JPH06275959A - Multilayer wiring substrate, manufacture thereof, and manufacture of double side printed wiring board - Google Patents
Multilayer wiring substrate, manufacture thereof, and manufacture of double side printed wiring boardInfo
- Publication number
- JPH06275959A JPH06275959A JP6168193A JP6168193A JPH06275959A JP H06275959 A JPH06275959 A JP H06275959A JP 6168193 A JP6168193 A JP 6168193A JP 6168193 A JP6168193 A JP 6168193A JP H06275959 A JPH06275959 A JP H06275959A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- wiring board
- hole
- double
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、大型計算機やワ−クス
テ−ション等のコンピュ−タ、交換機等に使われる高密
度な多層配線基板およびその製造方法、並びに前記多層
配線基板に用いられる両面プリント配線板の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-density multilayer wiring board used for a computer such as a large-scale computer or a workstation, an exchange, etc. The present invention relates to a method for manufacturing a printed wiring board.
【０００２】[0002]
【従来の技術】近年、従来の多層配線基板およびその製
造方法に替わる新しい高密度な多層配線基板およびその
製造方法が提案されている。例えば、ビルドアップ法が
挙げられる。この方法は、基本的には表層導体がパタ−
ニングされたプリント配線板の表層に感光性絶縁材料を
成膜した後、露光・現像によりビアホ−ルを形成し、次
いで、表層全面に導体を形成した後、導体をパタ−ニン
グする。さらに、これを繰り返して多層化した後、最後
に、貫通めっきスル−ホ−ルを形成する方法である。2. Description of the Related Art In recent years, a new high-density multilayer wiring board and a manufacturing method thereof have been proposed, which replace the conventional multilayer wiring board and the manufacturing method thereof. For example, there is a build-up method. In this method, the surface conductor is basically a pattern.
After a photosensitive insulating material is formed on the surface layer of the printed printed wiring board, a via hole is formed by exposure and development, and then a conductor is formed on the entire surface layer, and then the conductor is patterned. Further, this is a method of repeating this to form a multilayer, and finally forming a through-plated through hole.
【０００３】この方法においては、プリント配線板の表
層導体とビルドアップの導体層およびビルドアップの導
体層同士の接続が、ドリリングによる貫通めっきスル−
ホ−ルによる接続でなく、コンフォ−マルビアにより接
続される。そのため、従来の貫通めっきスル−ホ−ルの
みで層間接続をとるプリント配線板に比べると高密度な
多層配線基板が得られる。しかしながら、プリント配線
板の表層導体と内層導体との接続，プリント配線板両面
の接続は、製造工程の最終段階で形成される貫通めっき
スル−ホ−ルによる接続であるために、この分、配線密
度が低下する欠点がある。In this method, the connection between the surface layer conductor of the printed wiring board, the buildup conductor layer and the buildup conductor layers is achieved by drilling through-hole plating.
Instead of connecting by holes, it is connected by conformal via. Therefore, a high-density multilayer wiring board can be obtained as compared with a conventional printed wiring board in which interlayer connection is made only with through-plated through holes. However, since the connection between the surface layer conductor and the inner layer conductor of the printed wiring board and the connection on both sides of the printed wiring board are made by the through plating through holes formed at the final stage of the manufacturing process, the wiring is accordingly reduced. There is a drawback that the density decreases.
【０００４】また、ドリリングにより形成し、穴埋めさ
れていない貫通めっきスル−ホ−ルを有するプリント配
線板上では、感光性絶縁材料を成膜できないために、ビ
ルドアップ法による薄膜多層配線層を形成できない。な
お、これに関連するものとしては、特開平４−１４８５
９０号公報記載の技術が知られている。Further, since a photosensitive insulating material cannot be formed on a printed wiring board which is formed by drilling and has a through-plated through hole which is not filled up, a thin film multilayer wiring layer is formed by a build-up method. Can not. In addition, as a thing related to this, Japanese Patent Laid-Open No. 4-1485.
The technique described in Japanese Patent Publication No. 90 is known.
【０００５】前記技術の改良として、層間接続のために
ドリリングで形成しためっきスル−ホ−ルの穴を樹脂充
填し、上部にめっきスル−ホ−ルと前記導体に接続され
る導体パッドを形成してめっきスル−ホ−ルの面積を有
効利用する多層配線基板の製造方法がある。これに関連
するものとしては、例えば特開平４−１６８７９４号公
報に示される方法がある。As an improvement of the above technique, a hole of a plated through hole formed by drilling for interlayer connection is filled with resin, and a plated through hole and a conductor pad connected to the conductor are formed on an upper portion. Then, there is a method of manufacturing a multilayer wiring board which effectively utilizes the area of the plated through hole. A method related to this is, for example, the method disclosed in Japanese Patent Laid-Open No. 4-168794.
【０００６】上記方法は、多層配線基板の隣接する２層
の導体層の接続には有効であるが、プリント配線板の両
面あるいは１層以上の導体層を隔てた２層の導体層の接
続には、やはり、製造工程の最終段階で形成する貫通め
っきスル−ホ−ルに頼らざるを得えず、出来上がった多
層配線基板には穴埋めされていない貫通めっきスル−ホ
−ルが残るという欠点がある。The above method is effective for connecting two conductor layers adjacent to each other on a multilayer wiring board, but for connecting two conductor layers on both sides of a printed wiring board or by separating one or more conductor layers. Inevitably, however, there is no choice but to rely on the through-plating through-holes formed at the final stage of the manufacturing process, and there is a drawback that the through-plating through-holes that have not been filled remain in the finished multilayer wiring board. is there.
【０００７】[0007]
【発明が解決しようとする課題】上記従来の技術では、
ベ−スのプリント配線板に貫通めっきスル−ホ−ルがあ
る場合はビルドアップ法は適用できない問題があった。
貫通めっきスル−ホ−ルのないベ−スのプリント配線板
上にビルドアップ法を適用し、薄膜多層配線層を形成し
たとしても、ビルドアップで形成した導体層とべ−スの
プリント配線板の内層導体間の接続あるいはべ−スのプ
リント配線板の両面の接続をとるために、製造工程の最
終段階で貫通めっきスル−ホ−ルを形成しなければなら
ないという問題がある。上記貫通めっきスル−ホ−ルの
製造工程最終段階にて形成することは、穴埋めされてい
ない貫通めっきスル−ホ−ルが残存するという問題があ
り、さらに、高密度配線が形成できるビルドアップ法の
本来の機能を最大限に活用することはできないという問
題があった。SUMMARY OF THE INVENTION In the above conventional technique,
The build-up method cannot be applied when the base printed wiring board has a through-plated through hole.
Even if a build-up method is applied to a base printed wiring board without a through-plated through hole to form a thin-film multilayer wiring layer, the conductor layer formed by build-up and the printed wiring board of the base are There is a problem that a through-plated through hole must be formed at the final stage of the manufacturing process in order to connect the inner layer conductors or the both sides of the base printed wiring board. Forming at the final stage of the manufacturing process of the through-plated through-hole has a problem that the unfilled through-plated through-hole remains, and further, a build-up method capable of forming high-density wiring. There was a problem that it was not possible to make full use of the original functions of.
【０００８】本発明は、上記従来技術の問題点を解決す
るためになされたもので、耐熱性、機械特性、電気特性
等の特性に優れ、低コスト、かつ、信頼性が高い、貫通
めっきスル−ホ−ルの穴の影響をない、高密度配線機能
を有する多層配線基板，ビルドアップ法が形成しうる本
来の高密度配線機能を最大限に活用するその製造方法お
よび前記多層配線基板に用いられる両面プリント配線板
の製造方法を提供することを目的とするものである。The present invention has been made in order to solve the above-mentioned problems of the prior art, and has excellent characteristics such as heat resistance, mechanical characteristics, and electrical characteristics, low cost, and high reliability. -A multilayer wiring board having a high-density wiring function that is not affected by holes in the holes, a manufacturing method for maximizing the original high-density wiring function that can be formed by the build-up method, and the above-mentioned multilayer wiring board. It is an object of the present invention to provide a method for manufacturing a double-sided printed wiring board that is used.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る多層配線基板の構成は、穴埋めされた
層間接続スル−ホ−ルの導体と前記導体に接続される導
体パッドが設けられた両面プリント配線板上に、少なく
とも１層以上の導体パタ−ン層と層間絶縁膜層とが交互
に形成され、該導体パッドと前記導体パタ−ン層および
前記導体パタ−ン層同士が電気的に接続するものであ
る。上記両面プリント配線板は内層導体層を含んでいて
も差し支えない。In order to achieve the above object, a multilayer wiring board according to the present invention has a structure in which a conductor of an interlayer connecting through hole filled with a conductor and a conductor pad connected to the conductor are formed. At least one or more conductor pattern layers and interlayer insulating film layers are alternately formed on the provided double-sided printed wiring board, and the conductor pads, the conductor pattern layers, and the conductor pattern layers are adjacent to each other. Is to be electrically connected. The double-sided printed wiring board may include an inner conductor layer.
【００１０】また、上記本発明の多層配線基板のベ−ス
基板に用いられ、穴埋めされた層間接続スル−ホ−ルの
導体と前記導体に接続される導体パッドが設けられた両
面プリント配線板の製造方法は次の如く構成する。第一
の方法は、（１）貫通めっきスル−ホ−ルを有し、表層
導体がパタ−ニングされた両面プリント配線板の前記貫
通めっきスル−ホ−ルおよび前記導体間隙を有機系高分
子の絶縁膜で充填する工程、（２）該両面プリント配線
板の表層導体および貫通めっきスル−ホ−ル導体の所定
位置に接続される導体パッドを形成する工程とを含む方
法である。A double-sided printed wiring board used for the base substrate of the above-mentioned multilayer wiring board of the present invention, which is provided with a conductor of a buried interlayer connection through hole and a conductor pad connected to the conductor. The manufacturing method of is constructed as follows. The first method is (1) an organic polymer having a through-plated through-hole and a conductor gap of a double-sided printed wiring board having a through-hole plated through-hole and a surface layer conductor patterned. And a step of (2) forming conductor pads connected to predetermined positions of the surface layer conductor and the through-plated through-hole conductor of the double-sided printed wiring board.
