JPH06169147A - Metal base circuit board and manufacture thereof - Google Patents
Metal base circuit board and manufacture thereofInfo
- Publication number
- JPH06169147A JPH06169147A JP32067192A JP32067192A JPH06169147A JP H06169147 A JPH06169147 A JP H06169147A JP 32067192 A JP32067192 A JP 32067192A JP 32067192 A JP32067192 A JP 32067192A JP H06169147 A JPH06169147 A JP H06169147A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- conductive
- holding plate
- insulating layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は大きな電流容量を備え、
かつ量産に適した、放熱性の良好な金属ベース回路基板
及びその製造方法に関する。The present invention has a large current capacity,
In addition, the present invention relates to a metal base circuit board suitable for mass production and having good heat dissipation, and a method for manufacturing the same.
【０００２】[0002]
【従来技術及びその課題】放熱性等の特性を改良するた
めに銅板またはアルミニウム板等の金属基板を使用し、
この少なくとも片面に絶縁層を介して導電回路を設けた
金属ベース回路基板が知られている。2. Description of the Related Art A metal substrate such as a copper plate or an aluminum plate is used to improve characteristics such as heat dissipation.
There is known a metal base circuit board in which a conductive circuit is provided on at least one side of the insulating layer.
【０００３】通常、上記の導電回路を設ける方法として
は、銅箔等の金属箔を用い各種エッチング法により所定
パターンの導電回路を形成することがなされている。Generally, as a method for providing the above-mentioned conductive circuit, a conductive circuit having a predetermined pattern is formed by various etching methods using a metal foil such as a copper foil.
【０００４】しかしながら、このようなエッチング法に
よる導電回路形成法では、導電回路の厚みが厚いものは
作成し難く、またエッチング法によって導電回路を形成
した後、さらに回路上にハンダを介して厚銅を積層して
回路の厚みを厚くすることがなされているが、生産性に
劣るため、用途によっては電流容量を大きくとる必要が
ある上記金属ベース回路基板の製造には不向きであっ
た。However, in such a conductive circuit forming method by the etching method, it is difficult to form a conductive circuit having a large thickness, and after forming the conductive circuit by the etching method, a thick copper layer is further formed on the circuit via solder. Although the thickness of the circuit has been increased by laminating the above, it is unsuitable for manufacturing the above metal-based circuit board that requires a large current capacity depending on the application because of poor productivity.
【０００５】[0005]
【課題を解決するための手段】本発明は上記問題点を解
消できる金属ベース回路基板及びその製造方法を見出だ
したものであって、その要旨とするところは、金属基板
１の少なくとも片面に、導電性金属板を打ち抜いて形成
した導電回路部２を絶縁層４を介して積層一体化したこ
とを特徴とする金属ベース回路基板、及び金属基板１と
ほぼ同一の外形寸法を有する保持板３の一部を導電回路
の形状に打ち抜き、その打ち抜き穴３１に導電性金属板
を打ち抜いて形成した導電回路部２を嵌め込み、つい
で、この導電回路部２を嵌め込んだ保持板３を絶縁層４
を介して金属基板１の少なくとも片面に載置し、積層一
体化した後、保持板３のみを絶縁層４から剥離すること
を特徴とする金属ベース回路基板の製造方法にある。以
下、本発明を図面により詳細に説明する。図１は本発明
の金属ベース回路基板の一例を示す断面概略図、図２は
本発明基板の他の例を示す断面概略図、図３乃至図５は
本発明基板の製造方法の一例を示す概略図であり、図３
は保持板の打ち抜き穴に導電性金属板を打ち抜いて形成
した導電回路部を嵌め込んだ状態を示した平面図（ａ）
と断面概略図（ｂ）、図４は上下方向から加熱プレス板
により各構成部材を挟持した状態を示す断面概略図、図
５は保持板のみを絶縁層から剥離した状態を示す断面概
略図である。DISCLOSURE OF THE INVENTION The present invention has found a metal base circuit board and a method for manufacturing the same which can solve the above problems. The gist of the present invention is to provide at least one surface of the metal board 1. The metal base circuit board is characterized in that the conductive circuit portion 2 formed by punching out the conductive metal plate is laminated and integrated via the insulating layer 4, and the holding plate 3 having substantially the same outer dimensions as the metal substrate 1. A part is punched out in the shape of a conductive circuit, the conductive circuit part 2 formed by punching out a conductive metal plate is fitted into the punched hole 31, and then the holding plate 3 fitted with the conductive circuit part 2 is attached to the insulating layer 4.
