JPH0639485Y2 - Electrical equipment - Google Patents
Electrical equipmentInfo
- Publication number
- JPH0639485Y2 JPH0639485Y2 JP19012686U JP19012686U JPH0639485Y2 JP H0639485 Y2 JPH0639485 Y2 JP H0639485Y2 JP 19012686 U JP19012686 U JP 19012686U JP 19012686 U JP19012686 U JP 19012686U JP H0639485 Y2 JPH0639485 Y2 JP H0639485Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- cover
- electric
- pattern
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【考案の詳細な説明】 〔考案の属する分野〕 本考案は磁気記録カメラ、銀塩カメラ等の映像機器、複
写機、電子計算機等の電子事務器又は通信機器等の電気
機器であって、電気・電子回路を有し、該回路を硬質の
電気回路配線基板（以下ハード基板と称する）や軟質の
電気回路配線基板（以下フレキシブルプリント回路基板
（E.P.C）と称する）上に構成して回路を形成し、該回
路を前記電気機器に組み込む電気実装に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a video recording device such as a magnetic recording camera and a silver salt camera, an electronic office device such as a copying machine and a computer, or an electric device such as a communication device. · Having an electronic circuit, the circuit is formed on a hard electric circuit wiring board (hereinafter referred to as a hard board) or a soft electric circuit wiring board (hereinafter referred to as a flexible printed circuit board (EPC)) to form a circuit. However, the present invention relates to an electrical mounting in which the circuit is incorporated into the electric device.
ビデオテープ・レコーダ用カメラ又は銀塩用カメラにお
いてカメラの露出制御の絞り機構、シヤツタ機構又はレ
ンズ機構の絞りやシヤツタ、レンズを駆動するために測
光回路、露出値演算回路、オートフオーカス回路等の各
回路を必要とし該各回路を構成するトランジスタ、抵
抗、コンデンサ、コイル、IC、LSI（集積回路）等にハ
ード基板、E.P.C上に設けた回路パターン上に半田付け
によって固定して各回路を形成する。For video tape recorder cameras or silver salt cameras, the aperture mechanism for exposure control of the camera, the aperture or shutter of the shutter mechanism or lens mechanism, the photometric circuit for driving the lens, the exposure value calculation circuit, the autofocus circuit, etc. Each circuit is formed by soldering it onto a circuit pattern provided on a hard substrate or EPC on a transistor, resistor, capacitor, coil, IC, LSI (integrated circuit), etc. that requires each circuit and forms each circuit. To do.
前述のカメラ内の電気実装において、カメラの一層の電
気制御化の傾向及びカメラ機能の高度化に合わせた電気
回路の回路素子の集積による複雑化にともない回路形成
のために機器内に回路基板が増え、機器のコンパクト化
及び機器組立の都合を良くするため、更には故障修理の
際の部品、ユニツト交換等の作業性向上のために電気実
装を要領良く整える必要が増している。In the electrical mounting in the camera described above, a circuit board is formed in the device for forming a circuit in accordance with the tendency of further electric control of the camera and the complication due to the integration of the circuit element of the electric circuit according to the sophistication of the camera function. In order to make the equipment compact and to facilitate the equipment assembly, and to improve the workability of parts and unit replacement at the time of trouble repair, it is necessary to properly arrange electrical mounting.
EPCはフレキシブル性故に、狭少空間に配置することは
可能であるがFPC上に前述回路部品を半田付け固定する
と一定の空間体積を必要とし、又、第１図に示すように
測光回路ブロツクB1と露出演算回路ブロツクB2を接続す
る回路部分B3をFPC3で形成するとFPC3のカメラ内の引き
廻しによる実装の複雑化を招くことになる等の問題を有
している。上述の問題はカメラの側にとどまらず電気機
器一般に云えることである。The EPC can be placed in a narrow space because of its flexibility, but a fixed space volume is required if the above-mentioned circuit components are soldered and fixed on the FPC, and as shown in Fig. 1, the photometric circuit block B1 If the circuit portion B3 connecting the exposure calculation circuit block B2 and the FPC3 is formed by the FPC3, the mounting of the FPC3 in the camera becomes complicated and the mounting becomes complicated. The above-mentioned problem is not limited to the side of the camera but applies to general electric equipment.
