JPH05235204A - Manufacture of container for storing electronic components - Google Patents
Manufacture of container for storing electronic componentsInfo
- Publication number
- JPH05235204A JPH05235204A JP4034979A JP3497992A JPH05235204A JP H05235204 A JPH05235204 A JP H05235204A JP 4034979 A JP4034979 A JP 4034979A JP 3497992 A JP3497992 A JP 3497992A JP H05235204 A JPH05235204 A JP H05235204A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic
- ceramic green
- section
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は圧電振動子や弾性表面波
フィルタ等の電子部品を収容するための電子部品収容用
容器の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component housing container for housing electronic components such as piezoelectric vibrators and surface acoustic wave filters.
【０００２】[0002]
【従来技術及びその課題】従来、電子部品、例えば所定
の振動周波数を得る圧電振動子を収容するための電子部
品収納用容器は、一般にアルミナセラミックス等の電気
絶縁材料から成り、上面から側面を介し下面にかけて導
出するタングステン、モリブデン、マンガン等の高融点
金属粉末から成るメタライズ配線層を有する絶縁基体
と、前記絶縁基体上面のメタライズ配線層に導電性接着
材を介して取着され、圧電振動子を保持するとともに該
圧電振動子の電極を外部電気回路と接続する保持金具
と、同じく電気絶縁材料から成る椀状の蓋体とから構成
されており、保持金具上に圧電振動子をポリイミド導電
性樹脂から成る導電性接着材を介して接着保持させると
ともに圧電振動子の各電極を保持金具に電気的に接続さ
せ、しかる後、前記絶縁基体の上面に蓋体を半田等から
成る封止材により接合させ、絶縁基体と蓋体とから成る
容器の内部に圧電振動子を気密に収容することによって
最終製品としての圧電振動素子となる。2. Description of the Related Art Conventionally, an electronic component housing container for housing an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics, and has a top surface and a side surface. An insulating substrate having a metallized wiring layer made of a refractory metal powder such as tungsten, molybdenum, or manganese that is led out to the lower surface, and a metallized wiring layer on the upper surface of the insulating substrate are attached via a conductive adhesive, It is composed of a holding metal fitting for holding and connecting the electrode of the piezoelectric vibrator to an external electric circuit, and a bowl-shaped lid body also made of an electrically insulating material. The electrodes of the piezoelectric vibrator are electrically connected to the holding metal fittings through a conductive adhesive consisting of They are joined by a sealing material comprising a lid on the upper surface of the substrate from the solder or the like, a piezoelectric vibrating element as a final product by accommodating the piezoelectric vibrator hermetically inside a container made of the insulating base and the lid.
【０００３】尚、この従来の電子部品収納用容器は通
常、絶縁基体の下面に導出させたメタライズ配線層に予
めコバール金属や42アロイから成る金属突起がロウ付け
されており、該金属突起によって圧電振動素子を外部の
配線基板に搭載した際、圧電振動素子と配線基板との間
に介在する不要物の洗浄除去が可能となったり、圧電振
動素子と配線基板との接続状態が検査確認ができるよう
になったりしている。Incidentally, in this conventional container for storing electronic parts, a metal projection made of Kovar metal or 42 alloy is normally brazed to a metallized wiring layer led out to the lower surface of an insulating base, and the metal projection causes piezoelectricity. When the vibrating element is mounted on an external wiring board, it is possible to clean and remove unnecessary substances that are interposed between the piezoelectric vibrating element and the wiring board, and the connection state between the piezoelectric vibrating element and the wiring board can be inspected and confirmed. I have become like.
【０００４】かかる従来の前記電子部品収納用容器はそ
の絶縁基体が量産性を考慮し、通常、以下の方法によっ
て製作されている。In the conventional container for storing electronic parts, the insulating substrate is usually manufactured by the following method in consideration of mass productivity.
【０００５】即ち、 (1) まず広面積のセラミックグリーンシートを準備す
る。That is, (1) First, a large area ceramic green sheet is prepared.
【０００６】(2) 次に、前記セラミックグリーンシート
を仮想線で絶縁基体の形状に対応する複数の区画に区分
するとともに各区画の仮想線上に貫通孔を設ける。(2) Next, the ceramic green sheet is divided into a plurality of sections corresponding to the shape of the insulating substrate by virtual lines, and through holes are provided on the virtual lines of each section.
