JPH10303553A - Manufacture for printed wiring board - Google Patents
Manufacture for printed wiring boardInfo
- Publication number
- JPH10303553A JPH10303553A JP9105019A JP10501997A JPH10303553A JP H10303553 A JPH10303553 A JP H10303553A JP 9105019 A JP9105019 A JP 9105019A JP 10501997 A JP10501997 A JP 10501997A JP H10303553 A JPH10303553 A JP H10303553A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- substrate
- printed wiring
- wiring board
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、電気・電子機器等
に使用されるプリント配線板の製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board used for electric and electronic equipment.
【0002】[0002]
【従来の技術】電子部品や半導体装置を実装するための
プリント配線板として、複数の導体層を有する多層のプ
リント配線板が用いられている。この多層のプリント配
線板の製造方法としては、例えば、図5(a)に示すよ
うな、貫通した基板穴33を有すると共に、その基板穴
33の部分を除く一方の面の全面には、金属層32を有
する有機系の第一の基板31aと、一方の面に内層用の
導体パターン34を有すると共に、他方の面には全面に
金属層32を有する有機系の第二の基板31bと、エポ
キシ樹脂等の熱硬化性樹脂をガラスクロス等の基材に含
浸して製造したプリプレグ40を用いる。なお、プリプ
レグ40のうち、第一の基板31aに形成された基板穴
33に対応する部分には、貫通したプリプレグ穴42を
有しており、また、第二の基板31bの、上記基板穴3
3に対応する部分には、内層用の導体パターン34を有
している。2. Description of the Related Art A multilayer printed wiring board having a plurality of conductor layers has been used as a printed wiring board for mounting electronic components and semiconductor devices. As a method of manufacturing this multilayer printed wiring board, for example, as shown in FIG. 5 (a), there is a penetrated substrate hole 33, and the entire surface of one surface excluding the substrate hole 33 is made of metal. An organic first substrate 31a having a layer 32, and an organic second substrate 31b having an inner layer conductor pattern 34 on one surface and a metal layer 32 on the entire surface on the other surface; A prepreg 40 manufactured by impregnating a base material such as a glass cloth with a thermosetting resin such as an epoxy resin is used. In the prepreg 40, a portion corresponding to the substrate hole 33 formed in the first substrate 31a has a penetrated prepreg hole 42, and the second substrate 31b has the aforementioned substrate hole 3
The portion corresponding to No. 3 has a conductor pattern 34 for the inner layer.
【0003】そして、内層用の導体パターン34がプリ
プレグ40と接する側になるように、第一の基板31a
と第二の基板31bの間にプリプレグ40を挟んで積層
した後、加熱・加圧してプリプレグ40中の熱硬化性樹
脂を流動させることにより、導体パターン34間の凹部
をその熱硬化性樹脂で埋め、図5(b)に示すような、
その底面に導体パターン34が露出した凹部37を有す
る多層の積層板を製造する。Then, the first substrate 31a is placed such that the inner layer conductor pattern 34 is in contact with the prepreg 40.
After the prepreg 40 is interposed between the second substrate 31b and the prepreg 40, the thermosetting resin in the prepreg 40 is heated and pressurized so that the recess between the conductor patterns 34 is filled with the thermosetting resin. Filling, as shown in FIG.
A multilayer laminate having a concave portion 37 with the conductive pattern 34 exposed on the bottom surface is manufactured.
【0004】次いで、図5(c)に示すように、この積
層板に穴あけをした後、メッキ処理を行ってこの穴に内
層の導体パターン34及び外層の金属層(32)を導通
するスルホールメッキ皮膜38を形成し、次いで、外層
の金属層をエッチングして外層用の導体パターン39を
形成することによりプリント配線板は製造されている。[0005] Next, as shown in FIG. 5 (c), after punching a hole in the laminated board, plating is performed, and through-hole plating for conducting the inner conductor pattern 34 and the outer metal layer (32) to the hole is performed. A printed wiring board is manufactured by forming a film 38 and then etching an outer metal layer to form a conductor pattern 39 for the outer layer.
【0005】積層板を製造するときにプリプレグを用い
ると、そのプリプレグ中の樹脂は、加熱するといったん
粘度が低下して樹脂が流れ、さらに加熱すると硬化して
樹脂が流れなくなる挙動を示す。そのため、積層時の取
り扱いにおいては固体状のため扱いやすく、また、加熱
・加圧する途中である程度流動性を有するため、多少の
凹凸があっても接着することが可能であるという特徴が
あり一般に用いられている。When a prepreg is used in manufacturing a laminated board, the resin in the prepreg exhibits a behavior in which the viscosity decreases as soon as it is heated and the resin flows, and when further heated, the resin hardens and the resin does not flow. Therefore, it is easy to handle because it is in a solid state in handling at the time of lamination, and it has a certain degree of fluidity during heating and pressing, so it can be adhered even if it has some irregularities. Have been.
【0006】しかしこの方法で製造した場合、図5
(c)に示すように、凹部37の底面に露出した導体パ
ターン34の部分に熱硬化性樹脂45が流れ出して表面
を覆ってしまい、この導体パターン34に電子部品等を
実装した場合、接続信頼性が低いという問題があった。However, when manufactured by this method, FIG.
