JPH07266695A - Electronic part and method for marking the same - Google Patents
Electronic part and method for marking the sameInfo
- Publication number
- JPH07266695A JPH07266695A JP6061786A JP6178694A JPH07266695A JP H07266695 A JPH07266695 A JP H07266695A JP 6061786 A JP6061786 A JP 6061786A JP 6178694 A JP6178694 A JP 6178694A JP H07266695 A JPH07266695 A JP H07266695A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- marking
- resin layer
- irradiated
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Thermal Transfer Or Thermal Recording In General (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は樹脂モ−ルド部に標印が
設けられた半導体装置（ＩＣ）等の電子部品及び電子部
品の標印方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a semiconductor device (IC) having a marking on a resin mold portion and a marking method for the electronic component.
【０００２】[0002]
【従来の技術】従来、ＩＣ、トランジスタ等の電子部品
に対して標印する方法としては、例えば電子部品の樹脂
モ−ルド部の表面にあらかじめ着色材料を塗布してお
き、必要な文字等を刻設したマスクを介してレ−ザ−ビ
−ムを該表面に照射することにより、照射された個所の
焼きカスを飛ばして、凹形状となった該樹脂モ−ルド部
のマ−ク部分を露出させて必要な文字等を判読させる方
法（特開昭５８−３９４９４号公報）、あるいは電子部
品の樹脂モ−ルド部の表面に、例えばフェノ−ル樹脂層
を形成して上記のようなマスクを介してレ−ザ−ビ−ム
を該表面に照射することにより、フェノ−ル樹脂層のレ
−ザ−ビ−ムの照射された個所のみを黒色から茶褐色に
不変的に変色させて茶褐色の標印部を明瞭に識別させる
方法（実公平４−１７３６号公報）、また、色素を膜で
封じ込めたカプセルを電子部品の樹脂モ−ルド用成形材
料中に混入せしめ、この成形材料を用いて半導体素子を
封止するように樹脂モ−ルド部を成形した後、表面に上
記マスクを介してレ−ザ−ビ−ムを照射してカプセル膜
を破壊して色素を露呈させることにより標印を施す方法
等が考えられている（特公昭５９−６８２９７号公
報）。2. Description of the Related Art Conventionally, as a method of marking an electronic component such as an IC or a transistor, for example, a coloring material is applied in advance on the surface of a resin mold portion of the electronic component, and necessary characters are displayed. By irradiating the surface with a laser beam through an engraved mask, the burnt residue on the exposed part is blown off, and the mark part of the resin mold part having a concave shape is formed. As described above, in which a desired resin or the like is read by exposing the film (Japanese Patent Laid-Open No. 58-39494), or a phenol resin layer is formed on the surface of the resin mold portion of the electronic component. By irradiating the surface with a laser beam through a mask, only the irradiated portion of the laser beam of the phenol resin layer is permanently changed in color from black to brown. A method to clearly identify the dark brown markings (Actual Fairness 4-1) No. 36), and a capsule in which a dye is enclosed by a film is mixed in a molding material for a resin mold of an electronic component, and the resin molding is used to seal a semiconductor element. After molding, there has been considered a method of irradiating the surface with a laser beam through the above mask to destroy the capsule film to expose the dye, thereby applying a marking (Japanese Patent Publication No. 59-59-). 68297).
【０００３】[0003]
【発明が解決しようとする課題】前記従来の標印方法に
おいて、電子部品の樹脂モ−ルド部の表面部分の着色材
料をレ−ザ−ビ−ムにより焼きカスを飛ばす方法、フェ
ノ−ル樹脂層を黒色から茶褐色に変色させる方法、及び
色素を封じ込めたカプセルを破壊する方法のいずれの場
合においても、レ−ザ−ビ−ムを、被加工物の表面に照
射した際に、加工物の表面に、焼き焦げたカスが生じ、
このカスが加工表面に付着する。そのため、例えば半導
体装置（ＩＣ）のリ−ド端子に樹脂のカスが付着した状
態で、測定を行うと、測定端子がリ−ド端子に接触しな
いことによる測定不良等が生じ歩留まりが低下するとい
う欠点があった。そこで加工後のエア−ブロ−等による
クリ−ニングが必要であった。SUMMARY OF THE INVENTION In the conventional marking method, a method for removing a burned residue by a laser beam from a coloring material on the surface of a resin mold portion of an electronic component, a phenol resin In both cases of changing the layer from black to dark brown, and destroying the capsule that contains the dye, the laser beam is irradiated onto the surface of the workpiece, Burnt residue is generated on the surface,
This dust adheres to the processed surface. Therefore, for example, when the measurement is performed in a state where resin residue is attached to the lead terminal of a semiconductor device (IC), the measurement terminal does not come into contact with the lead terminal, resulting in a measurement failure or the like, which lowers the yield. There was a flaw. Therefore, it was necessary to perform cleaning by air blow after processing.
