JPH0529385A - Semiconductor device mounted on film carrier - Google Patents
Semiconductor device mounted on film carrierInfo
- Publication number
- JPH0529385A JPH0529385A JP3186073A JP18607391A JPH0529385A JP H0529385 A JPH0529385 A JP H0529385A JP 3186073 A JP3186073 A JP 3186073A JP 18607391 A JP18607391 A JP 18607391A JP H0529385 A JPH0529385 A JP H0529385A
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- semiconductor device
- semiconductor element
- insulating resin
- reinforcing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、固体撮像素子等をフィ
ルムキャリアを用いて実装したフィルムキャリア実装半
導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier mounted semiconductor device in which a solid-state image pickup device or the like is mounted using a film carrier.
【０００２】[0002]
【従来の技術】近年、テレビカメラや移動体電話などの
電子機器に見られる小型軽量化は、主に個々の電子部品
の小型化やそれらを実装する工法の開発で成されてき
た。特に多端子の接続を必要とする半導体素子について
は、フィルムキャリアを利用した実装法により小型軽量
化が図られている。2. Description of the Related Art In recent years, the reduction in size and weight found in electronic devices such as television cameras and mobile phones has been achieved mainly by miniaturization of individual electronic parts and development of a method of mounting them. In particular, for semiconductor elements that require multi-terminal connection, a mounting method using a film carrier is used to reduce the size and weight.
【０００３】以下に従来のフィルムキャリア実装半導体
装置について説明する。図５は従来のフィルムキャリア
実装半導体装置の平面図、図６は図５をＡ−Ａ′線で切
断した断面図である。これらの図において、１は半導体
素子、２はインナーリード３を保持するタイバーフィル
ム、４はアウターリード、５はバンプ、６は電極パッ
ド、７は絶縁樹脂である。A conventional semiconductor device mounted with a film carrier will be described below. FIG. 5 is a plan view of a conventional semiconductor device mounted with a film carrier, and FIG. 6 is a sectional view taken along line AA ′ in FIG. In these figures, 1 is a semiconductor element, 2 is a tie bar film holding an inner lead 3, 4 is an outer lead, 5 is a bump, 6 is an electrode pad, and 7 is an insulating resin.
【０００４】半導体素子１の表面に形成された電極パッ
ド６は導電性突起物であるバンプ５を介した状態でタイ
バーフィルム２に保持されたインナーリード３に接続さ
れ、さらに半導体素子１の表面及びタイバーフィルム２
の一部に適量の絶縁樹脂７が塗布される。上記構成にお
いて、半導体素子駆動装置（図示せず）にアウターリー
ド４を接続すると、電気信号がアウターリード４，イン
ナーリード３及びバンプ５を通して流れ、半導体素子１
が駆動されることになる。また、絶縁樹脂７は外気を遮
断し電極パッド４とインナーリード３の接合部を補強す
るものである。The electrode pad 6 formed on the surface of the semiconductor element 1 is connected to the inner lead 3 held by the tie bar film 2 via the bump 5 which is a conductive protrusion, and further on the surface of the semiconductor element 1 and Tie bar film 2
An appropriate amount of insulating resin 7 is applied to a part of the. In the above configuration, when the outer leads 4 are connected to the semiconductor element driving device (not shown), an electric signal flows through the outer leads 4, the inner leads 3 and the bumps 5, and the semiconductor element 1
Will be driven. The insulating resin 7 blocks the outside air and reinforces the joint between the electrode pad 4 and the inner lead 3.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら上記従来
の構成では、半導体素子１は絶縁樹脂７によって外気に
含まれる湿気や腐食性イオンを遮断され、品質，信頼性
を保っているが、絶縁樹脂７の塗布条件が不安定な場合
や絶縁樹脂７自体の特性がロット間で変動したりする
と、塗布した絶縁樹脂７の内部に気泡が発生したり、そ
の気泡がもとでピンホールが発生し、品質，信頼性が低
下するという課題を有していた。また、絶縁樹脂７が不
透明である場合、表面のピンホールは外観で良否の判定
が可能であるが、内部欠陥である気泡は外観での判定が
困難であった。また、タイバーフィルム２は絶縁樹脂７
の流れ止め及びインナーリード３の補強のため必要とさ
れ、そのタイバーフィルムの面積分だけ実装面積が大き
くなり、高密度実装の妨げになっていた。However, in the above-mentioned conventional structure, the semiconductor element 1 is shielded by the insulating resin 7 from moisture and corrosive ions contained in the outside air, so that the quality and reliability are maintained. If the coating condition of is unstable or the characteristics of the insulating resin 7 itself varies from lot to lot, bubbles are generated inside the coated insulating resin 7 or pinholes are generated due to the bubbles. The problem was that quality and reliability declined. Further, when the insulating resin 7 is opaque, it is possible to determine the quality of the pinholes on the surface by appearance, but it is difficult to determine the appearance of air bubbles that are internal defects. Also, the tie bar film 2 is made of insulating resin 7.