【００１１】第二の方法は、（１）貫通めっきスル−ホ
−ルを有し、表層導体がパタ−ニングされていない両面
プリント配線板の前記貫通めっきスル−ホ−ルを有機系
高分子の絶縁膜で充填する工程と、（２）該両面プリン
ト配線板の表層導体および貫通めっきスル−ホ−ル導体
の所定位置に接続される導体パッドを形成する工程とを
含む方法である。The second method (1) has a through-plated through-hole, and the through-plated through-hole of the double-sided printed wiring board in which the surface layer conductor is not patterned is replaced with an organic polymer. Of the double-sided printed wiring board, and a step of forming a conductor pad connected to a predetermined position of the through-hole plated through-hole conductor of the double-sided printed wiring board.
【００１２】上記工程の内、貫通めっきスル−ホ−ルを
有し、表層導体がパタ−ニングされた両面プリント配線
板の前記貫通めっきスル−ホ−ルおよび前記導体間隙を
有機系高分子の絶縁膜で充填する工程と、貫通めっきス
ル−ホ−ルを有し、表層導体がパタ−ニングされていな
い両面プリント配線板の前記貫通めっきスル−ホ−ルを
有機系高分子の絶縁膜で充填する工程とをさらに詳しく
説明する。Among the above-mentioned steps, the through-plated through-hole and the conductor gap of the double-sided printed wiring board having the through-plated through-hole and having the surface layer conductor patterned are made of an organic polymer. The step of filling with an insulating film, and the through-plating through-hole of the double-sided printed wiring board having a through-hole plating through-hole and the surface layer conductor not patterned, with an insulating film of an organic polymer. The filling step will be described in more detail.
【００１３】すなわち、（１）該両面プリント配線板上
に表面の平坦な金型を設置し、該両面プリント配線板と
該金型との間に溶剤を含まない流動性有機系高分子前駆
体を挾む工程と、（２）該金型と該両面プリント配線板
との間を排気する工程と、（３）該金型を該両面プリン
ト配線板方向へ移動させて該溶剤を含まない流動性有機
系高分子前駆体を貫通めっきスル−ホ−ルおよび導体間
隙に充填する工程と、（４）該溶剤を含まない流動性有
機系高分子前駆体に静水圧をかける工程と、（５）該溶
剤を含まない流動性有機系高分子前駆体を硬化する工程
と、（６）該有機系高分子で覆われた導体上面を露出さ
せる工程とを含む方法である。That is, (1) a mold having a flat surface is placed on the double-sided printed wiring board, and a fluid organic polymer precursor containing no solvent between the double-sided printed wiring board and the mold. And (2) exhausting the space between the mold and the double-sided printed wiring board, and (3) moving the mold in the direction of the double-sided printed wiring board and flowing without the solvent. Of a soluble organic polymer precursor into the through-plating through-holes and conductor gaps, and (4) applying hydrostatic pressure to the solvent-free fluid organic polymer precursor, ) A method including a step of curing the solvent-free fluid organic polymer precursor, and (6) exposing a conductor upper surface covered with the organic polymer.
【００１４】また、上記工程の内、両面プリント配線板
の表層導体および貫通めっきスル−ホ−ル導体の所定位
置に接続される導体パッドを形成する工程をさらに詳し
く説明する。第一の方法は、（１）貫通めっきスル−ホ
−ルまたは貫通めっきスル−ホ−ルと導体間隙とが有機
系高分子の絶縁膜で充填された両面プリント配線板の表
面全面にパッド用導体を形成する工程と、（２）該導体
上の所定位置にレジストの残しパタ−ンを形成する工程
と、（３）該導体をエッチングにより所定の形状にパタ
−ニングし、該レジストを剥離する工程とを含むサブト
ラクティブ法である。Further, among the above steps, the step of forming a conductor pad connected to a predetermined position of the surface conductor and the through-plated through-hole conductor of the double-sided printed wiring board will be described in more detail. The first method is (1) for padding on the entire surface of a double-sided printed wiring board in which a through-plated through hole or a through-plated through hole and a conductor gap are filled with an insulating film of an organic polymer. A step of forming a conductor, (2) a step of forming a resist-remaining pattern at a predetermined position on the conductor, and (3) a step of etching the conductor into a predetermined shape to remove the resist. And a subtractive method.
【００１５】第二の方法は、（１）貫通めっきスル−ホ
−ルまたは貫通めっきスル−ホ−ルと導体間隙とが有機
系高分子の絶縁膜で充填された両面プリント配線板表面
の所定位置にレジストの抜きパタ−ンを形成する工程
と、（２）該レジストの抜きパタ−ン内に導体を形成
し、該レジストを剥離する工程とを含むアディティブ法
である。以上の方法により、穴埋めされた層間接続スル
−ホ−ルの導体と前記導体に接続される導体パッドが設
けられた両面プリント配線板を製造することができる。The second method is: (1) Predetermined surface of a double-sided printed wiring board in which the through-plated through-hole or the through-plated through-hole and the conductor gap are filled with an insulating film of an organic polymer. It is an additive method including a step of forming a resist removal pattern at a position, and (2) a step of forming a conductor in the resist removal pattern and peeling the resist. By the method described above, it is possible to manufacture a double-sided printed wiring board provided with a conductor of a buried interlayer connection through hole and a conductor pad connected to the conductor.
【００１６】上記両面プリント配線板のベ−ス基板上に
薄膜多層配線層を形成する方法を説明する。すなわち、
（１）感光性絶縁樹脂を成膜する工程と、（２）露光、
現像により該感光性絶縁樹脂にビアホ−ルを形成する工
程と、（３）露光された該感光性絶縁樹脂表面を粗化す
る工程と、（４）導体を形成する工程と、（５）熱硬化
により該感光性絶縁樹脂を完全硬化する工程と、（６）
該導体のエッチングによりパタ−ンを形成する工程とを
含むビルドアップ法である。A method of forming a thin film multilayer wiring layer on the base substrate of the double-sided printed wiring board will be described. That is,
(1) a step of forming a photosensitive insulating resin film, (2) exposure,
Forming a via hole in the photosensitive insulating resin by development; (3) roughening the exposed surface of the photosensitive insulating resin; (4) forming a conductor; and (5) heat. Completely curing the photosensitive insulating resin by curing, (6)
And a step of forming a pattern by etching the conductor.
【００１７】ここで、本発明に用いられる材料をさらに
詳しく説明する。溶剤を含まない流動性有機系高分子前
駆体には、多官能エポキシ樹脂組成物，分子内に２個以
上のマレイミド骨格を有する化合物の組成物，分子内に
２個以上のシアン酸エステル骨格を有する化合物の組成
物，分子内に２個以上のベンゾシクロブテン骨格を有す
る化合物の組成物の内の少なくとも１つ以上を含む組成
物のいずれかを使用する。The materials used in the present invention will now be described in more detail. The solvent-free fluid organic polymer precursor includes a polyfunctional epoxy resin composition, a composition of a compound having two or more maleimide skeletons in the molecule, and two or more cyanate ester skeletons in the molecule. Either the composition of the compound having the above or the composition containing at least one or more of the compositions of the compound having two or more benzocyclobutene skeletons in the molecule is used.
【００１８】また、感光性絶縁樹脂は、少なくとも、室
温で固形の多官能不飽和化合物，エポキシ樹脂，アクリ
レ−トモノマ−，光重合開始剤，アミン系の熱硬化剤を
ふくむ組成物，あるいは、少なくとも、不飽和基を付加
反応させた２官能以上の多官能固形エポキシ樹脂、アク
リレ−トモノマ−、光重合開始剤、アミン系の熱硬化剤
を含む組成物の内のいずれかを使用する。また、アミン
系熱硬化剤はジシアンジアミドあるいはジアミノトリア
ジン化合物が望ましい。Further, the photosensitive insulating resin is a composition containing at least a polyfunctional unsaturated compound which is solid at room temperature, an epoxy resin, an acrylate monomer, a photopolymerization initiator, an amine-based thermosetting agent, or at least a composition. Any one of the compositions containing a bifunctional or more polyfunctional solid epoxy resin in which an unsaturated group is subjected to an addition reaction, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent is used. Further, the amine thermosetting agent is preferably a dicyandiamide or a diaminotriazine compound.
【００１９】[0019]
【作用】上記各技術的手段の働きは次のとおりである。
本発明に係る多層配線基板の構成によれば、穴埋めされ
た層間接続スル−ホ−ルの導体と前記導体に接続される
導体パッドとが設けられた両面プリント配線板上に、少
なくとも１層以上の導体パタ−ン層と層間絶縁膜層とが
交互に形成され、該導体パッドと前記導体パタ−ン層お
よび前記導体パタ−ン層同士が電気的に接続されるの
で、ベ−ス基板の両面プリント配線板の貫通めっきスル
−ホ−ルの穴の影響がなくなり、この上に薄膜多層配線
層を形成することができる。The function of each of the above technical means is as follows.
According to the structure of the multilayer wiring board of the present invention, at least one layer or more is provided on the double-sided printed wiring board provided with the conductor of the interlayer connection through hole which is filled up and the conductor pad connected to the conductor. The conductor pattern layers and the interlayer insulating film layers are alternately formed, and the conductor pads, the conductor pattern layers, and the conductor pattern layers are electrically connected to each other. The effect of the through-plated through-hole holes of the double-sided printed wiring board is eliminated, and a thin film multilayer wiring layer can be formed thereon.
【００２０】また、製造工程の最終段階で貫通めっきス
ル−ホ−ルが形成されないので、ベ−ス基板上の薄膜多
層配線層の配線密度を最大限にすることができる。さら
に、べ−ス基板上の薄膜多層配線層とベ−ス基板の内層
導体層との接続，ベ−ス基板の両面の接続，各導体層の
接続等が、製造工程における最終段階の貫通めっきスル
−ホ−ルの形成がなくても施すことができる。Further, since the through plating through hole is not formed at the final stage of the manufacturing process, the wiring density of the thin film multilayer wiring layer on the base substrate can be maximized. Further, the connection between the thin-film multilayer wiring layer on the base board and the inner conductor layers of the base board, the connection of both sides of the base board, the connection of each conductor layer, etc. are the final stages of the through-hole plating in the manufacturing process. It can be applied without the formation of through-holes.
