JPH03268386A - Method of mounting component on double-sided printed wiring board - Google Patents
Method of mounting component on double-sided printed wiring boardInfo
- Publication number
- JPH03268386A JPH03268386A JP6792990A JP6792990A JPH03268386A JP H03268386 A JPH03268386 A JP H03268386A JP 6792990 A JP6792990 A JP 6792990A JP 6792990 A JP6792990 A JP 6792990A JP H03268386 A JPH03268386 A JP H03268386A
- Authority
- JP
- Japan
- Prior art keywords
- component
- printed wiring
- wiring board
- positions
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000008646 thermal stress Effects 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000035882 stress Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、両面プリント配線板の両面に半田のり７０
−法によって部品を実装する方法の改良に関する。[Detailed Description of the Invention] <Industrial Application Field> This invention provides solder paste 70 on both sides of a double-sided printed wiring board.
-Relating to improvements in the method of mounting components by the method.
く従来の技術〉
両面プリント配線板の両面にリフロー法によりて部品を
実装する場合、従来は第２図に示すように片面ずつ実装
作業を行っている。まず、第２図（、）のようにプリン
ト配線板１の一方の面の所定の位置、すなわち取り付け
られるべき部品２の端子電極２ａの位置にり７０−用の
半田ペースト３を塗布した後、第２図（ｂ）のように部
品２を載置し、＋７７０−炉を通して第２図（Ｃ）のよ
うに半田ペースト３を溶融して半田付けを行う。４は加
熱源を示す。次に基板１を反転し、第２図（ｄ）、第２
図（ｅ）及び第２図（ｆ）のように他方の面に上記と同
じ要領で部品２を半田付けするのである。BACKGROUND ART When components are mounted on both sides of a double-sided printed wiring board by the reflow method, conventionally the mounting work is carried out on one side at a time, as shown in FIG. First, as shown in FIG. 2(,), after applying the solder paste 3 for 70- at a predetermined position on one side of the printed wiring board 1, that is, at the position of the terminal electrode 2a of the component 2 to be attached, The component 2 is mounted as shown in FIG. 2(b), and soldered by melting the solder paste 3 through a +770- furnace as shown in FIG. 2(c). 4 indicates a heating source. Next, the substrate 1 is reversed, and as shown in FIG. 2(d), the second
Component 2 is soldered to the other surface in the same manner as described above, as shown in FIG. 2(e) and FIG. 2(f).
〈発明が解決しようとする課題〉
上記のように片面ずつ実装しているので同種の工程を２
回繰り返さなければならず、また片面の処理後、プリン
ト配線板が冷えるまで待たなくてはならない、更に、最
初に実装された部品は２回り７０−炉を通るため熱スト
レスを２回受けることになり、それに耐えるだけの耐熱
性が要求される。<Problem to be solved by the invention> As mentioned above, since it is mounted on one side at a time, the same process can be performed twice.
The process must be repeated several times, the printed wiring board must wait until it cools down after processing one side, and the first mounted component passes through the furnace twice, subjecting it to thermal stress twice. Therefore, heat resistance is required to withstand this.
この発明はこのような問題点に着目し、両面の実装を１
回のり７０一炉通過で可能とすることにより、工程の簡
略化と熱ストレスの軽減を計ることを目的としてなされ
たものである。This invention focuses on these problems and makes it possible to implement both sides in one
This was done with the aim of simplifying the process and reducing thermal stress by making it possible to pass through a single furnace.
く課題を解決するための手段〉
上述の目的を達成するために、この発明では、一方の面
に取り付けられるべき部品の端子電極の位置に透孔を形
成すると共に当該部品を所定位置に仮固定し、次いで他
方の面を上向きにしてこの面に取り付けられるべき部品
の端子電極の位置と上記透孔の部分にリフロー用牛田を
塗布すると共に当該部品を所定位置に載置し、最後にり
７０−用半田を加熱溶融して両面の各部品の半田付けを
行うようにしている。Means for Solving the Problems> In order to achieve the above-mentioned object, in this invention, a through hole is formed at the position of a terminal electrode of a component to be attached to one surface, and the component is temporarily fixed in a predetermined position. Then, with the other side facing upward, reflow coating is applied to the position of the terminal electrode and the above-mentioned through hole of the component to be attached to this surface, and the component is placed in a predetermined position. - Each component on both sides is soldered by heating and melting the solder.