It is necessary to prevent the flow of the inner lead 3 and to reinforce the inner lead 3, and the mounting area is increased by the area of the tie bar film, which hinders high-density mounting.
【０００６】本発明は上記従来の課題を解決するもの
で、半導体素子の品質及び信頼性が確保できるフィルム
キャリア実装半導体装置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a film carrier-mounted semiconductor device in which the quality and reliability of semiconductor elements can be ensured.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明のフィルムキャリア実装半導体装置は、半導体
素子の回路配線面に絶縁樹脂を介して補強板を配した構
成を有している。To achieve this object, the film carrier-mounted semiconductor device of the present invention has a structure in which a reinforcing plate is arranged on the circuit wiring surface of a semiconductor element via an insulating resin.
【０００８】[0008]
【作用】この構成によって、絶縁樹脂にピンホールや気
泡が発生したとしても、それを通じて外気から湿気など
が浸入することを防止し、半導体素子の品質，信頼性を
向上させることができ、さらに補強板は絶縁樹脂の広が
りを規制する働きとインナーリードを補強する働きとが
あるのでインナーリードを規定の位置で任意の角度に折
り曲げることができる。With this structure, even if pinholes or bubbles are generated in the insulating resin, it is possible to prevent moisture or the like from entering from the outside through them, and improve the quality and reliability of the semiconductor element. Since the plate has a function of restricting the spread of the insulating resin and a function of reinforcing the inner lead, the inner lead can be bent at a predetermined position at an arbitrary angle.
【０００９】[0009]
【実施例】（実施例１）以下本発明の第１の実施例につ
いて、図面を参照しながら説明する。(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.
【００１０】図１は本発明の第１の実施例におけるフィ
ルムキャリア実装半導体装置の平面図、図２図１をＡ−
Ａ′線で切断した断面図である。これらの図において、
図５及び図６に示す従来例と同一箇所には同一符号を付
して詳細説明を省略した。FIG. 1 is a plan view of a semiconductor device mounted with a film carrier according to the first embodiment of the present invention, and FIG.
It is sectional drawing cut | disconnected by the A'line. In these figures,
The same parts as those in the conventional example shown in FIGS. 5 and 6 are designated by the same reference numerals and detailed description thereof is omitted.
【００１１】すなわち、本発明の特徴とするところは、
金属板等からなる補強板８ａで、補強板８ａの大きさは
半導体素子１の回路配線面と同等又はそれ以下の表面積
を有する点である。半導体素子１の表面に形成された電
極パッド６はバンプ５を介してタイバーフィルム２に保
持されたインナーリード３に接続され、さらに半導体素
子１の回路配線面に不透明な絶縁樹脂７を塗布した後、
半導体素子１の回路配線面の中心と補強板８ａの中心が
合うように張り合わせ、絶縁樹脂７を熱硬化し、補強板
８ａを接着固定する。That is, the feature of the present invention is that
In the reinforcing plate 8a made of a metal plate or the like, the reinforcing plate 8a has a size equal to or smaller than the circuit wiring surface of the semiconductor element 1. The electrode pads 6 formed on the surface of the semiconductor element 1 are connected to the inner leads 3 held by the tie bar film 2 via the bumps 5, and after the circuit wiring surface of the semiconductor element 1 is coated with an opaque insulating resin 7. ,
The circuit wiring surface of the semiconductor element 1 and the reinforcing plate 8a are attached to each other so that the center thereof is aligned with each other, the insulating resin 7 is thermoset, and the reinforcing plate 8a is adhesively fixed.
【００１２】このように第１の実施例によれば、半導体
素子１に接着された補強板８ａは外気に含まれる湿気や
腐食性イオンなど半導体素子１の特性劣化を招くような
ものを遮断するので、ピンホールや気泡が絶縁樹脂７の
内部に存在したとしても半導体素子１は特性劣化を起こ
すことはなく、品質，信頼性を確保できる。As described above, according to the first embodiment, the reinforcing plate 8a adhered to the semiconductor element 1 shields the elements such as moisture and corrosive ions contained in the outside air, which may deteriorate the characteristics of the semiconductor element 1. Therefore, even if pinholes or bubbles exist inside the insulating resin 7, the semiconductor element 1 does not deteriorate in characteristics, and quality and reliability can be secured.
