JPH06177503A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH06177503A JPH06177503A JP32659392A JP32659392A JPH06177503A JP H06177503 A JPH06177503 A JP H06177503A JP 32659392 A JP32659392 A JP 32659392A JP 32659392 A JP32659392 A JP 32659392A JP H06177503 A JPH06177503 A JP H06177503A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- copper
- wiring board
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、コンピュータやワード
・プロセッサーなどの各種電子機器に使用されるプリン
ト配線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used in various electronic devices such as computers and word processors.
【０００２】[0002]
【従来の技術】近年、電子機器の小型・軽量化や多機能
化、電子部品のはんだ付けの表面実装化などに伴い、プ
リント配線板は多層・高密度・高精度配線化される傾向
が著しい。これらによりプリント配線板の製造方法も従
来のスクリーン印刷法から写真現像法に変わりつつあ
る。2. Description of the Related Art In recent years, printed wiring boards have a tendency to be multi-layered, high-density, and highly-accurate wiring due to downsizing and weight reduction of electronic equipment, multifunctionalization, and surface mounting of electronic parts for soldering. . Due to these factors, the method of manufacturing a printed wiring board is changing from the conventional screen printing method to a photographic developing method.
【０００３】以下に従来のプリント配線板の製造方法に
ついて説明する。図３は従来のプリント配線板の製造方
法を示すものである。図３において、１は絶縁基板、２
ａは銅はく、２ｂは銅めっき層、２ｃは導体パターン、
３ａは第１のスルーホール、３ｂは第２のスルーホー
ル、４はアルカリ可溶性の樹脂、５はエッチングレジス
ト、６ａはソルダレジスト、６ｂはロードマップ、７は
バリである。A conventional method for manufacturing a printed wiring board will be described below. FIG. 3 shows a conventional method for manufacturing a printed wiring board. In FIG. 3, 1 is an insulating substrate and 2 is
a is a copper foil, 2b is a copper plating layer, 2c is a conductor pattern,
3a is a first through hole, 3b is a second through hole, 4 is an alkali-soluble resin, 5 is an etching resist, 6a is a solder resist, 6b is a road map, and 7 is a burr.
【０００４】以上のように構成されたプリント配線板の
製造方法について、以下詳細に説明する。A method of manufacturing the printed wiring board having the above structure will be described in detail below.
【０００５】まず、ガラス布基材エポキシ樹脂積層板で
構成された絶縁基板１の両面に銅はく２ａがラミネート
された銅張積層板を所定サイズに切断した後、図３
（ａ）に示すように、ＮＣボール盤などの手段により第
１のスルーホール３ａを加工・形成する。First, a copper clad laminate in which copper foils 2a are laminated on both sides of an insulating substrate 1 made of a glass cloth base epoxy resin laminate is cut into a predetermined size, and then, as shown in FIG.
As shown in (a), the first through hole 3a is processed and formed by means such as an NC drilling machine.
【０００６】次に、第１のスルーホール３ａが形成され
た銅張積層板は、図３（ｂ）に示すように、その全面に
無電解銅めっき層、電解銅めっき層２ｂが形成され、そ
の後、スルーホールの銅めっき層２ｂをエッチングから
保護するアルカリ可溶性の樹脂４がスキージング法によ
り第１のスルーホール３ａと銅めっき層２ｂ表面に充填
・塗布される。Next, as shown in FIG. 3 (b), the copper-clad laminate having the first through holes 3a is formed with an electroless copper plating layer and an electrolytic copper plating layer 2b on the entire surface, After that, an alkali-soluble resin 4 that protects the copper plating layer 2b of the through hole from etching is filled and applied to the surfaces of the first through hole 3a and the copper plating layer 2b by a squeegeeing method.
【０００７】銅めっき層２ｂ表面のアルカリ可溶性の樹
脂４は、図３（ｃ）に示すように研摩により機械的に除
去され、感光性ドライフィルムラミーネート、紫外線露
光、未露光部分の除去の後、エッチングレジスト５が形
成される。The alkali-soluble resin 4 on the surface of the copper plating layer 2b is mechanically removed by polishing as shown in FIG. 3 (c), and after the photosensitive dry film laminating, UV exposure and removal of the unexposed portion. , An etching resist 5 is formed.
