JPH07335471A - Conductive paste for external electrode of electronic component and formation of external electrode using this paste - Google Patents
Conductive paste for external electrode of electronic component and formation of external electrode using this pasteInfo
- Publication number
- JPH07335471A JPH07335471A JP6123612A JP12361294A JPH07335471A JP H07335471 A JPH07335471 A JP H07335471A JP 6123612 A JP6123612 A JP 6123612A JP 12361294 A JP12361294 A JP 12361294A JP H07335471 A JPH07335471 A JP H07335471A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- external electrode
- paste
- external electrodes
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば積層セラミック
コンデンサの外部電極用導電性ペーストおよびこれを用
いた電子部品の外部電極の形成方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste for external electrodes of, for example, a monolithic ceramic capacitor and a method for forming external electrodes of electronic parts using the same.
【０００２】[0002]
【従来の技術】図１に示すように、まず、厚さ数μｍの
セラミック誘電体層１と、厚さ数μｍの内部電極層２と
を交互に積層した後、焼成してコンデンサ素子３を得て
いた。次に、図２のブロックダイヤグラムに示すよう
に、このコンデンサ素子３の内部電極層２の露出した端
面に、銀系の導電性粉末と、ホウケイ酸亜鉛系、もしく
はホウケイ酸鉛系のガラスフリットとを有機ビヒクルに
分散させた導電性ペーストを塗布した後、１５０〜２５
０℃で乾燥し、７００〜９００℃で焼成して、コンデン
サ素子３と電機的・機械的に接続させた外部電極４ａ，
４ｂを形成し、その後、回路基板への半田付け性能を保
証するために、外部電極４ａ，４ｂ上に電解メッキ法を
用いてニッケルメッキ５ａ，５ｂ、およびハンダ、もし
くはスズメッキ６ａ，６ｂを行い、端子電極７ａ，７ｂ
を形成し、図１に示すような積層セラミックコンデンサ
を得ていた。2. Description of the Related Art As shown in FIG. 1, first, a ceramic dielectric layer 1 having a thickness of several μm and an internal electrode layer 2 having a thickness of several μm are alternately laminated and then fired to form a capacitor element 3. I was getting. Next, as shown in the block diagram of FIG. 2, a silver-based conductive powder and a zinc borosilicate-based or lead borosilicate-based glass frit were formed on the exposed end surface of the internal electrode layer 2 of the capacitor element 3. After applying a conductive paste in which is dispersed in an organic vehicle, 150 to 25
The external electrode 4a, which is dried at 0 ° C. and fired at 700 to 900 ° C., is electrically and mechanically connected to the capacitor element 3,
4b is formed, and then nickel plating 5a, 5b and solder or tin plating 6a, 6b are applied on the external electrodes 4a, 4b by electrolytic plating to ensure the soldering performance to the circuit board. Terminal electrodes 7a, 7b
To obtain a monolithic ceramic capacitor as shown in FIG.
【０００３】[0003]
【発明が解決しようとする課題】上記構成によると、外
部電極４ａ，４ｂは機械的強度、すなわちコンデンサ素
子３の端面との接着強度を得るために、導電性ペースト
中のガラスフリットを十分溶融させる必要があった。そ
のため、コンデンサ素子３の端面に導電性ペーストを塗
布し、１５０〜２５０℃で乾燥した後、７００〜９００
℃の高温で焼成しなければならず、製造工程が複雑にな
るという問題点を有していた。According to the above configuration, the external electrodes 4a and 4b sufficiently melt the glass frit in the conductive paste in order to obtain mechanical strength, that is, adhesive strength with the end face of the capacitor element 3. There was a need. Therefore, a conductive paste is applied to the end surface of the capacitor element 3, dried at 150 to 250 ° C., and then 700 to 900.
Since it has to be fired at a high temperature of ℃, there is a problem that the manufacturing process becomes complicated.
【０００４】本発明は、高温焼成の必要のない電子部品
の外部電極用導電性ペーストとこの導電性ペーストを用
いた外部電極の形成方法を提供することを目的とするも
のである。An object of the present invention is to provide a conductive paste for external electrodes of electronic parts which does not require high temperature firing and a method of forming external electrodes using this conductive paste.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に本発明は、導電性粉末と金属アルコキシドとを有機ビ
ヒクル中に分散させて導電性ペーストを作製し、この導
電性ペーストを電子部品に塗布し、導電性ペースト中の
金属アルコキシドを加水分解させて、外部電極を形成す
るものである。In order to achieve this object, the present invention is to disperse a conductive powder and a metal alkoxide in an organic vehicle to prepare a conductive paste, which is used as an electronic component. It is applied and the metal alkoxide in the conductive paste is hydrolyzed to form an external electrode.
【０００６】[0006]
【作用】この構成により、端子電極形成の工程を連続し
て行うことができるため、作業性と共に生産性を向上さ
せることができる。With this structure, the steps of forming the terminal electrodes can be continuously performed, so that workability as well as productivity can be improved.
