JPH07153907A - Power semiconductor module - Google Patents
Power semiconductor moduleInfo
- Publication number
- JPH07153907A JPH07153907A JP32621193A JP32621193A JPH07153907A JP H07153907 A JPH07153907 A JP H07153907A JP 32621193 A JP32621193 A JP 32621193A JP 32621193 A JP32621193 A JP 32621193A JP H07153907 A JPH07153907 A JP H07153907A
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- case
- external lead
- semiconductor module
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、内部に電力用半導体
チップとこの半導体チップを制御する制御部品を搭載
し、さらに樹脂封止して得られる電力用半導体モジュー
ルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor module obtained by mounting a power semiconductor chip and a control component for controlling the semiconductor chip therein, and further sealing with a resin.
【０００２】[0002]
【従来の技術】従来の電力用半導体モジュールとして
は、図３の断面図に示す構造のものがある。図において
２は、一方の面に絶縁板６を有する金属基板であり、こ
の絶縁板６上に銅回路（図示せず）が接着配置されてい
る。そして、金属基板２の銅回路上の必要箇所にクリー
ム半田を印刷し、クリーム半田上に電力用半導体チップ
８及び表面実装部品である抵抗、ＩＣ等の制御部品並び
に制御回路との接続ピン１２及び外部引き出し端子１０
を搭載し、リフロー炉で半田付けを行う。この後、電力
用半導体チップ８と必要な銅回路６とワイヤボンディン
グを行う。2. Description of the Related Art As a conventional power semiconductor module, there is one having a structure shown in a sectional view of FIG. In the figure, 2 is a metal substrate having an insulating plate 6 on one surface, and a copper circuit (not shown) is bonded and arranged on the insulating plate 6. Then, cream solder is printed on a required portion of the copper circuit of the metal substrate 2, and the power semiconductor chip 8 and control components such as resistors and ICs which are surface mounting components, and connection pins 12 with the control circuit are printed on the cream solder. External lead terminal 10
And solder in a reflow oven. After that, wire bonding is performed with the power semiconductor chip 8 and the necessary copper circuit 6.
【０００３】次に金属基板の周縁を後で述べるプリント
回路取付突部（図示せず）と一体成形した樹脂ケース２
４で覆い、側壁を金属基板にシリコンゴム等の接着剤で
接着する。そして、ケース２４の上部からシリコンゴム
を充填し、１２０〜１５０℃で加熱硬化して、シリコン
ゴム層２６を形成する。ついで、シリコンゴム層２６の
上部にエポキシ樹脂を充填し、１２０〜１５０℃で加熱
硬化してエポキシ樹脂層２８を形成する。Next, the resin case 2 in which the peripheral edge of the metal substrate is integrally formed with a printed circuit mounting protrusion (not shown) described later.
4, and the side wall is adhered to the metal substrate with an adhesive such as silicon rubber. Then, silicone rubber is filled from the upper part of the case 24 and heated and cured at 120 to 150 ° C. to form the silicone rubber layer 26. Then, an epoxy resin is filled in the upper part of the silicone rubber layer 26 and is heated and cured at 120 to 150 ° C. to form an epoxy resin layer 28.
【０００４】一方、電力用半導体チップを制御する制御
部品をプリント配線板に搭載し、半田付してプリント回
路１４を構成する。このプリント回路１４に設けた穴
（図示せず）をケースのプリント回路取付突起（図示せ
ず）に係合し、かつ接続ピン１２をプリント回路１４に
接続し、半田付けを行う。そして、ケース上部からエポ
キシ樹脂を充填し、１２０〜１５０℃で加熱硬化させ上
部のエポキシ樹脂層３０を形成する。On the other hand, a control component for controlling the power semiconductor chip is mounted on a printed wiring board and soldered to form the printed circuit 14. A hole (not shown) provided in the printed circuit 14 is engaged with a printed circuit mounting protrusion (not shown) of the case, and the connecting pin 12 is connected to the printed circuit 14 for soldering. Then, the epoxy resin is filled from the upper part of the case and heated and cured at 120 to 150 ° C. to form the upper epoxy resin layer 30.
