JPH05320482A - Flame-retarding epoxy resin composition - Google Patents
Flame-retarding epoxy resin compositionInfo
- Publication number
- JPH05320482A JPH05320482A JP12601592A JP12601592A JPH05320482A JP H05320482 A JPH05320482 A JP H05320482A JP 12601592 A JP12601592 A JP 12601592A JP 12601592 A JP12601592 A JP 12601592A JP H05320482 A JPH05320482 A JP H05320482A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- flame
- filler
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、難燃性エポキシ樹脂組
成物に関し、更に詳しくは、低発煙性で有害ガスの発生
が少なく、耐湿性、難燃性、作業性に優れた難燃性エポ
キシ樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant epoxy resin composition, and more specifically, it has low smoke generation, little generation of harmful gases, and excellent flame resistance, flame retardancy and workability. It relates to an epoxy resin composition.
【０００２】[0002]
【従来の技術】従来、エポキシ樹脂は優れた電気特性、
機械特性、耐クラック性を有するとともに、各種材料の
接着性に優れているため、電気絶縁用、特に注型用とし
て多用され、特に絶縁保護、高電圧特性（耐アーク性、
耐トラッキング性）、耐クラック性及び難燃性の向上を
目的として難燃性エポキシ樹脂が高圧部品の絶縁処理、
すなわち含浸注型用として用いられ、例えば酸無水物硬
化型エポキシ樹脂に多量の充てん剤及び難燃剤を含んだ
組成物が用いられている。難燃性エポキシ樹脂組成物
は、現在、ハロゲン系難燃剤、リン系難燃剤、無機系難
燃剤等を添加して難燃性を付与することが一般的であ
る。この組成物の燃焼ガスとしては、一酸化炭素、シア
ン化水素、亜硫酸ガス、ハロゲン化水素などの有害ガス
が生成する。特にハロゲン系難燃剤を用いた場合には、
非常に有害なブロム化ベンゾダイオキシン、ジベンゾフ
ランが生成する可能性があり問題視されている。また、
リン系難燃剤を用いる場合には耐湿性、耐熱性に劣り、
無機系難燃剤を用いる場合には、充分な難燃性が得られ
ず、増量配合により粘度が著しく上昇し、作業性が低下
する問題点があった。2. Description of the Related Art Conventionally, epoxy resin has excellent electrical characteristics,
Since it has mechanical properties and crack resistance, and is excellent in adhesion to various materials, it is often used for electrical insulation, especially for casting, especially for insulation protection, high voltage characteristics (arc resistance, arc resistance,
Tracking resistance), crack resistance, and flame resistance are improved with flame-retardant epoxy resin insulation treatment of high-voltage parts,
That is, it is used for impregnation casting, and for example, a composition containing a large amount of a filler and a flame retardant in an acid anhydride-curable epoxy resin is used. Currently, a flame-retardant epoxy resin composition is generally added with a halogen-based flame retardant, a phosphorus-based flame retardant, an inorganic flame retardant, or the like to impart flame retardancy. As a combustion gas of this composition, harmful gases such as carbon monoxide, hydrogen cyanide, sulfurous acid gas, and hydrogen halide are generated. Especially when a halogen-based flame retardant is used,
A very harmful brominated benzodioxin and dibenzofuran may be produced, which is regarded as a problem. Also,
Moisture resistance and heat resistance are poor when phosphorus-based flame retardants are used,
When an inorganic flame retardant is used, sufficient flame retardancy cannot be obtained, and there is a problem that the viscosity is remarkably increased by increasing the amount and the workability is deteriorated.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、前記の従来
技術の問題を解決し、ハロゲン系難燃剤を用いずに、加
熱・燃焼時における発煙量及び有害ガスの発生量が少な
く、耐湿性及び難燃性に優れ、かつ低粘度で作業性に優
れた難燃性エポキシ樹脂組成物を提供するものである。DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems of the prior art, does not use a halogen-based flame retardant, produces a small amount of smoke and a harmful gas during heating / combustion, and is resistant to moisture. And a flame-retardant epoxy resin composition having excellent flame retardancy, low viscosity, and excellent workability.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、充てん剤
として導電率が小さく更に、充てん剤の表面をシラン系
カップリング剤で処理した水和アルミナを特定の配合量
で用いることにより、前記の問題点が解決されることを
見出し、本発明に到達した。Means for Solving the Problems The present inventors have found that by using a hydrated alumina having a small conductivity as a filler and a surface of the filler treated with a silane coupling agent in a specific blending amount, The present invention has been achieved by finding that the above problems can be solved.
