JPH0751801Y2 - Photo coupler - Google Patents
Photo couplerInfo
- Publication number
- JPH0751801Y2 JPH0751801Y2 JP1987113049U JP11304987U JPH0751801Y2 JP H0751801 Y2 JPH0751801 Y2 JP H0751801Y2 JP 1987113049 U JP1987113049 U JP 1987113049U JP 11304987 U JP11304987 U JP 11304987U JP H0751801 Y2 JPH0751801 Y2 JP H0751801Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- light emitting
- emitting element
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は混成集積回路等の回路基板上に発光素子と受光
素子とを配置したホトカプラに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a photocoupler in which a light emitting element and a light receiving element are arranged on a circuit board such as a hybrid integrated circuit.
［従来の技術］ 従来のホトカプラは、例えば特公昭57−46225号公報に
開示されているように、一対のリードの一方に発光素子
を配置し、他方に受光素子を配置し、発光素子と受光素
子とを光透過性樹脂で覆い、更に封止体で覆うことによ
って構成されている。[Prior Art] A conventional photocoupler has a light emitting element arranged on one of a pair of leads and a light receiving element on the other, as disclosed in, for example, Japanese Patent Publication No. 57-46225. The device and the element are covered with a light-transmissive resin, and further covered with a sealing body.
［考案が解決しようとする問題点］ しかし、従来はホトカプラを個別部品として形成し、こ
れを回路基板に取付けているので、回路装置の低コスト
化及び小型化が困難であった。[Problems to be Solved by the Invention] However, conventionally, since the photocoupler is formed as an individual component and attached to the circuit board, it is difficult to reduce the cost and size of the circuit device.
この問題を解決するために本件出願人は、第６図及び第
７図に示すように回路基板上に直接にホトカプラを構成
することを試みた。第６図及び第７図のホトカプラを説
明すると、絶縁性の回路基板１上に、第１の配線導体
２、第２の配線導体３、第３の配線導体４及び第４の配
線導体５が印刷により形成されている。第１の配線導体
２上には発光素子６の一方の電極が電気的に且つ機械的
に固着されており、第２の配線導体３上には受光素子７
の一方の電極が電気的に且つ機械的に固着されている。
又、発光素子６及び受光素子７の他方の電極はそれぞれ
の内部リード細線８を介し第３の配線導体４及び第４の
配線導体５に電気的に接続されている。発光素子６と受
光素子７はそれぞれ共通の光透過性（透明性）樹脂から
成る光結合用樹脂９にて被覆されており、この光結合用
樹脂９を囲むように白色ラバーから成る反射性材料10更
に外光遮断材料である黒色樹脂11が被覆されている。な
お、発光素子６と受光素子７との主なる光伝達路は、第
７図に示す如く発光素子６から放射された光が光結合用
樹脂９と反射性材料10との界面で反射し受光素子７に達
する経路である。In order to solve this problem, the present applicant has attempted to construct a photocoupler directly on the circuit board as shown in FIGS. 6 and 7. Explaining the photocoupler of FIGS. 6 and 7, the first wiring conductor 2, the second wiring conductor 3, the third wiring conductor 4, and the fourth wiring conductor 5 are provided on the insulating circuit board 1. It is formed by printing. One electrode of the light emitting element 6 is electrically and mechanically fixed onto the first wiring conductor 2, and the light receiving element 7 is provided on the second wiring conductor 3.
One electrode is electrically and mechanically fixed.
The other electrodes of the light emitting element 6 and the light receiving element 7 are electrically connected to the third wiring conductor 4 and the fourth wiring conductor 5 via the respective inner lead thin wires 8. The light emitting element 6 and the light receiving element 7 are respectively covered with a common light-transmitting (transparent) resin 9 for optical coupling, and a reflective material made of white rubber so as to surround the resin 9 for optical coupling. Further, a black resin 11 which is an external light shielding material is coated. The main light transmission path between the light emitting element 6 and the light receiving element 7 is that the light emitted from the light emitting element 6 is reflected at the interface between the optical coupling resin 9 and the reflective material 10 as shown in FIG. It is a route to reach the element 7.
