JPH077783B2 - 電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置 - Google Patents

電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置

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Publication number
JPH077783B2
JPH077783B2 JP63063201A JP6320188A JPH077783B2 JP H077783 B2 JPH077783 B2 JP H077783B2 JP 63063201 A JP63063201 A JP 63063201A JP 6320188 A JP6320188 A JP 6320188A JP H077783 B2 JPH077783 B2 JP H077783B2
Authority
JP
Japan
Prior art keywords
copper
electrode
metal
semiconductor device
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63063201A
Other languages
English (en)
Other versions
JPH01238032A (ja
Inventor
義男 清水
正治 小谷
正次 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63063201A priority Critical patent/JPH077783B2/ja
Priority to US07/322,488 priority patent/US5235212A/en
Publication of JPH01238032A publication Critical patent/JPH01238032A/ja
Publication of JPH077783B2 publication Critical patent/JPH077783B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は銅もしくは銅合金製金属細線を電気的接続部に
配置する半導体装置に係わり、特にこの接続部の品質安
定化を図って信頼性を向上するものである。
（従来の技術） 半導体装置の製造は半導体基板に回路もしくはデバイス
等の機能素子を造込む前処理工程と、この半導体基板を
リードフレーム等に組立てる組立工程に大別される。
この組立工程としてはリードフレームを利用する方式が
集積回路及び個別半導体素子を問わず利用され主流とな
っている。
一方、量産技術の進歩によって集積度が飛躍的に向上し
た半導体素子では、各種の工程を自動化して最もゴミが
出易いマニュアル操作を除去する対策を施しており、組
立工程等では複数の工程に必要な製造装置を組合わせた
一体機も利用している。
この組合工程は多種工程により構成されるが、本発明に
関係するボンデイング即ち熱圧着技術とこれに引続いて
実施する樹脂封止技術について第２図により簡単に説明
する。
リードフレームとしては色々のタイプが利用されている
が、集積回路等のように多ピンタイプではほぼ直方体に
形成した中空の金属製枠体の複数個を連続して形成し、
単位体を構成する各枠体を起点とし求心方向に向う複数
のリード端子を形成するのが一般的である。第２図に示
すようにこのリード端子（図示せず）の一端には径大な
ベッド部50を設置し、常法により半導体素子を造込んだ
半導体素子51を公知のマウンターによってマウントす
る。
ところでこの半導体基板51に造込んだ半導体素子では機
能素子を構成する不純物領域に隣接して形成する電極52
と、他のリード端子間に金属細線53を張架して電気的な
接続を図るが、これにいわゆるボンデイング即ち熱圧着
法を利用する。
この熱圧着法には超音波熱圧着ボンデイング法が専ら適
用されており、しかも金細線が一般的に利用されてい
る。しかし、経済的な観点からアルミニュウム細線も品
種によっては採用されており、更に銅もしくは銅合金も
半導体基板に形成する電極の構成材料であるアルミニュ
ウムもしくはアルミニュウム合金、銅もしくは銅合金間
にボンダビリティ（Bondability）が存在する事実を基
に開発が進められている。
ところで、苛酷な価格競争にさらされている半導体素子
ではご多分に漏れず、安価でしかも優れた特性を発揮す
る製品が求められており、高価な金細線に代えて銅もし
くは銅合金を適用する気運が高まっている。
前述のようにリードフレームを利用する組立工程では引
続いて実施する樹脂封止工程における溶融樹脂の流れに
対する配慮からも一定の高さを持つループからなる金属
細線53が超音波を利用する熱圧着法により形成される。
前述の熱圧着工程を施す電極材料には純Al,Al−Si,Al−
Cu/Al−Si−Cu,Al−Si−Cuが通常使用するが、構成する
金属の種類及びその形成条件等によりその硬度は変化す
るのに対して規格化されていないのが実状である。
超音波熱圧着法によりループを持った金属細線53を形成
