JPH0662835B2 - Epoxy resin composition for laser printing - Google Patents
Epoxy resin composition for laser printingInfo
- Publication number
- JPH0662835B2 JPH0662835B2 JP2132645A JP13264590A JPH0662835B2 JP H0662835 B2 JPH0662835 B2 JP H0662835B2 JP 2132645 A JP2132645 A JP 2132645A JP 13264590 A JP13264590 A JP 13264590A JP H0662835 B2 JPH0662835 B2 JP H0662835B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- laser
- copper carbonate
- laser printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Epoxy Resins (AREA)
- Details Of Resistors (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気電子部品の絶縁被膜に用いられ、レーザ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーザー印字用エポキシ樹脂組成物に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is used for an insulating coating of an electric / electronic component, and an epoxy resin for laser printing capable of sharply printing the surface of the insulating coating by laser irradiation. It relates to a composition.
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化と目的としてより短時間で印字できる
方法が要求されている。Conventionally, a thermosetting ink or an ultraviolet curable ink has been used for printing on an electric / electronic component insulation-coated with an epoxy resin composition in order to clearly indicate its characteristics and model number. As a result, there is a demand for a method capable of printing in a shorter time.
この対応方法の1つとして、レーザーの照射による印字
システムが注目されている。このレーザー印字システム
は、文字やパターン状にレーザーを照射された部分が熱
エネルギーにより変色する、あるいは照射された部分が
昇華し表面粗化され、光の散乱によって文字やパターン
が識別できるものであり、この方法の印字時間は0.01秒
以下であり、従来の熱あるいは紫外線硬化性のインクが
硬化に数分〜数10分を必要とするのに比べ、大幅に短縮
されるものである。As one of the countermeasures against this, a printing system using laser irradiation is drawing attention. In this laser marking system, the part irradiated with laser in characters or patterns is discolored by heat energy, or the irradiated part is sublimated and surface roughened, and characters or patterns can be identified by scattering of light. The printing time of this method is 0.01 seconds or less, which is significantly shorter than the conventional heat-curable or UV-curable ink which requires several minutes to several tens of minutes for curing.
しかし、従来のエポキシ樹脂組成物の絶縁被覆にレーザ
ーを照射した場合、単に被覆表面を粗化するのみで、変
色がおこらず、鮮明な文字パターンを印字することがで
きなかった。However, when the insulating coating of the conventional epoxy resin composition is irradiated with a laser, the coating surface is simply roughened, discoloration does not occur, and a clear character pattern cannot be printed.
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄
を含有させるとレーザー照射によって黄色から褐色に変
色することが見い出された。(特開昭62−50360号公
報)。Recently, it has been found that when a conventional epoxy resin composition contains yellow ferric hydroxide, the color changes from yellow to brown by laser irradiation. (JP 62-50360).
しかし、水酸化第二鉄は黄色であるため、黄、橙色のよ
うな色相にしか用いることができず、青や緑色の下地、
特に淡色系の下地に黒色のレーザー印字を施すことが、
これからの課題とされてきた。However, since ferric hydroxide is yellow, it can be used only for hues such as yellow and orange, and a blue or green substrate,
Especially, it is possible to apply black laser printing on a light-colored base,
It has been regarded as a future issue.
本発明は、従来不可能であった青や緑の明色からレーザ
ーにより黒色に変色する樹脂組成物を得んとして鋭意検
討した結果、炭酸銅を含有させるとレーザーを照射した
際淡青色から黒色に変色することを見出し、更にこの知
見に基づき種々研究を進めて本発明を完成するに至った
ものである。The present invention, as a result of earnestly studying to obtain a resin composition that changes from a blue or green bright color to a black color by a laser, which has been impossible in the past, as a result, when copper carbonate was contained, a light blue to a black color was obtained when irradiated with a laser. It was found that the present invention was discolored, and based on this finding, various researches were conducted to complete the present invention.
本発明の目的とするところは電気的特性および他の諸特
性を低下させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供することにある。An object of the present invention is to provide an epoxy resin composition which gives a cured product capable of sharply marking a resin surface by laser irradiation without deteriorating electrical properties and other properties. is there.
本発明は、炭酸銅を含有することを特徴とするレーザー
印字用エポキシ樹脂組成物に関するものである。The present invention relates to an epoxy resin composition for laser printing, which contains copper carbonate.
