JPH05206596A - Metal base printed circuit board - Google Patents
Metal base printed circuit boardInfo
- Publication number
- JPH05206596A JPH05206596A JP3402192A JP3402192A JPH05206596A JP H05206596 A JPH05206596 A JP H05206596A JP 3402192 A JP3402192 A JP 3402192A JP 3402192 A JP3402192 A JP 3402192A JP H05206596 A JPH05206596 A JP H05206596A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- metal plate
- sprayed
- printed circuit
- circuit conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属ベースプリント回
路基板に関し、特にベース金属板と回路導体との接続構
造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal base printed circuit board, and more particularly to a connection structure between a base metal plate and a circuit conductor.
【０００２】[0002]
【従来の技術】金属ベースプリント回路基板は、アルミ
ニウム、銅、鉄などの金属板をベースとし、その片面ま
た両面に、熱伝導性を改善した絶縁層を介して、１層ま
たは２層以上の回路導体を形成したもので、ベース金属
板の熱伝導性を利用してトランジスタ等の発熱の大きい
部品を実装した場合の放熱性を高めたものである。2. Description of the Related Art A metal-based printed circuit board is based on a metal plate made of aluminum, copper, iron or the like, and has one or more layers on one or both sides of which an insulating layer with improved thermal conductivity is provided. A circuit conductor is formed to improve the heat dissipation when a heat-generating component such as a transistor is mounted by utilizing the heat conductivity of the base metal plate.
【０００３】このような金属ベースプリント回路基板で
は、回路導体の一部をベース金属板に電気的に接続し
て、アース電位または特定の電位に保持することが多く
行われている。この場合の回路導体とベース金属板との
接続構造としては従来、図４ないし図７に示す種々の構
造が採用されている。図４ないし図７において、11は金
属ベースプリント回路基板を示しており、12はベース金
属板、13は絶縁層、14は銅箔のパターンエッチング等に
より形成した回路導体である。In such a metal-based printed circuit board, it is often practiced to electrically connect a part of the circuit conductor to the base metal plate to hold it at the ground potential or a specific potential. Conventionally, various structures shown in FIGS. 4 to 7 have been adopted as the connection structure between the circuit conductor and the base metal plate in this case. 4 to 7, reference numeral 11 denotes a metal base printed circuit board, 12 is a base metal plate, 13 is an insulating layer, and 14 is a circuit conductor formed by pattern etching of a copper foil or the like.
【０００４】回路導体14をベース金属板12にアース接続
するため、図４の構造は回路導体14からベース金属板12
に達するネジ穴を形成し、そこに金属製のネジ15をねじ
込んだものである。また図５の構造は回路導体14とベー
ス金属板12を金属製のクリップ15で挟みつけたものであ
る。また図６の構造は座ぐり加工によりベース金属板12
の一部を露出させ、その露出部12ａと回路導体14とを導
電ペーストまたはメッキ17により接続したものである。
また図７の構造は座ぐり加工によりベース金属板12の一
部を露出させ、その露出部12ａと回路導体14ａ上に設け
たボンディングパッド14ａとをボンディングワイヤー18
により接続したものである。Since the circuit conductor 14 is grounded to the base metal plate 12, the structure shown in FIG.
Is formed by forming a screw hole reaching up to and a metal screw 15 is screwed therein. In the structure of FIG. 5, the circuit conductor 14 and the base metal plate 12 are sandwiched by metal clips 15. In addition, the structure of FIG.
Is exposed, and the exposed portion 12a and the circuit conductor 14 are connected by a conductive paste or plating 17.
In the structure shown in FIG. 7, a part of the base metal plate 12 is exposed by spot facing, and the exposed portion 12a and the bonding pad 14a provided on the circuit conductor 14a are bonded by the bonding wire 18.
It is connected by.