【００２１】本発明に係る両面プリント配線板の製造方
法によれば、貫通めっきスル−ホ−ルのある両面プリン
ト配線板上に表面の平坦な金型を設置し、該両面プリン
ト配線板と該金型との間に溶剤を含まない流動性有機系
高分子前駆体を挾む工程と、該金型と該両面プリント配
線板との間を排気する工程と、該金型を該両面プリント
配線板方向へ移動させて該溶剤を含まない流動性有機系
高分子前駆体を貫通めっきスル−ホ−ルおよび導体間隙
に充填する工程と、該溶剤を含まない流動性有機系高分
子前駆体に静水圧をかける工程と、該溶剤を含まない流
動性有機系高分子前駆体を硬化する工程と、該有機系高
分子で覆われた導体上面を露出させる工程とを含む工程
としたので、貫通スル−ホ−ル内あるいは導体間隙にピ
ンホ−ルやクラックのない均一な物性の絶縁膜を形成す
ることができる。また、次ぎの工程において形成される
導体パッドを接続するために必要な該両面プリント配線
板の表層導体の表面を露出させることができ、かつ、表
面が平坦なベ−ス基板を作ることができる。According to the method for producing a double-sided printed wiring board according to the present invention, a flat mold is placed on the double-sided printed wiring board having a through-plated through hole, and the double-sided printed wiring board and the double-sided printed wiring board are provided. A step of sandwiching a fluid organic polymer precursor containing no solvent between the mold and a step of exhausting gas between the mold and the double-sided printed wiring board; A step of moving the solvent-free fluid organic polymer precursor in the plate direction into the through-plating through-hole and the conductor gap, and the solvent-free fluid organic polymer precursor Since it is a step including a step of applying hydrostatic pressure, a step of curing the fluid organic polymer precursor containing no solvent, and a step of exposing the conductor upper surface covered with the organic polymer, Pinholes or cracks in the through-holes or in the conductor gaps. It is possible to form an insulating film without uniform properties. Further, the surface of the surface layer conductor of the double-sided printed wiring board necessary for connecting the conductor pad formed in the next step can be exposed, and the base substrate having a flat surface can be produced. .
【００２２】さらに、上記両面プリント配線板表層導体
および貫通めっきスル−ホ−ル導体の所定位置に接続す
る導体パッドを形成する方法として、特殊な技術でな
く、従来技術であるサブトラクティブ法あるいはアディ
ティブ法を採用することができる。Further, as a method of forming a conductor pad to be connected to a predetermined position of the surface conductor of the above-mentioned double-sided printed wiring board and the through-plated through-hole conductor, not a special technique but a conventional subtractive method or additive method. The law can be adopted.
【００２３】次ぎに、本発明に係る多層配線基板の製造
方法によれば、感光性絶縁樹脂を成膜する工程，露光，
現像により該感光性絶縁樹脂にビアホ−ルを形成する工
程と、露光された該感光性絶縁樹脂表面を粗化する工程
と、導体を形成する工程と、熱硬化により該感光性絶縁
樹脂を完全硬化する工程と、前記導体をエッチングによ
りパタ−ンに形成させる工程を経る方法としたため、従
来から問題となっていた前記導体と層間絶縁膜の接着強
度を向上させることができ、信頼性の高い薄膜多層配線
層を形成することができる。Next, according to the method for manufacturing a multilayer wiring board according to the present invention, the step of forming a film of a photosensitive insulating resin, the exposure,
A step of forming a via hole in the photosensitive insulating resin by development, a step of roughening the exposed surface of the photosensitive insulating resin, a step of forming a conductor, and a step of completely curing the photosensitive insulating resin by heat curing. Since the method includes a step of curing and a step of forming the conductor into a pattern by etching, the adhesive strength between the conductor and the interlayer insulating film, which has been a problem in the past, can be improved, and the reliability is high. A thin film multilayer wiring layer can be formed.
【００２４】上記貫通めっきスル−ホ−ルあるいは導体
間隙を埋めるために適用できる材料は、溶剤を含まない
流動性有機系高分子前駆体であり、多官能エポキシ樹脂
組成物，分子内に２個以上のマレイミド骨格を有する化
合物の組成物，分子内に２個以上のシアン酸エステル骨
格を有する化合物の組成物，分子内に２個以上のベンゾ
シクロブテン骨格を有する化合物の組成物の内の少なく
とも１つ以上を含む組成物を用いることにより、耐熱
性，機械特性，電気特性等に優れた絶縁膜を得ることが
できる。The material applicable for filling the through-plated through-hole or conductor gap is a fluid-free organic polymer precursor containing no solvent, which is a polyfunctional epoxy resin composition, and two in the molecule. At least among the composition of the compound having the maleimide skeleton, the composition of the compound having two or more cyanate ester skeletons in the molecule, and the composition of the compound having two or more benzocyclobutene skeletons in the molecule By using the composition containing one or more, an insulating film having excellent heat resistance, mechanical properties, electrical properties, and the like can be obtained.
【００２５】また、上記の感光性絶縁樹脂には、上記導
体と層間絶縁膜との接着強度を向上させるために、光で
硬化する成分と熱で硬化する成分とが必要であり、少な
くとも、室温で固形の多官能不飽和化合物，エポキシ樹
脂，アクリレ−トモノマ−，光重合開始剤，アミン系の
熱硬化剤を含む組成物，あるいは、少なくとも、不飽和
基を付加反応させた２官能以上の多官能固形エポキシ樹
脂，アクリレ−トモノマ−，光重合開始剤，アミン系の
熱硬化剤を含む組成物のいずれかにより、導体と層間絶
縁膜との接着強度に優れ、かつ、良好な解像性も得られ
る。さらに、アミン系熱硬化剤に、ジシアンジアミドあ
るいはジアミノトリアジン化合物を用いたことで、導体
のマイグレ−ションを抑えることができる。Further, the above photosensitive insulating resin needs a component which is hardened by light and a component which is hardened by heat in order to improve the adhesive strength between the conductor and the interlayer insulating film, and at least at room temperature. A composition containing a solid polyfunctional unsaturated compound, an epoxy resin, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent, or at least a polyfunctional polyfunctional compound obtained by addition-reacting an unsaturated group. By using any of the compositions containing a functional solid epoxy resin, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent, the adhesive strength between the conductor and the interlayer insulating film is excellent, and good resolution is obtained. can get. Furthermore, by using a dicyandiamide or a diaminotriazine compound as the amine thermosetting agent, migration of the conductor can be suppressed.
【００２７】[0027]
【実施例】以下、本発明の各実施例を図１ないし図７を
参照して説明する。 〔実施例 １〕図１は、本発明の一実施例に係る両面プ
リント配線板およびその製造方法を示す説明図、図５
は、本発明の一実施例に係る両面プリント配線板の製造
方法を示す説明図である。図１において、穴埋めされた
層間接続スル−ホ−ルの導体と前記導体に接続する導体
パッドが設けられた両面プリント配線板の製造方法の一
例を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Each embodiment of the present invention will be described below with reference to FIGS. [Embodiment 1] FIG. 1 is an explanatory view showing a double-sided printed wiring board and a method for manufacturing the same according to one embodiment of the present invention.
FIG. 6 is an explanatory diagram showing a method for manufacturing a double-sided printed wiring board according to an embodiment of the present invention. In FIG. 1, an example of a method of manufacturing a double-sided printed wiring board provided with a conductor of an interlayer connection through hole which is filled up and a conductor pad connected to the conductor will be described.
【００２８】両面の信号層を接続する貫通めっきスル−
ホ−ル１０１と裏面の電源層との接続をとる２種類の貫
通めっきスル−ホ−ル１０２、１０３とを有し、両面の
銅がパタ−ニングされた図１（ａ）に示すガラスポリイ
ミド両面プリント配線板を用意する。前記プリント配線
板としてはＢＴレジンのプリント配線板、例えば三菱瓦
斯化学（株）製を用いても差し支えない。Through plating through which connects the signal layers on both sides
The glass polyimide shown in FIG. 1 (a), which has two kinds of through-plated through-holes 102 and 103 for connecting the hole 101 and the power supply layer on the back surface, and has copper on both surfaces patterned. Prepare a double-sided printed wiring board. As the printed wiring board, a BT resin printed wiring board, for example, manufactured by Mitsubishi Gas Chemical Co., Inc. may be used.
【００２９】次ぎに、このプリント配線板の貫通めっき
スル−ホ−ルと表層導体の間隙を有機系高分子の絶縁膜
１０４で充填して図１（ｂ）に示す基板を作成するが、
その間のプロセスが、図５に示される金型工程である。
図５（ａ）に示されるように、前記図１（ａ）のプリン
ト配線板の両面をフイルム状組成物１０５にて挾み、こ
れを金型５０１の間に挿入する。Next, the gap between the through-plated through-hole and the surface conductor of this printed wiring board is filled with an organic polymer insulating film 104 to prepare a substrate shown in FIG. 1 (b).
The process in the meantime is the mold process shown in FIG.
As shown in FIG. 5 (a), both sides of the printed wiring board of FIG. 1 (a) are sandwiched by the film-like composition 105, and this is inserted between the molds 501.
【００３０】前記フイルム状組成物１０５は、本実施例
においては、溶剤を含まない流動性有機系高分子前駆
体、例えば４官能ポキシ樹脂エピクロンＥＸＡ４７００
（大日本インキ化学製造（株）製商品名）とフェノ−ル
樹脂バ−カムＴＤ２１３１（大日本インキ化学製造
（株）製商品名）６５ｐｈｒとを混練し溶融成形したも
のである。In the present embodiment, the film-like composition 105 is a solvent-free fluid organic polymer precursor, for example, a tetrafunctional epoxy resin Epicron EXA4700.
(Dai Nippon Ink Chemical Manufacturing Co., Ltd. trade name) and phenol resin bar cam TD2131 (Dainippon Ink Chemical Manufacturing Co., Ltd. trade name) 65 phr were kneaded and melt-molded.
【００３１】次いで、前記金型５０１を７０℃に加熱し
て上記フイルム状組成物１０５を溶融させ、さらに、前
記金型５０１と前記プリント配線板との空間を１０ｔｏ
ｒｒに排気して約７分間真空度を保持する。これによ
り、上記フイルム状組成物１０５が貫通めっきスル−ホ
−ル１０１、１０２、１０３および銅配線間隙に充填さ
れ、図５（ｂ）に示される基板を構成した。Next, the mold 501 is heated to 70 ° C. to melt the film-like composition 105, and the space between the mold 501 and the printed wiring board is adjusted to 10 to.
