heat is radiated at the portion where the radiating fin row 7 is provided.
【００１６】この例のヒートシンクを用いて、ヒートシ
ンクの姿勢依存性を試験した。ヒートシンクを水平状態
及び垂直状態として、発熱部品を取り付けて試験を行っ
た結果、いずれも良好な熱輸送性能を得た。Using the heat sink of this example, the attitude dependency of the heat sink was tested. Tests were performed with the heat sink in a horizontal state and a vertical state, and heat-generating components were attached. As a result, good heat transport performance was obtained in each case.
【００１７】図２は、本発明の第２実施例に係るヒート
シンクの構造を示す図であり、（Ａ）は正面図、（Ｂ）
は側面図である。この例のヒートシンク２１は、２層重
ね構造を有するプレート型ヒートパイプ２５の受熱部
（発熱体２９が固定された銃熱板２３が取り付けられた
部分）と放熱部（放熱フィン列２７が取り付けられた部
分）の間が、ほぼ直角に折り曲げられている。さらに、
放熱部には、両面に放熱フィン列３１が設けられてい
る。図中の符号３１はプレート型ヒートパイプに作動流
体を封入するためのノズルである。なお、このヒートシ
ンク２１を製造する際には、受熱部と放熱部間の曲げ部
にずれが生じて隙間が開き、ろう剤が流れるおそれがあ
るため、プレート型ヒートシンク２５を折り曲げて重ね
て接合した後に、曲げ加工を行うことが好ましい。FIGS. 2A and 2B are views showing the structure of a heat sink according to a second embodiment of the present invention, wherein FIG. 2A is a front view and FIG.
Is a side view. The heat sink 21 of this example has a heat receiving portion (a portion to which the gun heat plate 23 to which the heating element 29 is fixed) of the plate-type heat pipe 25 having a two-layer structure and a heat radiating portion (a radiating fin array 27). ) Are bent at substantially right angles. further,
The heat dissipating portion is provided with heat dissipating fin arrays 31 on both surfaces. Reference numeral 31 in the figure denotes a nozzle for sealing a working fluid into a plate-type heat pipe. When manufacturing the heat sink 21, the bent portion between the heat receiving portion and the heat radiating portion is shifted to open a gap, and the brazing agent may flow. It is preferable to perform bending later.
【００１８】このヒートシンク２１は、放熱部の両面に
放熱フィン列２７が設けられているため、特に放熱能力
が向上する。また、受熱部と放熱部の間を折り曲げるこ
とにより、設置される空間の形状や大きさに合わせてヒ
ートシンク２１を設置することができる。Since the heat sink 21 is provided with the heat radiating fin arrays 27 on both surfaces of the heat radiating portion, the heat radiating ability is particularly improved. In addition, by bending between the heat receiving portion and the heat radiating portion, the heat sink 21 can be installed according to the shape and size of the installed space.
【００１９】図３は、第３実施例に係るヒートシンクの
構造を示す正面図である。この例のヒートシンク４１
は、２層構造を有するプレート型ヒートパイプ４５が、
途中で分岐して互いに反対方向に折り曲げられている。
この例では、分岐した部分４５ａ、４５ｂは、受熱部に
直角方向に互いに反対方向に延びている。したがって、
分岐した部分は１層のプレート型ヒートパイプが同一面
上を延びる平面状になっている。この平面状の部分に
は、放熱フィン列４７や他のヒートシンクが取り付けら
れる。図中の符号４３は受熱板、符号４９は発熱部品で
ある。この例のヒートシンクは、発熱部品取り付け面に
対して放熱フィン列が離れて配置されている場合に、効
率良く放熱できるという利点がある。FIG. 3 is a front view showing the structure of the heat sink according to the third embodiment. Heat sink 41 of this example
Is a plate-type heat pipe 45 having a two-layer structure,
It branches off in the middle and is bent in opposite directions.
