JPH05174615A - Wiring electrode paste and manufacture of wiring electrode using the same - Google Patents
Wiring electrode paste and manufacture of wiring electrode using the sameInfo
- Publication number
- JPH05174615A JPH05174615A JP34442291A JP34442291A JPH05174615A JP H05174615 A JPH05174615 A JP H05174615A JP 34442291 A JP34442291 A JP 34442291A JP 34442291 A JP34442291 A JP 34442291A JP H05174615 A JPH05174615 A JP H05174615A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- powder
- oxide
- copper
- wiring electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、焼結基板上に配線電極
で回路形成されたいわゆる厚膜回路に用いる、酸化銅を
主成分とするペースト組成物に関し、その含有する金
属、あるいはその酸化物に特別な構成を持つ配線電極ペ
ーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste composition containing copper oxide as a main component, which is used for a so-called thick film circuit formed by a wiring electrode on a sintered substrate. The present invention relates to a wiring electrode paste having a special structure for objects.
【０００２】[0002]
【従来の技術】厚膜回路に使用される導体ペースト用材
料としては、金、金−白金、銀−白金、銀−パラジウム
等の貴金属、モリブデン、タングステン等の高融点卑金
属が用いられてきた。2. Description of the Related Art Noble metals such as gold, gold-platinum, silver-platinum and silver-palladium and refractory base metals such as molybdenum and tungsten have been used as materials for conductor pastes used in thick film circuits.
【０００３】貴金属は空気中で焼成が可能であるが、コ
スト高という問題があり、高融点卑金属は、導電性が低
く、高温下で還元性雰囲気中焼成しなければならないと
いう課題があった。Noble metals can be fired in air, but there is a problem of high cost, and high melting point base metals have low conductivity and must be fired at a high temperature in a reducing atmosphere.
【０００４】そこで安価で、導電性、耐マイグレーショ
ン性、高周波特性に優れた銅を導体ペースト用材料とし
て、例えば特開昭５３−４９２９６、特開昭５６−９３
３９６などに記載されているように、銅が用いるように
なってきた。Therefore, copper, which is inexpensive and has excellent conductivity, migration resistance, and high frequency characteristics, is used as a material for conductor paste, for example, Japanese Patent Laid-Open Nos. 53-49296 and 56-93.
Copper has come into use, as described in 396, et al.
【０００５】しかし、このような金属銅を導体材料とし
て使用するペーストでは、窒素中などの中性雰囲気中で
焼成を行なう必要があり、焼成時の酸素分圧が高すぎる
と、銅導体表面が酸化され、導電性、半田濡れ性の低下
が起こり、逆に酸素分圧が低すぎると、ペースト中の有
機物を完全に分解あるいは揮散させることが困難であ
り、またペースト中に残留した有機物の影響で接着強度
も低下するという課題があった。However, with a paste using such metallic copper as a conductor material, it is necessary to perform firing in a neutral atmosphere such as nitrogen, and if the oxygen partial pressure during firing is too high, the copper conductor surface will be Oxidation causes deterioration of conductivity and solder wettability. Conversely, if the oxygen partial pressure is too low, it is difficult to completely decompose or volatilize the organic matter in the paste, and the effect of the organic matter remaining in the paste However, there is a problem that the adhesive strength is also reduced.
【０００６】これに対して導体の出発材料として酸化銅
を用いたペーストにより、まずペースト中の有機物を分
解するに十分な酸化雰囲気中で熱処理を行ない、銅に対
して非酸化性となる雰囲気中で金属銅へ還元した後に、
焼結を行なう方法が特開昭６１−２６２９３に提案され
ている。On the other hand, with a paste using copper oxide as the starting material of the conductor, first, heat treatment is performed in an oxidizing atmosphere sufficient to decompose organic substances in the paste, and in an atmosphere that is non-oxidizing to copper. After reducing to metallic copper with
A method of sintering is proposed in Japanese Patent Laid-Open No. 61-26293.
【０００７】この方法によれば、厚膜印刷回路では、空
気中での脱バインダが必要であった各種のペーストとの
同時焼成が可能となり、また有機バインダを多量に含む
セラミック多層基板においても、銅を導体として同時焼
成する事が可能となった。According to this method, in a thick film printed circuit, it becomes possible to perform simultaneous firing with various pastes that require binder removal in air, and also in a ceramic multilayer substrate containing a large amount of organic binder, It became possible to co-fire copper as a conductor.