【０００５】[0005]
【発明が解決しようとする課題】以上のような接続構造
では次のような問題がある。図４または図５の構造で
は、接続部品であるネジ15やクリップ16が比較的大きな
スペースを必要とするため配線の高密度化が困難であ
り、小型化の障害となっている。The connection structure as described above has the following problems. In the structure shown in FIG. 4 or 5, the screws 15 and the clips 16 which are connection parts require a relatively large space, so that it is difficult to increase the wiring density, which is an obstacle to miniaturization.
【０００６】図６の構造では、導電ペーストのスクリー
ン印刷やメッキレジストのパターン形成などを必要とす
るため、製造が面倒であり、また経時変化による導通信
頼性の点に問題があった。The structure of FIG. 6 requires screen printing of a conductive paste, pattern formation of a plating resist, etc., which is troublesome to manufacture and has a problem in terms of continuity reliability due to aging.
【０００７】図７の構造では、座ぐり面の平坦度や粗さ
が一定しないため、ワイヤーボンディング強度がばらつ
くことが多く、信頼性の点で問題が多かった。またワイ
ヤーボンディング工程は部品実装後に行われるため、ボ
ンディングマシンを所有していないユーザーでは実施不
可能である。In the structure of FIG. 7, since the flatness and roughness of the counterbore surface are not constant, the wire bonding strength often varies and there are many problems in terms of reliability. Further, since the wire bonding process is performed after the components are mounted, it cannot be performed by a user who does not have a bonding machine.
【０００８】[0008]
【課題を解決するための手段】本発明は、上記のような
課題を解決した金属ベースプリント回路基板を提供する
もので、その構成は、ベース金属板の少なくとも片面に
絶縁層を介して１層または２層以上の回路導体を形成し
てなる金属ベースプリント回路基板において、前記ベー
ス金属板と回路導体との接続箇所の絶縁層を除去してベ
ース金属板を露出させ、そのベース金属板の露出部とそ
こに接続すべき回路導体とを、その両者に跨がるように
溶射された溶射金属層により電気的に接続したことを特
徴とするものである。DISCLOSURE OF THE INVENTION The present invention provides a metal base printed circuit board which solves the above-mentioned problems, and has a structure of at least one surface of a base metal plate with an insulating layer interposed therebetween. Alternatively, in a metal-based printed circuit board having two or more layers of circuit conductors, the insulating layer at the connection between the base metal plate and the circuit conductor is removed to expose the base metal plate, and the base metal plate is exposed. It is characterized in that the part and the circuit conductor to be connected thereto are electrically connected by a sprayed metal layer sprayed so as to extend over both parts.
【０００９】本発明において、回路導体とベース金属板
とを接続するための溶射金属は、その種類を特に限定さ
れるものではないが、望ましくは回路導体やベース金属
板と同種のものがよい。例えば銅、アルミニウムなどで
ある。溶射した部分にエポキシ樹脂等で封止を施すとさ
らに接続部の信頼性が向上する。また接続箇所の絶縁層
を除去してベース金属板を露出させる加工としては、一
般的なエンドミルによるルーター加工や、金属加工用の
マシニングセンターによる加工を採用することができ
る。In the present invention, the kind of the sprayed metal for connecting the circuit conductor and the base metal plate is not particularly limited, but preferably the same kind as the circuit conductor and the base metal plate. Examples include copper and aluminum. If the sprayed portion is sealed with epoxy resin or the like, the reliability of the connection portion is further improved. Further, as the processing for removing the insulating layer at the connection portion to expose the base metal plate, a router processing by a general end mill or a processing by a machining center for metal processing can be adopted.
【００１０】[0010]
【作用】上記構成によると、従来、ネジ止めやクリップ
挟みで必要とした大きなパッドは不要となり、配線の高
密度化が可能となる。また導電ペーストのスクリーン印
刷や部分メッキによるものに比べ簡便であり、経時変化
による抵抗増加などがなく、導通信頼性が改善される。
さらにボンディングワイヤーの接続強度がほとんど得ら
れないような粗い露出面であっても溶射された金属によ
り回路導体とベース金属板との接続強度は十分保たれ、
信頼性の高い接続部が得られる。According to the above construction, the large pad conventionally required for screwing or clipping the clip becomes unnecessary, and the wiring density can be increased. Further, it is simpler than the one using screen printing or partial plating of the conductive paste, and resistance increase due to aging does not occur, and conduction reliability is improved.