【０００４】更に、レ−ザ−ビ−ムによる加工時の熱に
よって、被加工物の表面が熱分解され蒸発してガスが発
生する場合もあり、衛生上の対策を必要とする等の欠点
もあった。本発明の目的は前記従来技術の欠点を解消
し、レ−ザ−ビ−ムの照射によって被加工物の表面に生
ずるカスの除去、及びガスの発生を防止して電子部品の
表面に見やすい標印を生産性良く施す方法を提供するこ
とにある。Further, heat generated during processing by a laser beam may cause the surface of the work piece to be thermally decomposed and vaporized to generate gas, which necessitates hygiene measures. There was also. The object of the present invention is to solve the above-mentioned drawbacks of the prior art, to remove dusts generated on the surface of a work by irradiation of a laser beam, and to prevent gas from being generated, thereby making it easy to see on the surface of an electronic component. It is to provide a method of applying a mark with high productivity.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記目的を達
成すべくなされたもので、樹脂モ−ルド部上にほぼ透明
の樹脂層を形成し、該樹脂層を介してレ−ザ−ビ−ムを
照射することにより、マ−キングを施すことを特徴とす
る。即ち、本発明は、次の電子部品及びマーキング方法
に係るものである。 樹脂モ−ルド部と、該樹脂モ−ルド部の表面に形成
されたほぼ透明の樹脂層と、前記樹脂モ−ルド部の表面
に刻設されたマ−キング部と、を有することを特徴とす
る電子部品。 樹脂モ−ルド部と、該樹脂モ−ルド部の表面に形成
された標印用樹脂層と、該標印用樹脂層の表面に形成さ
れたほぼ透明の樹脂層と、上記標印用樹脂層に刻設され
たマ−キング部と、を有するを有することを特徴とする
電子部品。 前記ほぼ透明の樹脂層がエポキシ樹脂又はアクリル
樹脂であることを特徴とする上記もしくはに記載の
電子部品。 樹脂モ−ルド部の表面にほぼ透明の樹脂層を形成
し、該樹脂層を介して前記樹脂モ−ルド部の表面にレ−
ザ−ビ−ムを照射することにより、マ−キングを施すこ
とを特徴とする電子部品のマ−キング方法。SUMMARY OF THE INVENTION The present invention has been made to achieve the above object. A substantially transparent resin layer is formed on a resin mold portion, and a laser is provided through the resin layer. Marking is performed by irradiating a beam. That is, the present invention relates to the following electronic component and marking method. A resin mold part, a substantially transparent resin layer formed on the surface of the resin mold part, and a marking part engraved on the surface of the resin mold part. And electronic components. A resin mold portion, a marking resin layer formed on the surface of the resin molding portion, a substantially transparent resin layer formed on the surface of the marking resin layer, and the marking resin And a marking part engraved in the layer. The electronic component as described in the above item 1 or 2, wherein the substantially transparent resin layer is an epoxy resin or an acrylic resin. A substantially transparent resin layer is formed on the surface of the resin mold portion, and a layer is formed on the surface of the resin mold portion through the resin layer.
A method for marking electronic parts, characterized in that marking is performed by irradiating the beam.