In this example, the branched portions 45a and 45b extend in directions opposite to each other in a direction perpendicular to the heat receiving portion. Therefore,
The branched portion has a plane shape in which a single-layer plate-type heat pipe extends on the same plane. A radiation fin row 47 and other heat sinks are attached to this planar portion. Reference numeral 43 in the figure denotes a heat receiving plate, and reference numeral 49 denotes a heat generating component. The heat sink of this example has an advantage that heat can be efficiently dissipated when the heat dissipating fin row is arranged away from the heat-generating component mounting surface.
【００２０】図４は、第４実施例に係るヒートシンクの
構造を示す斜視図である。この例のヒートシンク６１
は、２層重ね構造のプレート型ヒートパイプ６５の反受
熱板６３側の面６５ｃ（図の下層）のプレート型ヒート
パイプが、途中６５ｄから、面６５ｃに対してほぼ直角
に立ち上がってコルゲート状に折り曲げ加工されてい
る。コルゲート状に折り曲げられた部分６５ｅの一方の
湾曲部６５ｆは、受熱板６３側の面６５ｂ（図の上層）
に熱的に接合されている。また、コルゲート状に折り曲
げられた部分６５ｅの直線部６５ｇ間には、放熱フィン
列６７が両側のプレート型ヒートパイプに熱的に接続す
るように設けられている。図中の符号６９は発熱部品で
ある。この例のヒートシンクは、熱輸送部と放熱部を一
体化することによって接触抵抗を低減できるため、放熱
効率を向上できるという利点がある。FIG. 4 is a perspective view showing the structure of a heat sink according to a fourth embodiment. Heat sink 61 of this example
The plate-type heat pipe of the surface 65c (lower layer in the figure) on the side opposite to the heat receiving plate 63 of the plate-type heat pipe 65 having the two-layered structure rises from the middle 65d almost at right angles to the surface 65c to form a corrugated shape. It is bent. One of the curved portions 65f of the corrugated portion 65e is a surface 65b on the heat receiving plate 63 side (upper layer in the figure).
Is thermally bonded to Further, between the linear portions 65g of the corrugated portion 65e, a radiation fin row 67 is provided so as to be thermally connected to the plate-type heat pipes on both sides. Reference numeral 69 in the figure is a heat-generating component. The heat sink of this example has an advantage that the heat transfer efficiency can be improved because the contact resistance can be reduced by integrating the heat transport unit and the heat radiating unit.
【００２１】図５は、第４実施例に係るヒートシンクの
構造を示す斜視図である。この例のヒートシンク８１
は、２層重ね構造のプレート型ヒートパイプ８５の反受
熱板８３側の面８５ｃ（図の下層）のプレート型ヒート
パイプが、２層部の端８５ｄで面８５ｃに対してほぼ直
角に折り曲げられ、さらに面８５ｃ上に沿うようにコル
ゲート状に折り曲げ加工されている。コルゲート状に折
り曲げられた部分８５ｅの一方の湾曲部８５ｆは、反受
熱板８３側の面８５ｃに熱的に接合されている。また、
コルゲート状に折り曲げられた部分８５ｅの直線部８５
ｇ間には、放熱フィン列８７が両側のプレート型ヒート
パイプに熱的に接続するように設けられている。図中の
符号８９は発熱部品である。この例のヒートシンクも、
熱輸送部と放熱部を一体化することによって接触抵抗を
低減できるため、放熱効率を向上できるという利点があ
る。FIG. 5 is a perspective view showing the structure of the heat sink according to the fourth embodiment. Heat sink 81 of this example
The plate-type heat pipe of the surface 85c (lower layer in the figure) on the side opposite to the heat receiving plate 83 of the plate-type heat pipe 85 having a two-layered structure is bent almost perpendicularly to the surface 85c at the end 85d of the two-layer portion. , And are bent into a corrugated shape along the surface 85c. One curved portion 85f of the corrugated portion 85e is thermally joined to the surface 85c on the side opposite to the heat receiving plate 83. Also,
The straight portion 85 of the corrugated portion 85e
Between g, radiating fin rows 87 are provided so as to be thermally connected to the plate-type heat pipes on both sides. Reference numeral 89 in the drawing denotes a heat-generating component. The heat sink in this example also
Since the contact resistance can be reduced by integrating the heat transport section and the heat radiating section, there is an advantage that the heat radiating efficiency can be improved.