第７図のホトカプラにおいて、発光素子６と受光素子７
との沿面距離即ち配線導体２、３間の沿面距離は回路基
板１と光結合用樹脂９との界面に沿っての最短距離であ
る。ここで例えば発光素子６と受光素子７間の沿面距離
を西ドイツのVDE規格を満足するように8mm以上にする
と、発光素子６と受光素子７との間隔が大きくなりすぎ
て光結合効率が小さくなり、ホトカプラとしての十分な
機能が得られなくなる。なお、発光素子６をGaAs赤外発
光ダイオード、受光素子７をシリコンホトトランジスタ
とし、発光ダイオードの順方向電流値IFを10mAとしたと
きの素子間隔と光結合効率及び受光素子７の出力電流IP
との関係は第５図で示す通りである。In the photocoupler of FIG. 7, the light emitting element 6 and the light receiving element 7
And the creepage distance between the wiring conductors 2 and 3 is the shortest distance along the interface between the circuit board 1 and the optical coupling resin 9. Here, for example, if the creepage distance between the light emitting element 6 and the light receiving element 7 is set to 8 mm or more so as to satisfy the VDE standard of West Germany, the distance between the light emitting element 6 and the light receiving element 7 becomes too large, and the optical coupling efficiency decreases. , A sufficient function as a photo coupler cannot be obtained. Incidentally, the light-emitting element 6 GaAs infrared-emitting diode, the light receiving element 7 is a silicon phototransistor, the output current I of the element spacing and the light coupling efficiency and the light receiving element 7 when the forward current value I F of the light-emitting diode was 10mA P
The relationship with is as shown in FIG.
そこで、本考案の目的は光結合効率を低下させることな
く素子間の沿面距離を増大させて絶縁耐圧を向上させる
ことができる回路基板使用のホトカプラを提供すること
にある。Therefore, an object of the present invention is to provide a photocoupler using a circuit board, which can increase the creepage distance between elements and improve the dielectric strength without lowering the optical coupling efficiency.
［問題点を解決するための手段］ 上記目的を達成するための本考案は、実施例を示す図面
の符号を参照して説明すると、単一の絶縁性回路基板21
と、前記回路基板21上にそれぞれ形成され且つ端部が互
いに離間して対向するように配置されている第１及び第
２の配線導体22、23と、前記第１の配線導体22の端部又
はこの近傍に接続された発光素子26と、前記第２の配線
導体23の端部又はこの近傍に接続された受光素子27と、
前記第１の配線導体22の端部と前記第２の配線導体23の
端部との間を含むように前記回路基板21に設けられ、且
つ前記発光素子26と前記受光素子27とを結ぶ直線に直交
する方向における長さが前記第１及び第２の配線導体2
2、23の端部の前記直交する方向の長さよりも長くなる
ように形成された導孔孔32と、前記発光素子26と前記受
光素子27を被覆すると共に前記貫通孔32を充填するよう
に設けられた光結合用樹脂29とを有していることを特徴
とするホトカプラに係わるものである。[Means for Solving the Problems] The present invention for achieving the above object will be described with reference to the reference numerals of the drawings showing an embodiment.
And first and second wiring conductors 22 and 23 which are respectively formed on the circuit board 21 and whose end portions are spaced apart from each other and face each other, and an end portion of the first wiring conductor 22. Or a light emitting element 26 connected in the vicinity thereof, and a light receiving element 27 connected in the end portion of the second wiring conductor 23 or in the vicinity thereof,
A straight line connecting the light emitting element 26 and the light receiving element 27, which is provided on the circuit board 21 so as to include between the end portion of the first wiring conductor 22 and the end portion of the second wiring conductor 23. The length in the direction orthogonal to the first and second wiring conductors 2
In order to fill the through hole 32 while covering the light emitting element 26 and the light receiving element 27, and the conducting hole 32 formed so as to be longer than the length of the end portions of 2, 23 in the orthogonal direction. The present invention relates to a photocoupler characterized in that it has an optical coupling resin 29 provided.