Evacuate to rr and hold vacuum for about 7 minutes. As a result, the film-like composition 105 was filled in the through-plated through-holes 101, 102, 103 and the copper wiring gap to form the substrate shown in FIG. 5 (b).
【００３２】そして、前記金型５０１と図５（ｂ）の前
記プリント配線板の空間を大気圧に戻した後、圧縮圧力
５ｋｇｆ／ｃｍ2にて上下方向から、横方向からの空気
圧４．５ｋｇｆ／ｃｍ2にて横方向から加圧する。５分
後に前記金型５０１を７０℃から２００℃まで勾配速度
を７０℃／分にて昇温し、その状態にて３０分間保持し
た。Then, after the space between the mold 501 and the printed wiring board in FIG. 5 (b) is returned to atmospheric pressure, the compression pressure is 5 kgf / cm 2 and the air pressure is 4.5 kgf from the vertical direction and the horizontal direction. Pressurize laterally at / cm 2 . After 5 minutes, the mold 501 was heated from 70 ° C. to 200 ° C. at a ramp rate of 70 ° C./minute, and kept in that state for 30 minutes.
【００３３】そして、前記図５（ｂ）のプリント配線板
を金型５０１から外して常圧下で２００℃，６０分加熱
する。その結果、平坦で、ボイドやピンホ−ルがなく、
かつ、均一な物性を有する絶縁膜１０４が貫通めっきス
ル−ホ−ル１０１、１０２、１０３および表層配線導体
間隙に形成される。この結果、図５（ｃ）に示されるプ
リント配線板を得た。Then, the printed wiring board of FIG. 5B is removed from the mold 501 and heated at 200 ° C. for 60 minutes under normal pressure. The result is a flat surface with no voids or pinholes,
In addition, the insulating film 104 having uniform physical properties is formed in the through plating through-holes 101, 102, 103 and the surface layer wiring conductor gap. As a result, the printed wiring board shown in FIG. 5C was obtained.
【００３４】図５（ｃ）のプリント配線板には表層導体
上１０６に絶縁膜１０４の極薄膜が残存する。そこで、
図５（ｃ）のプリント配線板を１００℃に加熱し、２０
分間Ｏ3の雰囲気下にて紫外線に曝すことにより、絶縁
膜１０４をエッチバックし、表層導体を露出させた図５
（ｄ）のプリント配線板、すなわち、図１（ｂ）のプリ
ント配線板を得た。In the printed wiring board of FIG. 5C, an extremely thin film of the insulating film 104 remains on the surface conductor 106. Therefore,
The printed wiring board of FIG. 5 (c) is heated to 100 ° C.
The insulating film 104 was etched back by exposing it to ultraviolet rays in an atmosphere of O 3 for 5 minutes to expose the surface conductor.
The printed wiring board of (d), that is, the printed wiring board of FIG. 1 (b) was obtained.
【００３５】前記金型５０１におけるモ−ルドの条件と
して、真空度は２０Ｔｏｒｒ以下、圧力は２０ｋｇｆ／
ｃｍ2以下、上下方向の圧縮圧力は、横方向からの圧縮
圧力よりも大きいか少なくとも等しいことが望ましく、
その圧力差は１０ｋｇｆ／ｃｍ2以下であるとさらに良
い結果が得られる。さらに、エッチバックの方法として
酸素プラズマアッシングや研磨等を使用することもでき
る。As the mold condition of the mold 501, the degree of vacuum is 20 Torr or less and the pressure is 20 kgf /.
cm 2 or less, the compression pressure in the vertical direction is preferably greater than or at least equal to the compression pressure in the lateral direction,
Even better results are obtained when the pressure difference is 10 kgf / cm 2 or less. Further, oxygen plasma ashing, polishing or the like can be used as the etch back method.
【００３６】このようにして形成した図１（ｂ）のプリ
ント配線板両面には、銅の下地膜をスパッタにて０．５
μｍの厚さに成膜し、次いで、通常の電気銅めっきにて
さらに１５μｍの厚さに増し、前記プリント配線板両側
の全面に銅１０７を成膜した図１（ｃ）に示されるプリ
ント配線板を得た。前記銅１０７を成膜する方法として
は、この他イオンプレ−ティングや熔射、化学めっき等
の従来技術を用いることができる。A copper base film is sputtered on both surfaces of the thus-formed printed wiring board of FIG. 1B by 0.5.
The printed wiring shown in FIG. 1 (c) is formed by forming a film with a thickness of μm and then further increasing the thickness with a thickness of 15 μm by ordinary electrolytic copper plating to form copper 107 on both sides of the printed wiring board. I got a plate. As a method for depositing the copper 107, other conventional techniques such as ion plating, spraying, and chemical plating can be used.
【００３７】次に、銅１０７の上に従来技術によりエッ
チングレジストを形成し、露光・現像・エッチング・剥
離の工程により銅１０７をパタ−ニングして、穴埋めさ
れた層間接続スル−ホ−ルの導体と接続する導体パッド
１０８やその他のパタ−ンを有する両面プリント配線
板、すなわち完成された図１（ｄ）の両面プリント配線
板を得た。Next, an etching resist is formed on the copper 107 by a conventional technique, and the copper 107 is patterned by the steps of exposure, development, etching, and peeling, and the buried interlayer connection through hole is formed. A double-sided printed wiring board having conductor pads 108 for connecting to conductors and other patterns, that is, a completed double-sided printed wiring board of FIG. 1D was obtained.
【００３８】〔実施例 ２〕次に、本発明の他の一実施
例に係る両面プリント配線板を図１，２を参照して説明
する。図２は本発明に他の一実施例に係る両面プリント
配線板を示す説明図である。〔実施例 １〕と同様にし
て図１（ｂ）に示される両面プリント配線板まで形成す
る。[Embodiment 2] Next, a double-sided printed wiring board according to another embodiment of the present invention will be described with reference to FIGS. FIG. 2 is an explanatory view showing a double-sided printed wiring board according to another embodiment of the present invention. The double-sided printed wiring board shown in FIG. 1B is formed in the same manner as in [Example 1].
【００３９】次いで〔実施例 １〕では、いわゆるサブ
トラクティブ法により図１（ｄ）に示される両面プリン
ト配線板を得たが、本実施例においては、いわゆるアデ
ィティブ法にて導体パッド２０１を形成した。Next, in [Example 1], the double-sided printed wiring board shown in FIG. 1D was obtained by the so-called subtractive method. In this example, the conductor pad 201 was formed by the so-called additive method. .
【００４０】すなわち、図１（ｂ）の両面プリント配線
板の両面に所定の従来技術によりめっきレジストを形成
し、露光・現像により所定の抜きパタ−ンを得た後、化
学銅めっきにて導体パッド２０１を形成してレジストを
剥離する。このようにして、図２に示される穴埋めされ
た層間接続スル−ホ−ルの導体と前記導体に接続される
導体パッドが設けられた両面プリント配線板を完成し
た。That is, a plating resist is formed on both sides of the double-sided printed wiring board of FIG. 1 (b) by a predetermined conventional technique, and a predetermined removal pattern is obtained by exposure and development, and then a conductor is formed by chemical copper plating. The pad 201 is formed and the resist is peeled off. In this way, the double-sided printed wiring board having the conductor of the interlayer connection through hole and the conductor pad connected to the conductor shown in FIG. 2 was completed.
【００４１】〔実施例 ３〕次に、本発明のさらに他の
一実施例に係る両面プリント配線板の製造方法を図１，
３を参照して説明する。図３は、本発明にさらに他の一
実施例に係る両面プリント配線板の製造方法を示す説明
図である。〔実施例 １〕と同様にして図１（ｂ）に示
される両面プリント配線板まで形成する。[Embodiment 3] Next, a method for manufacturing a double-sided printed wiring board according to still another embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 3 is an explanatory view showing a method for manufacturing a double-sided printed wiring board according to still another embodiment of the present invention. The double-sided printed wiring board shown in FIG. 1B is formed in the same manner as in [Example 1].
【００４２】図３に示される両面の信号層を接続する貫
通めっきスル−ホ−ル３０１と裏面の電源層との接続を
とる２種類の貫通めっきスル−ホ−ル３０２、３０３と
を有し、両面の銅がパタ−ニングされていない図３
（ａ）に示されるガラスポリイミド両面プリント配線板
を用意する。It has a through-plated through-hole 301 for connecting the signal layers on both sides shown in FIG. 3 and two kinds of through-plated through-holes 302, 303 for connecting to the power supply layer on the back surface. , The copper on both sides is not patterned Fig. 3
The glass polyimide double-sided printed wiring board shown in (a) is prepared.
【００４３】次ぎに、〔実施例 １〕と同様にして、こ
の両面プリント配線板の貫通めっきスル−ホ−ルを有機
系高分子の絶縁膜３０４で充填して図３（ｂ）に示され
る基板とし、図３（ｂ）の基板の両面に従来の方法によ
りめっきレジストを形成し、露光・現像により所定の抜
きパタ−ンを得た後、化学銅めっきにて導体パッド３０
５を形成し、レジストを剥離して図３（ｃ）に示される
両面プリント配線板とした。Next, in the same manner as in [Example 1], the through-plated through hole of this double-sided printed wiring board is filled with an organic polymer insulating film 304, as shown in FIG. 3 (b). As a substrate, a plating resist is formed on both surfaces of the substrate shown in FIG. 3B by a conventional method, a predetermined removal pattern is obtained by exposure and development, and then a conductor pad 30 is formed by chemical copper plating.
5 was formed and the resist was peeled off to obtain a double-sided printed wiring board shown in FIG.
【００４４】そして、この上に所定の方法によりエッチ
ングレジストを形成し、露光・現像・エッチング・剥離
の工程により銅３０６をパタ−ニングして、穴埋めされ
た層間接続スル−ホ−ルの導体と接続する導体パッド３
０６やその他のパタ−ンを有する図３（ｄ）に示される
両面プリント配線板が得られる。Then, an etching resist is formed thereon by a predetermined method, and the copper 306 is patterned by the steps of exposure, development, etching, and peeling to form a buried interlayer connection through hole conductor. Conductor pad 3 to connect
The double-sided printed wiring board shown in FIG. 3 (d) having 06 and other patterns is obtained.
