JPH01290279A - Wiring board and manufacture thereof - Google Patents
Wiring board and manufacture thereofInfo
- Publication number
- JPH01290279A JPH01290279A JP12135988A JP12135988A JPH01290279A JP H01290279 A JPH01290279 A JP H01290279A JP 12135988 A JP12135988 A JP 12135988A JP 12135988 A JP12135988 A JP 12135988A JP H01290279 A JPH01290279 A JP H01290279A
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- wiring board
- ceramic
- resin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 52
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011888 foil Substances 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- 238000007751 thermal spraying Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、耐熱性、熱伝導性に優れた配線板とその製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a wiring board with excellent heat resistance and thermal conductivity, and a method for manufacturing the same.
（従来の技術）
樹脂層とセラミックス層を併用することにより配線板の
特性を改善するものとして、特開昭５３−５２９７９号
公報に示されているように配線パターンを形成した樹脂
層をセラミックス基板に熱圧着し樹脂層には予め素子装
着開口窓を穿設しておく方法や特開昭５４−１１１０９
号公報に示されているように複数枚のセラミックス基板
の上に熱軟化性樹脂層を介して金属箔を一体化して複合
基板を得る方法がある。(Prior art) In order to improve the characteristics of a wiring board by using a resin layer and a ceramic layer together, as shown in Japanese Patent Laid-Open No. 53-52979, a resin layer on which a wiring pattern is formed is used as a ceramic substrate. A method of heat-compression bonding and forming an opening window for mounting an element in the resin layer in advance, and a method disclosed in JP-A-54-11109.
As shown in the above publication, there is a method of obtaining a composite substrate by integrating metal foil onto a plurality of ceramic substrates via a thermosoftening resin layer.
（発明が解決しようとする課題）
特開昭５３−５２９７９号公報に示される方法はセラミ
ックス基板を素子搭載のみに使用することを目的として
おり、セラミックス基板と樹脂層とに同時に回路形成す
ることが困難であるという問題点があり、特開昭５４−
１１１０９号公報に示される方法は、セラミックス基板
の上に熱軟化性樹脂層を介して金属箔を一体化している
ため、基板の片面にのみにしか回路形成をすることがで
きず、両面回路や多層回路用途には使用できない。(Problems to be Solved by the Invention) The method disclosed in JP-A-53-52979 is intended to use a ceramic substrate only for mounting elements, and it is possible to form a circuit on the ceramic substrate and the resin layer at the same time. There is a problem that it is difficult, and
The method shown in Publication No. 11109 integrates a metal foil on a ceramic substrate via a heat-softening resin layer, so it is possible to form a circuit only on one side of the substrate, and it is not possible to form a circuit on both sides or a double-sided circuit. Cannot be used for multilayer circuit applications.
本発明は、このような課題を解決し、耐熱性と熱伝導性
に優れ、しかも生産性の良い配線板とその製造方法を提
供するものである。The present invention solves these problems and provides a wiring board with excellent heat resistance and thermal conductivity, and high productivity, and a method for manufacturing the same.
（課題を解決するための手段）
本発明は、樹脂系の絶縁層とその表面の一部分に設けら
れたセラミックス系絶縁層とを有する配線板、その配線
板の配線導体に金属ペーストを用いない配線板、このよ
うな配線板において金属芯を有する配線板、金属芯と樹
脂系の絶縁層とセラミックス系絶縁層とを有する配線板
及び以下にその工程を示すその配線板の製造方法である
。(Means for Solving the Problems) The present invention provides a wiring board having a resin-based insulating layer and a ceramic-based insulating layer provided on a part of the surface thereof, and a wiring that does not use metal paste for the wiring conductor of the wiring board. A wiring board having a metal core, a wiring board having a metal core, a resin-based insulating layer, and a ceramic-based insulating layer, and a method for manufacturing the wiring board, the steps of which are shown below.
ａ、金属芯となる金属板にセラミックスを溶射する工程
。a. Process of spraying ceramics onto a metal plate that will become a metal core.
ｂ、セラミックスを溶射した金属板と金属箔とを樹脂に
よって積層一体化する工程。b. A step of laminating and integrating a ceramic-sprayed metal plate and metal foil with resin.
