JPH0525369A - Flame retardant epoxy resin composition - Google Patents
Flame retardant epoxy resin compositionInfo
- Publication number
- JPH0525369A JPH0525369A JP18276391A JP18276391A JPH0525369A JP H0525369 A JPH0525369 A JP H0525369A JP 18276391 A JP18276391 A JP 18276391A JP 18276391 A JP18276391 A JP 18276391A JP H0525369 A JPH0525369 A JP H0525369A
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- epoxy resin
- weight
- parts
- resin composition
- flame
- Prior art date
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- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、難燃性エポキシ樹脂組
成物に関し、更に詳しくは、有害ガスの発生が少なく、
難燃性、作業性に優れた難燃性エポキシ樹脂組成物に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant epoxy resin composition, and more specifically, it produces less harmful gas.
The present invention relates to a flame-retardant epoxy resin composition having excellent flame retardancy and workability.
【０００２】[0002]
【従来の技術】従来、エポキシ樹脂は優れた電気特性、
機械特性、耐クラック性を有するとともに、各種材料の
接着性に優れているため、電気絶縁用、特に注型用とし
て多用され、特に絶縁保護、高電圧特性（耐アーク性、
耐トラッキング性）、耐クラック性及び難燃性の向上を
目的として難燃性エポキシ樹脂が高圧部品の絶縁処理、
すなわち含浸注型用として用いられ、例えば酸無水物硬
化型エポキシ樹脂に多量の充てん剤及び難燃剤を含んだ
組成物が用いられている。難燃性エポキシ樹脂組成物
は、現在、ハロゲン系難燃剤、リン系難燃剤、無機系難
燃剤等を添加して難燃性を付与することが一般的であ
る。この組成物の燃焼ガスとしては、一酸化炭素、シア
ン化水素、亜硫酸ガス、ハロゲン化水素などの有害ガス
が生成する。特にハロゲン系難燃剤を用いた場合には、
非常に有害なブロム化ベンゾダイオキシン、ジベンゾフ
ランが生成する可能性があり問題視されている。また、
リン系難燃剤を用いる場合には耐湿性、耐熱性に劣り、
無機系難燃剤を用いる場合には、充分な難燃性が得られ
ず、増量配合により粘度が著しく上昇し、作業性が低下
する問題点があった。2. Description of the Related Art Conventionally, epoxy resin has excellent electrical characteristics,
Since it has mechanical properties and crack resistance, and is excellent in adhesion to various materials, it is often used for electrical insulation, especially for casting, especially for insulation protection, high voltage characteristics (arc resistance, arc resistance,
Tracking resistance), crack resistance, and flame resistance are improved with flame-retardant epoxy resin insulation treatment of high-voltage parts,
That is, it is used for impregnation casting, and for example, a composition containing a large amount of a filler and a flame retardant in an acid anhydride-curable epoxy resin is used. Currently, a flame-retardant epoxy resin composition is generally added with a halogen-based flame retardant, a phosphorus-based flame retardant, an inorganic flame retardant, or the like to impart flame retardancy. As a combustion gas of this composition, harmful gases such as carbon monoxide, hydrogen cyanide, sulfurous acid gas, and hydrogen halide are generated. Especially when a halogen-based flame retardant is used,
A very harmful brominated benzodioxin and dibenzofuran may be produced, which is regarded as a problem. Also,
Moisture resistance and heat resistance are poor when phosphorus-based flame retardants are used,
When an inorganic flame retardant is used, sufficient flame retardancy cannot be obtained, and there is a problem that the viscosity is remarkably increased by increasing the amount and the workability is deteriorated.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、前記の従来
