JPH0618991B2 - Epoxy resin composition for laser printing - Google Patents
Epoxy resin composition for laser printingInfo
- Publication number
- JPH0618991B2 JPH0618991B2 JP1193962A JP19396289A JPH0618991B2 JP H0618991 B2 JPH0618991 B2 JP H0618991B2 JP 1193962 A JP1193962 A JP 1193962A JP 19396289 A JP19396289 A JP 19396289A JP H0618991 B2 JPH0618991 B2 JP H0618991B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy resin
- laser
- silver acetate
- laser printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電気電子部品の絶縁被覆に用いられ、レーザ
ーの照射によりその絶縁被覆表面に鮮明な印字を施すこ
とのできるレーザー印字用エポキシ樹脂組成物に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is used for an insulating coating of electric and electronic parts, and an epoxy resin for laser printing capable of sharply printing on the surface of the insulating coating by laser irradiation. It relates to a composition.
従来、エポキシ樹脂組成物により絶縁被覆された電気電
子部品に特性や型番を明示するため印字をする際、熱硬
化性のインクや紫外線硬化性のインクが用いられている
が、工程の合理化を目的としてより短時間で印字できる
方法が要求されている。Conventionally, a thermosetting ink or an ultraviolet curable ink is used for printing on an electric / electronic component insulating-coated with an epoxy resin composition in order to clearly indicate the characteristics and model number, but the purpose is to rationalize the process. As a result, there is a demand for a method capable of printing in a shorter time.
この対応方法の１つとして、レーザーの照射による印字
システムが注目されている。このレーザー印字システム
は、文字やパターン状にレーザーを照射された部分が熱
エネルギーにより変色する、あるいは照射された部分が
昇華し表面粗化され、光の散乱によって文字やパターン
が識別できるものであり、この方法の印字時間は０．０
１秒以下であり、従来の熱あるいは紫外線硬化性のイン
クが硬化に数分〜数１０分を必要とするのに比べ、大幅
に短縮されるものである。As one of the countermeasures against this, a printing system using laser irradiation is drawing attention. In this laser marking system, the part irradiated with laser in characters or patterns is discolored by heat energy, or the irradiated part is sublimated and surface roughened, and characters or patterns can be identified by scattering of light. , The printing time of this method is 0.0
The time is 1 second or less, which is significantly shorter than the conventional heat-curable or ultraviolet-curable ink which requires several minutes to several tens of minutes for curing.
しかし、従来のエポキシ樹脂組成物の絶縁被覆にレーザ
ーを照射した場合、単に被覆表面を粗化するのみで、変
色がおこらず、鮮明な文字やパターンを印字することが
できなかった。However, when the insulating coating of the conventional epoxy resin composition was irradiated with a laser, the coating surface was simply roughened, discoloration did not occur, and clear characters or patterns could not be printed.
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄
を含有させると、レーザー照射によって黄色から褐色に
変色することが見い出された（特開昭62-50360号公
報）。Recently, it has been found that when a conventional epoxy resin composition contains yellow ferric hydroxide, the color is changed from yellow to brown by laser irradiation (JP-A-62-50360).
しかし、水酸化第二鉄は黄色であるため、黄、燈色のよ
うな色相にしか用いることができず、青や緑色の下地、
特に淡色系の下地に黒色のレーザー印字を施すことがこ
れからの課題とされてきた。However, since ferric hydroxide is yellow, it can be used only for hues such as yellow and orange, and blue or green substrates,
In particular, it has been an issue in the future to apply black laser printing to a light-colored base.
本発明は、従来不可能であった青や赤、緑等の明色から
レーザーにより黒色に変色する樹脂組成物を得んとして
鋭意検討した結果、酢酸銀を含有させるとレーザーを照
射した際無色から黒色に変色することを見出し、更にこ
の知見に基づき種々研究を進めて本発明に完成するに至
ったものである。The present invention has been intensively studied to obtain a resin composition in which a bright color such as blue, red, and green, which has been impossible in the past, is changed to black by a laser. The present invention has led to the completion of the present invention through various researches based on this finding.
