JPH0552668A - Brazing material for platinum resistance body type temperature sensor - Google Patents
Brazing material for platinum resistance body type temperature sensorInfo
- Publication number
- JPH0552668A JPH0552668A JP3240475A JP24047591A JPH0552668A JP H0552668 A JPH0552668 A JP H0552668A JP 3240475 A JP3240475 A JP 3240475A JP 24047591 A JP24047591 A JP 24047591A JP H0552668 A JPH0552668 A JP H0552668A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- brazing material
- brazing
- temperature sensor
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、白金抵抗体式温度セン
サ用ロー付材料に関し、更に詳しく言えば、ロー付材料
に一定量のＴｉを含有させることにより、主にリード取
出部とセラミック基板間の剥離防止が図れる白金抵抗体
式温度センサ用ロー付材料に関するものである。本発明
は高温用温度センサ、酸素センサ及びセラミックヒータ
等に広く利用される。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing material for a platinum resistance type temperature sensor, and more specifically, by incorporating a certain amount of Ti into the brazing material, mainly between the lead extraction portion and the ceramic substrate. The present invention relates to a brazing material for a platinum resistance type temperature sensor capable of preventing peeling. The present invention is widely used for high temperature sensors, oxygen sensors, ceramic heaters and the like.
【０００２】[0002]
【従来の技術】白金は、化学的に安定で、しかも電気抵
抗の温度依存性が大きいので、温度センサ材料に用いら
れる。かかる白金を用いた温度センサーとしては、アル
ミナ基板に厚膜白金抵抗パターンを形成し、このパター
ン端部にリード取出部を設け、該リード取出部にリード
線がロー付材料を用いて接合されたものが知られている
（特開昭６４−６５４２６号公報、特開平１−４３８９
４号公報等）。この白金温度センサ用ロー材料として
は、「ＢＡｇ−４」銀ロー、「ＢＡｕ−１」金ロー等
が、従来より用いられている。そして、これら従来のロ
ー付材料の成分は、リード取出部及びリード線との接合
性を強固にすべく選択されたものであり、これらのロー
付材料を介してリード取出部とリード線は強固に結合す
ることとなる。2. Description of the Related Art Platinum is used as a temperature sensor material because it is chemically stable and its electric resistance greatly depends on temperature. As a temperature sensor using such platinum, a thick film platinum resistance pattern is formed on an alumina substrate, a lead lead-out portion is provided at an end portion of the pattern, and a lead wire is joined to the lead lead-out portion by using a brazing material. Some are known (Japanese Patent Laid-Open No. 64-65426, Japanese Patent Laid-Open No. 1-4389).
No. 4, etc.). As the raw material for the platinum temperature sensor, "BAg-4" silver raw, "BAu-1" gold raw, etc. have been conventionally used. The components of these conventional brazing materials are selected so as to strengthen the bondability between the lead take-out portion and the lead wire, and the lead take-out portion and the lead wire are strongly bonded through these brazing materials. Will be combined with.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記従来のロ
ー付材料を用いた場合リード取出部（白金）とセラミッ
ク基板（アルミナ基板等）間の接合性は、上記リード取
出部とリード線間の接合性ほど強固ではない。また、こ
れを加え、ロー付後の冷却時のリード取出部とセラミッ
ク基板の収縮量の相違から、両者の接合面においてはリ
ード取出部側とセラミック基板側の歪みに差を生ずるこ
とがある。従って、前記従来のロー付材料を使用する場
合には、リード取出部とセラミック基板間で剥離が生じ
易いこととなる。However, when the above conventional brazing material is used, the bondability between the lead lead-out portion (platinum) and the ceramic substrate (alumina substrate, etc.) is Not as strong as bondability. In addition, in addition, due to the difference in shrinkage amount between the lead take-out portion and the ceramic substrate during cooling after brazing, a difference may occur in the distortion between the lead take-out portion side and the ceramic substrate side at the joint surface between them. Therefore, when the conventional brazing material is used, peeling easily occurs between the lead take-out portion and the ceramic substrate.
【０００４】本発明は、上記問題点を解決するものであ
り、リード取出部とセラミック基板間の接合性を強固に
することにより、当該部分に於ける冷却時の剥離を防止
できる白金抵抗式温度センサ用ロー付材料を提供するこ
とを目的とする。The present invention solves the above-mentioned problems, and by strengthening the bondability between the lead extraction portion and the ceramic substrate, a platinum resistance type temperature which can prevent peeling at the portion at the time of cooling. An object is to provide a brazing material for a sensor.