【０００６】[0006]
【実施例】以下、本発明を図面に示す実施例に従って説
明するが本発明はこれに限定されるものではない。実施
例では電子部品としてＩＣを例示している。図１は本発
明のマ−キング方法に使用されるＩＣの一実施例を示す
斜視図である。図２はＩＣの一実施例を示す断面図であ
る。図３は第１の実施例として本発明のマ−キング方法
に使用するほぼ透明の樹脂層を形成するための一部裁断
したモ−ルド用金型の要部拡大斜視図である。図４は第
２の実施例として本発明のマ−キング方法に使用する透
明の樹脂層を樹脂モ−ルド部の表面に塗着する状態を示
す要部拡大正面図である。The present invention will be described below with reference to the embodiments shown in the drawings, but the present invention is not limited thereto. In the embodiment, an IC is exemplified as the electronic component. FIG. 1 is a perspective view showing an embodiment of an IC used in the marking method of the present invention. FIG. 2 is a sectional view showing an embodiment of the IC. FIG. 3 is an enlarged perspective view of a main part of a partially cut mold for forming a substantially transparent resin layer used in the marking method of the present invention as a first embodiment. FIG. 4 is an enlarged front view of essential parts showing a state in which a transparent resin layer used in the marking method of the present invention is applied to the surface of the resin mold portion as a second embodiment.
【０００７】ＩＣは周知のように集積回路本体を黒色カ
−ボンの混入されたエポキシ系樹脂で樹脂モ−ルドして
構成される。図１及び図２で示すように集積回路本体１
は中央基板１１の両側にそれぞれ先端部が下向きに屈曲
するリ−ド端子１２を突設配置し、前記中央基板１１に
半導体チップ１３をダイボンディングしている。そして
この半導体チップ１３と前記リ−ド端子１２を金属線
（Ａｕ線）１４でワイヤボンディングして電気的に接続
して構成されている。この集積回路本体１はリ−ド端子
１２の先端屈曲部を除き、その全体がエポキシ系樹脂か
ら成る樹脂モ−ルド部２で一体的にパッケ−ジされてい
る。As is well known, the IC is formed by resin-molding an integrated circuit main body with an epoxy resin mixed with black carbon. As shown in FIGS. 1 and 2, an integrated circuit body 1
Has lead terminals 12 projectingly arranged on both sides of the central substrate 11 and having tip portions bent downward, and a semiconductor chip 13 is die-bonded to the central substrate 11. The semiconductor chip 13 and the lead terminal 12 are electrically connected by wire bonding with a metal wire (Au wire) 14. The integrated circuit main body 1 is integrally packaged in its entirety with a resin mold portion 2 made of an epoxy resin, excluding a bent portion of a lead terminal 12.
【０００８】標印を施すため、レ−ザ−ビ−ムを透過さ
せる透明樹脂層３を前記樹脂モ−ルド部２の表面に形成
する方法は例えば次の通りである。図３で示すように透
明樹脂層３に用いるため、粉末状の透明エポキシ系樹脂
を、あらかじめ下金型５ｂの底面に配備し、上下金型５
ａ、５ｂの接合間に集積回路本体１を配置して金型５内
に黒色カ−ボンを混入したエポキシ系樹脂あるいは液晶
ポリマ−を充填する。加熱、加圧処理の工程を経た後、
金型５よりＩＣを取り出すと、前記樹脂モ−ルド部２の
表面に透明樹脂層３が一体に接着形成される。尚、この
とき前記透明エポキシ系樹脂と前記黒色カ−ボンを混入
したエポキシ系樹脂が混合されるのを防ぐため、前記透
明エポキシ系樹脂の熱硬化温度を前記黒色カ−ボンを混
入したエポキシ系樹脂の熱硬化温度よりもやや低く設定
することが望ましい。A method for forming a transparent resin layer 3 for transmitting a laser beam on the surface of the resin mold portion 2 for applying a mark is as follows, for example. Since it is used for the transparent resin layer 3 as shown in FIG. 3, a powdery transparent epoxy resin is previously disposed on the bottom surface of the lower mold 5b, and the upper and lower molds 5 are
The integrated circuit body 1 is arranged between the joints a and 5b, and the mold 5 is filled with epoxy resin or liquid crystal polymer mixed with black carbon. After going through the steps of heating and pressure treatment,
When the IC is taken out from the mold 5, the transparent resin layer 3 is integrally bonded and formed on the surface of the resin mold portion 2. At this time, in order to prevent the transparent epoxy resin and the epoxy resin mixed with the black carbon from being mixed, the thermosetting temperature of the transparent epoxy resin is set to the epoxy resin mixed with the black carbon. It is desirable to set the temperature slightly lower than the thermosetting temperature of the resin.