本発明のエポキシ樹脂組成物に炭酸銅を用いる理由を以
下述べる。The reason why copper carbonate is used in the epoxy resin composition of the present invention will be described below.
炭酸銅は淡緑色の粉末であり、加熱すると300〜400℃で
脱炭酸し酸化銅(II)に変化し、黒色となる。Copper carbonate is a light green powder, and when heated, it is decarbonated at 300 to 400 ℃ and changes to copper (II) oxide, which turns black.
従って、炭酸銅を含有したエポキシ樹脂組成物に対し文
字やパターン状にレーザーを照射すると、樹脂表面がレ
ーザーの熱エネルギーにより加熱され、樹脂中に含有さ
れた炭酸銅が上記化学反応を生じ黒色となる。すなわち
レーザーに照射された部分のみ黒色となり、照射されな
い部分は淡緑色のままのため、淡緑色の下地に黒色の文
字やパターンを鮮明に印字することができる。Therefore, when the epoxy resin composition containing copper carbonate is irradiated with a laser in a letter or pattern, the resin surface is heated by the thermal energy of the laser, and the copper carbonate contained in the resin causes the above chemical reaction to turn black. Become. That is, only the portion irradiated by the laser becomes black, and the non-irradiated portion remains light green, so that black characters or patterns can be clearly printed on the light green substrate.
本発明に用いられる炭酸銅の粒度は平均粒径が100μm
以下であることが好ましい。その理由はエポキシ樹脂組
成物に炭酸銅を混合分散させた際、100μm以上の平均
粒径では電子電気部品に被覆させた際表面に斑点状とな
り、部品の商品価値を低下させるばかりでなく、分散が
不充分となりやすく、レーザーが照射された際、炭酸銅
が存在しない部分では変色がおこらず、文字やパターン
がとぎれ鮮明な印字ができなくなる場合がある。The average particle size of the copper carbonate used in the present invention is 100 μm.
The following is preferable. The reason for this is that when copper carbonate is mixed and dispersed in an epoxy resin composition, an average particle size of 100 μm or more causes spots on the surface when it is coated on electronic and electrical components, which not only reduces the commercial value of the component but also disperses it. Is likely to be insufficient, and when irradiated with laser, discoloration does not occur in a portion where copper carbonate does not exist, and characters or patterns may be interrupted to make clear printing impossible.
なお、この平均粒径はコールターカウンター(日科機
(株)製)により得られる粒度分布を重量平均することに
より求めるのが適当であるが、コールターカウンター以
外の測定方法により求めてもよい。In addition, this average particle size
It is appropriate to obtain the particle size distribution by a weight average of the particle size distribution obtained by Co., Ltd., but it may be obtained by a measuring method other than the Coulter counter.
炭酸銅の含有量としては0.5〜20重量%が好ましい。こ
の理由としては、含有量が0.5重量%以下では、レーザ
ーが照射されても変色する度合が小さく鮮明な印字とな
らず、一方、20重量%を越えると、樹脂組成物の電気絶
縁性が低下し電子電気部品用絶縁材料としての本来の性
能を満足しにくくなるためである。The content of copper carbonate is preferably 0.5 to 20% by weight. The reason for this is that if the content is 0.5% by weight or less, the degree of discoloration even when irradiated with laser is small and clear printing cannot be performed, while if it exceeds 20% by weight, the electrical insulation of the resin composition deteriorates. This is because it is difficult to satisfy the original performance as an insulating material for electronic and electrical parts.
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールA型エポキシ樹脂、ビスフェノールF型エポ
キシ樹脂等のジグリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、クレゾールノボラ
ック型エポキシ樹脂等のノボラック型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、複素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられる
が、これらに限定されるものではない。Examples of the epoxy resin used in the present invention include diglycidyl ether type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, phenol novolac type epoxy resins, novolac type epoxy resins such as cresol novolac type epoxy resins, and glycidyl. Examples thereof include ester type epoxy resins, glycidyl amine type epoxy resins, linear aliphatic type epoxy resins, heterocyclic type epoxy resins, halogenated epoxy resins, and the like, but are not limited thereto.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ポリアミン、ノボラック型フェノール樹脂、
第3級アミン、イミダゾール化合物等があるが、いずれ
を用いてもよい。又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルミナ粉末
等を配合してもよい。As the curing agent and curing accelerator used in the present invention,
Acid anhydride, polyamine, novolac type phenol resin,
There are tertiary amines, imidazole compounds and the like, but any of them may be used. If necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alumina powder, and alumina powder may be added. .