The method for manufacturing a metal base circuit board is characterized in that the holding plate 3 is placed on at least one surface of the metal substrate 1 via the above, laminated and integrated, and then only the holding plate 3 is peeled off from the insulating layer 4. Hereinafter, the present invention will be described in detail with reference to the drawings. 1 is a schematic cross-sectional view showing an example of the metal base circuit board of the present invention, FIG. 2 is a schematic cross-sectional view showing another example of the present invention board, and FIGS. 3 to 5 show an example of a method of manufacturing the present invention board. 3 is a schematic diagram, FIG.
Is a plan view showing a state where a conductive circuit portion formed by punching out a conductive metal plate is fitted into a punching hole of a holding plate (a).
FIG. 4 is a schematic sectional view showing a state in which each constituent member is sandwiched by heating press plates from above and below, and FIG. 5 is a schematic sectional view showing a state in which only the holding plate is separated from the insulating layer. is there.
【０００６】本発明の金属ベース回路基板で使用する金
属基板１には放熱性に優れた銅板、アルミニウム板、鉄
板等が使用でき、厚みは０．５〜５ｍｍ、好ましくは１
〜３ｍｍの範囲のものが好適に使用できる。As the metal substrate 1 used in the metal base circuit board of the present invention, a copper plate, an aluminum plate, an iron plate or the like having excellent heat dissipation can be used, and the thickness thereof is 0.5 to 5 mm, preferably 1
Those having a range of up to 3 mm can be suitably used.
【０００７】上記金属基板１の少なくとも片面には図
１、２に示すように絶縁層４を介して導電性金属板を打
ち抜いて形成した導電回路部２を設けるが、絶縁層４に
使用する樹脂としては、ポリエーテルイミド、ポリエー
テルエーテルケトン、ポリエーテルサルフォン等の熱可
塑性樹脂やエポキシ樹脂、ポリイミド樹脂等の熱硬化性
樹脂が使用でき、必要に応じてガラス繊維布等の補強材
を介在させてもよい。As shown in FIGS. 1 and 2, a conductive circuit portion 2 formed by punching out a conductive metal plate is provided on at least one surface of the metal substrate 1 through an insulating layer 4, and a resin used for the insulating layer 4 is used. As the thermoplastic resin such as polyetherimide, polyetheretherketone, and polyethersulfone, or a thermosetting resin such as epoxy resin or polyimide resin, a reinforcing material such as glass fiber cloth may be used as necessary. You may let me.
【０００８】また、高度に放熱性を要求される基板で
は、熱伝導性に優れた窒化ケイ素や窒化ホウ素等の高熱
伝導性フイラーと樹脂粉体との混合物を、静電塗装法に
より金属基板上に塗布して絶縁層を形成したものが好適
に使用できる。Further, in the case of a substrate which is required to have a high heat dissipation property, a mixture of a highly thermal conductive filler such as silicon nitride or boron nitride having excellent thermal conductivity and a resin powder is applied on a metal substrate by an electrostatic coating method. What was apply | coated to and which formed the insulating layer can be used conveniently.
【０００９】上記絶縁層の厚みは絶縁性と熱伝導性の点
から０．０２〜０．５ｍｍ、好ましくは０．０８〜０．
２ｍｍの範囲とすればよい。ここで絶縁層としては図１
に示すような単一の層構成や、図２に示すような複数の
層構成でもよく、図２に示した絶縁層４では前もって金
属基板上に設け熱硬化した熱硬化性樹脂層４２の上にさ
らに接着性樹脂層４１を被覆し、導電回路を接合できる
ようにしている。接着性樹脂層には通常のプリプレグ、
接着性フイルムや各種接着剤が使用できる。The thickness of the insulating layer is 0.02 to 0.5 mm, preferably 0.08 to 0.
The range may be 2 mm. Here, as the insulating layer, FIG.
A single layer structure as shown in FIG. 2 or a plurality of layer structures as shown in FIG. 2 may be used. In the insulating layer 4 shown in FIG. 2, the insulating layer 4 shown in FIG. Further, the adhesive resin layer 41 is further covered so that the conductive circuit can be joined. Ordinary prepreg for the adhesive resin layer,
Adhesive film and various adhesives can be used.