Ｃ０金属箔の不要な部分をエツチング除去する工程。A process of removing unnecessary parts of C0 metal foil by etching.
第１図に樹脂系の絶縁層１とその表面の一部分に設けら
れたセラミックス系絶縁層２とを有する配線板の配線導
体３に金属ペーストを用いず金属芯４を有する配線板を
示し、第２図に金属芯４と樹脂系の絶縁層１とセラミッ
クス系絶縁層２とを有する配線板を示し、第３図ａ−ｃ
にその配線板の製造方法を示す。以下、図面に従って説
明する。FIG. 1 shows a wiring board having a metal core 4 without using metal paste for the wiring conductor 3 of the wiring board having a resin-based insulating layer 1 and a ceramic-based insulating layer 2 provided on a part of the surface thereof. Fig. 2 shows a wiring board having a metal core 4, a resin-based insulating layer 1, and a ceramic-based insulating layer 2, and Figs. 3 a-c
The method for manufacturing the wiring board is shown below. The explanation will be given below according to the drawings.
本発明の樹脂系の絶縁層１とその表面の一部分に設けら
れたセラミックス系絶縁層２とを有する配線板、その配
線板の配線導体３に金属ペーストを用いない配線板、又
は、このような配線板において金属芯４を有する配線板
において、樹脂系絶縁層１としては、電気的特性の点か
らエポキシ樹脂やポリイミド樹脂が適しており、熱伝導
性、寸法安定性の点からこれらの樹脂をガラス布に含浸
したものや、例えばアルミナや二酸化けい素、窒化アル
ミニウム等の熱伝導性フィラー入りのものが適している
。また、ポリイミド樹脂、ガラス布−エポキシ樹脂、ガ
ラス布−熱伝導性フィラー人ポリイミド樹脂又は熱伝導
性フィラー人エポキシ樹脂のいずれかであれば、さらに
好ましい。A wiring board according to the present invention having a resin-based insulating layer 1 and a ceramic-based insulating layer 2 provided on a part of its surface, a wiring board in which no metal paste is used for the wiring conductor 3 of the wiring board, or such a wiring board. In a wiring board having a metal core 4, epoxy resin or polyimide resin is suitable for the resin insulating layer 1 from the viewpoint of electrical properties, and these resins are suitable from the viewpoint of thermal conductivity and dimensional stability. Suitable materials include those impregnated with glass cloth, and those containing thermally conductive fillers such as alumina, silicon dioxide, and aluminum nitride. Further, it is more preferable to use any one of polyimide resin, glass cloth-epoxy resin, glass cloth-thermally conductive filler polyimide resin, or thermally conductive filler epoxy resin.
セラミックス系絶縁層２としては、その厚さが、熱伝導
性や耐熱性等の効果のあることと、生産性から決まり、
薄すぎると目的とする効果が得られず、又、厚すぎると
樹脂系絶縁層１とセラミックス系絶縁層２の一体化が困
難となる。このセラミックス系絶縁層２の望ましい厚さ
の範囲は、２０〜４００ μｍであり、より望ましい範
囲としては５０〜２００μｍである。このようなセラミ
ックス系絶縁Ｎ２としては、例えばセラミックス基板や
セラミックス溶射膜が適用可能であるが、特に厚さが薄
いセラミックス溶射膜が適している。The thickness of the ceramic insulating layer 2 is determined by its effectiveness in terms of thermal conductivity and heat resistance, as well as productivity.
If it is too thin, the desired effect cannot be obtained, and if it is too thick, it becomes difficult to integrate the resin-based insulating layer 1 and the ceramic-based insulating layer 2. A desirable thickness range of the ceramic insulating layer 2 is 20 to 400 μm, and a more desirable range is 50 to 200 μm. As such a ceramic insulation N2, for example, a ceramic substrate or a ceramic sprayed film can be applied, but a thin ceramic sprayed film is particularly suitable.
