JPH09199701A - Solid-state image pick-up device - Google Patents
Solid-state image pick-up deviceInfo
- Publication number
- JPH09199701A JPH09199701A JP8021652A JP2165296A JPH09199701A JP H09199701 A JPH09199701 A JP H09199701A JP 8021652 A JP8021652 A JP 8021652A JP 2165296 A JP2165296 A JP 2165296A JP H09199701 A JPH09199701 A JP H09199701A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- imaging device
- state imaging
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、固体撮像素子の
受光エリアのみを受光面に空間を設けて気密封止する固
体撮像装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device in which only a light-receiving area of a solid-state image pickup element is hermetically sealed by providing a space on a light-receiving surface.
【０００２】[0002]
【従来の技術】一般に、受光効率を向上させるため、固
体撮像素子の受光エリアにはマイクロレンズが画素に対
応して設けられている。そして、このようにオンチップ
マイクロレンズを備えた固体撮像素子の受光エリアのみ
を気密封止するには、図４に示すように、下面の縁部に
枠部104 を一体的に形成した光学部品等の透明材料から
なる封止部材103 を用いて、固体撮像素子101 のマイク
ロレンズ102 を設けた受光エリアのみを気密封止してい
る。なお図４において、105 は基板、106 は固体撮像素
子101 と基板105 とを電気的に接続するボンディングワ
イヤ、107 は接続部を封止するための封止樹脂である。2. Description of the Related Art Generally, in order to improve the light receiving efficiency, a microlens is provided corresponding to a pixel in a light receiving area of a solid-state image pickup device. Then, in order to hermetically seal only the light receiving area of the solid-state imaging device having the on-chip microlens in this manner, as shown in FIG. 4, an optical component integrally formed with a frame 104 at the edge of the lower surface. A sealing member 103 made of a transparent material such as is used to hermetically seal only the light receiving area of the solid-state imaging device 101 in which the microlenses 102 are provided. In FIG. 4, 105 is a substrate, 106 is a bonding wire for electrically connecting the solid-state imaging device 101 and the substrate 105, and 107 is a sealing resin for sealing the connection portion.
【０００３】[0003]
【発明が解決しようとする課題】ところで、従来の固体
撮像素子の受光エリアのみを受光面に空間を設けて気密
封止した固体撮像装置においては、封止部材は光学部品
を形成する上で、固体撮像素子の受光エリアと接合する
枠部を一体的に形成する必要があり、また封止部材の凹
部の裏面を光学的平面に仕上げる必要があるが、その加
工が難しく、非常に高価なものとなってしまうという問
題点があった。更にまた、封止部材の固体撮像素子への
接着時の位置合わせも、非常に難しいという問題点もあ
る。By the way, in the conventional solid-state image pickup device in which only the light-receiving area of the solid-state image pickup device is hermetically sealed by providing a space on the light-receiving surface, the sealing member forms an optical component. It is necessary to integrally form a frame portion that joins with the light receiving area of the solid-state image sensor, and it is necessary to finish the recessed surface of the sealing member to be an optical plane, but this is difficult to process and extremely expensive. There was a problem that became. Furthermore, there is a problem that it is very difficult to align the sealing member when it is bonded to the solid-state image sensor.
【０００４】本発明は、従来の固体撮像装置における上
記問題点を解消するためになされたもので、請求項１記
載の発明は、固体撮像素子の受光エリアのみを受光面に
空間を設けて容易に気密封止することの可能な固体撮像
装置を提供することを目的とする。また請求項２記載の
発明は、固体撮像素子と実装用基板とのボンディング時
の配線パターンの位置ずれを防止し、合わせ精度を向上
させることの可能な請求項１記載の固体撮像装置を提供
することを目的とする。また請求項３記載の発明は、更
に小型実装が可能な請求項１記載の固体撮像装置を提供
することを目的とする。The present invention has been made in order to solve the above problems in the conventional solid-state image pickup device. In the invention described in claim 1, only the light-receiving area of the solid-state image pickup element is easily provided by providing a space on the light-receiving surface. An object of the present invention is to provide a solid-state imaging device that can be hermetically sealed. The invention according to claim 2 provides the solid-state imaging device according to claim 1, which is capable of preventing the positional deviation of the wiring pattern at the time of bonding the solid-state imaging element and the mounting substrate and improving the alignment accuracy. The purpose is to It is another object of the present invention to provide a solid-state imaging device according to claim 1, which can be mounted in a smaller size.