【００１０】絶縁層４には導電性金属板を打ち抜いて形
成した導電回路部２を積層一体化するが、導電性金属板
としては銅又はアルミニウム等からなる導体の金属板が
使用でき、表面にニッケルメッキ等を施したり、クラッ
ド金属板を使用してもよい。この導電性金属板の厚みは
０．２〜１．５ｍｍ、好ましくは０．３〜０．８ｍｍの
範囲のものが使用できる。導電回路部２を積層一体化す
る方法としては、通常の加熱プレス法によればよい。A conductive circuit portion 2 formed by punching out a conductive metal plate is laminated and integrated on the insulating layer 4. A conductive metal plate made of copper, aluminum or the like can be used as the conductive metal plate, and the conductive metal plate is formed on the surface. Nickel plating or the like or a clad metal plate may be used. The conductive metal plate having a thickness of 0.2 to 1.5 mm, preferably 0.3 to 0.8 mm can be used. As a method of laminating and integrating the conductive circuit portion 2, a usual hot pressing method may be used.
【００１１】ここで、上記構成の基板を製造する方法に
は種々の方法が考えられるが、製造方法の一例として、
図３乃至図５に従い、その製造工程を説明する。図３の
（ａ）は、金属基板とほぼ同一の外形寸法を有する保持
板３の一部を導電回路の形状に打ち抜き、その打ち抜き
穴３１に導電性金属板を打ち抜いて形成した導電回路部
２を嵌め込んだ状態を示した平面図、図３の（ｂ）は、
（ａ）のｂ−ｂでの断面概略図である。Various methods are conceivable for manufacturing the substrate having the above structure.
The manufacturing process will be described with reference to FIGS. FIG. 3A shows a conductive circuit portion 2 formed by punching a part of a holding plate 3 having substantially the same outer dimensions as a metal substrate into a conductive circuit shape and punching a conductive metal plate into a punching hole 31. 3B is a plan view showing a state in which is fitted, FIG.
It is the cross-sectional schematic diagram in bb of (a).
【００１２】上記の保持板３の一部を導電回路の形状に
打ち抜き、その打ち抜き穴３１に導電回路部２を嵌め込
む方法としては、種々の方法があるが、特開平２−１９
０２９８号７や特開平２−２０５４１９号に示されてい
る方法によればよく、金属基板１とほぼ同一の外形寸法
を有する保持板３と導電性金属板を重ね、導電性金属板
側から順次導電回路の形状に打ち抜き、保持板３の打ち
抜き穴３１に導電回路部２を圧入する方法がより量産に
適しており好ましい。保持板３はアルミニウム、鉄等が
使用でき保持板３の厚みは導電回路部２と同じか、若干
肉薄でもよい。There are various methods for punching a part of the holding plate 3 into the shape of a conductive circuit and inserting the conductive circuit portion 2 into the punched hole 31.
No. 02987 and Japanese Unexamined Patent Publication No. 2-205419 may be used, and the holding plate 3 and the conductive metal plate having substantially the same outer dimensions as the metal substrate 1 are stacked, and the conductive metal plate side is sequentially stacked. A method of punching into the shape of a conductive circuit and press-fitting the conductive circuit portion 2 into the punched hole 31 of the holding plate 3 is more suitable for mass production and is preferable. The holding plate 3 may be made of aluminum, iron, or the like, and the thickness of the holding plate 3 may be the same as that of the conductive circuit portion 2 or may be slightly thinner.
【００１３】また、図３の（ｂ）に示すように保持板３
の絶縁層４に接する部分に、表面剥離剤３２を塗布する
ことが好ましく、後工程での保持板３の剥離が容易にで
きるという利点がある。表面剥離剤３２としては、シリ
コ−ン系離型剤やボロン系離型剤等が好適に使用でき
る。表面剥離剤３２は保持板３の一部を打ち抜く前、又
は打ち抜いた後に塗布すればよい。Further, as shown in FIG. 3B, the holding plate 3
It is preferable to apply the surface peeling agent 32 to the portion of the insulating layer 4 that contacts the insulating layer 4, which has an advantage that the holding plate 3 can be easily peeled in a later step. As the surface release agent 32, a silicone-based release agent, a boron-based release agent, or the like can be preferably used. The surface release agent 32 may be applied before or after punching a part of the holding plate 3.
【００１４】つぎに、上記の導電回路部２を嵌め込んだ
保持板３を絶縁層４を介して金属基板１の少なくとも片
面に載置し、積層一体化する必要がある。積層一体化の
方法としては図４に示すように、上下方向から加熱プレ
ス板５、５により挟持し一体化すればよい。加熱プレス
条件は、絶縁層に使用する樹脂等により異なり、層間の
最大接着力が得られる加熱、加圧条件で適宜行えばよ
い。Next, it is necessary to mount the holding plate 3 in which the conductive circuit portion 2 is fitted on at least one surface of the metal substrate 1 with the insulating layer 4 interposed therebetween, and laminate and integrate them. As a method of stacking and integrating, as shown in FIG. 4, it may be sandwiched and integrated by heating press plates 5 and 5 from above and below. The heating and pressing conditions vary depending on the resin used for the insulating layer and the like, and may be appropriately set under heating and pressurizing conditions that achieve the maximum adhesive force between the layers.