樹脂系絶縁層１とセラミックス系絶縁層２との一体化方
法としては、例えば半硬化状態の前記樹脂系絶縁層１を
重ね、その表面にセラミックス系絶縁層２が部分的に載
置されるように積み重ね、最外層に樹脂を塗布した金属
箔を重ねて加圧加熱により積層する方法、アルミナ等の
セラミックスを部分的に溶射した銅箔に樹脂系絶縁層１
を重ねて加圧加熱により積層する方法等がある。As a method for integrating the resin-based insulating layer 1 and the ceramic-based insulating layer 2, for example, the resin-based insulating layer 1 in a semi-hardened state is stacked, and the ceramic-based insulating layer 2 is partially placed on the surface thereof. A method in which metal foil coated with resin is layered on the outermost layer and laminated by heating under pressure.Resin-based insulating layer 1 is placed on copper foil partially sprayed with ceramics such as alumina.
There is a method of laminating layers by applying pressure and heating.
このようにして得られた積層物の回路形成は選択エツチ
ングにより可能である。但し、回路形成法はエツチング
に限定するものではなく、銅箔を用いずめっき法による
回路形成等も可能である。Circuits can be formed on the laminate thus obtained by selective etching. However, the circuit forming method is not limited to etching, and it is also possible to form a circuit by plating without using copper foil.
導体回路３に用いる金属は、通常、印刷配線板に用いら
れているものが使用でき、銅、アルミニウム、ニッケル
、金、銀及びその合金を用いても良い、いずれの・場合
も導体回路３は金属が適しており、−船釣にセラミック
ス配線板の回路形成に用いられているような金属粉を用
いた導体ペーストの使用は導体ペーストの抵抗が高いこ
と等から適していない。The metal used for the conductor circuit 3 can be those normally used for printed wiring boards, and copper, aluminum, nickel, gold, silver, and alloys thereof may also be used. In either case, the conductor circuit 3 is Metals are suitable; conductor pastes using metal powder, such as those used for forming circuits on ceramic wiring boards for fishing boats, are not suitable because of the high resistance of the conductor pastes.
回路接続用スルーホールはセラミックス系絶縁層部以外
に設けることにより容易にスルーホールを形成できこの
ため両面回路や多層回路の形成は一般的な樹脂系配線板
と全く同じ公知の方法で可能である。Through-holes for circuit connection can be easily formed by providing them in areas other than the ceramic insulating layer, making it possible to form double-sided circuits and multilayer circuits using the same known methods as for general resin-based wiring boards. .
４は金属板で、アルミニウム、鉄、ニッケル、銅やこれ
らの合金及びクラフト材等から選べば良く、金属板の厚
さも目的に応じ選定すれば良いが一般的には０．５〜２
■ｌの範囲である。4 is a metal plate, which can be selected from aluminum, iron, nickel, copper, alloys thereof, craft materials, etc. The thickness of the metal plate can also be selected depending on the purpose, but generally it is 0.5 to 2.
■It is within the range of l.
また、本発明の金属芯４と樹脂系の絶縁Ｎ１とセラミッ
クス系絶縁層２とを有する配線板において、セラミック
ス系絶縁Ｆｉ２としては、セラミックス溶射膜であり、
その厚さは、熱伝導性と生産性から決まり、２０〜１０
０μｍが適しておりより望ましくは３０〜６０μｍある
。また、金属芯４と樹脂系の絶縁層１としては、前記と
同じものを用いることができる。Further, in the wiring board having the metal core 4, the resin-based insulation N1, and the ceramic-based insulation layer 2 of the present invention, the ceramic-based insulation Fi2 is a ceramic sprayed film,
Its thickness is determined by thermal conductivity and productivity, and is 20 to 10
0 μm is suitable, and more preferably 30 to 60 μm. Further, as the metal core 4 and the resin-based insulating layer 1, the same ones as described above can be used.
その製造法は第３図ａに示すように、金属板４にアルミ
ナ等のセラミックスを所定量溶射しセラミックス系絶縁
Ｎ２を形成したものを作成し、第３図すに示すように、
これと金属箔６とを樹脂系絶縁層１を用いて接着する。The manufacturing method is as shown in Fig. 3a, by spraying a predetermined amount of ceramics such as alumina on a metal plate 4 to form a ceramic insulation N2, as shown in Fig. 3a.