【０００７】(3) 次に前記セラミックグリーンシートの
各区画の上面から貫通孔を介し下面にかけてメタライズ
インクを印刷塗布するとともに該セラミックグリーンシ
ートの仮想線に沿ってスナップ溝を入れる。(3) Next, metallization ink is applied by printing from the upper surface of each section of the ceramic green sheet to the lower surface through the through hole, and snap grooves are formed along the imaginary line of the ceramic green sheet.
【０００８】(4) そして次に前記セラミックグリーンシ
ートを焼成し、各区画毎に上面から貫通孔を介し下面に
かけて導出するメタライズ配線層を被着させたセラミッ
ク焼成体を得るとともに各区画のメタライズ配線層のう
ち下面に導出させた部位に金属突起をロウ付けする。(4) Then, the ceramic green sheet is fired to obtain a ceramic fired body to which a metallized wiring layer extending from the upper surface to the lower surface through the through hole is adhered for each partition, and the metallized wiring of each partition is obtained. A metal projection is brazed to a portion of the layer that is led to the lower surface.
【０００９】(5) 最後に前記セラミック焼成体をスナッ
プ溝に沿って分割し、これよってメタライズ配線層及び
金属突起を有する個々の絶縁基体となす。(5) Finally, the ceramic fired body is divided along the snap grooves to form individual insulating substrates having metallized wiring layers and metal protrusions.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら、この従
来の電子部品収納用容器の製造方法にいては、セラミッ
ク焼成体の各区画に設けたメタライズ配線層に金属突起
をロウ付けする際、ロウ材の一部が貫通孔内に入り込ん
で隣接する区画のメタライズ配線層間を接合させてしま
い、その結果、セラミック焼成体をスナップ溝に沿って
各区画毎に分割し、メタライズ配線層及び金属突起を有
する個々の絶縁基体となす際、その分割がうまくいか
ず、絶縁基体が破損して所望する形状の絶縁基体が得ら
れないという欠点を有していた。However, in this conventional method of manufacturing a container for storing electronic components, when brazing metal projections to the metallized wiring layers provided in each section of the ceramic fired body, the brazing material Part of the metal enters into the through hole and joins the metallized wiring layers of the adjacent sections, and as a result, the ceramic fired body is divided into each section along the snap groove, and the metallized wiring layer and the metal protrusion are individually formed. When it is used as the insulating substrate, the division is not successful, and the insulating substrate is damaged, so that the insulating substrate having a desired shape cannot be obtained.
【００１１】[0011]
【発明の目的】本発明は上記欠点に鑑み案出されたもの
で、その目的は上面から側面を介し下面にかけてメタラ
イズ配線層を有し、且つ該メタライズ配線層の一部に金
属突起を強固にロウ付けした絶縁基体を一度に複数個、
形成することができる電子部品収納用容器の製造方法を
提供することにある。SUMMARY OF THE INVENTION The present invention has been devised in view of the above-described drawbacks, and an object thereof is to have a metallized wiring layer from the upper surface to the side surface to the lower surface, and to firmly form a metal protrusion on a part of the metallized wiring layer. A plurality of brazing insulating substrates at once,
An object of the present invention is to provide a method of manufacturing a container for storing electronic components that can be formed.
【００１２】[0012]
【課題を解決するための手段】本発明はメタライズ配線
層及び金属突起を有する絶縁基体と椀状の蓋体とから成
り、内部に電子部品を収容するための空所を有する電子
部品収納用容器であって、前記絶縁基体が下記(1) 乃至
(5) の工程により形成されていることを特徴とするもの
である。The present invention comprises a container for storing electronic parts, which comprises an insulating substrate having a metallized wiring layer and metal protrusions, and a bowl-shaped lid, and has a space for housing electronic parts therein. Where the insulating substrate has the following (1) to
It is characterized by being formed by the step (5).