【００１５】上記方法で積層一体化した後、図５に示す
ように保持板３のみを絶縁層４から剥離し、最終の金属
ベース回路基板が得られる。After the layers are integrated by the above method, as shown in FIG. 5, only the holding plate 3 is peeled off from the insulating layer 4 to obtain the final metal base circuit board.
【００１６】以下、本発明を実施例により説明する。The present invention will be described below with reference to examples.
【００１７】[0017]
【実施例】図３乃至５に示した製造工程に従がい、下記
の内容により図１に示すような金属ベース回路基板を得
た。 金属基板１…アルミニウム板（厚み： ２ｍｍ） 保持板３… アルミニウム板（厚み：０．５ｍｍ） 導電性金属板… 銅 板 （厚み：０．５ｍｍ） 絶縁層４…ガラスエポキシ樹脂（プリプレグ） 表面剥離剤３２…シリコーン系剥離剤 加熱プレス条件…１６０℃×４０ｋｇｆ／ｃｍ2 、６０
分 得られた金属ベース回路基板は放熱性に優れ、また電流
容量を大きくすることができ、実用上問題がなかった。
なお、導電回路部２の形成は保持板３と導電性金属板を
重ね、導電性金属板側から順次導電回路の形状に打ち抜
き、保持板３の打ち抜き穴３１に導電回路部２を圧入す
る方法で行なった。積層後の保持板３の剥離も容易であ
り、基板の製造は極めて容易であった。EXAMPLE A metal base circuit board as shown in FIG. 1 was obtained according to the following contents by following the manufacturing steps shown in FIGS. Metal substrate 1 ... Aluminum plate (thickness: 2 mm) Holding plate 3 ... Aluminum plate (thickness: 0.5 mm) Conductive metal plate ... Copper plate (thickness: 0.5 mm) Insulation layer 4 ... Glass epoxy resin (prepreg) Surface peeling Agent 32 ... Silicone-based release agent Heat press condition ... 160 ° C. × 40 kgf / cm 2 , 60
The obtained metal-based circuit board had excellent heat dissipation and increased current capacity, so there was no problem in practical use.
The conductive circuit portion 2 is formed by stacking the holding plate 3 and the conductive metal plate, punching them sequentially from the conductive metal plate side into the shape of the conductive circuit, and press-fitting the conductive circuit portion 2 into the punching hole 31 of the holding plate 3. I did it in. The holding plate 3 after the lamination was easily peeled off, and the production of the substrate was extremely easy.
【００１８】[0018]
【発明の効果】上述したように、本発明によれば厚みが
厚い導電回路を設けた金属ベース回路基板が得られ、大
きな電流容量を必要とする用途への利用性が大きく、ま
た量産性に優れているという利点がある。As described above, according to the present invention, a metal base circuit board provided with a thick conductive circuit can be obtained, which has great applicability to applications requiring a large current capacity and mass productivity. It has the advantage of being excellent.
【図１】本発明の金属ベース回路基板の一例を示す断面
概略図。FIG. 1 is a schematic sectional view showing an example of a metal base circuit board of the present invention.
【図２】本発明基板の他の例を示す断面概略図。FIG. 2 is a schematic sectional view showing another example of the substrate of the present invention.
【図３】保持板の抜き穴に導電性金属板を打ち抜いて形
成した導電回路部を嵌め込んだ状態を示した平面図
（ａ）と断面概略図（ｂ）。FIG. 3 is a plan view (a) and a schematic cross-sectional view (b) showing a state in which a conductive circuit portion formed by punching out a conductive metal plate is fitted into a hole in a holding plate.
【図４】上下方向から加熱プレス板により各構成部材を
挟持した状態を示す断面概略図。FIG. 4 is a schematic cross-sectional view showing a state where each constituent member is sandwiched by heating press plates from above and below.
【図５】保持板のみを絶縁層から剥離した状態を示す断
面概略図。FIG. 5 is a schematic cross-sectional view showing a state in which only the holding plate is separated from the insulating layer.
