JP2600033C - - Google Patents
Info
- Publication number
- JP2600033C JP2600033C JP2600033C JP 2600033 C JP2600033 C JP 2600033C JP 2600033 C JP2600033 C JP 2600033C
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- copper
- laser
- oxalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- 239000000203 mixture Substances 0.000 claims description 21
- QYCVHILLJSYYBD-UHFFFAOYSA-L copper;oxalate Chemical compound [Cu+2].[O-]C(=O)C([O-])=O QYCVHILLJSYYBD-UHFFFAOYSA-L 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 11
- 239000011164 primary particle Substances 0.000 claims description 11
- 238000004040 coloring Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 238000007639 printing Methods 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 6
- 238000007648 laser printing Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229960003563 Calcium Carbonate Drugs 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000002542 deteriorative Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229960004887 ferric hydroxide Drugs 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- MSNWSDPPULHLDL-UHFFFAOYSA-K iron(3+);trihydroxide Chemical compound [OH-].[OH-].[OH-].[Fe+3] MSNWSDPPULHLDL-UHFFFAOYSA-K 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1H-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K Aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N Bis(4-hydroxyphenyl)methane Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- JHLNERQLKQQLRZ-UHFFFAOYSA-N Calcium silicate Chemical compound [Ca+2].[Ca+2].[O-][Si]([O-])([O-])[O-] JHLNERQLKQQLRZ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N Diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N Zirconium(IV) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- ZMMDPCMYTCRWFF-UHFFFAOYSA-J dicopper;carbonate;dihydroxide Chemical compound [OH-].[OH-].[Cu+2].[Cu+2].[O-]C([O-])=O ZMMDPCMYTCRWFF-UHFFFAOYSA-J 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- CQDTUBLRLRFEJX-UHFFFAOYSA-N tricopper;diborate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]B([O-])[O-].[O-]B([O-])[O-] CQDTUBLRLRFEJX-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- 229910052846 zircon Inorganic materials 0.000 description 1
