JPH0529792A - Ic conveyance device - Google Patents
Ic conveyance deviceInfo
- Publication number
- JPH0529792A JPH0529792A JP18279391A JP18279391A JPH0529792A JP H0529792 A JPH0529792 A JP H0529792A JP 18279391 A JP18279391 A JP 18279391A JP 18279391 A JP18279391 A JP 18279391A JP H0529792 A JPH0529792 A JP H0529792A
- Authority
- JP
- Japan
- Prior art keywords
- product
- lead frame
- grip unit
- mechanical grip
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はＩＣの製造装置における
ＩＣの搬送装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC carrier device in an IC manufacturing apparatus.
【０００２】[0002]
【従来の技術】従来、この種の搬送装置は、図５の平面
図に示すリードフレーム２に樹脂封止されたＩＣ製品１
（以下、単に製品と呼ぶ）を、図４の断面図に示す様
に、搬送レール３に沿って搬送する為に、搬送棹８と搬
送爪７を搬送サイクル動作させて製品をピッチ搬送さ
せ、その搬送系にカムと駆動用モータを有している。2. Description of the Related Art Conventionally, a carrier device of this type has an IC product 1 which is resin-sealed in a lead frame 2 shown in a plan view of FIG.
In order to convey (hereinafter, simply referred to as a product) along the conveying rail 3 as shown in the cross-sectional view of FIG. 4, the conveying rod 8 and the conveying claw 7 are operated in a conveying cycle to convey the product in pitch. The transport system has a cam and a drive motor.
【０００３】次に動作について説明する。図６の斜視図
のように、製品を搬送する為にサイクル動作１１を行な
うカムを利用することで、以下の連続動作を行なう。ま
ず、製品のリードフレームの角穴９または丸穴を利用
し、搬送棹８をの動作をさせることで角穴９へ搬送爪
７を挿入し、次に、の動作により製品を水平方向１０
へピッチ送りする。ピッチ送りされた搬送棹８は、の
動作により角穴９より抜き取られ、の動作により搬送
棹の原点へ復帰する。この一連の動作〜を繰り返す
ことで、製品は加工処理位置Ａへピッチ搬送され、搬送
途中においてリード切断等何らかの加工処理が実施され
る。Next, the operation will be described. As shown in the perspective view of FIG. 6, the following continuous operation is performed by using the cam that performs the cycle operation 11 to convey the product. First, by using the square hole 9 or the round hole of the lead frame of the product, the transporting rod 8 is operated to insert the transporting claw 7 into the square hole 9, and then the product is moved horizontally 10
Pitch feed to. The pitch-fed transport rod 8 is pulled out from the square hole 9 by the operation of and is returned to the origin of the transport rod by the operation of. By repeating this series of operations, the product is pitch-transported to the processing position A, and some processing such as lead cutting is carried out during the transportation.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
搬送装置は、搬送棹を〜の様なサイクル動作させる
搬送である為に、製品のピッチ搬送に実際に必要な動作
はのみであるにもかかわらず、，，の動作が付
随するが故に製品ピッチ搬送毎に上記，，の無駄
な時間が蓄積され、装置のインデックスひいては生産性
が低下する等の欠点があった。また、前述の様な搬送棹
及び搬送爪、リードフレームの角穴及び丸穴を利用した
搬送装置である為に、フレキシブルな品種対応が同一の
搬送装置では不可能である等の欠点があった。However, since the conventional transfer device is a transfer in which the transfer rod is cycled in the manner of to, it is only necessary to perform the pitch transfer of the product. However, since the operations of ,,, and are accompanied, wasteful time of the above, and is accumulated every time the product pitch is conveyed, and there is a defect that the index of the apparatus and thus the productivity is lowered. In addition, since the above-described transport device uses the transport rod and the transport claw, the square hole and the round hole of the lead frame, there is a drawback that flexible product compatibility is not possible with the same transport device. .
【０００５】[0005]
【課題を解決するための手段】本発明のＩＣの搬送装置
は、リードフレームに樹脂封止済のＩＣ製品を連続ピッ
チ搬送する為に、製品のリードフレーム端をクランプし
て搬送する為のメカグリップユニットと、それを駆動さ
せる為のサーボモータと、製品の原点位置を補正する為
の画像認識ユニットとを有している。SUMMARY OF THE INVENTION An IC carrying device of the present invention is a mechanism for clamping and carrying a lead frame end of a product in order to carry a resin-sealed IC product on a lead frame at a continuous pitch. It has a grip unit, a servomotor for driving the grip unit, and an image recognition unit for correcting the origin position of the product.