本発明の目的とするところは電気的特性および他の諸特
性を低化させることなく、レーザーの照射により樹脂表
面に鮮明な印字を施すことのできる硬化物を与えるエポ
キシ樹脂組成物を提供することにある。It is an object of the present invention to provide an epoxy resin composition which gives a cured product capable of sharply marking a resin surface by laser irradiation without deteriorating electrical properties and other properties. It is in.
本発明は、酢酸銀を含有することを特徴とするレーザー
印字用エポキシ樹脂組成物に関するものである。The present invention relates to an epoxy resin composition for laser printing, which contains silver acetate.
本発明のエポキシ樹脂組成物に酢酸銀を用いる理由を以
下述べる。The reason why silver acetate is used in the epoxy resin composition of the present invention will be described below.
酢酸銀は無色の結晶であり、加熱すると１５０〜２５０
℃で脱酢酸し酸化銀（Ｉ）に変化し、黒色となる。Silver acetate is a colorless crystal, and when heated it is 150-250.
It is deacetic acid at ℃, it changes to silver oxide (I), and it becomes black.
従って、酢酸銀を含有したエポキシ樹脂組成物に対し文
字やパターン状にレーザーを照射すると、樹脂表面がレ
ーザーの熱エネルギーにより加熱され、樹脂中に含有さ
れた酢酸銀が上記化学反応を生じ黒色となる。すなわち
レーザーに照射された部分のみ黒色となり、照射されな
い部分は白色のままのため、白色の下地に黒色の文字や
パターンを鮮明に印字することができる。Accordingly, when the epoxy resin composition containing silver acetate is irradiated with a laser in a character or pattern, the resin surface is heated by the thermal energy of the laser, and the silver acetate contained in the resin causes the above chemical reaction to turn black. Become. That is, only the portion irradiated by the laser becomes black, and the non-irradiated portion remains white, so that black characters and patterns can be clearly printed on a white background.
本発明に用いられる酢酸銀の粒度は平均粒径が１００μ
ｍ以下であることが好ましい。その理由はエポキシ樹脂
組成物に酢酸銀を混合分散させた際、１００μｍ以上の
平均粒径では電子電気部品に被覆された際表面に斑点状
となり、部品の商品価値を低下させやすくなるばかりで
なく、分散が不充分となりやすく、レーザーが照射され
た際、酢酸銀が存在しない部分では変色がおこらず、文
字やパターンがとぎれ鮮明な印字ができない場合があ
る。The grain size of silver acetate used in the present invention has an average grain size of 100 μm.
It is preferably m or less. The reason for this is that when silver acetate is mixed and dispersed in an epoxy resin composition, when the average particle size is 100 μm or more, the surface of the product becomes speckled when coated with electronic and electrical parts, which not only tends to reduce the commercial value of the part. Dispersion is likely to be insufficient, and when irradiated with laser, discoloration does not occur in a portion where silver acetate does not exist, and characters or patterns may be interrupted to make clear printing impossible.
なお、この平均粒径はコールターカウンター（日科機
（株）製）により得られる粒度分布を重量平均すること
により求めるのが適当であるが、コールターカウンター
以外の測定方法により求めてもよい。The average particle size is appropriately determined by weight-averaging the particle size distribution obtained by a Coulter counter (manufactured by Nikkaki Co., Ltd.), but may be determined by a measuring method other than the Coulter counter.
酢酸銀の含有量としては０．５〜２０重量％が好まし
い。この理由は、含有量が０．５重量％以下では、レー
ザーが照射されても変色する度合が小さく鮮明な印字と
ならず、一方、２０重量％を越えると、樹脂組成物の電
気絶縁性が低下し電子電気部品用絶縁材料として本来の
性能を満足しにくくなるためである。The content of silver acetate is preferably 0.5 to 20% by weight. The reason for this is that if the content is 0.5 wt% or less, the degree of color change even when irradiated with laser is small and clear printing cannot be performed, while if it exceeds 20 wt%, the electrical insulating property of the resin composition is reduced. This is because it is difficult to satisfy the original performance as an insulating material for electronic and electrical parts.