【０００８】ついで塩化第２銅などの溶液を用いて露出
した銅めっき層２ｂと銅はく２ａ部分がエッチングさ
れ、アルカリ水溶液でエッチングレジスト５と第１のス
ルーホール３ａの銅めっき層２ｂを保護していた樹脂４
が剥離・除去されて図３（ｄ）に示すように、絶縁基板
１上に導体パターン２ｃが形成される。Then, the exposed copper plating layer 2b and copper foil 2a are etched using a solution of cupric chloride or the like, and the etching resist 5 and the copper plating layer 2b of the first through hole 3a are protected with an alkaline aqueous solution. Resin 4
Are peeled off and removed to form a conductor pattern 2c on the insulating substrate 1 as shown in FIG. 3 (d).
【０００９】次に、はんだ付け不要部分にソルダレジス
ト６ａを形成、部品装着位置など明示するロードマップ
６ｂを形成した後、図３（ｅ）に示すように、銅めっき
層２ｂの不必要な第２のスルーホール３ｂがＮＣボール
盤によりドリル加工・形成され、外形加工、洗浄、フラ
ックス塗布などの工程処理の後、プリント配線板が完成
される。Next, after a solder resist 6a is formed on a portion where soldering is not necessary and a road map 6b for clearly indicating a component mounting position is formed, as shown in FIG. 3 (e), unnecessary portions of the copper plating layer 2b are removed. The two through holes 3b are drilled and formed by an NC drilling machine, and after the process processing such as outer shape processing, cleaning, and flux application, the printed wiring board is completed.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら上記従来
の構成では、図３（ｄ）に示すように第１のスルーホー
ル３ａ内には銅めっき層２ｂが確実に残留するため、銅
めっき層２ｂを必要としない第２のスルーホール３ｂの
形成の実施は、ソルダレジスト６ａやロードマップ６ｂ
形成の後、ＮＣボール盤などによりドリル加工で行われ
ている。However, in the above-mentioned conventional structure, the copper plating layer 2b is surely left in the first through hole 3a as shown in FIG. 3 (d). The formation of the second through hole 3b which is not necessary is performed by the solder resist 6a and the road map 6b.
After forming, it is drilled with an NC drilling machine or the like.
【００１１】このドリル加工の際、形成された導体パタ
ーン２ｃの粗密、各工程での熱履歴や湿式処理工程での
吸水や吸湿により引き起こされる絶縁基板１の寸法変化
とそのバラツキによりプリント配線板にそりが発生し、
第２のスルーホール３ｂの加工位置精度に狂いを生じる
という問題点を有していた。At the time of this drilling, the printed wiring board is formed due to the density of the formed conductor pattern 2c, the thermal history in each step, and the dimensional change of the insulating substrate 1 caused by water absorption and moisture absorption in the wet processing step and its variation. Sledding occurs,
There is a problem that the accuracy of the processing position of the second through hole 3b may be incorrect.
【００１２】また、導体パターン２ｃ形成、ソルダレジ
スト６ａおよびロードマップ６ｂ形成後のプリント配線
板表面の複雑な凹凸形状と、さらに絶縁基板１自身の板
厚許容差のため、複数重ねて処理される第２のスルーホ
ール３ｂのドリル加工時において、プリント配線板間に
ギャップが生じ、図３（ｅ）に示すように、第２のスル
ーホール３ｂの穴周囲にバリ７が発生し易い状態とな
る。Further, due to the complicated uneven shape of the surface of the printed wiring board after the formation of the conductor pattern 2c, the formation of the solder resist 6a and the road map 6b, and the tolerance of the thickness of the insulating substrate 1 itself, a plurality of layers are processed in layers. At the time of drilling the second through hole 3b, a gap is generated between the printed wiring boards, and as shown in FIG. 3 (e), burrs 7 are easily generated around the hole of the second through hole 3b. .