【０００５】本発明は、エポキシ樹脂、酸無水物、硬化
促進剤及び充てん剤を含有する難燃性エポキシ樹脂組成
物において、該充てん剤として導電率が３０μＳ／ｃｍ
以下でかつ、充てん剤の表面をシラン系カップリング剤
で処理した水面アルミナをエポキシ樹脂１００重量部に
対して２５０〜４５０重量部配合してなる難燃性エポキ
シ樹脂組成物に関する。The present invention provides a flame-retardant epoxy resin composition containing an epoxy resin, an acid anhydride, a curing accelerator and a filler, and the filler having an electric conductivity of 30 μS / cm.
The present invention also relates to a flame-retardant epoxy resin composition obtained by mixing 250 to 450 parts by weight of water surface alumina whose surface of a filler is treated with a silane coupling agent with 100 parts by weight of an epoxy resin.
【０００６】本発明に用いられるエポキシ樹脂は、分子
内に少なくとも１個のエポキシ基を有するものであり、
例えばビスフェノールＡとエピクロールヒドリンとから
得られるビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦとエピクロールヒドリンとから得られるビスフェ
ノールＦ型エポキシ樹脂、フタル酸、テトラヒドロフタ
ル酸、ヘキサヒドロキシフタル酸、セバチン酸、ドデカ
ン酸等のポリカルボン酸のグリシジルエステル、１，４
−ブタンジオール、１，６−ヘキサンジオール、ポリエ
チレングリコール、ポリプロピレングリコール、トリメ
チロールプロパン等の多価アルコールのグリシジルエー
テル、３，４−エポキシシクロへキシルメチル（３，４
−エポキシシクロへキサン）カルボキシレート等の脂環
式エポキシ樹脂、液状ポリプタジエンのエポキシ化合物
が挙げられる。The epoxy resin used in the present invention has at least one epoxy group in the molecule,
For example, a bisphenol A type epoxy resin obtained from bisphenol A and epichlorhydrin, a bisphenol F type epoxy resin obtained from bisphenol F and epichlorhydrin, phthalic acid, tetrahydrophthalic acid, hexahydroxyphthalic acid, sebacic acid, Glycidyl esters of polycarboxylic acids such as dodecanoic acid, 1,4
-Glycidyl ethers of polyhydric alcohols such as butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol, trimethylolpropane, 3,4-epoxycyclohexylmethyl (3,4
Examples include alicyclic epoxy resins such as epoxycyclohexane) carboxylate and epoxy compounds of liquid polyptadiene.
【０００７】本発明に用いられる酸無水物としては、例
えばメチルテトラヒドロ無水フタル酸、メチルヘキサヒ
ドロ無水フタル酸、無水フタル酸、ヘキサヒドロ無水フ
タル酸、エンドメチレンテトラヒドロ無水フタル酸、ド
デセニル無水コハク酸、オクテニル無水コハク酸、ポリ
アゼライン酸ポリ無水物等が挙げられる。酸無水物の使
用量は、エポキシ樹脂に含まれるエポキシ基１当量当た
り、０．６〜１．３当量の範囲が好ましい。Examples of the acid anhydride used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecenylsuccinic anhydride and octenyl. Examples thereof include succinic anhydride and polyazelaic acid polyanhydride. The amount of the acid anhydride used is preferably in the range of 0.6 to 1.3 equivalents per equivalent of the epoxy group contained in the epoxy resin.
