JPH0767005B2 - Composite circuit board - Google Patents
Composite circuit boardInfo
- Publication number
- JPH0767005B2 JPH0767005B2 JP62071563A JP7156387A JPH0767005B2 JP H0767005 B2 JPH0767005 B2 JP H0767005B2 JP 62071563 A JP62071563 A JP 62071563A JP 7156387 A JP7156387 A JP 7156387A JP H0767005 B2 JPH0767005 B2 JP H0767005B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- circuit
- circuit conductor
- conductor
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 本発明は、信号用の微小電流が流れる回路導体と電力用
の大電流が流れる回路導体とを備えた複合回路基板に関
するものである。Description: TECHNICAL FIELD The present invention relates to a composite circuit board including a circuit conductor through which a minute current for signal flows and a circuit conductor through which a large current for power flows.
従来から絶縁基板の片面に信号用の回路導体を、他面に
電力用の回路基体を形成した複合回路基板は公知であ
る。従来のこの種の複合回路基板は一般に、絶縁基板の
片面に信号回路用の薄い銅箔を張り付け、他面に電力回
路用の厚い銅箔を張り付けて、各々をパターンエッチン
グすることにより形成されている。しかしこのような回
路基板では、銅箔の厚さがエッチング可能な厚さに制限
されるため、大電流が流れる電力回路の場合、電流容量
を大きするためには導体幅を大きくしなければならず、
回路をコンパクトに構成することが困難である。Conventionally, a composite circuit board in which a circuit conductor for signals is formed on one surface of an insulating substrate and a circuit substrate for power is formed on the other surface is known. A conventional composite circuit board of this type is generally formed by sticking a thin copper foil for a signal circuit on one side of an insulating board and a thick copper foil for a power circuit on the other side and pattern-etching each. There is. However, in such a circuit board, the thickness of the copper foil is limited to a thickness that can be etched. Therefore, in the case of a power circuit in which a large current flows, the conductor width must be increased in order to increase the current capacity. No
It is difficult to make the circuit compact.
また電力用の回路導体にスルーホールを形成する場合に
は、通常の信号用回路導体の場合と同様、絶縁基板に形
成した穴の内面に無電界メッキにより導体層を形成する
ことになるが、このようなスルーホールでは導体層の厚
さを厚くすることが困難であるため、大電流を通電する
できない。When forming a through hole in the power circuit conductor, a conductor layer is formed by electroless plating on the inner surface of the hole formed in the insulating substrate, as in the case of a normal signal circuit conductor. Since it is difficult to increase the thickness of the conductor layer in such a through hole, a large current cannot be passed.
本発明は、上記のような従来技術の問題点を解決した複
合回路基板を提供するもので、その構成は、絶縁基板面
に信号用の回路導体と電力用の回路導体とを設けた複合
回路基板において、上記信号用の回路導体は絶縁基板に
張り付けられた銅箔をパターンエッチングすることによ
り形成され、上記電力用の回路導体は、導電性金属板を
所要のパターンに打抜き加工し、かつ絶縁基板への固定
部と固定部の間が絶縁基板面から浮き上がるように曲げ
加工したものを上記固定部において絶縁基板に固定する
ことにより形成されており、かつ上記電力用回路導体の
スルーホール部は上記固定部から絞り出された筒形突起
を上記絶縁基板の穴に挿通することにより形成されてい
ることを特徴とするものである。The present invention provides a composite circuit board that solves the problems of the prior art as described above, and has a configuration in which a signal circuit conductor and a power circuit conductor are provided on an insulating substrate surface. In the substrate, the signal circuit conductor is formed by pattern etching a copper foil attached to an insulating substrate, and the power circuit conductor is formed by punching a conductive metal plate into a desired pattern and insulating it. It is formed by fixing what is bent so that the space between the fixed part to the board and the fixed part floats from the surface of the insulating board, and is fixed to the insulating board at the fixed part, and the through hole part of the power circuit conductor is It is characterized in that it is formed by inserting a cylindrical protrusion squeezed out from the fixing portion into a hole of the insulating substrate.
この複合回路基板では、導電性金属板を打ち抜いたもの
を電力用の回路導体としているので、その厚さを自由に
選択でき、大電流用の回路導体をコンパクトに形成でき
る。またその回路導体の一部を筒形に絞り出すことによ
り形成した筒形突起をスルーホール部の導体としている
ので、導体肉厚の厚いスルーホール部が得られ、電流容
量を十分大きくとることが可能である。さらに導電性金
属板から打ち抜いた厚肉の回路導体は、剛性が大きいた
め全面を絶縁基板に固定してしまうと、絶縁基板との熱
膨張係数の差により複合回路基板全体に反りを生じさせ
ることになるが、本発明では電力用の回路導体を、絶縁
基板への固定部と固定部の間が絶縁基板面から浮き上が
るように曲げ加工することにより、回路導体の撓みで熱
膨張を吸収できるようにしている。In this composite circuit board, a punched conductive metal plate is used as the circuit conductor for electric power, so that the thickness can be freely selected and the circuit conductor for large current can be formed compactly. Also, since the cylindrical projection formed by squeezing out part of the circuit conductor into a cylindrical shape is used as the conductor of the through-hole portion, a thick through-hole portion with a thick conductor thickness can be obtained and a sufficient current capacity can be obtained. Is. Furthermore, since the thick circuit conductor punched out from the conductive metal plate has a large rigidity, if the entire surface is fixed to the insulating substrate, the entire composite circuit board may be warped due to the difference in thermal expansion coefficient from the insulating substrate. However, according to the present invention, the circuit conductor for electric power is bent so that the space between the fixed portion to the insulating substrate and the fixed portion is lifted from the surface of the insulating substrate, so that the thermal expansion can be absorbed by the bending of the circuit conductor. I have to.