【００１３】この発生したバリ７は、後工程における搬
送・保管などで導体パターン２ｃ、ソルダレジスト６ａ
表面やロードマップ６ｂにすり傷などを発生させ、プリ
ント配線板の外観不良を誘発させる問題点も有してい
た。The burr 7 thus generated is used for the conductor pattern 2c and the solder resist 6a during the transportation and storage in the subsequent process.
There is also a problem that scratches and the like are generated on the surface and the road map 6b, and the appearance defect of the printed wiring board is induced.
【００１４】本発明は上記従来の問題点を解決するもの
で、銅めっき層が形成されない第２のスルーホールの加
工位置精度を向上させると供に、加工位置精度の容易な
検査方法と第２のスルーホールの穴周囲にバリの無いプ
リント配線板の製造方法を提供することを目的とする。The present invention solves the above-mentioned problems of the prior art. In addition to improving the processing position accuracy of the second through hole in which the copper plating layer is not formed, an inspection method and a second inspection method that facilitate the processing position accuracy are provided. It is an object of the present invention to provide a method for manufacturing a printed wiring board having no burr around the through hole.
【００１５】[0015]
【課題を解決するための手段】この目的を達成するため
本発明のプリント配線板の製造方法は、所定寸法に切断
された銅張積層板に第１のスルーホール穴加工を施す工
程と、この銅張積層板表面に銅めっきによる導体層を形
成する工程と、導体層が形成された銅張積層板に第２の
スルーホール穴加工を施す工程とを備えた構成を有して
いる。To achieve this object, a method of manufacturing a printed wiring board according to the present invention comprises a step of performing a first through-hole processing on a copper clad laminate cut to a predetermined size, and The structure has a step of forming a conductor layer by copper plating on the surface of the copper-clad laminate and a step of performing a second through-hole processing on the copper-clad laminate on which the conductor layer is formed.
【００１６】また、本発明のプリント配線板の製造方法
は、所定寸法に切断された銅張積層板に第１のスルーホ
ール穴加工を施す工程と、この銅張積層板表面に銅めっ
きによる導体層を形成する工程と、スルーホール穴にア
ルカリ可溶性の樹脂を充填する工程と、この銅張積層板
に第２のスルーホール穴加工を施す工程とを備えた構成
を有している。The method of manufacturing a printed wiring board according to the present invention comprises a step of forming a first through-hole on a copper clad laminate cut into a predetermined size, and a copper plated conductor on the surface of the copper clad laminate. It has a structure including a step of forming a layer, a step of filling a through-hole hole with an alkali-soluble resin, and a step of subjecting this copper-clad laminate to a second through-hole hole processing.
【００１７】さらに、本発明のプリント配線板の製造方
法は、第１のスルーホール穴加工の際、プリント配線形
成領域外の銅張積層板に第１のスルーホール穴径、第２
のスルーホール穴径および第１のスルーホール穴と第２
のスルーホール穴のずれ許容差の２倍を加えたピッチで
複数の第１のスルーホール穴径と同径の第３のスルーホ
ール穴を形成し、第３のスルーホール穴間センター位置
に第２のスルーホール穴加工と同時に第２のスルーホー
ル穴径と同径の第４のスルーホール穴を形成する工程を
備えた構成を有している。Further, according to the method for manufacturing a printed wiring board of the present invention, the first through hole hole diameter and the second through hole hole are formed on the copper clad laminate outside the printed wiring forming area during the first through hole processing.
Through hole diameter and first through hole hole and second
A plurality of third through-hole holes with the same diameter as the first through-hole hole diameter are formed at a pitch that is twice the tolerance of the through-hole hole deviation, and the third through-hole hole is formed at the center position between the through holes. It has a configuration including a step of forming a fourth through-hole hole having the same diameter as the second through-hole hole diameter at the same time as the second through-hole hole processing.
