JPH0685445A - Double-sided mounting method - Google Patents
Double-sided mounting methodInfo
- Publication number
- JPH0685445A JPH0685445A JP23678492A JP23678492A JPH0685445A JP H0685445 A JPH0685445 A JP H0685445A JP 23678492 A JP23678492 A JP 23678492A JP 23678492 A JP23678492 A JP 23678492A JP H0685445 A JPH0685445 A JP H0685445A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- melting point
- parts
- reflow
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線基板の両
面に電子部品をリフローソルダリングにより実装する両
面実装工法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided mounting method for mounting electronic parts on both sides of a printed wiring board by reflow soldering.
【０００２】[0002]
【従来の技術】図３は従来の両面実装工法を示す工程説
明用のフローチャートである。2. Description of the Related Art FIG. 3 is a flow chart for explaining a conventional double-sided mounting method.
【０００３】プリント配線基板において、最初の工程で
部品をはんだ付けする一方の第１の面をＡ面とし、その
反対側で次の工程で部品をはんだ付けする他方の第２の
面をＢ面とする。In the printed wiring board, the first surface on which one of the components is soldered in the first step is the A surface, and the other second surface on which the other part is soldered in the next step is the B surface. And
【０００４】図３に示すように、まず、プリント配線基
板におけるＡ面に共晶クリームはんだを印刷供給し（ス
テップ３１）、続いてＡ面に部品をマウントする（ステ
ップ３２）。その後、上記のように部品をＡ面にマウン
トしたプリント配線基板をリフロー炉に通し、リフロー
温度２１０〜２３０℃で部品をプリント配線基板のＡ面
にはんだ付けする（ステップ３３）。As shown in FIG. 3, first, eutectic cream solder is printed and supplied on the A surface of the printed wiring board (step 31), and then the component is mounted on the A surface (step 32). Thereafter, the printed wiring board on which the components are mounted on the A surface as described above is passed through a reflow furnace, and the components are soldered to the A surface of the printed wiring board at a reflow temperature of 210 to 230 ° C (step 33).
【０００５】次に、プリント配線基板を反転し（ステッ
プ３４）、そのＢ面に共晶クリームはんだを印刷供給す
る（ステップ３５）。続いてＢ面に部品をマウントする
（ステップ３６）。その後、上記のように部品をＢ面に
マウントしたプリント配線基板をリフロー炉に通し、リ
フロー温度２１０〜２３０℃で部品をプリント配線基板
のＢ面にはんだ付けする（ステップ３７）。Next, the printed wiring board is turned over (step 34), and eutectic cream solder is printed and supplied to the B side (step 35). Subsequently, the component is mounted on the B side (step 36). Thereafter, the printed wiring board having the components mounted on the B side as described above is passed through a reflow furnace, and the components are soldered to the B side of the printed wiring board at a reflow temperature of 210 to 230 ° C (step 37).
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記の
従来の両面実装工法では、後からのＢ面実装時に先に実
装してあるＡ面のはんだが再溶融するため、Ａ面実装部
品のずれや落下などが発生し、実装品質を著しく低下さ
せる問題があった。However, in the above-mentioned conventional double-sided mounting method, the solder on the A-side that was previously mounted is remelted during the subsequent B-side mounting. There is a problem that the mounting quality is remarkably deteriorated due to dropping or the like.
【０００７】また、近年、電子機器の多機能化、高機能
化が増大するのに伴い、電子機器に使用される電子部品
には、共晶はんだを使用して内部基板の部品実装を行っ
たモジュール部品がますます多くなってきている。した
がって、これらのモジュール部品をマザー基板へはんだ
付けする場合、上記従来の両面実装工法では、モジュー
ル部品の内部基板ではんだの再溶融が起こり、部品特性
の変化や劣化が発生するという問題があった。Further, in recent years, as electronic equipment has become more multifunctional and highly functional, eutectic solder has been used to mount electronic board parts on electronic parts used in electronic devices. There are more and more modular parts. Therefore, when soldering these module parts to the mother board, the conventional double-sided mounting method described above has a problem that remelting of the solder occurs in the internal board of the module parts, resulting in change or deterioration of the part characteristics. .