Furthermore, the connection strength between the circuit conductor and the base metal plate is sufficiently maintained by the metal sprayed even on the rough exposed surface where the connection strength of the bonding wire is hardly obtained,
A reliable connection can be obtained.
【００１１】[0011]
【実施例】以下、本発明の実施例を図面を参照して詳細
に説明する。図１は本発明の一実施例を示す。この金属
ベースプリント回路基板11は、ベース金属板12の片面に
絶縁層13を介して回路導体14を１層形成したものにおい
て、回路導体14をベース金属板12に接続する箇所の絶縁
層13を座ぐり加工等により除去してベース金属板12を露
出させ、そのベース金属板の露出部12ａと接続すべき回
路導体14とを、その両者に跨がるように溶射された溶射
金属層21により電気的に接続したものである。Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows an embodiment of the present invention. This metal base printed circuit board 11 is one in which one layer of the circuit conductor 14 is formed on one surface of the base metal plate 12 with the insulating layer 13 interposed therebetween, and the insulating layer 13 at the location where the circuit conductor 14 is connected to the base metal plate 12 is provided. The base metal plate 12 is exposed by removing it by counter boring, etc., and the exposed portion 12a of the base metal plate and the circuit conductor 14 to be connected are sprayed by the sprayed metal layer 21 so as to extend over both of them. It is electrically connected.
【００１２】次に上記金属ベースプリント回路基板11の
製造方法を図２（Ａ）〜（Ｃ）を参照して具体的に説明
する。まず（Ａ）に示すように、ベース金属板12として
厚さ2.0 mmの銅板を使用し、その片面に厚さ120 μm の
絶縁層13を介して厚さ35μmの銅箔を積層接着し、その
銅箔をパターンエッチングして回路導体14を形成する。Next, a method of manufacturing the metal-based printed circuit board 11 will be specifically described with reference to FIGS. First, as shown in (A), a copper plate having a thickness of 2.0 mm is used as the base metal plate 12, and a copper foil having a thickness of 35 μm is laminated and adhered on one side of the insulating foil 13 having a thickness of 120 μm. The copper foil is pattern-etched to form the circuit conductor 14.
【００１３】次に（Ｂ）に示すように、回路導体14と銅
板12を接続すべき箇所に座ぐり加工を行い、銅板12の露
出部12ａを形成する。この座ぐり加工は、例えばユニオ
ンツール株式会社製の半月カッターＳＭ 2.0mmφを使用
し、ＮＣボール盤にて行うことができる。Next, as shown in FIG. 3B, a counterbore is formed at a place where the circuit conductor 14 and the copper plate 12 are to be connected to each other to form an exposed portion 12a of the copper plate 12. This counterbore processing can be performed with an NC drilling machine using a half-moon cutter SM 2.0 mmφ manufactured by Union Tool Co., Ltd., for example.
【００１４】次に（Ｃ）に示すように、銅板の露出部12
ａに対応する位置に 2.5mmφの穴22をあけたステンレス
マスク23を所定の位置にセットした後、溶射ガン24より
銅を溶射して溶射金属層21を形成する。溶射ガン24は銅
線25を溶融させて溶融銅微粒子を噴射するもので、試作
では加藤メタリコン株式会社製のものを使用した。Next, as shown in (C), the exposed portion 12 of the copper plate
After setting a stainless mask 23 having a hole 22 of 2.5 mmφ at a position corresponding to a at a predetermined position, copper is sprayed from a spray gun 24 to form a sprayed metal layer 21. The thermal spray gun 24 is one for melting the copper wire 25 and injecting molten copper fine particles, and a prototype manufactured by Kato Metallikon Co., Ltd. was used.