【００１３】(1) セラミックグリーンシートを仮想線で
絶縁基体の形状に対応する複数の区画に区分するととも
に各区画の仮想線上に貫通孔を設ける工程と、(2) 前記
セラミックグリーンシートの各区画の上面から貫通孔を
介し下面にかけてメタライズインクを印刷塗布するとと
もにセラミックグリーンシートの下面に印刷塗布された
メタライズインクのうち貫通孔周辺部をセラミックペー
ストで被覆する工程と、(3) 前記セラミックグリーンシ
ートの仮想線に沿ってスナップ溝を入れる工程と(4) 前
記セラミックグリーンシートを焼成し、各区画毎に上面
から貫通孔を介し下面にかけて導出するメタライズ配線
層を被着させたセラミック焼成体を得るとともに各区画
のメタライズ配線層のうち下面に導出させた部位に金属
突起をロウ付けする工程と、(5) 前記セラミック焼成体
をスナップ溝に沿って分割し、メタライズ配線層及び金
属突起を有する個々の絶縁基体となす工程。(1) dividing the ceramic green sheet into a plurality of sections corresponding to the shape of the insulating substrate by imaginary lines and providing through holes on the imaginary lines of each section; (2) each section of the ceramic green sheet A step of printing and applying a metallizing ink from the upper surface to the lower surface through the through hole and covering the through hole peripheral part of the metallizing ink printed and applied on the lower surface of the ceramic green sheet with a ceramic paste, (3) the ceramic green sheet And (4) firing the ceramic green sheet to obtain a ceramic fired body with a metallized wiring layer derived from the upper surface to the lower surface through the through hole is adhered to each section. Together with the step of brazing metal projections to the part of the metallized wiring layer in each section that is led to the bottom surface And (5) a step of dividing the ceramic fired body along snap grooves to form individual insulating substrates having metallized wiring layers and metal protrusions.
【００１４】[0014]
【実施例】次に本発明を添付図面に基づき詳細に説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.
【００１５】図1 は本発明の製造方法によって製造され
る圧電振動子を収容する容器の一実施例を示し、1 は絶
縁基体、2 は蓋体である。この絶縁基体1 と蓋体2 とで
内部に電子部品としての圧電振動子4 を収容する容器3
が構成される。FIG. 1 shows an embodiment of a container containing a piezoelectric vibrator manufactured by the manufacturing method of the present invention, in which 1 is an insulating base and 2 is a lid. A container 3 for accommodating a piezoelectric vibrator 4 as an electronic component inside by the insulating base 1 and the lid 2.
Is configured.
【００１６】前記絶縁基体１は酸化アルミニウム質焼結
体、ムライト質焼結体、窒化アルミニウム質焼結体、炭
化珪素質焼結体等の電気絶縁材料から成り、圧電振動子
4 を保持収容する基体として作用を為す。The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, and a silicon carbide sintered body.
It acts as a base for holding and containing 4.
【００１７】前記絶縁基体1 はまたその上面から側面を
介し下面にかけてタングステン、モリブデン、マンガン
等の高融点金属粉末から成る一対のメタライズ配線層5
が被着形成されており、該一対のメタライズ配線層5 の
各々の絶縁基体1 上面部には圧電振動子4 を保持する保
持部材6 が導電性接着材を介して取着され、また絶縁基
体1 の下面部には外部電気回路基板の配線導体が半田等
のロウ材を介し接続される。The insulating substrate 1 also has a pair of metallized wiring layers 5 made of refractory metal powder such as tungsten, molybdenum, manganese, etc. from the upper surface to the lower surface through the side surfaces.
The holding members 6 for holding the piezoelectric vibrators 4 are attached to the upper surfaces of the insulating bases 1 of the pair of metallized wiring layers 5 via a conductive adhesive material. The wiring conductor of the external electric circuit board is connected to the lower surface of 1 through a brazing material such as solder.
【００１８】また前記絶縁基体1 の上面に被着した一対
のメタライズ配線層5 の各々に取着される保持部材6 は
圧電振動子4 を保持するとともに圧電振動子4 の電極を
メタライズ配線層5 に電気的に接続する作用を為し、保
持部材6 には圧電振動子4 が導電性ポリイミド等の導電
性接着材を介し圧電振動子4 の電極が保持部材6 に導通
するようにして接着固定される。A holding member 6 attached to each of the pair of metallized wiring layers 5 adhered to the upper surface of the insulating substrate 1 holds the piezoelectric vibrator 4 and the electrodes of the piezoelectric vibrator 4 are metalized wiring layer 5. The piezoelectric vibrator 4 is bonded and fixed to the holding member 6 so that the electrodes of the piezoelectric vibrator 4 are electrically connected to the holding member 6 via a conductive adhesive material such as conductive polyimide. To be done.