【００１８】[0018]
【作用】この構成によって、第２のスルーホールは、め
っき後、あるいはアルカリ可溶性の樹脂充填後の比較的
初期工程の段階で形成されるため、プリント配線板製造
における熱履歴は短く、また絶縁基板表面全体に金属層
が形成された状態のため、寸法変化やバラツキを小さく
維持することが可能となり、またその表面は平滑を有し
ているため、複数枚重ね合わせての第２のスルーホール
のドリル穴加工の際、プリント配線板間のギャップの発
生を抑制することが実現できる。With this structure, the second through hole is formed at a relatively early stage after plating or after filling with an alkali-soluble resin, so that the thermal history in the production of the printed wiring board is short and the insulating substrate Since the metal layer is formed on the entire surface, it is possible to maintain small dimensional changes and variations. Also, since the surface has a smooth surface, a plurality of second through-holes can be stacked. It is possible to suppress the generation of a gap between printed wiring boards during drilling.
【００１９】また、第１のスルーホール穴径と同径であ
り、第１のスルーホール穴径、第２のスルーホール穴径
および第１のスルーホール穴と第２のスルーホール穴の
ずれ許容差の２倍のピッチで複数個形成された第３のス
ルーホール穴位置と第３のスルーホールの穴間センター
位置に、第２のスルーホールの穴径と同径の第４のスル
ーホール穴位置の相対位置関係の検査・確認により、第
１のスルーホール穴位置に対する第２のスルーホール穴
位置の相対位置精度を保証することが実現できる。Further, the diameter is the same as the diameter of the first through hole, and the first through hole diameter, the second through hole diameter, and the deviation between the first through hole hole and the second through hole hole are allowed. A fourth through hole having the same diameter as the diameter of the second through hole is formed at a third through hole hole position and a center position between the third through hole holes formed at a pitch twice the difference. By inspecting and confirming the relative positional relationship of the positions, it is possible to ensure the relative positional accuracy of the second through hole hole position with respect to the first through hole hole position.
【００２０】[0020]
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００２１】図１は、本発明の一実施例におけるプリン
ト配線板の製造方法を示し、図２は第１および第２のス
ルーホールの相対位置精度の検査・確認の方法を説明す
るための図である。FIG. 1 shows a method for manufacturing a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a view for explaining a method for inspecting and confirming the relative positional accuracy of the first and second through holes. Is.
【００２２】図１および図２において、１１は絶縁基
板、１２ａは銅はく、１２ｂは銅めっき層、１３ａは第
１のスルーホール、１３ｂは第２のスルーホール、１４
はアルカリ可溶性の樹脂、１５ａは第３のスルーホー
ル、１５ｂは第４のスルーホールである。In FIGS. 1 and 2, 11 is an insulating substrate, 12a is a copper foil, 12b is a copper plating layer, 13a is a first through hole, 13b is a second through hole, and 14
Is an alkali-soluble resin, 15a is a third through hole, and 15b is a fourth through hole.
【００２３】以上のように構成されたプリント配線板の
製造方法について、図１および図２を用いて詳細に説明
する。A method of manufacturing the printed wiring board having the above structure will be described in detail with reference to FIGS. 1 and 2.
【００２４】まず、ガラス布基材エポキシ樹脂積層板で
構成された絶縁基板１１の両面に銅はく１２ａがラミネ
ートされた銅張積層板を所定サイズに切断した後、図１
（ａ）に示すようにＮＣボール盤などの手段により第１
のスルーホール１３ａを加工・形成する。First, a copper clad laminate in which copper foils 12a are laminated on both surfaces of an insulating substrate 11 made of a glass cloth base epoxy resin laminate is cut into a predetermined size, and then, as shown in FIG.
As shown in (a), the first means such as NC drilling machine is used.
Through hole 13a is processed and formed.
【００２５】同時に、プリント配線板形成領域外の銅張
積層板に第１のスルーホール１３ａの穴径と同径の第３
のスルーホール１５ａを２個、そのピッチが第１のスル
ーホール１３ａ穴径、第２のスルーホール１３ｂ穴径及
び第１のスルーホール１３ａと第２のスルーホール１３
ｂ穴位置のずれ許容差の２倍とした位置にドリル加工・
形成される。At the same time, in the copper clad laminate outside the printed wiring board forming area, a third through hole having the same diameter as the first through hole 13a is formed.
