JPH0331093Y2 - - Google Patents
Info
- Publication number
- JPH0331093Y2 JPH0331093Y2 JP1986199906U JP19990686U JPH0331093Y2 JP H0331093 Y2 JPH0331093 Y2 JP H0331093Y2 JP 1986199906 U JP1986199906 U JP 1986199906U JP 19990686 U JP19990686 U JP 19990686U JP H0331093 Y2 JPH0331093 Y2 JP H0331093Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- magnetic
- circuit pattern
- resin
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 18
- 239000006247 magnetic powder Substances 0.000 claims description 17
- 230000005291 magnetic effect Effects 0.000 claims description 13
- 239000000696 magnetic material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 description 6
- 230000005284 excitation Effects 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009503 electrostatic coating Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- -1 silver halide Chemical class 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
〔考案の属する分野〕
本考案は磁気記録カメラ、銀塩カメラ等の映像
機器、複写機、電子計算機等の電子事務器又は通
信機器等の電気機器であつて、電気・電子回路を
有し、該回路を硬質の電気回路配線基板(以下ハ
ード基板と称する。)や軟質の電気回路配線基板
(以下FCBと称する。)上に構成して回路を形成
し、該回路を前記電気機器に組み込む電気実装に
関する。[Detailed description of the invention] [Field to which the invention pertains] The invention relates to electrical equipment such as video equipment such as magnetic recording cameras and silver halide cameras, electronic office equipment such as copying machines and computers, or communication equipment.・It has an electronic circuit, and the circuit is configured on a hard electric circuit wiring board (hereinafter referred to as a hard board) or a flexible electric circuit wiring board (hereinafter referred to as an FCB), and the circuit is The present invention relates to electrical packaging for incorporating into the electrical equipment.
ビデオテープレコーダ用カメラ又は銀塩用カメ
ラにおいて、カメラの露出制御の絞り機構、シヤ
ツタ機構又はレンズ機構の絞りやシヤツタ,レン
ズを駆動するために測光回路、露出値演算回路、
オートフオーカス回路等の各回路を必要とし、該
各回路を構成するトランジスタ、抵抗、コンデン
サ,コイル、IC,LSI(集積回路)等はハード基
板、FCB上に設けた回路パターン上に半田付け
によつて固定して各回路を形成する。
In a camera for a video tape recorder or a camera for silver halide, a photometric circuit, an exposure value calculation circuit, for driving the aperture, shutter, and lens of the camera's exposure control aperture mechanism, shutter mechanism, or lens mechanism;
Each circuit such as an autofocus circuit is required, and the transistors, resistors, capacitors, coils, ICs, LSIs (integrated circuits), etc. that make up each circuit are soldered onto the circuit pattern provided on the hard board or FCB. and fix it to form each circuit.
前述のカメラ内の電気実装において、カメラの
一層の電気制御化の傾向及びカメラ機能の高度化
に合せた電気回路の複雑化にともない回路形成の
ために機器内に回路基板が増え、機器のコンパク
ト化及び機器組立の都合を良くするため、更には
故障修理の際の部品、ユニツト交換等の作業性向
上のために電気実装を要領良く整える必要が増し
ている。
In the electrical packaging inside the camera mentioned above, as electric circuits become more complex due to the trend toward further electrical control of cameras and the sophistication of camera functions, the number of circuit boards inside the equipment increases to form circuits, and the equipment becomes more compact. There is an increasing need for electrical packaging to be arranged in a precise manner in order to make it easier to integrate and assemble equipment, as well as to improve the workability of replacing parts and units during breakdowns and repairs.
FCBはフレキシブル性故に狭少空間に配置す
ることは可能であるが、FCB上に前述の回路部
品を半田付け固定すると一定の空間体積を必要と
し、又、第1図に示すように測光回路ブロツクB
1と露出演算回路ブロツクB2を接続する回路部
分B3をFCBで形成するFCBのカメラ内の引き
廻しによる実装の複雑化を招くことになる等の問
題を有している。 Due to its flexibility, FCBs can be placed in narrow spaces; however, soldering and fixing the aforementioned circuit components onto FCBs requires a certain amount of space; B
The circuit portion B3 that connects the exposure calculation circuit block B2 to the exposure calculation circuit block B2 is formed of an FCB, and the wiring of the FCB within the camera complicates the implementation.