【００１９】尚、前記保持部材6 は洋白(Cu-Zn-Ni 合
金) やコバール金属(Fe-Ni-Co 合金)、42アロイ(Fe-Ni
合金) 等の弾性を有する金属材料で形成され、例えば、
コバール金属のインゴット( 塊) を従来周知の圧延加工
法や打ち抜き加工法を採用することによって所定の形状
に形成される。The holding member 6 is made of nickel silver (Cu-Zn-Ni alloy), Kovar metal (Fe-Ni-Co alloy), 42 alloy (Fe-Ni alloy).
(Alloy) and other elastic metal materials, for example,
A Kovar metal ingot (lump) is formed into a predetermined shape by adopting a conventionally known rolling method or punching method.
【００２０】また前記絶縁基体1 の下面に導出されたメ
タライズ配線層5 には厚さが0.2mm程度の金属突起7 が
ロウ付けされており、該金属突起7 は絶縁基体1 の下面
に導出するメタライズ配線層5 を外部電気回路基板の配
線導体に接続する際、絶縁基体1 と外部電気回路基板と
の間に適当な大きさの空隙を形成し、メタライズ配線層
5 と外部電気回路基板の配線導体との接続状態を目視で
確認できるように、また絶縁基体1 と外部電気回路基板
との間に介在する不要物を容易に洗浄除去できるように
する作用を為す。Further, a metal projection 7 having a thickness of about 0.2 mm is brazed to the metallized wiring layer 5 led out to the lower surface of the insulating base 1, and the metal projection 7 is led out to the lower surface of the insulating base 1. When the metallized wiring layer 5 is connected to the wiring conductor of the external electric circuit board, a gap of an appropriate size is formed between the insulating substrate 1 and the external electric circuit board.
5 The function of making it possible to visually confirm the connection state between the wiring conductors of the external electric circuit board and the external electric circuit board, and to easily wash and remove unnecessary substances existing between the insulating substrate 1 and the external electric circuit board. ..
【００２１】尚、前記金属突起7 はコバール金属や42ア
ロイ等の金属材料から成り、絶縁基体1 下面のメタライ
ズ配線層5 に銀ロウ等のロウ材を介しロウ付けされる。The metal projection 7 is made of a metal material such as Kovar metal or 42 alloy, and is brazed to the metallized wiring layer 5 on the lower surface of the insulating substrate 1 through a brazing material such as silver brazing.
【００２２】かくしてこの電子部品収納用容器によれ
ば、絶縁基体1 に取着した保持部材6に圧電振動子4 を
導電性接着材により接着し、圧電振動子4 を保持部材6
に保持させた後、蓋体2 の下面を絶縁基体1 に樹脂や低
融点ガラス、ロウ材等の封止材を介して接合させ、絶縁
基体1 と蓋体2 とから成る容器3 内部に圧電振動子4 を
気密に封入することによって製品としての圧電振動素子
となる。Thus, according to this electronic component storage container, the piezoelectric vibrator 4 is adhered to the holding member 6 attached to the insulating substrate 1 by a conductive adhesive material, and the piezoelectric vibrator 4 is held.
After that, the lower surface of the lid 2 is bonded to the insulating base 1 through a sealing material such as resin, low melting point glass, or brazing material, and the piezoelectric material is placed inside the container 3 composed of the insulating base 1 and the lid 2. A piezoelectric vibrating element as a product is obtained by hermetically sealing the vibrator 4.
【００２３】次に前記電子部品収納用容器の絶縁基体の
製造方法について図2 乃至図5 により説明する。Next, a method of manufacturing the insulating base body of the electronic component storage container will be described with reference to FIGS. 2 to 5.
【００２４】まず図2(a)(b) に示す如く、広面積のセラ
ミックグリーンシート10を準備するとともに該セラミッ
クグリーンシート10を仮想線A で絶縁基体の形状に対応
する複数の区画X に区分するとともに各区画X の仮想線
A 上に貫通孔11を形成する。First, as shown in FIGS. 2 (a) and 2 (b), a ceramic green sheet 10 having a large area is prepared, and the ceramic green sheet 10 is divided into a plurality of sections X corresponding to the shape of the insulating substrate along a virtual line A. And the virtual line of each section X
A through hole 11 is formed on A.