【０００９】また、図４で示すように複数の集積回路本
体が設けられ、これを従来通り黒色の樹脂モ−ルド部２
でパッケ−ジしたリ−ドフレ−ムＡの状態で、リ−ドフ
レ−ムＡより個々の半導体装置を分離切断する前に、樹
脂モ−ルド部２の上面に対して透明樹脂層３の材料であ
るペ−スト状の透明エポキシ系樹脂を塗布又は印刷（塗
着）することにより、透明樹脂層３を形成することもで
きる。Further, as shown in FIG. 4, a plurality of integrated circuit bodies are provided, and the black resin mold portion 2 is provided in the conventional manner.
In the state of the packaged lead frame A, the material of the transparent resin layer 3 is formed on the upper surface of the resin mold portion 2 before the individual semiconductor devices are separated from the lead frame A by cutting. It is also possible to form the transparent resin layer 3 by applying or printing (adhering) a transparent epoxy resin in a paste form.
【００１０】このように構成されたＩＣは、前記樹脂モ
−ルド部２の表面にレ−ザ−ビ−ムを透過させる透明樹
脂層３が数ミクロンから数ｍｍの厚さで形成されてい
る。前記樹脂モ−ルド部２の表面に部品の型式、メ−カ
名等の標印部４を施す際は、レ−ザ−装置により樹脂モ
−ルド部２の表面に対して所要の文字等を刻設したマス
ク（図示せず）を介してレ−ザ−ビ−ムを照射する。照
射されたレ−ザ−ビ−ムは透明樹脂層３では吸収される
ことなく透過して、樹脂モ−ルド部２の表面に達し、こ
こでレ−ザ−ビ−ムが吸収され部品の型式、メ−カ名等
を表す文字、数字等の標印が直接、焼印処理され標印部
４が刻設される。尚、本実施例において、レーザービー
ムとしてＹＡＧレーザーを用いた。In the thus constructed IC, the transparent resin layer 3 for transmitting the laser beam is formed on the surface of the resin mold portion 2 with a thickness of several microns to several mm. . When the marking portion 4 such as the model of the part or the manufacturer's name is provided on the surface of the resin mold portion 2, a desired character or the like is printed on the surface of the resin mold portion 2 by a laser device. The laser beam is irradiated through a mask (not shown) in which the laser beam is engraved. The irradiated laser beam passes through the transparent resin layer 3 without being absorbed, and reaches the surface of the resin mold portion 2, where the laser beam is absorbed and the laser beam is absorbed. The markings such as letters and numbers representing the model, the manufacturer's name, etc. are directly subjected to the branding and the marking portion 4 is engraved. In this example, a YAG laser was used as the laser beam.
【００１１】レ−ザ−ビ−ムの照射された樹脂モ−ルド
部２の表面のみはレ−ザ−ビ−ムを吸収するために熱に
より、焼き焦がされて変色する。例えば、樹脂モ−ルド
部２の材料として、液晶ポリマ−を用いた場合は白色か
ら黒色に変色する。また、樹脂モ−ルド部２と透明樹脂
層３の間に標印用樹脂層として例えばフェノ−ル樹脂層
を形成してレ−ザ−ビ−ムを照射した場合には、照射さ
れた標印部４のフェノ−ル樹脂は黒色から茶褐色に不変
的に変色し、よりコントラストが向上する。従って、標
印部４以外の樹脂モ−ルド部２あるいはフェノ−ル樹脂
の黒い面（レ−ザ−ビ−ムが照射されない面）に対して
変色した標印部４が透明樹脂層３を通して認識でき、明
瞭な識別性が確保される。Only the surface of the resin mold portion 2 irradiated with the laser beam is burnt and discolored by heat to absorb the laser beam. For example, when a liquid crystal polymer is used as the material of the resin mold portion 2, the color changes from white to black. Further, when a laser beam is irradiated with a phenol resin layer as a marking resin layer formed between the resin mold portion 2 and the transparent resin layer 3 and the laser beam is irradiated, the irradiated mark is irradiated. The phenol resin of the mark portion 4 is invariably changed color from black to dark brown, and the contrast is further improved. Therefore, the marking portion 4 discolored with respect to the resin mold portion 2 other than the marking portion 4 or the black surface of the phenol resin (the surface not exposed to the laser beam) passes through the transparent resin layer 3. Recognizable and clear distinctiveness is secured.