上述の問題はカメラの場合だけにとどまらず電
気機器一般に言えることである。 The above-mentioned problem is not limited to cameras, but applies to electrical equipment in general.
本考案は前述従来の電気機器における電気実装
上の問題を解決するためにハード基板又はFCB
基板等の回路基板を減少して実装形態を簡潔にス
ツキリとした形態にすることを提案課題とする。
更に本考案の課題は前述の回路基板を減少する方
法として電気機器のボデイ,カバー又はボデイ内
に固定される中間体に直接回路パターンを配線
し、例えば前述第1図に例における回路ブロツク
B1と回路ブロツクB2を継ぐ回路パターンB3
を機器のボデイ,カバー又は中間体表面に直接配
線し、これにより回路パターンB3の部分を削減
して実装形態をスツキリとすることを提案課題と
する。
This invention aims to solve the electrical mounting problems in the conventional electrical equipment mentioned above.
The proposed problem is to reduce the number of circuit boards such as circuit boards and make the mounting form simple and uncluttered.
A further object of the present invention is to wire a circuit pattern directly to the body, cover, or intermediate body fixed in the body of an electrical device as a method of reducing the number of circuit boards mentioned above. Circuit pattern B3 that connects circuit block B2
The proposed problem is to wire directly to the body, cover, or intermediate surface of the device, thereby reducing the portion of the circuit pattern B3 and making the mounting form neat.
更に本考案は樹脂成形体の隣り合う面にわたつ
て回路パターンを配線し、該回路パターンを設け
た各面に前述の各回路ブロツクの集積回路ICを
配置する回路構成を採用する場合の回路パターン
の好適な例を提案する。 Furthermore, the present invention provides a circuit pattern in which a circuit pattern is wired across adjacent surfaces of a resin molded body, and an integrated circuit IC of each of the aforementioned circuit blocks is arranged on each surface provided with the circuit pattern. We propose a suitable example.
電気回路を含む電気機器のボデイ、又はカバー
あるいは前記ボデイ・カバーに取り付ける中間体
を樹脂材料で成形して樹脂成形体と成し、
前記樹脂成形体の隣り合う面の陵線部分を円弧
状と成し、
前記隣り合う面及び円弧状部分に磁性粉を含有
した回路パターンを前記樹脂成形品の成形時に形
成することにより前述課題を達成するものであ
る。
A body or a cover of an electrical device including an electric circuit, or an intermediate body to be attached to the body/cover is molded from a resin material to form a resin molded body, and the ridge line portions of adjacent surfaces of the resin molded body are formed into an arc shape. The above object is achieved by forming a circuit pattern containing magnetic powder on the adjacent surfaces and the arc-shaped portion during molding of the resin molded product.
第1図は電気回路を有する電気機器のカバー,
ケース,ボデイ、又は中間体としての樹脂成形品
の一部の断面図を示す。
Figure 1 shows the cover of an electrical device with an electric circuit.
A cross-sectional view of a part of a case, a body, or a resin molded product as an intermediate body is shown.
図において100は前記成形品の一部断面部分
を示し、該成形品100の隣り合う面と面100
A,100Bの陵線部分100Cを或る曲率を持
つた曲面とし、平面100A,100B及び曲面
100Cに連続的に回路パターン200を形成
し、該回路パターン200の両端には第 図に示
した前述の回路ブロツクB1,B2を配置し、各
ブロツクB1,B2を回路パターン200によつ
て電気接続する。 In the figure, 100 indicates a partial cross section of the molded product, and adjacent surfaces of the molded product 100 and surfaces 100
The ridge line portions 100C of A and 100B are curved surfaces with a certain curvature, and a circuit pattern 200 is formed continuously on the flat surfaces 100A and 100B and the curved surface 100C, and the circuit pattern 200 has the above-mentioned marks shown in FIG. circuit blocks B1 and B2 are arranged, and each block B1 and B2 is electrically connected by a circuit pattern 200.
第2図は前記第1図示の樹脂成形品を成形する
ための成形装置の要部断面図を示し、第3図A,
B,C,D,Eは成形操作の説明図を示す。 FIG. 2 shows a sectional view of a main part of a molding apparatus for molding the resin molded product shown in FIG. 1, and FIG.