As shown in (c), the thermosetting resin 45 flows out into the portion of the conductor pattern 34 exposed on the bottom surface of the concave portion 37 and covers the surface, and when an electronic component or the like is mounted on the conductor pattern 34, the connection reliability is reduced. There was a problem that the property is low.
【0007】そのため、図6に示すように、第二の基板
31bの表面に有する内層用の導体パターン34のう
ち、プリプレグ40と接触を予定する部分の導体パター
ン34間に、熱硬化性樹脂を塗布した後、硬化させて、
導体パターン34間を樹脂硬化物35で埋め、次いで、
上記方法に用いたプリプレグよりも、熱硬化性樹脂が流
動し難いプリプレグ40を用いて積層することにより、
加熱・加圧したときに、凹部の底面に露出させようとす
る導体パターン34の部分に熱硬化性樹脂を流れ出し難
くする方法が検討されている。For this reason, as shown in FIG. 6, a thermosetting resin is applied between the conductor patterns 34 of the portion of the inner layer conductor pattern 34 that is to be brought into contact with the prepreg 40, on the surface of the second substrate 31b. After applying, cure
The space between the conductor patterns 34 is filled with a cured resin 35, and then
By laminating using a prepreg 40 in which the thermosetting resin is less likely to flow than the prepreg used in the above method,
A method of making it difficult for the thermosetting resin to flow into the portion of the conductor pattern 34 that is to be exposed on the bottom surface of the concave portion when heated and pressed is being studied.
【0008】なお、基板の間にプリプレグを挟んで積層
した後、加熱・加圧して得られる積層板は、上記第一の
基板31aと第二の基板31bの収縮量が一般に異なる
ため、反りが大きくなりやすく、更にこの反りの大きな
積層板を用いて製造したプリント配線板も反りが大きく
なりやすいという問題があった。The laminate obtained by heating and pressurizing after laminating the prepreg between the substrates is generally warped because the first substrate 31a and the second substrate 31b generally have different shrinkage amounts. There is also a problem that a printed wiring board manufactured using a laminated board having a large warp tends to have a large warp.
【0009】そのため、基板の間にプリプレグを挟んで
積層した後、加熱・加圧して製造するプリント配線板の
製造方法であって、反りが小さいプリント配線板が得ら
れるプリント配線板の製造方法が求められている。Therefore, a method for manufacturing a printed wiring board is described in which a prepreg is sandwiched between substrates and laminated and then heated and pressed to produce a printed wiring board with a small warpage. It has been demanded.
【0010】[0010]
【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、熱硬化性樹脂をガラスクロスに含浸したプリプレ
グと、複数枚の有機系基板とを用いて、基板の間にプリ
プレグを挟んで積層した後、加熱・加圧して製造するプ
リント配線板の製造方法であって、反りが小さいプリン
ト配線板が得られるプリント配線板の製造方法を提供す
ることにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a prepreg in which a thermosetting resin is impregnated into a glass cloth and a plurality of sheets. A method for producing a printed wiring board, comprising: using an organic substrate, laminating a prepreg between substrates, and then heating and applying pressure, wherein a printed wiring board with a small warpage is obtained. It is to provide a manufacturing method.
【0011】[0011]
【課題を解決するための手段】本発明の請求項1に係る
プリント配線板の製造方法は、熱硬化性樹脂をガラスク
ロスに含浸したプリプレグと、その中の少なくとも1枚
には、間を樹脂硬化物で埋められた複数の導体パターン
を表面に有する複数枚の有機系基板とを用いて、間を樹
脂硬化物で埋められた導体パターンがプリプレグと接す
るように、基板の間にプリプレグを挟んで積層した後、
加熱・加圧して製造するプリント配線板の製造方法にお
いて、基板の間に挟むプリプレグが、その挟むプリプレ
グのうち少なくとも1枚には、基板が対向する部分と対
応する位置に、加熱・加圧して熱硬化性樹脂が流動した
ときに、空洞部を形成する大きさの貫通した開口部を有
するプリプレグであることを特徴とする。According to a first aspect of the present invention, there is provided a method for manufacturing a printed wiring board, comprising: a prepreg in which a thermosetting resin is impregnated in a glass cloth; Using a plurality of organic substrates having a plurality of conductor patterns embedded in the cured product on the surface thereof, sandwich the prepreg between the substrates so that the conductor pattern embedded in the cured resin is in contact with the prepreg. After lamination,
In the method of manufacturing a printed wiring board manufactured by heating and pressing, the prepreg sandwiched between the substrates is heated and pressed at a position corresponding to a portion where the substrate is opposed to at least one of the sandwiched prepregs. When the thermosetting resin flows, the prepreg has a penetrating opening having a size to form a cavity.
【0012】なお、本発明の「基板が対向する部分」と
は、基板に貫通した穴を有する場合、その穴の部分は含
めないことを表すものである。The term "part facing the substrate" in the present invention means that when a hole is formed in the substrate, the hole is not included.
