JPH05125534A - Cooler for substrate to be subjected to surface treatment - Google Patents
Cooler for substrate to be subjected to surface treatmentInfo
- Publication number
- JPH05125534A JPH05125534A JP29293791A JP29293791A JPH05125534A JP H05125534 A JPH05125534 A JP H05125534A JP 29293791 A JP29293791 A JP 29293791A JP 29293791 A JP29293791 A JP 29293791A JP H05125534 A JPH05125534 A JP H05125534A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temp
- shape memory
- memory alloy
- substrate holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は薄膜形成装置、またはイ
オン注入装置などに適用される表面処理される基板の冷
却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for a surface-treated substrate which is applied to a thin film forming apparatus or an ion implantation apparatus.
【０００２】[0002]
【従来の技術】スパッタリング方法やイオンプレーティ
ング方法などによる薄膜形成、またはイオン注入などに
よる表面処理を施す場合、発熱して表面処理される基板
が損傷する危険があるので、基板ホルダーに冷却水を循
環させる冷却が行われている。2. Description of the Related Art When a thin film is formed by a sputtering method or an ion plating method, or a surface treatment is performed by ion implantation, there is a risk of heat generation and damage to the substrate to be surface treated. Circulating cooling is performed.
【０００３】また、薄膜の基板への密着性を高めるため
基板を加熱することもあるが、膜形態や結晶性などが基
板温度に強く影響されるため、基板の冷却や基板温度の
制御が必要となる。The substrate may be heated in order to improve the adhesion of the thin film to the substrate, but since the film morphology and crystallinity are strongly influenced by the substrate temperature, it is necessary to cool the substrate and control the substrate temperature. Becomes
【０００４】冷却効果を高めるためには、基板ホルダー
が基板に密着するための弾力性と熱良導性が必要であ
り、従来Ｃｕ、Ａｌなどの金属製基板ホルダーを用い、
さらに基板と基板ホルダーの間にＡｌはくを挿入するな
どの方法がとられている。In order to enhance the cooling effect, it is necessary for the substrate holder to have elasticity and thermal conductivity so as to adhere to the substrate. Conventionally, a metallic substrate holder such as Cu or Al is used.
Further, a method such as inserting an Al foil between the substrate and the substrate holder is used.
【０００５】また、基板ホルダーの表面にシリコンラバ
ーのクッション部を設け、基板の変形に追従するように
工夫した例もある。There is also an example in which a cushion portion made of silicon rubber is provided on the surface of the substrate holder so as to follow the deformation of the substrate.
【０００６】[0006]
【発明が解決しようとする課題】前記の熱良導性の金属
製基板ホルダーを用いＡｌはくを挿入する方法では、平
板基板の場合には有効であるが、曲面をもつ基板や基板
の変形が大きい場合には基板ホルダーとの接触が離れて
冷却性が悪くなる。The method of inserting an Al foil using the above-described metal substrate holder having good thermal conductivity is effective in the case of a flat substrate, but it has a curved surface or deformation of the substrate. If it is large, the contact with the substrate holder is separated and the cooling performance deteriorates.
【０００７】シリコンラバーを基板ホルダーに使う場合
には、弾力性劣化の問題があり、また、耐熱性、熱伝導
性に劣るため発熱量が大きい時の使用は難しい。When silicon rubber is used for the substrate holder, there is a problem of deterioration in elasticity, and since it is inferior in heat resistance and thermal conductivity, it is difficult to use it when a large amount of heat is generated.
【０００８】本発明は、以上の問題点を解決することが
できる表面処理される基板の冷却装置を提供しようとす
るものである。The present invention is intended to provide a cooling apparatus for a surface-treated substrate which can solve the above problems.
