JPH06188335A - Resin sealed semiconductor device - Google Patents
Resin sealed semiconductor deviceInfo
- Publication number
- JPH06188335A JPH06188335A JP34081092A JP34081092A JPH06188335A JP H06188335 A JPH06188335 A JP H06188335A JP 34081092 A JP34081092 A JP 34081092A JP 34081092 A JP34081092 A JP 34081092A JP H06188335 A JPH06188335 A JP H06188335A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base plate
- semiconductor device
- semiconductor chip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、スナバダイオードを実
施対象とした樹脂封止形半導体装置、特にその組立構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device for which a snubber diode is used, and more particularly to an assembly structure thereof.
【０００２】[0002]
【従来の技術】まず、スナバダイオードを例に、頭記樹
脂封止形半導体装置の従来構造を図４（ａ）〜（ｃ）に
示す。図において、１は放熱ベース板、２は平坦板の単
体ベース、３は半導体チップ（ダイオード）、４はコ字
形の単体電極、５は外部導出端子、６は樹脂ケース、７
は封止樹脂、８は半田接合部である。2. Description of the Related Art First, a conventional structure of the above-mentioned resin-encapsulated semiconductor device is shown in FIGS. 4A to 4C, taking a snubber diode as an example. In the figure, 1 is a heat dissipation base plate, 2 is a flat plate single base, 3 is a semiconductor chip (diode), 4 is a U-shaped single electrode, 5 is an external lead terminal, 6 is a resin case, 7
Is a sealing resin, and 8 is a solder joint.
【０００３】かかる構成の半導体装置は次記のようにし
て組立られる。まず、放熱ベース板１の上面に単体ベー
ス２，半導体チップ３，単体電極４，外部導出端子５を
順に積み重ねて各部品の相互間を半田接合する。次に各
部品を包囲して筒形の樹脂ケース６を放熱ベース板１の
上に取付ける。この場合に、ケース６の下部両サイドか
ら下方に突出した突起片６ａを放熱ベース板１の両サイ
ドに切欠いた溝１ａに嵌め込んで固定し、この状態で樹
脂ケース７の内方に封止樹脂（エポキシ樹脂）７を充填
してケース内に組み込まれた各部品を樹脂封止する。The semiconductor device having such a structure is assembled as follows. First, the single base 2, the semiconductor chip 3, the single electrode 4, and the external lead-out terminal 5 are sequentially stacked on the upper surface of the heat dissipation base plate 1, and the respective components are solder-bonded to each other. Next, a cylindrical resin case 6 is mounted on the heat dissipation base plate 1 so as to surround each component. In this case, the protruding pieces 6a protruding downward from both lower sides of the case 6 are fitted and fixed in the grooves 1a notched on both sides of the heat dissipation base plate 1, and sealed inwardly of the resin case 7 in this state. A resin (epoxy resin) 7 is filled and each component incorporated in the case is resin-sealed.
【０００４】[0004]
【発明が解決しようとする課題】ところで、前記した従
来の組立構造では、信頼性の面で次記のような問題点が
ある。 （１）ヒートサイクルに起因して半導体チップ３に加わ
るストレスが大きく、チップに歪が発生し易い。すなわ
ち、半導体チップ３に対して封止樹脂７の膨張係数は約
１０倍程度であり、図４の構造ではヒートサイクルに伴
う熱的ストレスが直接半導体チップ３に作用する。The conventional assembly structure described above has the following problems in terms of reliability. (1) The stress applied to the semiconductor chip 3 due to the heat cycle is large, and the chip is likely to be distorted. That is, the expansion coefficient of the sealing resin 7 is about 10 times that of the semiconductor chip 3, and in the structure of FIG. 4, the thermal stress accompanying the heat cycle directly acts on the semiconductor chip 3.
【０００５】（２）半導体装置を放熱体に取付けた実使
用の状態で外部導出端子５に対しネジを締結するなどし
て外力を加えると、外部導出端子５と封止樹脂７との
間、および放熱ベース板１と封止樹脂７の間に大きな応
力が加わり、このために半田接合部が剥離して接続不良
を引き起こすほか、ケース内の各所で封止樹脂の接合面
に剥離が生じて耐湿性の劣化を来すようになる。(2) When an external force is applied to the external lead-out terminal 5 such as by fastening a screw to the external lead-out terminal 5 in a state of actual use in which the semiconductor device is attached to a heat radiator, a gap between the external lead-out terminal 5 and the sealing resin 7 is generated. Also, a large stress is applied between the heat dissipation base plate 1 and the sealing resin 7, which causes the solder joint to peel off and cause a connection failure, and also causes peeling on the joint surface of the sealing resin at various places in the case. The moisture resistance will deteriorate.