【0013】本発明の請求項2に係るプリント配線板の
製造方法は、請求項1記載のプリント配線板の製造方法
において、基板の間に挟む全てのプリプレグに、上記開
口部を有することを特徴とする。According to a second aspect of the present invention, in the method for manufacturing a printed wiring board according to the first aspect, all the prepregs sandwiched between the substrates have the opening. And
【0014】本発明の請求項3に係るプリント配線板の
製造方法は、請求項1又は請求項2記載のプリント配線
板の製造方法において、基板の間に挟むプリプレグが、
プリプレグの全てのX方向及びY方向の断面に、上記開
口部が露出するように、開口部を配設したプリプレグで
あることを特徴とする。According to a third aspect of the present invention, there is provided a method of manufacturing a printed wiring board according to the first or second aspect, wherein the prepreg sandwiched between the substrates comprises:
The prepreg is characterized in that the prepreg is provided with openings so that the openings are exposed in all the cross sections in the X and Y directions of the prepreg.
【0015】加熱してプリプレグ中の熱硬化性樹脂が硬
化するとき、その熱硬化性樹脂が硬化収縮し、その収縮
によってプリプレグの両側に積層した基板も収縮する。
そのため、プリプレグの両側に積層した基板間の圧縮強
度が異なると、その基板間の収縮量が異なり、この差に
よって、収縮量の大きな側に曲がり、反りが発生すると
考えられる。しかし、本発明によると、空洞部をプリン
ト配線板に形成するため、その空洞部と対応する基板の
部分は収縮し難くなり、基板間の収縮量の絶対値がそれ
ぞれ小さくなってその差も小さくなり、反りが小さくな
る。When the thermosetting resin in the prepreg is cured by heating, the thermosetting resin cures and shrinks, and the shrinkage also shrinks the substrates laminated on both sides of the prepreg.
Therefore, if the compressive strength between the substrates laminated on both sides of the prepreg is different, the contraction amount between the substrates is different, and it is considered that the difference causes the bending to the side having the larger contraction amount and warpage. However, according to the present invention, since the cavity is formed in the printed wiring board, the portion of the substrate corresponding to the cavity is unlikely to shrink, and the absolute value of the amount of shrinkage between the substrates is reduced, and the difference is also small. And warpage is reduced.
【0016】[0016]
【発明の実施の形態】本発明に係るプリント配線板の製
造方法を図面に基づいて説明する。図1は本発明に係る
プリント配線板の製造方法の、一実施の形態を示す図で
あり、(a)は積層を説明する斜視図、(b)は積層を
説明する断面図、(c)は加熱後を説明する断面図であ
る。図2も本発明に係るプリント配線板の製造方法の、
一実施の形態を示す図であり、(a)は加熱前を説明す
る平面図、(b)は加熱後を説明する平面方向に破断し
て示した図である。図3は反りを説明する図である。図
4は本発明に係るプリント配線板の製造方法の、一実施
の形態の変形例を示す平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a printed wiring board according to the present invention will be described with reference to the drawings. 1A and 1B are diagrams showing an embodiment of a method for manufacturing a printed wiring board according to the present invention, wherein FIG. 1A is a perspective view illustrating lamination, FIG. 1B is a cross-sectional view illustrating lamination, and FIG. FIG. 3 is a cross-sectional view illustrating a state after heating. FIG. 2 also shows a method of manufacturing a printed wiring board according to the present invention.
It is a figure which shows one Embodiment, (a) is the top view explaining before heating, (b) is the figure fractured | ruptured and shown in the plane direction explaining after heating. FIG. 3 is a diagram for explaining the warpage. FIG. 4 is a plan view showing a modification of the embodiment of the method for manufacturing a printed wiring board according to the present invention.
【0017】本発明に係るプリント配線板の製造方法の
一実施の形態は、図1(a)及び図1(b)に示すよう
に、貫通した基板穴13を有すると共に、その基板穴1
3の部分を除く一方の面の全面には、銅製の金属層12
を有する有機系の第一の基板11aと、一方の面には、
その間を樹脂硬化物15で埋められた複数の内層用の導
体パターン14を有すると共に、他方の面には全面に銅
製の金属層12を有する有機系の第二の基板11bと、
プリプレグ20を用いる。One embodiment of the method for manufacturing a printed wiring board according to the present invention has a penetrated substrate hole 13 as shown in FIGS.
A copper metal layer 12 is formed on the entire surface on one side except the portion 3.
And an organic first substrate 11a having
An organic second substrate 11b having a plurality of inner layer conductor patterns 14 filled with a cured resin material 15 therebetween and a copper metal layer 12 on the entire other surface;
The prepreg 20 is used.