【００１２】更に、樹脂モ−ルド部２の成形材料中に任
意の色の色素を封じ込めたカプセルを混入し、レ−ザ−
ビ−ムを照射して、カプセルを破壊することにより変色
させてもよい。上記の実施例では樹脂モ−ルド部又は樹
脂モ−ルド部とほぼ透明の樹脂層の間に形成された標印
用樹脂層の変色により標印を形成しているが、本発明
は、これに限らず、レ−ザ−ビ−ムの照射により、標印
用樹脂層の照射された個所のみを溶融して、凹形状とな
った該樹脂モ−ルド部のマ−ク部分を露出させることに
より標印を形成する場合にも応用できる。Further, a capsule containing a dye of an arbitrary color is mixed in the molding material of the resin mold portion 2 to make a laser.
The color may be changed by irradiating a beam to break the capsule. In the above-mentioned embodiment, the mark is formed by the discoloration of the resin mold portion or the resin layer for marking formed between the resin mold portion and the substantially transparent resin layer. Not only the laser beam but also the irradiated portion of the marking resin layer is melted by the irradiation of the laser beam to expose the mark portion of the concave resin mold portion. This can also be applied to the case of forming a mark.
【００１３】また、上記の実施例ではほぼ透明の樹脂層
として透明のエポキシ樹脂を用いて形成しているが、本
発明は、これに限定されるものではなく、レ−ザ−ビ−
ムを照射したとき、レーザービームの発振波長において
光の吸収帯を有さず、且つ樹脂モールド部に形成された
標印部が見える程度の透明性を有する層とし得る樹脂で
あれば広く使用することができ、より具体的には、例え
ばアクリル樹脂等の熱可塑性樹脂、熱硬化性樹脂等を用
いることができる。本実施例では、レーザービームとし
てＹＡＧレーザーを用いたが、本発明はこれに限定され
ることなく、炭酸ガスレーザー等の各種レーザーによる
ビームを使用でき、これらレーザーは、透明樹脂層の材
質（樹脂）により透過可能なものを適宜用いられる。
尚、上記アクリル樹脂を用いる場合にはＹＡＧレーザ
（発振波長１０６０ｎｍ程度）を有効に使用することが
できる。Further, in the above embodiment, the transparent epoxy resin is used as the substantially transparent resin layer, but the present invention is not limited to this, and the laser beam is used.
Widely used as long as it is a resin that does not have a light absorption band at the oscillation wavelength of the laser beam when irradiated with a laser beam and can be a layer that is transparent enough to show the marking part formed in the resin mold part For example, a thermoplastic resin such as an acrylic resin, a thermosetting resin, or the like can be used. In this embodiment, the YAG laser was used as the laser beam, but the present invention is not limited to this, and beams of various lasers such as a carbon dioxide gas laser can be used. ), A material that can be transmitted is appropriately used.
When the above acrylic resin is used, a YAG laser (oscillation wavelength of about 1060 nm) can be effectively used.
【００１４】尚、上記実施例では、電子部品として樹脂
モ−ルド部を有するＩＣにマーキングしたときを例にあ
げたが、この発明は発光ダイオ−ド、トランジスタ、マ
イクロスイッチ、コンデンサ、抵抗器等の樹脂モールド
部もしくは樹脂保護層を有する種々の電子部品に広く適
用できるものである。In the above embodiment, the case where an IC having a resin mold portion is marked as an electronic component is taken as an example, but the present invention is a light emitting diode, transistor, micro switch, capacitor, resistor, etc. It can be widely applied to various electronic parts having the resin mold part or the resin protective layer.