【０００８】本発明に用いられる硬化促進剤としては、
例えば２−エチル４−メチルイミダゾール、１−シアノ
エチル４−メチルイミダゾール、１−ベンジル２−エチ
ルイミダゾール等のイミゾールおよびその誘導体、トリ
スジメチルアミノメチルフェノール等の第３級アミン類
等が挙げられる。硬化促進剤の使用量には特に制限はな
いが、酸無水物１００重量部当たり０．１〜５．０重量
部の範囲が好ましい。As the curing accelerator used in the present invention,
Examples thereof include imidazoles such as 2-ethyl 4-methylimidazole, 1-cyanoethyl 4-methylimidazole, 1-benzyl 2-ethylimidazole and derivatives thereof, and tertiary amines such as trisdimethylaminomethylphenol. The amount of the curing accelerator used is not particularly limited, but is preferably in the range of 0.1 to 5.0 parts by weight per 100 parts by weight of acid anhydride.
【０００９】本発明に用いられる充てん剤は、耐湿性及
び難燃性に効果のある水和アルミナであってその導電率
が３０μＳ／ｃｍ以下で、その表面をシラン系カップリ
ング剤で処理したものとされその配合量は、エポキシ樹
脂１００重量部に対して、２５０〜４５０重量部の範囲
とされる。充てん剤として、水和アルミナ以外のシリ
カ、タルク、炭酸カルシウム、クレー等を用いても、優
れた耐湿性及び難燃性（ＵＬ９４Ｖ−０）は得られな
い。充てん剤のシラン系カップリング剤による処理は、
充てん剤を水または有機溶剤に分散させてスラリー化
し、これを撹拌しながらシラン系カップリング剤を加
え、充てん剤を乾燥して行なわれる。充てん剤を撹拌し
てシラン系カップラング剤の水溶液をスプレーし、乾燥
してもよく、また、炉から取り出した直後の高温充てん
剤にシラン系カップリング剤の水溶液をスプレーしても
よい。The filler used in the present invention is a hydrated alumina which is effective in moisture resistance and flame retardancy, has an electric conductivity of 30 μS / cm or less, and has its surface treated with a silane coupling agent. The compounding amount thereof is in the range of 250 to 450 parts by weight with respect to 100 parts by weight of the epoxy resin. Even if silica, talc, calcium carbonate, clay or the like other than hydrated alumina is used as the filler, excellent moisture resistance and flame retardancy (UL94V-0) cannot be obtained. The treatment of the filler with the silane coupling agent is
The filler is dispersed in water or an organic solvent to form a slurry, the silane coupling agent is added while stirring the slurry, and the filler is dried. The filler may be stirred to spray an aqueous solution of the silane coupling agent and then dried. Alternatively, the high temperature filler immediately after being taken out of the furnace may be sprayed with the aqueous solution of the silane coupling agent.