【０００６】[0006]
【実施例】次に本発明について図面を参照して詳細に説
明する。図１は本発明の一実施例の一部を示す断面図、
図２は一実施例を説明する図で、同図（ａ）はクランプ
状態を示す断面図、同図（ｂ）はクランプを解放した状
態を示す断面図、図３は一実施例の動作を示す斜視図で
ある。図１はリードフレーム２に樹脂封止済ＩＣ製品が
搬送レール３中にあるときの状態を示しているが、製品
はこの搬送レール３中において原点位置補正、加工処理
等を含めた一連の連続ピッチ搬送がなされる。まず、図
２において、同図（ｂ）の状態から同図（ａ）の状態
に、製品のリードフレーム２の端をメカグリップユニッ
ト４によりクランプする。クランプ面には導電性ゴム１
２が設けてある。次に、図３において、メカグリップユ
ニット４をサーボモータ１３を用いて原点補正位置Ｂま
で製品を水平方向６に移動させ、画像認識ユニット５に
て原点位置補正し、その時の原点位置とＩＣ製品１のピ
ッチ間距離との情報から、サーボモータ１３により製品
を加工処理位置Ａまで連続ピッチ搬送し、加工処理を含
めた一連の搬送動作を行なう。尚、製品の加工処理を完
了した後、メカグリップユニット４はサーボモータ１３
により、水平方向６とは逆方向に高速で原点復帰し、あ
らかじめスタンバイ状態にある次の製品に対し前述した
動作を繰返す。上記動作は全て制御部１４でコントロー
ルされる。The present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view showing a part of an embodiment of the present invention,
2A and 2B are views for explaining one embodiment. FIG. 2A is a sectional view showing a clamped state, FIG. 2B is a sectional view showing a released state of the clamp, and FIG. 3 shows an operation of the embodiment. It is a perspective view shown. FIG. 1 shows a state in which a resin-sealed IC product is present on the lead frame 2 in the carrier rail 3, but the product is a series of continuous products in the carrier rail 3 including correction of the origin position and processing. Pitch conveyance is performed. First, in FIG. 2, the end of the lead frame 2 of the product is clamped by the mechanical grip unit 4 from the state of FIG. 2B to the state of FIG. Conductive rubber on the clamp surface 1
2 is provided. Next, referring to FIG. 3, the mechanical grip unit 4 is moved in the horizontal direction 6 to the origin correction position B by using the servo motor 13, and the origin position is corrected by the image recognition unit 5, and the origin position and IC product at that time are corrected. Based on the information of the distance between pitches of 1, the product is continuously conveyed by the servo motor 13 to the processing position A, and a series of conveying operations including the processing are performed. In addition, after the processing of the product is completed, the mechanical grip unit 4 is moved to the servo motor 13
Thus, the origin is returned at a high speed in the direction opposite to the horizontal direction 6, and the above-described operation is repeated for the next product in the standby state in advance. All the above operations are controlled by the control unit 14.
【０００７】上述した実施例の搬送装置を用いることに
より、製品を高速で搬送し、尚かつ加工処理を施すこと
ができる。また、リードフレーム端をメカグリップユニ
ットでクランプしての搬送であるため、製品に対してフ
レキシブルな品種対応が可能である。By using the carrying device of the above-described embodiment, the product can be carried at high speed and can be processed. Further, since the lead frame end is clamped by the mechanical grip unit for transportation, it is possible to flexibly correspond to the product type.
【０００８】[0008]
【発明の効果】以上説明した様に本発明は、樹脂封止済
ＩＣのリードフレームをメカグリップユニット，サーボ
モータ，原点位置補正用画像認識ユニットを用いること
により、製品の高速搬送及び加工処理を施すことができ
るため時間短縮が可能となる。その結果、装置インデッ
クスの向上が可能となり、高い生産性を発揮することが
でき、また製品に対しユニット交換や切換えの必要がな
くなり、フレキシブルな品種対応が可能となる。As described above, according to the present invention, by using the lead frame of the resin-sealed IC with the mechanical grip unit, the servo motor, and the image recognition unit for correcting the origin position, high-speed transportation and processing of the product can be achieved. Since it can be applied, the time can be shortened. As a result, the device index can be improved, high productivity can be exerted, and there is no need to replace or switch the unit with respect to the product, and flexible product correspondence is possible.