【００１３】（実施例２）以下本発明の第２の実施例に
ついて、図面を参照しながら説明する。(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.
【００１４】図３は本発明の第２の実施例におけるフィ
ルムキャリア実装半導体装置の平面図、図４は図３をＡ
−Ａ′線で切断した断面図である。これらの図におい
て、１は半導体素子、２ａ，２ｂ，２ｃ，２ｄはタイバ
ーフィルム、３はインナーリード、４はアウターリー
ド、５はバンプ、６は電極パッド、７は絶縁樹脂、８ｂ
は金属板等の補強板である。半導体素子１の表面に形成
された電極パッド６はバンプ５を介してタイバーフィル
ム２ａ，２ｂ，２ｃ，２ｄに保持されたインナーリード
３に接続され、不透明な絶縁樹脂７を適量塗布した後、
半導体素子１の回路配線面の表面積より大きい表面積の
補強板８ｂを所定の位置に張り合わせ、絶縁樹脂７を熱
硬化、補強板８ｂを接着固定する。さらにインナーリー
ド３は補強板８ｂの側面近傍で下向きに折り曲げられて
いる。FIG. 3 is a plan view of a semiconductor device mounted with a film carrier according to the second embodiment of the present invention, and FIG.
FIG. 6 is a cross-sectional view taken along line A ′. In these figures, 1 is a semiconductor element, 2a, 2b, 2c and 2d are tie bar films, 3 is an inner lead, 4 is an outer lead, 5 is a bump, 6 is an electrode pad, 7 is an insulating resin, and 8b.
Is a reinforcing plate such as a metal plate. The electrode pad 6 formed on the surface of the semiconductor element 1 is connected to the inner lead 3 held by the tie bar films 2a, 2b, 2c, 2d via the bump 5, and after applying an appropriate amount of the opaque insulating resin 7,
A reinforcing plate 8b having a surface area larger than the surface area of the circuit wiring surface of the semiconductor element 1 is attached to a predetermined position, the insulating resin 7 is thermoset, and the reinforcing plate 8b is adhesively fixed. Further, the inner lead 3 is bent downward near the side surface of the reinforcing plate 8b.
【００１５】このように第２の実施例によれば、絶縁樹
脂７は半導体素子１の外形よりはみ出した補強板８ｂの
面全体に流れ、その面直下にあるインナーリード３は接
着固定されるので、補強板８ｂの側面近傍でインナーリ
ード３を折り曲げてもインナーリード３と電極パッド６
の接続部に応力が加わることなく折り曲げることができ
る。As described above, according to the second embodiment, the insulating resin 7 flows over the entire surface of the reinforcing plate 8b protruding from the outer shape of the semiconductor element 1, and the inner leads 3 immediately below the surface are bonded and fixed. Even if the inner lead 3 is bent near the side surface of the reinforcing plate 8b, the inner lead 3 and the electrode pad 6 may be bent.
It can be bent without applying stress to the connection part.
【００１６】また、タイバーフィルム２ａ，２ｂ，２
ｃ，２ｄの幅は少なくとも１mmあるがインナーリード３
を垂直に曲げることによりその幅は存在しないも同然と
なり、その分実装面積が少なくなる。Further, the tie bar films 2a, 2b, 2
The width of c and 2d is at least 1mm, but inner lead 3
By bending the board vertically, the width does not exist, but the mounting area is reduced accordingly.
【００１７】なお上記第１，第２の実施例では、半導体
素子１の表面に塗布する絶縁樹脂７を熱硬化性の絶縁樹
脂としているが、熱硬化性の絶縁樹脂の代わりに光硬化
性の絶縁樹脂を用い、補強板８ａ，８ｂは金属板の代わ
りに光学ガラスまたは透過性の樹脂板を用いても良い。
この場合光硬化性樹脂を用い紫外線で絶縁樹脂７を硬化
することができるため、作業性が向上し、固体撮像素子
の実装に応用して顕著な効果を奏する。In the first and second embodiments, the insulating resin 7 applied to the surface of the semiconductor element 1 is a thermosetting insulating resin, but a photocurable insulating resin is used instead of the thermosetting insulating resin. An insulating resin may be used, and the reinforcing plates 8a and 8b may use optical glass or a transparent resin plate instead of the metal plate.
In this case, since the insulating resin 7 can be cured by ultraviolet rays using a photo-curable resin, workability is improved, and it is applied to mounting a solid-state image sensor, and a remarkable effect is exhibited.