Two through holes 15a, the pitch of which is the first through hole 13a hole diameter, the second through hole 13b hole diameter, and the first through hole 13a and the second through hole 13
Drill at a position that is twice the hole position deviation tolerance.
It is formed.
【００２６】次に、第１のスルーホール１３ａおよび第
３のスルーホール１５ａが形成された銅張積層板は、図
１（ｂ）に示すようにその全面に無電解銅めっき層、電
解銅めっき層１２ｂが形成され、その後、スルーホール
の銅めっき層１２ｂをエッチングから保護するアルカリ
可溶性の樹脂１４がスキージング法により第１のスルー
ホール１３ａと銅めっき層１２ｂ表面に充填・塗布・紫
外線硬化される。Next, as shown in FIG. 1B, the copper clad laminate having the first through holes 13a and the third through holes 15a formed thereon has an electroless copper plating layer and an electrolytic copper plating on the entire surface. After the layer 12b is formed, the alkali-soluble resin 14 that protects the copper plating layer 12b of the through hole from etching is filled / applied / UV-cured on the surfaces of the first through hole 13a and the copper plating layer 12b by the squeegeeing method. It
【００２７】銅めっき層１２ｂ表面のアルカリ可溶性の
樹脂１４は、図１（ｃ）に示すように研摩により機械的
に除去され、ついで銅めっき層１２ｂと第１のスルーホ
ール１３ａと第３のスルーホール１５ａの内部にアルカ
リ可溶性の樹脂１４が形成された銅張積層板は、２ない
し３枚重ね合わせられ、ＮＣボール盤にセットの後、図
１（ｄ）に示すように、ドリルにより第２のスルーホー
ル１３ｂが加工・形成される。The alkali-soluble resin 14 on the surface of the copper plating layer 12b is mechanically removed by polishing as shown in FIG. 1 (c), and then the copper plating layer 12b, the first through hole 13a and the third through hole are formed. Two or three copper-clad laminates in which the alkali-soluble resin 14 is formed inside the hole 15a are stacked, set on an NC drilling machine, and then, as shown in FIG. The through hole 13b is processed / formed.
【００２８】銅めっき層１２ｂ表面のアルカリ可溶性の
樹脂１４の機械研摩・除去の際に、銅めっき時に発生す
るめっき表面のザラツキやムラは同時除去されるため
に、２ないし３枚の重ねられた銅張積層板間はギャップ
なく密着し、従来のプリント配線板の製造方法で発生し
ていた第２のスルーホール１３ｂ穴周囲の約２０〜５０
μｍ程度のバリは実用上問題ない１０μｍ以下に抑制す
ることができた。During mechanical polishing / removal of the alkali-soluble resin 14 on the surface of the copper plating layer 12b, roughness or unevenness of the plating surface generated during copper plating is simultaneously removed, so that two or three sheets are stacked. There is no gap between the copper-clad laminates, and about 20 to 50 around the hole of the second through hole 13b generated in the conventional printed wiring board manufacturing method.
Burrs of about μm could be suppressed to 10 μm or less, which is practically no problem.
【００２９】さらに従来、第１のスルーホール１３ａと
第２のスルーホール１３ｂの相対位置ずれは、最大１５
０μｍ程度検出されたが、５０〜８０μｍ以下に精度良
く加工可能となった。Further, conventionally, the relative positional deviation between the first through hole 13a and the second through hole 13b is 15 at maximum.
Although about 0 μm was detected, it was possible to accurately process to 50 to 80 μm or less.
【００３０】同時に、図１（ｄ）および図２（ａ）に示
すようにプリント配線板形成領域外に加工された２個の
第３のスルーホール１５ａのピッチセンター位置に第２
のスルーホール１３ｂの穴径と同径の第４のスルーホー
ル１５ｂが形成される。At the same time, as shown in FIGS. 1 (d) and 2 (a), the second third through holes 15a machined outside the printed wiring board forming area are provided with a second pitch center position.
A fourth through hole 15b having the same diameter as the through hole 13b is formed.