本発明に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂等のジグリシジルエーテル型エポキシ樹脂、フ
ェノールノボラック型エポキシ樹脂、クレゾールノボラ
ック型エポキシ樹脂等のノボラック型エポキシ樹脂、グ
リシジルエステル型エポキシ樹脂、グリシジルアミン型
エポキシ樹脂、線状脂肪族型エポキシ樹脂、複素環型エ
ポキシ樹脂、ハロゲン化エポキシ樹脂等があげられる
が、これらに限定されるものではない。Examples of the epoxy resin used in the present invention include diglycidyl ether type epoxy resins such as bisphenol A type epoxy resins and bisphenol F type epoxy resins, phenol novolac type epoxy resins, novolac type epoxy resins such as cresol novolac type epoxy resins, and glycidyl. Examples thereof include ester type epoxy resins, glycidyl amine type epoxy resins, linear aliphatic type epoxy resins, heterocyclic type epoxy resins, halogenated epoxy resins, and the like, but are not limited thereto.
本発明に用いられる硬化剤および硬化促進剤としては、
酸無水物、ポリアミン、ノボラック型フェノール樹脂、
第３級アミン、イミダゾール化合物等があるが、いずれ
を用いてもよい。又必要により公知の無機充填剤、たと
えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶融
シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケ
イ酸カルシウム粉末、水和アルミナ粉末、アルミナ粉末
等を配合してもよい。As the curing agent and curing accelerator used in the present invention,
Acid anhydride, polyamine, novolac type phenol resin,
There are tertiary amines, imidazole compounds and the like, but any of them may be used. If necessary, known inorganic fillers such as zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder, hydrated alumina powder, and alumina powder may be added. .
本発明により得られる樹脂組成物は酢酸銀の色調により
通常白色を呈するため、赤、青、緑、黒色等の顔料を併
用できる。The resin composition obtained by the present invention usually exhibits white due to the color tone of silver acetate, and thus pigments such as red, blue, green and black can be used in combination.
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の
粉状、成型材料等の顆粒状、塊状等いずれの状態でもよ
い。The resin composition of the present invention may be in any state such as liquid such as casting material, powder such as powder coating material, granule such as molding material and lump.
本発明の樹脂組成物を製造する方法として、例えば粉体
塗料の場合をあげると、所定の割合で秤量した原料成分
をミキサーによって充分混合したのち、エクストルーダ
ー、コニーダーあるいはロール等で溶融混練し、次いで
粉砕機にて粉砕する方法等がある。上記方法により得ら
れた粉体塗料により電子電気部品の絶縁被覆を行う方法
としては、流動浸漬法、静電流動浸漬法、ころがし法、
ふりかけ法、ホットスプレー法、静電スプレー法等一般
の粉体塗装方法が用いられる。As a method for producing the resin composition of the present invention, for example, in the case of powder coating, after thoroughly mixing the raw material components weighed at a predetermined ratio with a mixer, melt-kneading with an extruder, a co-kneader or a roll, Then, there is a method of crushing with a crusher. As a method for performing insulation coating of electronic and electrical parts with the powder coating obtained by the above method, a fluidized immersion method, an electrostatic fluidized immersion method, a rolling method,
A general powder coating method such as a sprinkling method, a hot spray method, or an electrostatic spray method is used.
又、注型材料、成型材料の場合についても公知の技術で
製造でき、絶縁材料として使用できる。Also, in the case of a casting material or a molding material, it can be manufactured by a known technique and can be used as an insulating material.
次に本発明を実施例により更に詳しく説明する。 Next, the present invention will be described in more detail with reference to examples.
実施例１ ビスフェノールＡ型エポキシ樹脂 （エポキシ当量９５０） ５０重量部 酢酸銀 （平均粒型１７μｍ） ５ 〃 結晶シリカ粉末 ５０ 〃 ２メチルイミダゾール １ 〃 上記組成物を配合し、ヘンシェルミキサーでブレンド
し、コニーダーにて溶融混練した後、粉砕機で粉砕する
ことにより平均粒径６０〜７０μｍのエポキシ樹脂組成
物の粉体塗料を得た。Example 1 Bisphenol A type epoxy resin (epoxy equivalent 950) 50 parts by weight Silver acetate (average particle size 17 μm) 5 〃 crystalline silica powder 50 〃 2 methyl imidazole 1 〃 The above composition was blended and blended with a Henschel mixer, and a kneader After being melt-kneaded in, a powder coating of an epoxy resin composition having an average particle diameter of 60 to 70 μm was obtained by pulverizing with a pulverizer.