【０００５】[0005]
【課題を解決するための手段】本発明者らは、白金抵抗
式温度センサ用ロー付材料について、冷却時の剥離の防
止について種々検討した結果、ロー付材料に一定量のＴ
ｉを含有させることにより、この欠点が解消されること
を見出して、本発明を完成するに至ったのである。即
ち、本発明の白金抵抗式温度センサ用ロー付材料は、セ
ラミック基板と該セラミック基板上に形成され、Ｐｔ、
Ｗ及びＭｏのうちの少なくとも１つを含むリード取出部
を有する厚膜抵抗層と該リード取出部と接合される接続
端子部とを備える白金抵抗体式温度センサの該リード取
出部と該接続端子部を接合するためのロー付材料におい
て、該ロー付材料は、Ａｇを主成分とするＡｇロー素材
料、Ａｕロー素材料又はＰｄロー素材料の各素材料にＴ
ｉを含み、該Ｔｉの含有量が、該各素材料とＴｉの合計
を１００重量部とする場合、０．５〜３重量部であるこ
とを特徴とする。上記のように、ロー付材料中にＴｉを
含有させるのは、ＴｉがＡｌ2 Ｏ3 及びＰｔとの反応性
に優れるため、ロー付材料とリード取出部及びリード線
との接合性のみならず、セラミック基板との接合性をも
を強固にすることができるためである。また、このＴｉ
の含有量をロー素材料とＴｉの合計を１００重量部とす
る場合に０．５〜３重量部とするのは、０．５重量部以
下の場合にはセラミック基板との接合性の向上をそれ程
期待できず、一方３重量部を超えるとセラミックスとの
接合強度が却って低下するからである。As a result of various studies on the brazing material for a platinum resistance type temperature sensor to prevent peeling during cooling, the present inventors have found that a certain amount of T
The inventors have found that this defect can be eliminated by incorporating i, and have completed the present invention. That is, the brazing material for a platinum resistance temperature sensor of the present invention is formed on a ceramic substrate and the ceramic substrate, and Pt,
The lead lead-out portion and the connecting terminal portion of the platinum resistance temperature sensor including a thick film resistance layer having a lead lead-out portion containing at least one of W and Mo, and a connecting terminal portion joined to the lead lead-out portion In the brazing material for joining the brazing material, the brazing material is a Ag-based raw material, an Au-based brazing material, or a Pd-based brazing material containing Ag as a main component.
i is included, and the content of Ti is 0.5 to 3 parts by weight when the total amount of the respective raw materials and Ti is 100 parts by weight. As described above, when Ti is contained in the brazing material, Ti is excellent in reactivity with Al 2 O 3 and Pt, so that not only the bondability between the brazing material and the lead extraction portion and the lead wire This is because it is possible to strengthen the bondability with the ceramic substrate. Also, this Ti
The content of 0.5 to 3 parts by weight when the total amount of the rhodium material and Ti is 100 parts by weight is to improve the bondability with the ceramic substrate when it is 0.5 parts by weight or less. This is because it cannot be expected that much, and when it exceeds 3 parts by weight, the bonding strength with ceramics is rather lowered.