する方法の１つには、いわゆる素子上ボンデイングが知
られている。即ち機能素子を構成するために形成する不
純物領域に隣接して形成する電極に金属細線を熱圧着す
る手法であり、歪みやクラックが電極に生じる頻度が大
きいのであまり実施されていない。
これに対して第２図に明らかなように半導体基板51表面
に被覆した絶縁物層54に開口を設置し、ここに形成する
電極52に接続した配線層55を半導体基板の端部付近の絶
縁物層表面まで延長して終端とし、ここにいわゆるボン
デイングパッドを形成する方法が通常である。従ってこ
の方法ではこの絶縁物層54が熱圧着時のバッファ層とし
ての機能を果たすことになる。しかもこの熱圧着ボンデ
イングはいわゆる第１図ボンデイング（First Bondin
g）であり、テイルレス・ボンデイング（Taile less Bo
nding）とは相違する。
（発明が解決しようとする課題） 前述のように超音波を利用する熱圧着法に適用する金属
細線には、銅もしくは銅合金を主成分とした材料が検討
から実用化段階に入っているが、金細線に比較して硬度
が大きいため熱圧着時には荷重ならびに超音波出力を大
きくする必要がある。
このために金属細線が熱圧着される電極に隣接して配置
する絶縁物層にこの荷重が加わって歪みやマイクロクラ
ック（亀裂）が生じる頻度が大きくなり、半導体素子も
しくは半導体装置の信頼性が損なう恐れがある。
この対策としてはイ．金属電極の厚さを大きくする。
ロ．金属電極の硬度を増す。ハ．金属細線の純度を上げ
ることによってその硬度を下げる等が提案されている。
しかし、いずれも完全と言えず、金細線を超音波熱圧着
する条件に比べて狭い条件（荷重、超音波出力等）の下
で熱圧着せざるを得ないのが実状である。
本発明は上記欠点を除去する新規な銅もしくは銅合金製
金属細線を接続部とした半導体装置を提供し、特に熱圧
着時の制約条件を解放しかつ半導体素子の特性劣化を防
止してその信頼性を向上するものである。
〔発明の構成〕
（課題を解決するための手段） この目的を達成するのに本発明では半導体基板にヌープ
硬度40以上の金属で構成して設置する電極に近接して緩
衝層を配置し、この電極金属に銅もしくは銅合金からな
る金属細線を熱圧着して固定する手法を採用する。
（作用） この発明の背景としては、半導体基板表面に形成する絶
縁物層と電極の間に緩衝層を設置すると、この電極を構
成する金属の硬度により絶縁物層へのダメージの発生率
が変化する事実に立脚している。
即ち、金属電極に隣接して硬くて緻密な緩衝層を設置す
るとダメージが発生し難くなるが熱圧着条件範囲を広げ
ていくと特定の条件範囲からこの緩衝層と絶縁物層にダ
メージが発生する。この金属電極のヌープ硬度を変化さ
せて40以上になると非常に苛酷な熱圧着条件でもダメー
ジは発生しなくなるとの、新規な知見を基に本発明は完
成したものである。この緩衝層としては銅もしくは銅合
金からなる金属細線より硬くかつ半導体素子として悪影
響を与えない材料として窒化けい素と金属バナジュウム
が選定されるが、この緩衝層の設置位置としては、不純
物領域に隣接して形成する電極に連続して、あるいは両
者間に他の材料で構成する絶縁物層に隣接して設置して
も差支えない。
と言うのは、この電極に連続して形成する絶縁物層にた
とえクラックが発生しても緩衝層が保護層として機能す
るためである。
以下にボンディング条件／電極硬度／緩衝層材料／ダメ
ージ発生率の関係を第１表として示す。
この表から明らかなように電極用金属の硬度を大きくす
るだけでも効果はあるが、これに緩衝層を付加すると完
全になることが示されている。なお電極用金属の硬度を
大きくするには合金を利用する等の手段がある。
なお電極用金属のヌープ硬度を40以上としたのはこの数
値より小さく形成すると、緩衝層を設置しても絶縁物層
に亀裂（マイクロクラック）が発生する事実を基に限定
する根拠とするものである。
（実施例） 本発明に係わり、封止工程前の半導体素子の要部を示す
第１図により実施例を詳細に説明するが、従来技術と重
複する記載があるものの新しい番号を付けて記述する。
集積回路素子用として多ピン用リードフレームとしてい
わゆるDIP型もしくは混合型を利用するがその概略を示
すと、ほぼ直方体に形成した中空の金属製枠体の複数を
連続させてリードフレームを構成し、この単位体となる
各金属製枠体を起点とする求心方向にリード端子を形成
する。この中の一本に設置する径大なベッド部１には半
導体基板２を常法に従ってマウント後、半導体基板２に
形成した電極３にボールボンディング技術による超音波
熱圧着工程を施す。
この半導体基板２はシリコンからなりその表面には公知
の熱酸化法により絶縁物層４を被覆するが、図には示し
ていないが半導体基板２の所定の位置には不純物を導入
してPN接合を形成する領域等を設置して機能素子として
稼働可能な状態とするのは勿論である。
この不純物領域には常法通りAl,Al−Si,Al−Cu/Al−Si
−Cu,Al−Si−Cuの中の一種類で構成する電極３を隣接
して設置し、更に同種類の材料からなる配線層６を半導
体基板１端部に積層して配置する絶縁物層４表面まで延
長する。
この配線層６の端部にはいわゆるボンディング・パッド