【０００５】[0005]
【発明が解決しようとする課題】上記のような電力用半
導体モジュールを得るに当たって、樹脂ケースには外部
引き出し端子１０を固定するために挿通する穴２４ａを
設けている。この端子１０は複数個設けられており、数
多くの穴２４ａに一端が固定された外部引き出し端子１
０を挿通するのは作業性の悪いものであった。そこで、
外部引き出し端子を銅回路６に半田付けする前に、まず
複数の外部引き出し端子１０をそれぞれのケース２４の
穴２４ａに挿通し、ケースを金属基板１２に接着し、外
部引き出し端子１０を銅回路６に半田付けする試みがな
されているが、外部引き出し端子１０をケース２４の穴
２４ａに挿通後、金属基板にセットするまでの搬送時に
外れることがあり、作業性の悪いものであった。また、
外部引き出し端子をケース製造時にケースと同時にモー
ルド形成することもあるが、外部引き出し端子をセット
するのに時間が掛かるなど作業性が悪いものであった。In obtaining the above power semiconductor module, the resin case is provided with a hole 24a through which the external lead terminal 10 is fixed. A plurality of these terminals 10 are provided, and one end is fixed to a large number of holes 24a.
The workability of inserting 0 was poor. Therefore,
Before soldering the external lead terminals to the copper circuit 6, first, the plurality of external lead terminals 10 are inserted into the holes 24a of each case 24, the cases are bonded to the metal substrate 12, and the external lead terminals 10 are connected to the copper circuit 6. Although an attempt has been made to solder it, the external lead-out terminal 10 may be detached during the transportation after being inserted into the hole 24a of the case 24 until it is set on the metal substrate, and the workability is poor. Also,
The external lead terminals may be molded at the same time as the case when the case is manufactured, but the workability is poor because it takes time to set the external lead terminals.
【０００６】[0006]
【課題を解決するための手段】本発明は、銅回路が配置
された絶縁板を有する金属基板と、上記銅回路上に載置
固定される電力用半導体チップと、一方端がケース上部
外方に引き出され他方端が上記銅回路に接続される外部
引き出し端子とが上部に開口部を有する樹脂ケースで覆
いケース内を樹脂封止される電力用半導体モジュールに
おいて、上記樹脂ケースの側壁に、内部に向かって伸び
中央に開放部を有する挾持部と、上記挾持部の下部に設
けられ内向して伸び一部が上部に突出する突起を有する
支持台とが設けられ、上記外部引き出し端子に上記挾持
部の開放部より小さい幅の切欠部と、上記切欠部の下部
に設けられ内向して伸び一部が上記突起に係合する穴叉
は凹部を有する折り曲げ部とが設けられたものである。According to the present invention, there is provided a metal substrate having an insulating plate on which a copper circuit is arranged, a power semiconductor chip mounted and fixed on the copper circuit, and one end of which is outside the upper part of the case. In the power semiconductor module in which the external lead-out terminal connected to the copper circuit and the other end of which is covered with a resin case having an opening at the top is resin-sealed in the case, A holding part having an opening at the center and an inwardly extending projection part of which protrudes upward and is provided at the lower part of the holding part. A cutout portion having a width smaller than the open portion of the portion, and a bent portion provided in the lower portion of the cutout portion and having a hole or a recessed portion that extends inward and engages with the protrusion are provided.
【０００７】また、上記突起が穴との係合後かしめられ
た突起である。Further, the above-mentioned projection is a projection crimped after engaging with the hole.