【０００６】[0006]
【作用】従来の「ＢＡｇ−４」銀ロー、「ＢＡｕ−１」
金ロー等に代表されるロー材料５をそのまま用いた場合
には、材質の同質性より当該ロー材料５はリード取出部
３及びリード線４と強固に接合し、この結果、当該ロー
材料５を介してリード取出部３とリード線４が強固に結
合することとなる。しかし、これに比べれば、リード取
出部３とセラミック基板１間の接合性は、強固とはいえ
ない。また、一般に、ロー付後の冷却時には、リード取
出部３とセラミック基板１の収縮量は相違するため、両
者の接合面においては歪みが不連続となる。そして、こ
の接合性の弱さと歪みの不連続さ等により、図３に示す
ようなリード取出部３とセラミック基板４間の剥離が生
じ易いこととなる。これを解消する方法としては、例え
ば、リード線４とロー付部のリード取出部の面積を十分
にとり、リード取出部３とセラミック基板１間の接合性
の十分に確保することも考えられる。しかし、この方法
では、白金の使用量が増大し、コスト高を伴うこととな
る。[Function] Conventional "BAg-4" silver low, "BAu-1"
When the raw material 5 typified by gold brazing is used as it is, the raw material 5 is firmly bonded to the lead extraction portion 3 and the lead wire 4 due to the homogeneity of the material, and as a result, the raw material 5 is Through this, the lead take-out portion 3 and the lead wire 4 are firmly coupled. However, as compared with this, the bondability between the lead extraction portion 3 and the ceramic substrate 1 cannot be said to be strong. Further, generally, at the time of cooling after brazing, the lead take-out portion 3 and the ceramic substrate 1 have different shrinkage amounts, so that the discontinuity occurs at the joint surface between the two. Then, due to the weak bondability, discontinuity of strain, and the like, peeling between the lead extraction portion 3 and the ceramic substrate 4 as shown in FIG. 3 is likely to occur. As a method of solving this, for example, it is considered that the lead wire 4 and the lead extraction portion of the brazed portion are made to have a sufficient area and the bondability between the lead extraction portion 3 and the ceramic substrate 1 is sufficiently ensured. However, in this method, the amount of platinum is increased, and thus involve costly.
【０００７】一方、本発明のロー付材料には、セラミッ
クとの反応性のよいＴｉが含まれている為、図２に示す
様に、たとえセラミック基板上の導電パターンが小さく
ても、それをカバーするようにロー材料を配置すること
により、ロー材料が直接セラミック面と結合する。即
ち、ロー付材料が直接セラミックと反応するためロー付
強度の向上を図ることができ、これ加えてロー付部のリ
ード取出部の面積を小さくし白金の使用量を減少させコ
ストの軽減を図ることもできる。On the other hand, since the brazing material of the present invention contains Ti, which has a good reactivity with ceramics, even if the conductive pattern on the ceramic substrate is small as shown in FIG. By placing the brazing material over the cover, the brazing material is bonded directly to the ceramic surface. That is, since the brazing material reacts directly with the ceramic, the brazing strength can be improved. In addition, the area of the lead extraction portion of the brazing portion can be reduced to reduce the amount of platinum used and reduce the cost. You can also
【０００８】[0008]
【実施例】以下、実施例により本発明を具体的に説明す
る。 （１）試験品の作製 本実施例にて用いたセラミック配線基板は以下のように
製造された。先ず、アルミナ９２％、他成分としてＭｇ
Ｏ、ＳｉＯ2 、ＣａＯを含むグリーンシート（０．８ｍ
ｍ）上に白金ペースト（白金ブラック２：白金スポンジ
１、他にセラミックス材料としてブチルカルビドール、
有機バインダーを含む）を印刷して、図１に示すパター
ン２とのこのパターン端部に設けられたリード取出部３
ａ、３ｂを形成した。次に、中性又は酸化雰囲気中にて
電気炉に入れ、３５０℃で２４時間、加熱して樹脂抜き
をした後、１６００℃で２時間の焼成を中性又は酸化雰
囲気中にて行った。尚、焼成後の白金パターン膜２及び
リード取出３ａ、３ｂの膜厚は１５μｍであり、白金パ
ターン膜２の幅は０．２５ｍｍ、リード取出部３の幅は
表１に示す０．２５ｍｍ（Ｎｏ．４、８、１２）又は１
ｍｍ（他Ｎｏ．）である。EXAMPLES The present invention will be specifically described below with reference to examples. (1) Preparation of test product The ceramic wiring board used in this example was manufactured as follows. First, 92% alumina and Mg as another component
Green sheet containing O, SiO 2 , CaO (0.8m
m) on top of platinum paste (platinum black 2: platinum sponge 1, but also butyl carbidol as a ceramic material,
(Including organic binder) is printed, and the lead take-out portion 3 provided at the end of this pattern 2 and the pattern 2 shown in FIG.
a and 3b were formed. Next, the resin was placed in an electric furnace in a neutral or oxidizing atmosphere, heated at 350 ° C. for 24 hours to remove the resin, and then fired at 1600 ° C. for 2 hours in a neutral or oxidizing atmosphere. The film thickness of the platinum pattern film 2 and the leads 3a and 3b after firing was 15 μm, the width of the platinum pattern film 2 was 0.25 mm, and the width of the leads extraction part 3 was 0.25 mm shown in Table 1 (No. .4, 8, 12) or 1
mm (other No.).