［作用］ 上記考案において、回路基板21は、第１及び第２の配線
導体22、23、発光素子26、受光素子27及び光結合用樹脂
29の共通の支持体として機能する。また、回路基板21を
混成集積回路の回路基板として使用することができる。
貫通孔32は、第１及び第２の配線導体22、23の間に配設
され且つこれ等の端部の長さよりも長く形成されている
ので、沿面距離の増大に寄与する。[Operation] In the above invention, the circuit board 21 includes the first and second wiring conductors 22 and 23, the light emitting element 26, the light receiving element 27, and the optical coupling resin.
Serves as a common support for 29. Further, the circuit board 21 can be used as a circuit board of the hybrid integrated circuit.
Since the through hole 32 is disposed between the first and second wiring conductors 22 and 23 and is formed longer than the length of these end portions, it contributes to the increase of the creepage distance.
［実施例］ 次に、本考案の実施例に係わる混成集積回路におけるホ
トカプラを第１図及び第２図に基づいて説明する。[Embodiment] Next, a photocoupler in a hybrid integrated circuit according to an embodiment of the present invention will be described with reference to FIGS.
混成集積回路の絶縁回路基板21の上に、第１の配線導体
22、第２の配線導体23、第３の配線導体24及び第４の配
線導体25が印刷により形成されている。第１の配線導体
22上にはGaAs赤外発光ダイオードから成る発光素子26の
一方の電極が電気的に且つ機械的に固着されており、第
２の配線導体23上にはシリコンホトトランジスタから成
る受光素子27の一方の電極が電気的に且つ機械的に固着
されている。又、発光素子26及び受光素子27の他方の電
極はそれぞれの内部リード細線28を介し第３の配線導体
24及び第４の配線導体25に電気的に接続されている。On the insulating circuit board 21 of the hybrid integrated circuit, the first wiring conductor
The second wiring conductor 23, the second wiring conductor 23, the third wiring conductor 24, and the fourth wiring conductor 25 are formed by printing. First wiring conductor
One electrode of a light emitting element 26 made of a GaAs infrared light emitting diode is electrically and mechanically fixed on 22 and one electrode of a light receiving element 27 made of a silicon phototransistor on the second wiring conductor 23. Electrodes are fixed electrically and mechanically. The other electrodes of the light emitting element 26 and the light receiving element 27 are connected to the third wiring conductor via the respective inner lead thin wires 28.
It is electrically connected to 24 and the fourth wiring conductor 25.
発光素子26と受光素子27はそれぞれ共通の光透過性（透
明性）樹脂から成る光結合用樹脂29にて被覆されてお
り、この光結合用樹脂29を囲むように白色ラバーから成
る反射性材料30更に外光遮断材料である黒色樹脂31が被
覆されている。The light emitting element 26 and the light receiving element 27 are respectively covered with a common light transmissive (transparent) resin 29 for optical coupling, and a reflective material made of white rubber so as to surround the resin 29 for optical coupling. Further, a black resin 31 which is an external light shielding material is coated.
回路基板21の一方の主面から他方の主面に貫通するよう
に設けられた貫通孔32は本考案に従うものであり、発光
素子26と受光素子27との間の領域に位置する幅Ｗの幅狭
部分32aと、これに連続する一対の楕円形状の幅広部分3
2b、32cとから成り、全体として鼓状に形成されてい
る。発光素子26と受光素子27とを結ぶ直線に直交する方
向における貫通孔32の長さは、第１及び第２の配線導体
22、23の端部の幅よりも大きい。The through hole 32 provided so as to penetrate from one main surface of the circuit board 21 to the other main surface is in accordance with the present invention, and has a width W located in a region between the light emitting element 26 and the light receiving element 27. The narrow portion 32a and a pair of elliptical wide portions 3 that are continuous with the narrow portion 32a
It consists of 2b and 32c, and is shaped like a drum as a whole. The length of the through hole 32 in the direction orthogonal to the straight line connecting the light emitting element 26 and the light receiving element 27 is determined by the first and second wiring conductors.
Greater than the width of the edges of 22,23.