以下、本発明の実施例を図面を参照して詳細に説明す
る。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図ないし第４図は本発明の一実施例に係る複合回路
基板を示すもので、１はガラスエポキシ等からなる絶縁
基板、2A・2Bはその両面に設けられた信号用の回路導
体、３はその片面に設けられた電力用の回路導体であ
る。1 to 4 show a composite circuit board according to an embodiment of the present invention, in which 1 is an insulating substrate made of glass epoxy or the like, 2A and 2B are circuit conductors for signals provided on both surfaces thereof, 3 is a circuit conductor for electric power provided on one side thereof.
信号用の回路導体2A・2Bは従来同様、絶縁基板１の両面
に張り付けた例えば厚さ35μｍ程度の銅箔をそれぞ所要
のパターンにエッチングすることにより形成されてお
り、また両面の回路導体2A・2Bを導通させるスルーホー
ル部４も穴の内面メッキにより形成されている。The circuit conductors 2A and 2B for signals are formed by etching copper foils having a thickness of, for example, about 35 μm, which are adhered to both surfaces of the insulating substrate 1 in the same manner as in the conventional case, and the circuit conductors 2A on both surfaces are also formed. -The through hole part 4 for conducting 2B is also formed by plating the inner surface of the hole.
一方、電力用の回路導体３は、例えば厚さ1mm程度の銅
板または銅合金板を所要のパターンに打抜き加工し、か
つ第２図および第３図のように絶縁基板１への固定部５
以外は絶縁基板面から浮き上がるように曲げ加工し、さ
らに必要に応じ全面に半田メッキまたは錫メッキを施し
たものから成っている。On the other hand, the circuit conductor 3 for electric power is obtained by punching a copper plate or a copper alloy plate having a thickness of about 1 mm into a required pattern, and fixing the fixed portion 5 to the insulating substrate 1 as shown in FIGS. 2 and 3.
Other than the above, it is made by bending so that it floats above the surface of the insulating substrate, and if necessary, solder plating or tin plating is applied to the entire surface.
また電力用の回路導体３の固定部５にはスルーホール部
６が設けられている。このスルーホール部６は、固定部
５をいわゆるバーリング加工により筒形に絞り出して筒
形突起７を形成し、その筒形突起７を絶縁基板１の穴に
挿通することにより形成されている（第２図、第３図参
照）。筒形突起７の先端は、絶縁基板１の裏面に通信用
の回路導体2Bと共に形成されたランド部８に半田付けさ
れている。９はその半田付け部である。電力用の回路導
体３の固定部５はこの半田付けにより絶縁基板１に固定
されている。A through hole portion 6 is provided in the fixed portion 5 of the circuit conductor 3 for electric power. The through-hole portion 6 is formed by squeezing the fixing portion 5 into a cylindrical shape by so-called burring to form a cylindrical projection 7, and inserting the cylindrical projection 7 into a hole of the insulating substrate 1 (first). (See FIGS. 2 and 3). The tip of the cylindrical protrusion 7 is soldered to a land portion 8 formed on the back surface of the insulating substrate 1 together with the circuit conductor 2B for communication. 9 is the soldering part. The fixed portion 5 of the circuit conductor 3 for electric power is fixed to the insulating substrate 1 by this soldering.
上記スルーホール部６には例えばサイリスタ、パワート
ランジスタあるいは整流器などの端子部が接続される。
また前述の信号用の回路導体2A・2Bは例えばサイリスタ
やパワートランジスタの制御信号を流すのに使用され
る。A terminal portion such as a thyristor, a power transistor or a rectifier is connected to the through hole portion 6.
The above-mentioned signal circuit conductors 2A and 2B are used to flow control signals for thyristors and power transistors, for example.
なお、回路導体３の固定部５は、絶縁基板１に接着によ
り固定してもよいし、第５図に示すように筒形突起７の
先端を機械的にかしめることにより固定するようにして
もよい。The fixing portion 5 of the circuit conductor 3 may be fixed to the insulating substrate 1 by adhesion, or may be fixed by mechanically caulking the tip of the cylindrical protrusion 7 as shown in FIG. Good.