技術の問題点を解決し、ハロゲン系難燃剤を用いず、有
害ガス発生量が少なく、難燃性に優れ、しかも低粘度で
作業性に優れた難燃性エポキシ樹脂組成物を提供するも
のである。The present invention solves the above-mentioned problems of the prior art, does not use a halogen-based flame retardant, produces a small amount of harmful gas, is excellent in flame retardancy, and has a low viscosity. A flame-retardant epoxy resin composition having excellent properties is provided.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、充てん剤
としてＤＯＰ吸油量の小さい水和アルミナを特定の配合
量で用いることにより、前記の問題点が解決されること
を見出し、本発明に到達した。The present inventors have found that the above problems can be solved by using a hydrated alumina having a small DOP oil absorption amount as a filler in a specific blending amount, and the present invention has been made. Reached
【０００５】本発明は、エポキシ樹脂、酸無水物、硬化
促進剤及び充てん剤を含有する難燃性エポキシ樹脂組成
物において該充てん剤としてＤＯＰ（フタル酸ジオクチ
ル）吸油量が３０以下の水和アルミナをエポキシ樹脂１
００重量部に対して２５０〜５００重量部配合してなる
難燃性エポキシ樹脂組成物に関する。The present invention relates to a flame-retardant epoxy resin composition containing an epoxy resin, an acid anhydride, a curing accelerator and a filler, and the hydrated alumina having a DOP (dioctyl phthalate) oil absorption of 30 or less as the filler. The epoxy resin 1
The present invention relates to a flame-retardant epoxy resin composition obtained by mixing 250 to 500 parts by weight with respect to 00 parts by weight.
【０００６】本発明に用いられるエポキシ樹脂は、分子
内に少なくとも１個のエポキシ基を有するものであり、
例えばビスフェノールＡとエピクロールヒドリンとから
得られるビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦとエピクロールヒドリンとから得られるビスフェ
ノールＦ型エポキシ樹脂、フタル酸、テトラヒドロフタ
ル酸、ヘキサヒドロキシフタル酸、セバチン酸、ドデカ
ン酸等のポリカルボン酸のグリシジルエステル、１，４
−ブタンジオール、１，６−ヘキサンジオール、ポリエ
チレングリコール、ポリプロピレングリコール、トリメ
チロールプロパン等の多価アルコールのグリシジルエー
テル、３，４−エポキシシクロヘキシルメチル（３，４
−エポキシシクロヘキサン）カルボキシレート等の脂環
式エポキシ樹脂、液状ポリブタジエンのエポキシ化物等
が挙げられる。The epoxy resin used in the present invention has at least one epoxy group in the molecule,
For example, a bisphenol A type epoxy resin obtained from bisphenol A and epichlorhydrin, a bisphenol F type epoxy resin obtained from bisphenol F and epichlorhydrin, phthalic acid, tetrahydrophthalic acid, hexahydroxyphthalic acid, sebacic acid, Glycidyl esters of polycarboxylic acids such as dodecanoic acid, 1,4
-Glycidyl ethers of polyhydric alcohols such as butanediol, 1,6-hexanediol, polyethylene glycol, polypropylene glycol, trimethylolpropane, 3,4-epoxycyclohexylmethyl (3,4
Examples thereof include alicyclic epoxy resins such as epoxycyclohexane) carboxylate, and epoxidized products of liquid polybutadiene.
【０００７】本発明に用いられる酸無水物としては、例
えばメチルテトラヒドロ無水フタル酸、メチルヘキサヒ
ドロ無水フタル酸、無水フタル酸、ヘキサヒドロ無水フ
タル酸、エンドメチレンテトラヒドロ無水フタル酸、ド
デセニル無水コハク酸、オクテニル無水コハク酸、ポリ
アゼライン酸ポリ無水物等が挙げられる。酸無水物の使
用量は、エポキシ樹脂に含まれるエポキシ基１当量当た
り、０．６〜１．３当量の範囲が好ましい。Examples of the acid anhydride used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecenylsuccinic anhydride and octenyl. Examples thereof include succinic anhydride and polyazelaic acid polyanhydride. The amount of the acid anhydride used is preferably in the range of 0.6 to 1.3 equivalents per equivalent of the epoxy group contained in the epoxy resin.