【００４５】〔実施例 ４〕次に、図３，４を参照して
本発明のさらに他の一実施例を説明する。図４は、本発
明にさらに他の一実施例に係る両面プリント配線板を示
す説明図である。〔実施例 ３〕と同様にして図３
（ｂ）に示される両面プリント配線板まで形成し、次い
で図３（ｂ）の両面プリント配線板の両面全面に〔実施
例 １〕と同様にして銅を１５μｍの厚さに成膜した。[Embodiment 4] Next, still another embodiment of the present invention will be described with reference to FIGS. FIG. 4 is an explanatory view showing a double-sided printed wiring board according to still another embodiment of the present invention. Similar to [Embodiment 3], FIG.
The double-sided printed wiring board shown in (b) was formed, and then copper was deposited to a thickness of 15 μm on both surfaces of the double-sided printed wiring board of FIG. 3 (b) in the same manner as in [Example 1].
【００４６】そして、この上に所定の方法によりエッチ
ングレジストを形成し、露光・現像・エッチング・剥離
の工程により銅をパタ−ニングする。この結果、図４に
示される穴埋めされた層間接続スル−ホ−ルの導体と接
続する導体パッド４０１やその他のパタ−ンを有する両
面プリント配線板を得た。Then, an etching resist is formed on this by a predetermined method, and copper is patterned by the steps of exposure, development, etching, and peeling. As a result, a double-sided printed wiring board having conductor pads 401 for connecting to the conductors of the interlayer connecting through holes shown in FIG. 4 and other patterns was obtained.
【００４７】〔実施例 ５〕次に、図１，６，７を参照
して本発明のさらに他の一実施例に係る多層配線基板の
製造方法を説明する。図６は、本発明のさらに他の一実
施例に係る多層配線基板の製造方法の説明図、図７は、
本発明のさらに他の一実施例に係る多層配線基板の説明
図である。[Embodiment 5] Next, a method of manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIGS. FIG. 6 is an explanatory view of a method for manufacturing a multilayer wiring board according to still another embodiment of the present invention, and FIG.
It is explanatory drawing of the multilayer wiring board which concerns on another Example of this invention.
【００４８】〔実施例 １〕の方法で形成した図１
（ｄ）に示された穴埋めされた層間接続スル−ホ−ルの
導体と接続する導体パッドが設けられた両面プリント配
線板を使用し、その上にビルドアップ法にて薄膜多層配
線層が形成された多層配線基板およびその製造方法とを
説明する。FIG. 1 formed by the method of [Example 1]
A double-sided printed wiring board provided with conductor pads connected to the conductors of the interlayer connection through holes shown in (d) is used, and a thin film multilayer wiring layer is formed thereon by a build-up method. The manufactured multilayer wiring board and its manufacturing method will be described.
【００４９】本実施例においては、露光・現像工程の感
光性絶縁樹脂として下記（イ）〜（ヘ）よりなる樹脂組
成物を調整し使用した。 （イ）ジアリルフタレ−ト樹脂 １００ｇ （ロ）エピコ−ト８２８ ３０ｇ （ハ）ペンタエリスリト−ルトリアクリレ−ト ２０ｇ （ニ）ベンゾインイソプロピルエ−テル ４ｇ （ホ）ジシアンジアミド ４ｇ （ヘ）２，４−ジアミノ−６−〔２’−メチルイミダゾリル−（１’）〕− エチル−ｓ−トリアジン １ｇ （ト）その他（塗布特性向上のための添加剤） 適量In this example, a resin composition comprising the following (a) to (f) was prepared and used as the photosensitive insulating resin in the exposure / developing process. (A) Diallyl phthalate resin 100 g (b) Epicolate 828 30 g (c) Pentaerythritol triacrylate 20 g (d) Benzoin isopropyl ether 4 g (f) Dicyandiamide 4 g (f) 2,4-diamino- 6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine 1 g (g) Others (additives for improving coating properties) Appropriate amount
【００５０】まず、上記（イ）〜（ハ）と適量の溶剤
（エチルセロソルブ）とを混合した樹脂組成物を形成
し、８０℃で３０分間加熱撹拌した。次に、前記樹脂組
成物を常温にした後、他の成分（ニ）〜（ト）を混合
し、例えば三本ロ−ルにて混練し、感光性絶縁樹脂を得
た。上記感光性絶縁樹脂６０１を図１（ｄ）に示される
両面プリント配線板の両面にスプレ−コ−タで厚さ５０
μｍ塗布し、８０℃で３０分間の予備乾燥を施し、図６
（ａ）に示される基板を得た。First, a resin composition was prepared by mixing the above (a) to (c) with an appropriate amount of solvent (ethyl cellosolve), and heated and stirred at 80 ° C. for 30 minutes. Next, after the resin composition was brought to room temperature, the other components (d) to (g) were mixed and kneaded with, for example, three rolls to obtain a photosensitive insulating resin. The photosensitive insulating resin 601 is spray coated on both sides of the double-sided printed wiring board shown in FIG.
6 μm, and pre-dried at 80 ° C. for 30 minutes.
The substrate shown in (a) was obtained.
【００５１】次いで、４００Ｗ高圧水銀ランプを用い２
分間、紫外光でパタ−ン露光し、現像してビアホ−ル６
０２を形成し、さらに、全面露光をして図６（ｂ）に示
される基板を得た。その後、前記樹脂膜と後工程にて形
成されるめっき皮膜との接着強度を確保するために樹脂
表面の粗化を行った。使用した粗化液および粗化条件
は、次の通りである。 過マンガン酸カリウム ０．１〜０．５ｍｏｌ／ｌ 水酸化ナトリウム ０．２〜０．４ｍｏｌ／ｌ 液温 ５０〜９０℃Then, using a 400 W high pressure mercury lamp, 2
Minutes, pattern exposure with ultraviolet light, development, and via hole 6
No. 02 was formed, and then the entire surface was exposed to obtain the substrate shown in FIG. Then, the resin surface was roughened in order to secure the adhesive strength between the resin film and the plating film formed in the subsequent step. The roughening liquid and roughening conditions used are as follows. Potassium permanganate 0.1-0.5 mol / l Sodium hydroxide 0.2-0.4 mol / l Liquid temperature 50-90 ° C
【００５２】上記図６（ｂ）に示される基板を３〜１０
分間浸漬し粗化を行い、５０ｖｏｌ％塩酸に３分浸漬し
て中和させ、後に水洗・乾燥して粗化層を形成した。次
に、粗化層を活性化するため触媒液に浸漬し、下地導電
膜を無電解銅めっきにより０．２μｍの厚さに形成した
後、樹脂層を完全硬化するため１５０℃で３０分間加熱
硬化を行い、最後に、厚付け電気銅めっき６０３を１５
μｍを施して図６（ｃ）に示される基板とした。The substrate shown in FIG.
It was immersed for a minute for roughening, was immersed in 50 vol% hydrochloric acid for 3 minutes for neutralization, and was subsequently washed with water and dried to form a roughened layer. Next, after immersing in a catalyst solution to activate the roughening layer and forming a base conductive film to a thickness of 0.2 μm by electroless copper plating, heating at 150 ° C. for 30 minutes to completely cure the resin layer. Harden, and finally, thick electrolytic copper plating 603 15
μm was applied to obtain the substrate shown in FIG.
【００５３】触媒処理液その他および処理条件を下記に
示す。 （触媒処理液）シップレ−社製 キャタプリップ４０４ （２７０ｇ／ｌ） ４５℃、３分 キャタプリップ４０４ （２７０ｇ／ｌ） ４５℃、５分 キャタポジット４４ （３０ｍｌ／ｌ） アクセレ−タ 室温、３分The catalyst treatment liquid and other treatment conditions are shown below. (Catalyst treatment liquid) Shipley Catplip 404 (270 g / l) 45 ° C., 3 minutes Catplip 404 (270 g / l) 45 ° C., 5 minutes Cataposit 44 (30 ml / l) Accelerator room temperature, 3 minutes
【００５４】 （導電膜） シップレ−社製 カッパ−ミックス ３２８Ａ （１２５ｍｌ／ｌ） 室温、１分 カッパ−ミックス ３２８Ｌ （１２５ｍｌ／ｌ） カッパ−ミックス ３２８Ｃ （２５ｍｌ／ｌ）(Conductive Film) Kappa Mix 328A (125 ml / l) at room temperature, 1 minute Kappa Mix 328 L (125 ml / l) Kappa Mix 328 C (25 ml / l)
【００５５】 （銅めっき前処理） ニュ−トラクリ−ン （５０ｖｏｌ％） 室温、３分 硫酸洗浄 （１０ｖｏｌ％） 室温、１分(Copper plating pretreatment) Neutraclean (50 vol%) room temperature, 3 minutes Sulfuric acid cleaning (10 vol%) room temperature, 1 minute
【００５６】（厚付け電気銅めっき） ＣｕＳＯ4・５Ｈ2Ｏ （７５ｍｌ／ｌ） Ｈ2ＳＯ4 （９８ｍｌ／ｌ） ＨＣｌ （０．１５ｍｌ／ｌ） Ｃｕ−ボ−ドＨＡメ−キャップ（１０ｍｌ／ｌ)
（株）荏原ユ−ジライト製 液温 室温 電流密度 ２Ａ／ｄｍ2 (Thick electrolytic copper plating) CuSO 4 .5H 2 O (75 ml / l) H 2 SO 4 (98 ml / l) HCl (0.15 ml / l) Cu-board HA mecap (10 ml / l)
EBARA Yujilite Co., Ltd. liquid temperature room temperature current density 2 A / dm 2
【００５７】次ぎに、通常の方法により基板にエッチン
グレジストを形成し、露光・現像・エッチング・剥離の
工程により銅６０３をパタ−ニングし、さらに、不要な
回路間の触媒を除去して第１層目の導体パタ−ン層６０
４を形成する。その結果、図６（ｄ）に示される基板を
得た。Next, an etching resist is formed on the substrate by a usual method, and the copper 603 is patterned by the steps of exposure, development, etching, and peeling, and the catalyst between unnecessary circuits is removed. 60th conductor pattern layer
4 is formed. As a result, the substrate shown in FIG. 6D was obtained.
【００５８】触媒の除去は５ｗｔ％ＮａＯＨの強アルカ
リ水溶液に１０分間浸漬して実施し、第２層、第３層の
導体パタ−ン層の形成に関しても上記と同様に実施し
た。最後に、ソルダ−レジストを表面に形成して図７に
示される多層配線基板を得た。The catalyst was removed by immersing it in a strong alkaline aqueous solution of 5 wt% NaOH for 10 minutes, and the formation of the second and third conductor pattern layers was also performed in the same manner as above. Finally, a solder resist was formed on the surface to obtain the multilayer wiring board shown in FIG.