【０００５】[0005]
【課題を解決するための手段】上記問題点を解決するた
め、請求項１記載の発明は、固体撮像素子の受光エリア
のみを受光面に空間を設けて気密封止した固体撮像装置
において、配線パターンを備えた固体撮像素子実装用基
板に固体撮像素子受光エリアの気密封止用枠を一体的に
形成し、該基板の気密封止用枠の一面に受光エリアの外
縁部を対向させて固体撮像素子を実装させると共に、前
記気密封止用枠の他面に光学部品を載置し封止するもの
である。In order to solve the above problems, the invention according to claim 1 is a solid-state image pickup device in which only the light-receiving area of the solid-state image pickup element is airtightly sealed by providing a space on the light-receiving surface. A solid-state image sensor mounting substrate provided with a pattern is integrally formed with a frame for hermetically sealing the light-receiving area of the solid-state image sensor, and the outer edge portion of the light-receiving area is opposed to one surface of the frame for air-tight sealing of the substrate to form a solid state. An image pickup device is mounted, and an optical component is placed and sealed on the other surface of the hermetically sealing frame.
【０００６】このように、固体撮像素子実装用基板に気
密封止用枠を一体的に形成しているので、別個に気密封
止用枠を形成する必要がなく、また光学部品に気密封止
用枠を一体的に形成する必要もないので、固体撮像素子
の受光エリアのみを受光面に空間を設けて容易に気密封
止することができる。また固体撮像素子を実装用基板に
実装することにより、気密封止用枠の位置を必然的に受
光エリアに合わせることができ、気密封止用枠の位置合
わせを行う必要がなくなる。As described above, since the airtight sealing frame is integrally formed on the solid-state image pickup device mounting substrate, it is not necessary to separately form the airtight sealing frame, and the optical component is airtightly sealed. Since it is not necessary to integrally form the use frame, only the light receiving area of the solid-state image sensor can be easily hermetically sealed by providing a space on the light receiving surface. Further, by mounting the solid-state imaging device on the mounting substrate, the position of the hermetically sealing frame can be necessarily aligned with the light receiving area, and it is not necessary to align the hermetically sealing frame.
【０００７】請求項２記載の発明は、請求項１記載の固
体撮像装置の固体撮像素子実装用基板において、前記配
線パターンを前記気密封止用枠まで延長して形成するも
のである。このように構成することにより、固体撮像素
子をボンディングする時に配線パターンの位置ずれを起
こしにくく、ボンディング時の合わせ精度を向上させる
ことができる。According to a second aspect of the present invention, in the solid-state image pickup element mounting substrate of the solid-state image pickup device according to the first aspect, the wiring pattern is extended to the hermetically sealing frame. With this configuration, it is possible to prevent the displacement of the wiring pattern from occurring when the solid-state imaging device is bonded, and it is possible to improve the alignment accuracy during bonding.
【０００８】請求項３記載の発明は、請求項１記載の固
体撮像装置の固体撮像素子実装用基板において、前記気
密封止用枠が前記配線パターンのみによって保持される
ように構成するものである。このように構成することに
よって、固体撮像素子を実装用基板に実装した後、実装
用基板を容易に折り曲げることができ、一層の小型化を
図ることが可能となる。According to a third aspect of the present invention, in the solid-state image sensor mounting substrate of the solid-state image pickup device according to the first aspect, the hermetically sealing frame is held only by the wiring pattern. . With this configuration, after mounting the solid-state imaging device on the mounting substrate, the mounting substrate can be easily bent, and the size can be further reduced.
【０００９】[0009]
【発明の実施の形態】次に、実施の形態について説明す
る。図１の（Ａ）は本発明に係る固体撮像装置の第１の
実施の形態における固体撮像素子実装用基板を示す平面
図であり、図１の（Ｂ）は図１の（Ａ）に示した実装用
基板に固体撮像素子を実装してなる固体撮像装置の封止
樹脂を省略して示す平面図であり、図１の（Ｃ）は第１
の実施の形態を示す断面図である。Next, an embodiment will be described. 1A is a plan view showing a substrate for mounting a solid-state image pickup element in a first embodiment of a solid-state image pickup device according to the present invention, and FIG. 1B is shown in FIG. It is a top view which abbreviate | omitted the sealing resin of the solid-state imaging device which mounts the solid-state imaging element on the mounting board, and (C) of FIG.