絶縁性を有する光結合用樹脂29は貫通孔32の中にも充填
され、回路基板21の裏面にも被着されている。第２図か
ら明らかな如く裏面側においても光結合用樹脂29は反射
性材料30及び黒色樹脂31によって被覆されている。第１
図で点線で示されている光結合用樹脂29、反射性材料30
及び黒色樹脂31は貫通孔32の全部をカバーするように設
けられている。The insulating optical coupling resin 29 is also filled in the through holes 32, and is also adhered to the back surface of the circuit board 21. As is apparent from FIG. 2, the optical coupling resin 29 is covered with the reflective material 30 and the black resin 31 on the back surface side as well. First
Optical coupling resin 29 and reflective material 30 shown by dotted lines in the figure
The black resin 31 is provided so as to cover the entire through hole 32.
なお、第３及び第４の配線導体24、25の先端のワイヤボ
ンディング部分は第１及び第２の配線導体22、23に食い
込むような状態に形成されている。The wire bonding portions at the tips of the third and fourth wiring conductors 24 and 25 are formed so as to bite into the first and second wiring conductors 22 and 23.
本実施例は次の利点を有する。This embodiment has the following advantages.
（１）発光素子26と受光素子27との沿面距離、及び第１
及び第３の配線導体22、24と第２及び第４の配線導体2
3、25との沿面距離を増大させることができる。即ち、
この実施例における発光素子26又は第１の配線導体22と
受光素子27又は第２の配線導体23との沿面距離は、回路
基板21の表面に沿う経路と光結合用樹脂29の表面に沿う
経路との内の短い方である。第６図及び第７図の比較例
においては第１及び第２の配線導体２、３を直線で結ぶ
回路基板１の表面距離Ｌが沿面距離となり、この値は小
さいが、本実施例では貫通孔32を設けたので、回路基板
21の表面に沿う経路は第７図の距離Ｌよりも大幅に長
い。また、回路基板21の裏面側に突出する光結合用樹脂
29の表面距離は第７図の沿面距離Ｌに比べて回路基板21
の厚さｔの少なくとも２倍は増大している。(1) Creepage distance between the light emitting element 26 and the light receiving element 27, and the first
And third wiring conductors 22 and 24 and second and fourth wiring conductors 2
The creepage distance with 3, 25 can be increased. That is,
The creepage distance between the light emitting element 26 or the first wiring conductor 22 and the light receiving element 27 or the second wiring conductor 23 in this embodiment is the path along the surface of the circuit board 21 and the path along the surface of the optical coupling resin 29. And the shorter one. In the comparative example of FIGS. 6 and 7, the surface distance L of the circuit board 1 that connects the first and second wiring conductors 2 and 3 with a straight line is the creepage distance, which is small, but in the present embodiment, Since the holes 32 are provided, the circuit board
The path along the surface of 21 is significantly longer than the distance L in FIG. In addition, a resin for optical coupling protruding to the back side of the circuit board 21.
The surface distance of 29 is larger than that of the creepage distance L of FIG.
Is increased by at least twice the thickness t.
（２）発光素子26と受光素子27との相互間の距離を増大
させないで、沿面距離を増大させることがきるるので、
高い光結合効率を維持することができる。即ち、VDE規
格（沿面距離8mm以上）を満足させながら、実用可能な
光学的特性を有する混成集積回路のホトカプラを提供す
ることができる。(2) Since the creepage distance can be increased without increasing the distance between the light emitting element 26 and the light receiving element 27,
High optical coupling efficiency can be maintained. That is, it is possible to provide a photocoupler for a hybrid integrated circuit which has practical optical characteristics while satisfying the VDE standard (creeping distance of 8 mm or more).
（３）貫通孔32の形状を鼓状としたので、発光素子26と
受光素子27との相互間隔を狭く保った状態で沿面距離を
増大させることができる。即ち、ホトカプラの占有面積
の増大を抑制して沿面距離を増大させることができる。(3) Since the shape of the through hole 32 is drum-shaped, the creepage distance can be increased while keeping the mutual distance between the light emitting element 26 and the light receiving element 27 small. That is, the creepage distance can be increased by suppressing an increase in the occupied area of the photocoupler.
