JPH06140475A - 超音波ワイヤボンディング装置 - Google Patents

超音波ワイヤボンディング装置

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Publication number
JPH06140475A
JPH06140475A JP4287344A JP28734492A JPH06140475A JP H06140475 A JPH06140475 A JP H06140475A JP 4287344 A JP4287344 A JP 4287344A JP 28734492 A JP28734492 A JP 28734492A JP H06140475 A JPH06140475 A JP H06140475A
Authority
JP
Japan
Prior art keywords
horn
ultrasonic
vertical
bonding device
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4287344A
Other languages
English (en)
Other versions
JP2812104B2 (ja
Inventor
Masataka Morita
真登 森田
Masaru Nagaike
勝 長池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP4287344A priority Critical patent/JP2812104B2/ja
Priority to KR1019930021663A priority patent/KR0139403B1/ko
Priority to US08/140,519 priority patent/US5326014A/en
Publication of JPH06140475A publication Critical patent/JPH06140475A/ja
Application granted granted Critical
Publication of JP2812104B2 publication Critical patent/JP2812104B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
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    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
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    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【目的】 リードワイヤをリードフレームにボンディン
グする装置において、ペアチップが損傷するためボンデ
ィング可能範囲を広げることが出来ないという問題を解
決するもので、超音波捻り振動子を取り付けた縦型ホー
ンを備えた超音波ワイヤボンディング装置提供すること
を目的とする。 【構成】 超音波捻り振動子７を、超音波捻り振動子７
の捻り中心線からオフセットして取り付けられたキャピ
ラリ２を有する縦型ホーン８に取り付けた構成とするこ
とで、ホーンとワークテーブルが干渉することがないた
め、ボンディング可能範囲を広げ、ホーンを縦型とした
ことで、ホーンのたわみが生じることがなくなるため、
ペアチップが損傷することのない高精度なボンディング
を行なうことが出来る。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明はキャピタリを超音波振動
させてワイヤボンディングを行なう超音波ワイヤボンデ
ィング装置に関するものである。
【０００２】
【従来の技術】従来の縦振動を用いた超音波ワイヤボン
ディング装置は図４に示すように、縦振動するホーン１
にキャピラリ２を垂直に固定し、ワークテーブル３に載
置したベアチップ４とリードフレーム５をリードワイヤ
６にキャピラリ２を微小圧で押圧し、ホーン１に縦振動
の超音波振動を与えながら、ベアチップ４とリードフレ
ーム５リードワイヤ６でボンディングする。
【０００３】
【発明が解決しようとする課題】しかしながら上記の従
来の構成ではホーン１とワークステーブル３が干渉する
ためボンディング可能なワークテーブル３のサイズが、
ホーン１の長さにより決定されている。このことから、
ボンディング可能範囲を広げるために、ホーンの長さを
長くすると、ホーンにたわみが生じ、ホーンに上下方向
の振動が発生し、ベアチップが損傷するためボンディン
グ可能範囲を広げることが出来ないという問題点を有し
ていた。
【０００４】本発明は上記従来の問題点を解決するもの
で、超音波捻り振動を取り付けた縦型ホーンを備えた超
音波ワイヤボンディング装置提供することを目的とす
る。
【０００５】
【課題を解決するための手段】超音波ワイヤボンディン
グ装置は、超音波捻り振動子の捻り中心線からオフセッ
トして取り付けられたキャピラリを有する縦型ホーンに
取り付けた構成を有している。
【０００６】
【作用】この構成によって、ホーンを縦置き構造とする
ことにより、ホーンとワークステーブルり干渉をなくし
てボンディング可能範囲を広げることが出来る。
【０００７】
【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。
【０００８】図１、２において、７は超音波捻り振動
子、８は縦形ホーン、９はキャピラリ２を支えるプレー
ト、１０はボンディングヘッド、１１はボンディングユ
ニットを移動するリニアロボット、１２は超音波ワイヤ
ボンディング装置、１３は縦形ホーンの捻り振動中心軸
からのオフセットである。
【０００９】以上のように構成された超音波ワイヤボン
ディング装置１２について、図１、２、３を用いてその
動作を説明する。まず、リニアロボット１１が移動する
ことにより、ボンディングヘッド１０が、ワークテーブ
ル３上のベアチップ４とリードフレーム５に縦形ホーン
８の捻れ中心軸からオフセット１３された位置にプレー
ト９により取り付けられたキャピラリ２を微小圧で押圧
し、縦形ホーン８にキャピラリ２がその周面上での振幅
ば約５μｍの超音波μ捻り振動を与えながら、ベアチッ
プ４とリードフレーム５をリードワイヤ６でボンディン
グする。
【００１０】縦形ホーン８の先端のプレートに取り付け
られたキャピラリ２の捻り中心軸からのオフセット１３
を変更することで、ホーンを交換することなしに振幅の
拡大率を容易に変更することができる。
【００１１】以上のように本実施例によれば、超音波捻
り振動子を、超音波捻り振動子の捻り中心軸からオフセ
ットして取り付けられたキャピラリを有する縦形ホーン
に取り付けた構成とすることで、ホーンとワークステー
ブルが干渉することがないため、ボンディング可能範囲
を広げることが出来る。また、ホーンを縦形としたこと
で、ホーンにたわみが生じることがなくなるため、ベア
チップが損傷することのない高精度なボンディングを行
なうことが出来る。
【００１２】キャピラリを縦形ホーン先端のプレートに
取り付ける構造としたことにより、キャピラリを取り付
けるプレートのオフセット量を変更することにより振動
の拡大率をホーンの変更することなしに行なうことがで
きる。
【００１３】
【発明の効果】以上のように本発明は、超音波捻り振動
子を、超音波捻り振動子の捻り中心線からオフセットし
て取り付けられたキャピラリを有する縦形ホーンに取り
付けた構成とすることで、ホーンとワークテーブルが干
渉することがないため、ボンディング可能範囲を広げ、
ベアチップが損傷することなく、高精度なボンディング
を行なうことが出来る優れた超音波ワイヤボンディング
装置を実現できるものである。
【図面の簡単な説明】
【図１】本発明の第一の実施例における超音波ワイヤボ
ンディング装置の構成図
【図２】第１の実施例における装置の動作説明のための
要部構成図
【図３】第１の実施例における振幅拡大率変更方法説明
のための要部構成図
【図４】従来の超音波ワイヤボンディング装置の構成図
【符号の説明】
１ ホーン ２ キャピラリ ３ ワークテーブル ４ ペアチップ ５ リードフレーム ６ リードワイヤ ７ 超音波捻り振動子 ８ 縦型ホーン ９ プレート １０ ボンディングヘッド １１ リニアロボット １２ 超音波ワイヤボンディング装置 １３ 捻り中心軸からのオフセット