【0018】そして、間を樹脂硬化物15で埋められた
導体パターン14がプリプレグ20と接する側になるよ
うに、第一の基板11aと第二の基板11bの間にプリ
プレグ20を1枚挟んで積層した後、加熱・加圧してプ
リプレグ20中の熱硬化性樹脂を流動化させた後硬化さ
せて、第一の基板11aと第二の基板11bとプリプレ
グ20を一体化し、図1(c)に示すような、その内部
に空洞部25を有する多層の積層板を製造する。Then, one prepreg 20 is sandwiched between the first substrate 11a and the second substrate 11b such that the conductor pattern 14 filled with the cured resin 15 is on the side in contact with the prepreg 20. After lamination, the thermosetting resin in the prepreg 20 is heated and pressurized to fluidize and then harden, and the first substrate 11a, the second substrate 11b, and the prepreg 20 are integrated, and FIG. A multilayer laminate having a cavity 25 therein is manufactured as shown in FIG.
【0019】次いで、図示しないが、必要に応じてこの
積層板に穴あけをした後、メッキ処理を行ってこの穴に
内層の導体パターン及び外層の金属層を導通するスルホ
ールメッキ皮膜を形成し、次いで、外層の金属層をエッ
チングして外層用の導体パターンを形成する等の加工を
行いプリント配線板は製造される。Next, although not shown, the laminated plate is perforated as necessary, and then a plating process is performed to form a through-hole plating film for conducting the inner conductor pattern and the outer metal layer in the perforated holes. The printed wiring board is manufactured by processing such as etching the outer metal layer to form a conductor pattern for the outer layer.
【0020】なお、図2(a)に示すように、用いるプ
リプレグ20には、上記空洞部(25)を形成しようと
する部分には、貫通した開口部21を有しており、その
開口部21の大きさは、図2(b)に示すように、加熱
・加圧して熱硬化性樹脂23が流動した場合に、空洞部
25を形成する大きさとなっている。なお、図2(a)
は加熱前のプリプレグ20を説明する平面図であり、
(b)は加熱・加圧後のプリプレグ20と対応する部分
を、平面方向に破断して示した図である。As shown in FIG. 2A, the prepreg 20 to be used has a penetrating opening 21 at a portion where the hollow portion (25) is to be formed. As shown in FIG. 2B, the size of the cavity 21 is such that a cavity 25 is formed when the thermosetting resin 23 flows by heating and pressing. In addition, FIG.
Is a plan view illustrating the prepreg 20 before heating,
(B) is a diagram showing a portion corresponding to the prepreg 20 after heating and pressurization, which is cut away in a plane direction.
【0021】加熱してプリプレグ20中の熱硬化性樹脂
23が硬化するとき、その熱硬化性樹脂23が硬化収縮
し、その収縮によって上記第一の基板と第二の基板も収
縮する。そのため、第一の基板と第二の基板の圧縮強度
が異なると、第一の基板と第二の基板の収縮量が異な
り、この差によって、図3に示すように、収縮量の大き
な側に積層板10の端部が曲がり、反りSが発生すると
考えられる。しかし、開口部を有するプリプレグを用い
ることにより空洞部を積層板に形成すると、その空洞部
と対応する基板の部分は収縮し難くなるため、第一の基
板と第二の基板の収縮量の絶対値がそれぞれ小さくなっ
てその差も小さくなる。そのため、積層板10の端部が
曲がる曲率半径dが小さくなり、反りSが小さくなる。
そして、この反りSが小さい積層板を用いて得られるプ
リント配線板も、反りが小さくなる。なお、図3(a)
は空洞部を有する積層板10を説明する図であり、
(b)は空洞部を有さない従来の積層板10を説明する
図である。When the thermosetting resin 23 in the prepreg 20 is cured by heating, the thermosetting resin 23 cures and contracts, and the contraction also causes the first substrate and the second substrate to contract. Therefore, if the compressive strengths of the first substrate and the second substrate are different, the amount of contraction of the first substrate and the second substrate is different, and due to this difference, as shown in FIG. It is considered that the end of the laminate 10 bends and warpage S occurs. However, if a cavity is formed in a laminated plate by using a prepreg having an opening, the portion of the substrate corresponding to the cavity is unlikely to shrink, so the absolute amount of shrinkage of the first substrate and the second substrate is reduced. The values become smaller and the difference becomes smaller. Therefore, the radius of curvature d at which the end of the laminated plate 10 bends is reduced, and the warpage S is reduced.
Also, the printed wiring board obtained by using the laminated board having a small warpage S has a small warpage. FIG. 3 (a)
Is a diagram illustrating a laminated plate 10 having a hollow portion,
(B) is a figure explaining the conventional laminated board 10 which does not have a cavity part.