【０００８】また、上記樹脂ケースの側壁に、内部に向
かって伸び中央に開放部を有する挾持部と、上記挾持部
の下部に設けられ内向して伸び一部が穴叉は凹部を有す
る支持台とが設けられ、上記外部引き出し端子に上記挾
持部の開放部より小さい幅の切欠部と、上記切欠部の下
部に設けられ内向して伸び一部が上記穴叉は凹部に係合
する突起を有する折り曲げ部とが設けられたものであ
る。[0008] Further, a support base provided on a side wall of the resin case, which has an opening portion at its center and extends toward the inside, and an inwardly extending portion provided at the lower portion of the holding portion, having a hole or a recess. And a cutout portion having a width smaller than the open portion of the sandwiching portion, and a protrusion provided in the lower portion of the cutout portion and extending inwardly and engaging with the hole or the concave portion. And a bent portion having the same.
【０００９】[0009]
【作用】樹脂ケースの側壁の挾持部の開放部に外部引き
出し端子の切欠部を通し、外部引き出し端子を下げる
と、突起が穴又は凹部に係合し、かつ支持台に外部引き
出し端子の折り曲げ部が支持され、外部引き出し端子が
樹脂ケースに強固に支持される。When the cutout portion of the external lead terminal is passed through the open portion of the holding portion of the side wall of the resin case and the external lead terminal is lowered, the protrusion engages with the hole or the recess and the bent portion of the external lead terminal on the support base. Is supported, and the external lead terminal is firmly supported by the resin case.
【００１０】また、突起をかしめることによって外部引
き出し端子がケースに強固に固定される。Further, by crimping the protrusion, the external lead terminal is firmly fixed to the case.
【００１１】[0011]
【実施例】この発明による電力用半導体モジュールの一
実施例を図１及び図２に示す。なお、図３に示した従来
のものと同等部分には同一記号を付した。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a power semiconductor module according to the present invention is shown in FIGS. The same parts as those of the conventional one shown in FIG.
【００１２】４は樹脂ケースで、この樹脂ケース４は内
部に向かって伸び、中央に開放部４ｄを有する挾持部４
ａと、この挾持部４ａの下部に設けられ内部に向かって
伸びる支持台４ｂにより構成され、さらにこの支持台４
ｂの中央の一部に上部に突出する突起４ｃが設けられて
いる。また、１０は外部引き出し端子で、挾持部４ａの
開放部より小さい幅の切欠部１０ａと、切欠部１０ａの
下部に設けられて内部に向かって伸びる折り曲げ部１０
ｃとにより構成され、さらにこの折り曲げ部１０ｃには
上記の突起４ｃと係合できる穴叉は凹部１０ｂが設けら
れている。Reference numeral 4 denotes a resin case. The resin case 4 extends inward and has a holding portion 4 having an opening 4d at the center.
a and a support base 4b provided at a lower portion of the holding portion 4a and extending inward.
A protrusion 4c protruding upward is provided at a part of the center of b. Reference numeral 10 denotes an external lead terminal, which is a cutout portion 10a having a width smaller than the open portion of the holding portion 4a, and a bent portion 10 which is provided below the cutout portion 10a and extends inward.
Further, the bent portion 10c is provided with a hole or a recess 10b capable of engaging with the protrusion 4c.
【００１３】そして、樹脂ケース４の側壁の挾持部４ａ
の開放部４ｄに外部引き出し端子１０の切欠部１０ａを
通し、外部引き出し端子１０を下げると、支持台４ｂに
外部引き出し端子１０の折り曲げ部１０ｂが支持される
とともに、支持台４ｂの突起４ｃが外部引き出し端子１
０の穴又は凹部１０ｂに係合し、外部引き出し端子１０
が樹脂ケース４に支持される。また、突起を打ちかしめ
ると、外部引き出し端子は樹脂ケースに強固に支持され
る。Then, the holding portion 4a on the side wall of the resin case 4
When the cutout portion 10a of the external lead-out terminal 10 is passed through the open portion 4d and the external lead-out terminal 10 is lowered, the bent portion 10b of the external lead-out terminal 10 is supported by the support base 4b and the projection 4c of the support base 4b is externally attached. Lead-out terminal 1
The external lead-out terminal 10 by engaging with the hole 0 or the recess 10b.