く作用〉
この発明によれば、同種の工程を２回繰り返したり、プ
リント配線板の冷却を待ったりする必要がなく、一方の
面に仮固定された部品と他方の面に載ｒａされた部品の
半田付けが同時に行われ、両面の実装が１回の加熱で終
了する。According to the present invention, there is no need to repeat the same process twice or wait for the printed wiring board to cool down, and the components temporarily fixed on one surface and the components mounted on the other surface can be separated. Soldering is done at the same time, and mounting on both sides is completed with one heating.
〈実施例〉 次に第１図によりこの発明の一実施例を説明する。<Example> Next, an embodiment of the present invention will be described with reference to FIG.
まず、第１図（ａ）のようにプリント配線板１の一方の
面の所定の位置、すなわち取り付けられるべき部品２の
端子電極２ａの位置に透孔５を形成し、仮固定用の接着
剤６を塗布して第１図（ｂ）のように部品２を載置して
仮固定する。次に基板１を反転し、第１図（ｃ）のよう
に上向きになった面の所定の位置、すなわち取り付けら
れるべき部品２の端子電極２ａの位置と上記透孔５の部
分に半田ペースト３を塗布し、第１図（ｄ）のように所
定の位置に部品２を載置する。次いでり７０−炉を通し
て第１図（ｅ）のように半田ペースト３を溶融し、両面
の各部品２をプリント配線板１に同時に半田付けするの
である。First, as shown in FIG. 1(a), a through hole 5 is formed at a predetermined position on one side of the printed wiring board 1, that is, at the position of the terminal electrode 2a of the component 2 to be attached, and an adhesive for temporary fixing is applied. 6 is applied, and the part 2 is placed and temporarily fixed as shown in FIG. 1(b). Next, the board 1 is turned over, and the solder paste 3 is placed at a predetermined position on the surface facing upward as shown in FIG. is applied, and the part 2 is placed in a predetermined position as shown in FIG. 1(d). Next, the solder paste 3 is melted through a furnace 70 as shown in FIG. 1(e), and the components 2 on both sides are simultaneously soldered to the printed wiring board 1.
なお、第１図（ｃ）の基板１を反転して半田ペースト３
を塗布する工程では一般にスクリーンマスク（図示せず
）が用いられるが、透孔５の部分に半田ペースト３が確
実に入り込むようにスクリーンマスクには適切な開口部
を設けておく。また、部品２の配置やり７０−炉の加熱
源４の位置等を適切に選定し、１１７０−炉を通す際に
熱が透孔５内の半田ペースト３に直接前わるようにして
おくのである。Note that the board 1 in FIG. 1(c) is reversed and the solder paste 3 is
A screen mask (not shown) is generally used in the process of applying the solder paste 3, and the screen mask is provided with appropriate openings so that the solder paste 3 can reliably enter the through holes 5. In addition, the arrangement of the parts 2 and the position of the heating source 4 of the furnace 70 are appropriately selected so that the heat directly reaches the solder paste 3 in the through hole 5 when passing through the furnace 1170. .
このように、リフロー炉を通して半田ペースト３を溶融
する工程は１回であるから、従来の方法のように同種の
工程を２回繰り返す必要がなく、しかも２回加熱する場
合のようにプリント配線板の冷却を待つ必要もないので
、工程を簡略化し、所要時間を短縮することが可能とな
る。また最初に仮固定された部品の加熱力引回で済むの
で受ける熱ストレスが軽減され、従来上り耐熱性の低い
部品の使用が可能となるのである。In this way, since the process of melting the solder paste 3 through the reflow oven is done only once, there is no need to repeat the same process twice as in the conventional method. Since there is no need to wait for cooling, the process can be simplified and the required time can be shortened. In addition, since the heating force only needs to be routed to the parts that have been temporarily fixed in the first place, the thermal stress received is reduced, making it possible to use parts that conventionally have low upward heat resistance.