【００１５】[0015]
【発明の作用効果】本発明では以上のように、電子部品
の樹脂モ−ルド部の表面にほぼ透明の樹脂層を形成して
から、レ−ザ−ビ−ムを照射するため、樹脂モ−ルド部
の表面が焼印処理されても透明樹脂層により気密状態で
被覆されているので、焼きカスが飛散することも、また
ガスの空気中への発散もない。従って、樹脂モ−ルド部
にレ−ザ−ビ−ムを直接照射する場合に比べて、被加工
物の表面に生ずるカスの除去が不要になるとともに、測
定不良を減少させ歩留まりを向上させること等により生
産性の向上した電子部品のマ−キング方法を提供でき
る。このため、生産工程における加工後のクリ−ニング
作業が不要となるとともに、衛生を向上させることがで
き従来の欠点は一掃される。As described above, according to the present invention, the resin beam is irradiated after the substantially transparent resin layer is formed on the surface of the resin mold portion of the electronic component. Since the transparent resin layer is covered in an airtight state even if the surface of the cold portion is subjected to the branding process, neither burning dust nor scattering of gas into the air occurs. Therefore, as compared with the case where the resin beam is directly irradiated with the laser beam, it is not necessary to remove the dust generated on the surface of the workpiece, and the measurement failure is reduced to improve the yield. As a result, it is possible to provide a method for marking electronic components with improved productivity. For this reason, the cleaning work after processing in the production process is not required, and the hygiene can be improved, and the conventional defects can be eliminated.
【００１６】更に、樹脂モ−ルドの表面にほぼ透明の樹
脂層を形成した状態で標印形成されるので、標印部をほ
ぼ透明の樹脂層で保護することができ、電子部品の取扱
における標印部の直接の摩耗をなくして見やすい標印を
維持することができる。Further, since the mark is formed with the substantially transparent resin layer formed on the surface of the resin mold, the mark portion can be protected by the substantially transparent resin layer, and in handling electronic parts. It is possible to maintain the easy-to-see mark by eliminating direct wear of the mark part.
【図１】図１は本発明のマ−キング方法に使用される電
子部品の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of an electronic component used in the marking method of the present invention.
【図２】図２は電子部品の一実施例を示す断面図であ
る。FIG. 2 is a sectional view showing an embodiment of an electronic component.
【図３】図３は第１の実施例として本発明のマ−キング
方法に使用する透明樹脂層を形成する状態を示す要部拡
大斜視図である。FIG. 3 is an enlarged perspective view of essential parts showing a state in which a transparent resin layer used in the marking method of the present invention is formed as a first embodiment.
【図４】図４は第２の実施例として本発明のマ−キング
方法に使用する透明樹脂層を樹脂モ−ルド部表面に塗着
する状態を示す要部拡大正面図である。FIG. 4 is an enlarged front view of an essential part showing a state in which a transparent resin layer used in the marking method of the present invention is applied to the surface of a resin mold portion as a second embodiment.
１ 集積回路本体 ２ 樹脂モ−ルド部 ３ 透明樹脂層 ４ 標印部 ５ 金型 １１ 中央基板 １２ リ−ド端子 １３ 半導体チップ １４ 金属線（Ａｕ線） Ａ リ−ドフレ−ム 1 Integrated Circuit Main Body 2 Resin Mold Part 3 Transparent Resin Layer 4 Marking Part 5 Mold 11 Central Substrate 12 Lead Terminal 13 Semiconductor Chip 14 Metal Wire (Au Wire) A Lead Frame
Claims (4)
表面に形成されたほぼ透明の樹脂層と、前記樹脂モ−ル
ド部の表面に刻設されたマ−キング部と、を有すること
を特徴とする電子部品。1. A resin mold part, a substantially transparent resin layer formed on the surface of the resin mold part, and a marking part formed on the surface of the resin mold part. An electronic component having:
表面に形成された標印用樹脂層と、該標印用樹脂層の表
面に形成されたほぼ透明の樹脂層と、上記標印用樹脂層
に刻設されたマ−キング部と、を有するを有することを
特徴とする電子部品。2. A resin mold portion, a marking resin layer formed on the surface of the resin molding portion, and a substantially transparent resin layer formed on the surface of the marking resin layer, And a marking portion engraved on the marking resin layer.