【０００９】[0009]
【表１】 [Table 1]
【００１０】その後銀ロー（ＢＡｇ−４）９９．８重量
部に、Ｔｉを０．２重量部の割合にて添加したロー付材
料（全体を１００重量部とする。）を用意し、これを用
いてロー付けを行い、Ｎｏ．１〜４の試験品を作製し
た。同様に、それぞれ、０．５重量部の割合にてＴｉを
含有しているロー付材料を用いてＮｏ．５〜８の試験品
を、３重量部の割合にてＴｉを含有しているロー付材料
を用いてＮｏ．９〜１２の試験品を、５重量部の割合に
てＴｉを含有しているロー付材料を用いてＮｏ．１３〜
１５の試験品を作製した。Then, a brazing material (total 100 parts by weight) was prepared by adding 0.2 part by weight of Ti to 99.8 parts by weight of silver braze (BAg-4), and this was prepared. Brazing is performed using No. Test samples 1 to 4 were prepared. Similarly, the brazing material containing Ti in an amount of 0.5 parts by weight was used respectively. No. 5 to No. 8 test pieces were prepared using a brazing material containing Ti in an amount of 3 parts by weight. Nos. 9 to 12 were tested using brazing material containing Ti in an amount of 5 parts by weight. 13-
Fifteen test products were prepared.
【００１１】ここで、上記ロー付けは、カーボン材料か
らなる治具の一方の型中の所定の溝中にリード線の先端
を挿入するとともにこの接合位置にロー材料を配置し、
次いで、セラミック基板を配置し、更に他方の型を合わ
せ、一体物としてこれを加熱することによって行った。
尚、ここで用いたリード線は、高さ（直径）が０．６ｍ
ｍφのものである。次いで、以上のように作製した各試
験片を水中に入れ超音波により洗浄した。この超音波洗
浄条件は、シャープ株式会社製のＳＨＡＲＰ ＵＴ−３
０４型洗浄器を用いて強弱レベル７目盛で１５分間洗浄
した。Here, the brazing is performed by inserting the tip of the lead wire into a predetermined groove in one mold of a jig made of a carbon material and arranging the brazing material at this joining position.
Then, the ceramic substrate was arranged, the other mold was matched, and this was heated as an integral body.
The lead wire used here had a height (diameter) of 0.6 m.
mφ. Next, each test piece prepared as described above was put in water and washed by ultrasonic waves. This ultrasonic cleaning condition is SHARP UT-3 manufactured by Sharp Corporation.
It was washed for 15 minutes on a level 7 scale using a 04 type washer.
【００１２】（２）性能試験と評価 本実施例に於ける性能試験は、洗浄時にリード取出部
とセラミック基板の剥離（以下、「洗浄時剥離」とい
う。）を生じたか否か、洗浄時剥離が無い場合には、
洗浄後にリード線を１ｋｇｆの力で、リード線を９０°
曲げて基板に対して垂直方向に引っ張り、リード取出部
とセラミック基板の剥離（以下、「引っ張り剥離」とい
う。）を生じたか否かを評価することにより行った。こ
の結果を表１に示す。ここで、同表中の表示の意味は、
以下の通りである。 ×；洗浄時剥離あり、△；引っ張り剥離あり、○；剥離
なし(2) Performance Test and Evaluation The performance test in the present embodiment was conducted to determine whether or not peeling between the lead extraction portion and the ceramic substrate (hereinafter referred to as “peeling at washing”) occurred at the time of washing. If there is no
After cleaning the lead wire with a force of 1 kgf, the lead wire 90 °
It was bent and pulled in the direction perpendicular to the substrate to evaluate whether or not peeling between the lead extraction portion and the ceramic substrate (hereinafter referred to as “pull peeling”) occurred. The results are shown in Table 1. Here, the meaning of the display in the table is
It is as follows. X: peeling during cleaning, △: pulling peeling, ○: no peeling
【００１３】この結果によれば、先ず、試験品Ｎｏ．１
〜２、４及び１５においては洗浄時剥離が、試験品Ｎ
ｏ．３、１３及び１４では引っ張り剥離を生じ、これら
の試験品（比較品）では、リード取出部とセラミック基
板間の接合性がそれほど強固でないことがわかる。これ
に対して、試験品Ｎｏ．４〜９の試験品（実施品）にお
いては、洗浄時剥離も、引っ張り剥離も一切生ぜず、リ
ード取出部とセラミック基板間の接合性が強固であるこ
とがわかる。特に、リード取出部の幅が白金パターン膜
と同じ０．２５ｍｍと狭い場合においても、Ｔｉ含有量
が０．５重量部（Ｎｏ．８）、３重量部（Ｎｏ．１２）
の時は、剥離もなく良好な接着性を示した。According to this result, first, the test product No. 1
In Nos. 2, 4, and 15, peeling during cleaning is caused by the test product N.