【０００９】[0009]
【課題を解決するための手段】本発明の表面処理される
基板の冷却装置は、表面処理される基板を冷却する基板
ホルダーを、表面処理加工時に基板に密着する形状記憶
材で形成した。In a cooling device for a substrate to be surface-treated according to the present invention, a substrate holder for cooling the substrate to be surface-treated is formed of a shape memory material which is brought into close contact with the substrate at the time of processing the surface.
【００１０】[0010]
【作用】基板の外周面に表面処理をする場合、表面処理
加工時の発熱で形状記憶材の変態点以上になった時、基
板ホルダーは変形して基板に密着して十分な冷却効果を
発揮する。[Function] When the outer peripheral surface of the substrate is subjected to surface treatment, when the heat generated during the surface treatment exceeds the transformation point of the shape memory material, the substrate holder deforms and adheres to the substrate to exert a sufficient cooling effect. To do.
【００１１】[0011]
【実施例】本発明の一実施例を図１および図２によって
説明する。内部に冷却水の循環路２が設けられている縦
型の円筒形の形状記憶合金製のホルダー１に円筒形の基
板３を挿入した状態を、図１に示す。形状記憶合金製の
円筒形の基板ホルダー１の外径は、円筒形基板３の内径
より小さく形成されていて、同基板３にスムーズに挿入
され、この時基板ホルダー１と基板３は密着していな
い。前記形状記憶合金製の基板ホルダー１は、温度が上
昇して変態点以上になると、基板ホルダー１が基板３に
装着するように構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a state in which a cylindrical substrate 3 is inserted into a vertical cylindrical shape memory alloy holder 1 having a cooling water circulation path 2 provided therein. The outer diameter of the cylindrical substrate holder 1 made of shape memory alloy is smaller than the inner diameter of the cylindrical substrate 3, and the cylindrical substrate holder 1 is smoothly inserted into the substrate 3. At this time, the substrate holder 1 and the substrate 3 are in close contact with each other. Absent. The substrate holder 1 made of the shape memory alloy is configured so that the substrate holder 1 is mounted on the substrate 3 when the temperature rises to reach the transformation point or higher.
【００１２】本実施例において、表面処理にともなう発
熱により基板３の温度が上昇して予め設定した形状記憶
合金の変態温度以上になると、図２に示すように、基板
ホルダー１が基板３に密着し、基板３は基板ホルダー１
を介して冷却水により冷却される。さらに、熱良導体で
あり変形態を有するＡｌはくを基板ホルダー１と基板３
の間にはさむことで、冷却効果はさらに高まる。In the present embodiment, when the temperature of the substrate 3 rises due to the heat generated by the surface treatment and reaches the preset transformation temperature of the shape memory alloy or higher, the substrate holder 1 comes into close contact with the substrate 3 as shown in FIG. Then, the substrate 3 is the substrate holder 1
Is cooled by cooling water. Further, an Al foil which is a good conductor of heat and has a modified form is used for the substrate holder 1 and the substrate 3.
By sandwiching between them, the cooling effect is further enhanced.
【００１３】以上のように、本実施例では、表面処理加
工時の円筒形の基板３に基盤ホルダー１が密着して、有
効な基板３の冷却を行うことができると共に、基板３の
熱変形と熱割れを防ぐことができる。As described above, in the present embodiment, the substrate holder 1 is brought into close contact with the cylindrical substrate 3 during the surface treatment so that the substrate 3 can be effectively cooled and the substrate 3 is thermally deformed. And can prevent heat cracking.
【００１４】また、基板３の内径より基板ホルダー１の
外径が小さく形成されているために、基板３を基板ホル
ダー１に容易に装着することができる。Since the outer diameter of the substrate holder 1 is smaller than the inner diameter of the substrate 3, the substrate 3 can be easily mounted on the substrate holder 1.
【００１５】本実施例では、基板ホルダー１が形状記憶
合金で作られているが、形状記憶ポリマーで作るように
することもできる。In this embodiment, the substrate holder 1 is made of a shape memory alloy, but it may be made of a shape memory polymer.