【0022】開口部21の形状としては、図2(a)に
示すような、略渦巻き状の形状に限定するものではな
く、図4(a)に示すような、間に開口部21を設けて
短冊状のプリプレグ20を並べたものや、図4(b)に
示すような、間に開口部21を設けて角形に蛇行を形成
したプリプレグ20や、図4(c)に示すような、蛇行
をプリプレグ20のX方向(図で横方向)及びY方向
(図で縦方向)共に形成することにより、プリプレグ2
0の全てのX方向及びY方向の断面に、開口部21が露
出するように、開口部21を配設したプリプレグ20
や、図4(d)に示すような、中央に開口部21を設け
て口の字形に形成したプリプレグ20や、図4(e)に
示すような、4隅にプリプレグ20を配設したもの等が
挙げられる。なお、図4(c)に示した、プリプレグ2
0の全てのX方向及びY方向の断面に、開口部21が露
出するように、開口部21を配設したプリプレグ20の
場合、X方向とY方向の収縮量を共に小さくすることが
可能なため、特に反りが小さくなり好ましい。また、図
4(b),(c),(d)に示した、蛇行を形成したプ
リプレグ20や口の字形に形成したプリプレグ20の場
合、プリプレグ20が1枚につながっているため、プリ
プレグ20を基板と積層するときの作業性が優れ好まし
い。The shape of the opening 21 is not limited to a substantially spiral shape as shown in FIG. 2A, and the opening 21 is provided between the openings 21 as shown in FIG. 4 (b), an opening 21 is provided between the prepregs 20 to form a square meander, as shown in FIG. 4 (b), or as shown in FIG. 4 (c). By forming the meandering in both the X direction (horizontal direction in the figure) and the Y direction (vertical direction in the figure) of the prepreg 20, the prepreg 2
0, the prepreg 20 in which the openings 21 are disposed so that the openings 21 are exposed in all the cross sections in the X and Y directions.
4 (d), a prepreg 20 provided with an opening 21 at the center and formed in the shape of a mouth, or a prepreg 20 disposed at four corners as shown in FIG. 4 (e). And the like. The prepreg 2 shown in FIG.
In the case of the prepreg 20 in which the openings 21 are arranged so that the openings 21 are exposed in all the cross sections in the X direction and the Y direction of 0, both the shrinkage amounts in the X direction and the Y direction can be reduced. Therefore, the warpage is particularly small, which is preferable. In addition, in the case of the prepreg 20 having a meandering shape or the prepreg 20 having a mouth shape shown in FIGS. 4B, 4C, and 4D, the prepreg 20 is connected to one sheet. Is excellent in workability when laminating with a substrate.
【0023】なお、プリプレグ20に有する上記開口部
21は、第一の基板11aと第二の基板11bが対向す
る部分と対応する位置に有していれば良く、図1(a)
及び図1(b)に示す、第一の基板11aに形成された
貫通した基板穴13と対応する部分には、貫通した穴が
有っても良く、無くても良い。なお、基板穴13と対応
する部分のプリプレグ20に、貫通したプリプレグ穴2
2を有しており、かつ、基板穴33に対応する部分の第
二の基板11bに、内層用の導体パターン14を形成し
ておくと、図1(c)に示すように、加熱・加圧して得
られる積層板に、その底面に導体パターン14が露出す
る凹部17が形成されるため、この積層板を用いて得ら
れるプリント配線板は、電子部品等を実装する導体パタ
ーン14の数を増やすことが可能となる。なお、この基
板穴13と対応する部分に形成したプリプレグ穴22
は、基板11a,11bが対向する部分と対応する位置
に形成する開口部21には含めないものである。The opening 21 of the prepreg 20 only needs to be provided at a position corresponding to a portion where the first substrate 11a and the second substrate 11b face each other.
A portion corresponding to the penetrating substrate hole 13 formed in the first substrate 11a shown in FIG. 1B may or may not have a penetrating hole. In the prepreg 20 at a portion corresponding to the substrate hole 13,
2 and the conductor pattern 14 for the inner layer is formed on the portion of the second substrate 11b corresponding to the substrate hole 33, as shown in FIG. Since a recess 17 is formed on the bottom of the laminated board obtained by pressing the conductive pattern 14 so that the conductive pattern 14 is exposed, the printed wiring board obtained by using this laminated board has a reduced number of conductive patterns 14 on which electronic components and the like are mounted. It is possible to increase. The prepreg holes 22 formed in portions corresponding to the substrate holes 13 are formed.
Are not included in the opening 21 formed at a position corresponding to the portion where the substrates 11a and 11b face each other.
【0024】なお、上記実施の形態は、第一の基板11
aと第二の基板11bの間にプリプレグ20を1枚挟ん
で積層した実施の形態を説明したが、挟むプリプレグ2
0は1枚に限定するものではなく、複数枚挟むようにし
ても良い。複数枚挟む場合には、その全てのプリプレグ
20に上記開口部21を有していると、特に反りが小さ
くなり好ましいが、その挟むプリプレグ20のうち少な
くとも1枚に開口部21を有していれば、反りが小さく
なる。In the above embodiment, the first substrate 11
The embodiment in which one prepreg 20 is sandwiched between the first prepreg 20 and the second substrate 11b has been described.
0 is not limited to one sheet, and a plurality of sheets may be inserted. In the case where a plurality of prepregs 20 are sandwiched, it is preferable that all the prepregs 20 have the opening 21 because the warp is particularly small, but it is preferable that at least one of the sandwiched prepregs 20 has the opening 21. If this occurs, the warpage will be small.