（４）第１及び第２の配線導体22、23に幅狭部を設け、
ここに第３及び第４の配線導体24、25の先端部を配置し
たので、貫通孔32の幅広部分32bを有効に設けることが
できる。これにより、第１及び第３の配線導体22、24と
第２及び第４の配線導体23、25との回路基板21の表面に
沿っての沿面距離を増大できる。また、所定の沿面距離
を得るための貫通孔32の占有面積が小さくでき、ホトカ
プラの占有面積の増大を抑制することができる。(4) The narrow portions are provided in the first and second wiring conductors 22 and 23,
Since the tips of the third and fourth wiring conductors 24, 25 are arranged here, the wide portion 32b of the through hole 32 can be effectively provided. Thereby, the creeping distance between the first and third wiring conductors 22 and 24 and the second and fourth wiring conductors 23 and 25 along the surface of the circuit board 21 can be increased. Further, the occupied area of the through hole 32 for obtaining the predetermined creepage distance can be reduced, and the increase of the occupied area of the photocoupler can be suppressed.
（５）光結合用樹脂29が貫通孔32の中に充填されるの
で、回路基板21に対する光結合用樹脂29の固着の安定性
及び強度を向上させることができる。(5) Since the through hole 32 is filled with the optical coupling resin 29, the stability and strength of the fixation of the optical coupling resin 29 to the circuit board 21 can be improved.
（６）回路基板21を混成集積回路の基板とすることがで
きるので、混成集積回路の小型化及び低コスト化が可能
になる。(6) Since the circuit board 21 can be used as a substrate for the hybrid integrated circuit, the hybrid integrated circuit can be downsized and the cost can be reduced.
次に、本考案の別の実施例を示す第３図を説明する。但
し、第３図において符号21〜32で示すものは第１図及び
第２図で同一符号で示すものと実質的に同一であるの
で、その説明を省略する。この実施例では回路基板21の
端面21aに沿って発光素子26と受光素子27とが配置さ
れ、端面21aから切込みを入れた状態の貫通孔32が形成
されている。即ち、貫通孔32の一部が端面21aにて開放
されている。端面21aの外側は無限の大きさの孔と等価
であるので、第１図に示す鼓状貫通孔32の下側の幅広部
分32cに相当する部分を第３図の貫通孔32に設ける必要
がない。第３図において、光結合用樹脂29は貫通孔32に
充填され、回路基板21の裏面側にも至っていると共に、
端面21aにも被着されている。Next, FIG. 3 showing another embodiment of the present invention will be described. However, the reference numerals 21 to 32 in FIG. 3 are substantially the same as the reference numerals in FIGS. 1 and 2, and therefore the description thereof is omitted. In this embodiment, the light emitting element 26 and the light receiving element 27 are arranged along the end surface 21a of the circuit board 21, and a through hole 32 is formed in a state where a cut is made from the end surface 21a. That is, a part of the through hole 32 is open at the end surface 21a. Since the outside of the end face 21a is equivalent to a hole of infinite size, it is necessary to provide a portion corresponding to the wide portion 32c below the drum-shaped through hole 32 shown in FIG. 1 in the through hole 32 of FIG. Absent. In FIG. 3, the optical coupling resin 29 is filled in the through hole 32 and reaches the back surface side of the circuit board 21.
It is also attached to the end face 21a.
第３図の実施例は第１図及び第２図の実施例と同一の利
点を有する他に、次の利点も有する。In addition to having the same advantages as the embodiment of FIGS. 1 and 2, the embodiment of FIG. 3 has the following advantages.
（１）第１図の幅広部分32cに相当する部分を設ける必
要がない分だけ回路基板21の占有面積が小さくなり、小
型化が可能になる。(1) Since the area corresponding to the wide portion 32c in FIG. 1 does not need to be provided, the area occupied by the circuit board 21 is reduced and the size can be reduced.
（２）貫通孔32が端面21aで開放されているので、容易
に作製することができる。(2) Since the through hole 32 is open at the end face 21a, it can be easily manufactured.
（３）貫通孔32、発光素子26及び発光素子27が回路基板
21の端面21aに隣接しているので、光結合用樹脂29等を
容易に塗布することができる。(3) The through hole 32, the light emitting element 26, and the light emitting element 27 are circuit boards.
Since it is adjacent to the end face 21a of 21, the optical coupling resin 29 and the like can be easily applied.
［変形例］ 本考案は上述の実施例に限定されるものでなく、例えば
次の変形が可能なものである。[Modification] The present invention is not limited to the above-described embodiments, and the following modifications are possible, for example.