【００３１】形成された第３のスルーホール１５ａと第
４のスルーホール１５ｂは、その相対位置関係が第１の
スルーホール１３ａと第２のスルーホール１３ｂとの間
のずれが許容差内であれば、図２（ｂ）に示すように、
第３のスルーホール１５ａと隣接した第４のスルーホー
ル１５ｂとの間に隔壁が生じ、また、ずれが許容差を越
えた場合は、図２（ｃ）に示すように、第４のスルーホ
ール１５ｂによって第３のスルーホール１５ａが破壊さ
れる。The third through hole 15a and the fourth through hole 15b thus formed have a relative positional relationship such that the deviation between the first through hole 13a and the second through hole 13b is within a tolerance. For example, as shown in FIG.
When a partition wall is formed between the third through hole 15a and the adjacent fourth through hole 15b, and the deviation exceeds the tolerance, as shown in FIG. 2C, the fourth through hole is formed. The third through hole 15a is destroyed by 15b.
【００３２】これにより第１のスルーホール１３ａと第
２のスルーホール１３ｂの相対位置精度は、目視により
容易に検出・確認することができる。As a result, the relative positional accuracy of the first through hole 13a and the second through hole 13b can be easily detected and confirmed visually.
【００３３】第１のスルーホール１３ａ、第２のスルー
ホール１３ｂ、銅めっき層１２ｂとスルーホール内に充
填された樹脂層１４が形成された銅張積層板は、従来の
プリント配線板の製造方法と同様に、感光性ドライフィ
ルムとの接着性向上のため整面された後、感光性ドライ
フィルムがラミーネートされ、所定画像が形成された導
体パターン形成用のマスターフィルムが真空密着・紫外
線露光、未露光部分の除去の後、エッチングレジストが
形成される。The copper clad laminate having the first through hole 13a, the second through hole 13b, the copper plating layer 12b and the resin layer 14 filled in the through hole is a conventional printed wiring board manufacturing method. In the same manner as above, after the surface is adjusted to improve the adhesiveness with the photosensitive dry film, the photosensitive dry film is laminated, and the master film for forming the conductor pattern on which the predetermined image is formed is vacuum-adhered / exposed to ultraviolet light and is not exposed. After removing the exposed portion, an etching resist is formed.
【００３４】ついで塩化第２銅などの溶液を用いて露出
した銅めっき層１２ｂと銅はく１２ａ部分がエッチング
され、アルカリ水溶液でエッチングレジストと第１のス
ルーホール１３ａの銅めっき層を保護していた樹脂１４
が剥離・除去されて絶縁基板１１上に導体パターンが形
成される。Then, the exposed copper plating layer 12b and the copper foil 12a are etched using a solution of cupric chloride or the like, and the etching resist and the copper plating layer of the first through hole 13a are protected by an alkaline aqueous solution. Resin 14
Are peeled off and removed to form a conductor pattern on the insulating substrate 11.
【００３５】次に、はんだ付け不要部分にソルダレジス
トを形成、部品装着位置など明示するロードマップを形
成した後、外形加工、洗浄、フラックス塗布などの工程
処理の後、プリント配線板が完成される。Next, a solder resist is formed on a portion where soldering is not required, a road map that clearly indicates a component mounting position and the like is formed, and after the process processing such as outer shape processing, cleaning and flux application, the printed wiring board is completed. .
【００３６】なお、実施例においてプリント配線板は、
両面プリント配線板としたがプリント配線板は多層プリ
ント配線板としてもよい。また、エッチングレジストの
形成方法は写真現像法としたが、エッチングレジストの
形成方法は、スクリーン印刷法としてもよいことは言う
までもない。In the examples, the printed wiring board is
Although the double-sided printed wiring board is used, the printed wiring board may be a multilayer printed wiring board. Further, although the etching resist forming method is the photo-developing method, it goes without saying that the etching resist forming method may be a screen printing method.