【０００６】本発明は上記の点にかんがみなされたもの
であり、その目的は前記課題を解決して機械的強度の向
上，並びに半導体チップに加わる熱的ストレスの緩和が
図れるようにした樹脂封止形半導体装置の組立構造を提
供することにある。The present invention has been made in view of the above points, and an object of the present invention is to solve the above-mentioned problems and improve the mechanical strength and alleviate the thermal stress applied to a semiconductor chip by resin encapsulation. To provide an assembly structure of a semiconductor device.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の樹脂封止形半導体装置においては、次記の
ように構成するものとする。 （１）外部導出端子の板面に封止樹脂と結合し合う投錨
穴を開口するとともに、端子の下端部にコ字形の電極部
を屈曲形成して半導体チップの表面電極に半田付けす
る。In order to achieve the above object, the resin-encapsulated semiconductor device of the present invention is configured as follows. (1) An anchor hole to be combined with the sealing resin is opened on the plate surface of the external lead-out terminal, and a U-shaped electrode portion is formed by bending at the lower end portion of the terminal and soldered to the surface electrode of the semiconductor chip.
【０００８】（２）単体ベースを断面Ｕ字形に成形し、
そのベース基板から起立する側壁部で半導体チップの側
面を包囲する。 （３）樹脂ケースを底面開放形のキャップ状容器となし
て外部導出端子に一体結合するとともに、その底部側周
縁には放熱ベース板に穿孔した取付穴に差し込んでカシ
メ止めする脚片を設け、さらにケース上面に樹脂注入孔
を開口する。(2) A single base is molded into a U-shaped cross section,
The side wall of the semiconductor chip is surrounded by the side wall portion rising from the base substrate. (3) The resin case is formed as a cap-shaped container with an open bottom to be integrally connected to the external lead-out terminal, and the bottom side peripheral edge thereof is provided with a leg piece which is inserted into a mounting hole formed in the heat dissipation base plate and is caulked. Further, a resin injection hole is opened on the upper surface of the case.
【０００９】（４）前項（１),（２),（３）の各構造を
組み合わせて構成する。(4) The above-mentioned structures (1), (2), and (3) are combined and constructed.
【００１０】[0010]
【作用】前項（１）の構成によれば、外部導出端子の投
錨穴に封止樹脂が充填されるので外部導出端子と封止樹
脂との結合力が強化されるほか、外部導出端子と電極部
を一体化したのでその分だけ部品点数，半田付け箇所が
減り、組立工程が少なくて済む。According to the structure of the above (1), since the anchoring hole of the external lead-out terminal is filled with the sealing resin, the bonding force between the external lead-out terminal and the sealing resin is strengthened, and the external lead-out terminal and the electrode. Since the parts are integrated, the number of parts and soldering points are reduced accordingly, and the assembly process is reduced.
【００１１】また、前項（２）の構成により、温度変化
に伴って封止樹脂から半導体チップに向けて加わる熱的
ストレスに対し、断面Ｕ字形単体ベースの側壁部が緩衝
体として有効に働き、半導体チップに直接作用するスト
レスを緩和する。さらに、前項（３）の構成により、樹
脂ケースと外部導出端子との間，および樹脂ケースと放
熱ベース板との間の結合力が大となるので、外力による
曲げ応力などに対する機械的強度が増し、内部に充填さ
れている封止樹脂の剥離，半導体チップの歪発生を安全
に保護できる。Further, according to the constitution of the above item (2), the side wall portion of the unit base having the U-shaped section effectively acts as a buffer against the thermal stress applied from the sealing resin toward the semiconductor chip due to the temperature change, Relieves stress that acts directly on semiconductor chips. Further, with the configuration of the above item (3), since the coupling force between the resin case and the external lead-out terminal and between the resin case and the heat dissipation base plate becomes large, mechanical strength against bending stress due to external force increases. It is possible to safely protect the peeling of the sealing resin filled inside and the distortion of the semiconductor chip.