【０００８】さらにこの酸化銅ペーストについて、多層
基板において銅のメタライズ性、基板との接着強度の改
善、配線部の焼結を抑制するために各種の添加物につい
て検討したものが例えば特開昭６１−２８８４８４、特
開昭６１−２８９６９１、特開平１−３１７１８４等に
記載されているが、焼結基板上に形成される厚膜回路に
ついて、導体である金属銅の焼結促進についてはなんら
触れられていない。Further, with respect to this copper oxide paste, various additives have been studied in order to improve the metallization property of copper in a multi-layer substrate, improve the adhesive strength with the substrate, and suppress the sintering of the wiring part. -288484, JP-A-61-289691, JP-A-1-317184, etc., but regarding thick film circuits formed on a sintered substrate, there is no mention of promoting the sintering of metallic copper as a conductor. Not not.
【０００９】[0009]
【発明が解決しようとする課題】上記の酸化銅ペースト
を用いたプロセスによる配線電極では、酸化銅から金属
銅へ還元される際の体積収縮によって、導体膜中の導電
成分の体積分率が低くなり、導電性が低下する場合があ
る。通常のセラミック多層基板においては焼成時に基板
自身が３次元的に収縮することにより、導電成分の体積
分率の低下を補うことが出来るが、アルミナ基板上など
に印刷などのプロセスで形成される厚膜回路の場合、焼
成時には膜厚方向にのみ収縮が可能であり、導電成分の
体積分率の低下を補いきれず、金属銅を出発原料とする
厚膜ペーストに比べ高抵抗化するという問題があった。In the wiring electrode produced by the above process using the copper oxide paste, the volume fraction of the conductive component in the conductor film is low due to the volume contraction when the copper oxide is reduced to metallic copper. Therefore, the conductivity may decrease. In a normal ceramic multilayer substrate, it is possible to compensate for the decrease in volume fraction of the conductive component by shrinking the substrate itself three-dimensionally during firing, but the thickness formed on the alumina substrate by a process such as printing. In the case of a film circuit, it is possible to shrink only in the film thickness direction at the time of firing, it is not possible to compensate for the decrease in the volume fraction of the conductive component, there is a problem that higher resistance than the thick film paste starting metal copper there were.
【００１０】そこで、本発明は安価で、耐マイグレーシ
ョン及び高周波特性に優れた銅を導電成分の主成分と
し、ペーストに含有する有機成分を分解あるいは揮散で
き、接着強度に優れ、焼結温度が低く、焼結後も高抵抗
値化し難い配線電極ペースト及び配線電極の作成方法を
提供することを目的とする。Therefore, the present invention uses copper, which is inexpensive and has excellent migration resistance and high-frequency characteristics, as the main component of the conductive component, can decompose or volatilize organic components contained in the paste, has excellent adhesive strength, and has a low sintering temperature. It is an object of the present invention to provide a wiring electrode paste and a method for producing a wiring electrode, which hardly cause a high resistance value even after sintering.
【００１１】[0011]
【課題を解決するための手段】上記の課題を解決するた
めに、酸化銅を主成分とする電極ペーストの組成物であ
って、酸化銅以外に金属銅の融点よりも低温で少なくと
も金属銅と部分溶融する他の元素の金属粉末、または金
属酸化物粉末を還元した金属粉末が金属銅の融点よりも
低温で少なくとも金属銅と部分溶融する金属酸化物粉末
の何れかを含有した配線電極ペーストで、かかる従来の
課題を克服した。In order to solve the above-mentioned problems, a composition of an electrode paste containing copper oxide as a main component, which contains at least metallic copper at a temperature lower than the melting point of metallic copper in addition to copper oxide. A wiring electrode paste containing a metal powder of another element that partially melts, or a metal powder obtained by reducing a metal oxide powder that contains at least a metal oxide powder that partially melts with copper at a temperature lower than the melting point of metal copper. , Overcoming such conventional problems.