【００２５】前記セラミックグリーンシート10は、例え
ば絶縁基体を酸化アルミニウム質焼結体で形成する場
合、アルミナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア
(CaO)、マグネシア(MgO) 等のセラミック原料粉末に適
当な有機溶剤、溶媒を添加混合して泥漿状となすととも
にこれを従来周知のドクターブレード法やカレンダーロ
ール法等を採用し、シート状に成形することによって製
作される。The ceramic green sheet 10 includes, for example, alumina (Al 2 O 3 ), silica (SiO 2 ), and calcia when the insulating substrate is formed of an aluminum oxide sintered body.
(CaO), magnesia (MgO) and other ceramic raw material powders are mixed with an appropriate organic solvent and solvent to form a slurry, which is then formed into a sheet using the conventionally known doctor blade method, calendar roll method, etc. It is manufactured by molding.
【００２６】また前記セラミックグリーンシート10に設
けられる貫通孔11は、セラミックグリーンシート10に従
来周知の孔明け加工法を施すことによって各区画X の仮
想線A 上に所定形状に形成される。The through holes 11 provided in the ceramic green sheet 10 are formed in a predetermined shape on the imaginary line A of each section X by subjecting the ceramic green sheet 10 to a well-known hole forming method.
【００２７】次に前記セラミックグリーンシート10は図
3 に示す如く、仮想線A によって区画された各区画X の
上面から貫通孔11を介し下面にかけてメタライズインク
12を印刷塗布するとともにセラミックグリーンシート10
の下面に印刷塗布されたメタライズインク12のうち貫通
孔11周辺部をセラミックペースト13で被覆する。Next, the ceramic green sheet 10 is shown in FIG.
As shown in 3, metallized ink is applied from the upper surface of each section X divided by the virtual line A to the lower surface through the through hole 11.
12 is printed and applied together with the ceramic green sheet 10
The peripheral portion of the through hole 11 in the metallized ink 12 printed and applied on the lower surface of the is coated with the ceramic paste 13.
【００２８】前記メタライズインク12はタングステン、
モリブデン、マンガン等の高融点金属粉末に適当な有機
溶剤、溶媒を添加混合して形成され、従来周知のスクリ
ーン印刷法を採用することによってセラミックグリーン
シート10の各区画X の上面から貫通孔11を介し下面にか
けて所定パターンに印刷塗布される。The metallized ink 12 is tungsten,
It is formed by adding and mixing an appropriate organic solvent or solvent to high melting point metal powder such as molybdenum or manganese, and the through holes 11 are formed from the upper surface of each section X of the ceramic green sheet 10 by adopting a conventionally known screen printing method. It is printed and applied in a predetermined pattern through the lower surface.
【００２９】また前記メタライズインク12の貫通孔11周
辺部を被覆するセラミックペースト13は、例えばアルミ
ナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア(CaO) 、マ
グネシア(MgO) 等のセラミック原料粉末に適当な有機溶
剤、溶媒を添加混合しペースト状となすことによって形
成され、従来周知のスクリーン印刷法を採用することに
よってセラミックグリーンシート10に印刷塗布したメタ
ライズインク12の貫通孔11周辺部に被着される。The ceramic paste 13 for coating the peripheral portion of the through hole 11 of the metallized ink 12 is a ceramic raw material such as alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO) or magnesia (MgO). A suitable organic solvent to the powder, formed by adding and mixing a solvent to form a paste, in the peripheral portion of the through-hole 11 of the metallized ink 12 printed and applied on the ceramic green sheet 10 by adopting a conventionally known screen printing method. Be applied.
【００３０】次に前記メタライズインク12及びセラミッ
クペースト13が被着されたセラミックグリーンシート10
に図4 に示す如く、仮想線A に沿ってスナップ溝14を入
れる。Next, a ceramic green sheet 10 coated with the metallized ink 12 and the ceramic paste 13
Insert the snap groove 14 along the imaginary line A as shown in FIG.