B, C, D, and E show explanatory diagrams of the molding operation.
第2図は成形機に金型4および励磁コイル3を
取り付けて構成した磁気回路を示す。金型4は可
動側型板5および固定側型板6で構成され、キヤ
ビテイ7の表面上でパターンとなる部分は例えば
炭素鋼などの磁性体5a,6aで、パターン以外
の部分は例えばSUS303、などの非磁性体5
b,6bで構成される。また成形機プラテン1、
成形機タイバー2はそれぞれ炭素鋼などの磁性体
により構成される。ここで励磁コイル3に通電す
ると磁力線12は図示矢印のように発生し、磁性
体5a,6aのキヤビテイ7の表面上で磁力を発
生し、磁性粉体9をキヤビテイ表面に吸引固着せ
しめることができる。 FIG. 2 shows a magnetic circuit constructed by attaching a mold 4 and an excitation coil 3 to a molding machine. The mold 4 is composed of a movable mold plate 5 and a fixed mold plate 6, and the patterned parts on the surface of the cavity 7 are made of magnetic materials 5a and 6a such as carbon steel, and the parts other than the pattern are made of SUS303, for example. Non-magnetic materials such as 5
Consisting of b and 6b. Also, molding machine platen 1,
The molding machine tie bars 2 are each made of a magnetic material such as carbon steel. When the excitation coil 3 is energized, magnetic lines of force 12 are generated as shown by the arrows in the figure, generating magnetic force on the surface of the cavity 7 of the magnetic bodies 5a and 6a, and the magnetic powder 9 can be attracted and fixed to the cavity surface. .
前述第2図の金型構造において樹脂成形品10
0を形作るキヤビテイ7を構成する型板5a,6
aの角部5a′,6a′は第1図に示すように各半径
R1・R2とする曲率を有した曲面とする。特に樹
脂成形品100の肉厚寸法tと半径R1・R2の関
係はR2−R1=tとすることにより本考案のより
好ましい結果となる。更に樹脂成形品の平面部1
00A,100Bの肉厚寸法も曲面部100Cの
肉厚寸法と同寸法にすると好ましい結果となる。 In the mold structure shown in FIG. 2 above, the resin molded product 10
Template plates 5a and 6 that constitute the cavity 7 that forms 0
The corners 5a' and 6a' of a have their respective radii as shown in Figure 1.
The curved surface has a curvature of R 1 and R 2 . In particular, the relationship between the wall thickness t of the resin molded product 100 and the radii R 1 and R 2 is set to R 2 −R 1 =t, thereby achieving a more preferable result of the present invention. Furthermore, the flat part 1 of the resin molded product
A preferable result can be obtained by making the wall thicknesses of 00A and 100B the same as the wall thickness of the curved surface portion 100C.
次に第3図AB乃至第3図Eにより、本考案の
実施例の製造工程を示す。 Next, FIGS. 3AB to 3E show the manufacturing process of the embodiment of the present invention.
まず第3図Aに示すように可動側型板5を開
き、非磁性体5bのキヤビテイ面上部分をマスク
8によりマスキングする。すなわちキヤビテイ面
上で磁性粉体9を付着させたい磁性体5a部分だ
けを露出させる。上記マスク8の材料は例えば金
属、ゴム,プラスチツクなどで適当な手段により
可動側型板5に固定する。 First, as shown in FIG. 3A, the movable mold plate 5 is opened, and the upper part of the cavity surface of the nonmagnetic material 5b is masked with the mask 8. That is, only the portion of the magnetic body 5a to which the magnetic powder 9 is to be attached is exposed on the cavity surface. The material of the mask 8 is, for example, metal, rubber, plastic, etc., and is fixed to the movable template 5 by suitable means.