【００１８】[0018]
【発明の効果】以上のように本発明は、半導体素子の回
路配線面に補強板を接着固定することにより、半導体素
子の表面に塗布した絶縁樹脂にピンホールや気泡が存在
したとしても半導体素子の品質，信頼性が確保でき、さ
らに従来不可能であったインナーリードからの折り曲げ
が可能となるため、実装密度が向上する優れたフィルム
キャリア実装半導体装置を実現できるものである。As described above, according to the present invention, the reinforcing plate is adhered and fixed to the circuit wiring surface of the semiconductor element, so that even if the insulating resin applied to the surface of the semiconductor element has pinholes or bubbles, Since it is possible to secure the quality and reliability of the semiconductor device and to bend it from the inner lead, which has been impossible in the past, it is possible to realize an excellent film carrier-mounted semiconductor device with an improved packaging density.
【図１】本発明の第１の実施例におけるフィルムキャリ
ア実装半導体装置の平面図FIG. 1 is a plan view of a film carrier-mounted semiconductor device according to a first embodiment of the present invention.
【図２】同フィルムキャリア実装半導体装置の断面図FIG. 2 is a sectional view of the semiconductor device mounted with the film carrier.
【図３】本発明の第２の実施例におけるフィルムキャリ
ア実装半導体装置の平面図FIG. 3 is a plan view of a film carrier-mounted semiconductor device according to a second embodiment of the present invention.
【図４】同フィルムキャリア実装半導体装置の断面図FIG. 4 is a sectional view of the semiconductor device mounted with the film carrier.
【図５】従来のフィルムキャリア実装半導体装置の平面
図FIG. 5 is a plan view of a conventional semiconductor device mounted with a film carrier.
【図６】同フィルムキャリア実装半導体装置の断面図FIG. 6 is a sectional view of the semiconductor device mounted with the film carrier.
１ 半導体素子 ３ インナーリード ８ａ 補強板 1 Semiconductor element 3 inner lead 8a Reinforcing plate
Claims (4)
続した半導体素子の回路配線面に補強板を接着固定した
ことを特徴とするフィルムキャリア実装半導体装置。1. A semiconductor device mounted on a film carrier, wherein a reinforcing plate is bonded and fixed to a circuit wiring surface of a semiconductor element connected to an inner lead of the film carrier.
積より大きいことを特徴とする請求項１記載のフィルム
キャリア実装半導体装置。2. The film carrier-mounted semiconductor device according to claim 1, wherein the reinforcing plate is larger than the surface area of the circuit wiring surface of the semiconductor element.
または２記載のフィルムキャリア実装半導体装置。3. The reinforcing plate is made of a light transmissive member.
Alternatively, the film carrier-mounted semiconductor device according to the item 2.
板が光透過性部材からなる請求項１または２記載のフィ
ルムキャリア実装半導体装置。4. The film carrier-mounted semiconductor device according to claim 1, wherein the semiconductor element is a solid-state image pickup element, and the reinforcing plate is made of a light transmissive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186073A JPH0529385A (en) | 1991-07-25 | 1991-07-25 | Semiconductor device mounted on film carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3186073A JPH0529385A (en) | 1991-07-25 | 1991-07-25 | Semiconductor device mounted on film carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0529385A true JPH0529385A (en) | 1993-02-05 |
Family
ID=16181916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3186073A Pending JPH0529385A (en) | 1991-07-25 | 1991-07-25 | Semiconductor device mounted on film carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529385A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0660407A1 (en) * | 1993-12-20 | 1995-06-28 | Tomoegawa Paper Co. Ltd. | Adhesive for semiconductor device and reinforcing material using the same |
| US5707730A (en) * | 1993-12-20 | 1998-01-13 | Tomoegawa Paper Co. Ltd. | Adhesive for semiconductor device and reinforcing material using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63289944A (en) * | 1987-05-22 | 1988-11-28 | Olympus Optical Co Ltd | Semiconductor device |
| JPH03125440A (en) * | 1989-10-09 | 1991-05-28 | Rohm Co Ltd | Electronic parts |
-
1991
- 1991-07-25 JP JP3186073A patent/JPH0529385A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63289944A (en) * | 1987-05-22 | 1988-11-28 | Olympus Optical Co Ltd | Semiconductor device |
| JPH03125440A (en) * | 1989-10-09 | 1991-05-28 | Rohm Co Ltd | Electronic parts |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0660407A1 (en) * | 1993-12-20 | 1995-06-28 | Tomoegawa Paper Co. Ltd. | Adhesive for semiconductor device and reinforcing material using the same |
| US5707730A (en) * | 1993-12-20 | 1998-01-13 | Tomoegawa Paper Co. Ltd. | Adhesive for semiconductor device and reinforcing material using the same |
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