【０００７】[0007]
【実施例】以下、本発明の一実施例について図面を用い
て説明する。図１は、積層セラミックコンデンサの断面
図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a monolithic ceramic capacitor.
【０００８】まず、導電性粉末（例えば銀、銀−パラジ
ウム）と、金属アルコキシドとしてエチルシリケート
［Ｓｉ（ＯＣ2Ｈ5）4］のアルコール溶液および、Ｈ2Ｏ
と塩酸のアルコール溶液を混合し、有機ビヒクル中に分
散させて導電性ペーストを作成した。このときの混合比
はエチルシリケート１ｍｏｌｅに対し、塩酸０．０３ｍ
ｏｌｅ、Ｈ2Ｏはエチルシリケートに対して、ｍｏｌｅ
比で２以上必要であり、少ないとゲル化しにくくなり、
十分な接着強度を有する外部電極を形成することができ
ない。次に、この配合を基本に、導電性粉末に対するエ
チルシリケートの量を（表１）に示す割合で配合し、こ
の混合物と有機ビヒクルの混合比が７０ｗｔ％：３０ｗ
ｔ％になるようにしてペースト状にした。First, a conductive powder (eg, silver, silver-palladium), an alcohol solution of ethyl silicate [Si (OC 2 H 5 ) 4 ] as a metal alkoxide, and H 2 O.
And an alcohol solution of hydrochloric acid were mixed and dispersed in an organic vehicle to prepare a conductive paste. The mixing ratio at this time was 0.03 m of hydrochloric acid to 1 mole of ethyl silicate.
ole and H 2 O are moles with respect to ethyl silicate
It is necessary to have a ratio of 2 or more.
External electrodes having sufficient adhesive strength cannot be formed. Next, based on this blending, the amount of ethyl silicate to the conductive powder was blended at the ratio shown in (Table 1), and the blending ratio of this mixture and the organic vehicle was 70 wt%: 30w.
It was made into a paste so as to have t%.
【０００９】[0009]
【表１】 [Table 1]
【００１０】その後、図３のブロックダイヤグラムに示
すように、この導電性ペーストをＴｉ酸バリウムを主成
分とする積層コンデンサ素子３の内部電極層２の露出し
た端面に塗布し、２５０℃で２時間乾燥処理して、外部
電極４ａ，４ｂを形成した。ここで、乾燥処理温度が３
００℃を越えるとゲル化が部分的に促進され、接着強度
の劣化が起こり好ましくない。２５０〜３００℃の低温
で処理することにより加水分解が起こり、外部電極４
ａ，４ｂが形成される。また乾燥時間は長いほど接着強
度は向上する。次に、外部電極４ａ，４ｂの表面に電解
メッキ法を用いて、ニッケルメッキ５ａ，５ｂ、および
ハンダメッキ６ａ，６ｂを実施し、端子電極７ａ，７ｂ
を形成した。Thereafter, as shown in the block diagram of FIG. 3, this conductive paste is applied to the exposed end surface of the internal electrode layer 2 of the multilayer capacitor element 3 containing barium Ti oxide as a main component, and the paste is applied at 250 ° C. for 2 hours. The external electrodes 4a and 4b were formed by drying treatment. Here, the drying treatment temperature is 3
When the temperature exceeds 00 ° C, gelation is partially promoted and the adhesive strength is deteriorated, which is not preferable. Hydrolysis occurs due to the treatment at a low temperature of 250 to 300 ° C., and the external electrode 4
a and 4b are formed. Further, the longer the drying time, the higher the adhesive strength. Next, nickel plating 5a, 5b and solder plating 6a, 6b are performed on the surfaces of the external electrodes 4a, 4b by electrolytic plating, and the terminal electrodes 7a, 7b.
Was formed.
【００１１】このようにして得た積層セラミックコンデ
ンサの端子電極７ａ，７ｂの接着強度を計り、（表１）
に示す。（表１）からわかるように、エチルシリケート
の量が増えるほど接着強度は増している。ただし、エチ
ルシリケートの量が増えすぎるとニッケルメッキの連続
性に課題が生じる。しかし、最適な条件下では接着強
度、ニッケルメッキ５ａ，５ｂの連続性とも、何ら問題
のない端子電極７ａ，７ｂが得られている。The adhesive strength of the terminal electrodes 7a and 7b of the thus obtained monolithic ceramic capacitor was measured (Table 1).
Shown in. As can be seen from Table 1, the adhesive strength increases as the amount of ethyl silicate increases. However, if the amount of ethyl silicate is too large, a problem occurs in the continuity of nickel plating. However, under the optimum conditions, the terminal electrodes 7a and 7b having no problem in adhesive strength and continuity of the nickel platings 5a and 5b are obtained.