本考案は前述従来の電気機器における電気実装上の問題
を解決するためにハード基板又はFPC基板等の回路基板
を減少して実装形態を簡潔にスツキリとした形態にする
ことを提案課題とする。SUMMARY OF THE INVENTION The present invention proposes to reduce the number of circuit boards such as a hard board or an FPC board in order to solve the above-mentioned problems in electrical mounting in the conventional electrical equipment, and to make the mounting shape simple and sharp.
更に本考案の課題は前述の回路基板を減少する方法とし
て電気機器のボデイ、カバー又はボデイ内に固定される
中間体に直接端子パターンを配線し、例えば前述第１図
の例における回路ブロツクB1と回路ブロツクB2を継ぐコ
ネクター用の端子を直接機器のボデイ、カバー又は中間
体表面に直接配線し、これによりフレキシブル基板を削
減して実装形態をスツキリとすることを提案課題とす
る。A further object of the present invention is to directly connect a terminal pattern to a body, a cover, or an intermediate body fixed in the body of an electric device as a method of reducing the circuit board described above, for example, the circuit block B1 in the example shown in FIG. The proposed problem is to directly connect the terminal for the connector connecting the circuit block B2 to the surface of the body, the cover or the intermediate body of the device, thereby reducing the flexible substrate and making the mounting form smooth.
本考案は前記課題達成のためにボディ、カバー、又は、
前記ボディ、カバーに取り付けた中間体に樹脂材料で成
形した突起部を設け、前記突起部の表面に、前記ボデ
ィ、カバー、又は、中間体の成形時に同一金型によって
成形した、磁性粉を含有した端子パターンを有し、前記
端子パターンを形成した前記突起部に回路コネクターを
接続したことを特長とする電気機器を提案する。The present invention provides a body, a cover, or
A protrusion formed of a resin material is provided on the intermediate body attached to the body or the cover, and the surface of the protrusion contains magnetic powder formed by the same mold when the body, the cover, or the intermediate body is formed. The present invention proposes an electric device having a terminal pattern described above, wherein a circuit connector is connected to the protrusion having the terminal pattern.
第２図・第３図は本考案を適用した実施形態を示し、符
号１は電気機器のカバー、２はボデイ、ケースを示す。2 and 3 show an embodiment to which the present invention is applied, wherein reference numeral 1 is a cover of an electric device, 2 is a body, and a case.
1Aはカバー１の内側に形成した突起部を示し、B1は回路
基板で該回路基板B1上には第１の回路が構成されてい
る。B3は第１図示の符号B3に相当した回路パターンであ
り、該パターンB3の一方の端はカバー１の内側の平坦面
上に位置していて前記回路基板B1の不図示の回路パター
ンと圧接して電気的接続が保たれている。回路パターン
B3の他方は前記カバー内面の突起1Aの表面上を該突起の
根元から頂上端面に伸び、更に突起頂上から反対側の突
起根元に伸びて配線する。Reference numeral 1A denotes a protrusion formed inside the cover 1, and B1 denotes a circuit board on which a first circuit is formed. B3 is a circuit pattern corresponding to the reference numeral B3 in the first illustration, and one end of the pattern B3 is located on a flat surface inside the cover 1 and is in pressure contact with a circuit pattern (not shown) of the circuit board B1. Electrical connection is maintained. Circuit pattern
The other of B3 extends on the surface of the projection 1A on the inner surface of the cover from the root of the projection to the apex upper end surface, and further extends from the projection top to the root of the projection on the opposite side for wiring.
ボデイ２の符号2Aは突起部を示し、B2は第１図示の回路
ブロツクB2の回路基板を示す。B4はボデイ２の内側の表
面に配線した回路パターンを示し、パターンB4の一方の
端はボデイ表面の平坦面に位置して基板B2と圧接して基
板上の回路と電気接続する。パターンB4の他方の端は前
記突起部の根元から突起頂上端面に伸び、更に頂上端面
から突起の反対側の面の根元に伸びている。前記カバー
１の内側は第３図に斜視図に示すように形成される。突
起1Aの表・裏の垂直面には図示のようにパターンB3が配
線されており、該突起1A及びパターンB3にて回路接続の
ための雄側コネクターを形成する。Reference numeral 2A of the body 2 indicates a protrusion, and B2 indicates a circuit board of the circuit block B2 shown in the first illustration. B4 indicates a circuit pattern wired on the inner surface of the body 2. One end of the pattern B4 is located on the flat surface of the body surface and press-contacts with the substrate B2 to electrically connect to a circuit on the substrate. The other end of the pattern B4 extends from the root of the projection to the top top surface of the projection, and further extends from the top top surface to the root of the surface opposite to the projection. The inside of the cover 1 is formed as shown in a perspective view in FIG. A pattern B3 is wired on the front and back vertical surfaces of the protrusion 1A as shown in the drawing, and the protrusion 1A and the pattern B3 form a male connector for circuit connection.