【００１２】[0012]
【作用】この構成によって、通常の酸化銅ペーストのプ
ロセスにおいて脱バインダ工程、還元工程を経た後、焼
成工程においては導電膜中含まれる上記の金属粉末もし
くはこれらの酸化物粉末を還元して生ずる金属粉末が、
酸化銅粉末を還元して生ずる金属粉末との混合条件下
で、金属銅の融点より低い温度で部分点溶融を生じ、こ
の液相の効果で、金属銅の焼結を促進することが出来
る。これによって、還元工程で低下した導電成分の体積
分率を補い、導電性の優れた厚膜配線電極を実現する酸
化銅ペーストを提供することが出来る。With this configuration, after a binder removal step and a reduction step in a normal copper oxide paste process, a metal produced by reducing the above-mentioned metal powder or these oxide powders contained in the conductive film in the firing step. Powder is
Under mixing conditions with the metal powder produced by reducing the copper oxide powder, partial point melting occurs at a temperature lower than the melting point of the metal copper, and the effect of this liquid phase can accelerate the sintering of the metal copper. As a result, it is possible to provide a copper oxide paste that compensates for the volume fraction of the conductive component decreased in the reduction step and realizes a thick film wiring electrode having excellent conductivity.
【００１３】[0013]
【実施例】本発明の酸化銅以外に添加される金属粉末ま
たは金属酸化物粉末としては、相図で金属銅の融点以下
で、少なくとも部分溶融する金属元素であればよい。す
なわち金属銅の焼結促進作用がある金属粉末または金属
酸化物粉末を、酸化銅に添加してペーストを作成する。
このような金属元素の中でも、本発明者らの実験による
と、鉛、錫、亜鉛、銀のうちの少なくとも１種類以上か
ら選ばれたものを用いると良いことが判明した。EXAMPLES The metal powder or metal oxide powder added in addition to the copper oxide of the present invention may be any metal element that is at least partially melting below the melting point of copper metal in the phase diagram. That is, a metal powder or a metal oxide powder having a function of promoting the sintering of metallic copper is added to copper oxide to prepare a paste.
Among these metal elements, according to the experiments conducted by the present inventors, it was found that it is preferable to use one selected from at least one of lead, tin, zinc and silver.
【００１４】これら金属添加物元素の好ましい混合割合
は、各種元素によって異なる。例えば金属が鉛粉末また
は鉛酸化物の場合は、鉛成分を金属鉛に換算した量がペ
ースト中の酸化銅に対して０．３ｗｔ％〜４ｗｔ％の範
囲で、金属が錫粉末または錫酸化物の場合には、錫成分
を金属錫に換算した量がペースト中の酸化銅に対して
０．６ｗｔ％〜６ｗｔ％の範囲で、金属が亜鉛粉末また
は亜鉛酸化物の場合には、亜鉛成分を金属亜鉛に換算し
た量がペースト中の酸化銅に対して０．４〜６ｗｔ％の
範囲で、また、金属が銀粉末または銀酸化物の場合に
は、銀成分を金属銀に換算した量がペースト中の酸化銅
に対して０．３ｗｔ％〜２０ｗｔ％の範囲で、それぞれ
好ましい特性を示す。添加した金属粉末または金属酸化
物粉末がこれらの範囲より少ないと金属銅の融点低下の
程度が少なく、逆に多いと金属銅の導電性または耐マイ
グレーション性等の良好な特性が損なわれる傾向にあ
る。The preferable mixing ratio of these metal additive elements differs depending on various elements. For example, when the metal is lead powder or lead oxide, the amount of lead component converted to metallic lead is 0.3 wt% to 4 wt% with respect to the copper oxide in the paste, and the metal is tin powder or tin oxide. In the case of, the amount of tin component converted to metallic tin is in the range of 0.6 wt% to 6 wt% with respect to the copper oxide in the paste, and when the metal is zinc powder or zinc oxide, the zinc component is The amount converted to metallic zinc is in the range of 0.4 to 6 wt% with respect to the copper oxide in the paste, and when the metal is silver powder or silver oxide, the amount converted from the silver component to metallic silver is In the range of 0.3 wt% to 20 wt% with respect to the copper oxide in the paste, preferable properties are shown. When the added metal powder or metal oxide powder is less than these ranges, the melting point of the metallic copper is less deteriorated, and when it is more than the above range, good properties such as conductivity or migration resistance of the metallic copper tend to be impaired. ..
【００１５】本発明の配線電極ペーストに供されるバイ
ンダ材料としては、一般に脱バインダ工程で分解または
揮散し易く、また展性を有する有機高分子材料が適し、
例えばエチルセルロース等が挙げられる。As the binder material used for the wiring electrode paste of the present invention, an organic polymer material which is easily decomposed or volatilized in the binder removal step and has malleability is suitable.
For example, ethyl cellulose and the like can be mentioned.