を約100μｍスクエア（Square）厚さ約１〜2.5μｍに形
成し、更に複数個を設置する場合は間隔を最低80μｍ程
度に維持し、ここに熱圧着工程により銅もしくは銅合金
からなる金属細線７を接続するが、本発明では便宜上電
極３に熱圧着工程を実施するように記載する。
ボンディング・パッド即ち電極３と絶縁物層４の中間に
は銅もしくは銅合金からなる金属細線７より硬度が大き
い緩衝層８として窒化けい素層あるいは金属バナジュウ
ム層を形成する。
この窒化けい素層は化学量論比が正確なSi3N4だけで構
成する例の他に、多少化学量論比が多少ずれたもの、更
にはオキシ塩であるSiONも適用可能である。
この緩衝層８は前述のように電極３に隣接連続して形成
する例だけでなく、絶縁物層４に窒化けい素層や金属バ
ナジュウム層を設置後他の絶縁物層を積層しここに電極
５を形成する例も適用可能である。この例は窒化けい素
層を多層配線の層間絶縁膜として利用する場合である。
一方、電極３に適用する材料は前述のようにAlもしくは
Al合金であり、前述のようにスパッタリング法もしくは
真空蒸着法により所定の位置は堆積するのに、堆積用基
板温度を上げたり、合金を利用してヌープ硬度を40以上
とする。
ところで電極３と金属細線７間を電気的に接続す超音波
熱圧着工程は前述のように不活性雰囲気下における超音
波を利用するボール・ボンディング法を適用しており、
更に銅もしくは銅合金からなる金属細線７は電気トーチ
によりボールを形成する手法を採用した。
このような熱圧着法を施した半導体素子にはその頂面の
ファイナル・パッシベーション（Final Passivation）
層９を被覆後、トランスファモールド法による樹脂封止
工程を施して半導体装置を完成する。
〔発明の効果〕
以上説明したように金細線に代えて銅もしくは銅合金製
金属細線を熱圧着用に適用してコストダウンを図ってお
り、更にこの軟質金属細線を熱圧着する電極のヌープ硬
度は特定の数値に保持し、しかもこの電極に対向する位
置により緻密で硬い緩衝層を配置したので、半導体基板
表面を被覆する絶縁物層での亀裂発生を防止できたの
で、完成した半導体装置の信頼性を向上するものであ
る。より詳しく説明すると、硬い電極及びこの電極に対
向する位置に緩衝層を配置することにより、この熱圧着
条件は従来より広範囲とすることができるので絶縁物層
等における微小な亀裂が生じる頻度を著しく減少するこ
とができる。
本発明では不純物領域に隣接しかつ連続して形成する電
極、正確にはボンディング・パッドの硬度は前述の特定
値に維持しているので、熱圧着工程時における加圧によ
りその金属が飛出す現象が防止できる２次的な効果も発
揮される。
【図面の簡単な説明】
第１図は本発明に係わる半導体素子の概略を示す断面
図、第２図は従来の半導体素子の主要部を示す断面図で
ある。

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】半導体基板にヌープ硬度40以上の金属で構
    成して設置する電極に対向するこの半導体基板との中間
    に緩衝層を配置し、この電極用金属に銅もしくは銅合金
    からなる金属細線を熱圧着して固定することを特徴とす
    る電気的接続部に銅もしくは銅合金製金属細線を配置す
    る半導体装置。
JP63063201A 1988-03-18 1988-03-18 電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置 Expired - Lifetime JPH077783B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP63063201A JPH077783B2 (ja) 1988-03-18 1988-03-18 電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置
US07/322,488 US5235212A (en) 1988-03-18 1989-03-13 Semiconductor device having a mechanical buffer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63063201A JPH077783B2 (ja) 1988-03-18 1988-03-18 電気的接続部に銅もしくは銅合金製金属細線を配置する半導体装置

Publications (2)

Publication Number Publication Date
JPH01238032A JPH01238032A (ja) 1989-09-22
JPH077783B2 true JPH077783B2 (ja) 1995-01-30

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Country Status (2)

Country Link
US (1) US5235212A (ja)
JP (1) JPH077783B2 (ja)

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