【０００８】本発明は、上記従来の問題を解決するもの
であり、プリント配線基板の一方の第１の面に部品をリ
フローソルダリングにより実装した後、プリント配線基
板の他方の第２の面にリフローソルダリングにより部品
を実装する際、先に、第１の面に部品を実装しているは
んだの再溶融を防止して品質低下を防止することがで
き、また、第２の面に熱に弱い部品を実装することがで
きるようにして汎用性を得ることができるようにした両
面実装工法を提供することを目的とするものである。The present invention is to solve the above-mentioned conventional problems. After the components are mounted on one first surface of the printed wiring board by reflow soldering, the other second surface of the printed wiring board is mounted. When mounting a component by reflow soldering, it is possible to prevent re-melting of the solder that mounts the component on the first surface to prevent quality deterioration, and to prevent heat from being applied to the second surface. It is an object of the present invention to provide a double-sided mounting method capable of mounting weak parts and obtaining versatility.
【０００９】[0009]
【課題を解決するための手段】本発明は、上記目的を達
成するために、融点の高いはんだを用い、プリント配線
基板の一方の第１の面にリフローソルダリングにより部
品を実装し、次いで、上記最初のはんだより融点の低い
はんだを用い、上記プリント配線基板の他方の第２の面
に上記最初のはんだの融点より低い温度でリフローソル
ダリングにより部品を実装するようにしたものである。In order to achieve the above object, the present invention uses a solder having a high melting point, mounts a component on one first surface of a printed wiring board by reflow soldering, and then, A solder having a melting point lower than that of the first solder is used, and components are mounted on the other second surface of the printed wiring board by reflow soldering at a temperature lower than the melting point of the first solder.
【００１０】[0010]
【作用】したがって、本発明によれば、プリント配線基
板の一方の第１の面に部品をリフローソルダリングによ
り実装した後、プリント配線基板の他方の第２の面にリ
フローソルダリングにより部品を実装する際、先に第１
の面に部品を実装しているはんだが再溶融するのを防止
することができ、また、プリント配線基板の第２の面に
熱に弱い部品を実装することができる。Therefore, according to the present invention, after the component is mounted on one first surface of the printed wiring board by reflow soldering, the component is mounted on the other second surface of the printed wiring board by reflow soldering. When doing, first
It is possible to prevent re-melting of the solder on which the component is mounted on the surface of (1), and it is also possible to mount the heat-sensitive component on the second surface of the printed wiring board.
【００１１】[0011]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１２】図１は本発明の一実施例における両面実装
工法を示す工程説明用のフローチャート、図２は同両面
実装工法で用いる共晶はんだおよび低融点はんだのリフ
ロー温度の相関を示す図である。FIG. 1 is a flow chart for explaining steps showing a double-sided mounting method in one embodiment of the present invention, and FIG. 2 is a diagram showing a correlation between reflow temperatures of eutectic solder and low melting point solder used in the double-sided mounting method. .
【００１３】プリント配線基板において、最初の工程で
部品をはんだ付けする一方の第１の面をＡ面とし、その
反対側で次の工程で部品をはんだ付けする他方の第２の
面をＢ面とする。In the printed wiring board, the first surface on which one of the components is soldered in the first step is the A surface, and the other second surface on the opposite side of which the other part is soldered in the next step is the B surface. And
【００１４】図１および図２に示すように、まず、プリ
ント配線基板におけるＡ面に共晶クリームはんだ（融点
１８３℃）を印刷供給し（ステップ１）、続いてＡ面に
部品をマウントする（ステップ２）。その後、上記のよ
うに部品をＡ面にマウントしたプリント配線基板をリフ
ロー炉に通し、リフロー温度２１０〜２３０℃で部品を
プリント配線基板のＡ面にはんだ付けする（ステップ
３）。As shown in FIG. 1 and FIG. 2, first, eutectic cream solder (melting point 183 ° C.) is printed and supplied on the A surface of the printed wiring board (step 1), and then parts are mounted on the A surface ( Step 2). After that, the printed wiring board having the components mounted on the A surface as described above is passed through a reflow furnace, and the components are soldered to the A surface of the printed wiring board at a reflow temperature of 210 to 230 ° C. (step 3).
【００１５】次に、プリント配線基板を反転し（ステッ
プ４）、そのＢ面に低融点クリームはんだ（融点１３５
〜１５２℃）を印刷供給する（ステップ５）。続いてＢ
面に部品をマウントする（ステップ６）。その後、上記
のように部品をＢ面にマウントしたプリント配線基板を
リフロー炉に通し、リフロー温度１７０〜１８０℃で部
品をプリント配線基板のＢ面にはんだ付けする（ステッ
プ７）。Next, the printed wiring board is turned over (step 4), and a low melting point cream solder (melting point 135
(-152 ° C) is supplied by printing (step 5). Then B
Mount the component on the surface (step 6). Thereafter, the printed wiring board having the components mounted on the B side as described above is passed through a reflow furnace, and the components are soldered to the B side of the printed wiring board at a reflow temperature of 170 to 180 ° C. (step 7).