This and the metal foil 6 are bonded together using the resin-based insulating layer 1.
この樹脂系絶縁Ｎ１は金属箔６もしくは金属板４のいず
れか一方もしくは両方に、塗布しておくことが望ましい
が、予め半硬化状態の樹脂シート等を作成しておき、こ
れを用いることも可能である。接着方法としては、ロー
ルやプレス等による加圧加熱が用いられる。It is desirable to apply this resin-based insulation N1 to either or both of the metal foil 6 and the metal plate 4, but it is also possible to prepare a semi-cured resin sheet or the like in advance and use this. It is. As the adhesion method, pressure heating using a roll, press, etc. is used.
回路形成は、第３図Ｃに示すように、金属７ｔ３６の不
要な部分をエツチング除去することによってなされる。The circuit is formed by etching away unnecessary portions of the metal 7t36, as shown in FIG. 3C.
（作用）
本発明は、樹脂系の絶縁層とその表面の一部分に設けら
れたセラミックス系絶縁層とを有する配線板、その配線
板の配線導体に金属ペーストを用いない配線板、このよ
うな配線板において金属芯を有する配線板、金属芯と樹
脂系の絶縁層とセラミックス系絶縁層とを有する配線板
等、樹脂系絶縁層とセラミックス系絶縁層とを有してい
るので、発熱素子近辺のみを部分的に耐熱性及び熱伝導
性を向上することができ、スルーホールを樹脂系絶縁層
に設けることにより両面回路の形成や多層回路の形成が
容易であり、樹脂系絶縁層を併用していることにより銅
箔の選択エツチングやめっきによる回路形成ができるの
でフォトレジストの使用による微細回路の形成が容易で
ある。この他に、配線板を多数個取りの配置とした場合
に１枚の配線板を切り出すための裁断部にセラミックス
系絶縁層を形成しない設計とすることにより、セラミッ
クス配線板のみを切り出すときより容易に裁断できる。(Function) The present invention provides a wiring board having a resin-based insulating layer and a ceramic-based insulating layer provided on a part of the surface thereof, a wiring board that does not use metal paste for the wiring conductor of the wiring board, and such wiring. Wiring boards with metal cores, wiring boards with metal cores, resin-based insulating layers, and ceramic-based insulating layers, etc., have resin-based insulating layers and ceramic-based insulating layers, so only in the vicinity of the heating element. It is possible to partially improve heat resistance and thermal conductivity, and by providing through holes in the resin insulating layer, it is easy to form double-sided circuits and multilayer circuits. This allows circuit formation by selective etching or plating of copper foil, making it easy to form fine circuits by using photoresist. In addition, when the wiring board is arranged in a multi-piece arrangement, the design does not form a ceramic insulating layer at the cutting part used to cut out a single wiring board, making it easier to cut out only a ceramic wiring board. It can be cut into
また、その回路形成において銅箔を選択エツチングする
ことにより可能であり、従来のセラミックス溶射金属ベ
ース配線板と比較して回路形成が容易であり、フォトレ
ジストの使用ができるので容易に微細回路を形成するこ
とができる。この場合、熱伝導性は樹脂層に熱伝導性フ
ィラーを入れることにより従来のセラミックス溶射金属
ベース配線板と同等程度にすることができる。In addition, circuit formation is possible by selectively etching the copper foil, making it easier to form circuits compared to conventional ceramic sprayed metal-based wiring boards, and since photoresist can be used, fine circuits can be easily formed. can do. In this case, the thermal conductivity can be made comparable to that of a conventional ceramic sprayed metal base wiring board by adding a thermally conductive filler to the resin layer.
実施例１
厚さ１■−のアルミニウムに約６０μｍ程度アルミナｌ
を溶射し、銅箔にアルミナを分散させてエポキシ樹脂ワ
ニスを塗布し乾燥させた樹脂層塗布銅箔５を用意したも
のとともに両者をプレスにて加圧加熱し積層した。Example 1 Approximately 60 μm of alumina l on aluminum with a thickness of 1 -
A resin layer-coated copper foil 5 was prepared by thermally spraying the copper foil, dispersing alumina in the copper foil, coating the copper foil with epoxy resin varnish, and drying it. Both were heated under pressure in a press and laminated together.