次に、第3図Bに示すように静電塗装機10に
よつてキヤビテイ面露出部分およびマスク8面上
に磁性粉体9を塗装する。該磁性粉体9として
は、導電性を有する強磁性体でバインダ成分を含
むもので、例えば平均粒径2〜3μmのニツケル粉
末を90重量%、バインダ成分としてアクリル樹脂
粉末を10重量%の割合のものを、バインダ成分を
加熱して溶融状態にして混合し、その後冷却した
ものを平均粒径30μmに粉砕して粉体化したもの
がある。ここでニツケル粉末としてはインコリテ
ツド日本支社製のタイプ255を、アクリル樹脂
としては大日本インキ化学工業社製のフアインデ
イツクA224Sを用いることができる。上記磁
性粉体8を静電塗装機10により−70KVoltの電
圧で負に帯電させ、金型をアースして塗装すると
金型と粉体との間の静電気力によりキヤビテイ内
の磁性体5a部分およびマスク8表面に付着す
る。 Next, as shown in FIG. 3B, magnetic powder 9 is applied onto the exposed portion of the cavity surface and the surface of the mask 8 using the electrostatic coating machine 10. The magnetic powder 9 is a conductive ferromagnetic material containing a binder component, for example, 90% by weight of nickel powder with an average particle size of 2 to 3 μm and 10% by weight of acrylic resin powder as the binder component. In some cases, the binder components are heated to a molten state, mixed, and then cooled and pulverized to an average particle size of 30 μm. Here, as the nickel powder, Type 255 manufactured by Inc. Japan Branch can be used, and as the acrylic resin, Fine Dayc A224S manufactured by Dainippon Ink and Chemicals Co., Ltd. can be used. When the magnetic powder 8 is negatively charged with a voltage of -70KVolt by the electrostatic coating machine 10 and painted with the mold grounded, the electrostatic force between the mold and the powder causes the magnetic material 5a in the cavity and It adheres to the surface of the mask 8.
次にマスク8を可動側型板5からとりはずす
と、第3図Cに示すように磁性体5aのキヤビテ
イ7の表面上にのみ前記磁性粉体9によりパター
ンが形成される。 Next, when the mask 8 is removed from the movable mold plate 5, a pattern is formed by the magnetic powder 9 only on the surface of the cavity 7 of the magnetic body 5a, as shown in FIG. 3C.
次に第3図Dに示すように、金型4を閉じ、励
磁コイル3に通電する。これにより磁性体5aの
キヤビテイ7表面上では磁力が発生し、既に付着
している磁性粉体9を強力に吸引固着せしめてキ
ヤビテイ面に保持する。その後キヤビテイ内に樹
脂材料を注入すると、前記磁性粉体9は磁気力お
よび静電吸着力によりキヤビテイ内の所定位置に
固着保持されたまま、注入樹脂が磁性粉体を埋設
する様に充填される。さらにこのとき、磁性粉体
9に含まれる例えばアクリル樹脂などのバインダ
成分は注入樹脂11の高温高圧により溶融軟化さ
れ、注入樹脂の冷却固化と同時にバインダ成分も
固化し、バインダと成形品樹脂は非常に強い密着
力をもつようになる。 Next, as shown in FIG. 3D, the mold 4 is closed and the excitation coil 3 is energized. As a result, a magnetic force is generated on the surface of the cavity 7 of the magnetic body 5a, and the already attached magnetic powder 9 is strongly attracted and fixed to be held on the cavity surface. After that, when a resin material is injected into the cavity, the magnetic powder 9 is fixed and held at a predetermined position in the cavity by magnetic force and electrostatic adsorption force, and the injected resin is filled so as to embed the magnetic powder. . Furthermore, at this time, the binder component such as acrylic resin contained in the magnetic powder 9 is melted and softened by the high temperature and high pressure of the injected resin 11, and the binder component is also solidified at the same time as the injected resin is cooled and solidified, and the binder and molded product resin are extremely It has strong adhesion.
注入樹脂の冷却後、型開きして取り出した成形
品を第3図Eに示す。成形前に金型のキヤビテイ
7面上に形成された磁性粉体9によるパターン
は、注入樹脂11に埋設される様に成形品表面に
回路パターン13として転写される。 After cooling the injected resin, the mold was opened and the molded product taken out is shown in FIG. 3E. The pattern formed by the magnetic powder 9 on the surface of the cavity 7 of the mold before molding is transferred to the surface of the molded product as a circuit pattern 13 so as to be embedded in the injection resin 11.