【００３１】前記スナップ溝14は後述するセラミックグ
リーンシート10を焼成して形成されるセラミック焼成体
15を複数個の絶縁基体に分割する際、分割の補助をする
作用を為し、例えば円形のカッター刃を使用してセラミ
ックグリーンシート10に切り込みを入れることによって
形成される。The snap groove 14 is a ceramic fired body formed by firing a ceramic green sheet 10 described later.
When the 15 is divided into a plurality of insulating substrates, it serves to assist the division, and is formed by making a notch in the ceramic green sheet 10 using, for example, a circular cutter blade.
【００３２】尚、前記スナップ溝14はセラミックグリー
ンシート10の上下両面に形成され、その各々の深さはセ
ラミックグリーンシート10の厚みに対して30% としてお
くとセラミック焼成体15を分割して絶縁基体となす際、
その分割の作業を極めて容易となすことができる。The snap grooves 14 are formed on both upper and lower surfaces of the ceramic green sheet 10, and if the depth of each of them is set to 30% of the thickness of the ceramic green sheet 10, the ceramic fired body 15 is divided and insulated. When making a base,
The division work can be made extremely easy.
【００３３】そして次に前記セラミックグリーンシート
10は焼成され、図5 に示す如く、各区画X 毎に上面から
貫通孔11を介し下面にかけて導出するメタライズ配線層
5 を被着させたセラミック焼成体15となすとともに各区
画X のメタライズ配線層5 のうち下面に導出させた部位
に金属突起7 をロウ付けする。Then, the above-mentioned ceramic green sheet
10 is fired, and as shown in FIG. 5, the metallized wiring layer is led out from the upper surface to the lower surface through the through hole 11 for each section X.
The metal projection 7 is brazed to the portion of the metallized wiring layer 5 of each section X that is led to the lower surface, while forming the ceramic fired body 15 to which 5 is attached.
【００３４】前記セラミックグリーンシート10の焼成
は、該セラミックグリーンシート10に印刷塗布させたメ
タライズペースト12が酸化されるのを防止するために還
元雰囲気中、或いは不活性雰囲気中、約1600℃の温度で
行われる。The firing of the ceramic green sheet 10 is performed at a temperature of about 1600 ° C. in a reducing atmosphere or an inert atmosphere in order to prevent the metallizing paste 12 applied by printing on the ceramic green sheet 10 from being oxidized. Done in.
【００３５】また前記セラミック焼結体20に被着させた
メタライズ配線層5 への金属突起7のロウ付けは、メタ
ライズ配線層5 の上に銀ロウ等から成るロウ材と金属突
起7とを順次載置させ、しかる後、これを約850 ℃の温
度に加熱し、ロウ材を加熱溶融させることによって行わ
れる。The brazing of the metal projections 7 to the metallized wiring layer 5 adhered to the ceramic sintered body 20 is performed by sequentially brazing the metallized wiring layer 5 with a brazing material such as silver brazing and the metal projections 7. It is carried out by placing it and then heating it to a temperature of about 850 ° C. to heat and melt the brazing material.
【００３６】尚、前記セラミック焼結体15に被着させた
メタライズ配線層5 に金属突起7 をロウ付けする場合、
メタライズ配線層5 の貫通孔11周辺部にはセラミックペ
ースト13が焼き付けられているためロウ材の一部が貫通
孔11内に入り込んで隣接する区画のメタライズ配線層5
間を接合させることは一切なく、その結果、セラミック
焼成体15をスナップ溝14に沿って分割し、複数個の絶縁
基体となす際、その分割を極めて容易とし、且つ絶縁基
体に破損等を発生するのを皆無となすことができる。When the metal projection 7 is brazed to the metallized wiring layer 5 adhered to the ceramic sintered body 15,
Since the ceramic paste 13 is baked around the through hole 11 of the metallized wiring layer 5, a part of the brazing material enters the through hole 11 and the adjacent metallized wiring layer 5
As a result, when the ceramic fired body 15 is divided along the snap groove 14 to form a plurality of insulating bases, the division is extremely easy and the insulating bases are damaged. There is nothing to do.