【００５９】図７に示される多層配線基板の層構成は、
７０１と７０８とが、キャップとグランド層を兼ね、７
０２，７０３と７０６，７０７とが信号層、７０４と７
０５とが２種類の電源層である。ベ−ス基板の表裏の信
号層間および裏面の電源層とは、穴埋めされた貫通めっ
きスル−ホ−ルと、前記スル−ホ−ルと接続される導体
パッド７０９とにより接続される。The layer structure of the multilayer wiring board shown in FIG.
701 and 708 double as a cap and a ground layer, and
02, 703 and 706, 707 are signal layers, and 704 and 7
Reference numeral 05 denotes two types of power supply layers. The signal layers on the front and back surfaces of the base substrate and the power supply layer on the back surface are connected by a through-plated through-hole filled with holes and a conductor pad 709 connected to the through-hole.
【００６０】〔実施例 ６〕次に、図７を参照して本発
明のさらに他の一実施例に係る多層配線基板の製造方法
を説明する。図７は、本発明のさらに他の一実施例に係
る多層配線基板の説明図である。〔実施例 ５〕におい
ては、前記の如く下地導電膜を無電解銅めっきにより
０．２μｍの厚さに形成したが、〔実施例 ６〕におい
ては、下地導電膜として下記の無電解ニッケルめっきを
施し、〔実施例 ５〕と同様の方法にて図７に示される
多層配線基板を得た。[Embodiment 6] Next, a method for manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is an explanatory view of a multilayer wiring board according to still another embodiment of the present invention. In [Example 5], the underlying conductive film was formed to a thickness of 0.2 µm by electroless copper plating as described above, but in [Example 6], the following electroless nickel plating was used as the underlying conductive film. Then, the multilayer wiring board shown in FIG. 7 was obtained in the same manner as in [Example 5].
【００６１】 （無電解ニッケルめっき液） ブル−シュ−マ−（Ｎｉ−Ｐ） 原液使用 カニゼン社製 液温 ８０℃ めっき時間 ５分 下地導電膜は、銅よりもニッケルの方が樹脂との接着強
度は大きい。(Electroless Nickel Plating Solution) Blu-Schuma- (Ni-P) Undiluted solution made by Kanigen Co., Ltd. Liquid temperature 80 ° C. Plating time 5 minutes Nickel is more bonded to resin than copper in the underlying conductive film. The strength is great.
【００６２】〔実施例 ７〕次に、図１，７を参照して
本発明のさらに他の一実施例に係る多層配線基板の製造
方法を説明する。図１（ｄ）に示される両面プリント配
線板の表面導体の保護および下地導電膜に〔実施例
６〕と同様の無電解ニッケルめっきを用い、粗化液およ
び粗化条件として下記のクロム硫酸粗化液および条件を
用い、他の条件は〔実施例 ５〕と同様にして、図７に
示される多層配線基板を得た。[Embodiment 7] Next, a method for manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIGS. [Examples] for protecting the surface conductor and the underlying conductive film of the double-sided printed wiring board shown in FIG.
6] using the same electroless nickel plating as the roughening solution and the roughening solution and the following roughening solution of chromium sulfate, and the other conditions are shown in FIG. 7 in the same manner as in [Example 5]. A multi-layered wiring board was obtained.
【００６３】 クロム硫酸粗化液および条件 無水クロム酸 ２．０ｍｏｌ／ｌ〜飽和濃度 硫酸 ３．６〜６ｍｏｌ／ｌ 液温 ５０〜８０℃ 時間 ３〜１０分 アルカリ中和処理 ５〜１０分Chromium-sulfuric acid roughening liquid and conditions Chromic anhydride 2.0 mol / l-saturation concentration Sulfuric acid 3.6-6 mol / l Liquid temperature 50-80 ° C. time 3-10 minutes Alkaline neutralization treatment 5-10 minutes
【００６４】〔実施例 ８〕次に、図２，７を参照して
本発明のさらに他の一実施例に係る多層配線基板の製造
方法を説明する。〔実施例 ２〕の方法で形成した図２
に示される穴埋めされた層間接続スル−ホ−ルの導体と
前記導体に接続される導体パッドが設けられた両面プリ
ント配線板を用い、この上に〔実施例 ６〕と同様のビ
ルドアップ法により図７に示される多層配線基板と同様
の層を構成した多層配線基板を製造した。[Embodiment 8] Next, a method for manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIGS. FIG. 2 formed by the method of [Example 2]
The double-sided printed wiring board provided with the conductor of the inter-layer connection through hole filled in and the conductor pad connected to the conductor is used, and a build-up method similar to that of [Example 6] is applied thereon. A multilayer wiring board having the same layers as the multilayer wiring board shown in FIG. 7 was manufactured.
【００６５】〔実施例 ９〕次に、図３，７を参照して
本発明のさらに他の一実施例に係る多層配線基板の製造
方法を説明する。〔実施例 ３〕の方法で形成した図３
（ｄ）に示される穴埋めされた層間接続スル−ホ−ルの
導体と接続する導体パッドが設けられた両面プリント配
線板を用い、この上に〔実施例 ６〕と同様のビルドア
ップ法にて図７に示される多層配線基板と同様の層構成
の多層配線基板を製造した。[Embodiment 9] Next, a method of manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIGS. FIG. 3 formed by the method of [Example 3]
A double-sided printed wiring board provided with conductor pads connected to the conductors of the interlayer connection through holes shown in (d) is used, and a build-up method similar to that of [Example 6] is applied thereon. A multilayer wiring board having the same layer structure as that of the multilayer wiring board shown in FIG. 7 was manufactured.
【００６６】〔実施例 １０〕次に、図４，７を参照し
て本発明のさらに他の一実施例に係る多層配線基板の製
造方法を説明する。〔実施例 ４〕の方法で形成した図
４に示される穴埋めされた層間接続スル−ホ−ルの導体
と前記導体に接続される導体パッドが設けられた両面プ
リント配線板を用い、この上に〔実施例 ６〕と同様の
ビルドアップ法にて図７の多層配線基板と同様の層構成
の多層配線基板を製造した。[Embodiment 10] Next, a method of manufacturing a multilayer wiring board according to still another embodiment of the present invention will be described with reference to FIGS. A double-sided printed wiring board provided with the conductor of the interlayer connection through hole shown in FIG. 4 formed by the method of [Example 4] and the conductor pad connected to the conductor is provided thereon. A multilayer wiring board having the same layer structure as that of the multilayer wiring board of FIG. 7 was manufactured by the same build-up method as in [Example 6].
【００６７】上記各実施例の多層配線基板と貫通スル−
ホ−ルやインタ−スティシャルビアホ−ルで層間接続を
とる通常の多層配線基板とを比較すると、格子ピッチを
１．２７ｍｍとし、格子間に２本の配線を形成できると
して計算した時の配線密度（格子の数、配線長を考慮）
を１とすると、本実施例の多層配線基板のビルドアップ
法により形成した薄膜多層配線層は、格子ピッチ０．６
３５ｍｍに少なくとも２本の配線を形成できるので相対
配線密度は約２倍とすることができる。The multilayer wiring board and the through-hole via of each of the above embodiments
Comparing with a normal multi-layer wiring board in which layers are connected by holes or interstitial via holes, it is calculated that the grid pitch is 1.27 mm and two wires can be formed between the grids. Wiring density (considering the number of grids and wiring length)
Is 1, the thin film multilayer wiring layer formed by the build-up method of the multilayer wiring board of this embodiment has a lattice pitch of 0.6.
Since at least two wirings can be formed in 35 mm, the relative wiring density can be doubled.
【００６８】これは面積を同じとすると信号層数を１／
２に、逆に、信号層数を同じとすると面積を１／２にす
ることができる計算になり、高密度化とコスト低減の効
果が大きい。これに対して、製造の最終段階で貫通めっ
きスル−ホ−ルを形成すると、その面積分の配線をロス
することになる。When the area is the same, the number of signal layers is 1 /
On the contrary, if the number of signal layers is the same, the area can be halved, and the effect of high density and cost reduction is great. On the other hand, if a through-plated through hole is formed in the final stage of manufacturing, the wiring for that area will be lost.
【００６９】上記各実施例は、両面プリント配線板の両
表層導体を２種類の電源層とし、この両面にＸＹ信号層
２層と、グランドとキャップ層とをかねた１層とを形成
して成る多層配線基板およびその製造方法について説明
したが、本発明は、層構成に限定されるものでなく、上
記両面プリント配線板の内層にＸＹ信号層２層を入れた
４層板を用いても差し支えない。In each of the above embodiments, two surface layer conductors of the double-sided printed wiring board are used as two kinds of power supply layers, and two XY signal layers and one layer serving as a ground and a cap layer are formed on both surfaces. Although the multilayer wiring board and the method of manufacturing the same have been described, the present invention is not limited to the layer structure, and a four-layer board in which two XY signal layers are inserted in the inner layer of the double-sided printed wiring board is used. It doesn't matter.
【００７０】また、溶剤を含まない流動性有機系高分子
前駆体の前記フィルム組成物についても、上記実施例で
は、４官能ポキシ樹脂エピクロンＥＸＡ４７００（大日
本インキ化学製造（株）製商品名）とフェノ−ル樹脂バ
−カムＴＤ２１３１（大日本インキ化学製造（株）製商
品名）６５ｐｈｒとを混練し溶融成形したものを用いた
が、ビスマレイミド／シアン酸エステル系材料であるＢ
Ｔ−３３０９Ｔ（三菱瓦斯化学（株）製商品名）やベン
ゾシクロブテン系材料である１８０℃で５時間加熱して
オリゴマ−化したシスビスベンゾシクロブテニルエテン
を用いても差し支えない。その際の硬化温度はそれぞれ
２２０℃，２５０℃とすることが好ましい。Further, regarding the above-mentioned film composition of the fluid organic polymer precursor containing no solvent, the tetrafunctional epoxy resin Epicron EXA4700 (trade name, manufactured by Dainippon Ink and Chemicals, Inc.) was used in the above examples. A phenol resin bar cam TD2131 (trade name, manufactured by Dainippon Ink and Chemicals, Inc.) 65 phr was kneaded and melt-molded, and was a bismaleimide / cyanate ester material B.