Are supported by the resin case 4. When the protrusions are struck, the external lead terminals are firmly supported by the resin case.
【００１４】一方、一面がセラミックなどの絶縁板６上
に接着配置された銅回路（図示せず）の必要な箇所に電
力用半導体チップ８が半田付けされ、電力用半導体チッ
プ８と銅回路間にワイヤボンディングを施しスタックが
形成される。On the other hand, a power semiconductor chip 8 is soldered to a necessary portion of a copper circuit (not shown), one surface of which is adhered on an insulating plate 6 made of ceramic or the like. Wire bonding is performed to form a stack.
【００１５】そして、銅回路上の必要箇所にクリーム半
田を印刷し、さらに金属基板２の周縁をシリコンゴム等
の接着材を塗布する。このクリーム半田上に、上述した
スタックの他、表面実装部品の抵抗、半導体素子等の制
御部品及び制御回路との接続用の接続ピン１２並びに接
着材上に上述した外部引き出し端子が支持された樹脂ケ
ースを載置し、リフロー炉で半田付け及び接着を行う。
なお、外部引き出し端子も銅回路に同時に半田付けされ
る。Then, cream solder is printed on a necessary portion on the copper circuit, and an adhesive such as silicon rubber is applied to the peripheral edge of the metal substrate 2. On this cream solder, in addition to the above-mentioned stack, the resin for supporting the resistance of the surface-mounted component, the connection pin 12 for connecting to the control component such as a semiconductor element and the control circuit, and the above-mentioned external lead terminal on the adhesive material Place the case and solder and bond in a reflow oven.
The external lead terminal is also soldered to the copper circuit at the same time.
【００１６】そして、ケース４の上部からシリコンゴム
を充填し、１２０〜１５０℃で加熱硬化して、シリコン
ゴム層２６を形成する。ついで、シリコンゴム層２６の
上部にエポキシ樹脂を充填し、１２０〜１５０℃で加熱
硬化してエポキシ樹脂層２８を形成する。さらに別途電
力用半導体チップを制御する制御部品を搭載したプリン
ト回路１４をその内部に設けた穴を樹脂ケース４から張
り出したプリント回路取付突起（図示せず）に係合し、
接続ピン１２をプリント回路１４に接続し、半田付けを
行う。そして、ケース上部からエポキシ樹脂を充填し、
加熱硬化させ上部のエポキシ樹脂層３０を形成し、電力
用半導体モジュールを得る。Then, silicone rubber is filled from the upper part of the case 4 and heat-cured at 120 to 150 ° C. to form the silicone rubber layer 26. Then, an epoxy resin is filled in the upper part of the silicone rubber layer 26 and is heated and cured at 120 to 150 ° C. to form an epoxy resin layer 28. Further, a printed circuit 14 on which a control component for separately controlling the power semiconductor chip is mounted is engaged with a printed circuit mounting protrusion (not shown) protruding from the resin case 4 in a hole provided therein.
The connection pins 12 are connected to the printed circuit 14 and soldered. Then, fill the case with epoxy resin,
It is heated and cured to form the upper epoxy resin layer 30 to obtain a power semiconductor module.
【００１７】上記実施例では、ケース４の支持部４ｂに
突起４ｃを設け、外部引き出し端子１０の折り曲げ部１
０ｃに穴又は凹部１０ｂを設けていたが、逆に折り曲げ
部１０ｃに突起を設け、支持部４ｂに上記突起に係合で
きる穴又は凹部を設けてもよい。また、上記実施例は電
力用半導体チップをシリコンゴム層２６とエポキシ樹脂
層２８によりモールドされているがエポキシ樹脂のみモ
ールドしてもよい。In the above embodiment, the protrusion 4c is provided on the support portion 4b of the case 4, and the bent portion 1 of the external lead terminal 10 is provided.