【００３７】また前記メタライズ配線層5 に金属突起7
をロウ付けする際、メタライズ配線層5 の表面にニッケ
ル、金等の耐蝕性に優れ、且つロウ材と濡れ性の良い金
属をメッキ法等により1.0 乃至20.0μm の厚みに層着さ
せておけば、メタライズ配線層5 の酸化腐食を有効に防
止することができるとともにメタライズ配線層5 と金属
突起7 とのロウ付け強度を極めて強固なものとなすこと
ができる。従って、前記メタライズ配線層5 の表面には
ニッケル、金等の耐蝕性に優れ、且つロウ材と濡れ性の
良い金属をメッキ法等により1.0 乃至20.0μm の厚みに
層着させておくことが好ましい。Further, metal projections 7 are formed on the metallized wiring layer 5.
When brazing, a metal with good corrosion resistance such as nickel, gold, etc., and having good wettability with the brazing material should be layered on the surface of the metallized wiring layer 5 to a thickness of 1.0 to 20.0 μm by a plating method or the like. In addition, it is possible to effectively prevent the oxidative corrosion of the metallized wiring layer 5 and to make the brazing strength between the metallized wiring layer 5 and the metal projections 7 extremely strong. Therefore, it is preferable to deposit a metal such as nickel or gold having excellent corrosion resistance and good wettability on the brazing material to a thickness of 1.0 to 20.0 μm on the surface of the metallized wiring layer 5 by a plating method or the like. ..
【００３８】そして最後に前記セラミック焼成体15はス
ナップ溝14に沿って分割され、これによって図1 に示す
メタライズ配線層5 及び金属突起7 を有する複数個の絶
縁基体1 が一度に製作される。Finally, the ceramic fired body 15 is divided along the snap groove 14, whereby a plurality of insulating substrates 1 having the metallized wiring layer 5 and the metal protrusions 7 shown in FIG. 1 are manufactured at one time.
【００３９】尚、本発明は上述の実施例に限定されるも
のではなく本発明の要旨を逸脱しない範囲であれば種々
の変更は可能である。The present invention is not limited to the above-described embodiments, but various modifications can be made without departing from the gist of the present invention.
【００４０】[0040]
【発明の効果】本発明の電子部品収納用容器の製造方法
によれば、セラミックグリーンシートの各区画の上面か
ら貫通孔を介し下面にかけて印刷塗布されるメタライズ
インクのうち貫通孔周辺部をセラミックペーストで被覆
したことからセラミックグリーンシートを焼成し、セラ
ミック焼成体となした後、該セラミック焼成体の各区画
に設けたメタライズ配線層に金属突起をロウ付けした
際、ロウ材の一部が貫通孔内に入り込んで隣接する区画
のメタライズ配線層間を接合させることは一切なく、そ
の結果、セラミック焼成体を分割し、複数個の絶縁基体
となした場合、その分割を極めて容易とし、且つ絶縁基
体に破損等を発生するのを皆無となすことができる。According to the method of manufacturing a container for storing electronic parts of the present invention, the peripheral portion of the through hole in the metallized ink printed and applied from the upper surface of each section of the ceramic green sheet to the lower surface through the through hole is a ceramic paste. After the ceramic green sheet is fired to form a ceramic fired body, a part of the brazing material is penetrated into the metallized wiring layer provided in each section of the ceramic fired body by brazing. When the ceramic fired body is divided into a plurality of insulating bases as a result, the metallized wiring layers of adjacent sections are not joined to each other, and the division is extremely easy. It is possible to prevent damage and the like.
【図１】本発明の製造方法によって製造された電子部品
収納用容器の一実施例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a container for storing electronic components manufactured by a manufacturing method of the present invention.
【図２】(a)(b) は本発明の製造方法を説明するための
図であり、(a) は斜視図、(b) はその断面図である。2 (a) and 2 (b) are views for explaining the manufacturing method of the present invention, (a) is a perspective view, and (b) is a sectional view thereof.
【図３】本発明の製造方法を説明するための断面図であ
る。FIG. 3 is a cross-sectional view for explaining the manufacturing method of the present invention.
【図４】本発明の製造方法を説明するための断面図であ
る。FIG. 4 is a cross-sectional view for explaining the manufacturing method of the present invention.
【図５】本発明の製造方法を説明するための断面図であ
る。FIG. 5 is a cross-sectional view for explaining the manufacturing method of the present invention.