Description
【発明の詳細な説明】
【0001】
【産業上の利用分野】
本発明は、電気電子部品の絶縁被覆に用いられ、炭酸ガスレーザー(以下、C
O2レーザーという)の照射によりその絶縁被覆表面に鮮明な印字を施すことの
できるCO2レーザー印字に適したエポキシ樹脂組成物に関するものである。
【0002】
【従来の技術】
従来、エポキシ樹脂組成物により絶縁被覆された電気電子部品に特性や型番を
明示するため印字をする際、熱硬化性のインクや紫外線硬化性のインクが用いら
れているが、工程の合理化を目的としてより短時間で印字できる方法が要求され
ている。
【0003】
この対応方法の1つのとして、レーザーの照射による印字システムが注目され
ている。このレーザー印字システムは、文字やパターン状にレーザーを照射され
た部分が熱エネルギーにより変色する、あるいは照射された部分が昇華し表面粗
化され、光の散乱によって文字やパターンが識別できるものであり、この方法の
印字時間は0.01秒以下であり、従来の熱あるいは紫外線硬化性のインクが硬化に
数分〜数10分を必要とするのに比べ、大幅に短縮されものである。
【0004】
しかし、従来のエポキシ樹脂組成物の絶縁被覆にレーザーを照射した場合、単
に被覆表面を粗化するのみで、変色がおこらず、鮮明な文字やパターンを印字す
ることができなかった。
【0005】
最近、従来のエポキシ樹脂組成物に黄色の水酸化第二鉄を含有させるとレーザ
ー照射によって黄色から褐色に変色することが見出された(特開昭62-50360号公
報)。
【0006】
水酸化第二鉄は黄色であるため、黄、橙色のような色相にしか用いることがで
きないが、塩基性炭酸銅や塩基性炭酸鉛等を用いることによって青や緑色の下地
、特に淡色系の下地に黒色のレーザー印字を施すことが可能になった。
【0007】
【発明が解決しようとする課題】
本発明は、より低エネルギーのCO2レーザー光で変色する樹脂組成物を得ん
として鋭意検討した結果、レーザー発色材として一次粒子の平均粒径が5μm以
下である微粒子のシュウ酸銅(II)を含有させると、従来、変色度の少なかった
低エネルギーのCO2レーザー光でも明瞭に変色させられることを見出し、更に
この知見に基づき種々研究を進めて本発明を完成するに至ったものである。
【0008】
本発明の目的とするところは電気的特性及び他の諸特性を低下させることなく
、低エネルギーのCO2レーザー光でも照射により樹脂表面に鮮明な印字を施す
ことのできる硬化物を与えるエポキシ樹脂組成物を提供することにある。
【0009】
【課題を解決するための手段】
本発明は、レーザー発色材として一次粒子の平均粒径が5μm以下である微粒
子のシュウ酸銅(II)を含有することを特徴とするCO2レーザー印字に適した
エポキシ樹脂組成物に関するものである。
【0010】
本発明のエポキシ樹脂組成物において、一次粒子の平均粒子径が5μm以下で ある微粒子のシュウ酸銅(II)を用いる理由を以下に述べる
。シュウ酸銅(II)
は淡青色の粉末であり、加熱すると200〜300℃で脱炭酸し酸化銅(II)に変化し
、黒色となる。
【0011】
従って、シュウ酸銅(II)を含有したエポキシ樹脂組成物に対し文字やパター
ン状にレーザーを照射すると、樹脂表面がレーザーの熱エネルギーにより加熱さ
れ、樹脂中に含有されたシュウ酸銅(II)が上記化学反応を生じ黒色となる。こ
の時、シュウ酸銅(II)が一次粒子の平均粒径5μm以下の微粒子として含有さ
れている場合、その分散性が向上するため、樹脂組成物中に均一にシュウ酸銅(
II)を分散させることができる。すなわち低エネルギーのCO2レーザー光でも
文字やパターンを鮮明に印字することができる。
【0012】
本発明に用いられるシュウ酸銅(II)の粒度は、一次粒子の平均粒径が5μm
以下であるが、好ましくは1μmである。その理由はエポキシ樹脂組成物にシュ
ウ酸銅(II)を混合分散させた際、一次粒子が5μm以上の平均粒径では電子電
気部品に被覆させた際表面に斑点状となり、部品の商品価値を低下させるばかり
でなく、分散が不充分となりやすくレーザーが照射された際、シュウ酸銅(II)
が存在しない部分では変色がおこらず、文字やパターンがとぎれ鮮明な印字がで
きなくなる場合がある。
なお、この平均粒径の測定法は特に限定されないが、電子顕微鏡などにより容
易に測定することができる。
【0013】
シュウ酸銅(II)の含有量は 0.5〜20重量%が好ましい。この理由は、含有量
が 0.5重量%以下では、レーザーが照射されても変色する度合が小さく鮮明な印