【0025】また、上記実施の形態は、第一の基板11
aと第二の基板11bの2枚の基板を用いた実施の形態
を説明したが、用いる基板は2枚に限定するものではな
く、第1の基板11aの外側に、貫通して形成された基
板穴13を有する有機系の基板を、間にプリプレグ20
を挟んで積層するようにしてもよく、第2の基板11b
の外側に、有機系の基板を、間にプリプレグ20を挟ん
で積層するようにしてもよい。なおこの場合も、挟むプ
リプレグ20のうち少なくとも1枚に開口部21を有し
ていれば、いずれのプリプレグ20にも開口部21が無
い場合と比較して、反りが小さくなる。In the above embodiment, the first substrate 11
Although the embodiment using two substrates a and the second substrate 11b has been described, the number of substrates used is not limited to two, and the substrate is formed to penetrate outside the first substrate 11a. An organic substrate having a substrate hole 13 is placed between a prepreg 20
May be laminated with the second substrate 11b
An organic substrate may be laminated on the outside with the prepreg 20 interposed therebetween. Also in this case, if at least one of the sandwiched prepregs 20 has the opening 21, the warpage is smaller than in the case where none of the prepregs 20 has the opening 21.
【0026】本発明に用いる基板11a,11b・・
は、その中の少なくとも1枚には、間を樹脂硬化物15
で埋められた複数の導体パターン14を表面に有する有
機系の板であり、この間を樹脂硬化物15で埋められた
複数の導体パターン14を表面に有する有機系の板とし
ては、例えば、ガラス等の無機質繊維やポリエステル、
ポリアミド、木綿等の有機質繊維のクロス、ペーパー等
の基材を、熱硬化性樹脂で接着し、片面又は両面に金属
箔が張られている板や、熱硬化性樹脂単独のシートの片
面又は両面に金属箔が張られている板等を用いて、表面
の金属箔をエッチングして導体パターン14を形成した
後、導体パターン14間に熱硬化性樹脂を塗布し、次い
で、その熱硬化性樹脂を硬化させて、導体パターン14
間を樹脂硬化物15で埋めたもの、及び、金属箔が張ら
れていない同様の板に金属メッキを行い、導体パターン
14を形成した後、導体パターン14間に熱硬化性樹脂
を塗布し、次いで、その熱硬化性樹脂を硬化させて、導
体パターン14間を樹脂硬化物15で埋めたもの等が挙
げられる。The substrates 11a, 11b used in the present invention
Means that at least one of them has a resin cured product 15
An organic plate having on its surface a plurality of conductive patterns 14 buried with a resin, and an organic plate having on its surface a plurality of conductive patterns 14 buried with a cured resin 15 is, for example, glass or the like. Inorganic fiber and polyester,
Substrates of organic fiber cloth such as polyamide and cotton, paper and the like are bonded with a thermosetting resin and a metal foil is stretched on one or both sides, or one or both sides of a sheet of the thermosetting resin alone The surface of the metal foil is etched by using a plate or the like on which a metal foil is stretched to form a conductor pattern 14, and then a thermosetting resin is applied between the conductor patterns 14, and then the thermosetting resin is applied. To cure the conductor pattern 14
After filling the space with a cured resin material 15 and a similar plate on which a metal foil is not stretched, metal plating is performed to form a conductor pattern 14, and then a thermosetting resin is applied between the conductor patterns 14, Next, the thermosetting resin is cured to fill the space between the conductor patterns 14 with the cured resin 15.
【0027】なお、導体パターン14を表面に有さない
有機系の基板を用いる場合の基板としては、上記基材を
熱硬化性樹脂等で接着した板や、熱硬化性樹脂単独のシ
ート等が挙げられる。In the case where an organic substrate having no conductive pattern 14 on its surface is used, the substrate may be a plate obtained by bonding the above-mentioned base material with a thermosetting resin or the like, or a sheet of the thermosetting resin alone. No.
【0028】上記熱硬化性樹脂としては、エポキシ樹脂
系、フェノール樹脂系、ポリイミド樹脂系、不飽和ポリ
エステル樹脂系、ポリフェニレンエーテル樹脂系等の熱
硬化性樹脂や、これらの熱硬化性樹脂に無機充填材等を
配合した樹脂組成物が挙げられる。なお、基板11a,
11b・・に用いる熱硬化性樹脂と、導体パターン14
間を埋める樹脂硬化物15に用いる熱硬化性樹脂は、同
じでも良く、異なっていても良い。As the thermosetting resin, thermosetting resins such as epoxy resin type, phenolic resin type, polyimide resin type, unsaturated polyester resin type and polyphenylene ether resin type, and inorganic filling of these thermosetting resins. A resin composition containing a material and the like is included. The substrate 11a,
11b... And the conductive pattern 14
The thermosetting resin used for the cured resin 15 filling the space may be the same or different.
【0029】なお、本発明に用いる基板11a,11b
・・の内部には、導体パターンやその壁面に金属皮膜を
形成した穴等を有していてもよい。また、本発明に用い
る基板11a,11b・・のプリプレグ20と接しない
側の面には、金属層を有していても良く、有機系の絶縁
部が露出するようになっていても良い。なお、上記実施
の形態は、第一の基板11aに基板穴13を有する実施
の形態を説明したが、基板穴13は無くても良い。The substrates 11a and 11b used in the present invention
··· may have a conductor pattern or a hole formed by forming a metal film on the wall surface of the conductor pattern. Further, the surfaces of the substrates 11a, 11b,... Used in the present invention that are not in contact with the prepreg 20 may have a metal layer, and an organic insulating portion may be exposed. In the above embodiment, the embodiment in which the substrate hole 13 is provided in the first substrate 11a has been described, but the substrate hole 13 may not be provided.