（１）第４図に示す如く回路基板21の裏面側にも表面側
と同程度に光結合用樹脂29を塗布してもよい。(1) As shown in FIG. 4, the optical coupling resin 29 may be applied to the back side of the circuit board 21 to the same extent as the front side.
（２）発光素子26の発光面と受光素子27の受光面とを対
向させてもよい。(2) The light emitting surface of the light emitting element 26 and the light receiving surface of the light receiving element 27 may be opposed to each other.
（３）光結合用樹脂29は光透過性樹脂に光散乱剤を多量
に混入させて白濁させたものでもよい。(3) The light-coupling resin 29 may be a light-transmitting resin mixed with a large amount of a light-scattering agent so that it becomes cloudy.
［考案の効果］ 上述から明らかなように本考案は次の効果を有する。[Effects of the Invention] As is apparent from the above, the present invention has the following effects.
（イ）回路基板に設けた貫通孔によって第１及び第２の
配線導体の端部の相互間即ち発光素子と受光素子との間
の沿面距離を増大させ、これ等の間の絶縁耐圧を向上さ
せることができる。(A) The through hole provided in the circuit board increases the creepage distance between the ends of the first and second wiring conductors, that is, between the light emitting element and the light receiving element, and improves the withstand voltage between them. Can be made.
（ロ）第１及び第２の配線導体の端部の相互間即ち発光
素子と受光素子の相互間の距離が小さくても所望の沿面
距離を得ることが可能になるので、発光素子と受光素子
の間隔を小さくして光結合効率を高めることができる。(B) Since the desired creepage distance can be obtained even if the distance between the end portions of the first and second wiring conductors, that is, the distance between the light emitting element and the light receiving element is small, the light emitting element and the light receiving element can be obtained. The optical coupling efficiency can be increased by reducing the distance between the two.
（ハ）回路基板上に発光素子及び受光素子を配置し、こ
れ等を光結合用樹脂で覆ってホトカプラを構成するの
で、回路基板を混成集積回路の回路基板と共用すること
が可能になり、混成集積回路の低コスト化及び小型化が
可能になる。(C) Since the light emitting element and the light receiving element are arranged on the circuit board and these are covered with the optical coupling resin to form the photocoupler, the circuit board can be shared with the circuit board of the hybrid integrated circuit. It is possible to reduce the cost and size of the hybrid integrated circuit.
第１図は本考案の実施例に係わる混成集積回路のホトカ
プラを示す平面図、 第２図は第１図のホトカプラのII−II線に相当する部分
の断面図、 第３図は本考案の別の実施例に係わるホトカプラを示す
平面図、 第４図は変形例のホトカプラを示す断面図、 第５図はホトカプラにおける素子間隔と光結合効率及び
受光素子の電流との関係を示す特性図、 第６図は比較例のホトカプラを示す平面図、 第７図は第６図のVII−VII線に相当する部分を示す断面
図である。 21…回路基板、22、23、24、25…配線導体、26…発光素
子、27…受光素子、29…光結合用樹脂、32…貫通孔。FIG. 1 is a plan view showing a photocoupler of a hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is a sectional view of a portion corresponding to line II--II of the photocoupler of FIG. 1, and FIG. FIG. 4 is a plan view showing a photocoupler according to another embodiment, FIG. 4 is a sectional view showing a photocoupler of a modified example, and FIG. 5 is a characteristic diagram showing the relationship between the element spacing in the photocoupler, the optical coupling efficiency, and the current of the light receiving element. FIG. 6 is a plan view showing a photocoupler of a comparative example, and FIG. 7 is a sectional view showing a portion corresponding to line VII-VII in FIG. 21 ... Circuit board, 22, 23, 24, 25 ... Wiring conductor, 26 ... Light emitting element, 27 ... Light receiving element, 29 ... Optical coupling resin, 32 ... Through hole.