【００１６】また、本発明の配線電極ペースト中に、例
えば分散剤等の有機成分、あるいは例えばホウ珪酸ガラ
ス等の無機物を含有していてもよい。The wiring electrode paste of the present invention may contain an organic component such as a dispersant or an inorganic substance such as borosilicate glass.
【００１７】本発明の配線電極の作成方法は、上記ペー
ストを例えばスクリーン印刷、グラビア印刷、ブレード
塗布法等の通常の塗布法で、例えば酸化アルミニウム等
の絶縁性基板上に、配線パタ−ンに対応して塗布する。
次に、酸素を含む雰囲気下で加熱し、バインダ等の有機
成分を除去する脱バインダ工程を行う。次に、水素等の
還元性雰囲気中で加熱し、少なくとも酸化銅を金属銅に
還元する。しかる後、中性雰囲気中で加熱し焼結を行
い、配線電極が完成する。本発明の配線電極ペースト
は、添加した金属粉末または金属酸化物粉末の何れかの
作用で、金属銅の融点よりも低温で少なくとも部分溶融
することができる。従って、この焼結工程の加熱温度
は、金属銅の融点よりも低温で行うことができる。The method for producing a wiring electrode of the present invention is a conventional coating method such as screen printing, gravure printing, or blade coating method, for example, on an insulating substrate such as aluminum oxide, to form a wiring pattern. Apply correspondingly.
Next, a binder removal step of heating in an atmosphere containing oxygen to remove organic components such as a binder is performed. Next, it is heated in a reducing atmosphere such as hydrogen to reduce at least copper oxide to metallic copper. After that, the wiring electrode is completed by heating and sintering in a neutral atmosphere. The wiring electrode paste of the present invention can be at least partially melted at a temperature lower than the melting point of metallic copper by the action of the added metal powder or metal oxide powder. Therefore, the heating temperature in this sintering step can be lower than the melting point of metallic copper.
【００１８】以下本発明について実施例を挙げて説明す
る。 （実施例１）まず本発明の配線電極ペーストの作製につ
いて述べる。０．７μｍ以上７μｍ以下の酸化銅、及び
各種添加金属あるいは酸化物を所定の比率で混合したも
のに、酸化銅に対して３ｗｔ％のホウ珪酸ガラスを加
え、エチルセルロースのターピネオール８％溶液をビヒ
クルとして加え、３本ロールミルを用いて混練し、溶剤
量を加減して粘度を調節する。本実施例においてはペー
ストのキャスティング方法としてスクリーン印刷法を用
いるために室温における粘度としては５から３０ｐａ・
ｓが適当である。添加物の添加割合については金属に換
算して、酸化銅を１００としたｗｔ％で（表１）に示
す。なおペースト中に酸化物として添加したものについ
ては括弧内に酸化物としての添加量も示した。The present invention will be described below with reference to examples. Example 1 First, the production of the wiring electrode paste of the present invention will be described. 3 wt% of borosilicate glass to copper oxide was added to a mixture of copper oxide of 0.7 μm or more and 7 μm or less and various kinds of added metals or oxides in a predetermined ratio, and an 8% terpineol solution of ethyl cellulose was used as a vehicle. In addition, kneading is performed using a three-roll mill, and the amount of solvent is adjusted to adjust the viscosity. In this example, since the screen printing method is used as the paste casting method, the viscosity at room temperature is 5 to 30 pa.
s is suitable. The addition ratio of the additive is shown in (Table 1) in terms of wt% with copper oxide as 100, converted to metal. In addition, about the thing added as an oxide in paste, the addition amount as an oxide is also shown in the parenthesis.
【００１９】続いて配線電極の作成プロセス及び評価に
ついて述べる。焼結基板として９６％アルミナを用い、
各ペーストについて２５０メッシュのステンレススクリ
ーン版で５００μｍ幅、アスペクト３００のパターンを
印刷し、１００℃で１０分間乾燥した後、空気中５００
℃で１時間加熱し脱バインダし、次に水素中３００℃で
２時間加熱することにより少なくとも酸化銅を還元し、
最後に窒素中９００℃で１０分間焼成を行なった。それ
ぞれについて直流４端子法で配線抵抗を測定し、膜厚１
５μｍの面積抵抗に換算した結果を（表１）〜（表３）
に示す。Next, the process of making a wiring electrode and its evaluation will be described. 96% alumina is used as a sintered substrate,
A pattern of 500 μm width and aspect 300 was printed on each paste with a 250 mesh stainless screen plate, dried at 100 ° C. for 10 minutes, and then 500 in air.