第２図・第３図において回路コネクター３は前記のカバ
ー又はボデイの突起1Aと2Aと差し込み結合するように差
し込み口3A・3Bを有しコネクター３の各差し込み口にボ
デイ及びカバーを接続することによりカバー側の回路パ
ターンB3とボデイ側の回路パターンB4を電気接続するよ
うに構成する。In FIGS. 2 and 3, the circuit connector 3 has insertion openings 3A and 3B so as to be inserted and connected to the projections 1A and 2A of the cover or body, and the body and the cover should be connected to the respective insertion openings of the connector 3. Thus, the circuit pattern B3 on the cover side and the circuit pattern B4 on the body side are electrically connected.
次に第４図Ａ〜Ｅを参照して第１・２図示のカバー内側
へのパターンB3の配線の形成方法について述べる。Next, a method of forming the wiring of the pattern B3 inside the cover shown in FIGS. 1 and 2 will be described with reference to FIGS.
4A・4Bはそれぞれ固定型板と可動型板をそれぞれ示す。
固定型板4Aは磁性材料から作られた磁性部型板4a1と非
磁性材料から作られている非磁性部型板4a2・4a3から成
り、磁性部型板4a1の占める部分は第２図において回路
パターンB3を配線する部分である。可動型板4Bはパター
ンB3を形成する部分を占める磁性材料から作った磁性部
型板4b1と非磁性材料から作った非磁性部型板4b2・4b3か
ら成る。可動型板と固定型板には型板を閉じたときに前
記カバー１を形成するための空間−キヤビテイを設け
る。4A and 4B respectively show a fixed template and a movable template.
Fixed plate 4A is made of a nonmagnetic part mold plates 4a 2 · 4a 3 are made with the magnetic part mold plate 4a 1 made of a magnetic material from non-magnetic material, the portion occupied by the magnetic unit type plate 4a 1 Part In FIG. 2, it is a portion where the circuit pattern B3 is wired. Movable die plate 4B is made of a nonmagnetic part mold plate 4b 2 · 4b 3 made of a magnetic part mold plate 4b 1 and the non-magnetic material made of a magnetic material occupying the portion forming the pattern B3. The movable mold plate and the fixed mold plate are provided with a space-cavity for forming the cover 1 when the mold plate is closed.
５はマスク部材を示し、該マスク部材５は一方の型板4A
の非磁性部4a2・4a3の表面を遮蔽し、キヤビテイの回路
パターンB3を形成する必要のある個所のみが開口した開
口部5aを有しており、該マスク部材５は適宜の手段によ
って非磁性部4a2・4a3に固着する。Reference numeral 5 denotes a mask member, and the mask member 5 is one template 4A.
The non-magnetic parts 4a 2 and 4a 3 of the above have an opening 5a which shields the surface of the non-magnetic parts 4a 2 and 4a 3 and is opened only at the portion where the cavity circuit pattern B3 needs to be formed. Stick to the magnetic parts 4a 2 and 4a 3 .
型板4Aのキヤビテイ内面にマスク部材５を固着した後に
第４図Ｂに示すように塗装器６によってマスク５を固定
した型板4Aのキヤビテイ内面に磁性粉体から成る回路パ
ターン材７を塗装する。After the mask member 5 is fixed to the inner surface of the mold 4A, the circuit pattern material 7 made of magnetic powder is applied to the inner surface of the mold 4A with the mask 5 fixed by the coating device 6 as shown in FIG. 4B. .
該回路パターン材７としては平均粒径２〜３μmmのニツ
ケル粉末を90重量％、アクリル樹脂粉末を10重量％の割
合の各粉末を加熱して溶融状態にして混合し、混合後冷
却したものを平均粒径30μmmに粉砕して粉体化して粉体
10とする。As the circuit pattern material 7, 90% by weight of nickel powder having an average particle diameter of 2 to 3 μmm and 10% by weight of acrylic resin powder are heated in a molten state to be mixed and mixed, and then cooled. Powder with an average particle size of 30 μmm
Set to 10.