Claims (3)

    【特許請求の範囲】
  1. 【請求項１】 リードワイヤをリードフレームにボンデ
    ィングする装置においてホーンを捻り振動させる超音波
    捻り振動振動子を有する縦型ホーンを備えた超音波ワイ
    ヤボンディング装置。
  2. 【請求項２】 キャピラリを超音波捻り振動子の捻り中
    心からオフセットさせた縦型ホーンを備えた超音波ワイ
    ヤボンディング装置。
  3. 【請求項３】 キャピラリを超音波捻り振動子の捻り中
    心からのオフセット量を簡単に変更することで、ホーン
    を交換することなしに振幅の拡大率を変更できる縦型ホ
    ーンを備えた超音波ワイヤボンディング装置。
JP4287344A 1992-10-26 1992-10-26 超音波ワイヤボンディング装置 Expired - Fee Related JP2812104B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP4287344A JP2812104B2 (ja) 1992-10-26 1992-10-26 超音波ワイヤボンディング装置
KR1019930021663A KR0139403B1 (ko) 1992-10-26 1993-10-19 초음파 와이어 본딩장치 및 본딩방법
US08/140,519 US5326014A (en) 1992-10-26 1993-10-25 Head of ultrasonic wire bonding apparatus and bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4287344A JP2812104B2 (ja) 1992-10-26 1992-10-26 超音波ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH06140475A true JPH06140475A (ja) 1994-05-20
JP2812104B2 JP2812104B2 (ja) 1998-10-22

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Country Status (3)

Country Link
US (1) US5326014A (ja)
JP (1) JP2812104B2 (ja)
KR (1) KR0139403B1 (ja)

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US5996877A (en) * 1996-12-19 1999-12-07 Texas Instruments Incorporated Stepwise autorotation of wire bonding capillary
US5782403A (en) * 1997-01-06 1998-07-21 International Business Machines Corporation Ultrasonic chip removal method and apparatus
US5930666A (en) * 1997-10-09 1999-07-27 Astralux, Incorporated Method and apparatus for packaging high temperature solid state electronic devices
JP3942738B2 (ja) 1998-07-17 2007-07-11 松下電器産業株式会社 バンプ接合装置及び方法、並びに半導体部品製造装置
JP3568496B2 (ja) 2001-07-06 2004-09-22 株式会社アルテクス 超音波ワイヤボンディング用共振器
US8407054B2 (en) 2007-05-08 2013-03-26 Nec Corporation Speech synthesis device, speech synthesis method, and speech synthesis program
WO2019210937A1 (de) * 2018-05-01 2019-11-07 Telsonic Holding Ag Verdrehschweisswerkzeug, verdrehschweissvorrichtung, verfahren zum verdrehschweissen und damit gefertigtes bauteil
WO2020039566A1 (ja) * 2018-08-23 2020-02-27 株式会社カイジョー ワイヤボンディング方法及びワイヤボンディング装置
CN111570992B (zh) * 2020-05-29 2021-11-12 永康市精进科技有限公司 一种用于超声波金属焊接机的焊头结构
DE102020124171A1 (de) 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Elektronisches Modul und Verfahren zum Verbinden von mehreren Leitern mit einem Substrat
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168142A (ja) * 1999-12-03 2001-06-22 Arutekusu:Kk 超音波振動接合用ツール

Also Published As

Publication number Publication date
KR940010178A (ko) 1994-05-24
KR0139403B1 (ko) 1998-07-15
US5326014A (en) 1994-07-05
JP2812104B2 (ja) 1998-10-22

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