At least copper oxide is reduced by heating at 300C for 1 hour to remove the binder, and then heating in hydrogen at 300 ° C for 2 hours,
Finally, it was baked in nitrogen at 900 ° C. for 10 minutes. The wiring resistance was measured by the DC 4-terminal method for each, and the film thickness was 1
The results converted into a sheet resistance of 5 μm are shown in (Table 1) to (Table 3).
Shown in.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】[0022]
【表３】 [Table 3]
【００２３】ＮＯ．１は添加物を含まない本発明の範囲
外の比較例である。ＮＯ．３〜６は鉛の添加についての
本発明の好ましい範囲の例であり、良好な導電性を示し
ている。ＮＯ．２は鉛の添加量が少なすぎて焼結促進に
は寄与しなかった本発明の好ましい範囲外の例である。
逆にＮＯ．７は鉛の添加が過剰となった本発明の好まし
い範囲外の例であり、焼結促進の効果よりも鉛添加によ
る導電率の低下の効果が勝ったためと考えられる。NO. No. 1 is a comparative example which does not include an additive and is outside the scope of the present invention. NO. Nos. 3 to 6 are examples of the preferable range of the present invention regarding the addition of lead, and show good conductivity. NO. No. 2 is an example outside the preferable range of the present invention in which the amount of lead added was too small and did not contribute to the promotion of sintering.
On the contrary, NO. No. 7 is an example outside the preferable range of the present invention in which the addition of lead was excessive, and it is considered that the effect of lowering the conductivity due to the addition of lead was superior to the effect of promoting sintering.
【００２４】ＮＯ．９〜１２は酸化鉛の添加についての
本発明の好ましい範囲の例であり、良好な導電性を示し
ている。ＮＯ．８は酸化鉛の添加量が少なすぎて焼結促
進には寄与しなかった本発明の好ましい範囲外の例であ
る。逆にＮＯ．１３は酸化鉛の添加が過剰となった本発
明の好ましい範囲外の例であり、焼結促進の効果よりも
鉛添加による導電率の低下の効果が勝ったためと考えら
れる。NO. Nos. 9 to 12 are examples of the preferable range of the present invention regarding the addition of lead oxide, and show good conductivity. NO. No. 8 is an example outside the preferable range of the present invention in which the amount of lead oxide added was too small to contribute to promotion of sintering. On the contrary, NO. No. 13 is an example outside the preferable range of the present invention in which the addition of lead oxide was excessive, and it is considered that the effect of lowering the conductivity due to the addition of lead was superior to the effect of promoting sintering.
【００２５】ＮＯ．１４は錫の添加量が少なすぎて焼結
促進には寄与しなかった本発明の好ましい範囲外の例で
ある。ＮＯ．１５〜１８は錫の添加についての本発明の
好ましい範囲の例であり、良好な導電性を示している。
ＮＯ．１９は錫の添加が過剰となった本発明の好ましい
範囲外の例であり、鉛の場合と同様に焼結促進の効果よ
りも錫添加による導電率の低下の効果が勝ったためと考
えられる。NO. No. 14 is an example outside the preferred range of the present invention in which the amount of tin added was too small to contribute to the promotion of sintering. NO. Nos. 15 to 18 are examples of the preferable range of the present invention regarding the addition of tin, and show good conductivity.
NO. No. 19 is an example outside the preferable range of the present invention in which the addition of tin was excessive, and it is considered that the effect of lowering the conductivity due to the addition of tin was superior to the effect of promoting sintering as in the case of lead.
【００２６】ＮＯ．２０は酸化錫の添加量が少なすぎて
焼結促進には寄与しなかった本発明の好ましい範囲外の
例である。ＮＯ．２１〜２４は酸化錫の添加についての
本発明の例であり、良好な導電性を示している。ＮＯ．
２５は酸化錫の添加が過剰となった本発明の好ましい範
囲外の例であり、鉛の場合と同様に焼結促進の効果より
も錫添加による導電率の低下の効果が勝ったためと考え
られる。NO. No. 20 is an example outside the preferred range of the present invention in which the amount of tin oxide added was too small to contribute to the promotion of sintering. NO. Nos. 21 to 24 are examples of the present invention regarding the addition of tin oxide, and show good conductivity. NO.