【図１】本発明の一実施例の一部を示す断面図である。FIG. 1 is a sectional view showing a part of an embodiment of the present invention.
【図２】本発明の一実施例を説明する図で、同図（ａ）
はクランプ状態を示す断面図、同図（ｂ）はクランプを
解放した状態を示す断面図である。FIG. 2 is a diagram for explaining an embodiment of the present invention, and FIG.
Is a sectional view showing a clamped state, and FIG. 7B is a sectional view showing a state in which the clamp is released.
【図３】本発明の一実施例の動作を示す斜視図である。FIG. 3 is a perspective view showing the operation of the embodiment of the present invention.
【図４】従来の搬送装置の一部を示す断面図である。FIG. 4 is a cross-sectional view showing a part of a conventional transport device.
【図５】製品の一部を示す平面図である。FIG. 5 is a plan view showing a part of the product.
【図６】従来の搬送装置の動作を示す斜視図である。FIG. 6 is a perspective view showing an operation of a conventional carrier device.
１ ＩＣ製品 ２ リードフレーム ３ 搬送レール ４ メカグリップユニット ５ 画像認識ユニット ６ 水平方向 ７ 搬送爪 ８ 搬送棹 ９ 角穴 １０ 水平方向 １１ サイクル動作 １２ 導電性ゴム １３ サーボモータ １４ 制御部 Ａ 加工処理位置 Ｂ 原点補正位置 1 IC product 2 lead frame 3 Conveyor rail 4 Mechanical grip unit 5 Image recognition unit 6 horizontal direction 7 Transport claw 8 Transport rod 9 square holes 10 Horizontal 11 cycle operation 12 Conductive rubber 13 Servo motor 14 Control unit A processing position B Origin correction position
Claims (3)
のリードフレーム端をクランプするメカグリップユニッ
トと、このメカグリップユニットを駆動して製品を原点
補正位置および加工処理位置に連続ピッチ搬送させるサ
ーボモータと、前記原点位置補正を行なう画像認識ユニ
ットとを有することを特徴とするＩＣの搬送装置。1. A mechanical grip unit for clamping a lead frame end of an IC product which is resin-sealed in a lead frame, and a servo motor for driving the mechanical grip unit to continuously convey the product to an origin correction position and a processing position. And an image recognition unit that performs the origin position correction.
グリップユニットは往路よりも高速で初期位置に復帰す
る請求項１記載のＩＣの搬送装置。2. The IC transfer device according to claim 1, wherein the mechanical grip unit returns to the initial position at a higher speed than the outward path after the completion of processing at the processing position.
内を往復移動する請求項１記載のＩＣの搬送装置。3. The IC transfer device according to claim 1, wherein the mechanical grip unit reciprocates in the same horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182793A JP2927991B2 (en) | 1991-07-24 | 1991-07-24 | IC transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3182793A JP2927991B2 (en) | 1991-07-24 | 1991-07-24 | IC transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0529792A true JPH0529792A (en) | 1993-02-05 |
| JP2927991B2 JP2927991B2 (en) | 1999-07-28 |
Family
ID=16124521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3182793A Expired - Fee Related JP2927991B2 (en) | 1991-07-24 | 1991-07-24 | IC transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2927991B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239944A (en) * | 1988-03-22 | 1989-09-25 | Toshiba Seiki Kk | Feeding of semiconductor frame |
| JPH0258342A (en) * | 1988-08-24 | 1990-02-27 | Hitachi Ltd | Method and apparatus for transferring lead frame, and bonding device using the same |
-
1991
- 1991-07-24 JP JP3182793A patent/JP2927991B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01239944A (en) * | 1988-03-22 | 1989-09-25 | Toshiba Seiki Kk | Feeding of semiconductor frame |
| JPH0258342A (en) * | 1988-08-24 | 1990-02-27 | Hitachi Ltd | Method and apparatus for transferring lead frame, and bonding device using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2927991B2 (en) | 1999-07-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970121 |
|
| LAPS | Cancellation because of no payment of annual fees |