o. Nos. 3, 13 and 14 were peeled off by pulling, and it can be seen that in these test products (comparative products), the bondability between the lead extraction part and the ceramic substrate was not so strong. On the other hand, the test product No. It can be seen that in the test products of 4 to 9 (implemented products), neither peeling at the time of cleaning nor peeling by pulling occurred, and the bondability between the lead extraction part and the ceramic substrate was strong. In particular, even when the width of the lead extraction portion is as narrow as 0.25 mm as the platinum pattern film, the Ti content is 0.5 parts by weight (No. 8) and 3 parts by weight (No. 12).
At that time, good adhesion was exhibited without peeling.
【００１４】また、所定量のＴｉを含むロー付材料を使
用することにより、接合強度が上昇すると共に熱間の強
度、冷熱のサイクルに対する強度も高くなる為、従来の
ように、ロー付部を高温部（発熱部）から離すために、
長いセラミック基板に導電パターンを形成する必要がな
くなった。これにより、基板、ペースト材の節約が可能
となった。Further, by using the brazing material containing a predetermined amount of Ti, the joint strength is increased, and the strength between hot and cold cycles is also increased. In order to keep away from the high temperature part (heat generating part),
It is no longer necessary to form conductive patterns on long ceramic substrates. This made it possible to save the substrate and paste material.
【００１５】尚、本発明においては、前記具体的実施例
に示すものに限られず、目的、用途に応じて本発明の範
囲内で種々変更した実施例とすることができる。即ち、
本実施例では、Ａｇを主成分とするロー付材料を用いた
が、Ａｕ又はＰｄを主成分とするロー付材料を用いても
よい。また、セラミック基板上に形成する厚膜抵抗層
は、Ｐｔの他にＷ、Ｍｏを含むものでも、Ｐｔに代わり
Ｗ又はＭｏを含むものでもよい。更に、リード取出部、
リード線、セラミック基板の大きさ、形状等は、本発明
の目的を達成できる限りにおいて特に問わない。The present invention is not limited to the specific examples described above, and various modifications may be made within the scope of the present invention depending on the purpose and application. That is,
In this embodiment, the brazing material containing Ag as a main component is used, but a brazing material containing Au or Pd as a main component may be used. The thick film resistance layer formed on the ceramic substrate may contain W or Mo in addition to Pt, or may contain W or Mo instead of Pt. In addition, the lead extraction part,
The size and shape of the lead wire and the ceramic substrate are not particularly limited as long as the object of the present invention can be achieved.
【００１６】[0016]
【発明の効果】本発明の白金抵抗式温度センサ用ロー付
材料を用いれば、ロー材料がセラミックにも直接結合す
るため強度面に優れると共に、ロー付部のメタライズ面
積を小さくできるので白金の使用量を低く抑えることが
でき、低コスト化を図ることもできる。When the brazing material for a platinum resistance type temperature sensor of the present invention is used, the brazing material is also directly bonded to the ceramic, so that the strength is excellent and the metallized area of the brazing part can be made small. The amount can be kept low, and the cost can be reduced.
【図１】実施例における白金抵抗式温度センサのリード
取出の接合状態を示す全体斜視図である。FIG. 1 is an overall perspective view showing a joined state of leads taken out of a platinum resistance type temperature sensor in an example.
【図２】実施例における白金抵抗式温度センサのリード
取出の接合状態を示す断面説明図である。FIG. 2 is a cross-sectional explanatory view showing a joined state of leads taken out of the platinum resistance temperature sensor in the example.