字となりにくい。一方、20重量%を越えると、樹脂組成物の電気絶縁性が低下し
、電子電気部品用絶縁材料としての本来の性能を満足しにくくなるためである。
【0014】
本発明に用いられるエポキシ樹脂としては、例えばビスフェノールA型エポキ
シ樹脂、ビスフェノールF型エポキシ樹脂等のジグリシジルエーテル型エポキシ
樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ
樹脂等のノボラック型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリ
シジルアミン型エポキシ樹脂、線状脂肪族型エポキシ樹脂、被素環型エポキシ樹
脂、ハロゲン化エポキシ樹脂等があげられるが、これらに限定されるものではな
い。
【0015】
本発明に用いられる硬化剤及び硬化促進剤としては、酸無水物、ポリアミン、
ノボラック型フェノール樹脂、第3級アミン、イミダゾール化合物等があるが、
いずれを用いてもよい。
【0016】
無機充填剤としては、例えばジルコン粉末、タルク粉末、結晶シリカ粉末、溶
融シリカ粉末、炭酸カルシウム粉末、マグネシア粉末、ケイ酸カルシウム粉末、
水和アルミナ粉末、アルミナ粉末等が挙げられる。かかる無機充填剤は平均粒径
が10μm以下のものがシュウ酸銅(II)の分散を良好にし鮮明な発色のために好
ましい。
【0017】
本発明により得られる樹脂組成物はシュウ酸銅(II)の色調により通常淡青色
を呈するが、赤、青、緑、黒、白色等の顔料を併用してもよい。
本発明の樹脂組成物は注型材料等の液状、粉体塗料等の粉状、成型材料等の顆
粒状、塊状等いずれの状態でもよい。
【0018】
本発明のエポキシ樹脂組成物を製造する方法として、例えば粉体塗料の場合を
あげると、所定の割合で秤量した原料成分をミキサーによって充分混合したのち
、エクストルーダー、コニーダーあるいはロール等で溶融混練し、次いで粉砕機
にて粉砕する方法等がある。上記方法により得られる粉体塗料により電子電気部
品の絶緑被覆を行う方法としては、流動浸漬法、静電流動浸漬法、ころがし法、
ふりかけ法、ホットスプレー法、静電スプレー法等、一般の粉体塗装方法が用い
られる。
【0019】
又、注型材料、成型材料の場合についても公知の技術で製造でき、絶縁材料と
して使用できる。
【0020】
【実施例】
次に本発明を実施例により更に詳しく説明する。
【0021】
実施例1
ビスフェノールA型エポキシ樹脂(エポキシ当量950) 50重量部
シュウ酸銅(II) (一次粒子の平均粒径0.8μm、平均粒径15μm)
5重量部
炭酸カルシウム粉末(平均粒径7μm) 50重量部
2−メチルイミダゾール 1重量部
上記組成物を配合し、ヘンシェルミキサーでブレンドし、コニーダーにて溶融
混練した後、粉砕機で粉砕することにより平均粒径60〜70μmのエポキシ樹脂組
成物の粉体塗料を得た。
【0022】
実施例2
実施例1において、発色材として一次粒子の平均粒径3μm、平均粒径15μm
のシュウ酸銅(II)を使用し、他は同様の方法にて平均粒径60〜70μmのエポキ
シ樹脂組成物の粉体塗料を得た。
【0023】
比較例1
実施例1において、発色材として一次粒子の平均粒径10μmのシュウ酸銅(II
)を使用し、他は同様の方法にて平均粒径60〜70μmのエポキシ樹脂組成物の粉
体塗料を得た。
【0024】
比較例2
実施例1において、発色材として一次粒子の平均粒径20μmのシュウ酸銅(II
)を使用し、他は同様の方法にて平均粒径60〜70μmのエポキシ樹脂組成物の粉
体
塗料を得た。
【0025】
実施例1、2及び比較例1、2の樹脂組成物について100℃で2時間硬化させ
た。この試料に炭酸ガスレーザー(ウシオ電機(株)製400型レーザーマーク、
エネルギー密度4Joule/cm2及び6Joule/cm2)を用いて、100万分の1秒間所定
のマスクを通してレーザーを照射して、硬化物の表面にマーキングを施した。
また、上記硬化物の絶縁被覆電圧をJIS K 6911により測定した。結果を表1に
示す。
【0026】
【表1】
【0027】
【発明の効果】
本発明のレーザー印字に適したエポキシ樹脂組成物を絶緑被覆材として用いた
場合、電気的特性及び他の特性を低下させることなく、低エネルギーのレーザー
の照射により樹脂表面に鮮明な印字を施すことのできる被覆を与えることができ
る。従って、従来より非常に短時間で印字できるため、電気電子部品の生産工程
の合理化をはかることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for insulating coating of electric and electronic parts, and uses a carbon dioxide laser (hereinafter referred to as C).