No. 25 is an example outside the preferred range of the present invention in which the addition of tin oxide was excessive, and it is considered that, as in the case of lead, the effect of lowering the conductivity by tin addition was superior to the effect of promoting sintering. ..
【００２７】ＮＯ．２６は亜鉛の添加量が少なすぎて焼
結促進には寄与しなかった本発明の好ましい範囲外の例
である。ＮＯ．２７〜３０は亜鉛の添加についての本発
明の例であり、良好な導電性を示している。ＮＯ．３１
は亜鉛の添加が過剰となった本発明の好ましい範囲外の
例であり、鉛の場合と同様に焼結促進の効果よりも亜鉛
添加による導電率の低下の効果が勝ったためと考えられ
る。NO. No. 26 is an example outside the preferable range of the present invention in which the amount of zinc added was too small to contribute to promotion of sintering. NO. Nos. 27 to 30 are examples of the present invention regarding the addition of zinc, and show good conductivity. NO. 31
Is an example outside the preferable range of the present invention in which zinc is added excessively, and it is considered that the effect of lowering the conductivity by the addition of zinc is superior to the effect of promoting sintering as in the case of lead.
【００２８】ＮＯ．３２は酸化亜鉛の添加量が少なすぎ
て焼結促進には寄与しなかった本発明の好ましい範囲外
の例である。ＮＯ．３３〜３６は酸化亜鉛の添加につい
ての本発明の例であり、良好な導電性を示している。Ｎ
Ｏ．３７は酸化亜鉛の添加が過剰となった本発明の好ま
しい範囲外の例であり、鉛の場合と同様に焼結促進の効
果よりも亜鉛添加による導電率の低下の効果が勝ったた
めと考えられる。NO. 32 is an example outside the preferred range of the present invention in which the amount of zinc oxide added was too small to contribute to promotion of sintering. NO. Nos. 33 to 36 are examples of the present invention regarding the addition of zinc oxide, and show good conductivity. N
O. No. 37 is an example outside the preferred range of the present invention in which the addition of zinc oxide was excessive, and it is considered that the effect of lowering the conductivity by zinc addition was superior to the effect of promoting sintering as in the case of lead. ..
【００２９】ＮＯ．３８は銀の添加量が少なすぎて焼結
促進には寄与しなかった本発明の好ましい範囲外の例で
ある。ＮＯ．３９〜４４は銀の添加、ＮＯ．４５〜４７
は酸化銀の添加についての本発明の例であり、良好な導
電性を示している。銀はそれ自体が良好な導電率を持つ
ために、添加による焼結促進、導電性改善については、
広い範囲で効果がある。但し、添加した銀の量が増すと
金属銅の良好な耐マイグレーション性が損なわれるが、
導電性だけを考える場合は本実施例のように何の問題も
の無い。NO. No. 38 is an example outside the preferred range of the present invention in which the amount of silver added was too small to contribute to promotion of sintering. NO. Nos. 39 to 44 are silver additions, NO. 45-47
Is an example of the present invention for the addition of silver oxide and shows good conductivity. Since silver itself has a good conductivity, the addition of silver promotes sintering and improves conductivity.
Effective in a wide range. However, although the good migration resistance of metallic copper is impaired as the amount of added silver increases,
When considering only conductivity, there is no problem as in this embodiment.
【００３０】ＮＯ．４８〜６５は、複数種類の添加物を
加えた本発明の例であり、何れも優れた導電性を有して
いる。NO. 48 to 65 are examples of the present invention in which a plurality of types of additives are added, and all have excellent conductivity.
【００３１】しかし、好ましい添加量よりも少ないかま
たは多いペーストＮｏ．２、７、８、１３、１４、１
９、２０、２５、２６、３１、３２、３７および３８の
導電性自体は、何れも無添加のペーストＮｏ．１の場合
と大差がない。However, when the paste No. is smaller or larger than the preferable addition amount. 2, 7, 8, 13, 14, 1
The conductivity itself of each of Nos. 9, 20, 25, 26, 31, 32, 37 and 38 was paste No. There is not much difference from the case of 1.
【００３２】なお本実施例では、スクリーン印刷によっ
て配線を形成したが、所望の配線、電極の種類や用途に
よって適当な方法を選択できる。また、ペーストに使用
するビヒクルの種類及び配合量については選択したキャ
スティングの方法に応じて自由に選択することができ
る。In this embodiment, the wiring is formed by screen printing, but an appropriate method can be selected depending on the desired wiring, the kind of electrode and the intended use. Further, the type and blending amount of the vehicle used in the paste can be freely selected according to the selected casting method.