【図３】従来のロー付材料を用いて接合した白金抵抗式
温度センサのリード取出の接合構造において、接合部分
の剥離の状態を示す断面説明図である。FIG. 3 is a cross-sectional explanatory view showing a peeled state of a bonding portion in a lead-out bonding structure of a platinum resistance temperature sensor bonded using a conventional brazing material.
１ セラミック基板 ２ 白金パターン ３ リード取出部 ４ リード線 ４１ 接続端子部 ５ ロー材料。 1 Ceramic substrate 2 Platinum pattern 3 Lead extraction part 4 Lead wire 41 Connection terminal part 5 Raw material.
Claims (1)
形成され、Ｐｔ、Ｗ及びＭｏのうちの少なくとも１つを
含むリード取出部を有する厚膜抵抗層と該リード取出部
と接合される接続端子部とを備える白金抵抗体式温度セ
ンサの該リード取出部と該接続端子部を接合するための
ロー（ろう）付材料において、 該ロー付材料は、Ａｇを主成分とするＡｇロー素材料、
Ａｕロー素材料又はＰｄロー素材料の各素材料にＴｉを
含み、該Ｔｉの含有量が、該各素材料とＴｉの合計を１
００重量部とする場合、０．５〜３重量部であることを
特徴とする白金抵抗体式温度センサ用ロー付材料。1. A ceramic substrate, a thick film resistance layer formed on the ceramic substrate and having a lead lead-out portion containing at least one of Pt, W and Mo, and a connection terminal portion joined to the lead lead-out portion. A brazing material for joining the lead lead-out part and the connection terminal part of a platinum resistance temperature sensor comprising: a brazing material containing Ag as a main component;
Each raw material of the Au raw material or the Pd raw material contains Ti, and the content of the Ti is the sum of the raw materials and Ti being 1
A brazing material for a platinum resistance temperature sensor, which is 0.5 to 3 parts by weight when the amount is 00 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3240475A JP3070993B2 (en) | 1991-08-27 | 1991-08-27 | Brazing material for platinum resistor type temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3240475A JP3070993B2 (en) | 1991-08-27 | 1991-08-27 | Brazing material for platinum resistor type temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0552668A true JPH0552668A (en) | 1993-03-02 |
| JP3070993B2 JP3070993B2 (en) | 2000-07-31 |
Family
ID=17060073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3240475A Expired - Fee Related JP3070993B2 (en) | 1991-08-27 | 1991-08-27 | Brazing material for platinum resistor type temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3070993B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6543102B1 (en) | 1998-03-26 | 2003-04-08 | Sensotherm Temperatursensorik Gmbh | Sensor component |
| JP2009088529A (en) * | 2007-09-28 | 2009-04-23 | Heraeus Sensor Technology Gmbh | Sheathed wire and film resistor |
| US7832616B2 (en) * | 2006-04-26 | 2010-11-16 | Watlow Electric Manufacturing Company | Methods of securing a thermocouple to a ceramic substrate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW394702B (en) * | 1996-10-09 | 2000-06-21 | Sega Enterprises Kk | Player, solution and play implementation and play system |
| CN100380086C (en) * | 2004-11-24 | 2008-04-09 | 李嘉豪 | Method and special apparatus for eliminating non-condensed gas in hot pipeline |
| CN100470182C (en) * | 2004-12-30 | 2009-03-18 | 李嘉豪 | Method and device for removing not concretive gas inside heat pipe |
-
1991
- 1991-08-27 JP JP3240475A patent/JP3070993B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6543102B1 (en) | 1998-03-26 | 2003-04-08 | Sensotherm Temperatursensorik Gmbh | Sensor component |
| US7832616B2 (en) * | 2006-04-26 | 2010-11-16 | Watlow Electric Manufacturing Company | Methods of securing a thermocouple to a ceramic substrate |
| KR101486253B1 (en) * | 2006-04-26 | 2015-01-26 | 와틀로 일렉트릭 매뉴팩츄어링 컴파니 | Ceramic heater and method of securing a thermocouple thereto |
| JP2009088529A (en) * | 2007-09-28 | 2009-04-23 | Heraeus Sensor Technology Gmbh | Sheathed wire and film resistor |
| US8138881B2 (en) | 2007-09-28 | 2012-03-20 | Heraeus Sensor Technology Gmbh | Coated wire and film resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3070993B2 (en) | 2000-07-31 |
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