前記粉体７の材料のニツケル粉末としてはインコ・リミ
テツド日本支社のタイプ255号を用い、アクリル樹脂粉
末としては大日本インキ化学工業社製フアインデイツク
A224Sを用いることができる。上述の粉体を塗装器６に
入れて粉体を−70Kvoltの電圧でマスク５の上から噴出
させると、第３図Ｂに示すように粉体７は負の電荷を帯
びて型板と粉体との間の静電力によって型板4Aのキヤビ
テイ内面に吸着する。粉体７の型板4Aへの塗装後前記マ
スク５を取り外すと、型板の磁気部4a、表面には粉体７
により回路パターンが形成されている。次に可動型板4B
を型閉じし励磁コイル11・11…に通電する。このコイル
通電により型板4Aの磁性部4a、型板4Bの磁性部4b、及び
粉体７の間に磁気回路が形成されて粉体７の型板への吸
着力が増強される。As the nickel powder of the material of the powder 7, Inco Limited Japan branch type No. 255 is used, and as the acrylic resin powder, Dainippon Ink and Chemicals, Inc.
A224S can be used. When the above powder is put into the coater 6 and the powder is jetted from above the mask 5 with a voltage of -70 Kvolt, the powder 7 is negatively charged as shown in FIG. It is attracted to the inner surface of the cavity of the template 4A by the electrostatic force between the body. When the mask 5 is removed after the powder 7 is coated on the template 4A, the powder 7 is present on the magnetic part 4a of the template.
Form a circuit pattern. Next, movable template 4B
Close the mold and energize the exciting coils 11. By energizing the coil, a magnetic circuit is formed between the magnetic portion 4a of the template 4A, the magnetic portion 4b of the template 4B, and the powder 7, and the attraction force of the powder 7 to the template is enhanced.
前記磁気回路の起磁力はコイル巻数346ターン（Ｔ）の
コイル11に60アンペア（Ａ）の電流を流した。As the magnetomotive force of the magnetic circuit, a current of 60 amperes (A) was applied to the coil 11 having 346 turns (T).
前記コイル通電後に不図示の射出シリンダーより200℃
の溶融ポリスチレン樹脂を340kg/cm2の圧力でキヤビテ
イ内に射出する。After the coil is energized, 200 ℃ from the injection cylinder (not shown)
The molten polystyrene resin of is injected into the cavity at a pressure of 340 kg / cm 2 .
キヤビテイ内に前記樹脂が前記圧力で注入される際前記
粉体７は前述の磁気力及び静電吸着力によって型板4Aの
磁性部4a1の所定位置に固着状態を保っており注入樹脂
は粉体７で形成される回路パターンを該樹脂で埋設する
様にキヤビテイ内を充填していく。When the resin is injected into the cavity at the pressure, the powder 7 is kept in a fixed state at the predetermined position of the magnetic portion 4a 1 of the template 4A by the magnetic force and the electrostatic attraction force, and the injected resin is powder. The interior of the cavity is filled so that the circuit pattern formed by the body 7 is embedded with the resin.
樹脂の射出終了後に冷却を行った後型開きして成形品の
カバー１を金型より取り出す。取り出したカバー１は第
４図Ｅに示すようにカバー１の突部1A及び突部1Aの側面
1A1、更に成形品の内面平坦部にかけて粉体10による回
路パターンB3が形成できる。After the completion of the injection of the resin, the resin is cooled, the mold is opened, and the cover 1 of the molded product is taken out from the mold. As shown in FIG. 4E, the cover 1 taken out is a side surface of the projection 1A and the projection 1A of the cover 1.
A circuit pattern B3 of the powder 10 can be formed on 1A 1 and further on the flat portion of the inner surface of the molded product.
第２図に示すボデイ２の成形及び配線も第４図Ａ乃至Ｅ
に示した成形装置と成形方法によってボデイの成形と同
時に同一金型を用いてボデイと回路パターンB4の一体成
形が可能となる。ボデイ２とカバー１の成形する上での
差異はボデイ及びカバーのそれぞれの形状の差異からく
るキヤビテイの空間形状の差であり、成形時の回路パタ
ーンB4又はB3の一体的配線の仕方は全く同じであるので
ボデイ２の成形の装置及び方法の説明は略す。The molding and wiring of the body 2 shown in FIG. 2 are also shown in FIGS.