【００１０】本発明に用いられるシラン系カップリング
剤としては、例えばビニルシラン系、アクリルシラン
系、エポキシシラン系、アミノシラン系等のカップリン
グ剤が挙げられる。例えばビニルトリクロルシラン、ビ
ニルトリス（β−メトキシエトキシ）シラン、ビニルト
リエトキシシラン、ビニルトリメトキシシラン、γ−メ
タクリロキシプロピルトリメトキシシラン、β−（３，
４−エポキシシクロヘキシル）エチルトリメトキシシラ
ン、γ−グリシドキシプロピルトリメトキシシラン、γ
−グリシドキシプロピルメチルジエトキシシラン、Ｎ−
β（アミノエチル）−γ−アミノプロピルトリメトキシ
シラン、Ｎ−β（アミノエチル）−γ−アミノプロピル
メチルジメトキシシラン、γ−アミノプロピルトリエト
キシシラン、Ｎ−フェニル−γ−アミノプロピルトリメ
トキシシラン、γ−メルカプトプロピルトリメトキシシ
ラン、γ−クロロプロピルトリメトキシシラン等があげ
られる。またシラン系カップリング剤で処理した水和ア
ルミナに脂肪酸やステアリン酸を更に処理（ダブルコー
ト）することもできる。充てん剤に処理するシラン系カ
ップリング剤の処理量は特に制限はないが充てん剤１０
０重量部当たり０．１〜３．０重量部の範囲が好まし
い。上記の水和アルミナの配合量が、２５０重量部未満
では、難燃性（ＵＬ９４Ｖ−０）が得られず、４５０重
量部を越えると粘度が著しく上昇し、作業性が低下す
る。また表面処理を行なわず導電率が３０を越える水和
アルミナを用いたものは、作業性に劣り耐湿性が著しく
低下する。充てん剤としては、特定量の上記の水和アル
ミナを用いるが、これら以外に、シリカ、タルク、炭酸
カルシウム、クレー等の充てん剤を併用することもでき
る。Examples of the silane-based coupling agent used in the present invention include vinylsilane-based, acrylsilane-based, epoxysilane-based, and aminosilane-based coupling agents. For example, vinyltrichlorosilane, vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, β- (3,
4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ
-Glycidoxypropylmethyldiethoxysilane, N-
β (aminoethyl) -γ-aminopropyltrimethoxysilane, N-β (aminoethyl) -γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, Examples include γ-mercaptopropyltrimethoxysilane and γ-chloropropyltrimethoxysilane. The hydrated alumina treated with the silane coupling agent may be further treated (double-coated) with fatty acid or stearic acid. The amount of the silane coupling agent to be treated as the filler is not particularly limited, but the filler 10
The range of 0.1 to 3.0 parts by weight per 0 parts by weight is preferable. If the blending amount of the hydrated alumina is less than 250 parts by weight, flame retardancy (UL94V-0) cannot be obtained, and if it exceeds 450 parts by weight, the viscosity remarkably increases and the workability deteriorates. Further, the one using hydrated alumina having a conductivity of more than 30 without surface treatment is inferior in workability and remarkably deteriorates in moisture resistance. As the filler, a specific amount of the above-mentioned hydrated alumina is used, but in addition to these, fillers such as silica, talc, calcium carbonate and clay can also be used together.
【００１１】本発明の難燃性エポキシ樹脂組成物には、
必要に応じて、三酸化アンチモン、ベンガラ、酸化第二
鉄、カーボン、チタンホワイト等の着色剤、シラン系ま
たはチタン系カップリング剤、シリコーン系消泡剤、モ
ノグリシジルエーテル、ジグリシジルエーテル等のエポ
キシ反応性希釈剤などを配合することもできる。The flame-retardant epoxy resin composition of the present invention comprises
If necessary, coloring agents such as antimony trioxide, red iron oxide, ferric oxide, carbon, titanium white, silane-based or titanium-based coupling agents, silicone-based defoaming agents, epoxies such as monoglycidyl ether, diglycidyl ether, etc. A reactive diluent and the like can also be added.