Although the hole or the concave portion 10b is provided in 0c, the bent portion 10c may be provided with a projection and the supporting portion 4b may be provided with a hole or a concave portion that can be engaged with the projection. Further, in the above embodiment, the power semiconductor chip is molded by the silicon rubber layer 26 and the epoxy resin layer 28, but only the epoxy resin may be molded.
【００１８】[0018]
【発明の効果】以上のように、本発明によれば樹脂ケー
スに外部引き出し端子を挾持する挾持部を設け、この挾
持部は中央が開放され、この開放部に端子の切欠部を通
して端子を挾持部内にはめ込み、端子を下げると、ケー
スの突起が端子の穴又は凹部に係合し、さらに端子の折
り曲げ部が樹脂ケースの支持台により支持され、端子が
樹脂ケースに簡単に強固に支持される。これにより搬送
作業時に端子がケースから外れるとこもなく、電力用半
導体モジュールの製造が容易となる。As described above, according to the present invention, the resin case is provided with the holding portion for holding the external lead-out terminal, and the holding portion is opened at the center, and the terminal is held through the cutout portion of the terminal. When it is fitted into the part and the terminal is lowered, the protrusion of the case engages with the hole or recess of the terminal, and the bent part of the terminal is supported by the support base of the resin case, and the terminal is easily and firmly supported by the resin case. . As a result, the terminal does not come off from the case during the transportation work, and the manufacturing of the power semiconductor module becomes easy.
【図１】本発明の電力用半導体モジュールの一実施例の
樹脂ケースと外部引き出し端子との係合を説明する斜視
図である。FIG. 1 is a perspective view illustrating the engagement between a resin case and an external lead terminal of an embodiment of a power semiconductor module of the present invention.
【図２】本発明の電力用半導体モジュールの一実施例を
示す断面図である。FIG. 2 is a sectional view showing an embodiment of a power semiconductor module of the present invention.
【図３】従来の電力用半導体モジュールの断面図であ
る。FIG. 3 is a sectional view of a conventional power semiconductor module.
２ 金属基板 ４ 樹脂ケース ４ａ 挾持部 ４ｂ 支持台 ４ｃ 突起 ４ｄ 開放部 ６ 絶縁板 ８ 電力用半導体チップ １０ 外部引き出し端子 １０ａ 切欠部 １０ｂ 穴又は凹部 １０ｃ 折り曲げ部 １２ 接続ピン １４ プリント回路 ２６ シリコンゴム層 ２８，３０ エポキシ樹脂層 2 metal substrate 4 resin case 4a holding part 4b support base 4c protrusion 4d open part 6 insulating plate 8 power semiconductor chip 10 external lead terminal 10a cutout part 10b hole or recessed part 10c bent part 12 connection pin 14 printed circuit 26 silicon rubber layer 28 , 30 Epoxy resin layer
Claims (3)
基板と、上記銅回路上に載置固定される電力用半導体チ
ップと、一方端がケース上部外方に引き出され他方端が
上記銅回路に接続される外部引き出し端子とが上部に開
口部を有する樹脂ケースで覆いケース内を樹脂封止され
る電力用半導体モジュールにおいて、上記樹脂ケースの
側壁に、内部に向かって伸び中央に開放部を有する挾持
部と、上記挾持部の下部に設けられ内向して伸び一部が
上部に突出する突起を有する支持台とが設けられ、上記
外部引き出し端子に上記挾持部の開放部より小さい幅の
切欠部と、上記切欠部の下部に設けられ内向して伸び一
部が上記突起に係合する穴叉は凹部を有する折り曲げ部
とが設けられたことを特徴とする電力半導体モジュー
ル。1. A metal substrate having an insulating plate on which a copper circuit is arranged, a power semiconductor chip mounted and fixed on the copper circuit, one end of which is pulled out of the upper part of the case and the other end of which is the copper. In a power semiconductor module in which an external lead terminal connected to a circuit is covered with a resin case having an opening at the top, and the inside of the case is resin-sealed, a side wall of the resin case extends inward, and an opening is formed at the center. And a support base having a protrusion that is provided in a lower portion of the holding portion and that extends inwardly and a part of which protrudes upward is provided, and the external lead terminal has a width smaller than the opening portion of the holding portion. A power semiconductor module, comprising: a cutout portion; and a bent portion that is provided in a lower portion of the cutout portion and has an inwardly extending portion that has a hole or a concave portion that engages with the protrusion.