With the molding apparatus and the molding method shown in FIG. 1, it is possible to mold the body and the circuit pattern B4 integrally using the same mold at the same time as molding the body. The difference in molding between the body 2 and the cover 1 is the difference in space shape of the cavity due to the difference in shape between the body and the cover, and the way of integrally wiring the circuit pattern B4 or B3 during molding is exactly the same. Therefore, the description of the apparatus and method for molding the body 2 is omitted.
第４図Ａ乃至Ｅに示す方法に基づいて成形したカバー１
とボデイ２は各突起部1A・2Aの突起垂直表面の根元から
頂上端面及び頂上端面から根元にかけて第３図の斜視図
に示すように回路パターンB3・B4が同一金型内でカバー
及びボデイの成形と同時に一体的に成形される。それ故
コネクター３とカバー１とボデイ２の各突起部に挿入結
合すると回路B1と回路B2はカバー内側の配線B3、コネク
ター３、ボデイ内側の配線B4によって電気接続が行われ
る。Cover 1 molded according to the method shown in FIGS. 4A to 4E
As shown in the perspective view of FIG. 3, the circuit patterns B3 and B4 cover the body and the body in the same mold from the root of the projection vertical surface of each projection 1A and 2A to the top top surface and from the top top surface to the root. It is integrally molded at the same time as molding. Therefore, when the connector 3, the cover 1 and the body 2 are inserted and connected to each other, the circuits B1 and B2 are electrically connected by the wiring B3 inside the cover, the connector 3 and the wiring B4 inside the body.
第２図・３図の実施例においてはカバー１とボデイ２の
双方に突起部1A・2Aを形成し両者間をコネクター３によ
って接続した例を示したがボデイ２に突起部2Aを設け、
該突起部2Aに不図示の回路基板と電気接続したコネクタ
ーを差し込んで電気接続した実装とすることも可能であ
る。In the embodiment shown in FIGS. 2 and 3, the projections 1A and 2A are formed on both the cover 1 and the body 2 and the two are connected by the connector 3, but the projection 2A is provided on the body 2.
It is also possible to insert a connector, which is electrically connected to a circuit board (not shown), into the protrusion 2A so as to be electrically connected.
更に、カバー１やボデイ２の代りにカバー又はボデイに
固定し樹脂材料でできた中間体に該中間体の成形時に第
４図A-Eに示した方法により中間体とパターン配線を同
一金型内で一体的に成形するようにしてもよい。Further, instead of the cover 1 or the body 2, an intermediate body made of a resin material which is fixed to the cover or the body is molded with the intermediate body and the pattern wiring in the same mold by the method shown in FIG. You may make it integrally molded.
本考案に依れば電気回路を含む電気機器のボデイやカバ
ー、又は前記ボデイ、カバーに取り付けた中間体の内面
に突起部を設けて樹脂材料で成形し、前記突起部の突起
表面に磁性粉を含有した端子パターンを前記ボデイ、カ
バー、中間体の成形時に同一金型によって一体成形し、
前記端子パターンを形成した前記突起部に回路コネクタ
ーを接続するようにしたことにより従来必要であったフ
レキシブルプリント回路板を追放し、第２図に示すよう
にカバー１とボデイ２の間はスツキリとし、回路配線板
の束や折り返しによるゴチヤゴチヤした実装を追放する
ことができた。According to the present invention, a protrusion is provided on the inner surface of a body or a cover of an electric device including an electric circuit, or an intermediate body attached to the body or the cover, and the protrusion is formed with a resin material. A terminal pattern containing the above-mentioned body, cover, and the intermediate body are integrally molded by the same mold at the time of molding,
By connecting the circuit connector to the protrusion having the terminal pattern, the conventionally required flexible printed circuit board is banished, and as shown in FIG. 2, there is a sharp gap between the cover 1 and the body 2. , I was able to expel the rugged mounting by bundling and folding back the circuit wiring board.
本考案によればカバー１やボデイ２又は中間体（不図
示）の所定位置に突起部1A・2Aを成形し、該突起部にコ
ネクター３と接続する端子パターンB3・B4を成形するこ
とにより、コネクター３の挿入する位置が固定的に定ま
る。そのため電気機器の自動組立による電気実装の組立
も自動化が可能となるメリツトを有する。According to the present invention, the protrusions 1A and 2A are formed at predetermined positions of the cover 1, the body 2 or the intermediate body (not shown), and the terminal patterns B3 and B4 for connecting to the connector 3 are formed on the protrusions. The insertion position of the connector 3 is fixedly determined. Therefore, there is a merit that the assembly of electrical mounting by the automatic assembly of electric equipment can be automated.