T-3309T (trade name, manufactured by Mitsubishi Gas Chemical Co., Inc.) or cisbisbenzocyclobutenylethene, which is a benzocyclobutene-based material and is oligomerized by heating at 180 ° C. for 5 hours, may be used. The curing temperature at that time is preferably 220 ° C. and 250 ° C., respectively.
【００７１】[0071]
【発明の効果】以上詳細に説明したように、本発明によ
れば、耐熱性、機械特性、電気特性等の特性に優れ、低
コスト、かつ、信頼性が高い、貫通めっきスル−ホ−ル
の穴の影響がない、高密度配線機能を有する多層配線基
板，ビルドアップ法が形成しうる本来の高密度配線機能
を最大限に活用するその製造方法および前記多層配線基
板に用いられる両面プリント配線板の製造方法を提供す
ることができる。As described in detail above, according to the present invention, through-plating through-holes having excellent characteristics such as heat resistance, mechanical properties, and electrical properties, low cost, and high reliability are provided. Multilayer wiring board having a high-density wiring function that is not affected by the holes in the wiring, its manufacturing method that maximizes the original high-density wiring function that can be formed by the build-up method, and double-sided printed wiring used for the multilayer wiring board A method for manufacturing a plate can be provided.
【図１】本発明の一実施例に係る両面プリント配線板お
よびその製造方法を示す説明図である。FIG. 1 is an explanatory view showing a double-sided printed wiring board and a method for manufacturing the same according to one embodiment of the present invention.
【図２】本発明に他の一実施例に係る両面プリント配線
板を示す説明図である。FIG. 2 is an explanatory view showing a double-sided printed wiring board according to another embodiment of the present invention.
【図３】本発明にさらに他の一実施例に係る両面プリン
ト配線板の製造方法を示す説明図である。FIG. 3 is an explanatory view showing a method for manufacturing a double-sided printed wiring board according to still another embodiment of the present invention.
【図４】本発明にさらに他の一実施例に係る両面プリン
ト配線板を示す説明図である。FIG. 4 is an explanatory view showing a double-sided printed wiring board according to still another embodiment of the present invention.
【図５】本発明の一実施例に係る両面プリント配線板の
製造方法を示す説明図である。FIG. 5 is an explanatory diagram showing a method for manufacturing a double-sided printed wiring board according to an embodiment of the present invention.
【図６】本発明のさらに他の一実施例に係る多層配線基
板の製造方法の説明図である。FIG. 6 is an explanatory view of a method for manufacturing a multilayer wiring board according to still another embodiment of the present invention.
【図７】本発明のさらに他の一実施例に係る多層配線基
板の説明図である。FIG. 7 is an explanatory diagram of a multilayer wiring board according to still another embodiment of the present invention.
１０１ 両面の信号層を接続する貫通めっきスル−ホ−
ル １０２ 裏面の電源層との接続をとる貫通めっきスル−
ホ−ル １０３ 裏面の電源層との接続をとる貫通めっきスル−
ホ−ル １０４ 有機系高分子の絶縁膜 １０５ 溶剤を含まない流動性有機系高分子前駆体のフ
イルム状組成物 １０６ 表層導体部 １０７ 銅 １０８ 穴埋めされた層間接続スル−ホ−ルの導体と接
続する導体パッド ２０１ 穴埋めされた層間接続スル−ホ−ルの導体と接
続する導体パッド ３０１ 両面の信号層を接続する貫通めっきスル−ホ−
ル ３０２ 裏面の電源層との接続をとる貫通めっきスル−
ホ−ル ３０３ 裏面の電源層との接続をとる貫通めっきスル−
ホ−ル ３０４ 有機系高分子絶縁膜 ３０５ 導体パッド ３０６ 銅 ４０１ 導体パッド ５０１ 金型 ６０１ 感光性絶縁樹脂 ６０２ ビアホ−ル ６０３ 銅 ６０４ 導体パタ−ン層 ７０１ キャップ層をかねるグランド層 ７０２ 信号層 ７０３ 信号層 ７０４ 電源層 ７０５ 電源層 ７０６ 信号層 ７０７ 信号層 ７０８ キャップ層をかねるグランド層 ７０９ 導体パッド101 Through plating through hole for connecting signal layers on both sides
Through 102 plated through-hole for connecting to the power supply layer on the back side
Hole 103 Through-plating through which connects to the power supply layer on the back surface
Hole 104 Organic polymer insulating film 105 Solvent-free fluid organic polymer precursor film-like composition 106 Surface layer conductor section 107 Copper 108 Filled interlayer connection Connection with conductor of through hole Conductor pad 201 Conductor pad 301 to be connected to the conductor of the interlayer connection through hole that is filled in 301 Through-plating through hole to connect the signal layers on both sides
Ruler 302 Penetration plated through for connecting to the power supply layer on the back side
Hole 303 Penetration plated through for connecting to the power supply layer on the back side
Hole 304 Organic polymer insulating film 305 Conductor pad 306 Copper 401 Conductor pad 501 Mold 601 Photosensitive insulating resin 602 Via hole 603 Copper 604 Conductor pattern layer 701 Ground layer 702 that functions as a cap layer 702 Signal layer 703 Signal Layer 704 Power layer 705 Power layer 706 Signal layer 707 Signal layer 708 Ground layer that also functions as cap layer 709 Conductor pad
フロントページの続き (72)発明者 渡部 真貴雄 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 今林 慎一郎 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 田中 勇 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 岡 齋 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 京井 正之 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 谷口 幸弘 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所情報通信事業部内Front page continuation (72) Inventor Makio Watanabe 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside Production Engineering Research Laboratory, Hitachi, Ltd. (72) Inventor Shinichiro Imabayashi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside the Hitachi, Ltd. Production Technology Research Laboratory (72) Inventor Isamu Tanaka, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi Production Engineering Research Center (72) Inventor Sai Oka 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Address Company, Hitachi, Ltd., Production Engineering Laboratory (72) Inventor, Masayuki Kyoi, 292, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture, Ltd., Production Company, Hitachi, Ltd. (72), Yukihiro Taniguchi, Totsuka-ku, Yokohama, Kanagawa Prefecture 216 Totsuka-cho Incorporated company Hitachi Ltd. Information & Communication Division
Claims (11)
体と接続する導体パッドが設けられた両面プリント配線
板上に、少なくとも１層以上の導体パタ−ン層と層間絶
縁膜層とが交互に形成され、該導体パッドと導体パタ−
ン層および導体パタ−ン層同士が電気的に接続されて成
る多層配線基板。1. A double-sided printed wiring board provided with a conductor pad for connecting with a conductor of a buried interlayer connection through hole, at least one conductor pattern layer and an interlayer insulating film layer. The conductor pads and the conductor patterns are alternately formed.
A multilayer wiring board in which a wiring layer and a conductor pattern layer are electrically connected to each other.
表層導体がパタ−ニングされた両面プリント配線板の前
記貫通めっきスル−ホ−ルおよび前記導体間隙を有機系
高分子の絶縁膜で充填する工程と、 （２）該両面プリント配線板の表層導体および貫通めっ
きスル−ホ−ル導体の所定位置に接続する導体パッドを
形成する工程とを含む穴埋めされた層間接続スル−ホ−
ルの導体と前記導体に接続される導体パッドが設けられ
た両面プリント配線板の製造方法。2. (1) Having a through-hole plated through hole,
A step of filling the through-plated through-hole and the conductor gap of a double-sided printed wiring board having a surface layer conductor patterned with an insulating film of an organic polymer, (2) a surface layer conductor of the double-sided printed wiring board And a through-hole plated through-hole conductor, and a step of forming a conductor pad connected to a predetermined position of the through-plated through-hole conductor.
And a conductor pad connected to the conductor.
表層導体がパタ−ニングされていない両面プリント配線
板の前記貫通めっきスル−ホ−ルを有機系高分子の絶縁
膜で充填する工程と、 （２）該両面プリント配線板表層導体および貫通めっき
スル−ホ−ル導体の所定位置に接続する導体パッドを形
成する工程とを含む穴埋めされた層間接続スル−ホ−ル
の導体と前記導体に接続される導体パッドが設けられた
両面プリント配線板の製造方法。3. A through-hole plated through hole is provided,
A step of filling the through-plating through-hole of the double-sided printed wiring board in which the surface layer conductor is not patterned with an insulating film of an organic polymer, and (2) the double-sided printed wiring board surface layer conductor and the through-plating layer. A double-sided printed wiring board provided with a conductor of an interlayer connection through hole which is filled with a conductor pad and a conductor pad which is connected to the conductor. Production method.
体がパタ−ニングされた両面プリント配線板の前記貫通
めっきスル−ホ−ルおよび前記導体間隙を有機系高分子
の絶縁膜で充填する工程が、 （１）該両面プリント配線板上に表面の平坦な金型を設
置し、該両面プリント配線板と該金型との間に溶剤を含
まない流動性有機系高分子前駆体を挾む工程と、 （２）該金型と該両面プリント配線板との間を排気する
工程と、 （３）該金型を該両面プリント配線板方向へ移動させて
該溶剤を含まない流動性有機系高分子前駆体を前記貫通
めっきスル−ホ−ルおよび前記導体間隙に充填する工程
と、 （４）該溶剤を含まない流動性有機系高分子前駆体に静
水圧をかける工程と、 （５）該溶剤を含まない流動性有機系高分子前駆体を硬
化する工程と、 （６）該有機系高分子で覆われた前記導体上面を露出さ
せる工程と、 を含むことを特徴とする穴埋めされた層間接続スル−ホ
−ルの導体と前記導体に接続される導体パッドが設けら
れた両面プリント配線板の製造方法。4. A through-hole plating through-hole and a conductor gap of a double-sided printed wiring board having a through-hole plating through-hole and a surface layer conductor patterned, are made of an organic polymer insulating film. The filling step includes (1) a fluid organic polymer precursor in which a mold having a flat surface is placed on the double-sided printed wiring board and a solvent is not contained between the double-sided printed wiring board and the mold. And (2) a step of exhausting the space between the mold and the double-sided printed wiring board, and (3) moving the mold toward the double-sided printed wiring board and flowing without the solvent. A conductive organic polymer precursor into the through plating through-hole and the conductor gap, and (4) applying hydrostatic pressure to the fluid organic polymer precursor containing no solvent, (5) a step of curing the fluid organic polymer precursor containing no solvent (6) exposing the upper surface of the conductor covered with the organic polymer, and the conductor of the buried interlayer connection through hole and the conductor pad connected to the conductor. A method for manufacturing the provided double-sided printed wiring board.