3 is a cross-sectional view showing the embodiment of FIG.
【００１０】第１の実施の形態は、請求項１記載の発明
に対応する実施の形態であり、図１の（Ａ）〜（Ｃ）に
おいて、１は実装用基板で、固体撮像素子６のマイクロ
レンズ８を備えた受光エリア７及びボンディングパッド
に形成したバンプ９の配置領域に対応する部分に、受光
部用開孔部10とボンディング用開孔部11をそれぞれ設け
ることにより、固体撮像素子受光エリア７の外縁部に対
応する部分に気密封止用枠３が形成されている。そし
て、配線パターン２が、その先端の実装部４がボンディ
ング用開孔部11に位置するように、実装用基板１上に形
成されている。実装用基板１の材質としては、ポリイミ
ド樹脂，ガラス繊維入りエポキシ樹脂，エポキシ樹脂，
セラミック，シリコン，メタル，ガラス，石英等が用い
られる。またバンプ９の材質としては、金，ハンダ，
銅，銀等が用いられる。The first embodiment is an embodiment corresponding to the invention described in claim 1. In FIGS. 1A to 1C, 1 is a mounting substrate, which is a solid-state image sensor 6. By providing the light receiving portion opening portion 10 and the bonding opening portion 11 in the light receiving area 7 including the microlens 8 and the area where the bumps 9 formed on the bonding pad are arranged, respectively, An airtight sealing frame 3 is formed in a portion corresponding to the outer edge of the area 7. The wiring pattern 2 is formed on the mounting substrate 1 so that the mounting portion 4 at the tip thereof is located in the bonding opening portion 11. As the material of the mounting substrate 1, polyimide resin, glass fiber-containing epoxy resin, epoxy resin,
Ceramic, silicon, metal, glass, quartz, etc. are used. The material of the bump 9 is gold, solder,
Copper, silver, etc. are used.
【００１１】以上のように形成された実装用基板１に、
図１の（Ｂ），（Ｃ）に示すように、実装用基板１の配
線パターン２の実装部４と固体撮像素子６のボンディン
グパッドに形成したバンプ９とを位置合わせを行ってボ
ンディングし、固体撮像素子６を実装する。上記ボンデ
ィング方法としては、超音波接合、熱圧着、超音波併用
熱圧着、ハンダ、導電性樹脂、異方性導電性樹脂、導電
性シート、異方性導電性シート等が用いられる。On the mounting substrate 1 formed as described above,
As shown in FIGS. 1B and 1C, the mounting portion 4 of the wiring pattern 2 of the mounting substrate 1 and the bumps 9 formed on the bonding pads of the solid-state imaging device 6 are aligned and bonded, The solid-state image sensor 6 is mounted. As the above-mentioned bonding method, ultrasonic bonding, thermocompression bonding, thermocompression bonding using ultrasonic waves, solder, conductive resin, anisotropic conductive resin, conductive sheet, anisotropic conductive sheet and the like are used.
【００１２】固体撮像素子６を実装用基板１の配線パタ
ーン２の実装部４にボンディングした後、実装用基板１
の気密封止用枠３の上に光学部品５を位置合わせして載
置し、荷重を加えながら気密封止用枠３及び光学部品５
の側面を、封止樹脂12で封止する。その時、配線パター
ン２の実装部４と固体撮像素子６のバンプ９との接続部
も、合わせて封止樹脂12で封止してもよい。前記光学部
品５としては、ガラス板，石英板，プリズム，レンズ，
フィルタ等があり、封止樹脂12としては、エポキシ系，
ポリイミド系，シリコン系，フェノール系，アクリル系
等のものを用いることができる。After the solid-state image sensor 6 is bonded to the mounting portion 4 of the wiring pattern 2 of the mounting substrate 1, the mounting substrate 1 is mounted.
The optical component 5 is aligned and placed on the airtight sealing frame 3 and the frame 3 and the optical component 5 are sealed while applying a load.