【００１２】[0012]
【実施例】以下、実施例より本発明を説明する。下記例
中の「部」は重量部を意味する。表２の配合組成の難燃
性エポキシ樹脂組成物について特性を測定した。難燃性
エポキシ樹脂組成物は７０℃で２．５時間、次いで１１
０℃で２．５時間硬化させた。また、各特性は、以下に
示す方法により測定した。 （１）充てん剤の平均粒子径：島津製作所（株）製、セ
デイグラフ５００ＥＴを用い、試料濃度約８重量％、ス
タート粒子径５０μｍ、分散液ヘキサ−メタリン酸ソー
ダ０．１重量％で予備分散超音波洗浄２０分間を行って
粒子径分布図を作成し粒子径の累積重量％を求め、平均
粒子径は、累積重量（％）が５０％の粒子径（μｍ）を
示した。 （２）粘度：Ｂ型回転粘度計を用い、測定温度２５℃で
測定した。 （３）難燃性：ＵＬ９４に従って、試験片厚み１．５８
ｍｍの試料で評価した。 （４）導電率：試料３０ｇを８５℃の水１００ｍｌに懸
濁させ、冷却後懸濁液の導電率（μＳ／ｃｍ）を導電率
計で測定した。 （５）耐湿性：エポキシ樹脂組成物を所定条件で撹拌・
混合し、所定条件で硬化板（１．６ｍｍ厚み）を作成
し、次に１０ｃｍ×１０ｃｍに切り出した硬化板をヤマ
トラボテック（株）製高圧蒸気滅菌器内（２．１ａｔ
ｍ、１２０℃）に、５０時間放置し１ｍｍ換算での絶縁
破壊強さ（ｋＶ／ｍｍ）で評価した。耐湿性：次の基準
で評価した。 ○：５０時間後の絶縁破壊強さが１５ｋＶ／ｍｍ以上 ×：５０時間後の絶縁破壊強さが１５ｋＶ／ｍｍ未満 なお、実施例、比較例に用いた充てん剤の種類とメーカ
ー及び特性を表１に示し、これを用いて配合した樹脂組
成物の組成（単位は重量部である）を表２に示す。EXAMPLES The present invention will be described below with reference to examples. "Parts" in the following examples means parts by weight. The characteristics of the flame-retardant epoxy resin composition having the composition shown in Table 2 were measured. Flame retardant epoxy resin composition at 70 ° C for 2.5 hours, then 11
Cured at 0 ° C. for 2.5 hours. Moreover, each characteristic was measured by the method shown below. (1) Average particle diameter of filler: using Shimadzu Corporation's Sedigraph 500ET, sample concentration of about 8% by weight, starting particle diameter of 50 μm, dispersion of sodium hexametaphosphate 0.1% by weight and preliminary dispersion exceeding Sonic cleaning was carried out for 20 minutes to prepare a particle size distribution chart to determine the cumulative weight% of the particle size, and the average particle size showed a particle size (μm) with a cumulative weight (%) of 50%. (2) Viscosity: Measured at a measurement temperature of 25 ° C. using a B type rotational viscometer. (3) Flame retardancy: Test piece thickness 1.58 according to UL94
Evaluation was made with a sample of mm. (4) Conductivity: 30 g of the sample was suspended in 100 ml of water at 85 ° C., and after cooling, the conductivity (μS / cm) of the suspension was measured with a conductivity meter. (5) Moisture resistance: The epoxy resin composition is stirred under predetermined conditions.
After mixing, a hardened plate (1.6 mm thickness) is created under predetermined conditions, and then the hardened plate cut out into 10 cm × 10 cm is put in a high pressure steam sterilizer manufactured by Yamatra Botech Co., Ltd. (2.1 at).
m, 120 ° C.) for 50 hours, and evaluated by the dielectric breakdown strength (kV / mm) in terms of 1 mm. Moisture resistance: evaluated according to the following criteria. ◯: Dielectric breakdown strength after 50 hours is 15 kV / mm or more ×: Dielectric breakdown strength after 50 hours is less than 15 kV / mm Note that the types, manufacturers and characteristics of the fillers used in Examples and Comparative Examples are shown below. The composition (unit is parts by weight) of the resin composition shown in FIG.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【表２】 [Table 2]
【００１５】実施例１〜４ 表１の充てん剤の中で、導電率が３０μＳ／ｃｍ以下で
かつ、充てん剤の表面をアクリルシラン系カップリング