【０００８】本発明に用いられる硬化促進剤としては、
例えば２−エチル４−メチルイミダゾール、１−シアノ
エチル４−メチルイミダゾール、１−ベンジル２−エチ
ルイミダゾール等のイミダゾールおよびその誘導体、ト
リスジメチルアミノメチルフェノール等の第３級アミン
類等が挙げられる。硬化促進剤の使用量には特に制限は
ないが、酸無水物１００重量部当たり０．１〜５．０重
量部の範囲が好ましい。As the curing accelerator used in the present invention,
Examples thereof include imidazole such as 2-ethyl 4-methylimidazole, 1-cyanoethyl 4-methylimidazole, 1-benzyl 2-ethylimidazole and derivatives thereof, and tertiary amines such as trisdimethylaminomethylphenol. The amount of the curing accelerator used is not particularly limited, but is preferably in the range of 0.1 to 5.0 parts by weight per 100 parts by weight of acid anhydride.
【０００９】本発明に用いられる充てん剤は、難燃性に
硬化のある水和アルミナであってそのＤＯＰ吸油量は３
０以下のものとされ、その配合量は、エポキシ樹脂１０
０重量部に対して、２５０〜５００重量部の範囲とす
る。充てん剤として、水和アルミナ以外のシリカ、タル
ク、炭酸カルシウム、クレー等を用いても、難燃性（Ｕ
Ｌ９４Ｖ−０）が得られない。また、ＤＯＰ吸油量が３
０より大きい水和アルミナの場合には、組成物の粘度が
著しく上昇するため適正な粘度を維持するには、エポキ
シ樹脂に対して水和アルミナを比較的少量しか配合でき
ず、難燃性（ＵＬ９４Ｖ−０）と粘度のバランスがとれ
ない。The filler used in the present invention is flame-retardant and hardened hydrated alumina, and its DOP oil absorption is 3
The amount of the epoxy resin is 10 or less.
The amount is 250 to 500 parts by weight with respect to 0 parts by weight. Even if silica, talc, calcium carbonate, clay, etc. other than hydrated alumina is used as the filler, flame retardancy (U
L94V-0) cannot be obtained. Also, the DOP oil absorption is 3
In the case of hydrated alumina of more than 0, the viscosity of the composition remarkably increases, and in order to maintain an appropriate viscosity, only a relatively small amount of hydrated alumina can be blended with the epoxy resin, and the flame retardance ( UL94V-0) and viscosity cannot be balanced.
【００１０】上記の水和アルミナの配合量は、エポキシ
樹脂１００重量部に対して２５０〜５００重量部であ
る。該配合量が２５０重量部未満では、難燃性（ＵＬ９
４Ｖ−０）が得られず、５００重量部を越えると粘度が
著しく上昇し、作業性が低下する。The compounding amount of the hydrated alumina is 250 to 500 parts by weight with respect to 100 parts by weight of the epoxy resin. If the blending amount is less than 250 parts by weight, flame retardancy (UL9
4V-0) cannot be obtained, and when it exceeds 500 parts by weight, the viscosity remarkably increases and the workability decreases.
【００１１】充てん剤としては、特定量の上記の水和ア
ルミナを用いるが、これら以外に、シリカ、タルク、炭
酸カルシウム、クレー等の充てん剤を併用することもで
きる。As the filler, a specific amount of the above-mentioned hydrated alumina is used, but in addition to these, fillers such as silica, talc, calcium carbonate and clay can also be used together.
【００１２】本発明の難燃性エポキシ樹脂組成物には、
必要に応じて、三酸化アンチモン、ベンガラ、酸化第２
鉄、カーボン、チタンホワイト等の着色剤、シラン系ま
たはチタン系カップリング剤、シリコーン系消泡剤、モ
ノグリシジルエーテル、ジグリシジルエーテル等のエポ
キシ反応性希釈剤などを配合することができる。The flame-retardant epoxy resin composition of the present invention comprises
As needed, antimony trioxide, red iron oxide, second oxide
Coloring agents such as iron, carbon and titanium white, silane coupling agents or titanium coupling agents, silicone defoaming agents, and epoxy reactive diluents such as monoglycidyl ether and diglycidyl ether can be added.