【００３３】[0033]
【発明の効果】以上のように本発明は、酸化銅を主成分
として、酸化銅以外に金属銅の融点よりも低温で少なく
とも金属銅と部分溶融する他の元素の金属粉末、もしく
は金属酸化物粉末を還元した金属粉末が金属銅の融点よ
りも低温で少なくとも金属銅と部分溶融する前記金属酸
化物粉末の何れかを含む配線電極ペーストであるため、
これらの金属粉末もしくはこれらの酸化物粉末を還元し
て生ずる金属粉末が、酸化銅粉末を還元して生ずる金属
粉末との混合条件下で、金属銅の融点より低い温度で部
分溶融を生じ、導電性が高く、耐マイグレーション性に
優れた配線電極ペーストを提供できる効果がある。INDUSTRIAL APPLICABILITY As described above, the present invention is based on copper oxide as a main component, and in addition to copper oxide, a metal powder of another element or a metal oxide of another element which is partially melted at least at a temperature lower than the melting point of metallic copper. Since the metal powder obtained by reducing the powder is a wiring electrode paste containing any of the metal oxide powders which are partially melted with at least metal copper at a temperature lower than the melting point of metal copper,
The metal powder produced by reducing these metal powders or these oxide powders causes partial melting at a temperature lower than the melting point of the metal copper under the mixing conditions with the metal powder produced by reducing the copper oxide powder, resulting in conductivity. There is an effect that it is possible to provide a wiring electrode paste having high property and excellent migration resistance.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年２月２１日[Submission date] February 21, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２０[Correction target item name] 0020
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２０】[0020]
【表１】 [Table 1]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２１[Correction target item name] 0021
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２１】[0021]
【表２】 [Table 2]
Claims (7)
物であって、前記酸化銅以外に金属銅の融点よりも低温
で少なくとも金属銅と部分溶融する他の元素の金属粉
末、または金属酸化物粉末を還元した金属粉末が金属銅
の融点よりも低温で少なくとも金属銅と部分溶融する前
記金属酸化物粉末の何れかを含有したことを特徴とする
配線電極ペースト。1. A composition of an electrode paste containing copper oxide as a main component, which is a metal powder of another element other than the copper oxide, which is at least partially melted with the metal copper at a temperature lower than the melting point of the metal copper, or a metal. A wiring electrode paste, wherein the metal powder obtained by reducing the oxide powder contains any one of the above metal oxide powders that partially melts with at least the metal copper at a temperature lower than the melting point of the metal copper.
錫、亜鉛、銀の何れかの粉末もしくは酸化物であること
を特徴とする、請求項１記載の配線電極ペースト。2. The metal powder or metal oxide powder is lead,
The wiring electrode paste according to claim 1, which is a powder or oxide of any one of tin, zinc, and silver.
もしくは鉛酸化物粉末で、鉛成分を金属鉛に換算して、
ペースト中の酸化銅に対して０．３ｗｔ％以上４ｗｔ％
以下であることを特徴とする、請求項２記載の配線電極
ペースト。3. The metal powder or metal oxide powder is lead powder or lead oxide powder, and the lead component is converted to metallic lead,
0.3 wt% or more and 4 wt% with respect to the copper oxide in the paste
The wiring electrode paste according to claim 2, wherein:
もしくは錫酸化物粉末で、錫成分を金属錫に換算して、
ペースト中の酸化銅に対して０．６ｗｔ％以上６ｗｔ％
以下であることを特徴とする、請求項２記載の配線電極
ペースト。4. The metal powder or metal oxide powder is tin powder or tin oxide powder, and the tin component is converted to metal tin,
0.6 wt% to 6 wt% with respect to copper oxide in the paste
The wiring electrode paste according to claim 2, wherein:
末もしくは亜鉛酸化物粉末で、亜鉛成分を金属亜鉛に換
算して、ペースト中の酸化銅に対して０．４ｗｔ％以上
６ｗｔ％以下であることを特徴とする、請求項２記載の
配線電極ペースト。5. The metal powder or metal oxide powder is zinc powder or zinc oxide powder, and the zinc component is 0.4 wt% or more and 6 wt% or less with respect to copper oxide in the paste when converted to zinc metal. The wiring electrode paste according to claim 2, wherein:
もしくは銀酸化物粉末で、銀成分を金属銀に換算して、
ペースト中の酸化銅に対して０．３ｗｔ％以上２０ｗｔ
％以下であることを特徴とする、請求項２記載の配線電
極ペースト。6. The metal powder or metal oxide powder is silver powder or silver oxide powder, and the silver component is converted into metallic silver,
0.3 wt% or more and 20 wt% with respect to copper oxide in the paste
% Or less, the wiring electrode paste according to claim 2.