剤及びステアリン酸の複合系で処理した水和アルミナを
エポキシ樹脂１００重量部に対して２５０〜５００重量
部の範囲内で配合したエポキシ樹脂組成物は、いずれも
耐湿性に優れ、更に難燃性は、ＵＬ規格で９４Ｖ−０と
高いレベルを示す。 比較例１ 表１の充てん剤の中で、導電率が３０μＳ／ｃｍ以下で
充てん剤表面をシラン系カップリング剤で処理しない水
和アルミナをエポキシ樹脂１００重量部に対して３００
重量部配合したエポキシ樹脂組成物は、耐湿性及び難燃
性に優れるが、充てん剤の表面を処理、改質した水和ア
ルミナを用いたエポキシ組成物に比べ粘度が高く作業性
に劣る。 比較例２ 表１の充てん剤の中で、導電率が３０μＳ／ｃｍ以下で
かつ、充てん剤の表面をアクリルシラン系カップリング
剤で処理した水和アルミナをエポキシ樹脂１００重量部
に対して２３０重量部より少なく配合して得られるエポ
キシ樹脂組成物は、耐湿性に優れ、低粘度で作業性に優
れるが、難燃性（ＵＬ９４Ｖ−０）が得られない。 比較例３ 表１の充てん剤の中で、導電率が３０μＳ／ｃｍ以下で
かつ、充てん剤の表面をアクリルシラン系カップリング
剤で処理した水和アルミナをエポキシ樹脂１００重量部
に対して４８０重量部より多く配合して得られるエポキ
シ樹脂組成物は、耐湿性に優れ、難燃性（ＵＬ９４Ｖ−
０）にも優れるが、粘度が著しく上昇し、作業性が劣
る。 比較例４ 表１の充てん剤の中で、導電率が３０μＳ／ｃｍ以上で
かつ、充てん剤の表面をシラン系カップリング剤で処理
しない水和アルミナをエポキシ樹脂１００重量部に対し
て３００重量部配合して得られるエポキシ樹脂組成物
は、難燃性に優れるが、作業性、耐湿性に劣る。Examples 1 to 4 Among the fillers in Table 1, hydrated alumina whose conductivity is 30 μS / cm or less and whose surface is treated with a composite system of an acrylic silane coupling agent and stearic acid. All of the epoxy resin compositions containing 250 to 500 parts by weight of 100 parts by weight of the epoxy resin have excellent moisture resistance, and flame retardancy shows a high level of 94 V-0 according to UL standard. . Comparative Example 1 Among the fillers shown in Table 1, hydrated alumina whose conductivity is 30 μS / cm or less and whose filler surface is not treated with a silane coupling agent is 300 parts by weight with respect to 100 parts by weight of an epoxy resin.
The epoxy resin composition blended in parts by weight has excellent moisture resistance and flame retardancy, but has a higher viscosity and poorer workability than an epoxy composition using hydrated alumina whose surface of the filler has been treated and modified. Comparative Example 2 Among the fillers in Table 1, hydrated alumina whose conductivity is 30 μS / cm or less and whose filler surface is treated with an acrylic silane coupling agent is 230 parts by weight with respect to 100 parts by weight of the epoxy resin. The epoxy resin composition obtained by blending less than the above parts has excellent moisture resistance, low viscosity and excellent workability, but flame retardancy (UL94V-0) cannot be obtained. Comparative Example 3 Among the fillers in Table 1, the conductivity was 30 μS / cm or less, and 480 parts by weight of hydrated alumina obtained by treating the surface of the filler with an acrylic silane coupling agent was used with respect to 100 parts by weight of the epoxy resin. The epoxy resin composition obtained by blending more than 100 parts has excellent moisture resistance and flame retardancy (UL94V-
It is also excellent in 0), but the viscosity is remarkably increased and the workability is poor. Comparative Example 4 Among the fillers in Table 1, 300 parts by weight of hydrated alumina whose conductivity is 30 μS / cm or more and whose filler surface is not treated with a silane coupling agent is used per 100 parts by weight of the epoxy resin. The epoxy resin composition obtained by blending is excellent in flame retardancy, but inferior in workability and moisture resistance.