【００１３】[0013]
【実施例】以下、実施例より本発明を説明する。下記例
中の「部」は重量部を意味する。なお、難燃性エポキシ
樹脂組成物は７０℃で２．５時間、次いで１１０℃で
２．５時間硬化させた。また、各特性は、以下に示す方
法により測定した。 （１） 充てん剤の平均粒子径：島津製作所（株）製、
セデイグラフ５０００ＥＴを用い、試料濃度約８重量
％、スタート粒子径５０μｍ、分散液ヘキサ−メタリン
酸ソーダ０．１重量％で予備分散超音波洗浄２０分間を
行って粒子径分布図を作成し粒子径の累積重量％を求
め、平均粒子径は、累積重量（％）が５０％の粒子径
（μｍ）を示した。 （２） 充てん剤のＤＯＰ吸油量：充てん剤Ｗｇを１０
０ｍｌのビーカーに、１ｍｇの桁まで正しくはかりと
る。次にビューレットよりＤＯＰ（フタル酸ジオクチ
ル）を１滴／秒程度の速さで充てん剤に滴下し、スパチ
ュラで混合撹拌する。充てん剤とＤＯＰが均一に混合
し、粘稠性が発現したところ（Ａｍｌ）を終点とし、充
てん剤のＤＯＰ吸油量を次式によって算出した。充てん
剤量は５ｇとして行った。 ＤＯＰ吸油量（ｍｌ／１００ｇ）＝（Ａ／Ｗ）×１００ Ａ：ＤＯＰの使用量（ｍｌ） Ｗ：充てん剤量（ｇ） （３） 粘度：Ｂ型回転粘度計を用い、測定温度２５℃
で測定した。 （４） 難燃性：ＵＬ９４に従って、試験片厚み１．５
８ｍｍの試料で評価した。 （５） 実機コイルへの注入作業性：注入量約１００ｇ
の高圧トランスに三双機工（株）製真空注入機を用いて
エポキシ樹脂組成物を真空注入する際の流れ性から注入
作業性を評価した。（注入温度５０℃、注入真空度３〜
５Ｔｏｒｒ、エポキシ樹脂組成物吐出圧力 １ａｔｍ） 注入作業性は、次の基準で評価した。 〇：１２０秒以内に注入が完了する。 △：３００秒以内に注入が完了する。 ×：注入が完了するまでに３００秒より長くかかるか注
入できない。なお、実施例、比較例に用いた充てん剤の
種類とメーカー及び特性を表１に示し、これを用いて配
合した樹脂組成物の組成（単位は重量部である）を表２
に示す。EXAMPLES The present invention will be described below with reference to examples. "Parts" in the following examples means parts by weight. The flame-retardant epoxy resin composition was cured at 70 ° C. for 2.5 hours and then at 110 ° C. for 2.5 hours. Moreover, each characteristic was measured by the method shown below. (1) Average particle size of filler: Shimadzu Corp.