ここでは例えば前記励磁コイル3にコイル巻数
346(ターン)、電流60(アンペア)の起磁
力を与えた後、射出シリンダーより200℃のポリ
スチレン樹脂を340Kg/cm2の圧力でキヤビテイ内
に射出充填したところ、前記磁性粉体が所定の位
置に転写され、表面抵抗値1.0Ω/□の回路パタ
ーン200をもつ成形品を得た。 Here, for example, after applying a magnetomotive force of 346 coil windings (turns) and a current of 60 (amperes) to the excitation coil 3, polystyrene resin at 200°C was injected into the cavity at a pressure of 340 kg/cm 2 from an injection cylinder. However, the magnetic powder was transferred to a predetermined position, and a molded article having a circuit pattern 200 with a surface resistance value of 1.0 Ω/□ was obtained.
上記の成形操作により樹脂成形品100と同時
に回路パターン200を形成することができる。
そして回路パターン200の各端部に第4図の各
回路ブロツクB1,B2の集積回路(IC)を接
続する。 By the above molding operation, the circuit pattern 200 can be formed simultaneously with the resin molded product 100.
Then, integrated circuits (ICs) of circuit blocks B1 and B2 shown in FIG. 4 are connected to each end of the circuit pattern 200.
以上の実施例では電気的回路を例にして説明し
たが、本発明はこれに限定されることなく、磁性
体のパターン形状や磁性体を変更することによ
り、成形品表面の装飾デザインなど表面の不均質
な樹脂成形品の製造に応用することができる。
Although the above embodiments have been explained using electrical circuits as an example, the present invention is not limited to this, and by changing the pattern shape of the magnetic material and the magnetic material, the surface of the molded product can be improved, such as decorative designs on the surface of the molded product. It can be applied to the production of heterogeneous resin molded products.
また、本発明は射出成形だけではなくRIM成
形、LIM成形、注型成形等の方法でもよい。 Further, the present invention is not limited to injection molding, and may be applied to methods such as RIM molding, LIM molding, and cast molding.
以上説明したように本考案によれば、磁性体と
非磁性体とを組み合わせた金型のキヤビテイ面に
静電塗装により磁性粉体を付着させてパターン形
状とし、磁力を用いながら成形することによつ
て、二次加工なしで樹脂成形品の凹凸表面に成形
と同時に回路を形成することが可能になるととも
に、成形品との密着性に優れた回路が形成できる
効果がある。
As explained above, according to the present invention, magnetic powder is attached to the cavity surface of a mold made of a combination of magnetic and non-magnetic materials by electrostatic coating to form a pattern shape, and molding is performed using magnetic force. Therefore, it is possible to form a circuit on the uneven surface of a resin molded product at the same time as molding without secondary processing, and there is an effect that a circuit with excellent adhesion to the molded product can be formed.
特に本考案は樹脂成形品の隣り合う平面に回路
ブロツクB1,B2を配置し該回路ブロツクB
1,B2を樹脂成形品と同時に成形配線した回路
パターン200で電気接続することにより従来の
フレキシブルプリント回路基板を排除することが
でき、電気機器の組立作業上のメリツトも生まれ
た。 In particular, the present invention arranges circuit blocks B1 and B2 on adjacent planes of a resin molded product.
By electrically connecting 1 and B2 with the circuit pattern 200 molded and wired at the same time as the resin molded product, the conventional flexible printed circuit board can be eliminated, and there are also advantages in the assembly work of electrical equipment.
更に本考案は樹脂成形品の隣り合う面(平面)
の陵線部分を曲面とすることにより陵線部分の磁
性粉の吸着不良を解消することができて、回路パ
ターン200部分の配線の信頼性を向上すること
ができた。 Furthermore, this invention can be applied to adjacent surfaces (planes) of resin molded products.
By making the ridge line portions curved, it was possible to solve the problem of poor adsorption of magnetic powder in the ridge line portions, and improve the reliability of the wiring in the circuit pattern 200 portion.
尚、本考案において樹脂成形品100の隣り合
う面100Aと100Bの陵線部分100Cを曲
面としたが陵線部分100を第5図に示すように
曲取り状態にして斜面部100′Cとするように
構成することもできる。 In the present invention, the ridge line portion 100C of the adjacent surfaces 100A and 100B of the resin molded product 100 is a curved surface, but the ridge line portion 100 is curved as shown in FIG. 5 to form a slope portion 100'C. It can also be configured as follows.