この積層物の銅箔を選択的エツチングし、回路形成を行
い本発明の金属ベース配線板を得た。The copper foil of this laminate was selectively etched to form a circuit to obtain a metal base wiring board of the present invention.
実施例２
エポキシ樹脂含浸プリプレグの１００μｍ厚のものを用
意し、５０μｍの厚さにアルミナを部分的に溶射した銅
箔とともに重ね厚さ２１のアルミニウム板に重ね加圧加
熱し積層した。その積層体にフォトレジストを形成し、
選択的エツチング法により回路形成し配線板を得た。Example 2 A prepreg impregnated with an epoxy resin having a thickness of 100 μm was prepared, and a copper foil partially sprayed with alumina to a thickness of 50 μm was stacked on an aluminum plate having a thickness of 21 μm, and the prepreg was heated under pressure and laminated. Forming a photoresist on the laminate,
A circuit was formed by selective etching and a wiring board was obtained.
実施例３
エポキシ樹脂含浸ガラス布の両面に回路形成をした回路
板と、エポキシ樹脂含浸ガラス布プリプレグと、７０μ
ｍの厚さにアルミナを銅箔に部分的に溶射した部分セラ
ミックス溶射銅箔と、銅箔とを重ねて加圧加熱し積層し
た。このものにスルーホールを開け、表面及びスルーホ
ール内に１０μｍの厚さの無電解銅めっきを行いフォト
レジストを形成して選択的エツチング法にて回路形成し
くテンティング法）配線板を得た。Example 3 A circuit board with circuits formed on both sides of an epoxy resin-impregnated glass cloth, an epoxy resin-impregnated glass cloth prepreg, and a 70μ
A partially ceramic sprayed copper foil, in which alumina was partially sprayed onto the copper foil to a thickness of m, was stacked on the copper foil and laminated by heating under pressure. A through hole was opened in this material, electroless copper plating was applied to the surface and inside the through hole to a thickness of 10 μm, a photoresist was formed, and a circuit was formed using a selective etching method (tenting method) to obtain a wiring board.
（発明の効果）
以上に説明したように、本発明の樹脂系″ｌｊＡ縁層に
部分的にセラミックス系絶縁層を形成する配線板は、
ｆｉｌ 大型の配線板も容易に製造できる。(Effects of the Invention) As explained above, the wiring board of the present invention in which a ceramic insulating layer is partially formed on the resin-based "ljA" edge layer can be easily manufactured even in large-sized wiring boards.
（２）小型の配線板の場合は樹脂系の配線板と同様に多
数個取りを行い生産効率を向上することができる。(2) In the case of small-sized wiring boards, production efficiency can be improved by manufacturing multiple pieces as in the case of resin-based wiring boards.
（３） 発熱素子等の搭載のため耐熱性等が必要な場
合に同一配線板上に搭載できるため、スペースの節約が
でき軽薄短小化の要求を満たすことができる。(3) When heat resistance is required to mount a heating element, etc., it can be mounted on the same wiring board, which saves space and satisfies the need for lighter, thinner, and smaller devices.
（４）製造コストの高い厚膜法を用いずに金属箔エツチ
ングやめっき決算純金属を用いる方法で回路形成するた
めセラミックス配線板に比べ格段に安くでき、しかも多
層回路形成も容易な構造となっている。(4) Because the circuit is formed using metal foil etching or plating using pure metal without using the thick film method, which is expensive to manufacture, it is much cheaper than ceramic wiring boards, and it has a structure that allows easy formation of multilayer circuits. ing.
（５） 誘電率の高いセラミックス系絶縁層を部分的
にしか用いておらずほとんどの部分は誘電率の低い樹脂
系の絶縁層構造となっているため伝送特性にも優れてい
る。(5) It also has excellent transmission characteristics because a ceramic insulating layer with a high dielectric constant is used only partially, and most parts have a resin insulating layer structure with a low dielectric constant.