【００２２】[0022]
【発明の効果】以上の説明から明らかなように、本発明
によれば、プレート型ヒートパイプを折り曲げて２層構
造としたことにより、小型で、姿勢依存性がなく、高い
熱輸送能力を有するヒートシンクを提供できる。As is clear from the above description, according to the present invention, the plate-type heat pipe is bent to form a two-layer structure, so that it is small, has no attitude dependency, and has a high heat transport ability. A heat sink can be provided.
【図１】本発明の第１実施例に係るヒートシンクの構造
を示す図であり、（Ａ）は正面図、（Ｂ）は平面図であ
る。FIG. 1 is a view showing a structure of a heat sink according to a first embodiment of the present invention, wherein (A) is a front view and (B) is a plan view.
【図２】本発明の第２実施例に係るヒートシンクの構造
を示す図であり、（Ａ）は正面図、（Ｂ）は側面図であ
る。FIG. 2 is a view showing a structure of a heat sink according to a second embodiment of the present invention, wherein (A) is a front view and (B) is a side view.
【図３】第３実施例に係るヒートシンクの構造を示す正
面図である。FIG. 3 is a front view showing a structure of a heat sink according to a third embodiment.
【図４】第４実施例に係るヒートシンクの構造を示す斜
視図である。FIG. 4 is a perspective view illustrating a structure of a heat sink according to a fourth embodiment.
【図５】第４実施例に係るヒートシンクの構造を示す斜
視図である。FIG. 5 is a perspective view illustrating a structure of a heat sink according to a fourth embodiment.
１、２１、４１、６１、８１ ヒートシンク ３、２３、４３、６３、８３ 受熱板 ５、２５、４５、６５、８５ プレート型ヒートパイプ ７、２７、４７、６７、８７ 放熱フィン列 ９、２９、４９、６９、８９ 発熱部品 １１、３１ ノズル 1, 21, 41, 61, 81 Heat sinks 3, 23, 43, 63, 83 Heat receiving plates 5, 25, 45, 65, 85 Plate heat pipes 7, 27, 47, 67, 87 Radiation fin rows 9, 29, 49, 69, 89 Heating parts 11, 31 Nozzle
Claims (5)
部（放熱部）が該ベース板から離れた位置に延びるよう
に構成されているプレート型ヒートパイプと、 該ヒートパイプの前記放熱部の表面に接続された放熱フ
ィン列と、を具備するヒートシンクであって；前記プレ
ート型ヒートパイプの受熱部が、一枚のヒートパイプを
折り曲げて重ねた構造を有することを特徴とするヒート
シンク。1. A base plate to which a heating element is attached, a part (heat receiving part) connected to the base plate, and another part (heat radiating part) extending to a position away from the base plate. A heat sink comprising: a plate-type heat pipe configured; and a radiating fin row connected to a surface of the heat radiating portion of the heat pipe; A heat sink having a structure in which pipes are bent and stacked.
該受熱部から延びる放熱部を有するプレート型ヒートパ
イプと、 該ヒートパイプの前記放熱部の表面に接続された放熱フ
ィン列と、を具備するヒートシンクであって；前記プレ
ート型ヒートパイプの受熱部が、一枚のヒートパイプを
折り曲げて重ねた構造を有することを特徴とするヒート
シンク。2. A heat receiving unit to which a heating element is attached, and
A heat sink comprising: a plate-type heat pipe having a heat radiating portion extending from the heat receiving portion; and a radiating fin row connected to a surface of the heat radiating portion of the heat pipe; A heat sink having a structure in which one heat pipe is bent and stacked.