【００１２】また、前項（１）〜（３）の構造を併用す
ることで半導体装置の信頼性がより一層高まる。Further, the reliability of the semiconductor device is further improved by using the structures of the above (1) to (3) together.
【００１３】[0013]
【実施例】以下、本発明の実施例を図１ないし図３によ
り説明する。なお、実施例の図中で図４に対応する同一
部材には同じ符号が付してある。すなわち、実施例の組
立構造においては、まず、放熱ベース板１と半導体チッ
プ２との間に介挿した単体ベース２は断面Ｕ字形に屈曲
加工されており、そのベース基板の左右両側に側壁部２
ａが起立成形されている。この側壁部２ａは単体ベース
２に搭載した半導体チップ３の側面を十分カバーするだ
けの高さを有する。また、外部導出端子５については、
封止樹脂７に埋没する部分で板面に投錨穴５ａが開口し
ており、さらに端子の下端部にはコ字形の電極部５ｂが
一体に屈曲形成されており、この電極部５ｂが半導体チ
ップ３の上面電極に半田付けされている。さらに、樹脂
ケース６は下面を開放したキャップ状容器であり、前記
の外部導出端子５と一体に結合してモールド成形される
か、あるいは接着剤により結合されている。また、ケー
スの底部側周縁には、図４に示した突起片６ａのほかに
符号６ｂで示す脚片が複数箇所に形成されており、さら
にケース上面には封止樹脂７を充填する際に使用する樹
脂注入孔６ｃが開口している。そして、樹脂ケース６の
脚片６ｂに対向して放熱ベース板１の板面には差込穴１
ｂが穿孔されている。なお、図３において８ａは各部品
の間にセットした半田箔を示す。Embodiments of the present invention will be described below with reference to FIGS. In the drawings of the embodiments, the same members corresponding to those in FIG. 4 are designated by the same reference numerals. That is, in the assembly structure of the embodiment, first, the single base 2 inserted between the heat dissipation base plate 1 and the semiconductor chip 2 is bent to have a U-shaped cross section, and side wall portions are formed on both left and right sides of the base substrate. Two
a is formed upright. The side wall portion 2a has a height sufficient to cover the side surface of the semiconductor chip 3 mounted on the single base 2. Regarding the external lead-out terminal 5,
An anchor hole 5a is opened in the plate surface at a portion buried in the sealing resin 7, and a U-shaped electrode portion 5b is integrally formed at the lower end portion of the terminal by bending. The electrode portion 5b is a semiconductor chip. 3 is soldered to the upper surface electrode. Further, the resin case 6 is a cap-shaped container having an open lower surface, and is integrally molded with the external lead-out terminal 5 by molding or is bonded by an adhesive. Further, in addition to the protruding piece 6a shown in FIG. 4, leg pieces 6b are formed at a plurality of positions on the bottom side peripheral edge of the case, and when the sealing resin 7 is filled on the upper surface of the case. The resin injection hole 6c to be used is open. Then, the insertion hole 1 is formed on the plate surface of the heat dissipation base plate 1 so as to face the leg pieces 6b of the resin case 6.
b is perforated. In FIG. 3, 8a indicates a solder foil set between each component.
【００１４】かかる構成で、単体ベース２，半導体チッ
プ３，外部導出端子５，樹脂ケース６を組立てた後、図
２のように樹脂ケース６の脚片６ｂを放熱ベース板１の
差込穴１ｂに挿入し、その裏面側に突出した脚片６ｂの
先端に熱を加えてカシメ止めし、放熱ベース板１と樹脂
ケース６との間を強固に結合する。その後に樹脂ケース
６の上面側より樹脂注入孔６ｃを通じてケース内に封止
樹脂７を充填して硬化させて製品を完成する。After assembling the single base 2, the semiconductor chip 3, the external lead-out terminal 5, and the resin case 6 with such a configuration, the leg pieces 6b of the resin case 6 are inserted into the insertion holes 1b of the heat dissipation base plate 1 as shown in FIG. The heat dissipation base plate 1 and the resin case 6 are firmly coupled to each other by applying heat to the tips of the leg pieces 6b projecting to the back surface side and caulking them. After that, the sealing resin 7 is filled into the case from the upper surface side of the resin case 6 through the resin injection hole 6c and cured to complete the product.