第1図は本考案に係る樹脂成形品の一部断面
図。第2図は金型の断面図。第3図A乃至第3図
Eは成形操作の説明図。第4図は回路構成の説明
図。第5図は他の例による樹脂成形品の一部断面
図。
1……成形機プラテン、2……成形機タイバ
ー、3……励磁コイル、4……金型、5……可動
側型板、6……固定側型板、5a,6a……磁性
体、5b,6b……非磁性体。
FIG. 1 is a partial sectional view of a resin molded product according to the present invention. Figure 2 is a cross-sectional view of the mold. FIGS. 3A to 3E are explanatory diagrams of the molding operation. FIG. 4 is an explanatory diagram of the circuit configuration. FIG. 5 is a partial sectional view of a resin molded product according to another example. 1... Molding machine platen, 2... Molding machine tie bar, 3... Excitation coil, 4... Mold, 5... Movable side template, 6... Fixed side template, 5a, 6a... Magnetic material, 5b, 6b...Nonmagnetic material.
Claims (1)
形体の前記2つの平面に連続した回路パターンを
設けてボデイ、またはカバー、あるいは前記ボデ
イ,カバーに取りつける中間体とした電気機器に
おいて、 前記隣り合う面の稜線部分は曲面であり、 成形用金型のキヤビテイ表面を磁性体と非磁性
体とで構成して前記磁性体の磁気力によつて前記
磁性体に導電性磁性粉を吸着保持させて樹脂材料
を注入し前記2つの平面と曲面に導電性磁性粉に
よる連続した回路パターンを作つた樹脂成形体
と、 前記各平面にそれぞれ電気部品を取りつけて前
記回路パターンと電気部品によつて形成した電気
回路から成る、 ことを特徴とする電気機器。[Claims for Utility Model Registration] An electrical device formed by providing a continuous circuit pattern on the two planes of a resin molded body having at least two adjacent planes to form a body, a cover, or an intermediate body attached to the body or cover. The ridgeline portions of the adjacent surfaces are curved surfaces, and the cavity surface of the molding die is composed of a magnetic material and a non-magnetic material, and conductive magnetic powder is applied to the magnetic material by the magnetic force of the magnetic material. A resin molded body is formed by adsorbing and holding a resin material and injecting a resin material to create a continuous circuit pattern of conductive magnetic powder on the two flat surfaces and a curved surface, and an electric component is attached to each of the flat surfaces to form the circuit pattern and the electric component. An electrical device comprising an electrical circuit formed by.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199906U JPH0331093Y2 (en) | 1986-12-25 | 1986-12-25 | |
US07/408,942 US4935174A (en) | 1986-01-13 | 1989-09-18 | Resin molded article bearing electric circuit patterns and process for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199906U JPH0331093Y2 (en) | 1986-12-25 | 1986-12-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63105372U JPS63105372U (en) | 1988-07-08 |
JPH0331093Y2 true JPH0331093Y2 (en) | 1991-07-01 |
Family
ID=31161964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986199906U Expired JPH0331093Y2 (en) | 1986-01-13 | 1986-12-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0331093Y2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5222790A (en) * | 1975-08-14 | 1977-02-21 | Sumitomo Metal Mining Co Ltd | Base material for thick film conductive paste |
JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
JPS5595390A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Method of forming molded article having printed circuit portion |
JPS59155988A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Method of producing thick film conductive paste |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59109185U (en) * | 1983-01-13 | 1984-07-23 | オムロン株式会社 | Electronics |
-
1986
- 1986-12-25 JP JP1986199906U patent/JPH0331093Y2/ja not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5222790A (en) * | 1975-08-14 | 1977-02-21 | Sumitomo Metal Mining Co Ltd | Base material for thick film conductive paste |
JPS52126756A (en) * | 1976-04-16 | 1977-10-24 | Matsushita Electric Ind Co Ltd | Inserttmolding method of preparing electroconductive plate for mounting electronic parts |
JPS5595390A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Method of forming molded article having printed circuit portion |
JPS59155988A (en) * | 1983-02-25 | 1984-09-05 | 住友金属鉱山株式会社 | Method of producing thick film conductive paste |
Also Published As
Publication number | Publication date |
---|---|
JPS63105372U (en) | 1988-07-08 |
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