１ 金属基板 ２ 導電回路部 ３ 保持板 ３１ 打ち抜き穴 ３２ 表面剥離剤 ４ 絶縁層 1 Metal Substrate 2 Conductive Circuit Section 3 Holding Plate 31 Punching Hole 32 Surface Release Agent 4 Insulating Layer
Claims (4)
電性金属板を打ち抜いて形成した導電回路部（２）を絶
縁層（４）を介して積層一体化したことを特徴とする金
属ベース回路基板。1. A metal base characterized in that a conductive circuit portion (2) formed by punching out a conductive metal plate is laminated and integrated on at least one surface of a metal substrate (1) via an insulating layer (4). Circuit board.
有する保持板（３）の一部を導電回路の形状に打ち抜
き、その打ち抜き穴（３１）に導電性金属板を打ち抜い
て形成した導電回路部（２）を嵌め込み、ついで、この
導電回路部（２）を嵌め込んだ保持板（３）を絶縁層
（４）を介して金属基板（１）の少なくとも片面に載置
し、積層一体化した後、保持板（３）のみを絶縁層
（４）から剥離することを特徴とする金属ベース回路基
板の製造方法。2. A holding plate (3) having substantially the same outer dimensions as the metal substrate (1) is punched into a conductive circuit shape, and a punching hole (31) is punched with a conductive metal plate. The conductive circuit part (2) is fitted, and then the holding plate (3) fitted with the conductive circuit part (2) is placed on at least one surface of the metal substrate (1) via the insulating layer (4), and laminated. A method for manufacturing a metal base circuit board, characterized in that only the holding plate (3) is separated from the insulating layer (4) after being integrated.
有する保持板（３）と導電回路形成用の導電性金属板を
重ね、導電性金属板側から順次導電回路の形状に打ち抜
き、保持板（３）の打ち抜き穴（３１）に導電回路部
（２）を圧入することを特徴とする請求項２記載の金属
ベース回路基板の製造方法。3. A holding plate (3) having substantially the same outer dimensions as the metal substrate (1) and a conductive metal plate for forming a conductive circuit are stacked, and punched in order from the conductive metal plate side into a conductive circuit shape. The method for manufacturing a metal-based circuit board according to claim 2, wherein the conductive circuit portion (2) is press-fitted into the punched hole (31) of the holding plate (3).
打ち抜いた後に、保持板（３）の絶縁層（４）に接する
部分に、表面剥離剤（３２）を塗布することを特徴とす
る請求項２乃至３記載の金属ベース回路基板の製造方
法。4. A surface release agent (32) is applied to a portion of the holding plate (3) which comes into contact with the insulating layer (4) before or after punching a part of the holding plate (3). The method for manufacturing a metal-based circuit board according to claim 2,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32067192A JPH06169147A (en) | 1992-11-30 | 1992-11-30 | Metal base circuit board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32067192A JPH06169147A (en) | 1992-11-30 | 1992-11-30 | Metal base circuit board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06169147A true JPH06169147A (en) | 1994-06-14 |
Family
ID=18124031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32067192A Pending JPH06169147A (en) | 1992-11-30 | 1992-11-30 | Metal base circuit board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06169147A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0946007A (en) * | 1995-08-02 | 1997-02-14 | Mitsubishi Electric Corp | Circuit board and its manufacture |
| JP2015019003A (en) * | 2013-07-12 | 2015-01-29 | 三菱電機株式会社 | Power module and process of manufacturing the same |
| JP2018147934A (en) * | 2017-03-01 | 2018-09-20 | 三菱マテリアル株式会社 | Method for manufacturing insulative circuit board |
| JP2019169540A (en) * | 2018-03-22 | 2019-10-03 | 三菱マテリアル株式会社 | Insulation circuit board and manufacturing method of the insulation circuit board |
| EP3951856A4 (en) * | 2019-03-26 | 2023-02-01 | Mitsubishi Materials Corporation | Insulated circuit board |
-
1992
- 1992-11-30 JP JP32067192A patent/JPH06169147A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0946007A (en) * | 1995-08-02 | 1997-02-14 | Mitsubishi Electric Corp | Circuit board and its manufacture |
| JP2015019003A (en) * | 2013-07-12 | 2015-01-29 | 三菱電機株式会社 | Power module and process of manufacturing the same |
| JP2018147934A (en) * | 2017-03-01 | 2018-09-20 | 三菱マテリアル株式会社 | Method for manufacturing insulative circuit board |
| JP2019169540A (en) * | 2018-03-22 | 2019-10-03 | 三菱マテリアル株式会社 | Insulation circuit board and manufacturing method of the insulation circuit board |
| EP3951856A4 (en) * | 2019-03-26 | 2023-02-01 | Mitsubishi Materials Corporation | Insulated circuit board |
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