【００１５】溶射金属層21の厚さは60μm 程度とした
が、接続部の導体抵抗は20ｍΩであり、十分な電気導通
性を示した。また溶射金属層21の表面にエポキシ接着剤
を被覆したものについて、85℃、85％Ｒ. Ｈ. （相対湿
度）の雰囲気中に 500時間放置した後の接続部の導体抵
抗を測定したところ初期値に比べ５％以内の変動率であ
り、高い接続信頼性を示した。Although the thickness of the sprayed metal layer 21 was set to about 60 μm, the conductor resistance of the connection portion was 20 mΩ, which showed sufficient electrical conductivity. In addition, when the surface of the sprayed metal layer 21 was coated with an epoxy adhesive, the conductor resistance of the connection part was measured after leaving it in an atmosphere of 85 ° C. and 85% RH (relative humidity) for 500 hours. The fluctuation rate was within 5% of the value, indicating high connection reliability.
【００１６】また、ベース金属板としてアルミニウム板
を使用し、銅箔を回路導体としたアルミニウムベースプ
リント回路基板についても、上記と同じ方法で座ぐり加
工および銅の溶射を行った結果、同等の特性を得ること
ができた。An aluminum-based printed circuit board using an aluminum plate as a base metal plate and a copper foil as a circuit conductor was also spot-machined and sprayed with copper in the same manner as above, and as a result, the same characteristics were obtained. I was able to get
【００１７】図３は本発明の他の実施例を示す。この金
属ベースプリント回路基板11は、ベース金属板12の片面
に絶縁層13を介して回路導体14を２層に形成したもの
で、それ以外の構成は図１の実施例と同様であるので、
同一部分には同一符号を付して説明を省略する。FIG. 3 shows another embodiment of the present invention. This metal base printed circuit board 11 is one in which two layers of circuit conductors 14 are formed on one surface of a base metal plate 12 with an insulating layer 13 interposed therebetween, and the other structure is the same as that of the embodiment of FIG.
The same parts are designated by the same reference numerals and the description thereof will be omitted.
【００１８】[0018]
【発明の効果】以上説明したように本発明によれば、金
属ベースプリント回路基板の回路導体とベース金属板と
を溶射金属層により接続したので、接続のために広いス
ペースを必要とせず、配線密度を高めることができ、電
子機器の小型化に有効である。またスクリーン印刷やメ
ッキなどの複雑かつ面倒でコスト高の要因となる工程を
必要としないため、製造がきわめて容易である。さらに
ワイヤーボンディングの場合に要求されていた座ぐり面
の粗度の厳重な管理を必要とせずに信頼性の高い接続状
態を得ることができる。As described above, according to the present invention, since the circuit conductor of the metal base printed circuit board and the base metal plate are connected by the sprayed metal layer, a wide space is not required for the connection, and the wiring is provided. The density can be increased, which is effective for downsizing electronic devices. Further, since complicated and troublesome and costly steps such as screen printing and plating are not required, the manufacturing is extremely easy. Further, it is possible to obtain a highly reliable connection state without requiring strict control of the roughness of the counterbore surface, which is required in the case of wire bonding.
【図１】 本発明の一実施例に係る金属ベースプリント
回路基板の断面図。FIG. 1 is a sectional view of a metal-based printed circuit board according to an embodiment of the present invention.
【図２】 （Ａ）〜（Ｃ）は図１の金属ベースプリント
回路基板の製造方法を工程順に示す断面図。2A to 2C are cross-sectional views showing a method of manufacturing the metal-based printed circuit board of FIG. 1 in the order of steps.
【図３】 本発明の他の実施例に係る金属ベースプリン
ト回路基板の断面図。FIG. 3 is a sectional view of a metal-based printed circuit board according to another embodiment of the present invention.
【図４】 従来の金属ベースプリント回路基板の一例を
示す断面図。FIG. 4 is a sectional view showing an example of a conventional metal-based printed circuit board.