Claims (2)
いに離間して対向するように配置されている第１及び第
２の配線導体（22）（23）と、 前記第１の配線導体（22）の端部又はこの近傍に接続さ
れた発光素子（26）と、 前記第２の配線導体（23）の端部又はこの近傍に接続さ
れた受光素子（27）と、 前記第１の配線導体（22）の端部と前記第２の配線導体
（23）の端部との間を含むように前記回路基板（21）に
設けられ、且つ前記発光素子（26）と前記受光素子（2
7）とを結ぶ直線に直交する方向における長さが前記第
１及び第２の配線導体（22）（23）の端部の前記直交す
る方向の長さよりも長くなるように形成された貫通孔
（32）と、 前記発光素子（26）と前記受光素子（27）を被覆すると
共に前記貫通孔（32）を充填するように設けられた光結
合用樹脂（29）と を有していることを特徴とするホトカプラ。1. A single insulating circuit board (21), and first and second insulating circuit boards (21) formed on the circuit board (21) and arranged so that their end portions are spaced apart from each other and face each other. Wiring conductors (22) and (23), an end portion of the first wiring conductor (22) or a light emitting element (26) connected to the vicinity thereof, an end portion of the second wiring conductor (23) or this The light receiving element (27) connected in the vicinity, and the circuit board (21) so as to include between the end portion of the first wiring conductor (22) and the end portion of the second wiring conductor (23). And the light emitting element (26) and the light receiving element (2
7) A through-hole formed so that the length in the direction orthogonal to the straight line connecting with 7) is longer than the length in the orthogonal direction of the end portions of the first and second wiring conductors (22) (23). (32) and an optical coupling resin (29) provided so as to cover the light emitting element (26) and the light receiving element (27) and fill the through hole (32). Is a photo coupler.
設けられた切込み状の孔である実用新案登録請求の範囲
第１項記載のホトカプラ。2. The photocoupler according to claim 1, wherein the through hole (32) is a notched hole provided in the circuit board (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113049U JPH0751801Y2 (en) | 1987-07-23 | 1987-07-23 | Photo coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113049U JPH0751801Y2 (en) | 1987-07-23 | 1987-07-23 | Photo coupler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6418765U JPS6418765U (en) | 1989-01-30 |
| JPH0751801Y2 true JPH0751801Y2 (en) | 1995-11-22 |
Family
ID=31352542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987113049U Expired - Lifetime JPH0751801Y2 (en) | 1987-07-23 | 1987-07-23 | Photo coupler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751801Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5746225A (en) * | 1980-09-01 | 1982-03-16 | Amada Eng & Service | Method and device for cooling condensing lens in laser machining apparatus |
-
1987
- 1987-07-23 JP JP1987113049U patent/JPH0751801Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6418765U (en) | 1989-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1043008A (en) | Photo coupler | |
| US5245620A (en) | Laser diode system for reflecting and maintaining laser light within the system | |
| JP3437709B2 (en) | Three-dimensional wiring type optical coupling device and reflection type optical coupling device | |
| JP4117868B2 (en) | Optical coupling element | |
| JPH0751801Y2 (en) | Photo coupler | |
| JPH10294495A (en) | Electronic component | |
| JPH0623002Y2 (en) | Photo coupler | |
| US7777234B2 (en) | Light-receiving element and photonic semiconductor device provided therewith | |
| JPH08186284A (en) | Surface-mounting photocoupler and its manufacture | |
| JPH04114080U (en) | light emitting display device | |
| JP2512626Y2 (en) | Resin-sealed optical semiconductor device | |
| JP2506452Y2 (en) | Side emitting display | |
| JP3824696B2 (en) | Photocoupler and manufacturing method thereof | |
| JP2525554Y2 (en) | Light emitting display | |
| JPH0559863U (en) | Semiconductor light emitting device | |
| JP3559700B2 (en) | Optical semiconductor device | |
| JPS61207086A (en) | Light-emitting element array | |
| JP2002359392A (en) | Semiconductor relay | |
| US20240113093A1 (en) | Insulation module | |
| JPH0528059U (en) | Optically coupled semiconductor device | |
| JPS6127192Y2 (en) | ||
| JPH0112306Y2 (en) | ||
| JPS5935001Y2 (en) | optical bidirectional thyristor | |
| JPH0645636A (en) | Photodetection and light-emitting element and photodetection and light-emitting device utilizing it | |
| JPH085571Y2 (en) | Optically coupled semiconductor device |