【0030】なお、導体パターン14を形成する金属と
しては、電気的信頼性より銅又は銅の表面にニッケル皮
膜等の金属皮膜を形成したものが好ましい。The metal forming the conductive pattern 14 is preferably copper or a metal having a metal film such as a nickel film formed on the surface of copper from the viewpoint of electrical reliability.
【0031】本発明に用いるプリプレグ20としては、
ガラス等の無機質繊維やポリエステル、ポリアミド、木
綿等の有機質繊維のクロス、ペーパー等の基材に、上記
熱硬化性樹脂を含浸した後、半硬化させてシート状とし
たものが挙げられる。なお、プリプレグ20に用いる熱
硬化性樹脂は、基板11a,11b・・に用いる熱硬化
性樹脂や、導体パターン14間を埋める樹脂硬化物15
に用いる熱硬化性樹脂と、同じでも良く、異なっていて
も良い。また、プリプレグ20に開口部21を形成する
方法としては、ルーター加工や、金型打ち抜き等により
切断して形成する方法が挙げられる。The prepreg 20 used in the present invention includes:
Substrates of inorganic fibers such as glass, organic fibers such as polyester, polyamide and cotton, and substrates such as paper are impregnated with the above-mentioned thermosetting resin and then semi-cured to form a sheet. The thermosetting resin used for the prepreg 20 may be a thermosetting resin used for the substrates 11a, 11b,.
May be the same as or different from the thermosetting resin used for the resin. Examples of a method for forming the opening 21 in the prepreg 20 include a method of forming the opening 21 by cutting by router processing, die punching, or the like.
【0032】基板11a,11b・・とプリプレグ20
を積層した後、加熱・加圧する条件としては、プリプレ
グ20中の熱硬化性樹脂が硬化する条件で適宜調整して
加熱・加圧すればよいが、加圧の圧力があまり高いと得
られる積層板及びプリント配線板の反りが大きくなる傾
向があるため、基板11a,11b・・とプリプレグ2
0を一体化できる範囲内で、可能な限り低圧で加圧する
と好ましい。The substrates 11a, 11b... And the prepreg 20
After laminating, the heating and pressurizing conditions may be appropriately adjusted under the condition where the thermosetting resin in the prepreg 20 is cured, and the heating and pressurizing may be performed. Since the warpage of the board and the printed wiring board tends to increase, the prepreg 2 and the substrates 11a, 11b.
It is preferable to apply the pressure as low as possible within a range where 0 can be integrated.
【0033】[0033]
【発明の効果】本発明に係るプリント配線板の製造方法
は、基板の間に挟むプリプレグとして、基板が対向する
部分と対応する位置に、加熱・加圧して熱硬化性樹脂が
流動したときに、空洞部を形成する大きさの貫通した開
口部を有するプリプレグを用いるため、反りが小さいプ
リント配線板を得ることが可能となる。The method for manufacturing a printed wiring board according to the present invention is characterized in that a prepreg sandwiched between substrates is heated and pressurized at a position corresponding to a portion where the substrate is opposed to when the thermosetting resin flows. Since a prepreg having a penetrating opening having a size to form a cavity is used, a printed wiring board with small warpage can be obtained.
【図1】本発明に係るプリント配線板の製造方法の、一
実施の形態を示す図であり、(a)は積層を説明する斜
視図、(b)は積層を説明する断面図、(c)は加熱後
を説明する断面図である。FIG. 1 is a view showing one embodiment of a method for manufacturing a printed wiring board according to the present invention, wherein (a) is a perspective view illustrating lamination, (b) is a cross-sectional view illustrating lamination, and (c). () Is a cross-sectional view for explaining after heating.
【図2】本発明に係るプリント配線板の製造方法の、一
実施の形態を示す図であり、(a)は加熱前を説明する
平面図、(b)は加熱後を説明する平面方向に破断して
示した図である。FIGS. 2A and 2B are views showing one embodiment of a method for manufacturing a printed wiring board according to the present invention, wherein FIG. 2A is a plan view illustrating a state before heating, and FIG. FIG.
【図3】反りを説明する図である。FIG. 3 is a diagram illustrating warpage.
【図4】本発明に係るプリント配線板の製造方法の、一
実施の形態の変形例を示す平面図である。FIG. 4 is a plan view showing a modification of the embodiment of the method for manufacturing a printed wiring board according to the present invention.
【図5】従来のプリント配線板の製造方法を説明する工
程図である。FIG. 5 is a process chart illustrating a conventional method for manufacturing a printed wiring board.
【図6】従来の他のプリント配線板の製造方法の工程の
一部を説明する断面図である。FIG. 6 is a cross-sectional view illustrating a part of the steps of another conventional method for manufacturing a printed wiring board.