１・・・・絶縁基体 ２・・・・蓋体 ３・・・・容器 ４・・・・圧電振動子 ５・・・・メタライズ配線層 ６・・・・保持部材 ７・・・・金属突起 10・・・・セラミックグリーンシート 11・・・・貫通孔 12・・・・メタライズインク 13・・・・セラミックペースト 14・・・・スナップ溝 15・・・・セラミック焼成体 Ａ・・・・仮想線 Ｘ・・・・区画 1 ... Insulating substrate 2 ... Lid 3 ... Container 4 ... Piezoelectric vibrator 5 ... Metallized wiring layer 6 ... Holding member 7 ... Metal protrusion 10 ・ ・ ・ ・ Ceramic green sheet 11 ・ ・ ・ ・ ・ ・ Through hole 12 ・ ・ ・ ・ ・ ・ Metalized ink 13 ・ ・ ・ ・ Ceramic paste 14 ・ ・ ・ ・ Snap groove 15 ・ ・ ・ ・ ・ ・ Ceramic fired body A ・ ・ ・ ・ Virtual Line X ...
Claims (1)
縁基体と椀状の蓋体とから成り、内部に電子部品を収容
するための空所を有する電子部品収納用容器であって、
前記絶縁基体が下記(1) 乃至(5) の工程により形成され
ていることを特徴とする電子部品収納用容器の製造方
法。 (1) セラミックグリーンシートを仮想線で絶縁基体の形
状に対応する複数の区画に区分するとともに各区画の仮
想線上に貫通孔を設ける工程と、 (2) 前記セラミックグリーンシートの各区画の上面から
貫通孔を介し下面にかけてメタライズインクを印刷塗布
するとともにセラミックグリーンシートの下面に印刷塗
布されたメタライズインクのうち貫通孔周辺部をセラミ
ックペーストで被覆する工程と、 (3) 前記セラミックグリーンシートの仮想線に沿ってス
ナップ溝を入れる工程と(4) 前記セラミックグリーンシ
ートを焼成し、各区画毎に上面から貫通孔を介し下面に
かけて導出するメタライズ配線層を被着させたセラミッ
ク焼成体を得るとともに各区画のメタライズ配線層のう
ち下面に導出させた部位に金属突起をロウ付けする工程
と、 (5) 前記セラミック焼成体をスナップ溝に沿って分割
し、メタライズ配線層及び金属突起を有する個々の絶縁
基体となす工程。1. A container for storing electronic components, which comprises an insulating substrate having a metallized wiring layer and metal protrusions, and a bowl-shaped lid, and has a cavity for storing electronic components therein.
A method of manufacturing a container for storing electronic parts, wherein the insulating substrate is formed by the following steps (1) to (5). (1) dividing the ceramic green sheet into a plurality of sections corresponding to the shape of the insulating substrate with virtual lines, and providing a through hole on the virtual line of each section, (2) from the top surface of each section of the ceramic green sheet A step of printing and applying a metallizing ink to the lower surface through the through hole and a step of coating the peripheral part of the through hole of the metallizing ink printed and applied to the lower surface of the ceramic green sheet with a ceramic paste; (3) a virtual line of the ceramic green sheet And (4) firing the ceramic green sheet to obtain a ceramic fired body to which a metallized wiring layer derived from the upper surface to the lower surface through the through hole is adhered in each section and each section. The step of brazing metal projections to the part of the metallized wiring layer that is led out to the bottom surface, and (5) The ceramic fired body was divided along the snap groove, step formed between the individual insulating base having a metallized wiring layer and the metal protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4034979A JP2887243B2 (en) | 1992-02-21 | 1992-02-21 | Manufacturing method of electronic component storage container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4034979A JP2887243B2 (en) | 1992-02-21 | 1992-02-21 | Manufacturing method of electronic component storage container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05235204A true JPH05235204A (en) | 1993-09-10 |
| JP2887243B2 JP2887243B2 (en) | 1999-04-26 |
Family
ID=12429269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4034979A Expired - Fee Related JP2887243B2 (en) | 1992-02-21 | 1992-02-21 | Manufacturing method of electronic component storage container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2887243B2 (en) |
-
1992
- 1992-02-21 JP JP4034979A patent/JP2887243B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2887243B2 (en) | 1999-04-26 |
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