はアクリル樹脂であることを特徴とする請求項１もしく
は２に記載の電子部品。3. The electronic component according to claim 1, wherein the substantially transparent resin layer is an epoxy resin or an acrylic resin.
層を形成し、該樹脂層を介して前記樹脂モ−ルド部の表
面にレ−ザ−ビ−ムを照射することにより、マ−キング
を施すことを特徴とする電子部品のマ−キング方法。4. A substantially transparent resin layer is formed on the surface of the resin mold portion, and the surface of the resin mold portion is irradiated with a laser beam through the resin layer. A method for marking electronic parts, which is characterized by performing marking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6061786A JPH07266695A (en) | 1994-03-30 | 1994-03-30 | Electronic part and method for marking the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6061786A JPH07266695A (en) | 1994-03-30 | 1994-03-30 | Electronic part and method for marking the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07266695A true JPH07266695A (en) | 1995-10-17 |
Family
ID=13181129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6061786A Pending JPH07266695A (en) | 1994-03-30 | 1994-03-30 | Electronic part and method for marking the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07266695A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6238847B1 (en) | 1997-10-16 | 2001-05-29 | Dmc Degussa Metals Catalysts Cerdec Ag | Laser marking method and apparatus |
| US6503310B1 (en) | 1999-06-22 | 2003-01-07 | Dmc2 Degussa Metals Catalysts Cerdec Ag | Laser marking compositions and method |
| US6503316B1 (en) | 2000-09-22 | 2003-01-07 | Dmc2 Degussa Metals Catalysts Cerdec Ag | Bismuth-containing laser markable compositions and methods of making and using same |
| WO2005068163A1 (en) * | 2004-01-16 | 2005-07-28 | Japan Science And Technology Agency | Micro-fabrication method |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| US7238396B2 (en) | 2002-08-02 | 2007-07-03 | Rieck Albert S | Methods for vitrescent marking |
| JP2008026112A (en) * | 2006-07-20 | 2008-02-07 | Seiko Instruments Inc | Embedded cassette |
| KR20180051192A (en) * | 2016-11-08 | 2018-05-16 | 주식회사 바른전자 | Color-varied memory device |
-
1994
- 1994-03-30 JP JP6061786A patent/JPH07266695A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6238847B1 (en) | 1997-10-16 | 2001-05-29 | Dmc Degussa Metals Catalysts Cerdec Ag | Laser marking method and apparatus |
| US6503310B1 (en) | 1999-06-22 | 2003-01-07 | Dmc2 Degussa Metals Catalysts Cerdec Ag | Laser marking compositions and method |
| US6503316B1 (en) | 2000-09-22 | 2003-01-07 | Dmc2 Degussa Metals Catalysts Cerdec Ag | Bismuth-containing laser markable compositions and methods of making and using same |
| US6680121B2 (en) | 2000-09-22 | 2004-01-20 | Dmc2 Degussa Metals Catalysts Cerdec Ag | Bismuth-containing laser markable compositions and methods of making and using same |
| US7238396B2 (en) | 2002-08-02 | 2007-07-03 | Rieck Albert S | Methods for vitrescent marking |
| WO2005068163A1 (en) * | 2004-01-16 | 2005-07-28 | Japan Science And Technology Agency | Micro-fabrication method |
| JP2006156674A (en) * | 2004-11-29 | 2006-06-15 | Asahi Kasei Electronics Co Ltd | Semiconductor device and its manufacturing method |
| JP2008026112A (en) * | 2006-07-20 | 2008-02-07 | Seiko Instruments Inc | Embedded cassette |
| KR20180051192A (en) * | 2016-11-08 | 2018-05-16 | 주식회사 바른전자 | Color-varied memory device |
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