の元素の金属粉末または金属酸化物粉末を含有した配線
電極ペーストを、電極パタ−ンに応じて絶縁性基板上に
塗布乾燥し、含酸素雰囲気下で加熱後、還元性雰囲気下
で少なくとも前記酸化銅を還元し、金属銅の融点より低
い温度で少なくとも部分溶融させることを特徴とする配
線電極の作成方法。7. A wiring electrode paste containing copper oxide as a main component and containing a metal powder or a metal oxide powder of another element in addition to the copper oxide is applied and dried on an insulating substrate according to an electrode pattern. Then, after heating in an oxygen-containing atmosphere, at least the copper oxide is reduced in a reducing atmosphere and at least partially melted at a temperature lower than the melting point of metallic copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34442291A JPH05174615A (en) | 1991-12-26 | 1991-12-26 | Wiring electrode paste and manufacture of wiring electrode using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34442291A JPH05174615A (en) | 1991-12-26 | 1991-12-26 | Wiring electrode paste and manufacture of wiring electrode using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05174615A true JPH05174615A (en) | 1993-07-13 |
Family
ID=18369137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34442291A Pending JPH05174615A (en) | 1991-12-26 | 1991-12-26 | Wiring electrode paste and manufacture of wiring electrode using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05174615A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015209575A (en) * | 2014-04-28 | 2015-11-24 | 住友電気工業株式会社 | Metal fine particle dispersion, production method of metal fine particle dispersion, production method of metal film and metal film |
-
1991
- 1991-12-26 JP JP34442291A patent/JPH05174615A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015209575A (en) * | 2014-04-28 | 2015-11-24 | 住友電気工業株式会社 | Metal fine particle dispersion, production method of metal fine particle dispersion, production method of metal film and metal film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4529835A (en) | Ceramic thick film circuit substrate | |
| JP2002290011A (en) | Thick film circuit board and its manufacturing method | |
| JPH08161930A (en) | Conductive paste, and conductive body and multilayer ceramic board using it | |
| JPH0817241A (en) | Copper conductive paste and manufacture of copper conductive film | |
| JP2007066671A (en) | Chip type fuse element and its manufacturing method | |
| JPH05174615A (en) | Wiring electrode paste and manufacture of wiring electrode using the same | |
| JP2006339105A (en) | Chip type fuse element and manufacturing method thereof | |
| JP2001291959A (en) | Manufacturing method for multilayer ceramic substrate and copper conductive paste | |
| US6190790B1 (en) | Resistor material, resistive paste and resistor using the resistor material, and multi-layered ceramic substrate | |
| JP3567774B2 (en) | Resistance material, resistance paste and resistor using the same, and ceramic multilayer substrate | |
| KR102463361B1 (en) | Electrode composition, method for manufacturing electronic component using the same, and electronic component manufactured therefrom | |
| JP2841586B2 (en) | Conductive paste | |
| JP2004119561A (en) | Resistive paste and resistor | |
| JPH06139815A (en) | Paste for metallization | |
| JP3538700B2 (en) | Resistance material, resistance paste and resistor using the same, and ceramic multilayer substrate | |
| JP3538699B2 (en) | Resistance material, resistance paste and resistor using the same, and ceramic multilayer substrate | |
| JP3222296B2 (en) | Conductive ink | |
| JPH01258306A (en) | Conductive paste | |
| JP2992958B2 (en) | Conductive paste for low-temperature fired multilayer wiring boards | |
| JPS63301405A (en) | Manufacture of low temperature baking type conductive paste and circuit board | |
| JP2006066475A (en) | Composition for forming thick film resistor, process for forming thick film resistor, and thick film resistor | |
| JPS6263488A (en) | Manufacturing thick film substrate | |
| JP2709728B2 (en) | Porcelain electronic components | |
| JPH1098244A (en) | Thick-film circuit board and its manufacture | |
| JPS59181502A (en) | Resistor paste composition |