【００３７】[0037]
【発明の効果】以上のように本発明によれば、銅めっき
層が形成されない第２のスルーホール形成を銅めっき層
形成の後、あるいは銅めっき層形成・アルカリ可溶性の
樹脂の充填・形成の後に実施する構成とすることによ
り、銅めっき層が形成されない第２のスルーホールの加
工位置精度が向上すると同時にスルーホールの加工位置
精度の目視による容易な検査方法と、第２のスルーホー
ルの穴周囲にバリの無いプリント配線板を提供すること
ができる優れたプリント配線板の製造方法を実現できる
ものである。As described above, according to the present invention, the second through hole in which the copper plating layer is not formed is formed after the copper plating layer is formed or after the copper plating layer is formed and the alkali-soluble resin is filled and formed. By adopting the configuration to be performed later, the processing position accuracy of the second through hole in which the copper plating layer is not formed is improved, and at the same time, an easy inspection method for visually checking the processing position accuracy of the through hole and the hole of the second through hole. It is possible to realize an excellent printed wiring board manufacturing method capable of providing a printed wiring board without burrs around.
【図１】（ａ）〜（ｄ）は本発明の一実施例におけるプ
リント配線板の製造過程を示す断面図1A to 1D are cross-sectional views showing a manufacturing process of a printed wiring board according to an embodiment of the present invention.
【図２】（ａ）〜（ｃ）は本発明の一実施例におけるプ
リント配線板のずれ検査・確認方法の動作説明のための
平面図2A to 2C are plan views for explaining the operation of the printed wiring board displacement inspection / confirmation method in one embodiment of the present invention.
【図３】（ａ）〜（ｅ）は従来のプリント配線板の製造
過程を示す断面図3 (a) to 3 (e) are cross-sectional views showing a manufacturing process of a conventional printed wiring board.
１１ 絶縁基板 １２ａ 銅はく １２ｂ 銅めっき層 １３ａ 第１のスルーホール １３ｂ 第２のスルーホール １４ アルカリ可溶性の樹脂 １５ａ 第３のスルーホール １５ｂ 第４のスルーホール 11 Insulating Substrate 12a Copper Foil 12b Copper Plating Layer 13a First Through Hole 13b Second Through Hole 14 Alkali-Soluble Resin 15a Third Through Hole 15b Fourth Through Hole
Claims (3)
スルーホール穴加工を施す工程と、この銅張積層板表面
に銅めっきによる導体層を形成する工程と、導体層が形
成された銅張積層板に第２のスルーホール穴加工を施す
工程とを備えたプリント配線板の製造方法。1. A step of forming a first through-hole on a copper clad laminate cut to a predetermined size, a step of forming a conductor layer by copper plating on the surface of the copper clad laminate, and a conductor layer being formed. And a step of performing a second through-hole processing on the copper clad laminate thus obtained.
スルーホール穴加工を施す工程と、この銅張積層板表面
に銅めっきによる導体層を形成する工程と、スルーホー
ル穴にアルカリ可溶性の樹脂を充填する工程と、この銅
張積層板に第２のスルーホール穴加工を施す工程とを備
えたプリント配線板の製造方法。2. A step of forming a first through-hole hole on a copper-clad laminate cut to a predetermined size, a step of forming a conductor layer by copper plating on the surface of the copper-clad laminate, and a step of forming a through-hole. A method of manufacturing a printed wiring board, comprising: a step of filling an alkali-soluble resin; and a step of forming a second through hole in the copper clad laminate.