〈発明の効果〉
上述の実施例から明らかなように、この発明は、一方の
面に取り付けられるべき部品の端子電極の位置に透孔を
形成して部品を仮固定し、次いで他方の面を上向きにし
てこの面に取り付けられるべき部品の端子電極の位置と
上記透孔の部分にり７０−用半田を塗布して部品を所定
位置に載置した後、両面の各部品の半田付けを同時に行
うようにしたものである。<Effects of the Invention> As is clear from the above embodiments, the present invention temporarily fixes the component by forming a through hole at the position of the terminal electrode of the component to be attached to one surface, and then attaching the other surface. After applying 70-grade solder to the position of the terminal electrode and the above-mentioned through hole of the component to be attached to this side facing upward and placing the component in the specified position, solder each component on both sides at the same time. This is what I decided to do.
従って、半田のり７０−工程は１回で済むので部品の実
装工程の簡略化と所要時間の短縮ができ、また加熱力引
回で済むため部品が受ける熱ストレスが軽減され、従来
より耐熱性の低い部品の使用が可能となる。またこれら
の総合効果により製造コストが低減される。Therefore, the soldering process only needs to be performed once, which simplifies the component mounting process and shortens the required time.Also, since heating power is only needed to be routed, the thermal stress on the components is reduced, making it more heat resistant than before. It becomes possible to use low cost parts. Moreover, manufacturing costs are reduced due to these comprehensive effects.
第１図（ａ）乃至ｔＩＳ１図（ｅ）は、それぞれこの発
明の一実施例による部品実装工程の説明図、第２図（、
）乃至第２図（ｆ）は、それぞれ従来例による部品実装
工程の説明図である。
１・・・プリント配線板 、２・・・部品２ａ・・・端
子電極
、３・・・半田ベース
５・・・透孔
、６・・・接着剤FIG. 1(a) to tIS1(e) are explanatory diagrams of a component mounting process according to an embodiment of the present invention, and FIG.
) to FIG. 2(f) are explanatory diagrams of the component mounting process according to the conventional example, respectively. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Component 2a... Terminal electrode, 3... Solder base 5... Through hole, 6... Adhesive
Claims (1)
置に透孔を形成すると共に当該部品を所定位置に仮固定
する工程と、他方の面を上向きにし、この面に取り付け
られるべき部品の端子電極の位置と上記透孔の部分にリ
フロー用半田を塗布すると共に当該部品を所定位置に載
置する工程と、リフロー用半田を加熱溶融して両面の各
部品の半田付けを行う工程とからなることを特徴とする
両面プリント配線板への部品実装方法。1. A step of forming a through hole at the position of the terminal electrode of the component to be attached to one surface and temporarily fixing the component in a predetermined position, and a step of fixing the terminal electrode of the component to be attached to this surface with the other surface facing upward. The method consists of a step of applying reflow solder to the position and the above-mentioned through hole and placing the component in the predetermined position, and a step of heating and melting the reflow solder to solder each component on both sides. Features a method for mounting components on double-sided printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6792990A JPH03268386A (en) | 1990-03-16 | 1990-03-16 | Method of mounting component on double-sided printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6792990A JPH03268386A (en) | 1990-03-16 | 1990-03-16 | Method of mounting component on double-sided printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03268386A true JPH03268386A (en) | 1991-11-29 |
Family
ID=13359097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6792990A Pending JPH03268386A (en) | 1990-03-16 | 1990-03-16 | Method of mounting component on double-sided printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03268386A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| JP2016092321A (en) * | 2014-11-10 | 2016-05-23 | 日東電工株式会社 | Wiring circuit board and method of manufacturing the same, and wiring circuit board assembly and method of manufacturing the same |
| WO2016120449A1 (en) * | 2015-01-30 | 2016-08-04 | Valeo Comfort And Driving Assistance | Method for mounting a through-mounted electronic component on a printed circuit board |
-
1990
- 1990-03-16 JP JP6792990A patent/JPH03268386A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
| JP2016092321A (en) * | 2014-11-10 | 2016-05-23 | 日東電工株式会社 | Wiring circuit board and method of manufacturing the same, and wiring circuit board assembly and method of manufacturing the same |
| WO2016120449A1 (en) * | 2015-01-30 | 2016-08-04 | Valeo Comfort And Driving Assistance | Method for mounting a through-mounted electronic component on a printed circuit board |
| FR3032327A1 (en) * | 2015-01-30 | 2016-08-05 | Valeo Comfort & Driving Assistance | METHOD FOR MOUNTING AN ELECTRONIC COMPONENT CROSSING ON A PRINTED CIRCUIT BOARD |
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