【００１２】なお、本実施例においては、導電性粉末と
して銀、銀−パラジウムを示したが、導電性を有するも
のであれば構わない。また、外部電極４ａ，４ｂ上にニ
ッケルメッキ５ａ，５ｂを設けたが、外部電極４ａ，４
ｂが銀喰われを起こさないものであれば、設ける必要は
ない。また、導電性ペーストをコンデンサ素子３の端面
に塗布する方法はどのような方法でも構わないが、ディ
ップにより塗布するのが望ましい。Although silver and silver-palladium are used as the conductive powder in this embodiment, any conductive powder may be used. Further, the nickel platings 5a and 5b are provided on the external electrodes 4a and 4b.
If b does not cause silver erosion, it need not be provided. The conductive paste may be applied to the end face of the capacitor element 3 by any method, but it is preferable to apply it by dipping.
【００１３】[0013]
【発明の効果】以上のように、本発明は、導電性ペース
トを焼成することなく、外部電極を形成することができ
るので、端子電極形成工程を連続して行うことができる
ため、作業性と共に生産性を向上させることができる。As described above, according to the present invention, since the external electrodes can be formed without firing the conductive paste, the terminal electrode forming step can be continuously performed, and thus the workability is improved. Productivity can be improved.
【図１】積層セラミックコンデンサの断面図FIG. 1 is a sectional view of a monolithic ceramic capacitor.
【図２】従来の端子電極形成方法を示すブロックダイヤ
グラムFIG. 2 is a block diagram showing a conventional method of forming a terminal electrode.
【図３】本発明の一実施例における端子電極形成方法の
ブロックダイヤグラムFIG. 3 is a block diagram of a method of forming a terminal electrode according to an embodiment of the present invention.
１ セラミック誘電体層 ２ 内部電極層 ３ コンデンサ素子 ４ａ 外部電極 ４ｂ 外部電極 ５ａ ニッケルメッキ ５ｂ ニッケルメッキ ６ａ ハンダもしくはスズメッキ ６ｂ ハンダもしくはスズメッキ ７ａ 端子電極 ７ｂ 端子電極 1 Ceramic Dielectric Layer 2 Internal Electrode Layer 3 Capacitor Element 4a External Electrode 4b External Electrode 5a Nickel Plating 5b Nickel Plating 6a Solder or Tin Plating 6b Solder or Tin Plating 7a Terminal Electrode 7b Terminal Electrode
Claims (2)
機ビヒクル中に分散させた電子部品の外部電極用導電性
ペースト。1. A conductive paste for an external electrode of an electronic component, wherein a conductive powder and a metal alkoxide are dispersed in an organic vehicle.
とを有機ビヒクルに分散させて導電性ペーストを作製
し、次に前記導電性ペーストを電子部品に塗布し、加水
分解させて外部電極を形成する電子部品の外部電極の形
成方法。2. First, a conductive powder and a metal alkoxide are dispersed in an organic vehicle to prepare a conductive paste, and then the conductive paste is applied to an electronic component and hydrolyzed to form an external electrode. For forming external electrodes of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6123612A JPH07335471A (en) | 1994-06-06 | 1994-06-06 | Conductive paste for external electrode of electronic component and formation of external electrode using this paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6123612A JPH07335471A (en) | 1994-06-06 | 1994-06-06 | Conductive paste for external electrode of electronic component and formation of external electrode using this paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07335471A true JPH07335471A (en) | 1995-12-22 |
Family
ID=14864914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6123612A Pending JPH07335471A (en) | 1994-06-06 | 1994-06-06 | Conductive paste for external electrode of electronic component and formation of external electrode using this paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07335471A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101290153B1 (en) * | 2011-01-21 | 2013-07-26 | 가부시키가이샤 무라타 세이사쿠쇼 | Ceramic electronic component |
| WO2016186053A1 (en) * | 2015-05-21 | 2016-11-24 | 株式会社村田製作所 | Electronic component |
| JP2021028948A (en) * | 2019-08-09 | 2021-02-25 | 株式会社村田製作所 | Electronic component and manufacturing method of the same |
-
1994
- 1994-06-06 JP JP6123612A patent/JPH07335471A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101290153B1 (en) * | 2011-01-21 | 2013-07-26 | 가부시키가이샤 무라타 세이사쿠쇼 | Ceramic electronic component |
| WO2016186053A1 (en) * | 2015-05-21 | 2016-11-24 | 株式会社村田製作所 | Electronic component |
| CN107615421A (en) * | 2015-05-21 | 2018-01-19 | 株式会社村田制作所 | Electronic unit |
| JPWO2016186053A1 (en) * | 2015-05-21 | 2018-02-22 | 株式会社村田製作所 | Electronic components |
| US10453608B2 (en) | 2015-05-21 | 2019-10-22 | Murata Manufacturing Co., Ltd. | Electronic component |
| JP2021028948A (en) * | 2019-08-09 | 2021-02-25 | 株式会社村田製作所 | Electronic component and manufacturing method of the same |
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