配線形成領域外の銅張積層板に、第１のスルーホール穴
径、第２のスルーホール穴径および第１のスルーホール
穴と第２のスルーホール穴のずれ許容差の２倍を加えた
ピッチで複数の第１のスルーホール穴径と同径の第３の
スルーホール穴を形成し、第３のスルーホール穴間セン
ター位置に第２のスルーホール穴加工と同時に第２のス
ルーホール穴径と同径の第４のスルーホール穴を形成す
る請求項１または２記載のプリント配線板の製造方法。3. A first through-hole hole diameter, a second through-hole hole diameter, and a first through-hole hole are formed on a copper clad laminate outside the printed wiring forming area during the first through-hole hole processing. A plurality of third through-hole holes having the same diameter as the first through-hole hole diameter are formed at a pitch that is twice the tolerance of the deviation of the second through-hole hole, and the center position between the third through-hole holes is formed. The method for manufacturing a printed wiring board according to claim 1 or 2, wherein a fourth through-hole having the same diameter as the second through-hole is formed at the same time as the second through-hole processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4326593A JP2797871B2 (en) | 1992-12-07 | 1992-12-07 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4326593A JP2797871B2 (en) | 1992-12-07 | 1992-12-07 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06177503A true JPH06177503A (en) | 1994-06-24 |
| JP2797871B2 JP2797871B2 (en) | 1998-09-17 |
Family
ID=18189557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4326593A Expired - Fee Related JP2797871B2 (en) | 1992-12-07 | 1992-12-07 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2797871B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532493A (en) * | 1994-01-21 | 1996-07-02 | The United States Of America As Represented By The Secretary Of The Air Force | Optical waveguide chemical and biological sensor |
| JP2008109144A (en) * | 2007-11-05 | 2008-05-08 | Toshiba Corp | Manufacturing method and inspection method for circuit board |
| JP2010135734A (en) * | 2008-12-03 | 2010-06-17 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing printed-circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243740A (en) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | Printed wiring board and its manufacture |
-
1992
- 1992-12-07 JP JP4326593A patent/JP2797871B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05243740A (en) * | 1992-02-27 | 1993-09-21 | Fujitsu Ltd | Printed wiring board and its manufacture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532493A (en) * | 1994-01-21 | 1996-07-02 | The United States Of America As Represented By The Secretary Of The Air Force | Optical waveguide chemical and biological sensor |
| JP2008109144A (en) * | 2007-11-05 | 2008-05-08 | Toshiba Corp | Manufacturing method and inspection method for circuit board |
| JP2010135734A (en) * | 2008-12-03 | 2010-06-17 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing printed-circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2797871B2 (en) | 1998-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5218761A (en) | Process for manufacturing printed wiring boards | |
| JP2001053447A (en) | Multilayer wiring board with built-in part and manufacturing method thereof | |
| JP2006165494A (en) | Manufacturing method of printed circuit board and thin printed circuit board | |
| JP2006148038A (en) | Method of manufacturing high density printed circuit board | |
| JP2010087168A (en) | Method for manufacturing multilayer printed circuit board | |
| JP2013168691A (en) | Printed circuit board and method for filling via hole thereof | |
| JP2013106034A (en) | Manufacturing method of printed circuit board | |
| JPH1187931A (en) | Manufacture of printed circuit board | |
| JP2797871B2 (en) | Manufacturing method of printed wiring board | |
| JPH09232760A (en) | Multilayered printed-wiring board and manufacture thereof | |
| JPH11261236A (en) | Multi-layer printed wiring board and manufacture thereof | |
| KR20030037738A (en) | Method for creating blind via holes in printed circuit board | |
| JP2010129997A (en) | Printed-circuit board with embedded pattern, and its manufacturing method | |
| JP2005236194A (en) | Manufacturing method for printed-wiring board | |
| JPH1187886A (en) | Production of printed wiring board | |
| KR100313612B1 (en) | Method of making blind-via hole in PCB | |
| KR20030042339A (en) | Method for creating through holes in printed wiring board | |
| JP2002111204A (en) | Method of manufacturing multilayered wiring board | |
| KR100651341B1 (en) | Printed circuit board manufacturing method where fine pattern can be formed | |
| JP2004335726A (en) | Method of manufacturing multilayer printed wiring board with cavity | |
| JPH04286389A (en) | Manufacture of circuit board | |
| KR100332516B1 (en) | Method of making blind-via hole in PCB | |
| JP2009088337A (en) | Printed circuit board and its manufacturing method | |
| JPH08186357A (en) | Printed wiring board and manufacture thereof | |
| KR101492192B1 (en) | Multi-Layer Printed Circuit Board And Its Manufacturing Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070703 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20080703 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20090703 |
|
| LAPS | Cancellation because of no payment of annual fees |