た突起である請求項１の電力用半導体モジュール。2. The power semiconductor module according to claim 1, wherein the protrusion is a protrusion crimped after engaging with the hole.
基板と、上記銅回路上に載置固定される電力用半導体チ
ップと、一方端がケース上部外方に引き出され他方端が
上記銅回路に接続される外部引き出し端子とが上部に開
口部を有する樹脂ケースで覆いケース内を樹脂封止され
る電力用半導体モジュールにおいて、上記樹脂ケースの
側壁に、内部に向かって伸び中央に開放部を有する挾持
部と、上記挾持部の下部に設けられ内向して伸び一部が
穴または凹部を有する支持台とが設けられ、上記外部引
き出し端子に上記挾持部の開放部より小さい幅の切欠部
と、上記切欠部の下部に設けられ内向して伸び一部が上
記穴または凹部に係合する突起を有する折り曲げ部とが
設けられたことを特徴とする電力半導体モジュール。3. A metal substrate having an insulating plate on which a copper circuit is arranged, a power semiconductor chip mounted and fixed on the copper circuit, one end of which is pulled out of the upper part of the case, and the other end of which is the copper. In a power semiconductor module in which an external lead terminal connected to a circuit is covered with a resin case having an opening at the top, and the inside of the case is resin-sealed, a side wall of the resin case extends inward, and an opening is formed at the center. And a support base provided in a lower portion of the holding portion and extending inwardly and having a hole or a concave portion inwardly, the external lead terminal has a notch portion having a width smaller than an opening portion of the holding portion. And a bent portion provided at a lower portion of the cutout portion and having an inwardly extending projection having a part engaging with the hole or the concave portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32621193A JP2720009B2 (en) | 1993-11-29 | 1993-11-29 | Power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32621193A JP2720009B2 (en) | 1993-11-29 | 1993-11-29 | Power semiconductor module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07153907A true JPH07153907A (en) | 1995-06-16 |
| JP2720009B2 JP2720009B2 (en) | 1998-02-25 |
Family
ID=18185242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32621193A Expired - Lifetime JP2720009B2 (en) | 1993-11-29 | 1993-11-29 | Power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2720009B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0752720A3 (en) * | 1995-07-07 | 1998-06-03 | Mitsubishi Denki Kabushiki Kaisha | Lead for semiconductor device |
| JP2001196531A (en) * | 2000-01-11 | 2001-07-19 | Sansha Electric Mfg Co Ltd | Electric power semiconductor module |
| JP2008252055A (en) * | 2007-03-08 | 2008-10-16 | Fuji Electric Device Technology Co Ltd | Semiconductor and method for manufacturing the same |
| JP2009021286A (en) * | 2007-07-10 | 2009-01-29 | Mitsubishi Electric Corp | Semiconductor device for electric power |
| US7541670B2 (en) | 2006-06-29 | 2009-06-02 | Mitsubishi Electric Corporation | Semiconductor device having terminals |
| KR101482326B1 (en) * | 2012-12-20 | 2015-01-13 | 삼성전기주식회사 | Power semiconductor module having latchable lead member |
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| JP6472033B1 (en) * | 2017-11-09 | 2019-02-20 | 株式会社三社電機製作所 | Semiconductor module |
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| JP2720009B2 (en) | 1998-02-25 |
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