10 積層板 11a,11b,31a,31b 基板 12,32 金属層 13,33 基板穴 14,34,39 導体パターン 15,35 樹脂硬化物 17,37 凹部 20,40 プリプレグ 21 開口部 22,42 プリプレグ穴 23 熱硬化性樹脂 25 空洞部 33 基板穴 38 スルホールメッキ皮膜 39 導体パターン 45 熱硬化性樹脂 DESCRIPTION OF SYMBOLS 10 Laminated board 11a, 11b, 31a, 31b Substrate 12, 32 Metal layer 13, 33 Substrate hole 14, 34, 39 Conductive pattern 15, 35 Resin hardened material 17, 37 Depression 20, 40 Prepreg 21 Opening 22, 42 Prepreg hole 23 Thermosetting Resin 25 Cavity 33 Board Hole 38 Through Hole Plating Film 39 Conductor Pattern 45 Thermosetting Resin
フロントページの続き (72)発明者 高添 智樹 大阪府門真市大字門真1048番地松下電工株 式会社内Continued on front page (72) Inventor Tomoki Takazoe 1048 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd.
Claims (3)
プリプレグと、その中の少なくとも1枚には、間を樹脂
硬化物で埋められた複数の導体パターンを表面に有する
複数枚の有機系基板とを用いて、間を樹脂硬化物で埋め
られた導体パターンがプリプレグと接するように、基板
の間にプリプレグを挟んで積層した後、加熱・加圧して
製造するプリント配線板の製造方法において、基板の間
に挟むプリプレグが、その挟むプリプレグのうち少なく
とも1枚には、基板が対向する部分と対応する位置に、
加熱・加圧して熱硬化性樹脂が流動したときに、空洞部
を形成する大きさの貫通した開口部を有するプリプレグ
であることを特徴とするプリント配線板の製造方法。1. A prepreg in which a thermosetting resin is impregnated in a glass cloth, and at least one of the prepregs has a plurality of organic substrates having a plurality of conductive patterns filled with a cured resin on the surface. In the method for manufacturing a printed wiring board, a prepreg is sandwiched between substrates and laminated, and then heated and pressed, so that the conductive pattern filled with the cured resin is in contact with the prepreg. The prepreg sandwiched between the substrates has at least one of the sandwiched prepregs at a position corresponding to a portion where the substrate faces,
A method for manufacturing a printed wiring board, comprising: a prepreg having a penetrating opening having a size to form a cavity when a thermosetting resin flows under heat and pressure.
記開口部を有することを特徴とする請求項1記載のプリ
ント配線板の製造方法。2. The method according to claim 1, wherein all the prepregs sandwiched between the substrates have the opening.
グの全てのX方向及びY方向の断面に、上記開口部が露
出するように、開口部を配設したプリプレグであること
を特徴とする請求項1又は請求項2記載のプリント配線
板の製造方法。3. The prepreg sandwiched between the substrates is a prepreg provided with openings such that the openings are exposed in all cross sections of the prepreg in the X and Y directions. The method for producing a printed wiring board according to claim 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9105019A JPH10303553A (en) | 1997-04-22 | 1997-04-22 | Manufacture for printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9105019A JPH10303553A (en) | 1997-04-22 | 1997-04-22 | Manufacture for printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10303553A true JPH10303553A (en) | 1998-11-13 |
Family
ID=14396359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9105019A Pending JPH10303553A (en) | 1997-04-22 | 1997-04-22 | Manufacture for printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10303553A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151854A (en) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | Multilayer printed wiring board and manufacturing method therefor |
JP2006196832A (en) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | Multi layer wiring board |
JPWO2008146487A1 (en) * | 2007-05-29 | 2010-08-19 | パナソニック株式会社 | Circuit board and manufacturing method thereof |
CN106507595A (en) * | 2017-01-05 | 2017-03-15 | 深圳诚和电子实业有限公司 | There is the PCB warpage flatening method of separate lines and pad |
-
1997
- 1997-04-22 JP JP9105019A patent/JPH10303553A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151854A (en) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | Multilayer printed wiring board and manufacturing method therefor |
JP2006196832A (en) * | 2005-01-17 | 2006-07-27 | Kyocera Corp | Multi layer wiring board |
JP4606181B2 (en) * | 2005-01-17 | 2011-01-05 | 京セラ株式会社 | Multilayer wiring board |
JPWO2008146487A1 (en) * | 2007-05-29 | 2010-08-19 | パナソニック株式会社 | Circuit board and manufacturing method thereof |
US8446736B2 (en) | 2007-05-29 | 2013-05-21 | Panasonic Corporation | Circuit board and manufacturing method thereof |
CN106507595A (en) * | 2017-01-05 | 2017-03-15 | 深圳诚和电子实业有限公司 | There is the PCB warpage flatening method of separate lines and pad |
CN106507595B (en) * | 2017-01-05 | 2019-07-26 | 深圳诚和电子实业有限公司 | PCB warpage flatening method with separate lines and pad |
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