【００１５】[0015]
【発明の効果】以上述べた本発明の構成によれば、外力
に対するパッケージ構造の機械的強度が向上するほか、
ヒートサイクルに伴って半導体チップに直接加わる熱的
ストレスを緩和して歪の発生を軽減できるなど、実使用
面での信頼性の高い樹脂封止形半導体を提供することが
できる。According to the configuration of the present invention described above, the mechanical strength of the package structure against external force is improved, and
It is possible to provide a resin-encapsulated semiconductor that is highly reliable in actual use, such that the thermal stress directly applied to the semiconductor chip due to the heat cycle can be relieved to reduce the occurrence of strain.
【図１】本発明の実施例による樹脂封止形半導体装置の
構成断面図FIG. 1 is a structural cross-sectional view of a resin-sealed semiconductor device according to an embodiment of the present invention.
【図２】図１における放熱ベース板と樹脂ケースの分解
斜視図FIG. 2 is an exploded perspective view of a heat dissipation base plate and a resin case in FIG.
【図３】図１における内部組立体の斜視図FIG. 3 is a perspective view of the internal assembly in FIG.
【図４】従来における樹脂封止形半導体装置の構成図で
あり、（ａ）は装置全体の構成断面図、（ｂ）は樹脂ケ
ースの外観斜視図、（ｃ）放熱ベース板の外観斜視図4A and 4B are configuration diagrams of a conventional resin-sealed semiconductor device, wherein FIG. 4A is a configuration sectional view of the entire device, FIG. 4B is an external perspective view of a resin case, and FIG. 4C is an external perspective view of a heat dissipation base plate.
１ 放熱ベース板 ２ 単体ベース ２ａ 側壁部 ３ 半導体チップ ５ 外部導出端子 ５ａ 投錨穴 ５ｂ コ字形電極部 ６ 樹脂ケース ６ｂ 脚片 ６ｃ 樹脂注入孔 ７ 封止樹脂 ８ 半田接合部 1 Heat Dissipation Base Plate 2 Single Base 2a Sidewall 3 Semiconductor Chip 5 External Lead-out Terminal 5a Anchor Hole 5b U-Shaped Electrode 6 Resin Case 6b Leg 6c Resin Injection Hole 7 Sealing Resin 8 Solder Joint
Claims (4)
ップ，外部導出端子を積み重ねて半田付けするととも
に、これら部品を包囲して放熱ベース板上に樹脂ケース
を取付け、さらに樹脂ケース内に封止樹脂を充填してな
る樹脂封止形半導体装置において、外部導出端子の板面
に封止樹脂と結合し合う投錨穴を開口するとともに、端
子の下端部にコ字形の電極部を屈曲形成して半導体チッ
プの表面電極に半田付けしたことを特徴とする樹脂封止
形半導体装置。1. A single base, a semiconductor chip, and external lead-out terminals are stacked and soldered on a heat dissipation base plate, and these parts are surrounded to mount a resin case on the heat dissipation base plate, and further sealed in the resin case. In a resin-sealed semiconductor device that is filled with a sealing resin, an anchor hole that connects with the sealing resin is opened in the plate surface of the external lead-out terminal, and a U-shaped electrode portion is formed by bending at the lower end of the terminal. The resin-sealed semiconductor device is characterized in that it is soldered to the surface electrode of the semiconductor chip.
ップ，外部導出端子を積み重ねて半田付けするととも
に、これら部品を包囲して放熱ベース板上に樹脂ケース
を取付け、さらに樹脂ケース内に封止樹脂を充填してな
る樹脂封止形半導体装置において、単体ベースを断面Ｕ
字形に成形し、そのベース基板から起立する側壁部で半
導体チップの側面を包囲したことを特徴とする樹脂封止
形半導体装置。2. A single base, a semiconductor chip, and external lead-out terminals are stacked and soldered on a heat dissipation base plate, and these parts are surrounded to mount a resin case on the heat dissipation base plate and further sealed in the resin case. In a resin-encapsulated semiconductor device that is filled with a stop resin, the unit base is cross-section U
A resin-encapsulated semiconductor device, characterized in that it is formed in a letter shape, and a side wall portion standing upright from the base substrate surrounds a side surface of a semiconductor chip.