【００１６】[0016]
【発明の効果】本発明の難燃性エポキシ樹脂組成物は、
ハロゲン系難燃剤を用いずに、加熱・燃焼時における発
煙量及び有害ガスの発生量が少なく、耐湿性及び難燃性
に優れ、かつ低粘度で作業性に優れたものである。本発
明の難燃性エポキシ樹脂組成物はフライバックトラン
ス、高圧トランス、電源トランス、スイッチングトラン
ス、ソレノイドコイルなどの含浸、注型用として広く用
いることができる。The flame-retardant epoxy resin composition of the present invention is
Without using a halogen-based flame retardant, the amount of smoke and the amount of harmful gas generated at the time of heating / combustion are small, the humidity resistance and flame retardancy are excellent, and the viscosity is low and the workability is excellent. The flame-retardant epoxy resin composition of the present invention can be widely used for impregnation and casting of flyback transformers, high-voltage transformers, power transformers, switching transformers, solenoid coils and the like.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 雅博 茨城県日立市東町四丁目13番１号 日立化 成工業株式会社山崎工場内 (72)発明者 小原 光雄 茨城県日立市東町四丁目13番１号 日立化 成工業株式会社山崎工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masahiro Suzuki Masahiro Suzuki 13-13-1, Higashimachi, Hitachi City, Ibaraki Hitachi Chemical Co., Ltd. Yamazaki Factory (72) Inventor Mitsuo Ohara 4-13, Higashimachi, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Chemical Co., Ltd. Yamazaki Factory
Claims (1)
び充てん剤を含有する難燃性エポキシ樹脂組成物におい
て、該充てん剤として導電率が３０μＳ／ｃｍ以下でか
つ、充てん剤の表面をシラン系カップリング剤で処理し
た水和アルミナをエポキシ樹脂１００重量部に対して、
２５０〜４５０重量部配合してなる難燃性エポキシ樹脂
組成物。1. A flame-retardant epoxy resin composition containing an epoxy resin, an acid anhydride, a curing accelerator and a filler, wherein the filler has an electric conductivity of 30 μS / cm or less, and the surface of the filler is silane. Hydrated alumina treated with a coupling agent was added to 100 parts by weight of the epoxy resin.
A flame-retardant epoxy resin composition containing 250 to 450 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12601592A JPH05320482A (en) | 1992-05-19 | 1992-05-19 | Flame-retarding epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12601592A JPH05320482A (en) | 1992-05-19 | 1992-05-19 | Flame-retarding epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05320482A true JPH05320482A (en) | 1993-12-03 |
Family
ID=14924618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12601592A Pending JPH05320482A (en) | 1992-05-19 | 1992-05-19 | Flame-retarding epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05320482A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100662838B1 (en) * | 2005-03-28 | 2006-12-28 | 후지제롯쿠스 가부시끼가이샤 | Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition |
| KR101132370B1 (en) * | 2011-05-02 | 2012-04-02 | 진도화성공업 주식회사 | Resin composition for filling the temperature sensor |
| WO2015104917A1 (en) * | 2014-01-08 | 2015-07-16 | 信越化学工業株式会社 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
-
1992
- 1992-05-19 JP JP12601592A patent/JPH05320482A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100662838B1 (en) * | 2005-03-28 | 2006-12-28 | 후지제롯쿠스 가부시끼가이샤 | Flame-retardant epoxy resin composition, and electronic device, laminated circuit board, multilayered circuit board and printed circuit board using the flame-retardant epoxy resin composition |
| KR101132370B1 (en) * | 2011-05-02 | 2012-04-02 | 진도화성공업 주식회사 | Resin composition for filling the temperature sensor |
| WO2015104917A1 (en) * | 2014-01-08 | 2015-07-16 | 信越化学工業株式会社 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
| CN105899569A (en) * | 2014-01-08 | 2016-08-24 | 信越化学工业株式会社 | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
| JP6090614B2 (en) * | 2014-01-08 | 2017-03-08 | 信越化学工業株式会社 | Liquid epoxy resin composition for semiconductor encapsulation and resin-encapsulated semiconductor device |
| US9711378B2 (en) | 2014-01-08 | 2017-07-18 | Shin-Etsu Chemical Co., Ltd. | Liquid epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device |
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