実施例 実施例１において、酢酸銀の添加量を２０重量部に替
え、他は同様にして平均粒径６〜７０μｍのエポキシ樹
脂組成物の粉体塗料を得た。Example A powder coating material of an epoxy resin composition having an average particle size of 6 to 70 μm was obtained in the same manner as in Example 1 except that the amount of silver acetate added was changed to 20 parts by weight.
比較例１ 実施例１において、酢酸銀の添加量を０．１重量部に替
え、他は同様にして平均粒径６０〜７０μｍのエポキシ
樹脂組成物の粉体塗料を得た。Comparative Example 1 A powder coating material of an epoxy resin composition having an average particle diameter of 60 to 70 μm was obtained in the same manner as in Example 1, except that the addition amount of silver acetate was changed to 0.1 part by weight.
比較例２ 実施例１において、酢酸銀の添加銀を５０重量部に替
え、他は同様にして平均粒径６０〜７０μｍのエポキシ
樹脂組成物の粉体塗料を得た。Comparative Example 2 A powder coating material of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as in Example 1, except that the amount of silver acetate added was changed to 50 parts by weight.
実施例１、２及び比較例１、２の樹脂組成物について硬
化物を作製した。Cured products were prepared from the resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2.
この試料に炭酸ガスレーザー（ウシオ電機（株）製４０
０型レーザーマーク、エネルギー密度６Joul／cm2を用
いて、１００万分の１秒間所定のマスクを通してレーザ
ーを照射して、硬化物の表面にマーキングを施した。Carbon dioxide gas laser (USHIO INC. 40
A 0 type laser mark and an energy density of 6 Joul / cm 2 were used to irradiate a laser through a predetermined mask for one millionth of a second to mark the surface of the cured product.
また、上記硬化物の絶縁破壊電圧をJISK6911により測定
した。結果を表−１に示す。The dielectric breakdown voltage of the cured product was measured according to JIS K6911. The results are shown in Table-1.
〔発明の効果〕 本発明のレーザー印字用エポキシ樹脂組成物を絶縁被覆
材として用いた場合、電気的特性および他の特性を低下
させることなく、レーザーの照射により樹脂表面に鮮明
な印字を施すことのできる被覆を与えることができる。
従って、従来より非常に短時間で印字できるため、電気
電子部品の生産工程の合理化をはかることができる。 [Effects of the Invention] When the laser-printing epoxy resin composition of the present invention is used as an insulating coating material, it is possible to perform clear printing on the resin surface by laser irradiation without deteriorating electrical characteristics and other characteristics. It is possible to provide a coating capable of
Therefore, since printing can be performed in a much shorter time than in the past, the production process of electric and electronic parts can be rationalized.
Claims (3)
るエポキシ樹脂組成物において、酢酸銀を含有すること
を特徴とするレーザー印字用エポキシ樹脂組成物。1. An epoxy resin composition for laser printing, which comprises an epoxy resin, a curing agent, a filler, and the like, and contains silver acetate.
ことを特徴とする請求項１記載のレーザー印字用エポキ
シ樹脂組成物。2. The epoxy resin composition for laser printing according to claim 1, wherein the average particle size of silver acetate is 100 μm or less.
％含有することを特徴とする請求項１又は２記載のレー
ザー印字用エポキシ樹脂組成物。3. The epoxy resin composition for laser printing according to claim 1, which contains 0.5 to 20% by weight of silver acetate based on the composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193962A JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1193962A JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0359065A JPH0359065A (en) | 1991-03-14 |
| JPH0618991B2 true JPH0618991B2 (en) | 1994-03-16 |
Family
ID=16316662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1193962A Expired - Lifetime JPH0618991B2 (en) | 1989-07-28 | 1989-07-28 | Epoxy resin composition for laser printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0618991B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649817B2 (en) * | 1986-07-09 | 1994-06-29 | 住友ベ−クライト株式会社 | Epoxy resin composition for semiconductor encapsulation |
-
1989
- 1989-07-28 JP JP1193962A patent/JPH0618991B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0359065A (en) | 1991-03-14 |
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