Using Sedigraph 5000ET, a sample concentration of about 8% by weight, a starting particle size of 50 μm, and a dispersion liquid of sodium hexametaphosphate 0.1% by weight were subjected to preliminary dispersion ultrasonic cleaning for 20 minutes to prepare a particle size distribution chart and calculate the particle size distribution. The cumulative weight% was determined, and the average particle diameter was such that the cumulative weight (%) was 50%. (2) DOP oil absorption of filler: 10 Wg of filler
Accurately weigh up to the order of 1 mg in a 0 ml beaker. Next, DOP (dioctyl phthalate) is added dropwise from the burette to the packing material at a speed of about 1 drop / second, and mixed and stirred with a spatula. The filler and DOP were uniformly mixed and the point where the viscosity developed (Aml) was taken as the end point, and the DOP oil absorption of the filler was calculated by the following formula. The amount of filler was 5 g. DOP oil absorption (ml / 100g) = (A / W) x 100 A: DOP usage (ml) W: Filler amount (g) (3) Viscosity: B type rotational viscometer, measurement temperature 25 ° C
It was measured at. (4) Flame retardancy: Test piece thickness 1.5 according to UL94
An 8 mm sample was evaluated. (5) Workability of injecting into actual coil: Injecting amount about 100g
The injection workability was evaluated from the flowability when the epoxy resin composition was vacuum-injected into the high-voltage transformer using a vacuum injection machine manufactured by Sanso Kiko Co., Ltd. (Injection temperature 50 ° C., injection vacuum degree 3 to
5 Torr, Epoxy resin composition discharge pressure 1 atm) The injection workability was evaluated according to the following criteria. ◯: The injection is completed within 120 seconds. Δ: Injection is completed within 300 seconds. X: It takes longer than 300 seconds to complete the injection or the injection cannot be performed. The types, manufacturers, and characteristics of the fillers used in the examples and comparative examples are shown in Table 1, and the composition (unit is parts by weight) of the resin composition blended using the same is shown in Table 2.
Shown in.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【表２】 [Table 2]
【００１６】実施例１〜６ 第１表の充てん剤の中で、ＤＯＰ吸油量が３０以下の水
和アルミナをエポキシ樹脂１００重量部に対して２５０
〜５００重量部の範囲内で配合したエポキシ樹脂組成物
は、いずれも低粘度で作業性に優れ、さらに難燃性は、
ＵＬ規格で９４Ｖ−０と高いレベルが得られた。Examples 1 to 6 Among the fillers shown in Table 1, hydrated alumina having a DOP oil absorption of 30 or less was added to 250 parts by weight of 100 parts by weight of epoxy resin.
Each of the epoxy resin compositions blended in the range of 500 parts by weight to 500 parts by weight has a low viscosity, excellent workability, and flame retardancy.
A high level of 94V-0 was obtained according to the UL standard.
【００１７】比較例１および２ 表１の充てん剤の中で、ＤＯＰ吸油量が３０より大きい
水和アルミナをエポキシ樹脂１００重量部に対して２５
０〜５００重量部の範囲内で配合したエポキシ樹脂組成
物は、難燃性は、ＵＬ規格で９４Ｖ−０と高いレベルに
あるが、粘度が著しく上昇するため作業性に劣る。Comparative Examples 1 and 2 Among the fillers shown in Table 1, hydrated alumina having a DOP oil absorption of more than 30 was added to 25 parts with respect to 100 parts by weight of the epoxy resin.
The epoxy resin composition blended in the range of 0 to 500 parts by weight has a flame retardancy as high as 94V-0 according to the UL standard, but the workability is poor because the viscosity is remarkably increased.
【００１８】比較例３および４ 表１の充てん剤の中をシリカをエポキシ樹脂１００重量
部に対して２５０〜５００重量部の範囲内で配合したエ
ポキシ樹脂組成物は、難燃性（ＵＬ９４−０）が得られ
ない。Comparative Examples 3 and 4 Epoxy resin compositions prepared by blending silica in the filler of Table 1 in the range of 250 to 500 parts by weight with respect to 100 parts by weight of epoxy resin are flame retardant (UL94-0). ) Cannot be obtained.