The side surface of is sealed with a sealing resin 12. At that time, the connecting portion between the mounting portion 4 of the wiring pattern 2 and the bump 9 of the solid-state image pickup device 6 may also be sealed with the sealing resin 12. The optical component 5 includes a glass plate, a quartz plate, a prism, a lens,
There is a filter, etc., and the sealing resin 12 is an epoxy resin,
A polyimide type, a silicon type, a phenol type, an acrylic type or the like can be used.
【００１３】以上のように構成することにより、簡単に
固体撮像素子の受光エリアのみを受光面に空間を設けて
気密封止することができ、小型化が可能で作業が容易で
あり、コストの低減も図ることができる。With the above arrangement, only the light receiving area of the solid-state image pickup device can be easily airtightly sealed by providing a space on the light receiving surface, and the size can be reduced, the work is easy, and the cost can be reduced. It can also be reduced.
【００１４】次に、第２の実施の形態について説明す
る。図２の（Ａ）は第２の実施の形態の一部を省略して
示す平面図で、図２の（Ｂ）は断面図であり、図１の
（Ａ）〜（Ｃ）に示した第１の実施の形態と同一又は対
応する部材には、同一符号を付して示している。この実
施の形態は、請求項２記載の発明に対応するもので、第
１の実施の形態と同様に、実装用基板１には、固体撮像
素子６のマイクロレンズ８を備えた受光エリア７及びボ
ンディングパッドに形成したバンプ９の配置領域に対応
する部分に、受光部用開孔部10とボンディング用開孔部
11をそれぞれ設けることにより、固体撮像素子受光エリ
ア７の外縁部に対応する部分に気密封止用枠３が形成さ
れている。そして、配線パターン２の先端は前記気密封
止用枠３に延長して配設され、その実装部４がボンディ
ング用開孔部11に位置するように形成されている。Next, a second embodiment will be described. 2A is a plan view showing a part of the second embodiment with a part thereof omitted, and FIG. 2B is a cross-sectional view shown in FIGS. 1A to 1C. The same or corresponding members as those in the first embodiment are designated by the same reference numerals. This embodiment corresponds to the invention described in claim 2, and, like the first embodiment, the mounting substrate 1 has a light receiving area 7 including the microlenses 8 of the solid-state imaging device 6 and The light receiving portion opening portion 10 and the bonding opening portion are formed in the portion corresponding to the arrangement area of the bumps 9 formed on the bonding pad.
By providing 11 respectively, the airtight sealing frame 3 is formed in the portion corresponding to the outer edge portion of the solid-state image sensor light receiving area 7. The tip of the wiring pattern 2 is provided so as to extend to the hermetically sealing frame 3, and the mounting portion 4 is formed so as to be located in the bonding opening portion 11.
【００１５】このように構成された実装用基板１の配線
パターン２の実装部４と固体撮像素子６のバンプ９とを
位置合わせを行ってボンディングする。次いで、気密封
止用枠３の上に光学部品５を位置合わせして載置し、荷
重を加えながら気密封止用枠３及び光学部品５の側面
を、封止樹脂12で封止する。その際、配線パターン２の
実装部４と固体撮像素子６のバンプ９との接続部も、合
わせて封止樹脂12で封止してもよい。The mounting portion 4 of the wiring pattern 2 of the mounting substrate 1 thus constructed and the bumps 9 of the solid-state image sensor 6 are aligned and bonded. Next, the optical component 5 is aligned and placed on the hermetic sealing frame 3, and the side faces of the hermetic sealing frame 3 and the optical component 5 are sealed with the sealing resin 12 while applying a load. At that time, the connecting portion between the mounting portion 4 of the wiring pattern 2 and the bump 9 of the solid-state image pickup device 6 may be also sealed with the sealing resin 12.
【００１６】なお、上記実装用基板１の材質、バンプ９
の材質、光学部品としては、第１の実施の形態と同様の
ものを用いることができ、また配線パターン２の実装部
４と固体撮像素子６のバンプ９とのボンディング方法と
しては、第１の実施の形態と同様な手段を用いることが
できる。The material of the mounting substrate 1 and the bumps 9
The same materials and optical components as those in the first embodiment can be used, and the first bonding method for the mounting portion 4 of the wiring pattern 2 and the bumps 9 of the solid-state imaging device 6 is the same. The same means as in the embodiment can be used.