The present invention relates to an epoxy resin composition suitable for CO 2 laser printing, which is capable of providing clear printing on the surface of the insulating coating by irradiation with O 2 laser. 2. Description of the Related Art Conventionally, thermosetting inks and ultraviolet curable inks have been used for printing on electrical and electronic parts which are insulated and coated with an epoxy resin composition in order to specify characteristics and model numbers. However, a method capable of printing in a shorter time is required for the purpose of streamlining the process. [0003] As one of the methods for responding to this, a printing system using laser irradiation has attracted attention. In this laser printing system, the parts irradiated with laser in the form of letters or patterns are discolored by thermal energy, or the irradiated parts are sublimated and the surface is roughened, and letters and patterns can be identified by scattering of light. The printing time of this method is 0.01 second or less, which is much shorter than the conventional heat or ultraviolet curable ink which requires several minutes to several tens of minutes for curing. However, when a conventional insulating coating of an epoxy resin composition is irradiated with a laser, the coating surface is simply roughened, discoloration does not occur, and clear characters and patterns cannot be printed. [0005] Recently, it has been found that when a conventional epoxy resin composition contains yellow ferric hydroxide, the color changes from yellow to brown by laser irradiation (JP-A-62-50360). [0006] Since ferric hydroxide is yellow, it can be used only for hues such as yellow and orange. However, by using basic copper carbonate or basic lead carbonate, a blue or green base, particularly It became possible to apply black laser printing on a light-colored base. DISCLOSURE OF THE INVENTION The present invention has been studied as a result of obtaining a resin composition that changes color with a lower energy CO 2 laser beam. As a result, the average particle size of primary particles as a laser coloring material is reduced. 5 μm or less
It was found that the addition of the underlying fine particles of copper oxalate can clearly change the color even with a low-energy CO 2 laser beam, which had a low degree of color change. The present invention has been completed. An object of the present invention is to provide a cured product capable of giving a clear print on a resin surface by irradiation with low-energy CO 2 laser light without deteriorating electrical characteristics and other characteristics. An object of the present invention is to provide an epoxy resin composition. Means for Solving the Problems The present invention provides fine particles having an average primary particle size of 5 μm or less as a laser coloring material.
The present invention relates to an epoxy resin composition suitable for CO 2 laser printing, characterized by containing copper oxalate (II) . The reason why fine particles of copper (II) oxalate having an average primary particle size of 5 μm or less are used in the epoxy resin composition of the present invention will be described below . Copper (II) oxalate
Is a pale blue powder that, when heated, decarbonates at 200-300 ° C and changes to copper (II) oxide, turning black. Therefore, when a laser is irradiated in a letter or pattern on the epoxy resin composition containing copper (II) oxalate, the resin surface is heated by the thermal energy of the laser, and the copper oxalate contained in the resin is heated. (II) undergoes the above chemical reaction and turns black. At this time, when the copper (II) oxalate is contained as fine particles having an average primary particle size of 5 μm or less, the dispersibility is improved, so that the copper oxalate (H) is uniformly contained in the resin composition.
II) can be dispersed. That is, characters and patterns can be clearly printed even with low energy CO 2 laser light. [0012] The average particle size of the primary particles of the copper (II) oxalate used in the present invention is 5 μm.
It is as follows, but preferably 1 μm. Gerhard the reason the epoxy resin composition
When copper (II) borate is mixed and dispersed, when the primary particles have an average particle diameter of 5 μm or more, when coated on an electronic / electrical component, the surface becomes spot-like and not only reduces the commercial value of the component, but also disperses. Copper oxalate (II) when irradiated with laser easily
There is a case where discoloration does not occur in a portion where is not present, characters and patterns are cut off, and clear printing cannot be performed. The method for measuring the average particle size is not particularly limited, but can be easily measured with an electron microscope or the like. The content of copper (II) oxalate is preferably 0.5 to 20% by weight. The reason is that when the content is 0.5% by weight or less, the degree of discoloration is small even when irradiated with a laser, and it is difficult to obtain clear printing. On the other hand, when the content exceeds 20% by weight, the electrical insulation of the resin composition is reduced, and it is difficult to satisfy the original performance as an insulating material for electronic / electric parts. The epoxy resin used in the present invention is, for example, a diglycidyl ether type epoxy resin such as bisphenol A type epoxy resin and bisphenol F type epoxy resin, a phenol novolak type epoxy resin, and a novolak type epoxy resin such as cresol novolak type epoxy resin. Examples thereof include, but are not limited to, resins, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, linear aliphatic type epoxy resins, elementary ring type epoxy resins, and halogenated epoxy resins. The curing agent and the curing accelerator used in the present invention include acid anhydride, polyamine,
There are novolak type phenolic resins, tertiary amines, imidazole compounds, etc.