本発明により得られる樹脂組成物は炭酸銅の色調により
通常淡緑色を呈するが、赤、青、緑、黒、白色等の顔料
を併用してもよい。The resin composition obtained according to the present invention usually exhibits a light green color depending on the color tone of copper carbonate, but pigments such as red, blue, green, black and white may be used together.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等のいずれの状態でも
よい。The resin composition of the present invention may be in a liquid state such as a casting material, a powder state such as a powder coating material, a granular state such as a molding material or a lump state.
本発明の樹脂組成物を製造する方法として、例えば粉体
塗料の場合をあげると、所定の割合で秤量した原料成分
をミキサーによって充分混合したのち、エキストルーダ
ー、コニーダーあるいはロール等で溶融混練し、次いで
粉砕機にて粉砕する方法等がある。上記方法により得ら
れた粉体塗料により電子電気部品の絶縁被覆を行う方法
としては、流動浸漬法、静電流動浸漬法、ころがし法、
ふりかけ法、ホットスプレー法、静電スプレー法等一般
の粉体塗装方法が用いられる。As a method for producing the resin composition of the present invention, for example, in the case of powder coating, after thoroughly mixing the raw material components weighed at a predetermined ratio with a mixer, melt kneading with an extruder, a co-kneader or a roll, Then, there is a method of crushing with a crusher. As a method for performing insulation coating of electronic and electrical parts with the powder coating obtained by the above method, a fluidized immersion method, an electrostatic fluidized immersion method, a rolling method,
A general powder coating method such as a sprinkling method, a hot spray method, or an electrostatic spray method is used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。Also, in the case of a casting material or a molding material, it can be manufactured by a known technique and can be used as an insulating material.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be described in more detail with reference to examples.
実施例1 ビスフェノールA型エポキシ樹脂 (エポキシ当量950) 50重量部 炭酸銅(平均粒径10μm) 5重量部 結晶シリカ粉末 50重量部 2メチルイミダゾール 1重量部 上記組成物を配合し、ヘンシェルミキサーでブレンド
し、コニーダーにて溶融混練した後、粉砕機で粉砕する
ことにより平均粒径60〜70μmのエポキシ樹脂組成物の
粉体塗料を得た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent 950) 50 parts by weight Copper carbonate (average particle size 10 μm) 5 parts by weight Crystalline silica powder 50 parts by weight 2 Methylimidazole 1 part by weight The above composition was blended and blended with a Henschel mixer. Then, after melt-kneading with a cokneader, it was pulverized with a pulverizer to obtain a powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm.
実施例2 実施例1において、炭酸銅の添加量を20重量部に替え、
他は同様にして平均粒径60〜70μmのエポキシ樹脂組成
物の粉体塗料を得た。Example 2 In Example 1, the amount of copper carbonate added was changed to 20 parts by weight,
Otherwise in the same manner, a powder coating material of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained.
比較例1 実施例1において、炭酸銅の添加量を0.1重量部に替
え、他は同様にして平均粒径60〜70μmのエポキシ樹脂
組成物の粉体塗料を得た。Comparative Example 1 A powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm was obtained in the same manner as in Example 1, except that the addition amount of copper carbonate was changed to 0.1 part by weight.
比較例2 実施例1において、炭酸銅の添加量を50重量部に替え、
他は同様にして平均粒径60〜70μmのエポキシ樹脂組成
物の粉体塗料を得た。Comparative Example 2 In Example 1, the amount of copper carbonate added was changed to 50 parts by weight,
Otherwise in the same manner, a powder coating material of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained.
実施例1、2及び比較例1、2の樹脂組成物について硬
化物を作製した。Cured products were prepared from the resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2.
この試料に炭酸ガスレーザー(ウシオ電機(株)製400型
レーザーマークエネルギー密度6Joule/cm2)を用い
て、100万分の1秒間所定のマスクを通してレーザーを
照射して、硬化物の表面にマーキングを施した。A carbon dioxide laser (400 type laser mark energy density 6 Joule / cm 2 manufactured by Ushio Inc.) was applied to this sample with a laser through a predetermined mask for 1 millionth of a second to mark the surface of the cured product. gave.
また、上記硬化物の絶縁被覆電圧をJISK6911により測定
した。結果を表−1に示す。The insulation coating voltage of the cured product was measured according to JIS K6911. The results are shown in Table-1.