【００１７】以上のように構成することにより、簡単に
固体撮像素子の受光エリアのみを受光面に空間を設けて
気密封止することができ、小型化が可能で作業が容易で
あり、コストの低減も図れる。更に、実装用基板の配線
パターンが気密封止用枠の一部に延長して配設されてい
るため、配線パターンの実装部の位置ずれが起きにく
く、ボンディング時の合わせ精度を向上させることがで
きる。With the above structure, only the light receiving area of the solid-state image pickup device can be easily hermetically sealed by providing a space on the light receiving surface, and the size can be reduced, the work is easy, and the cost is low. It can be reduced. Further, since the wiring pattern of the mounting substrate is arranged to extend to a part of the hermetically sealing frame, it is difficult for the mounting portion of the wiring pattern to be displaced, and the alignment accuracy at the time of bonding can be improved. it can.
【００１８】次に、第３の実施の形態について説明す
る。図３の（Ａ）は第３の実施の形態の一部を省略して
示す平面図で、図３の（Ｂ）は断面図であり、図１の
（Ａ）〜（Ｃ）に示した第１の実施の形態と同一又は対
応する部材には、同一符号を付して示している。この実
施の形態は、請求項３記載の発明に対応するもので、図
３の（Ａ），（Ｂ）において、１は実装用基板で、固体
撮像素子６のマイクロレンズ８を備えた受光エリア７に
対応する部分に受光部用開孔部10を形成すると共に、固
体撮像素子６のボンディングパッドに形成したバンプ９
の配置領域に対応する部分の実装用基板１を切除して、
ボンディング用切除部13を形成し、固体撮像素子６の受
光エリア７の外縁部に対応する部分に気密封止用枠３を
形成する。そして、配線パターン２の先端を前記気密封
止用枠３に延長して配設して、気密封止用枠３が配線パ
ターン２のみで保持されるように構成すると共に、配線
パターン２の実装部４がボンディング用切除部13に位置
するように形成されている。Next, a third embodiment will be described. FIG. 3A is a plan view showing a part of the third embodiment with a part thereof omitted, and FIG. 3B is a sectional view, which is shown in FIGS. The same or corresponding members as those in the first embodiment are designated by the same reference numerals. This embodiment corresponds to the invention described in claim 3, and in FIGS. 3A and 3B, reference numeral 1 denotes a mounting substrate, which is a light-receiving area including the microlens 8 of the solid-state imaging device 6. A hole 9 for a light receiving portion is formed in a portion corresponding to 7 and a bump 9 formed on a bonding pad of the solid-state imaging device 6
The mounting substrate 1 of the portion corresponding to the arrangement area of is cut off,
The cutting portion 13 for bonding is formed, and the hermetically sealing frame 3 is formed in a portion corresponding to the outer edge portion of the light receiving area 7 of the solid-state image pickup element 6. Then, the tip of the wiring pattern 2 is extended to the airtight sealing frame 3 so that the airtight sealing frame 3 is held only by the wiring pattern 2 and the wiring pattern 2 is mounted. The portion 4 is formed so as to be located in the cutting portion 13 for bonding.
【００１９】このように構成された実装用基板１の配線
パターン２の実装部４と固体撮像素子６のバンプ９とを
位置合わせを行ってボンディングする。次いで、気密封
止用枠３の上に光学部品５を位置合わせして載置し、荷
重を加えながら気密封止用枠３及び光学部品５の側面
を、封止樹脂12で封止する。その際、配線パターン２の
実装部４と固体撮像素子６のバンプ９との接続部も、合
わせて封止樹脂12で封止してもよい。The mounting portion 4 of the wiring pattern 2 of the mounting substrate 1 thus constructed and the bumps 9 of the solid-state image sensor 6 are aligned and bonded. Next, the optical component 5 is aligned and placed on the hermetic sealing frame 3, and the side faces of the hermetic sealing frame 3 and the optical component 5 are sealed with the sealing resin 12 while applying a load. At that time, the connecting portion between the mounting portion 4 of the wiring pattern 2 and the bump 9 of the solid-state image pickup device 6 may be also sealed with the sealing resin 12.