Either may be used. Examples of the inorganic filler include zircon powder, talc powder, crystalline silica powder, fused silica powder, calcium carbonate powder, magnesia powder, calcium silicate powder,
Examples include hydrated alumina powder and alumina powder. Such an inorganic filler having an average particle diameter of 10 μm or less is preferable for good dispersion of copper oxalate (II) and for vivid color formation. The resin composition obtained according to the present invention usually exhibits a light blue color depending on the color tone of copper oxalate (II), but a pigment such as red, blue, green, black or white may be used in combination. The resin composition of the present invention may be in any state such as a liquid state such as a casting material, a powder state such as a powder coating, a granular state such as a molding material, and a lump. As a method for producing the epoxy resin composition of the present invention, for example, in the case of a powder coating, a raw material component weighed at a predetermined ratio is sufficiently mixed by a mixer, and then mixed with an extruder, a co-kneader or a roll. There is a method of melt-kneading and then pulverizing with a pulverizer. As a method for performing the green coating of electronic and electrical components with the powder coating obtained by the above method, a fluid immersion method, an electrostatic fluid immersion method, a rolling method,
General powder coating methods such as sprinkling, hot spraying, and electrostatic spraying are used. Also, casting materials and molding materials can be manufactured by known techniques and used as insulating materials. Next, the present invention will be described in more detail with reference to examples. Example 1 Bisphenol A type epoxy resin (epoxy equivalent: 950) 50 parts by weight Copper (II) oxalate (average particle size of primary particles 0.8 μm, average particle size 15 μm) 5 parts by weight Calcium carbonate powder (average particle size) 7 μm) 50 parts by weight 2-methylimidazole 1 part by weight The above composition is blended, blended by a Henschel mixer, melt-kneaded by a co-kneader, and then pulverized by a pulverizer to obtain an epoxy resin composition having an average particle size of 60 to 70 μm. A powder coating was obtained. Example 2 In Example 1, the average particle size of the primary particles was 3 μm and the average particle size was 15 μm as the coloring material.
And a powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner except that copper (II) oxalate was used. Comparative Example 1 In Example 1, copper oxalate (II) having an average primary particle size of 10 μm was used as a coloring material.
), And a powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as described above. Comparative Example 2 In Example 1, copper (II) oxalate having an average primary particle diameter of 20 μm was used as a coloring material.
), And a powder coating of an epoxy resin composition having an average particle size of 60 to 70 μm was obtained in the same manner as described above. The resin compositions of Examples 1 and 2 and Comparative Examples 1 and 2 were cured at 100 ° C. for 2 hours. A carbon dioxide laser (Ushio Inc. 400 type laser mark,
Using an energy density of 4 Joule / cm 2 and 6 Joule / cm 2 ), the surface of the cured product was marked by irradiating a laser through a predetermined mask for 1 / 1,000,000 second. The insulation coating voltage of the cured product was measured according to JIS K 6911. Table 1 shows the results. [Table 1] When the epoxy resin composition suitable for laser printing according to the present invention is used as a green-green coating material, irradiation with a low-energy laser can be performed without deteriorating electrical characteristics and other characteristics. It is possible to provide a coating capable of giving a clear print on the resin surface. Therefore, since printing can be performed in a much shorter time than in the past, the production process of electric and electronic components can be rationalized.
Claims (1)
物において、レーザー発色材としてシュウ酸銅(II)を有し、該シュウ酸銅(II
)の一次粒子径の平均粒径が5μm以下であることを特徴とするエポキシ樹脂組
成物。 【請求項2】 シュウ酸銅(II)を組成物に対して0.5〜20重量部含有す
ることを特徴とする請求項1記載のエポキシ樹脂組成物。Claims: 1. An epoxy resin composition comprising an epoxy resin, a curing agent, a filler, and the like, comprising copper (II) oxalate as a laser coloring material, wherein the copper (II) oxalate is used.
The epoxy resin composition according to (1 ) , wherein the average primary particle diameter is 5 μm or less. 2. The epoxy resin composition according to claim 1, wherein copper (II) oxalate is contained in an amount of 0.5 to 20 parts by weight based on the composition.
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