【図５】 従来の金属ベースプリント回路基板の他の例
を示す断面図。FIG. 5 is a sectional view showing another example of a conventional metal-based printed circuit board.
【図６】 従来の金属ベースプリント回路基板のさらに
他の例を示す断面図。FIG. 6 is a sectional view showing still another example of a conventional metal-based printed circuit board.
【図７】 従来の金属ベースプリント回路基板のさらに
他の例を示す断面図。FIG. 7 is a sectional view showing still another example of a conventional metal-based printed circuit board.
11：金属ベースプリント回路基板 12：
ベース金属板 12ａ：ベース金属板の露出部 13：
絶縁層 14：回路導体 21：
溶射金属層11: Metal base printed circuit board 12:
Base metal plate 12a: Exposed part of base metal plate 13:
Insulation layer 14: Circuit conductor 21:
Sprayed metal layer
Claims (1)
介して１層または２層以上の回路導体を形成してなる金
属ベースプリント回路基板において、前記ベース金属板
と回路導体との接続箇所の絶縁層を除去してベース金属
板を露出させ、そのベース金属板の露出部とそこに接続
すべき回路導体とを、その両者に跨がるように溶射され
た溶射金属層により電気的に接続したことを特徴とする
金属ベースプリント回路基板。1. A metal base printed circuit board comprising one or more circuit conductors formed on at least one surface of a base metal plate with an insulating layer interposed between the base metal plate and the circuit conductor. The base metal plate is exposed by removing the insulating layer, and the exposed portion of the base metal plate and the circuit conductor to be connected thereto are electrically connected by a sprayed metal layer sprayed across both of them. A metal-based printed circuit board characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3402192A JPH05206596A (en) | 1992-01-27 | 1992-01-27 | Metal base printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3402192A JPH05206596A (en) | 1992-01-27 | 1992-01-27 | Metal base printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05206596A true JPH05206596A (en) | 1993-08-13 |
Family
ID=12402729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3402192A Pending JPH05206596A (en) | 1992-01-27 | 1992-01-27 | Metal base printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05206596A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10153482A1 (en) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Method for treating an electrical strip conductor on a foil wire applies a coating with thermal gun/flame spraying to a locally defined surface area on a conductor surface |
| JP2008198964A (en) * | 2007-01-19 | 2008-08-28 | Sumitomo Electric Ind Ltd | Printed wiring board and method for manufacturing the same |
| US7927499B2 (en) | 2006-08-18 | 2011-04-19 | Advanced Semiconductor Engineering, Inc. | Substrate having blind hole and method for forming blind hole |
| DE102011089927A1 (en) * | 2011-12-27 | 2013-06-27 | Robert Bosch Gmbh | Contact system with a connection means and method |
| US9706638B2 (en) | 2009-09-29 | 2017-07-11 | Astec International Limited | Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets |
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
-
1992
- 1992-01-27 JP JP3402192A patent/JPH05206596A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10153482A1 (en) * | 2001-10-30 | 2003-05-22 | Leoni Ag | Method for treating an electrical strip conductor on a foil wire applies a coating with thermal gun/flame spraying to a locally defined surface area on a conductor surface |
| US7927499B2 (en) | 2006-08-18 | 2011-04-19 | Advanced Semiconductor Engineering, Inc. | Substrate having blind hole and method for forming blind hole |
| JP2008198964A (en) * | 2007-01-19 | 2008-08-28 | Sumitomo Electric Ind Ltd | Printed wiring board and method for manufacturing the same |
| US8866027B2 (en) | 2007-01-19 | 2014-10-21 | Sumitomo Electric Industries, Ltd. | Printed wiring board and method for manufacturing the same |
| US9706638B2 (en) | 2009-09-29 | 2017-07-11 | Astec International Limited | Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets |
| DE102011089927A1 (en) * | 2011-12-27 | 2013-06-27 | Robert Bosch Gmbh | Contact system with a connection means and method |
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
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