体がパタ−ニングされていない両面プリント配線板の前
記貫通めっきスル−ホ−ルを有機系高分子の絶縁膜で充
填する工程が、 （１）該両面プリント配線板上に表面の平坦な金型を設
置し、該両面プリント配線板と該金型との間に溶剤を含
まない流動性有機系高分子前駆体を挾む工程と、 （２）該金型と該両面プリント配線板との間を排気する
工程と、 （３）該金型を該両面プリント配線板方向へ移動させて
該溶剤を含まない流動性有機系高分子前駆体を前記貫通
めっきスル−ホ−ルおよび前記導体間隙に充填する工程
と、 （４）該溶剤を含まない流動性有機系高分子前駆体に静
水圧をかける工程と、 （５）該溶剤を含まない流動性有機系高分子前駆体を硬
化する工程と、 （６）該有機系高分子で覆われた前記導体上面を露出さ
せる工程とを含むことを特徴とする穴埋めされた層間接
続スル−ホ−ルの導体と前記導体に接続される導体パッ
ドが設けられた両面プリント配線板の製造方法。5. A step of filling the through-plated through-hole of a double-sided printed wiring board having a through-plated through-hole and the surface layer conductor not being patterned with an insulating film of an organic polymer. (1) A mold having a flat surface is placed on the double-sided printed wiring board, and a fluid organic polymer precursor containing no solvent is sandwiched between the double-sided printed wiring board and the mold. And (2) a step of evacuating the space between the mold and the double-sided printed wiring board, and (3) moving the mold toward the double-sided printed wiring board so as not to contain the solvent. A step of filling a polymer precursor into the through plating through-hole and the conductor gap; (4) a step of applying hydrostatic pressure to the fluid organic polymer precursor containing no solvent; Curing the fluid organic polymer precursor containing no solvent, (6) A step of exposing the upper surface of the conductor covered with a mechanical polymer, a double-sided print provided with a conductor of a buried interlayer connection through hole and a conductor pad connected to the conductor. Wiring board manufacturing method.
通めっきスル−ホ−ル導体の所定位置に接続する導体パ
ッドを形成する工程が、 （１）前記貫通めっきスル−ホ−ルまたは前記貫通めっ
きスル−ホ−ルと前記表層導体の間隙とが有機系高分子
の絶縁膜で充填された両面プリント配線板の表面全面に
パッド用導体を形成する工程と、 （２）該導体上の所定位置にレジストの残しパタ−ンを
形成する工程と、 （３）該導体をエッチングにより所定の形状にパタ−ニ
ングし、該レジストを剥離する工程とを含むことを特徴
とする穴埋めされた層間接続スル−ホ−ルの導体と前記
導体に接続される導体パッドが設けられた両面プリント
配線板の製造方法。6. The step of forming a conductor pad connected to a predetermined position of a surface layer conductor and a through plating through hole conductor of a double-sided printed wiring board comprises: (1) the through plating through hole or the through plating. A step of forming a pad conductor on the entire surface of a double-sided printed wiring board in which a gap between the through-hole and the surface conductor is filled with an organic polymer insulating film, and (2) a predetermined position on the conductor And (3) patterning the conductor into a predetermined shape by etching, and peeling the resist to remove the resist. A method for manufacturing a double-sided printed wiring board provided with a conductor of a hole and a conductor pad connected to the conductor.
通めっきスル−ホ−ル導体の所定位置に接続する導体パ
ッドを形成する工程が、 （１）前記貫通めっきスル−ホ−ルまたは前記貫通めっ
きスル−ホ−ルと前記導体間隙とが有機系高分子の絶縁
膜で充填された両面プリント配線板表面の所定位置にレ
ジストの抜きパタ−ンを形成する工程、 （２）該レジストの抜きパタ−ン内に導体を形成し、該
レジストを剥離する工程とを含むことを特徴とする穴埋
めされた層間接続スル−ホ−ルの導体と前記導体に接続
される導体パッドが設けられた両面プリント配線板の製
造方法。7. A step of forming a conductor pad connected to a predetermined position of a surface layer conductor and a through-plated through-hole conductor of a double-sided printed wiring board comprises: (1) the through-plated through hole or the through-plated plate. Forming a resist removal pattern at a predetermined position on the surface of the double-sided printed wiring board in which the through-hole and the conductor gap are filled with an organic polymer insulating film; (2) the resist removal pattern A double-sided print provided with a conductor of a hole-filled interlayer connection through hole and a conductor pad connected to the conductor. Wiring board manufacturing method.
体と前記導体に接続される導体パッドが設けられたプリ
ント配線板上に、 （１）感光性絶縁樹脂を成膜する工程と、 （２）露光、現像により該感光性絶縁樹脂にビアホ−ル
を形成する工程と、 （３）露光された該感光性絶縁樹脂表面を粗化する工程
と、 （４）導体を形成する工程と、 （５）熱硬化により該感光性絶縁樹脂を完全硬化する工
程と、 （６）該導体のエッチングによりパタ−ンを形成する工
程とを繰り返し、多層化することを特徴とする請求項１
記載の多層配線基板の製造方法。8. A step (1) of forming a photosensitive insulating resin film on a printed wiring board provided with a conductor of a buried interlayer connection through hole and a conductor pad connected to the conductor. (2) forming a via hole in the photosensitive insulating resin by exposure and development; (3) roughening the exposed surface of the photosensitive insulating resin; and (4) forming a conductor. And (5) the step of completely curing the photosensitive insulating resin by thermosetting and (6) the step of forming a pattern by etching the conductor are repeated to form a multilayer structure.
A method for manufacturing the multilayer wiring board described.
体が、多官能エポキシ樹脂組成物，分子内に２個以上の
マレイミド骨格を有する化合物の組成物，分子内に２個
以上のシアン酸エステル骨格を有する化合物の組成物，
分子内に２個以上のベンゾシクロブテン骨格を有する化
合物の組成物の内、少なくとも１つ以上を含むいずれか
の組成物であることを特徴とする請求項４，５記載のい
ずれかの両面プリント配線板の製造方法。9. A solvent-free fluid organic polymer precursor is a polyfunctional epoxy resin composition, a composition of a compound having two or more maleimide skeletons in the molecule, and two or more cyan in the molecule. A composition of a compound having an acid ester skeleton,
The double-sided print according to any one of claims 4 and 5, which is any composition containing at least one or more of the compositions of compounds having two or more benzocyclobutene skeletons in the molecule. Wiring board manufacturing method.
において固形の多官能不飽和化合物，エポキシ樹脂，ア
クリレ−トモノマ−，光重合開始剤，アミン系の熱硬化
剤を含む組成物あるいは不飽和基を付加反応させた２官
能以上の多官能固形エポキシ樹脂，アクリレ−トモノマ
−，光重合開始剤，アミン系の熱硬化剤を含む組成物の
いずれかであることを特徴とする請求項８記載の多層配
線基板の製造方法。10. A composition or unsaturated group in which the photosensitive insulating resin contains at least a polyfunctional unsaturated compound which is solid at room temperature, an epoxy resin, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent. 9. A composition comprising a polyfunctional solid epoxy resin having at least two functional groups obtained by addition reaction with acrylate, an acrylate monomer, a photopolymerization initiator, and an amine-based thermosetting agent. Manufacturing method of multilayer wiring board.
ドまたはジアミノトリアジン化合物のいずれかであるこ
とを特徴とする請求項１０記載の多層配線基板の製造方
法。11. The method for manufacturing a multilayer wiring board according to claim 10, wherein the amine-based thermosetting agent is either a dicyandiamide or a diaminotriazine compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168193A JPH06275959A (en) | 1993-03-22 | 1993-03-22 | Multilayer wiring substrate, manufacture thereof, and manufacture of double side printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168193A JPH06275959A (en) | 1993-03-22 | 1993-03-22 | Multilayer wiring substrate, manufacture thereof, and manufacture of double side printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06275959A true JPH06275959A (en) | 1994-09-30 |
Family
ID=13178256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6168193A Pending JPH06275959A (en) | 1993-03-22 | 1993-03-22 | Multilayer wiring substrate, manufacture thereof, and manufacture of double side printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06275959A (en) |
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|---|---|---|---|---|
| WO1999020090A1 (en) * | 1997-10-14 | 1999-04-22 | Ibiden Co., Ltd. | Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| WO2000001209A1 (en) * | 1998-06-26 | 2000-01-06 | Ibiden Co., Ltd. | Multilayer printed wiring board and production method thereof |
| JP2000003037A (en) * | 1999-01-11 | 2000-01-07 | Nec Corp | Wiring structure and its production |
| JP2000022334A (en) * | 1998-06-26 | 2000-01-21 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
| WO2000030419A1 (en) * | 1998-11-18 | 2000-05-25 | Daiwa Co., Ltd. | Method of manufacturing wiring boards |
| US6226862B1 (en) * | 1998-04-30 | 2001-05-08 | Sheldahl, Inc. | Method for manufacturing printed circuit board assembly |
| US6384344B1 (en) | 1995-06-19 | 2002-05-07 | Ibiden Co., Ltd | Circuit board for mounting electronic parts |
| US6427325B1 (en) | 1998-09-01 | 2002-08-06 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
| EP1318708A2 (en) * | 1995-10-23 | 2003-06-11 | Ibiden Co., Ltd. | Resin filler and multilayer printed wiring board |
| US6706975B2 (en) | 2000-07-13 | 2004-03-16 | Ngk Spark Plug Co., Ltd. | Paste for filling throughhole and printed wiring board using same |
| JP2004349672A (en) * | 2002-07-10 | 2004-12-09 | Ngk Spark Plug Co Ltd | Filler material, multilayer wiring substrate using the same, and method of manufacturing multilayer wiring substrate |
| WO2005022970A1 (en) * | 2003-08-28 | 2005-03-10 | International Business Machines Corporation | Method for manufacturing printed wiring board and printed wiring board |
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-
1993
- 1993-03-22 JP JP6168193A patent/JPH06275959A/en active Pending
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