【００２０】なお、上記実装用基板１の材質、バンプ９
の材質、光学部品としては、第１の実施の形態と同様の
ものを用いることができ、また配線パターン２の実装部
４と固体撮像素子６のバンプ９とのボンディング方法と
しても、第１の実施の形態と同様な手段を用いることが
できる。The material of the mounting substrate 1 and the bumps 9
The same materials and optical components as those in the first embodiment can be used, and the bonding method between the mounting portion 4 of the wiring pattern 2 and the bumps 9 of the solid-state image sensor 6 can be the same as in the first embodiment. The same means as in the embodiment can be used.
【００２１】以上のように構成することにより、簡単に
固体撮像素子の受光エリアのみを受光面に空間を設けて
気密封止することができ、小型化が可能で作業が容易で
あり、コストの低減も図れる。更に、実装用基板１の気
密封止用枠３は配線パターンのみで保持されるように形
成されているので、固体撮像素子を実装用基板に実装し
た後、図３の（Ｃ）に示すように、ボンディング用切除
部13において、実装用基板１を固体撮像素子６の側面に
沿うように容易に折り曲げることができ、一層の小型化
を図ることができる。With the above-mentioned structure, only the light receiving area of the solid-state image pickup device can be easily hermetically sealed by providing a space on the light receiving surface, and the size can be reduced, the work is easy, and the cost is reduced. It can be reduced. Furthermore, since the hermetically sealing frame 3 of the mounting substrate 1 is formed so as to be held only by the wiring pattern, after mounting the solid-state imaging device on the mounting substrate, as shown in FIG. In addition, in the cutting portion 13 for bonding, the mounting substrate 1 can be easily bent along the side surface of the solid-state imaging device 6, and the size can be further reduced.
【００２２】[0022]
【発明の効果】以上実施の形態に基づいて説明したよう
に、請求項１記載の発明によれば、簡単に固体撮像素子
の受光エリアのみを受光面に空間を設けて気密封止する
ことができる。また請求項２記載の発明によれば、配線
パターンの実装部の位置ずれが起きにくく、ボンディン
グ時の合わせ精度を向上させることができる。また請求
項３記載の発明によれば、実装用基板を固体撮像素子の
側面に沿うように容易に折り曲げることができるので、
一層の小型化を図ることができる。As described above based on the embodiment, according to the invention described in claim 1, it is possible to simply provide the light receiving area of the solid-state image pickup element with a space on the light receiving surface to hermetically seal. it can. According to the second aspect of the present invention, the displacement of the mounting portion of the wiring pattern is unlikely to occur, and the alignment accuracy during bonding can be improved. According to the third aspect of the invention, the mounting substrate can be easily bent along the side surface of the solid-state imaging device.
Further miniaturization can be achieved.
【図１】本発明に係る固体撮像装置の第１の実施の形態
を示す図である。FIG. 1 is a diagram showing a first embodiment of a solid-state imaging device according to the present invention.
【図２】本発明の第２の実施の形態を示す図である。FIG. 2 is a diagram showing a second embodiment of the present invention.
【図３】本発明の第３の実施の形態及びその使用態様を
示す図である。FIG. 3 is a diagram showing a third embodiment of the present invention and a mode of use thereof.
【図４】従来の固体撮像装置の構成例を示す図である。FIG. 4 is a diagram showing a configuration example of a conventional solid-state imaging device.
１ 実装用基板 ２ 配線パターン ３ 気密封止用枠 ４ 配線パターンの実装部 ５ 光学部品 ６ 固体撮像素子 ７ 受光エリア ８ マイクロレンズ ９ バンプ 10 受光部用開孔部 11 ボンディング用開孔部 12 封止樹脂 13 ボンディング用切除部 1 Mounting Substrate 2 Wiring Pattern 3 Airtight Sealing Frame 4 Wiring Pattern Mounting Area 5 Optical Component 6 Solid-State Image Sensor 7 Light-Receiving Area 8 Microlens 9 Bump 10 Light-Receiving Area Opening 11 Bonding Opening 12 Sealing Resin 13 Cutting part for bonding
Claims (3)
に空間を設けて気密封止した固体撮像装置において、配
線パターンを備えた固体撮像素子実装用基板に固体撮像
素子受光エリアの気密封止用枠を一体的に形成し、該基
板の気密封止用枠の一面に受光エリアの外縁部を対向さ
せて固体撮像素子を実装させると共に、前記気密封止用
枠の他面に光学部品を載置し封止したことを特徴とする
固体撮像装置。1. A solid-state imaging device in which only a light-receiving area of a solid-state imaging device is hermetically sealed by providing a space on a light-receiving surface, and a solid-state imaging device mounting substrate having a wiring pattern hermetically seals the solid-state imaging device light-receiving area. A frame is integrally formed, the outer edge portion of the light receiving area is opposed to one surface of the hermetically sealing frame of the substrate to mount the solid-state imaging device, and an optical component is provided on the other surface of the hermetically sealing frame. A solid-state imaging device, which is mounted and sealed.