ップ，外部導出端子を積み重ねて半田付けするととも
に、これら部品を包囲して放熱ベース板上に樹脂ケース
を取付け、さらに樹脂ケース内に封止樹脂を充填してな
る樹脂封止形半導体装置において、樹脂ケースを底面開
放形のキャップ状容器となして外部導出端子に一体結合
するとともに、その底部側周縁には放熱ベース板に穿孔
した取付穴に差し込んでカシメ止めする脚片を設け、さ
らにケース上面に樹脂注入孔を開口したことを特徴とす
る樹脂封止形半導体装置。3. A single base, a semiconductor chip, and external lead-out terminals are stacked and soldered on a heat dissipation base plate, and these parts are surrounded to mount a resin case on the heat dissipation base plate and further sealed in the resin case. In a resin-encapsulated semiconductor device filled with resin, the resin case is made into a cap-shaped container with an open bottom to be integrally connected to the external lead-out terminal, and the bottom side peripheral edge is perforated with a heat dissipation base plate. A resin-encapsulated semiconductor device, comprising a leg piece which is inserted into a hole and fixed by caulking, and a resin injection hole is opened on the upper surface of the case.
備えて構成したことを特徴とする樹脂封止形半導体装
置。4. A resin-encapsulated semiconductor device comprising the structure described in any one of claims 1, 2, and 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34081092A JPH06188335A (en) | 1992-12-22 | 1992-12-22 | Resin sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34081092A JPH06188335A (en) | 1992-12-22 | 1992-12-22 | Resin sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06188335A true JPH06188335A (en) | 1994-07-08 |
Family
ID=18340504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34081092A Pending JPH06188335A (en) | 1992-12-22 | 1992-12-22 | Resin sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06188335A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003020849A (en) * | 2001-07-06 | 2003-01-24 | Daiken Trade & Ind Co Ltd | Pivot hinge |
| US6885096B2 (en) * | 2000-07-11 | 2005-04-26 | Kabushiki Kaisha Toshiba | Semiconductor device having at least three power terminals superposed on each other |
| JP2009277959A (en) * | 2008-05-16 | 2009-11-26 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
| WO2011115081A1 (en) | 2010-03-16 | 2011-09-22 | 富士電機システムズ株式会社 | Semiconductor device |
| WO2013141287A1 (en) * | 2012-03-22 | 2013-09-26 | 三菱電機株式会社 | Semiconductor device and method for manufacturing same |
| CN117198901A (en) * | 2023-11-07 | 2023-12-08 | 通富微电子股份有限公司 | Power module packaging method and power module |
-
1992
- 1992-12-22 JP JP34081092A patent/JPH06188335A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6885096B2 (en) * | 2000-07-11 | 2005-04-26 | Kabushiki Kaisha Toshiba | Semiconductor device having at least three power terminals superposed on each other |
| JP2003020849A (en) * | 2001-07-06 | 2003-01-24 | Daiken Trade & Ind Co Ltd | Pivot hinge |
| JP4708609B2 (en) * | 2001-07-06 | 2011-06-22 | 大建工業株式会社 | Pivot hinge |
| JP2009277959A (en) * | 2008-05-16 | 2009-11-26 | Mitsubishi Electric Corp | Semiconductor device and method of manufacturing the same |
| WO2011115081A1 (en) | 2010-03-16 | 2011-09-22 | 富士電機システムズ株式会社 | Semiconductor device |
| US8441117B2 (en) | 2010-03-16 | 2013-05-14 | Fuji Electric Co., Ltd. | Semiconductor device |
| WO2013141287A1 (en) * | 2012-03-22 | 2013-09-26 | 三菱電機株式会社 | Semiconductor device and method for manufacturing same |
| KR20140131959A (en) * | 2012-03-22 | 2014-11-14 | 미쓰비시덴키 가부시키가이샤 | Semiconductor device and method for manufacturing same |
| JPWO2013141287A1 (en) * | 2012-03-22 | 2015-08-03 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
| US9236316B2 (en) | 2012-03-22 | 2016-01-12 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
| CN117198901A (en) * | 2023-11-07 | 2023-12-08 | 通富微电子股份有限公司 | Power module packaging method and power module |
| CN117198901B (en) * | 2023-11-07 | 2024-01-23 | 通富微电子股份有限公司 | Power module packaging method and power module |
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