（６） 耐熱性、放熱性等の特性を要求される部分的
にセラミックス系絶縁層を形成し、穴あけ裁断等の機械
加工が必要な場所には樹脂系絶縁層のみとすることによ
り熱特性にも機械加工にも優れた部分セラミックス金属
ベース配線板を作成できる。(6) By forming a ceramic insulating layer in parts that require properties such as heat resistance and heat dissipation, and using only a resin insulating layer in areas where machining such as drilling or cutting is required, thermal properties can be improved. It is also possible to create partially ceramic metal-based wiring boards that are also excellent in machining.
第１図は本発明の一実施例を示す部分セラミックス配線
板の断面図、第１図は本発明の一実施例を示す部分セラ
ミンクス金属ベース配線板の断面図、第３図ａ −ｃは
本発明の一実施例の製造法を説明するための断面図であ
る。
符号の説明
１、樹脂系絶縁層
２、セラミックス系絶縁層
３、導体回路
４、金属板
５、セラミックス溶射銅箔
第 １ 図
第２図
第３図４
第３図す
第３図ＣFIG. 1 is a cross-sectional view of a partial ceramic wiring board showing an embodiment of the present invention, FIG. 1 is a cross-sectional view of a partial ceramic metal base wiring board showing an embodiment of the present invention, and FIGS. FIG. 2 is a cross-sectional view for explaining a manufacturing method according to an embodiment of the invention. Explanation of symbols 1, resin insulating layer 2, ceramic insulating layer 3, conductor circuit 4, metal plate 5, ceramic sprayed copper foil Fig. 2 Fig. 3 Fig. 4 Fig. 3 Fig. 3 C
Claims (5)
セラミックス系絶縁層とを有する配線板。1. A wiring board having a resin-based insulating layer and a ceramic-based insulating layer provided on a portion of its surface.
配線板。2. 2. The wiring board according to claim 1, wherein no metal paste is used for the wiring conductor.
層とを有する配線板。4. A wiring board having a metal core, a resin-based insulating layer, and a ceramic-based insulating layer.
法。 ａ．金属芯となる金属板にセラミックスを溶射する工程
。 ｂ．セラミックスを溶射した金属板と金属箔とを樹脂に
よって積層一体化する工程。 ｃ．金属箔の不要な部分をエッチング除去する工程。5. The method for manufacturing a wiring board according to claim 4, which comprises the following steps. a. A process in which ceramics are sprayed onto a metal plate that serves as a metal core. b. A process in which a ceramic-sprayed metal plate and metal foil are laminated and integrated using resin. c. A process to remove unnecessary parts of metal foil by etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12135988A JPH01290279A (en) | 1988-05-18 | 1988-05-18 | Wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12135988A JPH01290279A (en) | 1988-05-18 | 1988-05-18 | Wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01290279A true JPH01290279A (en) | 1989-11-22 |
Family
ID=14809305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12135988A Pending JPH01290279A (en) | 1988-05-18 | 1988-05-18 | Wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01290279A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0462986A (en) * | 1990-07-02 | 1992-02-27 | Hitachi Chem Co Ltd | Metal base wiring board with resistor |
| WO2008125010A1 (en) * | 2007-04-12 | 2008-10-23 | Cosmos Vacuum Technology Corporation | A method of manufacturing the high heat conductive circuit substrate |
| WO2008125009A1 (en) * | 2007-04-12 | 2008-10-23 | Cosmos Vacuum Technology Corporation | A high heat conductive circuit substrate |
| JP2010021434A (en) * | 2008-07-11 | 2010-01-28 | Denka Agsp Kk | Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element |
-
1988
- 1988-05-18 JP JP12135988A patent/JPH01290279A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0462986A (en) * | 1990-07-02 | 1992-02-27 | Hitachi Chem Co Ltd | Metal base wiring board with resistor |
| WO2008125010A1 (en) * | 2007-04-12 | 2008-10-23 | Cosmos Vacuum Technology Corporation | A method of manufacturing the high heat conductive circuit substrate |
| WO2008125009A1 (en) * | 2007-04-12 | 2008-10-23 | Cosmos Vacuum Technology Corporation | A high heat conductive circuit substrate |
| JP2010021434A (en) * | 2008-07-11 | 2010-01-28 | Denka Agsp Kk | Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element |
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