前記配線パターンが前記気密封止用枠まで延長して形成
されていることを特徴とする請求項１記載の固体撮像装
置。2. The substrate for mounting a solid-state image sensor,
The solid-state imaging device according to claim 1, wherein the wiring pattern is formed to extend to the hermetically sealing frame.
前記気密封止用枠が前記配線パターンのみによって保持
されていることを特徴とする請求項１記載の固体撮像装
置。3. The substrate for mounting a solid-state image sensor,
The solid-state imaging device according to claim 1, wherein the hermetically sealing frame is held only by the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8021652A JPH09199701A (en) | 1996-01-16 | 1996-01-16 | Solid-state image pick-up device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8021652A JPH09199701A (en) | 1996-01-16 | 1996-01-16 | Solid-state image pick-up device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09199701A true JPH09199701A (en) | 1997-07-31 |
Family
ID=12060989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8021652A Withdrawn JPH09199701A (en) | 1996-01-16 | 1996-01-16 | Solid-state image pick-up device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09199701A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100354114B1 (en) * | 2000-11-15 | 2002-10-05 | 삼성테크윈 주식회사 | Package for CMOS image sensor and manufacturing method thereof |
| KR100406810B1 (en) * | 2000-04-10 | 2003-11-21 | 미쓰비시덴키 가부시키가이샤 | Imaging Device and Portable Phone |
| JP2004165191A (en) * | 2002-11-08 | 2004-06-10 | Oki Electric Ind Co Ltd | Semiconductor device, method of manufacturing semiconductor device, and camera system |
| JP2005317564A (en) * | 2004-04-26 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Optical device and manufacturing method thereof |
| JP2006173463A (en) * | 2004-12-17 | 2006-06-29 | Dainippon Printing Co Ltd | Sensor module |
| US7110033B2 (en) | 2000-04-07 | 2006-09-19 | Mitsubishi Denki Kabushiki Kaisha | Imaging device having an imaging element mounted on a substrate |
| JP2016054289A (en) * | 2014-08-18 | 2016-04-14 | オプティツ インコーポレイテッド | Wire bond sensor package and method |
-
1996
- 1996-01-16 JP JP8021652A patent/JPH09199701A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7110033B2 (en) | 2000-04-07 | 2006-09-19 | Mitsubishi Denki Kabushiki Kaisha | Imaging device having an imaging element mounted on a substrate |
| KR100406810B1 (en) * | 2000-04-10 | 2003-11-21 | 미쓰비시덴키 가부시키가이샤 | Imaging Device and Portable Phone |
| KR100354114B1 (en) * | 2000-11-15 | 2002-10-05 | 삼성테크윈 주식회사 | Package for CMOS image sensor and manufacturing method thereof |
| JP2004165191A (en) * | 2002-11-08 | 2004-06-10 | Oki Electric Ind Co Ltd | Semiconductor device, method of manufacturing semiconductor device, and camera system |
| US7525167B2 (en) | 2002-11-08 | 2009-04-28 | Oki Semiconductor Co., Ltd. | Semiconductor device with simplified constitution |
| JP2005317564A (en) * | 2004-04-26 | 2005-11-10 | Matsushita Electric Ind Co Ltd | Optical device and manufacturing method thereof |
| JP4686134B2 (en) * | 2004-04-26 | 2011-05-18 | パナソニック株式会社 | Optical device and manufacturing method thereof |
| JP2006173463A (en) * | 2004-12-17 | 2006-06-29 | Dainippon Printing Co Ltd | Sensor module |
| JP2016054289A (en) * | 2014-08-18 | 2016-04-14 | オプティツ インコーポレイテッド | Wire bond sensor package and method |
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| A300 | Withdrawal of application because of no request for examination |
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