【００１６】このように本実施例によれば、Ａ面実装に
共晶はんだを用いた共晶点より高い温度でのリフローソ
ルダリングを行い、Ｂ面実装に低融点はんだを用いた共
晶点より低い温度でのリフローソルダリングを行うこと
により、Ｂ面実装時にＡ面実装部品のはんだの再溶融を
防止して品質低下を防止することができ、しかも、Ｂ面
に熱に弱い部品を実装することができる。As described above, according to this embodiment, reflow soldering is performed at a temperature higher than the eutectic point using the eutectic solder for the A surface mounting, and the eutectic point using the low melting point solder for the B surface mounting. By performing reflow soldering at a lower temperature, it is possible to prevent re-melting of the solder of the A-side mounted component during B-side mounting and prevent quality deterioration, and mount a heat-sensitive component on the B-side. can do.
【００１７】[0017]
【発明の効果】以上説明したように本発明によれば、融
点の高いはんだを用い、プリント配線基板の一方の第１
の面にリフローソルダリングにより部品を実装し、次い
で、上記最初のはんだより融点の低いはんだを用い、上
記プリント配線基板の他方の第２の面に上記最初のはん
だの融点より低い温度でリフローソルダリングにより部
品を実装するので、第２の面に部品を実装する際、先に
第１の面に部品を実装しているはんだの再溶融を防止し
て品質低下を防止することができる。また、第２の面に
熱に弱い部品を実装することができて汎用性を得ること
ができる。As described above, according to the present invention, the solder having a high melting point is used, and the first one of the printed wiring boards is used.
On the surface of the printed wiring board by using reflow soldering, and then using a solder having a melting point lower than that of the first solder, and reflow soldering the second surface of the printed wiring board at a temperature lower than the melting point of the first solder. Since the component is mounted by the ring, when the component is mounted on the second surface, it is possible to prevent re-melting of the solder that has mounted the component on the first surface first, and prevent the deterioration of quality. Further, it is possible to mount a heat-sensitive component on the second surface, and thus it is possible to obtain versatility.
【図１】本発明の一実施例における両面実装工法を示す
工程説明用のフローチャートFIG. 1 is a flowchart for explaining a process showing a double-sided mounting method according to an embodiment of the present invention.
【図２】同両面実装工法で用いる共晶はんだおよび低融
点はんだのリフロー温度の相関を示す図FIG. 2 is a diagram showing a correlation between reflow temperatures of eutectic solder and low melting point solder used in the double-sided mounting method.
【図３】従来の両面実装工法を示す工程説明用のフロー
チャートFIG. 3 is a flowchart for explaining a process showing a conventional double-sided mounting method.
Claims (1)
基板の一方の第１の面にリフローソルダリングにより部
品を実装し、次いで、上記最初のはんだより融点の低い
はんだを用い、上記プリント配線基板の他方の第２の面
に上記最初のはんだの融点より低い温度でリフローソル
ダリングにより部品を実装することを特徴とする両面実
装工法。1. A printed wiring board, wherein a solder having a high melting point is used to mount a component on one first surface of a printed wiring board by reflow soldering, and then a solder having a lower melting point than the first solder is used. A double-sided mounting method characterized in that a component is mounted on the second surface of the other side by reflow soldering at a temperature lower than the melting point of the first solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23678492A JPH0685445A (en) | 1992-09-04 | 1992-09-04 | Double-sided mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23678492A JPH0685445A (en) | 1992-09-04 | 1992-09-04 | Double-sided mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0685445A true JPH0685445A (en) | 1994-03-25 |
Family
ID=17005746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23678492A Pending JPH0685445A (en) | 1992-09-04 | 1992-09-04 | Double-sided mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685445A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002087296A1 (en) * | 2001-04-10 | 2002-10-31 | Nec Corporation | Circuit board, circuit board mounting method, and electronic device using the circuit board |
| JP2003037357A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Soldering method and heating unit |
-
1992
- 1992-09-04 JP JP23678492A patent/JPH0685445A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002087296A1 (en) * | 2001-04-10 | 2002-10-31 | Nec Corporation | Circuit board, circuit board mounting method, and electronic device using the circuit board |
| JP2003037357A (en) * | 2001-07-26 | 2003-02-07 | Matsushita Electric Ind Co Ltd | Soldering method and heating unit |
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