以上説明したように本発明に係る複合回路基板において
は、電力用の回路導体が導電性金属板を打抜き加工した
ものから成っているので、その厚さを十分厚くすること
ができ、しかも電力用回路導体のスルーホール部もメッ
キではなくその回路導体から絞り出した筒形突起により
形成されているので、スルーホール部の導体肉厚も十分
厚くすることができる。したがって従来より電力用回路
導体の電流容量が格段に大きくでき、しかもコンパクト
な複合回路基板を構成できる。また電力用の回路導体は
絶縁基板への固定部と固定部の間が絶縁基板面から浮き
上がるように曲げ加工されているので、通電により発熱
した場合でも熱膨張を浮き上がり部の撓みで吸収できる
と共に、放熱性も良好になるという利点がある。As described above, in the composite circuit board according to the present invention, since the circuit conductor for electric power is formed by punching the conductive metal plate, the thickness can be made sufficiently thick, Since the through hole portion of the circuit conductor is not formed by plating but is formed by the cylindrical projection squeezed out from the circuit conductor, the conductor wall thickness of the through hole portion can be made sufficiently thick. Therefore, the current capacity of the power circuit conductor can be remarkably increased as compared with the conventional one, and a compact composite circuit board can be constructed. Further, since the circuit conductor for electric power is bent so that the space between the fixed part to the insulating substrate floats from the surface of the insulating substrate, even if heat is generated by energization, thermal expansion can be absorbed by the bending of the floating part. There is an advantage that the heat dissipation is also good.
第１図は本発明の一実施例に係る複合回路基板の要部を
示す平面図、第２図および第３図は第１図のII−II線お
よびIII−III線における断面図、第４図は同回路基板の
底面図、第５図は本発明の複合回路基板における電力用
回路導体を絶縁基板に固定する部分の他の例を示す断面
図である。 １〜絶縁基板、2A・2B〜信号用の回路導体、３〜電力用
の回路導体、５〜固定部、６〜スルーホール部、７〜筒
形突起。FIG. 1 is a plan view showing an essential part of a composite circuit board according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views taken along lines II-II and III-III of FIG. FIG. 5 is a bottom view of the circuit board, and FIG. 5 is a cross-sectional view showing another example of the portion for fixing the power circuit conductor to the insulating board in the composite circuit board of the present invention. 1-insulating substrate, 2A / 2B-circuit conductor for signals, 3-circuit conductor for power, 5-fixing portion, 6-through hole portion, 7-cylindrical protrusion.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭55−77882（ＪＰ，Ｕ) 特公 昭59−24557（ＪＰ，Ｂ２) 実公 昭58−1928（ＪＰ，Ｙ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Bibliographic references Sho 55-77882 (JP, U) Special public account 59-24557 (JP, B2) Actual public Sho 58-1928 (JP, Y2)
Claims (1)
回路導体とを設けた複数回路基板において、上記信号用
の回路基板は絶縁基板に張り付けられた銅箔をパターン
エッチングすることにより形成され、上記電力用の回路
導体は、導電性金属板を所要のパターンに打抜き加工
し、かつ絶縁基板への固定部と固定部の間が絶縁基板面
から浮き上がるように曲げ加工したものを上記固定部に
おいて絶縁基板に固定することにより形成されており、
かつ上記電力用回路導体のスルーホール部は上記固定部
から絞り出された筒形突起を上記絶縁基板の穴に挿通す
ることにより形成されていることを特徴とする複数回路
基板。1. A plurality of circuit boards in which a circuit conductor for signals and a circuit conductor for power are provided on an insulating substrate surface, wherein the signal circuit substrate is formed by pattern etching a copper foil attached to the insulating substrate. The power circuit conductor is formed by punching a conductive metal plate into a desired pattern and bending it so that a space between the fixed portion and the fixed portion of the insulating substrate rises from the insulating substrate surface. It is formed by fixing to the insulating substrate at the fixing part,
A plurality of circuit boards, wherein the through-hole portion of the power circuit conductor is formed by inserting a cylindrical protrusion squeezed out from the fixing portion into a hole of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62071563A JPH0767005B2 (en) | 1987-03-27 | 1987-03-27 | Composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62071563A JPH0767005B2 (en) | 1987-03-27 | 1987-03-27 | Composite circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8153831A Division JP2813576B2 (en) | 1996-06-14 | 1996-06-14 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63239894A JPS63239894A (en) | 1988-10-05 |
| JPH0767005B2 true JPH0767005B2 (en) | 1995-07-19 |
Family
ID=13464305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62071563A Expired - Lifetime JPH0767005B2 (en) | 1987-03-27 | 1987-03-27 | Composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767005B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2813576B2 (en) * | 1996-06-14 | 1998-10-22 | 古河電気工業株式会社 | Circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54140259U (en) * | 1978-03-22 | 1979-09-28 | ||
| JPS5577882U (en) * | 1978-11-22 | 1980-05-29 | ||
| JPS60257191A (en) * | 1984-06-02 | 1985-12-18 | 株式会社日立製作所 | Printed circuit board |
-
1987
- 1987-03-27 JP JP62071563A patent/JPH0767005B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63239894A (en) | 1988-10-05 |
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|---|---|---|---|
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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