〔発明の効果〕 本発明のレーザー印字用エポキシ樹脂組成物を絶縁被覆
材として用いた場合、電気的特性および他の特性を低下
させることなく、レーザーの照射により樹脂表面に鮮明
な印字を施すことのできる被覆を与えることができる。
従って、従来より非常に短時間で印字できるため、電気
電子部品の生産工程の合理化をはかることができる。 [Effects of the Invention] When the laser-printing epoxy resin composition of the present invention is used as an insulating coating material, it is possible to perform clear printing on the resin surface by laser irradiation without deteriorating electrical characteristics and other characteristics. It is possible to provide a coating capable of
Therefore, since printing can be performed in a much shorter time than in the past, the production process of electric and electronic parts can be rationalized.
Claims (3)
るエポキシ樹脂組成物において、炭酸銅を含有すること
を特徴とするレーザー印字用エポキシ樹脂組成物。1. An epoxy resin composition for laser printing, which comprises an epoxy resin, a curing agent, a filler, and the like, and contains copper carbonate.
とを特徴とする請求項1記載のレーザー印字用エポキシ
樹脂組成物。2. The epoxy resin composition for laser printing according to claim 1, wherein the average particle size of copper carbonate is 100 μm or less.
有することを特徴とする請求項1又は2記載のレーザー
印字用エポキシ樹脂組成物。3. The epoxy resin composition for laser printing according to claim 1, which contains 0.5 to 20% by weight of copper carbonate with respect to the composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2132645A JPH0662835B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition for laser printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2132645A JPH0662835B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition for laser printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0428756A JPH0428756A (en) | 1992-01-31 |
JPH0662835B2 true JPH0662835B2 (en) | 1994-08-17 |
Family
ID=15086169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2132645A Expired - Lifetime JPH0662835B2 (en) | 1990-05-24 | 1990-05-24 | Epoxy resin composition for laser printing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0662835B2 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5223142A (en) * | 1975-08-15 | 1977-02-21 | Showa Electric Wire & Cable Co Ltd | Sulfur shielding composition |
JPS63179921A (en) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | Sealing resin composition and resin-sealed type semiconductor device using said composition |
JPS63295667A (en) * | 1987-05-27 | 1988-12-02 | Showa Electric Wire & Cable Co Ltd | Transparent electroconductive resin composition |
-
1990
- 1990-05-24 JP JP2132645A patent/JPH0662835B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0428756A (en) | 1992-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0618987B2 (en) | Epoxy resin composition for laser printing | |
JPS6250360A (en) | Epoxy resin composition suitable for use in laser-beam printing | |
JP2834540B2 (en) | Epoxy resin composition suitable for laser printing | |
JPH0618990B2 (en) | Epoxy resin composition for laser printing | |
JP2740616B2 (en) | Epoxy resin composition suitable for laser printing | |
JP2740617B2 (en) | Epoxy resin composition suitable for laser printing | |
JPH0662835B2 (en) | Epoxy resin composition for laser printing | |
JPH0618988B2 (en) | Epoxy resin composition for laser printing | |
JP2740615B2 (en) | Epoxy resin composition suitable for laser printing | |
JP2600029B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
JPH0618989B2 (en) | Epoxy resin composition for laser printing | |
JPH0647647B2 (en) | Epoxy resin composition for laser printing | |
JP2882851B2 (en) | Epoxy resin composition for laser marking | |
JPH0618991B2 (en) | Epoxy resin composition for laser printing | |
JPH0647646B2 (en) | Epoxy resin composition for laser printing | |
JP2600033B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
JPH068380B2 (en) | Epoxy resin composition suitable for carbon dioxide laser printing | |
JPH06305258A (en) | Epoxy resin composition suitable for laser printing | |
JPH0428757A (en) | Epoxy resin composition suitable for laser printing | |
JPH0583582B2 (en) | ||
JPH0575783B2 (en) | ||
JP2600033C (en) | ||
JP3389073B2 (en) | Epoxy resin composition for laser marking | |
JPH0575784B2 (en) | ||
JPH0625513A (en) | Epoxy resin composition excellent in thermal discoloration resistance and used for sealing electronic part |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080817 Year of fee payment: 14 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090817 Year of fee payment: 15 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100817 Year of fee payment: 16 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100817 Year of fee payment: 16 |