第１図は本考案を適用する回路のブロツク図、 第２図は本考案を適用するカバー１とボデイ２及びコネ
クター３の断面図、 第３図はカバー１の内側の突起部1Aに端子パターンB3を
配線した状態を示す斜視図、 第４図Ａ〜Ｅは成形方法を説明する図であって、 第４図Ａは金型の要部断面図、 第４図Ｂは型板キヤビテイ面に端子パターンとなる粉体
を噴き付け付着する説明図、 第４図Ｃはマスク５を取り外した状態を示す図、 第４図Ｄは樹脂を射出する説明図、 第４図Ｅは第４図Ｄの装置からカバー１を取り出したカ
バーの断面図。 １……カバー、２……ボデイ、4a1・4a2……磁性材から
成る型板、4a2・4a3,4b2・4b3……非磁性材から成る型
板、５……マスク。FIG. 1 is a block diagram of a circuit to which the present invention is applied, FIG. 2 is a sectional view of a cover 1, a body 2 and a connector 3 to which the present invention is applied, and FIG. 3 is a terminal pattern on a protrusion 1A inside the cover 1. B3 is a perspective view showing a wiring state, FIGS. 4A to 4E are views for explaining the molding method, FIG. 4A is a cross-sectional view of a main part of the mold, and FIG. 4B is a mold plate cavity surface. Explanatory drawing of spraying and adhering powder to be a terminal pattern, FIG. 4C is a drawing showing a state in which the mask 5 is removed, FIG. 4D is an explanatory drawing of injecting resin, and FIG. 4E is FIG. 4D. FIG. 5 is a cross-sectional view of the cover in which the cover 1 is taken out from the device of FIG. 1 ... Cover, 2 ... Body, 4a 1・ 4a 2・ ・ ・ Template made of magnetic material, 4a 2・ 4a 3 , 4b 2・ 4b 3 ...... Template made of non-magnetic material, 5 ... Mask.
Claims (1)
して構成した電気回路を有した電子事務機又は通信機器
等の電気機器であって、 樹脂材料にて成形加工した前記電気機器の本体ボデイ、
又は、カバーと、 前記本体ボデイ、カバーの表面部分に形成した突起部
と、 前記突起部の表面に、前記本体ボデイ、カバーの成形時
に同一金型によって成形した磁性粉を含有した電気回路
端子パターンを有し、 前記電気回路端子パターンを形成した前記突起部に回路
コネクターを接続して前記電気部品、電気回路端子パタ
ーン、回路コネクター等により電気回路を形成したこと
を特徴とした電気機器。1. An electric device such as an electronic office machine or a communication device having an electric circuit formed by connecting electric and electronic parts by electric circuit wiring, wherein the main body of the electric device is formed by molding a resin material. Body,
Alternatively, a cover, the main body body, a protrusion formed on a surface portion of the cover, and an electric circuit terminal pattern containing magnetic powder formed on the surface of the protrusion by the same mold when the main body body and the cover are molded. An electric device comprising: an electric circuit formed by the electric component, the electric circuit terminal pattern, the circuit connector, etc. by connecting a circuit connector to the protrusion having the electric circuit terminal pattern.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19012686U JPH0639485Y2 (en) | 1986-12-10 | 1986-12-10 | Electrical equipment |
| US07/408,942 US4935174A (en) | 1986-01-13 | 1989-09-18 | Resin molded article bearing electric circuit patterns and process for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19012686U JPH0639485Y2 (en) | 1986-12-10 | 1986-12-10 | Electrical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6395279U JPS6395279U (en) | 1988-06-20 |
| JPH0639485Y2 true JPH0639485Y2 (en) | 1994-10-12 |
Family
ID=31143057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19012686U Expired - Lifetime JPH0639485Y2 (en) | 1986-01-13 | 1986-12-10 | Electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639485Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8952116B2 (en) | 2009-09-29 | 2015-02-10 | Nippon Shokubai Co., Ltd. | Particulate water absorbent and process for production thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001160185A (en) * | 1999-12-02 | 2001-06-12 | Atsumi Electric Co Ltd | Alarm device for electronic equipment |
-
1986
- 1986-12-10 JP JP19012686U patent/JPH0639485Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8952116B2 (en) | 2009-09-29 | 2015-02-10 | Nippon Shokubai Co., Ltd. | Particulate water absorbent and process for production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6395279U (en) | 1988-06-20 |
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