【００１９】比較例５および６ 表１の充てん剤の中で、ＤＯＰ吸油量が３０以下の水和
アルミナをエポキシ樹脂１００重量部に対し、２５０重
量部より少なく配合して得られるエポキシ樹脂組成物
は、難燃性が得られず、また５００重量部より多く配合
して得られるエポキシ樹脂組成物は、粘度が著しく上昇
し、作業性が劣る。Comparative Examples 5 and 6 An epoxy resin composition obtained by mixing less than 250 parts by weight of hydrated alumina having a DOP oil absorption of 30 or less with 100 parts by weight of the epoxy resin among the fillers shown in Table 1. Does not have flame retardancy, and the epoxy resin composition obtained by blending more than 500 parts by weight has a markedly increased viscosity and poor workability.
【００２０】[0020]
【発明の効果】本発明の難燃性エポキシ樹脂組成物は、
ハロゲン系難燃剤を用いず有害ガスの発生量が少なく、
難燃性はＵＬ９４試験においてＶ−０という高いレベル
を有し、しかも、低粘度で作業性に優れるものである。
本発明の難燃性エポキシ樹脂組成物はフライバックトラ
ンス、高圧トランス、電源トランス、スイッチングトラ
ンス、ソレノイドコイルなどの含浸、注型用として広く
用いることができる。The flame-retardant epoxy resin composition of the present invention is
The halogen-based flame retardant is not used and the amount of harmful gas generated is small.
The flame retardancy has a high level of V-0 in the UL94 test, and has low viscosity and excellent workability.
The flame-retardant epoxy resin composition of the present invention can be widely used for impregnation and casting of flyback transformers, high-voltage transformers, power transformers, switching transformers, solenoid coils and the like.
Claims (1)
び充てん剤を含有する難燃性エポキシ樹脂組成物におい
て、該充てん剤としてＤＯＰ（フタル酸ジオクチル）吸
油量が３０以下の水和アルミナをエポキシ樹脂１００重
量部に対して２５０〜５００重量部配合してなる難燃性
エポキシ樹脂組成物。Claim: What is claimed is: 1. A flame-retardant epoxy resin composition containing an epoxy resin, an acid anhydride, a curing accelerator, and a filler, wherein the filler has a DOP (dioctyl phthalate) oil absorption of 30. A flame-retardant epoxy resin composition obtained by mixing 250 to 500 parts by weight of the following hydrated alumina with 100 parts by weight of an epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18276391A JPH0525369A (en) | 1991-07-24 | 1991-07-24 | Flame retardant epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18276391A JPH0525369A (en) | 1991-07-24 | 1991-07-24 | Flame retardant epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0525369A true JPH0525369A (en) | 1993-02-02 |
Family
ID=16124002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18276391A Pending JPH0525369A (en) | 1991-07-24 | 1991-07-24 | Flame retardant epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0525369A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271225B2 (en) | 2002-05-29 | 2007-09-18 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition |
| JP2013151655A (en) * | 2011-12-28 | 2013-08-08 | Hitachi Chemical Co Ltd | Resin composition, resin composition sheet and manufacturing method for resin composition sheet, resin composition sheet with metal foil, b-stage sheet, semi-hardened resin composition sheet with metal foil, metal base wiring board material, metal base wiring board, led light source member, and power semiconductor device |
-
1991
- 1991-07-24 JP JP18276391A patent/JPH0525369A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271225B2 (en) | 2002-05-29 | 2007-09-18 | Nippon Chemical Industrial Co., Ltd. | Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition |
| JP2013151655A (en) * | 2011-12-28 | 2013-08-08 | Hitachi Chemical Co Ltd | Resin composition, resin composition sheet and manufacturing method for resin composition sheet, resin composition sheet with metal foil, b-stage sheet, semi-hardened resin composition sheet with metal foil, metal base wiring board material, metal base wiring board, led light source member, and power semiconductor device |
| JP2017141464A (en) * | 2011-12-28 | 2017-08-17 | 日立化成株式会社 | Resin composition, resin composition sheet and method for producing resin composition sheet, resin composition sheet with metal foil, b stage sheet, semi-cured resin composition sheet with metal foil, metal base wiring board material, metal base wiring board, led light source member, and power semiconductor device |
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