重ね構造であり、その両面に前記放熱フィン列が接続さ
れていることを特徴とする請求項１又は２記載のヒート
シンク。3. The heat sink according to claim 1, wherein the heat radiating portion of the plate-type heat pipe also has an overlapping structure, and the heat radiating fin rows are connected to both surfaces thereof.
形成されていることを特徴とする請求項１又は２記載の
ヒートシンク。4. The heat sink according to claim 1, wherein the heat radiating portion is formed so as to branch off from the heat receiving portion.
られたプレート型ヒートパイプを含むことを特徴とする
請求項１又は２記載のヒートシンク。5. The heat sink according to claim 1, wherein the heat radiating portion includes a plate-type heat pipe bent in a corrugated shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000342867A JP2002151636A (en) | 2000-11-10 | 2000-11-10 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000342867A JP2002151636A (en) | 2000-11-10 | 2000-11-10 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002151636A true JP2002151636A (en) | 2002-05-24 |
Family
ID=18817335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000342867A Pending JP2002151636A (en) | 2000-11-10 | 2000-11-10 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002151636A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2393328A (en) * | 2002-09-17 | 2004-03-24 | Hewlett Packard Development Co | Heat sink with angled heat pipe |
| US6894900B2 (en) | 2002-09-17 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe and base fins |
| US7140422B2 (en) | 2002-09-17 | 2006-11-28 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe in direct contact with component |
| US7561426B2 (en) | 2005-04-12 | 2009-07-14 | Samsung Sdi Co., Ltd. | Display module |
| JP2012084907A (en) | 2005-07-08 | 2012-04-26 | Fuji Electric Co Ltd | Cooling apparatus for power module |
| CN102984916A (en) * | 2011-09-07 | 2013-03-20 | 技嘉科技股份有限公司 | Circulating type radiator |
| JP2015015353A (en) * | 2013-07-04 | 2015-01-22 | 株式会社神戸製鋼所 | Heat sink for cooling electric element |
| WO2016036867A1 (en) * | 2014-09-02 | 2016-03-10 | Aavid Thermalloy, Llc | Evaporator and condenser section structure for thermosiphon |
| WO2016044052A3 (en) * | 2014-09-15 | 2016-08-04 | Aavid Thermalloy, Llc | Thermosiphon with bent tube section |
| JP2020173662A (en) * | 2019-04-11 | 2020-10-22 | レノボ・シンガポール・プライベート・リミテッド | Portable information device with cover |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2393328A (en) * | 2002-09-17 | 2004-03-24 | Hewlett Packard Development Co | Heat sink with angled heat pipe |
| US6894900B2 (en) | 2002-09-17 | 2005-05-17 | Hewlett-Packard Development Company, L.P. | Heat sink with heat pipe and base fins |
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| JP2012084907A (en) | 2005-07-08 | 2012-04-26 | Fuji Electric Co Ltd | Cooling apparatus for power module |
| CN102984916A (en) * | 2011-09-07 | 2013-03-20 | 技嘉科技股份有限公司 | Circulating type radiator |
| JP2015015353A (en) * | 2013-07-04 | 2015-01-22 | 株式会社神戸製鋼所 | Heat sink for cooling electric element |
| WO2016036867A1 (en) * | 2014-09-02 | 2016-03-10 | Aavid Thermalloy, Llc | Evaporator and condenser section structure for thermosiphon |
| WO2016044052A3 (en) * | 2014-09-15 | 2016-08-04 | Aavid Thermalloy, Llc | Thermosiphon with bent tube section |
| US10655920B2 (en) | 2014-09-15 | 2020-05-19 | Aavid Thermalloy, Llc | Thermosiphon with bent tube section |
| JP2020173662A (en) * | 2019-04-11 | 2020-10-22 | レノボ・シンガポール・プライベート・リミテッド | Portable information device with cover |
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