【００１６】また、形状記憶合金または形状記憶ポリマ
ーを可逆記憶させると、基板３の温度が予め設定した変
態点以下になると基板ホルダー１の径が小さくなり基板
３の冷却がほとんど行われなくなる。従って、基板３と
基板ホルダー１の接離の繰り返しによって基板３の温度
を制御することが可能になり、基板の表面加工部の膜形
態や結晶性を良好にすることができる。一方、形状記憶
合金または形状記憶ポリマーを非可逆記憶させた場合に
は、基板３の温度が上昇しないように循環路２に冷却水
を流して冷却が継続して行われる。Further, when the shape memory alloy or the shape memory polymer is reversibly stored, when the temperature of the substrate 3 becomes equal to or lower than the preset transformation point, the diameter of the substrate holder 1 becomes small and the substrate 3 is hardly cooled. Therefore, the temperature of the substrate 3 can be controlled by repeating contact and separation between the substrate 3 and the substrate holder 1, and the film morphology and crystallinity of the surface processed portion of the substrate can be improved. On the other hand, when the shape memory alloy or the shape memory polymer is irreversibly stored, cooling water is caused to flow through the circulation path 2 so that the temperature of the substrate 3 does not rise and cooling is continued.
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば、
円筒などの曲面を持つ基板に対しても、基板ホルダーと
密着させることができ、冷却を効率よく行うことがで
き、またその結果、基板の熱変形、熱割れを防ぐことが
できる。As described above, according to the present invention,
Even a substrate having a curved surface such as a cylinder can be brought into close contact with the substrate holder, cooling can be efficiently performed, and as a result, thermal deformation and thermal cracking of the substrate can be prevented.
【図１】本発明の一実施例に係る形状記憶合金の変態温
度以下時の断面図である。FIG. 1 is a sectional view of a shape memory alloy according to an embodiment of the present invention at a temperature equal to or lower than a transformation temperature.
【図２】同実施例の一実施例に係る形状記憶合金の変態
温度以上時の断面図である。FIG. 2 is a cross-sectional view of a shape memory alloy according to an example of the same example at a temperature equal to or higher than a transformation temperature.
【符号の説明】 １ 基板ホルダー ２ 冷却水の循環路 ３ 基板[Explanation of symbols] 1 substrate holder 2 cooling water circulation path 3 substrate
Claims (1)
ダーを、表面処理加工時に前記基板に密着する形状記憶
材で形成したことを特徴とする表面処理される基板の冷
却装置。1. A cooling device for a substrate to be surface-treated, wherein a substrate holder for cooling the substrate to be surface-treated is formed of a shape memory material that is in close contact with the substrate at the time of surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29293791A JPH05125534A (en) | 1991-11-08 | 1991-11-08 | Cooler for substrate to be subjected to surface treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29293791A JPH05125534A (en) | 1991-11-08 | 1991-11-08 | Cooler for substrate to be subjected to surface treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05125534A true JPH05125534A (en) | 1993-05-21 |
Family
ID=17788347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29293791A Withdrawn JPH05125534A (en) | 1991-11-08 | 1991-11-08 | Cooler for substrate to be subjected to surface treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05125534A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101311301A (en) * | 2007-05-23 | 2008-11-26 | 鸿富锦精密工业（深圳）有限公司 | Bearing table for sputter film plating machine bench |
| US8312919B2 (en) | 2008-11-17 | 2012-11-20 | Hon Hai Precision Industry Co., Ltd. | Tray for vacuum deposition apparatus |
-
1991
- 1991-11-08 JP JP29293791A patent/JPH05125534A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101311301A (en) * | 2007-05-23 | 2008-11-26 | 鸿富锦精密工业（深圳）有限公司 | Bearing table for sputter film plating machine bench |
| US8312919B2 (en) | 2008-11-17 | 2012-11-20 | Hon Hai Precision Industry Co., Ltd. | Tray for vacuum deposition apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |